PCB制程设备能力稽核讲解

PCB钻孔机中cpk的解释CPK基本知识什么是Cpk?Cpk的定义：制程能力指數；Cpk的意义：制程水准的量化反映;用一个数值来表达制程的水准;(1) 只有制程能力强的制程才可能生产出质量好、可靠性水平高的产品﹔(2)制程能力指数是一种表示制程水平高低的方便方法，其实质作用是反映制程合格率的高低。

和Cpk相关的几个重要概念1单边规格：只有规格上限和规格中心或只有下限或规格中心的规格;如考试成绩不得低于80分，或浮高不得超过0.5mm等；此時數據越接近上限或下限越好﹔双边规格：有上下限與中心值,而上下限與中心值對稱的规格；此时数据越接近中心值越好；如D854前加工脚长规格2.8±0.2mm;USL (Upper specification limit):即規格上限?LSL (Low specification limit): 即規格下限?C ：规格中心X=(X1+X2+… …+Xn)/n 平均值(n 為樣本數)T=USL-LSL 規格公差?n -1(X1-X)2+(X2-X)2+… …+(Xn -X)2δ=和Cpk 相关的几个重要概念2Ca:制程准确度; (Capability of Accuracy)Ca 在衡量“實際平均值“與“規格中心值”之一致性;对于单边规格，不存在规格中心，因此也就不存在Ca;对于双边规格，2/T CXCa什么是Ca?等級A B C DCa值|Ca|<12.5%12.5%<|Ca|<25%25%<|Ca|<50%處理原則作業員遵守作業標準操作並達到規格之要求,需繼續保持.有必要盡可能將其改進為A級作業員可能看錯規格不按作業標準操作或檢討規格及作業標準.應采取緊急措施,全面檢討所有可能影響之因素,必要時得停止生產.50%<|Ca|Ca等级评定及处理原则Cp:制程精密度(Capability of Precision)Cp 衡量的是“規格公差寬度”與“製程變異寬度”之比例;对于只有规格上限和规格中心的规格：对于只有规格下限和规格中心的规格：对于双边规格：6σUSL-LSLCp=3σUSL-X Cpu=3σX Cpl=LSL什么是Cp?Cp等级评定及处理原则等級Cp值處理原則A+≧1.67無缺點考慮降低成本A 1.33 ≦ Cp ＜ 1.67狀態良好維持現狀B 1.00 ≦ Cp ＜ 1.33 改進為 A 級C0.67 ≦ Cp ＜ 1.00制程不良較多，必須提升其能力D Cp ＜ 0.67制程能力太差，應考慮重新整改設計制程Cpk的計算公式?Cpk=Cpx(1-Ca );Cpk≦Cp;Cpk是Cp和Ck的綜合表現﹔製程能力靶心圖.............Ca 好﹐Cp 差Cp 好﹐Ca 差Cpk 好﹔.........Cpk等級評定及處理原則等級Cpk值處理原則A+≧1.67無缺點考慮降低成本A 1.33 ≦ Cpk ＜ 1.67狀態良好維持現狀B 1.00 ≦ Cpk ＜ 1.33 改進為 A 級C0.67 ≦ Cpk ＜ 1.00制程不良較多，必須提升其能力D Cpk ＜ 0.67制程能力太差，應考慮重新整改設計制程Cpk 和制程良率換算合格率%68.395.599.7399.993799.99995≒100每一百件之不良Defects per 100 parts每一百萬件之不良(Dppm)Defects per million parts0.3331.74.5Cpk 1.331.6720.6710.00630.0000570.0000002317310455002700630.570.0020.27Cpk的計算實例1某工序的規格要求為100.1mm,實際測出50個樣本值如下﹐計算出該工序的Cpk;9.9959.9819.9639.94710.01610.0149.97110.09510.03410.0049.9289.91410.01710.02110.0069.9839.9769.96810.0269.9919.97210.05410.1599.9739.98410.01610.0039.9949.9839.9769.99210.02710.01810.00510.0039.9879.99510.00110.01710.00310.02510.0219.98710.0069.9829.9729.97510.0029.9439.994Cpk的計算實例2X=10.036;σ=0.027;Ca=(x-C)/(T/2)=(10.036-10)/0.1=0.36;Cp=(10+0.1-(10-0.1))/(6*0.027)=1.239;Cpk=Cpx(1-Ca)=1.239x(1-0.36)=0.793;總結代等號雙邊規格單邊規格級准確度:A 比較制程實績平均值與規B 格中心值一致的程度﹔CD 精密度﹕A+ 比較規格公差寬度和制程A 變異寬度﹔B C D 制程能力指數﹕A+ 綜合衡量Ca 和Cp;A B C D定義計算公式等級標准Ca無Cp Cpk無50%<ca< bdsfid="187" p=""></ca<>X - C T/2Ca=Ca ≦12.5%12.5%< ≦25%Ca 25%< ≦50%Ca T 6σCp=Cpu=USL-X3σCpl=X-LSL 3σCpk=Cp(1- Ca )1.67≦Cp1.33≦Cp<1.671≦Cp<1.330.67≦Cp<1Cp<0.67Cpk<0.67 0.67≦Cpk<11≦Cpk<1.331.33≦Cpk<1.671.67≦Cpk。

