PMEG3030BEP,115;中文规格书,Datasheet资料

PMEG1030EH; PMEG1030EJ10V, 3A ultra low V F MEGA Schottky barrier rectifiersRev. 03 — 2 June 2005Product data sheet1.Product profile1.1General descriptionPlanar Maximum Efficiency General Application(MEGA)Schottky barrier rectifiers with anintegrated guard ring for stress protection encapsulated in small SMD plastic packages.Table 1:Product overviewType number Package ConfigurationPhilips JEITAPMEG1030EH SOD123F-single isolated diodesPMEG1030EJ SOD323F SC-90single isolated diodes1.2Featuress Forward current: 3 As Reverse voltage: 10 Vs Ultra low forward voltages Small and flat lead SMD package1.3Applicationss Low voltage rectifications High efficiency DC-to-DC conversions Switched-mode power supplys Inverse polarity protections Low power consumption applications1.4Quick reference dataTable 2:Quick reference dataSymbol Parameter Conditions Min Typ Max UnitI F forward current T sp≤ 55°C--3AV R reverse voltage--10VV F forward voltage I F=3A[1]-390530mV[1]Pulse test: t p≤300µs;δ≤0.02.2.Pinning information[1]The marking bar indicates the cathode.3.Ordering information4.MarkingTable 3:PinningPin Description Simplified outline Symbol1cathode [1]2anode001aab54012sym00112Table 4:Ordering informationType numberPackage NameDescriptionVersion PMEG1030EH -plastic surface mounted package; 2 leads SOD123F PMEG1030EJSC-90plastic surface mounted package; 2 leadsSOD323FTable 5:Marking codesType number Marking code PMEG1030EH AC PMEG1030EJE75.Limiting values[1]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.6.Thermal characteristics[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[2]For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses P R are a significant part of the total power losses. Nomograms for determining the reverse power losses P R and I F(AV) rating will be available on request.[3]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.Table 6:Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V R reverse voltage -10V I F forward current T sp ≤ 55°C -3A I FRM repetitive peak forward currentt p ≤1ms;δ≤0.25- 5.5A I FSM non-repetitive peak forward currentt =8ms; square wave [1]-9AP tottotal power dissipation T amb ≤25°CPMEG1030EH [1]-375mW [2]-830mW PMEG1030EJ[1]-360mW [2]-830mW T j junction temperature -150°C T amb ambient temperature −65+150°C T stgstorage temperature−65+150°CTable 7:Thermal characteristics Symbol ParameterConditions Min Typ Max UnitR th(j-a)thermal resistance from junction to ambient in free airPMEG1030EH [1][2]--330K/W [2][3]--150K/W PMEG1030EJ[1][2]--350K/W [2][3]--150K/WR th(j-sp)thermal resistance from junction to solder point PMEG1030EH --60K/W PMEG1030EJ--55K/W7.Characteristics[1]Pulse test: t p ≤300µs;δ≤0.02.Table 8:CharacteristicsT amb =25°C unless otherwise specified.Symbol Parameter ConditionsMin Typ Max Unit V Fforward voltage[1]I F =0.01A -100130mV I F =0.1A -170200mV I F =1 A -280350mV I F =3 A-390530mV I Rreverse currentV R =5V -0.552mA V R =8V -0.8 2.5mA V R =10V-13mA C ddiode capacitanceV R =1V; f =1MHz-7085pF(1)T amb =125°C (2)T amb =85°C (3)T amb =25°C (4)T amb =−40°C(1)T amb =125°C (2)T amb =85°C (3)T amb =25°C (4)T amb =−40°CFig 1.Forward current as a function of forwardvoltage; typical values Fig 2.Reverse current as a function of reversevoltage; typical values006aaa290101103102104I F (mA )10−1V F (V)00.40.50.30.10.2(1)(3)(4)(2)006aaa29110310102105104106I R (µA)1V R (V)0108462(1)(2)(3)(4)8.Package outline9.Packing information[1]For further information and the availability of packing methods, see Section 16.T amb =25°C; f =1MHzFig 3.Diode capacitance as a function of reverse voltage; typical valuesV R (V)0108462006aaa292709050110130C d (pF)30Fig 4.Package outline SOD123F Fig 5.Package outline SOD323F (SC-90)04-11-29Dimensions in mm1.2 1.00.250.103.63.42.72.50.550.350.700.551.71.51204-09-13Dimensions in mm0.800.650.250.100.50.32.72.31.81.60.400.251.351.1512Table 9:Packing methodsThe -xxx numbers are the last three digits of the 12NC ordering code.[1]Type number Package DescriptionPacking quantity 300010000PMEG1030EH SOD123F 4 mm pitch, 8 mm tape and reel -115-135PMEG1030EJSOD323F4 mm pitch, 8 mm tape and reel-115-13510.SolderingReflow soldering is the only recommended soldering method.Dimensions in mmFig 6.Reflow soldering footprint SOD123FReflow soldering is the only recommended soldering method.Dimensions in mmFig 7.Reflow soldering footprint SOD323F (SC-90)1.61.62.944.4 1.1 1.22.1 1.1(2×)solder lands solder resistoccupied areasolder paste msa4331.650.50(2×)2.101.602.800.603.050.500.95solder lands solder resistoccupied area solder paste11.Revision historyTable 10:Revision historyDocument ID Release date Data sheet status Change notice Doc. number SupersedesPMEG1030EH_EJ_320050602Product data sheet-9397 750 15078PMEG1030EH_EJ_2 Modifications:•Table 6 “Limiting values” I FSM value changed to 9 APMEG1030EH_EJ_220050405Product data sheet-9397 750 14884PMEG1030EJ_1 PMEG1030EJ_120050124Product data sheet-9397 750 13916-12.Data sheet status[1]Please consult the most recently issued data sheet before initiating or completing a design.