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ISD · 2727 North First Street, San Jose, CA 95134 · TEL: 408/943-6666 · FAX: 408/544-1787 · July 2000GENERAL DESCRIPTIONInformation Storage Devices’ ISD1810 ChipCorder ®provides high-quality, single-chip, single-message,record/playback solution with user-selectable du-rations of 8 to 16 seconds. The CMOS devices in-clude an on-chip oscillator (with external control),microphone preamplifier, automatic gain con-trol, anti-aliasing filter, multilevel storage array,smoothing filter, and speaker amplifier. A mini-mum record/playback subsystem can be config-ured with a microphone, a speaker, several passive components, two push-buttons, and a power source.Recordings are stored in on-chip nonvolatile mem-ory cells, providing zero-power message storage.This unique, single-chip solution is made possible through ISD’s patented multilevel storage technology.Voice and audio signals are stored directly into memory in their natural form, providing high-quality,solid-state voice reproduction.ISD1810Single-Chip, Single-Message Voice Record/PlaybackDevice 8- to 16-Second DurationsAdvanceInformationISD1810 ProductiiVoice Solutions in Silicon ™FEATURES•Easy-to-use single-chip, single-message voice record/playback solution•High-quality, natural voice/audio reproduction •Push-button interface–Playback can be edge- or level-activated •Variable record/playback duration controlled by external resistor selection which sets sample rate.8 KHz sample rate =8 seconds 6.4 KHz sample rate =10 seconds 5.3 KHz sample rate =12 seconds 4.0 KHz sample rate=16 seconds•Automatic power-down mode–Enters standby mode immediately fol-lowing a record or playback cycle –0.5µA standby current (typical)•On-chip 89 speaker driver •Zero-power message storage –Eliminates battery backup circuits •100-year message retention (typical)•10,000 record cycles (typical)•On-chip oscillator•No algorithm development required •Single +3 volt power supply•Available in die form and 28-pin 600 mil DIP (for sampling only)NOTEA resistor value of 100 K 9 at the ROSC pin provides this specified duration. Only this duration isguaranteed and tested.Part Number Minimum Duration 1(Seconds)Maximum Input Sample Rate (KHz)1Typical Filter UpperPass Band (KHz)1ISD1810106.42.6Table of ContentsDETAILED DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Speech/Sound Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 NONVOLATILE Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Basic Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Automatic Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Voltage Supplies (V CCA , V CCD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Ground Supplies (V SSA, V SSD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Record (REC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Playback, Edge-Activated (PLAYE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Playback, Level-Activated (PLAYL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Record LED Output (RECLED) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Microphone Input (MIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Microphone Reference (MIC REF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Automatic Gain Control (AGC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Speaker Outputs (SP+, SP–) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 External Clock (XCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Resistor Controlled Oscillator (ROSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Feed Through (FT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 FUNCTIONAL DESCRIPTION EXAMPLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 PHYSICAL DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14ISD iiiISD1810 Product1ISDDETAILED DESCRIPTIONSPEECH/SOUND QUALITYISD’s patented ChipCorder technology provides natural record and playback. The input voice signals are stored directly in nonvolatile cells and are re-produced without the synthetic effect often heard with digital solid-state speech solutions. A complete sample is stored in a single cell, minimizing the mem-ory necessary to store a single message.DURATIONThe ISD1810 devices offer single-chip solutions with 8 to 16 seconds of record/playback duration capacity. Sampling rate and duration are deter-mined by an external resistor connected to the ROSC pin. These specifications apply with the re-quired resistor value for 10-second minimum play-back duration.NOTEOnly the 10 second duration is guaranteed and tested.NONVOLATILE STORAGEOne of the benefits of ISD’s ChipCorder technology is the use of on-chip nonvolatile memory, providing zero-power message storage. The message is re-tained for up to 100years without power. In addi-tion, the device can be re-recorded typically over 10,000times.BASIC OPERATIONThe ISD1810 ChipCorder device is controlled by the REC pin, and either of two playback pins,PLAYE (edge-activated playback), and PLAYL (lev-el-activated playback). The ISD1810 parts are configured for design simplicity in a single-mes-sage application. Device operation is explained on “Functional Description Example” on page 6.AUTOMATIC POWER-DOWN MODEAt the end of a playback or record cycle, the ISD1810 device automatically returns to a low-power standby mode, consuming typically 0.5µA, provided that Play REC, XCLK, and FT pins are LOW (see DC parameters). During a playback cycle, the device powers down automatically at the end of the message. During a record cycle,the device powers down immediately after REC is released LOW.PIN DESCRIPTIONSVOLTAGE SUPPLIES (V CCA , V CCD )Analog and digital circuits internal to the ISD1810device use separate power buses to minimize noise