SUNLORDINC顺络电子NTC热敏电阻选型资料

【Version change history】Rev. Effective Date Changed Contents Change reasons Approved By01 / New release / Hai GuoCautionAll products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications.1.Aircraft equipment2.Aerospace equipment3.Undersea equipment4.nuclear control equipmentitary equipment6.Power plant equipment7.Medical equipment8.Transportation equipment (automobiles, trains, ships,etc.)9.Traffic signal equipment10.Disaster prevention / crime prevention equipment11.Data-processing equipment12. The application with a long term direct-current voltage difference, which is greater than 1.5V, between D+ and D- of differential lines13. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above1. ScopeThis specification applies to SDMM Series of multi-layer common mode filter. 2.Product Description and Identification (Part Number) 1) DescriptionSDMM Series of multi-layer common mode filter. 2)Product Identification (Part Number) SDMM 0806 U -2 -□□□T ① ② ③ ④ ⑤ ⑥3. Electrical CharacteristicsPlease refer to Appendix A . 1) Operating and storage temperature range (individual chip without packing): -40 ~ +85℃℃ 2) Storage temperature range (packaging conditions): -10~+40 and RH 70% (Max.)℃℃Appendix A: Electrical CharacteristicsPart NumberCommon modeImpedance @ 100MHz(Ω)DC Resistance (Ω) Max.Rated Current (mA) Max.Insulation Resistance (M Ω) Min.Cutoff Frequency(typ.) (GHz) SDMM0806U-2-120T 12±5 2.5 130 100 ＞8 SDMM0806U-2-350T 35±20% 3.5 100 100 ＞6SDMM0806U-2-470T 47±20% 4.0 100 100 6 SDMM0806U-2-900T 90±20% 4.51001003.5Note: Absolute maximum long term direct-current voltage between D+ and D- of differential lines: DC 1.5VPacking ⑥TTape Carrier Package① TypeSDMMmultilayer commonmode filter② External Dimensions (L x W) (mm)08060.85×0.65Number of Lines ④-2 2 linesCommon Mode Impedance ⑤ (Ω)Example Nominal Value350 35③Feature TypeUFor Ultra high speedDifferential SignalLinesTypical Electrical CharacteristicsSDMM0806U-2-120T SDMM0806U-2-350TImpedance vs. Frequency(SDMM0806U-2-120T) Impedance vs. Frequency(SDMM0806U-2-350T)Insertion loss vs. Frequency (SDMM0806U-2-120T) Insertion loss vs. Frequency (SDMM0806U-2-350T)Insertion loss vs. Frequency (SDMM0806U-2-120T) Insertion loss vs. Frequency (SDMM0806U-2-350T)SDMM0806U-2-470T SDMM0806U-2-900TImpedance vs. Frequency (SDMM0806U-2-470T) Impedance vs. Frequency (SDMM0806U-2-900T)Insertion loss vs. Frequency (SDMM0806U-2-470T) Insertion loss vs. Frequency (SDMM0806U-2-900T)Insertion loss vs. Frequency (SDMM0806U-2-470T) Insertion loss vs. Frequency (SDMM0806U-2-900T)4. Shape and Dimensions1) Dimensions: See Fig.4-1 and Table 4-1. 2) Equivalent circuit: See Fig. 4-2.3)Recommended PCB pattern for reflow soldering: See Fig. 4-3.4) Structure: See Fig. 4-4 and Fig. 4-5.Material Information: See Table 4-2.[Table 4-2]Code Part NameMaterial Name ① Ceramic Body Ceramic Powder ② Ferrite Body Ferrite Powder ③ Inner Coils(Ag) Silver Paste ④ Pull-out Electrode (Ag) Silver PasteTypeL W T SL SW P 0806 0.85±0.05 0.65±0.05 0.40±0.05 0.20+0.05/-0.10 0.27±0.05 0.50±0.05[Table 4-1] Unit: mmSW（3） （1） （4）（2）（3） （1） （2）（4）For 0806Fig. 4-2Fig. 4-3Fig.4-1①③④⑤Fig. 4-4②①AgStructure of Electro-platingBodyNiSn⑤-1 ⑤-2Fig. 4-55.Test and Measurement Procedures 5.1 Test ConditionsUnless otherwise specified, the standard atmospheric conditions for measurement/test as:a. Ambient Temperature: 20±15℃b. Relative Humidity: 65±20%c.Air Pressure: 86 kPa to 106 kPaIf any doubt on the results, measurements/tests should be made within the following limits:a. Ambient Temperature: 20±2℃b. Relative Humidity: 65±5%c. Air Pressure: 86kPa to 106 kPa 5.2 Visual Examination a. Inspection Equipment: 20× magnifier5.3 Electrical TestItems Requirements