[2]The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL .[3]For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.13.DefinitionsShort-form specification —The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.14.DisclaimersLife support —These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes —Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’),relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes noresponsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to theseproducts,and makes no representations or warranties that these products are free from patent,copyright,or mask work right infringement,unless otherwise specified.15.TrademarksNotice —All referenced brands, product names, service names and trademarks are the property of their respective owners.16.Contact informationFor additional information, please visit: For sales office addresses, send an email to: sales.addresses@Level Data sheet status [1]Product status [2][3]DefinitionI Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice.IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification.Supplementary data will be published at a later date.Philips Semiconductors reserves the right to change the specification without notice,in order to improve the design and supply the best possible product.III Product data ProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design,manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).17.Contents1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 11.1General description. . . . . . . . . . . . . . . . . . . . . . 11.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4Quick reference data. . . . . . . . . . . . . . . . . . . . . 12Pinning information. . . . . . . . . . . . . . . . . . . . . . 23Ordering information. . . . . . . . . . . . . . . . . . . . . 24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 36Thermal characteristics. . . . . . . . . . . . . . . . . . . 37Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 48Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 59Packing information. . . . . . . . . . . . . . . . . . . . . . 510Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 712Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 813Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 814Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816Contact information . . . . . . . . . . . . . . . . . . . . . 8© Koninklijke Philips Electronics N.V.2005All rights are reserved.Reproduction in whole or in part is prohibited without the priorwritten consent of the copyright owner.The information presented in this document doesnot form part of any quotation or contract,is believed to be accurate and reliable and maybe changed without notice.No liability will be accepted by the publisher for anyconsequence of its use.Publication thereof does not convey nor imply any license underpatent- or other industrial or intellectual property rights.Date of release: 2 June 2005Document number: 9397 750 15078。

Product Data Sheet DS656The Bridgelux SMD 3030 high power LED is hot-color targeted, which ensures that the LEDs fall within their specified color bin at the typical application conditions of 85°C. With its broad lumen coverage and wide range of CCT options, the SMD 3030 provides unparalleled design-in flexibility for indoor and outdoor lighting applications. The SMD 3030 is ideal as a drop-in replacement for emitters with an industry standard 3.0mm x 3.0mm footprint.Features• Industry-standard 3030 footprint• 5 bin color control• Hot-color targeting ensures that color is within the ANSI bin at the typical application conditions of 85°C • Enables 3- and 6-step MacAdam ellipse custom binning kits• RoHS compliant and lead free• Multiple CCT configurations for a wide range of lighting applicationsBenefits• Lower operating and manufacturing cost • Ease of design and rapid go-to-market • Uniform, consistent white light• Reliable and constant white point• Compliant with environmental standards • Design flexibilityContentsProduct Feature Map2 Product Nomenclature2 Product Test Conditions2 Product Selection Guide3 