on the chip. These power buses are brought out to separate pins on the package and should be tied together as close to the supply as possi-ble. It is important that the power supply be de-coupled as close as possible to the package.GROUND SUPPLIES (V SSA , V SSD )Similar to V CCA and V CCD , the analog and digital circuits internal to the ISD1810 device use sepa-rate ground buses to minimize noise. These pins should be tied together as close as possible to the device.RECORD (REC)The REC input is an active-HIGH record signal. The device records whenever REC is HIGH. This pin must remain HIGH for the duration of the record-ing. REC takes precedence over either playback (PLAYL or PLAYE) signal. If REC is pulled HIGH during a playback cycle, the playback immediately ceases and recording begins.NOTEThe REC signal is internally debounced on the rising edge to prevent a false re-triggering from a push-button switch.ISD1810 Product2Voice Solutions in Silicon ™A record cycle is completed when REC is pulled LOW. An end-of-message (EOM) marker is internally recorded, enabling a subsequent playback cycle to terminate appropriately. The device automatical-ly powers down to standby mode when REC goes LOW. This pin has an internal pull-down device.Holding this pin HIGH will increase standby current consumption.PLAYBACK, EDGE-ACTIVATED (PLAYE)When a HIGH-going transition is detected on this input pin, a playback cycle begins. Playback con-tinues until an End-of-Message (EOM) marker is en-countered or the end of the memory space is reached. Upon completion of the playback cy-cle, the device automatically powers down into standby mode. Taking PLAYE LOW during a play-back cycle will not terminate the current cycle.This pin has an internal pull-down device. Holding this pin HIGH will increase standby current con-sumption.PLAYBACK, LEVEL-ACTIVATED (PLAYL)When this input pin transitions from LOW to HIGH, a playback cycle is initiated. Playback continues until PLAYL is pulled LOW, an end-of-message marker is detected, or the end of the memory space is reached. The device automatically powers down to standby mode upon completion of the playback cycle. This pin has an internal pull-down device. Holding this pin HIGH will increase standby current consumption.RECORD LED OUTPUT (RECLED)It can be used to drive an LED to provide feed-back that a record cycle is in progress. In addition,RECLED pulses LOW momentarily when an end-of-message or end-of-memory marker is encoun-tered in a playback cycle.MICROPHONE INPUT (MIC)The microphone input transfers its signal to the on-chip preamplifier. An on-chip Automatic Gain Control (AGC) circuit controls the gain of thepreamplifier. An external microphone should be AC coupled to this pin via a series capacitor. The capacitor value, together with the internal 10K Ωresistance on this pin, determine the low-frequency cutoff for the ISD1810 passband.MICROPHONE REFERENCE (MIC REF)The MIC REF input is the inverting input to the mi-crophone preamplifier. This provides input noise-cancellation, or common-mode rejection, when the microphone is connected differentially to the device.Figure 1:ISD1810 Pinouts—For Sampling OnlyNOTE:NC means must Not Connect.AUTOMATIC GAIN CONTROL (AGC)The AGC dynamically adjusts the gain of the preamplifier to compensate for the wide range of microphone input levels. The AGC allows the full range of sound, from whispers to loud sounds, to be recorded with minimal distortion. Nominal val-ues of 4.7µF give satisfactory results in most cas-es.ISD1810 Product3ISDSPEAKER OUTPUTS (SP+, SP–)The SP+ and SP– pins provide direct drive for loud-speakers with impedances as low as 8 Ω. A single output may be used, but, for direct-drive loud-speakers, the two opposite-polarity outputs pro-vide an improvement in output power of up to four times over a single-ended connection. Furthermore,when SP+ and SP– are used, a speaker coupling capacitor is not required. A single-ended connec-tion will require an AC-coupling capacitor be-tween the SP pin and the speaker.The SP+ pin and the SP– pin are internally connected through a 50K Ω resistance. When not in playback mode, they are floating.EXTERNAL CLOCK (XCLK)The external clock input for the ISD1810 devices has an internal pull-down resistor. This pin is used for test purposes only. Do not bond this pad.RESISTOR CONTROLLED OSCILLATOR (ROSC)The resistor controlled oscillator input enables the user to vary the ISD1810 device record and play-back duration. The resistor connected between the ROSC pin and V SS (R2) determines the sample frequency and the filter upper pass band for the ISD1810 device. ISD recommends an ROSC resis-tor value of 100K Ω.FEED THROUGH (FT)Feed Through mode allows use of the speaker drivers for external signals. The signal between the MIC and MIC_REF pins will pass through the AGC,the filter and the speaker drivers to the speaker outputs SP+ and SP-. The input FT controls the feed through mode. To operate this mode, the control pins REC, PLAYE and PLAYL are held low at VSS. The pin FT is held high to VCC. For normal operation of record, play and power down, the FT pin is held at VSS. The FT pin has a weak pull down to VSS.SPECIFICATIONS1.Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.1.V CC = V CCA = V CCD .2.V SS = V SSA = V SSD .Table 1:Absolute Maximum Ratings 1ConditionValueJunction temperature 150°CStorage temperature range –65°C to +150°C Voltage applied to any pad(V SS – 0.3 V) to (V CC +0.3 V)V CC – V SS–0.3 V to +7.0 VTable 2:Operating ConditionsConditionValueOperating temperature range 0°C to +50°C Play voltage (V CC )(1)+2.7V to +4.5V Ground voltage (V SS )(2)0 VRecord Supply voltage (V CC )(1+2.7V to 4.5VISD1810 Product4Voice Solutions in Silicon ™1.Typical values @ T A = 25°C and 3.0 V.2.All Min/Max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are 100percent tested.3.Record LED output, RECLED.4.V CCA and V CCD connected together.5.REC, PLAYL, PLAYE, XCLK, and FT must be at V SSD .6.REC, PLAYL, and PLAYE.7.REC, PLAYL and PLAYE.8.FT.Table 3: DC ParametersSymbol ParametersMin (2)Typ (1)Max (2)Units ConditionsV IL Input Low Voltage 0.8V V IH Input High Voltage 2.0VV OL Output Low Voltage 0.4V I OL = 4.0 mA (3)V OH Output High Voltage 2.4V I OH = – 1.6 mA (3)I CC V CC Current (Operating)30mA V CC = 4.5VI SB V CC Current (Standby)0.510µA (4)(5)I ILPD1Input Leakage Current ±1µA Force V SS (6) I ILPD2Input Current HIGH 30150400µA Force V CC (7) I ILPD3Input Current HIGH 3130µA Force V CC (8)R EXTOutput Load Impedance 8ΩSpeaker Load, SP+ to SP–R MIC, R MICREF Preamp Input Resistance 10K ΩA MSPMIC SP+/– Gain42dBAGC = 0.0 VTable 4: AC Parameters 1Symbol CharacteristicMin (3)Typ (2)Max (3)Units ConditionsF S Sampling Frequency 6.4KHz (4)F CF Filter Pass Band 2.6KHz 3 dB Roll-Off Point (5)(6)T REC Record Duration 1011sec (4)T PLAY Playback Duration 1011sec (4)T EOM EOM Pulse Width 84msec T DBDebounce Time84msecISD1810 Product5ISD1.These specifications apply with R OSC equaling 100K Ω.2.Typical values @ T A = 25°C and3.0 V.3.All Min/Max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are 100percent tested.4.Oscillator stability may vary as much as ±5 percent over the operating temperature and voltage ranges.5.Low-frequency cutoff depends upon value of external capacitors (see Pin Descriptions).6.Filter specification applies to the antialiasing filter and to the smoothing filter.7.Balanced input signal applied between MIC and MIC REF as shown in the application example. Single-ended MIC or MIC REF recommended to be less than 100mV peak to peak.Figure 2: ISD1810 Application Example—Design SchematicTHDTotal Harmonic Distortion1%@ 1 KHz, V IN = 15mV Peak to Peak P OUT Speaker Output Power 24.4mW R EXT = 8 ΩV OUT Voltage Across Speaker Pins 1.25 2.5V p–p R EXT = 600 ΩV INMIC Input Voltage15300mVPeak-to-Peak (7)Table 4: AC Parameters 1Symbol CharacteristicMin (3)Typ (2)Max (3)UnitsConditionsISD1810 Product6Voice Solutions in Silicon ™FUNCTIONAL DESCRIPTION EXAMPLEThe following example operating sequence dem-onstrates the functionality of the ISD1810 devices.1.Record a message filling the memory.Pulling the REC pin HIGH initiates a record cycle from the beginning of the message space. The device will automatically power down after REC is released LOW. An EOM marker is written at the end of message. If REC is held HIGH, the recording continues until the message space has been filled.Once the message space is filled,recording ceases. 2.Edge-activated playback.Pulling the PLAYE pin HIGH initiates a playback cycle from the beginning of the message space. The falling edge of PLAYE has no effect on operation. When the device reaches the EOM marker, it automatically powers down. If a recording has filled the message space, the entire message is played. A subsequent rising edge on PLAYE initiates a new play cycle from the beginning of the memory.3.Level-activated playback.Pulling the PLAYL pin HIGH initiates a playback cycle from the beginning of the message space. When the device reaches the EOM marker, it automatically powers down. If recording has filled the message space, the entire message is played. A subsequent rising edge on PLAYL initiates a new play cycle from the beginning of the memory.4.Level-activated playback (truncated).If PLAYL is pulled LOW any time during the playback cycle, the device stops playing and enters the power-down mode. A subsequent rising edge on PLAYL initiates a new play cycle from the beginning of memory.5.Record (interrupting playback).The REC pin takes precedence over other operations. Any HIGH-going transition on REC initiates a new record operation from the beginning of the memory, regardless of any current operation in progress.6.Record a message, partially filling thememory.A record operation need not fill the entire memory. Releasing the REC pin LOW before filling the message space causes the recording to stop and an EOM marker to be placed. The device powers down automatically.7.Play back a message that partially fills thememory.Pulling the PLAYE or PLAYL pin HIGH initiates a playback cycle. The playback cycle ceases when the EOM marker is encountered and the device then powers down.8.The RECLED output pin provides an active-LOW signal which can be used to drive an LED as a “record-in- progress” indicator. It returns to a HIGH state when the REC pin is released LOW or when the recording is completed due to the memory being filled. This pin also pulses LOW to indicate the end of a message has been reached.9.ROSC OperationThe duration of the device can be varied by changing the value of R2 (R OSC ). This means the ISD1810 device can actually be between 8 to 16 seconds duration. See the curve below which charts typical durations when the R OSC is varied from 80K Ω to 160K Ω.This feature allows frequency shifting where a recorded voice or sound can be played back faster or slower than normal for special effects. For example, use a 100K Ωresistor to make the recording and thenISD1810 ProductISD playback with either an 80KΩ resistor for faster “chipmunk” talk or with a 120KΩ resistor for a slower, lower voice.Another feature is a “Pause” or interrupt function that can be done by taking the ROSC resistor to V CC to stop playback momentarily, resuming when the resistor is connected back to ground.Chart 1:ISD1810 Duration versus R OSC at T A = 25°C and 3.0 VTypicalDuration(sec)78ISD1810 ProductVoice Solutions in Silicon™TIMING DIAGRAMSFigure 3: Record Message Until Record