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太阳能逆变器中IGBT和MOSFET技术解析(1)2014-09-2320:30:35???来源:互联网??关键字：太阳能逆变器IGBTMOSFET发展逆变器技术是太阳能应用提出的要求，本文介绍了太阳能逆变器的原理及架构，着重介绍了IGBT和MOSFET技术，实现智能控制是发展太阳能逆变器技术的关键。
一、太阳能对逆变器的要求通过太阳能光伏技术将太阳辐射转换成电能是现在市面上最有效也是最具发展潜力的可再生，3.要求直流输入电压有较宽的适应范围，由于太阳电池的端电压随负载和日照强度而变化，蓄电池虽然对太阳电池的电压具有重要作用，但由于蓄电池的电压随蓄电池剩余容量和内阻的变化而波动，特别是当蓄电池老化时其端电压的变化范围很大，如１２Ｖ蓄电池，其端电压可在１０Ｖ～１６Ｖ之间变化，这就要求逆变器必须在较大的直流输入电压范围内保证正常工作，并保证交流输出电压的稳定。
4.在中、大容量的光伏发电系统中，逆变电源的输出应为失真度较小的正弦波。
这是由于在中、大容量系统中，若采用方波供电，则输出将含有较多的谐波分量，高次谐波将产生附加损耗，许多光伏发电系统的负载为通信或仪表设备，这些设备对电网品质有较高的要求，当中、大容量的光伏发电系统并网运行时，为避免与公共电网的电力污染，也要求逆变器输出正弦波电流。
二、太阳能逆变器的原理及架构通常把交流电能变换成直流电能的过程称之为整流，相控整流是最常见的交-直流变换过程；而把直流电能变换成交流电能的过程称之为逆变，它是整流的逆过程。
在逆变电路中，按照负载性质的不同，逆变分为有源逆变和无源逆变。
如果把该电路的交流侧接到交流电源上，把直流电能经过直-交流变换，逆变成与交流电源同频率的交流电返送到电网上去，称作有源逆变。
相应的装置称为有源逆变器，控制角大于90°的相控整流器为常见的有源逆变器。
而把直流电能变换为交流电在图1中，Q1和Q3被指定为高压侧IGBT，Q2和Q4则是低压侧IGBT。
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Adaptec’s maxView provides an HTML5 web interface, which can be used in standard desktops and mobile browsers, for all storage configuration and management needs.Further Resources and Information: Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for commu-nications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardenedanalog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronizationdevices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discretecomponents; Enterprise Storage and Communication solutions, security technologies and scalable anti-tamper products;Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemiis headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. 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Microsemi拟收购Vitesse，连续5年大收购盘点Microsemi(美高森美)计划以约3.89亿美元现金收购Vitesse半导体公司。
这两个公司已于周三宣布该协议，折合每股5.28美元，相当于昨日收盘价一个约36%的溢价。
如果协议完成，此次协议将帮助扩张Microsemi作为通讯半导体公司的地位。
Vitesse是一家通过为电信网、企业网和物联网网络提供IC解决方案,以推进“以太网无处不在”战略的领先供应商。
Microsemi预期此次收购将增加协议完成后首个全年的每股盈余0.16-0.20美元。
此次协议预期将于6月28日结束季度的某一时间完成。
午盘后Vitesse股价上涨37%至5.33美元，Microsemi股价上涨1.9%至34.50美元。
美高森美的营收在过去5年里增长了一倍。
2014财年，营收为11.4亿美元。
焦点市场集中在通信(占总营收的38%)、国防和安全(28%)、航空航天(13%)以及工业(23%)。
几年来，通过不断地并购和通过创新实现自有产品的内生增长，美高森美不断成长为产品线多样，多元化发展的公司。
2010年以前，Microsemi还是一家主要提供模拟技术的半导体公司，产品线构成中，混合信号/RF产品占据29%，分立器件占据71%。
通过目标并购扩大应用市场份额，以及通过创新和先进产品实现内生增长，是Microsemi 近年来的成长路线，Microsemi正确评估市场进行收购，再通过行之有效的策略迅速做好业绩，不仅能够避免金钱流失，而且能够快速增值。
现在Microsemi的产品线更为多样化，具有四大系列产品：FPGA、定时、混合信号/FR 和分立器件。
2014年，分立器件仅占32%，混合信号/RF产品占据26%，新增的定时和FPGA产品线各占据18%和24%，比重分布较为均衡。
2015年三个因素可以促使Microsemi有很好的发展1.通信市场驱动力强劲。
2.全球信息安全意识和保障力度提升。
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HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴鑫诺SIGNOR配套工厂/河北东方对重导靴鑫诺SIGNOR /河北东方安全部件门锁鑫诺SIGNOR / 无锡展鹏/宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器河北东方缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN 无齿轮曳引机鑫诺SIGNOR导向轮鑫诺SIGNOR配套工厂分散控制系统轿厢操纵盘鑫诺SIGNOR 厅外召唤盒鑫诺SIGNOR 称重装置鑫诺SIGNOR 轿厢鑫诺SIGNOR 厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利有机房观光电梯主要配置清单型号：MRGL-O1.0m/s～2.5m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴河北东方对重导靴鑫诺SIGNOR / 河北东方安全部件门锁鑫诺SIGNOR / 无锡展鹏/ 宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器河北东方缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN 无齿轮曳引机鑫诺SIGNOR导向轮鑫诺SIGNOR配套工厂分散控制系统轿厢操纵盘鑫诺SIGNOR 厅外召唤盒鑫诺SIGNOR 称重装置鑫诺SIGNOR 