Test Methods and Remarks5.3.1 Impedance (Common Mode)Refer to Appendix ATest equipment: High Accuracy RF LCR Meter Agilent4287A/E4991A or equivalent.Common Mode Impedance is tested according to the following circuit.5.3.2 Impedance (Differential Mode)Refer to Appendix ATest equipment: High Accuracy RF LCR Meter Agilent4287A/E4991A or equivalent. Differential Mode Impedance is tested according to the following circuit.5.3.3DC ResistanceRefer to Appendix ATest equipment: High Accuracy Milliohm meter Agilent4338B/34420 or equivalent. DC Resistance is tested according to the following circuit.5.3.4Rated CurrentRefer to Appendix ATest equipment: Electric Power, Electric current meter, Thermometer.Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rise just20 against chip initial surface temperature.℃ Rated Current is tested according to the following circuit.5.3.5 Insulation ResistanceRefer to Appendix ATest equipment: High resistance meter Agilent4339B. Withstand Voltage:2.5 times rated voltage Application time:1~5 SecondsThe charging and discharging current::Less than 1mAInsulation Resistance is tested according to the following circuit.5.3.6Insertion LossRefer to Appendix ATest equipment: S-parameter Network Analyzer AgilentE5071C or equivalent. Insertion Loss is S21mag tested according to the following circuit.5.4.10 Loading under damp heat① No visible mechanical damage. ② Impedance change: within ±20%. ③ Insulation Resistance: 100M Ω Min.① Temperature: 60±2.℃ ② Humidity: 90% to 95% RH. ③ Duration: 1000+12hours.④ Applied current: Rated current.⑤ The chip shall be stabilized at normal condition for 1~2 hoursbefore measuring.5.4.11Loading at high temperature (Life test) ① No visible mechanical damage. ② Impedance change: within ±20%. ③ Insulation Resistance: 100M Ω Min.① Temperature: 85±2.℃ ② Duration: 1000+12hours.③ Applied current: Rated current.④The chip shall be stabilized at normal condition for 1~2 hours before measuring.6. Packaging and Storage6.1 PackagingTape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig.6.1-1~4 b.Tape carrier packaging quantity please see the following table:Type 0806 Tape Paper Tape Quantity10Kc. Reel shall be packaged in vinyl bag.d. Maximum of 5 or 10 reels bags shall be packaged in an inner box.e.Maximum of 6 or 10 inner boxes shall be packaged in an outer case.(1)Remark: The sprocket holes are to the right as the tape is pulled toward the user.(2) Taping Dimensions (Unit: mm)Type A B P Tmax 08060.80±0.051.0±0.052.0±0.050.55Chip CavityTSunlord Business categories ：Level 0（general confidential ） Specifications for Multi-layer Common Mode Filter Page 11 of 11(3) Reel Dimensions (Unit: mm)6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40 or less and 70% RH or less.℃b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H 2S).c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight.d.Solderability specified in Clause 5.4.6shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3 .For those parts, which passed more than 6 months shall be checked solder-ability before use.7. Recommended Soldering Technologies7.1 Re-flowing Profile:△ Preheat condition: 150 ~200/60~120℃sec. △ Allowed time above 217: 60~90s ℃ec. △ Max temp: 260℃△ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max7.2 Iron Soldering Profile.△ Iron soldering power: Max.30W. △ Pre-heating: 150 / 60 sec. ℃ △ Soldering Tip temperature: 350Max.℃ △ Soldering time: 3 sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu. △ Max.1 times for iron soldering. [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]CFig.6.1.34.3±0.2mm4.0±0.1mm5.0±0.1mm3.0±0.1mmmax ＜14.4mm[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.]26015020021725℃ Tc ℃350℃。