Goes LOWFigure 4: Record Message Until Array is FullISD1810 Product9ISDFigure 5: Play Edge (PLAYE) Play Until End of MessageFigure 6: Play Level (PLAYL) Play Until End of MessageISD1810 ProductFigure 7: Play Until Play Level (PLAYL) FallsFigure 8: Looping Play, PLAYE to RECLED10Voice Solutions in Silicon™ISD1810 Product11ISDPHYSICAL DIMENSIONSFigure 9: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)—For Sampling OnlyTable 5: Plastic Dual Inline Package (PDIP) (P) Dimensions—For Sampling OnlyINCHESMILLIMETERSMinNom Max Min Nom Max A 1.4451.450 1.45536.7036.8336.96B10.150 3.81B20.0650.0700.075 1.65 1.781.91C10.6000.62515.2415.88C20.5300.5400.55013.4613.7213.97D 0.19 4.83D10.0150.38E 0.1250.135 3.18 3.43F 0.0150.0180.0220.380.460.56G 0.0550.0600.0651.401.52 1.65H 0.100 2.54J 0.0080.0100.0120.200.250.30S 0.0700.0750.080 1.78 1.912.03q0°15°0°15°ISD1810 Product12Voice Solutions in Silicon ™Figure 10: ISD1810 Bonding Physical Layout (Unpackaged Die)1.The backside of die is internally connected to V SS . It MUST NOT be connected to any other potential or damage may occur.2.Die thickness is subject to change, please contact ISD factory for status and availability.ISD1810FTXCLK VCCD RECLED REC VSSD PLAYE PLAYL ROSCVCCA SP+VSSA SP–AGC MICREF MIC ISD1810I.Die Dimensions X:2530 Y:2420I.Die Thickness 211.5 ±0.5 mil (typ)I.PAD Opening90 x 90 micronsISD1810 Product13ISDTable 6: ISD1810 PIN/PAD Designations with Respect to Die CenterPIN PIN NameX Axis (µm)Y Axis (µm)1VSSD –368.951038.702REC -558.951038.703PLAYE -760.151038.704PLAYL -977.351038.705N/C 6N/C 7N/C 8N/C 9N/C 10MIC –977.75-1037.2011N/C 12MIC REF -741.75-1037.2013AGC -522.35-1037.2014NC 15SP–-148.15-1024.1016VSSA 158.85-1037.2017SP+465.85-1024.1018VCCA 772.85-1037.2019ROSC 1007.85-1037.2020N/C 21N/C 22N/C 23N/C 24N/C 25FT 630.451018.9026XCLK 358.351038.7027VCCD 122.151038.7028RECLED-126.051038.7014ISD1810 ProductVoice Solutions in Silicon™ORDERING INFORMATIONWhen ordering, please refer to the following part numbers which are supported in volume for this product series. Consult the local ISD Sales Representative or Distributor for availability information.For the latest product information, access ISD’s worldwide website at .Part Number ISD1810X ISD1810P(For Sampling Only)ISD1810Duration:10=8- to 16-second durationPackage Type:X =Die P=Plastic Dual Inline Package (PDIP)(For Sampling Only)Product Number Descriptor KeyISD1800 SeriesPart No. 2200898D15102727 North First Street San Jose, California 95134Tel: 408/943-6666 Fax: 408/544-1787IMPORTANT NOTICESThe warranty for each product of ISD (Information Storage Devices, Inc.), is contained in a written warranty which governs sale and use of such product. Such warranty is contained in the printed terms and conditions under which such product is sold, or in a separate written warranty supplied with the product. Please refer to such written warranty with respect to its applicability to certain applications of such product.These products may be subject to restrictions on use. Please contact ISD, for a list of the current additional restrictions on these products. By purchasing these products, the purchaser of these products agrees to comply with such use restrictions. Please contact ISD for clarification of any restrictions described herein.ISD, reserves the right, without further notice, to change the ISD ChipCorder product specifications and/or information in this document and to improve reliability, functions and design.ISD assumes no responsibility or liability for any use of the ISD ChipCorder products. ISD conveys no license or title, either expressed or implied, under any patent, copyright, or mask work right to the ISD ChipCorder products, and ISD makes no warranties or representations that the ISD ChipCorder products are free from patent, copyright, or mask work right infringement,unless otherwise specified.Application examples and alternative uses of any integrated circuit contained in this publication are for illustration purposes only and ISD makes no representation or warranty that such applications shall be suitable for the use specified.The ISD products described herein may not be used in recordable greeting cards intended for resale in Japan without ISD’s prior written consent. Recordable greeting cards are articles, usually constructed of paper or cardboard (but not limited to these materials), that include artwork (including preprinted or customer-affixed photographs or artwork) and/or editorials that have the look and feel of greeting cards and areable to be inserted into an envelope (but do not necessarily need to be inserted) and primarily intended to be presented or delivered to an individual as a greeting card, that allow the sender to record and the recipient to play back, and audio signal message. The foregoing restriction applies only to recordable greeting cards intended, directly or indirectly, for retail distribution. Recordable greeting cards incorporating ISD products may not be sold, directly or indirectly, through retail channels without ISD’s prior written consent.The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the ISD Reliability Report, and are neither warranted nor guaranteed by ISD.Information contained in this ISD ChipCorder data sheet supersedes all data for the ISD ChipCorder products published by ISD prior to August, 1998.This data sheet and any future addendum to this data sheet is (are) the complete and controlling ISD ChipCorder product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety.Copyright© 1998, ISD (Information Storage Devices, Inc.) All rights reserved. ISD is a registered trademark of ISD. ChipCorder is a trademark of ISD. All other trademarks are properties of their respective owners.。