轿厢鑫诺SIGNOR 厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利有机房载货电梯主要配置清单型号：FEVF0.5m/s～1.0m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴鑫诺SIGNOR配套工厂/河北东方对重导靴鑫诺SIGNOR配套工厂/ 河北东方安全部件门锁鑫诺SIGNOR/ 无锡展鹏/宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器鑫诺SIGNOR配套工厂/河北东方缓冲器河北东方/ 常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器长春汇通曳引机苏州通润/ 常熟顺达导向轮鑫诺SIGNOR配套工厂分散控制系统轿厢操纵盘鑫诺SIGNOR厅外召唤盒鑫诺SIGNOR称重装置鑫诺SIGNOR / 西安伊斯特轿厢鑫诺SIGNOR厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利无机房乘客电梯主要配置清单型号：RLGL-P 1.0m/s～1.75m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴鑫诺SIGNOR配套工厂/河北东方对重导靴鑫诺SIGNOR配套工厂/ 河北东方安全部件门锁鑫诺SIGNOR / 无锡展鹏/宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器宁波欧菱缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN无齿轮曳引机鑫诺SIGNOR分散控制系统轿厢操纵盘鑫诺SIGNOR 厅外召唤盒鑫诺SIGNOR 称重装置鑫诺SIGNOR 轿厢鑫诺SIGNOR 厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利无机房医梯主要配置清单型号：MRGL-B1.0m/s～1.75m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴河北东方对重导靴鑫诺SIGNOR / 河北东方安全部件门锁鑫诺SIGNOR / 无锡展鹏/宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器宁波欧菱缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN 无齿轮曳引机鑫诺SIGNOR导向轮鑫诺SIGNOR配套工厂分散控制系统轿厢操纵盘鑫诺SIGNOR 厅外召唤盒鑫诺SIGNOR 称重装置鑫诺SIGNOR 轿厢鑫诺SIGNOR 厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利无机房观光电梯主要配置清单型号：MRGL-O1.0m/s～1.75m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴河北东方对重导靴鑫诺SIGNOR / 河北东方安全部件门锁鑫诺SIGNOR红外线光幕宁波WECO安全钳河北东方限速器宁波欧菱缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN无齿轮曳引机鑫诺SIGNOR分散控制系统轿厢操纵盘鑫诺SIGNOR厅外召唤盒鑫诺SIGNOR称重装置鑫诺SIGNOR / 西安伊斯特轿厢鑫诺SIGNOR厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利无机房载货电梯主要配置清单型号：FEVF-W0.5m/s～1.0m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺SIGNOR主接触器苏州西门子抱闸接触器苏州西门子/常熟富士安全门锁继电器苏州西门子/中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌/日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex/美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂轿厢导靴河北东方对重导靴鑫诺SIGNOR / 河北东方安全部件门锁鑫诺SIGNOR / 无锡展鹏/ 宁波欧菱红外线光幕宁波WECO安全钳河北东方限速器宁波欧菱缓冲器河北东方/常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN无齿轮曳引机鑫诺SIGNOR分散控制系统轿厢操纵盘鑫诺SIGNOR厅外召唤盒鑫诺SIGNOR称重装置鑫诺SIGNOR / 西安伊斯特轿厢鑫诺SIGNOR厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利别墅电梯主要配置清单型号：SNHL 0.4m/s部件名称配置品牌控制柜系统控制柜鑫诺 SIGNOR系统控制板鑫诺 SIGNOR主接触器苏州西门子抱闸接触器苏州西门子 / 常熟富士安全门锁继电器苏州西门子 / 中国施耐德轿厢照明控制继电器中国 OMRONDSP矢量控制器美国 TI32位ARM CPU ST意法半导体智能功率模块(IPM/IGBT)德国英飞凌 / 日本富士光藕美国安捷伦电流传感器日本甲神主回路整流桥日本三社SanRex / 美国美高森美MICROSEMI 风扇台湾元山深圳保税工厂主控MCU 意法半导体ST轿厢控制板CAN控制芯片美国Microchip 控制板CPU 日本 FUJITSU 电源控制器台湾 HTC CAN收发器美国 TI门机系统门机鑫诺SIGNOR无锡展鹏工厂门机控制器井道部件导轨鑫诺SIGNOR配套工厂随行电缆鑫诺SIGNOR配套工厂钢丝绳鑫诺SIGNOR配套工厂导靴鑫诺配套工厂安全部件门锁鑫诺SIGNOR / 宁波欧菱/ 无锡展鹏红外线光幕宁波WECO安全钳鑫诺配套工厂限速器鑫诺配套工厂缓冲器常州明燕/江阴永诚端站、极限开关天津六开曳引系统旋转编码器德国HEIDENHAIN无齿轮曳引机苏州通润分散控制系统轿厢操纵盘鑫诺SIGNOR 厅外召唤盒鑫诺SIGNOR 称重装置西安伊斯特轿厢鑫诺SIGNOR 厅门及门套鑫诺SIGNOR注: 1.此配置仅适合标准规格,非标规格无效2.在保证质量与性能的前提下,本公司保留更改的权利。