NTC热敏电阻及温度传感器正确选型正确选型NTC热敏电阻/温度传感器需要考虑以下方面：一、首先明确产品应用功能：1. 温度测量2. 温度补偿3. 浪涌电流抑制点击了解更多：温度测量、控制用NTC热敏电阻器/温度传感器――工作原理和应用电路温度补偿NTC热敏电阻器/温度传感器――工作原理和应用电路浪涌电流抑制NTC热敏电阻器/温度传感器――工作原理和应用电路二．按产品应用场合分类：1. 汽车：VT系列——汽车温度传感器用热敏电阻DTV系列——汽车温度传感器用NTC热敏芯片VTS系列——交通工具温度传感器/温度开关2. 医疗：MT系列——医疗设备温度传感器用NTC热敏电阻DTM系列——医疗温度传感器用NTC热敏芯片IT系列——电子温度计NTC温度传感器3. 家电：TS系列——NTC温度传感器BT系列——绝缘引线型NTC温度传感器4. 通讯：CT系列——片式负温度系数热敏电阻AT系列——非绝缘引线插件 NTC热敏电阻5. 计算机及办公自动化设备：OT系列——办公自动化NTC热敏电阻/温度传感器GT系列——玻璃封装NTC热敏电阻FT系列——薄膜NTC热敏电阻6. 消费类电子：PT系列——功率型（浪涌抑制）NTC热敏电阻AT系列——非绝缘引线插件 NTC热敏电阻BT系列——绝缘引线型NTC温度传感器7. 集成电路/模块：DT系列——高精度芯片NTC热敏电阻三．明确产品工作温度范围――对应选择相应材料和封装形式：（一）热敏头封装形式：1. 环氧树脂封装：耐潮湿、绝缘强度高、工作温度－40℃～＋125℃2. 硅树脂封装：绝缘强度高、工作温度－40℃～＋200℃，耐潮湿性能一般。