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ISD17120资料

ISD17120资料

PRELIMINARYPublication Release Date: January 23, 2007 Revision 1.3-S2ISD1700 SeriesMulti-Message Single-ChipVoice Record & Playback DevicesISD1700 SERIESTABLE OF CONTENTS1GENERAL DESCRIPTION (3)2FEATURES (4)3BLOCK DIAGRAM (5)4PINOUT CONFIGURATION (6)5PIN DESCRIPTION (7)6MODES OF OPERATIONS (8)6.1Standalone (Push-Button) Mode (8)6.2SPI Mode (8)7TIMING DIAGRAMS (8)7.1Standalone Operation (8)7.2SPI Operation (12)8ABSOLUTE MAXIMUM RATINGS (13)8.1Operating Conditions (13)9ELECTRICAL CHARACTERISTICS (14)9.1DC Parameters (14)9.2AC Parameters (15)10TYPICAL APPLICATION CIRCUITS (16)10.1Good Audio Design Practices (18)11PACKAGING (19)11.128-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC (19)11.228-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) (20)11.328-Lead 600-Mil Plastic Dual Inline Package (PDIP) (21)11.4Die Information (21)12ORDERING INFORMATION (22)13VERSION HISTORY (23)- 2 -ISD1700 SERIES1 GENERAL DESCRIPTIONThe Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi-message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications.The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output.The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as “Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction.Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a single-ended current or voltage output to drive an external amplifier.While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed.In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products.Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes.Publication Release Date: January 23, 2007- 3 - Revision 1.3-S2ISD1700 SERIES- 4 -2 FEATURESy Integrated message management systems for single-chip, push-button applicationso REC : level-trigger for recordingo PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially o ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages o FWD : edge-trigger to advance to the next message or fast message scan during the playback o VOL : 8 levels output volume controlo INT RDY : ready or busy status indication o RESET : return to the default stateo Automatic power-down after each operation cycley Selectable sampling frequency controlled by an external oscillator resistorySelectable messagedurationo A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosenSample Freq. ISD1730ISD1740 ISD1750ISD1760ISD1790ISD17120ISD17150ISD17180 ISD17210ISD1724012 kHz20 secs 26 secs 33 secs 40 secs 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs 8 kHz 30 secs 40 secs 50 secs 60 secs 90 secs 120 secs 150 secs 180 secs 210 secs 240 secs 6.4 kHz 37 secs 50 secs 62 secs 75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs 5.3 kHz 45 secs 60 secs 75 secs 90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs 4 kHz60 secs80 secs100 secs120 secs180 secs240 secs300 secs360 secs 420 secs480 secsy Message and operation indicatorso Four customizable Sound Effects (SEs) for audible indicationo Optional vAlert (voiceAlert) to indicate the presence of new messageso LED: stay on during recording, blink during playback, forward and erase operationsy Dual operating modes o Standalone mode:Integrated message management techniques Automatic power-down after each operation cycle o SPI mode:Fully user selectable and controllable options via APC register and various SPI commands y Two individual input channelso MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through y Dual output channelso Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier y ChipCorder standard featureso High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltageo 100-year message retention (typical) o 100,000 record cycles (typical)Sampling Frequency12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz Rosc53 k Ω 80 k Ω100 k Ω 120 k Ω 160 k ΩISD1700 SERIESy Temperature options:o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)o Industrial: -40°C to +85°C (packaged units)y Packaging types: available in die, PDIP, SOIC and TSOPy Package option: Lead-free packaged units3 BLOCK DIAGRAMPublication Release Date: January 23, 2007- 5 - Revision 1.3-S2ISD1700 SERIES4 PINOUT CONFIGURATIONRefer to Design Guide for details before performing any design or PCB layout.- 6 -ISD1700 SERIES5 PIN DESCRIPTIONRefer to Design Guide for details before performing any design or PCB layout.Publication Release Date: January 23, 2007- 7 - Revision 1.3-S2ISD1700 SERIES6 MODES OF OPERATIONSThe ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.6.1 S TANDALONE (P USH-B UTTON)M ODEOne can utilize the REC, PLAY, FT, FWD, ERASE, VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state.6.2 SPI M ODEIn SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands.For technical details, please refer to the design guide.7 TIMING DIAGRAMSThe following estimated timing diagrams are not in proper scale.7.1 B ASIC O PERATIONFigure 12.1: Record Operation with No Sound Effect- 8 -ISD1700 SERIESFigure 12.2: Start and Stop Playback OperationFigure 12.3: Single Erase Operation with No Sound EffectPublication Release Date: January 23, 2007- 9 - Revision 1.3-S2ISD1700 SERIESFigure 12.4: Forward Operation with No Sound EffectFigure 12.5: Global Erase Operation with or without Sound Effects- 10 -ISD1700 SERIESFigure 12.6: Reset OperationFigure 12.7: Playback Operation with ramp up and ramp down effect at AUD outputPublication Release Date: January 23, 2007- 11 - Revision 1.3-S2ISD1700 SERIES7.2 SPI O PERATIONFigure 12.8: SPI Operationslower sampling frequency.