Microsemi PolarFire FPGA评估方案MPF300－EVAL－KITMicrosemi公司的PolarFire FPGA是业界最低功耗的中等密度FPGA,具有高达500K逻辑单元和12.7G收发器,极好的安全性和可靠性.其功耗比同类产品要低50%,特别适合各种应用如有线接入网络,峰窝架构,国防和民用航空市场以及工业自动化和物联网(IoT).PolarFire™FPGA采用28nm非易失工艺技术,是Microsemi公司第五代非易失FPGA,内置了低功耗双路PCI Express Gen2(EP/RP),集成了低功耗加密协处理器.PolarFire™FPGA主要特性别包括高达481K逻辑单元,包括4输入查找表(LUT)和可分离的D型触发器,内置了单误差修正双误差检测(SECDED)的20kb双路或双端口大型静态随机存储器(LSRAM)区块,64x12双端口μRAM驱块,有预加法,48位累加器和选择16 deepx18系数的18x18数学区块,高速串行连接有多个多吉比特多协议收发器,速率从250Mbps到12.7Gbps;器件还集成了双路PCIe,高速I/O(HSIO)支持高达1600 Mbps DDR4, 1333 Mbps DDR3L, 和1333 Mbps,具有I/O数字的LPDDR3/DDR3,通用I/O(GPIO)支持3.3V,内置的CDR用于串行吉比特以太网, 1067 Mbps DDR3和1600 Mbps LVDS I/O.PolarFire FPGA工作电压1.0V和1.05V,使用户在功率和性能找到平衡点,以满足应用的需求.商业工作温度0℃到100℃,工业工作温度–40℃到100℃.本文介绍了PolarFire FPGA主要特性,架构图和PolarFire评估板FPGA MPF300-EVAL-KIT主要特性,元件表,框图,电路图和PCB设计图.PolarFire FPGAs deliver up to 500K logic elements, 12.7G transceivers at 50% lower power.Award-winning PolarFire FPGAs deliver the industry’s lowestpower at mid-range densities with exceptional security and reliability. The product family spans from 100K logic elements (LEs) to 500K LEs, features 12.7G transceivers and offers up to 50% lower power than competing mid-range FPGAs. The devices are ideal for a wide range of applications within wireline access networks and cellular infrastructure, defense and commercial aviation markets, as well as industrial automation and IoT markets. Get started with your design today by downloading the Libero SoC PolarFire Design Suite and ordering a PolarFiredevelopment kit that best matches your needs.PolarFire™FPGAs are the fifth-generation family of non-volatile FPGA devices from Microsemi, built onstate-of-the-art 28nm non-volatile process technology. Cost-optimized PolarFire FPGAs deliver thelowest power at mid-range densities. PolarFire FPGAs lower the cost of mid-range FPGAs by integratingthe industry’s lowest power FPGA fabric, lowest power 12.7 Gbps transceiver lane, built-in low powerdual PCI Express Gen2 (EP/RP), and, on select data security (S) devices, an integrated low-power crypto co-processor. PolarFire FPGAs can operate at 1.0 V and 1.05 V, offering the end user the ability to tradeoff power and performance to match the application requirements.This document describes the features of the production PolarFire FPGA extended commercial (0℃to100℃) and industrial (–40℃to 100℃) device offerings. Please refer to the datasheet for current siliconstatus and electrical characteristics.PolarFire FPGA主要特性:Up to 481K logic elements consisting of a 4-input look-up table (LUT) with a fractureable D-type flipflop20 Kb dual- or two-port large static random access memory (LSRAM) block with built-in single errorcorrect double error detect (SECDED)64 ×12 two-port μRAM block implemented as an array of latches18 ×18 math block with a pre-adder, a 48-bit accumulator, and an optional 16 deep x 18 coefficientROMBuilt-in μPROM, modifiable at program time, readable at run time for user data storageHigh-speed serial connectivity with built-in multi-gigabit multi-protocol transceivers from 250 Mbpsto 12.7 Gbps Integrated dual PCIe for up to ×4 Gen2 endpoint (EP) and root port (RP) designsHigh-speed I/O (HSIO) supporting up to 1600 Mbps DDR4, 1333 Mbps DDR3L, and 1333 MbpsLPDDR3/DDR3 memories with integrated I/O digitalGeneral purpose I/O (GPIO) supporting 3.3 V, built-in CDR for serial gigabit Ethernet, 1067 MbpsDDR3, and 1600 Mbps LVDS I/O speed with integrated I/O digital logicLow-power phase-locked loops (PLLs) and delay-locked loops (DLLs) for high precision and low-jitter1.0 V and 1.05 V operating modesPolarFire FPGA低功耗特性:Low device static powerLow inrush currentLow power transceiversPolarFire FPGA可靠性特性:FPGA configuration cells single