STD15N06L中文资料
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STD15N06LN -CHANNEL ENHANCEMENT MODELOW THRESHOLD POWER MOS TRANSISTORs TYPICAL R DS(on)=0.075Ωs AVALANCHE RUGGED TECHNOLOGY s 100%AVALANCHE TESTEDs REPETITIVE AVALANCHE DATA AT 100o C s LOW GATE CHARGEs HIGH CURRENT CAPABILITYs 175o C OPERATING TEMPERATURE sAPPLICATION ORIENTED CHARACTERIZATIONsTHROUGH-HOLE IPAK (TO-251)POWER PACKAGE IN TUBE (SUFFIX ”-1”)sSURFACE-MOUNTING DPAK (TO-252)POWER PACKAGE IN TAPE &REEL (SUFFIX ”T4”)APPLICATIONS s HIGH CURRENT,HIGH SPEED SWITCHING s SOLENOID AND RELAY DRIVERS s REGULATORS s DC-DC &DC-AC CONVERTERS s MOTOR CONTROL,AUDIO AMPLIFIERS s AUTOMOTIVE ENVIRONMENT (INJECTION,ABS,AIR-BAG,LAMPDRIVERS,Etc.)INTERNAL SCHEMATIC DIAGRAMTYPE V DSS R DS(on)I D STD15N06L60V<0.1Ω15AFebruary 1995ABSOLUTE MAXIMUM RATINGSSymbol ParameterValue Unit V D S Drain-source Voltage (V GS =0)60V V DG R Drain-gate Voltage (R GS =20k Ω)60V V GS Gate-source Voltage±15V I D Drain Current (continuous)at T c =25o C 15A I D Drain Current (continuous)at T c =100o C 10A I D M (•)Drain Current (pulsed)60A P tot Total Dissipation at T c =25o C 50W Derating Factor 0.33W/o CT stg Storage Temperature-65to 175o C T jMax.Operating Junction Temperature175oC(•)Pulse width limited by safe operating area132IPAK TO-251(Suffix ”-1”)13DPAK TO-252(Suffix ”T4”)1/10THERMAL DATAR thj-cas e R thj-amb R t hc-sin kT l Thermal Resistance Junction-case MaxThermal Resistance Junction-ambient MaxThermal Resistance Case-sink TypMaximum Lead Temperature For Soldering Purpose31001.5275o C/Wo C/Wo C/Wo CAVALANCHE CHARACTERISTICSSymbol Parameter Max Value UnitI A R Avalanche Current,Repetitive or Not-Repetitive(pulse width limited by T j max,δ <1%)15AE AS Single Pulse Avalanche Energy(starting T j=25o C,I D=I AR,V D D=25V)50mJE AR Repetitive Avalanche Energy(pulse width limited by T j max,δ <1%)12mJI A R Avalanche Current,Repetitive or Not-Repetitive(T c=100o C,pulse width limited by T j max,δ <1%)10AELECTRICAL CHARACTERISTICS(T case=25o C unless otherwise specified)OFFSymbol Parameter Test Conditions Min.Typ.Max.Unit V(BR)DSS Drain-sourceBreakdown VoltageI D=250µA V G S=060VI DS S Zero Gate VoltageDrain Current(V GS=0)V DS=Max RatingV DS=Max Rating x0.8T c=125o C2501000µAµAI G SS Gate-body LeakageCurrent(V D S=0)V GS=±15V±100nA ON(∗)Symbol Parameter Test Conditions Min.Typ.Max.Unit V G S(th)Gate Threshold Voltage V DS=V GS I D=250µA1 1.7 2.5VR DS(on)Static Drain-source OnResistance V GS=5V I D=7.5AV GS=5V I D=7.5A T c=100o C0.0750.10.2ΩΩI D(on)On State Drain Current V DS>I D(on)x R D S(on)maxV GS=10V15A DYNAMICSymbol Parameter Test Conditions Min.Typ.Max.Unitg fs(∗)ForwardTransconductanceV DS>I D(on)x R D S(on)max I D=7.5A35SC iss C oss C rss Input CapacitanceOutput CapacitanceReverse