- 12 -ISD1700 SERIESPublication Release Date: January 23, 2007- 13 - Revision 1.3-S28 ABSOLUTE MAXIMUM RATINGSABSOLUTE MAXIMUM RATINGS (DIE) [1] CONDITIONSVALUESJunction temperature1500CStorage temperature range -650C to +1500CVoltage Applied to any pads(V SS - 0.3V) to (V CC + 0.3V) Power supply voltage to ground potential-0.3V to +7.0VABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) [1]CONDITIONSVALUESJunction temperature1500CStorage temperature range -650C to +1500CVoltage Applied to any pins(V SS - 0.3V) to (V CC + 0.3V) Voltage applied to any pin (Input current limited to +/-20 mA) (V SS – 1.0V) to (V CC + 1.0V) Power supply voltage to ground potential-0.3V to +7.0V[1]Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.8.1 O PERATING C ONDITIONSOPERATING CONDITIONS (DIE) CONDITIONSVALUESOperating temperature range 0°C to +50°C Supply voltage (V CC ) [1] +2.4 V to +5.5 VGround voltage (V SS ) [2]0 VInput voltage (V CC ) [1]0 V to 5.5 V Voltage applied to any pins (V SS –0.3 V) to (V CC +0.3 V)OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONSVALUESOperating temperature range (Case temperature) -40°C to +85°CSupply voltage (V DD ) [1] +2.4V to +5.5VGround voltage (V SS ) [2]0V Input voltage (V DD ) [1] 0V to 5.5V Voltage applied to any pins (V SS –0.3V) to (V DD +0.3V)[1] V CC = V CCA = V CCD = V CCP[2]V SS = V SSA = V SSD = V SSP1 V SSP2ISD1700 SERIES- 14 -9 ELECTRICAL CHARACTERISTICS9.1 DC P ARAMETERSPARAMETER SYMBOL MIN TYP [1]MAX UNITS CONDITIONSSupply Voltage V DD 2.4 5.5 V Input Low Voltage V IL V SS -0.3 0.3xV DD V Input High Voltage V IH 0.7xV DD V DD V Output Low Voltage V OL V SS -0.3 0.3xV DD V I OL = 4.0 mA [2] Output High Voltage V OH 0.7xV DD V DD V I OH = -1.6 mA [2]Record Current I DD_Record 20 mAPlayback Current I DD_Playback 20 mAErase Current I DD_Erase 20 mAV DD = 5.5 V, No load, Sampling freq = 12 kHz Standby Current I SB 1 10 µA [3] [4]Input Leakage Current I ILPD1 ±1 µA Force V DD Input Current Low I ILPD2 -3 -10 µA Force V SS , others at Vcc Preamp Input Impedance R MIC+,R MIC- 7 k Ω Power-up AGC AnaIn Input Impedance R AnaIn 42 k Ω When active MIC Differential Input V IN1 15 300 mV Peak-to-Peak [5] AnaIn Input Voltage V IN2 1 V Peak-to-Peak Gain from MIC to SP+/- A MSP 6 40 dB V IN = 15~300 mV, AGC =4.7 µF, V CC = 2.4V~5.5VSpeaker Output Load R SPK 8 Ω Across both Speaker pins AUX Output Load R Aux 5 k Ω When active 670 mW V DD = 5.5 V 313 mW V DD = 4.4 V 117 mW V DD = 3 V Speaker Output Power Pout 49 mW V DD = 2.4 V 1Vp-p,1 kHz sinewave atAnaIn. R SPK = 8 Ω.Speaker Output Voltage V OUT1 V DD V R SPK = 8Ω (Speaker),Typical buzzerAUX Output Swing V OUT2 1 V Peak-to-Peak AUX Output DC Level V OUT3 1.2 V When active AUD I AUD -3.0 mA V DD =4.5 V, R EXT = 390 Ω Volume Output A Vol 0 to -28 dB 8 steps of 4dB eachreference to outputTotal Harmonic Distortion THD 1 % 15 mV p-p 1 kHz sinewave, Cmessage weightedNotes: [1]Conditions: V CC = 4.5V, 8 kHz sampling frequency and T A = 25°C, unless otherwise stated.[2]LED output during Record operation. [3]V CCA , V CCD and V CCP are connected together. V SSA , V SSP1, V SSP2 and V SSD are connected together.[4] REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at V CCD .[5]Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p.ISD1700 SERIESPublication Release Date: January 23, 2007 - 15 - Revision 1.3-S29.2 AC P ARAMETERSCHARACTERISTIC SYMBOL MIN TYP [1] MAX UNITS CONDITIONSSampling Frequency [2] F S 4 12 kHz [2] [4]Duration [3]T Dur Refer to duration tablesec [3]Rising Time T r 100 nsec Falling TimeT f 100 nsecDebounce Time T Deb 192/F S msec [4]Ramp Up Time T RU 128/F S msec Ramp Down Time T RD 128/F S msecInitial Scan Time after power is appliedT Sc1 DRN/8/F S msec DRN = device row# [4]Initial Scan Time from PD stateT Sc2 DRN/16/F Smsec After a PB operationis run [4]End Recording Time T ER 32/F S msec [4]LED High TimeT LH 0.5K/F S msec [4]LED Flash Time for SE1 T LS1 3.5K/F S sec SE1 not recorded [5]LED Flash Time for SE2 T LS2 7.5K/F S sec SE2 not recorded [5]LED Flash Time for SE3 T LS3 11.5K/F S sec SE3 not recorded [5]LED Flash Time for SE4 T LS4 15.5K/F S sec SE4 not recorded [5]SE1 Recorded Duration T SE1 4K/F S sec [4] [5]SE2 Recorded Duration T SE2 4K/F S sec [4] [5]SE3 Recorded Duration T SE3 4K/F S sec [4] [5]SE4 Recorded Duration T SE4 4K/F S sec [4] [5]Erase TimeT E 10MRN/F S sec MRN=message row #[4]Global Erase Wait Time T GE1 20K/F S sec [4] [5]Global Erase Time T GE2 34/F S secRESET PulseT Reset 1 μsec All Fs [4]Settle TimeT Set1 128/F S msec [4]Settle Time after Reset T Set2 64/F S msec [4]LED Error TimeT LErr 27.5K/F S msec [4] [5]LED Cycle frequencyT Cyc 1 4 Hz Pending upon F SNotes:[1]Typical values: V CC = 4.5 V, F S = 8 kHz and @ T A = 25°C, unless otherwise stated.