event upset (SEU) immuneBuilt-in SECDED and memory interleaving on LSRAMsSystem controller suspend mode for safety-critical designsPolarFire FPGA安全特性:Cryptography Research Incorporated (CRI)-patented differential power analysis (DPA) bitstreamprotection Integrated physically unclonable function (PUF)56 KBytes of secure non-volatile memory (sNVM)Built-in tamper detectors and countermeasuresDigest integrity check for FPGA, μPROM, and sNVMData security features in S devices—true random number generator, integrated Athena TeraFireEXP5200B Crypto Coprocessor, suite B capable, and CRI DPA countermeasure pass-through license图1.PolarFire FPGA架构图PolarFire评估板FPGA MPF300-EVAL-KITMicrosemi’sPolarFire Evaluation Kit offers high-performance evaluation across a broad class of applications. This kit is ideally suited for high-speed transceiver evaluation, 10Gb Ethernet, IEEE1588, JESD204B, SyncE, CPRI and more. The kit connections include a high pin count (HPC) FPGA mezzanine card (FMC), numerous SMAs, PCIe, Dual Gigabit Ethernet RJ45, SFP+ and USB. A 300K logic element (LE) PolarFire FPGA with DDR4, DDR3, and SPI-flash allow a broad class of high-performance designs to be developed.The MicrosemiPolarFire™FPGA Evaluation Kit (MPF300-EVAL-KIT), which is RoHS-compliant,enables you to evaluate the PolarFire family of FPGAs with support for the following interfaces:•PCI Express Gen1 and Gen2• 1 GbE•DDR3 and DDR4 memory•FMC HPC with 8 Transceiver lanes• 1 Full-Duplex Transceiver SMAs•SFP+ Cage•UART Interface to FTDI device•SPI Interface to SPI Flash devicePolarFire评估板MPF300-EVAL-KIT包括:图2.PolarFire评估板MPF300-EVAL-KIT框图The PolarFire Evaluation Board features the PolarFire MPF300TS-1FCG1152I FPGA. The device hasthe following capabilities:•20 Kb dual-port or two-port large static random access memory (LSRAM) block with a built-in singleerror correct double error detect (SECDED)•64 ×12 two-port μSRAM block implemented as an array of latches•18 ×18 Multiply Accumulate (MACC) block with a pre-adder, a 48-bit accumulator, and an optional16 deep ×18 coefficient RO•Built-in μPROM, modifiable at program time, readable at run time for user data storage•Digest integrity check for FPGA, μPROM, and sNVM•Low-power features:•Low device static power•Low inrush current•Low power transceivers•Unique Flash*Freeze (F*F) mode•High-performance communication interfacesThe PolarFire Evaluation Board has several standard interfaces, including:•VSC8575 with two RJ45 connector for 101001000 Mbps Ethernet•8 Full-Duplex Transceiver lanes connected through FMC connector•FMC HPC connector•DDR3 memory•DDR4 memory•Power Sequence and monitor chip•x4 Lane PCIe Edge connector•SFP+ connector•Two SPI Flash devicesPolarFire评估板MPF300-EVAL-KIT硬件特性:300K LE PolarFire FPGA in an FCG1152 Package (MPF300TS-1FCG1152I)HPC FMC Connector1x SFP+ CageIEEE 1588 PLLs and SoftwareSMA connectors for testing of full-duplex 12.7Gbps SERDES channel4GB DDR4 x32 and 2GB DDR3 x16PCI Express (x4) Edge Connector2 x RJ45 for 10/100/1000 Ethernet using SGMII on GPIODual 10/100/1000BASE-T PHY (VSC8575) for SyncE and 1588 applicationSATA InterfacePower Management Unit for 1 or 1.05v PolarFire FPGA core voltageUSB to UART InterfaceEmbedded programming and debugging using SPI and JTAGOn-board Power