TransferCapacitanceV DS=25V f=1MHz V G S=070023080950310110pFpFpFSTD15N06L 2/10ELECTRICAL CHARACTERISTICS(continued)SWITCHING ONSymbol Parameter Test Conditions Min.Typ.Max.Unitt d(on) t r Turn-on TimeRise TimeV DD=30V I D=7.5AR G=4.7ΩV GS=5V(see test circuit figure)1516060200nsns(di/dt)on Turn-on Current Slope V DD=40V I D=15AR G=47 ΩV GS=5V(see test circuit figure)70A/µsQ g Q gs Q gd Total Gate ChargeGate-Source ChargeGate-Drain ChargeV DD=40V I D=15A V GS=5V188930nCnCnCSWITCHING OFFSymbol Parameter Test Conditions Min.Typ.Max.Unitt r(Vof f) t ft c Off-voltage Rise TimeFall TimeCross-over TimeV DD=48V I D=15AR GS=47ΩV GS=10V(see test circuit figure)5210017080140240nsnsnsSOURCE DRAIN DIODESymbol Parameter Test Conditions Min.Typ.Max.UnitI S D I SDM(•)Source-drain CurrentSource-drain Current(pulsed)1560AAV S D(∗)Forward On Voltage I SD=15A V G S=0 1.5Vt rr Q rr I RRM Reverse RecoveryTimeReverse RecoveryChargeReverse RecoveryCurrentI SD=15A di/dt=100A/µsV DD=25V T j=150o C600.145nsµCA(∗)Pulsed:Pulse duration=300µs,duty cycle1.5%(•)Pulse width limited by safe operating areaSafe Operating Area Thermal ImpedanceSTD15N06L3/10Derating CurveTransfer CharacteristicsStatic Drain-source On Resistance Output Characteristics TransconductanceGate Charge vs Gate-source VoltageSTD15N06L 4/10STD15N06L Capacitance Variations Normalized Gate Threshold Voltage vsTemperatureNormalized On Resistance vs Temperature Turn-on Current SlopeCross-over TimeTurn-off Drain-source Voltage Slope5/10STD15N06LSwitching Safe Operating Area Accidental Overload AreaSource-drain Diode Forward CharacteristicsFig.1:Unclamped Inductive Load Test Circuits Fig.2:Unclamped Inductive Waveforms 6/10Fig.4:Gate Charge Test CircuitFig.5:Test Circuit For Inductive Load Switching And Diode Recovery TimesFig.3:Switching Times Test Circuits For Resistive LoadSTD15N06L7/10DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 2.2 2.40.0860.094A10.9 1.10.0350.043A30.7 1.30.0270.051B 0.640.90.0250.031B2 5.25.40.2040.212B30.850.033B50.30.012B60.950.037C 0.450.60.0170.023C20.480.60.0190.023D 6 6.20.2360.244E 6.4 6.60.2520.260G 4.4 4.60.1730.181H 15.916.30.6260.641L 99.40.3540.370L10.81.20.0310.047L20.810.0310.039DAC 2CLA 3L2L113H==B 3BB 6B 2EGA 1====B 52TO-251(IPAK)MECHANICAL DATA0068771-ESTD15N06L8/10DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 2.2 2.40.0860.094A10.9 1.10.0350.043A20.030.230.0010.009B 0.640.90.0250.035B2 5.2 5.40.2040.212C 0.450.60.0170.023C20.480.60.0190.023D 6 6.20.2360.244E 6.4 6.60.2520.260G 4.4 4.60.1730.181H 9.3510.10.3680.397L20.80.031L40.610.0230.039AC 2CHA 1A 2==DL2L413==BE==B 2G2DETAIL ”A”DETAIL ”A”TO-252(DPAK)MECHANICAL DATA0068772-BSTD15N06L9/10STD15N06LInformation furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A10/10。