[2]Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage ranges. [3]Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges. [4]Vcc=2.4 V~5.5V [5]K = 1024ISD1700 SERIES10 TYPICAL APPLICATION CIRCUITSThe following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each designhas to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc.The below notes apply to the following applications examples:*These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.Please refer to the applications notes or consult Winbond for layout advice.** It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible.Example #1: Recording using microphone input via push-button controls- 16 -ISD1700 SERIES Example #2: Recording using AnaIn input via push-button controlsPublication Release Date: January 23, 2007- 17 - Revision 1.3-S2ISD1700 SERIES Example #3: Connecting the SPI Interface to a microcontroller10.1 G OOD A UDIO D ESIGN P RACTICESTo ensure the highest quality of voice reproduction, it is important to follow good audio designpractices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites.Design Considerations for ISD1700 FamilyAN-CC1002 Design Considerations for ISD1700 Family.pdfGood Audio Design Practices/products/isd_products/chipcorder/applicationinfo/apin11.pdfSingle-Chip Board Layout Diagrams/products/isd_products/chipcorder/applicationinfo/apin12.pdf- 18 -ISD1700 SERIESPublication Release Date: January 23, 2007 - 19 - Revision 1.3-S211 PACKAGING11.1 28-L EAD 8X 13.4MM P LASTIC T HIN S MALL O UTLINE P ACKAGE (TSOP) T YPE 1 - IQCbISD1700 SERIES- 20 -11.2 28-L EAD 300-M IL P LASTIC S MALL O UTLINE I NTEGRATED C IRCUIT (SOIC)28272625242322212019181716151234567891011121314ADEF BGCHPlastic Small Outline Integrated Circuit (SOIC) DimensionsISD1700 SERIESPublication Release Date: January 23, 2007 - 21 - Revision 1.3-S211.3 28-L EAD 600-M IL P LASTIC D UAL I NLINE P ACKAGE (PDIP)Plastic Dual Inline Package (PDIP) (P) DimensionsINCHES MILLIMETERSMin Nom Max Min Nom MaxA 1.445 1.450 1.455 36.70 36.83 36.96 B1 0.150 3.81 B2 0.065 0.070 0.075 1.65 1.78 1.91 C1 0.600 0.625 15.24 15.88 C2 0.530 0.540 0.550 13.46 13.72 13.97 D 0.19 4.83 D1 0.015 0.38 E 0.125 0.135 3.18 3.43 F 0.015 0.018 0.022 0.38 0.46 0.56 G 0.055 0.060 0.065 1.40 1.52 1.65 H 0.100 2.54 J 0.008 0.010 0.012 0.20 0.25 0.30 S 0.070 0.075 0.080 1.78 1.91 2.03 0 0° 15° 0° 15°11.4 D IE I NFORMATIONFor die info, please contact the local Winbond Sales Representatives.ISD1700 SERIES- 22 -12 ORDERING INFORMATIONProduct Number Descriptor KeyWhen ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond Sales Representatives for any questions and the availability.For the latest product information, please contact the Winbond Sales/Rep or access Winbond’s worldwide web site at I17xxx x x x x xxProduct Series: 17 = 1700Duration: 30 : 20 – 60 secs 40 : 26 – 80 secs 50 : 33 – 100 secs 60 : 40 – 120 secs 90 : 60 – 180 secs 120 : 80 – 240 secs150 : 100 – 300 secs180 : 120 – 360 secs210 : 140 – 420 secs240 : 160 – 480 secsPackage Type : X = DieE = Thin Small Outline Package (TSOP) S = Small Outline Integrated Circuit(SOIC) Package P = Plastic Dual Inline Package (PDIP)Temperature :I = Industrial (-40°C to +85°C)Blank= Commercial• Die (0°C to +50°C) • Package (0°C to +70°C)Special Features Field : Blank = None 01 = vAlert Tape & Reel: Blank = None R = Tape & ReelLead-Free : Y = Lead-FreeProduct Name: I = ISDISD1700 SERIES13 VERSION HISTORYVERSION DATE DESCRIPTION1.3-S Sep 2006 Initial version1.3-S1 Nov 2006 Revise Pinout Configuration & Pin Description sections1.3-S2 Jan 2007 Revise Rosc resistor valueRevise Selectable Message Duration sectionUpdate standby current, sampling frequency & duration parametersPublication Release Date: January 23, 2007- 23 - Revision 1.3-S2ISD1700 SERIES- 24 -Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipmentintended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support orsustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication andreserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property.The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of thisdocuments, even if Winbond has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration onlyand Winbond makes no representation or warranty that such applications shall be suitable for the use specified.The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporatesSuperFlash ®.This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD ® ChipCorder ® product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice.Copyright © 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder®and ISD ® are trademarks of Winbond Electronics Corporation. SuperFlash ®is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners.。