Monitoring2 x 1Gb SPI Flash MemoryPolarFire评估板MPF300-EVAL-KIT元件表:图4.PolarFire评估板MPF300-EVAL-KIT电路图(1)图5.PolarFire评估板MPF300-EVAL-KIT电路图(2)图6.PolarFire评估板MPF300-EVAL-KIT电路图(3)图7.PolarFire评估板MPF300-EVAL-KIT电路图(4)图8.PolarFire评估板MPF300-EVAL-KIT电路图(5)图9.PolarFire评估板MPF300-EVAL-KIT电路图(6)图10.PolarFire评估板MPF300-EVAL-KIT电路图(7)图11.PolarFire评估板MPF300-EVAL-KIT电路图(8)图12.PolarFire评估板MPF300-EVAL-KIT电路图(9)图13.PolarFire评估板MPF300-EVAL-KIT电路图(10)图14.PolarFire评估板MPF300-EVAL-KIT电路图(11)图15.PolarFire评估板MPF300-EVAL-KIT电路图(12)图16.PolarFire评估板MPF300-EVAL-KIT电路图(13)图17.PolarFire评估板MPF300-EVAL-KIT电路图(14)图18.PolarFire评估板MPF300-EVAL-KIT电路图(15)图19.PolarFire评估板MPF300-EVAL-KIT电路图(16)图20.PolarFire评估板MPF300-EVAL-KIT电路图(17)图21.PolarFire评估板MPF300-EVAL-KIT电路图(18)图22.PolarFire评估板MPF300-EVAL-KIT电路图(19)图23.PolarFire评估板MPF300-EVAL-KIT电路图(20)图24.PolarFire评估板MPF300-EVAL-KIT电路图(21)图25.PolarFire评估板MPF300-EVAL-KIT电路图(22)图26.PolarFire评估板MPF300-EVAL-KIT电路图(23)图27.PolarFire评估板MPF300-EVAL-KIT电路图(24)图28.PolarFire评估板MPF300-EVAL-KIT电路图(25)图29.PolarFire评估板MPF300-EVAL-KIT电路图(26)图30.PolarFire评估板MPF300-EVAL-KIT电路图(27)图31.PolarFire评估板MPF300-EVAL-KIT电路图(28)图32.PolarFire评估板MPF300-EVAL-KIT电路图(29)图33.PolarFire评估板MPF300-EVAL-KIT电路图(30)图34.PolarFire评估板MPF300-EVAL-KIT电路图(31)图35.PolarFire评估板MPF300-EVAL-KIT电路图(32)图36.PolarFire评估板MPF300-EVAL-KIT电路图(33)图37.PolarFire评估板MPF300-EVAL-KIT电路图(34)图38.PolarFire评估板MPF300-EVAL-KIT电路图(35)图39.PolarFire评估板MPF300-EVAL-KIT电路图(36)图40.PolarFire评估板MPF300-EVAL-KIT电路图(37)图41.PolarFire评估板MPF300-EVAL-KIT电路图(38)图42.PolarFire评估板MPF300-EVAL-KIT电路图(39)图43.PolarFire评估板MPF300-EVAL-KIT电路图(40)图44.PolarFire评估板MPF300-EVAL-KIT电路图(41)图45.PolarFire评估板MPF300-EVAL-KIT PCB设计图(1):顶层丝印图46.PolarFire评估板MPF300-EVAL-KIT PCB设计图(2):底层丝印。
PoE标准最初的IEEE 802.3af以太网供电(PoE)标准以相对直接的方式通过48V直流电压为负载提供13W左右的可用功率，但将可用功率提升到50W以上的IEEE 802.3at PoE Plus新标准引入了一些PoE设计师甚至IT经理必须了解的新东西。
需要注意的一点是，设计师仍能以有限的方式在一些现有的以太网络中通过中跨设备(mid-span bridge)供电。
但在这种情况下，设计师无法实现供电设备(PSE)和受电设备(PD)之间的功率协商。
这意味着中跨设备中的专用PoE Plus端口和相对较高占空比电源。
PD是另外一个值得密切注意的对象，它通过以太网连接与PSE动态协商功率要求。
这要求编写更多的PD微控制器代码，以及要求编写这段代码的工程师很好地理解动态功率要求。
对最终用户来说，一个潜在缺陷是，PD如果得不到全功能运行所需的足够功率，它会通过工作在降模式(fall-back mode)来满足这一标准(如视频电话可以只提供语音，但不显示图像)。
换句话说，一台PD设备可以简单地通过提供“功率不足”信号来满足标准。
那些购买了大量遵守新标准的视频电话的IT经理可能会因为“符合新标准”的交换机没有足够鲁棒的电源致使系统无法正常运行而遭遇麻烦。
历史教训为了更好地理解PoE Plus，了解PoE Plus的起源和发展史是很有帮助的。
最初，思科公司开发的一种给VoIP商用电话供电的私有技术，它包括为路由器中的一些线对提供48V电压。
业内的其它公司认为这种做法很好，并希望它成为一种开放标准，它就是IEEE 802.3af标准的前身。
保守起见，IEEE委员会将PSE端的功率限制在15W，这对于当时主导市场的非视频VoIP电话来说是足够了。
他们还对思科的思路进行了拓展，允许通过中跨设备向以太网线缆中的“空闲线对”馈电，从而使得传统以太网设备也能用上PoE。
许多潜在供应商在PoE推出后不久就发现了它的优势，并加入了大力推广的行列。
1Features•Four independent clock channels•Frequency and Phase Sync over Packet Networks •Frequency accuracy performance for WCDMA-FDD, GSM, LTE-FDD and femtocell applications •Frequency performance for ITU-T G.823 and G.824 synchronization interface, as well as G.8261 PNT PEC and CES interfaces•Phase Synchronization performance forWCDMA-TDD, Mobile WiMAX, TD-SCDMA and CDMA2000 applications•Client holdover and reference switching between multiple Servers•Physical Layer Equipment Clocks Synchronization •ITU-T G.8262 for SyncE EEC option 1 & 2•ITU-T G.813 for SONET/SDH SEC option 1 & 2•Telcordia GR-1244 & GR-253 Stratum 3 & SMC •Support for G.781 SETS•Any input clock rate from 1Hz to 750MHz •Automatic hitless reference