CPK基本知识什么是Cpk?⏹Cpk的定义：制程能力指數；⏹Cpk的意义：制程水准的量化反映;用一个数值来表达制程的水准; (1) 只有制程能力强的制程才可能生产出质量好、可靠性水平高的产品﹔(2)制程能力指数是一种表示制程水平高低的方便方法，其实质作用是反映制程合格率的高低。

和Cpk相关的几个重要概念1单边规格：只有规格上限和规格中心或只有下限或规格中心的规格;如考试成绩不得低于80分，或浮高不得超过0.5mm等；此時數據越接近上限或下限越好﹔双边规格：有上下限與中心值,而上下限與中心值對稱的规格；此时数据越接近中心值越好；如D854前加工脚长规格2.8±0.2mm;⏹USL (Upper specification limit):即規格上限⏹LSL (Low specification limit): 即規格下限⏹C ：规格中心⏹X=(X1+X2+… …+Xn)/n 平均值(n 為樣本數)▪T=USL-LSL 規格公差⏹n -1(X1-X)2+(X2-X)2+… …+(Xn -X)2δ=和Cpk 相关的几个重要概念2•Ca:制程准确度; (Capability of Accuracy)•Ca 在衡量“實際平均值“與“規格中心值”之一致性;•对于单边规格，不存在规格中心，因此也就不存在Ca;•对于双边规格，2/T CXCa什么是Ca?等級A B C DCa值|Ca|<12.5%12.5%<|Ca|<25%25%<|Ca|<50%處理原則作業員遵守作業標準操作並達到規格之要求,需繼續保持.有必要盡可能將其改進為A級作業員可能看錯規格不按作業標準操作或檢討規格及作業標準.應采取緊急措施,全面檢討所有可能影響之因素,必要時得停止生產.50%<|Ca|Ca等级评定及处理原则•Cp:制程精密度(Capability of Precision)•Cp 衡量的是“規格公差寬度”與“製程變異寬度”之比例;对于只有规格上限和规格中心的规格：对于只有规格下限和规格中心的规格：对于双边规格：6σUSL-LSL Cp=3σUSL-X Cpu=3σX Cpl=LSL 什么是Cp?Cp等级评定及处理原则等級Cp值處理原則A+≧1.67無缺點考慮降低成本A 1.33 ≦ Cp ＜ 1.67狀態良好維持現狀B 1.00 ≦ Cp ＜ 1.33 改進為 A 級C0.67 ≦ Cp ＜ 1.00制程不良較多，必須提升其能力D Cp ＜ 0.67制程能力太差，應考慮重新整改設計制程Cpk的計算公式⏹Cpk=Cpx(1-Ca );⏹Cpk≦Cp;⏹Cpk是Cp和Ck的綜合表現﹔製程能力靶心圖.............Ca 好﹐Cp 差Cp 好﹐Ca 差Cpk 好﹔.........Cpk等級評定及處理原則等級Cpk值處理原則A+≧1.67無缺點考慮降低成本A 1.33 ≦ Cpk ＜ 1.67狀態良好維持現狀B 1.00 ≦ Cpk ＜ 1.33 改進為 A 級C0.67 ≦ Cpk ＜ 1.00制程不良較多，必須提升其能力D Cpk ＜ 0.67制程能力太差，應考慮重新整改設計制程Cpk 和制程良率換算合格率%68.395.599.7399.993799.99995≒100每一百件之不良Defects per 100 parts每一百萬件之不良(Dppm)Defects per million parts0.3331.74.5Cpk 1.331.6720.6710.00630.0000570.0000002317310455002700630.570.0020.27Cpk的計算實例1某工序的規格要求為10±0.1mm,實際測出50個樣本值如下﹐計算出該工序的Cpk;9.9959.9819.9639.94710.01610.0149.97110.09510.03410.0049.9289.91410.01710.02110.0069.9839.9769.96810.0269.9919.97210.05410.1599.9739.98410.01610.0039.9949.9839.9769.99210.02710.01810.00510.0039.9879.99510.00110.01710.00310.02510.0219.98710.0069.9829.9729.97510.0029.9439.994Cpk的計算實例2⏹X=10.036;⏹ σ=0.027;⏹Ca=(x-C)/(T/2)=(10.036-10)/0.1=0.36;⏹Cp=(10+0.1-(10-0.1))/(6*0.027)=1.239;⏹Cpk=Cpx(1-Ca)=1.239x(1-0.36)=0.793;總結代等號雙邊規格單邊規格級准確度:A 比較制程實績平均值與規B 格中心值一致的程度﹔CD 精密度﹕A+ 比較規格公差寬度和制程A 變異寬度﹔B C D 制程能力指數﹕A+ 綜合衡量Ca 和Cp;A B C D定義計算公式等級標准Ca無Cp Cpk無50%<CaX - C T/2Ca=Ca ≦12.5%12.5%< ≦25%Ca 25%< ≦50%Ca T 6σCp=Cpu=USL-X3σCpl=X-LSL 3σCpk=Cp(1- Ca )1.67≦Cp1.33≦Cp<1.671≦Cp<1.330.67≦Cp<1Cp<0.67Cpk<0.670.67≦Cpk<11≦Cpk<1.331.33≦Cpk<1.671.67≦Cpk。