Electrical Characteristics4 Absolute Maximum Ratings5 Product Bin Definitions6 Performance Curves9 Typical Radiation Pattern12 Typical Color Spectrum 13 Mechanical Dimensions14 Reliability 15 Reflow Characteristics16 Packaging17 Design Resources19 Precautions19 Disclaimers19 About Bridgelux20Product Feature MapCathode MarkYellow phosphor Light Emitting Surface (LES)Product NomenclatureThe part number designation for Bridgelux SMD 3030 is explained as follows:Product Test ConditionsBridgelux SMD 3030 LEDs are tested and binned with a 10ms pulse of 100mA at Tj (junction temperature)=T sp (solder point temperature) =25°C. Forward voltage and luminous flux are binned at a T j =T sp =25°C.while color is hot targeted at a T sp of 85°C.1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17Product FamilyColor Bin OptionsFlux Bins Minimum CRIE = 80 CRIForward Voltage Bins Nominal CCT27 = 2,700K 30 = 3,000K 35 = 3,500K 40 = 4,000K 50 = 5,000K 57 = 5,700K 65 = 6,500KBXEM – 30 E – 1 3 H – 9 CS – 00 – 0 – 0Product Version High PowerDie count in parallelTypical Forward VoltageDie count in series Bridgelux SMD LED products come in industry standard package sizes and follow ANSI binning standards. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications.Product Selection GuideThe following product configurations are available:Table 1: Selection Guide, Pulsed Measurement Data at 100mA (T j =T sp =25°C)Notes for Tables 1 & 2:1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-0” denotes the full distribution of flux, forward voltage, and 6 SDCM color.Example: BXEM-30E-13H-9CS-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 6-step ANSI standard chromaticity region with a minimum of 80CRI, 1x3 die configuration, 8.9V typical forward voltage.2. Product CCT is the nominal CCT at Tsp = 85°C as defined by ANSI C78.377-2011.3. Listed CRIs are minimum values at Tsp = 85°C and include test tolerance.4. Products tested under pulsed condition (10ms pulse width) at nominal drive current where Tj=Tsp=25°C.5. Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 3030.6. Refer to Table 5 and Table 6 for Bridgelux SMD 3030 Luminous Flux Binning and Forward Voltage Binning information.7. Typical pulsed test performance values are provided as reference only and are not a guarantee of performance.8. Typical performance is estimated based on operation under pulsed current with LED emitter mounted onto a heat sink with thermal interfacematerial and the solder point temperature maintained at 85°C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected.Table 2: Selection Guide, Pulsed Test Performance (T sp = 85°C)7,8Electrical CharacteristicsTable 3: Electrical CharacteristicsNotes for Table 3:1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-0” denotes the full distribution of flux, forward voltage, and 6 SDCM color.Example: BXEM-30E-13H-9CS-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 6-step ANSI standardchromaticity region with a minimum of 80CRI, 1x3 die configuration, high power, 8..9V typical forward voltage.2. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Voltage minimum and maximum values at the nominal drive current are guaranteed by 100% test.3. Products tested under pulsed condition (10ms pulse width) at nominal drive current where Tsp = 25°C.4. Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power.Absolute Maximum RatingsTable 4: Maximum RatingsNotes for Table 4:1. Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating LED SMD at maximum peak pulsed current specified.Maximum peak pulsed current indicate values where LED SMD can be driven without catastrophic failures.2. Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. no rating is providedProduct Bin DefinitionsTable 5:Luminous flux Bin Definitions at 100mA, T sp =25°CTable 5 lists the standard photometric luminous flux bins for Bridgelux SMD 3030 LEDs. Although several bins are listed, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all CCTs.Table 6: Forward Voltage Bin Definition at 100mA, T sp=25°CNote for Table 6:1. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements.Note for Table 5:1.Bridgelux maintains a tolerance of ± 7.5% on luminous flux measurements.Product Bin DefinitionsTable 7: 3- and 6-step MacAdam Ellipse Color Bin DefinitionsNotes for Table 7:1. Color binning at T=85°C unless otherwise specifiedsp2. Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space.Product Bin DefinitionsFigure 1: C.I.E. 1931 Chromaticity Diagram (5 Color Bin Structure, Hot-color Targeted at Tsp=85°C)Note for Figure 3:1. Pulse width modulation (PWM) is recommended for dimming effects.Figure 2: Drive Current vs. Voltage (T sp =25°C)Figure 4: Typical Relative Flux vs. Solder Point TemperatureFigure 5: Typical ccx Shift vs. Solder Point TemperatureNotes for Figures 4 & 5:1. Characteristics shown for neutral white based on 4000K 80 CRI.2. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information.Figure 6: Typical ccy Shift vs. Solder Point TemperatureD r a2. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information.Typical Radiation PatternFigure 7: Typical Spatial Radiation Pattern at 100mA, T sp =25°CFigure 8: Typical Polar Radiation Pattern at 100mA, T sp =25°CNotes for Figure 7:1. Typical viewing angle is 120⁰.2. The viewing angle is defined as the off axis angle from the centerline where luminous intensity (Iv) is ½ of the peak value.Typical Color Spectrum Figure 9: Typical Color SpectrumNotes for Figure 9:1. Color spectra measured at nominal current for Tsp = 25°C2. Color spectra shown for 80 CRI products.Mechanical Dimensions Figure 10: Drawing for SMD 3030Notes for Figure 10:1. Drawings are not to scale.2. Drawing dimensions are in millimeters.3. Unless otherwise specified, tolerances are ± 0.10mm. Recommended PCB Soldering Pad PatternReliabilityTable 8: Reliability Test Items and ConditionsNotes for Table 8:1. Measurements are performed after allowing the LEDs to return to room temperature2. T sld : reflow soldering temperature; T a: ambient temperaturePassing CriteriaFigure 11 : Reflow ProfileReflow CharacteristicsFigure 12 : Pick and PlaceNote for Figure 12:1. When using a pick and place machine, choose a nozzle that has a larger diameter than the LED’s emitting surface. Using a Pick-and-Place nozzle witha smaller diameter than the size of the LEDs emitting surface will cause damage and may also cause the LED to not illuminate.Is greater than LEDsemitting surfacePackagingFigure 13: Emitter Reel DrawingsNote for Figure 13:1. Drawings are not to scale. Drawing dimensions are in millimeters. Figure 14: Emitter Tape DrawingsNote for Figure 14:1. Drawings are not to scale. Drawing dimensions are in millimeters.PackagingFigure 15: Emitter Reel Packaging DrawingsNote for Figure 15:1.Drawings are not to scale.5 k10 kDesign ResourcesDisclaimersPrecautionsPlease contact your Bridgelux sales representative for assistance.MINOR PRODUCT CHANGE POLICYThe rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cosmetic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization.CAUTION: CHEMICAL EXPOSURE HAZARDExposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED emitter. Please consult Bridgelux Application Note AN51 for additional information.CAUTION: EYE SAFETYEye safety classification for the use of Bridgelux SMD LED emitter is in accordance with IECspecification EN62471: Photobiological Safety of Lamps and Lamp Systems. SMD LED emitters are classified as Risk Group 1 when operated at or belowthe maximum drive current. Please use appropriate precautions. It is important that employees working with LEDs are trained to use them safely.CAUTION: RISK OF BURNDo not touch the SMD LED emitter during operation. Allow the emitter to cool for a sufficient period of time before handling. The SMD LED emitter may reachelevated temperatures such that could burn skin when touched.CAUTIONCONTACT WITH LIGHT EMITTING SURFACE (LES) Avoid any contact with the LES. Do not touch the LES of the emitter or apply stress to the LES (yellow phosphor resin area). Contact may cause damage to the emitterOptics and reflectors must not be mounted in contact with the LES (yellow phosphor resin area).STANDARD TEST CONDITIONSUnless otherwise stated, LED emitter testing is performed at the nominal drive current.About Bridgelux: Bridging Light and Life™© 2021 Bridgelux, Inc. All rights reserved 2021. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc. All other trademarks are the property of their respective owners.46410 Fremont Boulevard Fremont, CA 94538 USA Tel (925) 583-8400Fax (925) At Bridgelux, we help companies, industries and people experience the power and possibility of light. Since 2002, we’ve designed LED solutions that are high performing, energy efficient, cost effective and easy to integrate. Our focus is on light’s impact on human behavior, delivering products that create better environments, experiences and returns—both experiential and financial. And our patented technology drives new platforms for commercial and industrial luminaires.For more information about the company, please visit /Bridgelux /Bridgelux/user/Bridgelux WeChat ID: BridgeluxInChina https:///company/bridgelux-inc-_2。