switching and digital holdover on reference fail•Flexible two-stage architecture translates between arbitrary data, line coding and FEC rates •Digital PLLs programmable bandwidth from 0.1mHz up to 1kHz•Programmable synthesizers•Any output clock rate from 1 Hz to 750 MHz •Output jitter below 0.61 ps rms•Operates from a single crystal resonator or clock oscillator•Field configurable via SPI/I 2C interfaceApril 2013Figure 1 - Functional Block DiagramZL30362IEEE 1588 & Synchronous Ethernet PacketClock Network SynchronizerShort Form Data SheetOrdering InformationZL30362GDG2144 Pin LBGATraysPb Free Tin/Silver/Copper-40o C to +85o CPackage size: 13 x 13 mmDetailed FeaturesGeneral•Four independent clock channels•Operates from a single crystal resonator or clock oscillator•Configurable its SPI/I2C interfaceTime Synchronization Algorithm•External algorithm controls software digital PLL to adjust frequency & phase alignment•Frequency, Phase and Time Synchronization over IP, MPLS and Ethernet Packet Networks•Frequency accuracy performance for WCDMA-FDD, GSM, LTE-FDD and femtocell applications, with target performance less than ± 15 ppb.•Frequency performance for ITU-T G.823 and G.824 synchronization interface, as well as G.8261 PNT EEC, PNT PEC and CES interface specifications.•Phase Synchronization performance for WCDMA-TDD, Mobile WiMAX, TD-SCDMA and CDMA2000 applications with target performance less than ± 1 s phase alignment.•Time Synchronization for UTC-traceability and GPS replacement.•Client reference switching between multiple Servers•Client holdover when Server packet connectivity is lostElectrical Clock Inputs•Nine input references configurable as single ended or differential and two single ended input references •Synchronize to any clock rate from 1 Hz to 750 MHz on differential inputs•Synchronize to any clock rate from 1 Hz to 177.75 MHz on singled-ended inputs•Any input reference can be fed with sync (frame pulse) or clock.•Synchronize to sync pulse and sync pulse/clock pair.•Flexible input reference monitoring automatically disqualifies references based on frequency and phase irregularities•LOS•Single cycle monitor•Precise frequency monitor•Coarse frequency monitor•Guard soak timer•Per input clock delay compensationElectrical Clock Engine•Digital PLLs filter jitter from 0.1 mHz up to 1 kHz•Flexible two-stage architecture translates between arbitrary data rates, line coding rates and FEC rates •Internal state machine automatically controls mode of operation (free-run, locked, holdover)•Automatic hitless reference switching and digital holdover on reference fail•Physical-to-physical reference switching•Physical-to-packet reference switching•Packet-to-physical reference switching•Packet-to-packet reference switching•Support for wide variety of Equipment Clock specifications•SyncE•ITU-T G.8262 option 1 EEC (Europe/China)•ITU-T G.8262 option 2 (USA)•SONET/SDH•ITU-T G.813 option 1 SEC (Europe/China)•ITU-T G.813 option 2 (USA)•ANSI T1.105/Telcordia GR-253 Stratum 3 for SONET•Telcordia GR-253 SMC•PDH•ITU-T G.812 Type I SSU•ITU-T G.812 Type III, ANSI T1.101/Telcordia GR-1244 Stratum 3E, including phase build out•ANSI T1.101/Telcordia GR-1244 Stratum 3•ANSI T1.101/Telcordia GR-1244 Stratum 4E/4•Selectable phase slope