pcb检验流程和检验规范英文回答：PCB（Printed Circuit Board）inspection is an essential step in the manufacturing process to ensure the quality and reliability of the final product. The inspection process involves various stages and follows specific standards and guidelines. Let me explain the PCB inspection process and the associated inspection standards.Firstly, before the actual inspection, it is crucial to prepare the necessary equipment and tools. This includes a magnifying glass, a microscope, a digital camera, and a testing device. These tools are used to examine the PCB for any defects or abnormalities.Next, the visual inspection is conducted to identify any visible defects such as soldering issues, component misalignment, or physical damage. The inspector carefully examines each component, solder joint, and trace on the PCBto ensure they meet the required specifications. Any defects found during this stage are documented and further analyzed.After the visual inspection, the electrical testing is performed to verify the functionality of the PCB. This involves applying electrical signals and checking the response of the circuit. Various tests, such as continuity testing, insulation resistance testing, and functional testing, are conducted to ensure the PCB operates as intended.In addition to the visual and electrical inspection, there may be additional tests conducted depending on the specific requirements of the PCB. These tests may include thermal cycling, vibration testing, or environmentaltesting to assess the durability and reliability of the PCB under different conditions.Throughout the inspection process, it is important to follow specific standards and guidelines to ensure consistency and accuracy. The most commonly used standardfor PCB inspection is IPC-A-610, which provides criteriafor acceptability of electronic assemblies. This standard defines various classes of defects and provides guidelines for their acceptability based on the intended use and reliability requirements of the PCB.中文回答：PCB（Printed Circuit Board）检验是制造过程中的一个关键步骤，旨在确保最终产品的质量和可靠性。