cxa1691文档

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—1—E99215-TESony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.Absolute Maximum Ratings (Ta=25 °C)•Supply voltage V CC 14V •Operating temperature Topr –10 to +60°C •Storage temperature Tstg –50 to +125°C •Allowable power dissipationP D700mW (CXA1691BM)P D 1000mW(CXA1691BS)Recommended Operating Conditions Supply voltage V CC 2 to 7.5V(CXA1691BM)V CC 2 to 8.5V(CXA1691BS)DescriptionCXA1691BM/BS is a one-chip FM/AM radio IC designed for radio-cassette tape recorders.Features•Small number of peripheral components.•Low current consumption (V CC =3 V)For FM :I D =5.8 mA (Typ.)For AM :I D =4.7 mA (Typ.)•Built-in FM/AM select switch.•Large output of AF amplifier.V CC =6 V, EIAJ output=500 mW (Typ.)when load impedance 8 ΩFunction FM section•RF amplifier, Mixer and OSC(incorporating AFC variable capacitor).•IF amplifier•Quadrature detection •Tuning LED driver AM section•RF amplifier, Mixer and OSC (with RF AGC)•IF amplifier (with IF AGC)•Detector•Tuning LED driver AF section•Electronic volume control •FM mutingStructureBipolar monolithic ICFM/AM RadioCXA1691BMCXA1691BS28 pin SOP (Plastic)30 pin SDIP (Plastic)CXA1691BM/BSFor the availability of this product, please contact the sales office.—2—Block Diagram CXA1691BMCXA1691BSFM/AMBAND AM FM IFAFC AFCDET AFRipple AFDISCRI OSCOSC OUTRFRF INRF IN GND FE OUTFM/AMBAND AM FM IFAFC AFC DET AF Ripple CC AFDISCRI OSCOSC OUTRF RF INRF IN GND FE OUTNCStandard Circuit Design Data(The pin numbers in the parenthesis are for CXA1691BS.)—3——4—∗The pin voltage of pin 6 during AM, it is the same pin voltage of pin 22 (23) during J BAND and is the same pin voltage of pin 21 (22) during W BAND.—5——6—CXA1691BM/BSN o .123456789101112131415I t e mA M c i r c u i t c u r r e n t F M c i r c u i t c u r r e n t F M f r o n t e n d v o l t a g e g a i nF M d e t e c t i o n o u t p u t l e v e lF M I F k n e e l e v e l F M d e t e c t i o n o u t p u t d i s t o r t i o n f a c t o r F M m e t e r c u r r e n t A M f r o n t e n d v o l t a g e g a i nA M I F v o l t a g e g a i nA M d e t e c t i o n o u t p u t l e v e lA M m e t e r c u r r e n tA M d e t e c t i o n o u t p u t d i s t o r t i o n f a c t o rA u d i o v o l t a g e g a i nA u d i o d i s t o r t i o n f a c t o r M u t i n g l e v e lS y m b o l I D 1I D 2G V 1V D 1V D 2T H D 1I B 1G V 2G V 3V D 3I B 2T H D 2G V 4T H D 3V D 4S W c o n d i t i o n s 123456A B A A A A A B A A B A A B A A B A A ——A B AA ——AB A A ——A B A A ——A B A A A A AA AAA —A A AAA —A A A AA —A A A AA B B A A A ————B A ————B A ————B T e s t P o i n tI A I A V AV D V D V DI M V BV DV DI MV DV EV EV EC o n d i t i o n sN o s i g n a l , A M N o s i g n a l , F M V I N 1=40 d B µV , 100 M H z V I N 3=90 d B µV , 10.7 M H z (1 k H z , 22.5 k H z D E V )V I N 3=l e v e l a t a p o i n t 3 d B d o w n f r o m V I N 3=90 d B µV , 10.7 M H z (1 k H z , 22.5 k H z D E V )V I N 3=90 d B µV , 10.7 M H z (1 k H z , 75 k H z D E V )V I N 3=60 d B µV , 10.7 M H z V I N 2=60 d B µV , 1660 k H z V I N 3w h e n 455 k H z (1 k H z , 30 % M O D )o u t p u t i s –34 d B m V I N 3=85 d B µV , 455 k H z (1 k H z , 30 % M O D )V I N 3=85 d B µV , 455 k H