limiting•Holdover better than 1 ppb (when using < 0.1 Hz filter)•Supports ITU-T G.823, G.824 and G.8261 for 2048kbit/s and 1544kbit/s interfaces•Supports G.781 SETSElectrical Clock Generation•Four programmable synthesizers•Eight LVPECL outputs•Two LVPECL outputs per synthesizer•Generate any clock rate from 1 Hz to 750 MHz•Maximum jitter below 0.61 ps RMS•Meets OC-192, STM-64, 1 GbE & 10 GbE interface jitter requirements•Eight LVCMOS outputs•Two LVCMOS outputs per synthesizer•Generate any clock rate from 1 Hz to 177.75 MHz•Maximum jitter below 1 ps rms•Programmable output advancement/delay to accommodate trace delays or compensate for system routing paths•Outputs may be disabled to save powerAPI Software•Interfaces to 1588-capable PHY and switches with integrated timestamping•Abstraction layer for independence from OS and CPU, from embedded SoC to home-grown•Fits into centralized, highly integrated pizza box architectures as well as distributed architectures with multiple line cards and timing cardsApplications•ITU-T G.8262 System Timing Cards which support 1GbE and 10GbE interfaces•Telcordia GR-253 Carrier Grade SONET/SDH Stratum 3 System Timing Cards•System Timing Cards which supports ITU-T G.781 SETS (SDH Equipment Timing Source)•Integrated basestation reference clock for air interface for GSM, WCDMA, LTE and WiMAX macro, micro or femtocells•Mobile Backhaul NID, edge router or access aggregation node•EPON/GE-PON & GPON OLT•EPON/GE-PON & GPON ONU/OLT•DSLAM and RT-DSLAM•10Gigabit line cards•Synchronous Ethernet, 10GBASE-R and 10GBASE-W•SONET/SDH, Fibre Channel, XAUIInformation relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any suchinformation, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi.This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded.Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request.Purchase of Microsemi’s I 2C components conveys a license under the Philips I 2C Patent rights to use these components in an I 2C System, provided that the system conforms to the I 2C Standard Specification as defined by Philips.Microsemi, ZL, and combinations thereof, VoiceEdge, VoicePort, SLAC, ISLIC, ISLAC and VoicePath are trademarks of Microsemi Corporation.TECHNICAL DOCUMENTATION - NOT FOR RESALEFor more information about all Microsemi productsvisit our Web Site at/timing-and-synchronization。
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1 产品综述1.1 机芯概述电源部分，该产品由待机电路、PFC 电路、DC-DC 电路、DC-AC 高压驱动电路以及高压平衡电路组成。
1.2 主要功能LCD 屏高压驱动，同时提供给整机其它用电设备供电。
1.3 主要技术规格输入电压规格：220V AC （110-240V ）； 输出电压规格：+5V （0.1～1A ）；+12V （0.5～2A ）； +24V （0.5～1A ）；+/-HV 1100Vrms 85mA2 电路介绍2.1机芯总电路 待机电路图：L101100uH400V7935101T101E1911223344557788V C CN CN CF BD R A I NN C G N D3451872IC101NCP1014C10110uF/450VC102100uF/50VC10347uF/50VR10120K 0805D101P6KE200A D1021N 4007C11147n 0805D1031N 5819D104BY V26CC104100uF/16VC105100uF/16VR1021K 0805R1031K 0805R1041K 0805C1120.1u 0805R1054.7K 0805R1064.7K 080515VINC2B3E 1Q101R10710K 0805R1084.7K 0805112233INGN D OU T312IC1037815Q102ST5VR1094.7K 0805C1130.1u 0805R11110K 0805R1101K 0805ON/OFFD105123IC102TL431PC102PC81712PC101A PC81743PC101B PC817SGNDGNDST5VQ103R1124.7K 0805R1134.7K 0805D306ZD 301D305ZD 302D106ZD 101+12V+24V18V ST5VR119R1251K 0805J33J34J32交流输入与PFC 电路图：F1T8A/250VCY 