ISD-18101820语音录放贴片组件

ISD-18101820语音录放贴片组件

ISD-1810/1820语音录放贴片组件ISD 系列语音录放组件，是应用目前技术最先进的美国ISD 公司单片语音处理大规模集成电路ISD 系列为核心，内含64K/128K EEPROM 存储器、消除噪声的话筒前置放大器和自动增益调节AGC 电路、适合语音的专用滤波电路、具有极高温度稳定性能的时钟振荡电路及全部语音处理电路。

它具有全贴片微型化、使用方便、语音任意录抹放、断电语音保存、微功耗、直推喇叭、音质与磁带效果相当等特点。

这种电路还提了多种应用方式选择和接口，并可方便地应用到各种集成化电子语音系统中。

ISD 系列语音录放组件可用于各种一段式语音留言装置、语音报警及语音提示装置中，能够在电源断开的情况下，长期保存信息，又可以随意更改录入的内容，整个体积小巧，厚度仅为9毫米，使用领域十分广泛，也极为方便。

一、特点◎单片语音录放电路，内含 EEPROM 存储器，永久性存储信息，可录放音十万次，存储可保留一百年◎易于使用，无需编程及开发系统，可随意改变录放内容上图为实例对比图，详见实物 ◎单电源5V 供电，具有自动节电功能◎直接普通驻极体话筒录音，直接8-16W 喇叭放音。

◎采用简易的手动控制方式，可选循环放音方式◎体积小巧，厚度仅为9毫米。

可以录音8-16秒.市面所见的产品中ISD1810和ISD1820是指同一个产品.只是商家操作才有了2个名字.二 、 引脚描述◆电源(VCC) 芯片内部的模拟和数字电路使用的不同电源总线在此引脚汇合，这样使得噪声最小。

去耦电容应尽量靠近芯片。

◆地线(VSSA, VSSD) 芯片内部的模拟和数字电路的不同地线汇合在这个引脚。

◆录音 (REC) 高电平有效。

只要REC 变高(不管芯片处在节电状态还是正在放音)，芯片即开始录音。

录音期间，REC 必须保持为高。

REC 变低或内存录满后，录音周期结束，芯片自动写入一个信息结束标志(EOM)，使以后的重放操作可以及时停止。

断路器参数im ir isd io 含义

断路器参数im ir isd io 含义

In是过负荷脱扣器的额定电流，Ir是长延时过负荷脱扣器整定电流，（热脱口）Isd是短延时过负荷脱扣器的整定电流。

（磁脱扣）Im是短延时（热磁）脱扣器整定电流。

之宇文皓月创作Ii 是短路瞬动呵护电流。

（电子式断路器中才有，其余参数热磁式断路器也有）Ui 额定绝缘电压Uimp 额定冲击耐压In是电子脱扣器的额定电流，Io是电子脱扣器的整定电流，Ir 是电子脱扣器的过载整定电流，Isd是短延时过负荷脱扣器的整定电流。

Im是瞬时（热磁）脱扣器整定电流。

国标《低压开关设备和控制设备低压断路器》GBl4048.2—94 (等效采取IEC947—2)对断路器的额定电流的概念有如下解释：断路器的额定电流1n，是指脱扣器能长期通过的电流，也就是脱扣器额定电流。

对带可调式脱扣器的断路器则为脱扣器可长期通过的最大电流。

断路器壳架等级额定电流lnm，用基本几何尺寸相同和结构相似的框架或塑料外壳中所装的最大脱扣器额定电流暗示。

脱扣器额定电流1n，指脱扣器能长期通过的最大电流。

长延时过载脱扣器动作电流整定值Ir，固定式脱扣器其1r=In，可调式脱扣器其Ir为脱扣器额定电流1n的倍数，如1r=0.4～1×1n。

（参考断路器选择）短延时电磁脱扣器动作电流整定值Im，为过载脱扣器动作电流整定值Ir的倍数，倍数固定或可调，如Im=2～10×Ir。

对不成调式可在其中选择一适当的整定值。

瞬时电磁脱扣器动作电流额定值Im′，为脱扣器额定电流In 的倍数，倍数固定或可调，如Im′=1.5～11×In。

对不成调式可在其中选择一适当的整定值。

额定极限短路分断能力Icu是断路器规定的试验电压及其它规定条件下的极限短路分断电流之值，它可以用预期短路电流暗示。

额定运行短路分断能力Ics是指断路器在规定的试验电压及其它规定条件下的一种比额定极限短路分断电流小的分断电流值，Ics是Icu的一个百分数。

额定短时耐受电流Icw是指断路器在规定的试验条件下短时间承受的电流值。

富士施乐S2010_S1810维修手册_1-3章

富士施乐S2010_S1810维修手册_1-3章


· 文章开头出现的符号的意义如下。
危险
表示紧急危险情况，操作员如果无视警告，错误地操作机器，将会导致死亡或严重受伤。 警告
表示潜在危险情况，操作员如果无视警告，错误地操作机器，将会导致死亡或严重受伤。 注意
表示潜在危险情况， 操作员如果无视警告， 错误地操作机器， 将会受伤或损坏设备。
指示：若未严格按照指示步骤操作，可能会损坏机器及装置。
9. 有机溶剂 在适用感光鼓清洁剂、 机器清洁剂等有机溶剂时， 应注意以下各事项。 · 应充分注意室内的通风换气， 以免大量吸入。 · 不要在加热的状态下使用。 · 不要靠近火源。 · 使用后应将手清洗干净。
10. 防震处理 [FX] 客户若需要防震措施， 本公司备有防震组件 (ZB38)。
11. 机器的改造使用 改造机器时， 应事先提出改造使用许可申请。
实施维护作业时，应注意以下事项，避免执行错误及不必要的作业。
4. 安全装置 预防机器事故的安全装置 ( 保险丝、 断路器、 联锁开关 ) 及客户操作上的安全装置 ( 控 制面板、 盖子类 )， 都应该确保其安全功能令人满意。 另外， 禁止有损机器安全功能的 改造。
5. 零件的安装、 拆卸 零件、 盖子的边缘部分较锐利。 注意不要触摸到， 若手指、 手上附有油污时， 应擦拭后 再进行作业。 此外， 拉出零件、 电缆等时， 请勿强行拉出， 应慢慢地拉出。
61规格62工具维修消耗品消耗品修改63维修数据64维修模式电气配线数据本章记载本产品的配线连接器列表位置线路网以及bsd相关产品资料未发行安装拆卸本章记载本产品及本产品专用选装品的安装拆卸步骤
DocuCentre S2010/S1810
维修手册 Ver.1.0
DocuCentre S2010/S1810