z (1 k H z , 30 % M O D )V I N 2=95 d B µV , 1660 k H z (1 k H z , 30 % M O D )V I N 3=60 d B µV , 10.7 M H z V I N 4=–30 d B m , 1 k H z D i s t o r t i o n f a c t o r f o r 50 m W o u t p u t V I N 3=60 d B µV , 10.7 M H z V I N 4=–20 d B m , 1 k H z M u t i n g l e v e l f o r 50 m W o u t p u t V I N 4=–20d B m , 1 k H z A t t e n u a t i o n f o r 60 d B µV i n p u t w i t h V I N 3O F FM i n .T y p .M a x .U n i t—4.810.0m A —7.614.0m A323946d B3977.5155m V r m s—2432d B µV—0.32.0%1.83.57.0m A 152229d B142027d B µV3977.5155m V r m s1.33.07.0m A—0.62.0%2731.536d B—0.92.5%81522d BE l e c t r i c a l C h a r a c t e r i s t i c s(S e e t h e E l e c t r i c a l C h a r a c t e r i s t i c s T e s t C i r c u i t , T a =25 °C , V C C =6 V )0 d B µV =1 µV—7—E l e c t r i c a l C h a r a c t e r i s t i c s T e s t C i r c u i tV I N 2V I N 1V I N 3V AV BV EG N DV C CI F T :O S C :A M 455k H z I F T A M O S C—8—A p p l i c a t i o n C i r c u i t 1B A T TA p p l i c a t i o n c i r c u i t s s h o w n a r e t y p i c a l e x a m p l e s i l l u s t r a t i n g t h e o p e r a t i o n o f t h e d e v i c e s . S o n y c a n n o t a s s u m e r e s p o n s i b i l i t y f o r a n y p r o b l e m s a r i s i n g o u t o f t h e u s e o f t h e s e c i r c u i t s o r f o r a n y i n f r i n g e m e n t o f t h i r d p a r t y p a t e n t a n d o t h e r r i g h t d u e t o s a m e .—9—A p p l i c a t i o n C i r c u i t 2B A T TA p p l i c a t i o n c i r c u i t s s h o w n a r e t y p i c a l e x a m p l e s i l l u s t r a t i n g t h e o p e r a t i o n o f t h e d e v i c e s . S o n y c a n n o t a s s u m e r e s p o n s i b i l i t y f o r a n y p r o b l e m s a r i s i n g o u t o f t h e u s e o f t h e s e c i r c u i t s o r f o r a n y i n f r i n g e m e n t o f t h i r d p a r t y p a t e n t a n d o t h e r r i g h t d u e t o s a m e .Coil dataAM OSCCore diameter ø 0.06 mm 2UEWEquivalent to L-5K7-H5 R12-1684X. Mitsumi Electric Co., Ltd.or 7TRS-8441X TOKO Co., Ltd.FM RFFM OSCAM bar antennaBPF PFWE8(88 to 108 MHz)Soshin Electric Co., Ltd.CF1SFU-455B Murata Mfg. Co., Ltd. Or BFCFL-455 TOKO Co., Ltd.CF2SFE10.7MA5Murata Mfg. Co., Ltd.CF3CDA10.7MC1Murata Mfg. Co., Ltd.f (kHz)796L (µH)1 to 3270Q O1 to 31251 to 31074 to 629f (kHz)796L (µH)650Primary91 tSecondary20 tAM IFTCore diameter ø 0.07 mm UEWEquivalent to 21K7-H5 R12-8558A. Mitsumi Electric Co., Ltd.or 7MC-7789N TOKO Co., Ltd.φ 4mmφ 0.6mm 4.5tφ 4mmφ 0.6mm 3.5tSecondaryNumber of widings (t)C O(pF)1 to 3180Q O1 to 3901 to 21112 to 3354 to 67Number of widings (t)—10—SONY CODE EIAJ CODE JEDEC CODESOP-28P-L04PACKAGE STRUCTUREPACKAGE MATERIALLEAD TREATMENT LEAD MATERIAL PACKAGE MASS42/COPPER ALLOY SOLDER PLATING EPOXY RESIN 28PIN SOP (PLASTIC)+ 0.4+ 0.4SOP028-P-03750.7gSONY CODE EIAJ CODE JEDEC CODE30PIN SDIP (PLASTIC)SDIP-30P-01SDIP030-P-0400PACKAGE STRUCTUREMOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE MASSEPOXY RESINPLATING COPPER ALLOY 1.8gSOLDER/PALLADIUM1.All mat surface type.Two kinds of package surface:2.All mirror surface type.Package Outline Unit : mmCXA1691BMCXA1691BSCXA1691BM/BS—11—NOTE : PALLADIUM PLATINGThis product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).。