2471A CCY 1471A CCY 3471A CCY 4471A CCX 1471A CCX 2471A CRN 2NTC5R/5ARZ110D471C001474/630V C205220n/0805R21222R 0805C201150uF/450V R2071.5M/1206R21410K 0805R0030.1R 5WR2051.5M/1206R2041.5M/1206R2061.5M/1206R20956K 0805C2071n/0805C2061n/0805C2041n/08051122D201FM XA-1106SR2104.7K 1206C208220n/0805R208470K /1206R211100R 0805R21310R 0805D2021N 414815VINR201680K 0805R202680K 0805R203560K 0805FBVcont rol IN CSVMGN D Drv VCC34561872IC201NCP1653A C20310U/50VQ202C 2B3E1Q203L00610652B-680uH-0.8C002474/630VR001680K 1206R002680K 1206G1D2S 3Q2012S K3528400VC20247F/25VCY 5471A CCY 6471A CCX 3471A CL00410652B-680uH-0.8L00510652B-680uH-0.8C201A 150uF/450V2512L201PQ3225-680u H R004680K 120612CN01AC220V INL NRN 1NTC5R/5A1234L00112M H1234L00212M H1234L00312M HGND1234D001BRIDGE1-1J1LJ35J17J42J44R215680K 0805C209220n/0805J46J18DC-DC 电路图（12V/24V 控制电路）：R3020.39 2W12V /4A24V /3A+12V+24VR3182401R3172401R30724KR30322R305470R30610R31256KR31156KD3021N4148C305220PC302220PR3144.7KR31610K R3154.1KC311104R30824K D301BAV26R30168K 2WC30610/50VR31319.1KR320330 2W R322330 2W 1122334455667788IC301NCP1207K1A2R3IC302TL431A 1K2C 4E 3PC302PC81715VINQ30204N60R323330 2WR324330 2W R325330 2WC314100P/1KVC315100P/1KVC3091000UF 25VC3101000UF 25VL3023.8uHC316104R321330 2WC3071000UF 25VL3013.8uHC3081000UF 25VC317104C303100PC301104R30422400VGNDSGND+12V+24V123D30320H100123D30420H100164891115T301J20J37J43高压部分电路：752816T7014921067T702312465IC702FDC6333CQ701FQ B5N 50CR70356.2C7060.47uFR70410KR702191R701374G1D2S 3Q702FQ B5N 50CR70568.1Q705FD N337R706100KR70710K4921067T703312465IC703FDC6333CG1D2S 3Q703FQ B5N 50CR71056.2C7330.47uFR71110KR709191R760374G1D2S 3Q704FQ B5N 50CR71268.1Q712FD N337R713100K R71410K400VC7051uFC7321uFC7131uFVDDC7144.7uFC7151uFR71515KR70840KC716220pF C7171uF C7181nFR7681MR71810KA_DIMENR71930KR720NUR72220K C720100pFR72310KC7211nFR72410K C7222.2nFR726100KC7241nFR72722KR7286.81KC725100pF R73022KR73122KC7265.6nFC727220pFR73247KC7281nF R73447KR73347KR73747R738A0.1uF R738100R73947R739A0.1uF R740100R7592KC7292.2nFC7072.2pFC7085600pFC7092.2pFC7105600pF 1423T71212CN707R7494.7KR7503.3KR7514.7KR7523.3K 1423T71312CN708LA MP13LA MP14LA MP15LA MP161423T7141423T715R7764.7KR7773.3KR7544.7KR7533.3K1423T71612CN709R7784.7KR7793.3KR7804.7KR7813.3K 1423T71712CN710LA MP13LA MP14LA MP15LA MP161423T7181423T719R7564.7KR7553.3KR7824.7KR7833.3K1423T70412CN703R7434.7KR7443.3KR7414.7KR7423.3K 1423T70512CN704LA MP13LA MP14LA MP15LA MP161423T7061423T707R7624.7KR7613.3KR7464.7KR7453.3K1423T70812CN705R7634.7KR7643.3KR7474.7KR7483.3K 1423T70912CN706LA MP13LA MP14LA MP15LA MP161423T7101423T711R7664.7KR7653.3KR7674.7KR7693.3KVDD +12VR78710KR78810KR78610KR72510KVSNS2VSNS1VSNS1VSNS2213D702BAT54S 213D705BAT54S213D701BAS40213D704BAS40213D703BAS21213D706BAS21213D713BAT54S 213D714BAT54S213D712BAT54CC7344.7uFD707D708D709D710D715D716D717D718D719D720D721D722D723D724D725D726J2J3J5J4J6J7J8J9J10J11J12J13J14J15J16G1G2G3G4J26J27J28A1A2A3A4A5A6A7A8A O HBOH12345678910111213141516LX6503IC701C7292.2nF2.2机芯新电路(本机芯特有) 无2.3 机芯其它电路 无3 主要信号流程介绍3.1电源信号流程如上图所示：待机电路为整机信号板CPU 工作提供所需的5V 电压，并由待机变压器的辅助绕组为其他几部分电路提供VCC ；PFC 电路用于校正和补偿电路中电流电压的相位，可以使整个电源板的PF值达到98%左右；DC-DC电路用于从PFC提供的400V直流电压进行电压变换，产生出供给主板所需的12V、24V电压；DC-AC电路（包括其控制电路部分）从PFC提供的400V电压进行电压变换，产生出点亮液晶屏所需的交流正负高压；高压平衡电路用于提供给灯管在正常工作时能够保证流经灯管的电流保持一致。