3. 玻璃封装封装：耐潮湿、绝缘强度高、耐高温、工作温度－40℃～＋350℃。

（二）引线类型：1.金属裸线：因无外绝缘皮，所以工作温度取决于封装物质的承受温度。

2.PVC电子线：工作温度－40℃～＋（90-110）℃。

3.铁氟龙电子线：工作温度－40℃～＋220℃。

热敏电阻选型注意事项-概述说明以及解释1.引言1.1 概述热敏电阻是一种温度感知器件，其电阻值会随着环境温度的变化而发生相应的变化。

热敏电阻主要由绝缘材料和导电材料组成，当受到热能刺激时，导电材料的电阻发生变化，从而通过测量电阻值的变化来判断环境温度的高低。

在实际的应用中，选择合适的热敏电阻成为了一个关键的问题。

首先，我们需要了解所需测量的温度范围，不同类型的热敏电阻适用于不同的温度范围。

通常，热敏电阻被分为正温度系数（PTC）和负温度系数（NTC）两种类型，前者在温度升高时，电阻值增加，而后者在温度升高时，电阻值减小。

其次，我们需要考虑热敏电阻的精度和响应时间。

精度是指热敏电阻测量温度值与实际温度值之间的偏差，一般以百分比或者温度单位来表示。

响应时间则是指热敏电阻从受到温度变化刺激到电阻发生变化所需的时间，对于一些需要实时性的应用来说，响应时间是非常重要的。

此外，还应考虑热敏电阻的尺寸和包装形式。

尺寸的选择要考虑到实际的安装环境和需要测量的对象，包装形式的选择则需要根据实际应用的要求来确定。

综上所述，选择适合的热敏电阻应该考虑到温度范围、精度、响应时间、尺寸和包装形式等方面的因素。

只有在充分了解这些注意事项的基础上，我们才能选择到最合适的热敏电阻，以满足实际应用的需求。

1.2 文章结构文章结构部分的内容可以参考以下写法：在本文中，将按照以下结构进行讨论。

首先，在引言部分，我们将概述热敏电阻的基本概念和作用。

接下来，我们将介绍文章的整体结构和每个部分的内容。

然后，在正文部分，我们将着重介绍热敏电阻选型的三个主要要点。

这些要点包括（可根据实际写作内容进行具体介绍）。

最后，在结论部分，我们将总结这些要点，并给出相关的结论和建议。

通过这样的结构，读者将能够清晰地了解本文的内容和组织方式。

同时，文章的结构也有助于读者更好地理解每个部分的论述，并能够更好地掌握热敏电阻选型的相关注意事项。

接下来，让我们深入探讨每个部分的具体内容。

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SDNT0603X223H3900FTF22±3%3900±1%0.22<3sec SDNT0603X223H3900HTF22±3%3900±3%0.22<3sec SDNT0603X223J3380FTF22±5%3380±1%0.22<3sec SDNT0603X223J3380HTF22±5%3380±3%0.22<3sec SDNT0603X223J3900FTF22±5%3900±1%0.22<3sec SDNT0603X223J3900HTF22±5%3900±3%0.22<3sec SDNT0603X223K3380FTF22±10%3380±1%0.22<3sec SDNT0603X223K3380HTF22±10%3380±3%0.22<3sec SDNT0603X223K3900FTF22±10%3900±1%0.22<3sec SDNT0603X223K3900HTF22±10%3900±3%0.22<3sec SDNT0603X224F4250FTF220±1%4250±1%0.06<3sec SDNT0603X224H4250FTF220±3%4250±1%0.06<3sec SDNT0603X224H4250HTF220±3%4250±3%0.06<3sec SDNT0603X224J4250FTF220±5%4250±1%0.06<3sec SDNT0603X224J4250HTF220±5%4250±3%0.06<3sec SDNT0603X224K4250FTF220±10%4250±1%0.06<3sec SDNT0603X224K4250HTF220±10%4250±3%0.06<3sec SDNT0603X473F3950FTF47±1%3950±1%0.12<3sec SDNT0603X473F4100FTF47±1%4100±1%0.12<3sec SDNT0603X473H3950FTF47±3%3950±1%0.12<3sec SDNT0603X473H3950HTF47±3%3950±3%0.12<3sec SDNT0603X473H4100FTF47±3%4100±1%0.12<3sec SDNT0603X473H4100HTF47±3%4100±3%0.12<3sec SDNT0603X473J3950FTF47±5%3950±1%0.12<3sec SDNT0603X473J3950HTF47±5%3950±3%0.12<3sec SDNT0603X473J4100FTF47±5%4100±1%0.12<3secSDNT0603X473K3950HTF47±10%3950±3%0.12<3sec SDNT0603X473K4100FTF47±10%4100±1%0.12<3sec SDNT0603X473K4100HTF47±10%4100±3%0.12<3sec SDNT0603X683F4150FTF68±1%4150±1%0.11<3sec SDNT0603X683F4250FTF68±1%4250±1%0.11<3sec SDNT0603X683H4150FTF68±3%4150±1%0.11<3sec SDNT0603X683H4150HTF68±3%4150±3%0.11<3sec SDNT0603X683H4250FTF68±3%4250±1%0.11<3sec SDNT0603X683H4250HTF68±3%4250±3%0.11<3sec SDNT0603X683J4150FTF68±5%4150±1%0.11<3sec SDNT0603X683J4150HTF68±5%4150±3%0.11<3sec SDNT0603X683J4250FTF68±5%4250±1%0.11<3sec SDNT0603X683J4250HTF68±5%4250±3%0.11<3sec SDNT0603X683K4150FTF68±10%4150±1%0.11<3sec SDNT0603X683K4150HTF68±10%4150±3%0.11<3sec SDNT0603X683K4250FTF68±10%4250±1%0.11<3sec SDNT0603X683K4250HTF68±10%4250±3%0.11<3sec SDNT1005X102F3450FTF1±1%3450±1%1<3sec SDNT1005X102H3450FTF1±3%3450±1%1<3sec SDNT1005X102H3450HTF1±3%3450±3%1<3sec SDNT1005X102J3450FTF1±5%3450±1%1<3sec SDNT1005X102J3450HTF1±5%3450±3%1<3sec SDNT1005X102K3450FTF1±10%3450±1%1<3sec SDNT1005X102K3450HTF1±10%3450±3%1<3sec SDNT1005X103F3380FTF10±1%3380±1%0.31<3sec SDNT1005X103F3950FTF10±1%3950±1%0.33<3sec SDNT1005X103F4050FTF10±1%4050±1%0.33<3sec SDNT1005X103H3380FTF10±3%3380±1%0.31<3sec SDNT1005X103H3380HTF10±3%3380±3%0.31<3sec SDNT1005X103H3950FTF10±3%3950±1%0.33<3sec SDNT1005X103H3950HTF10±3%3950±3%0.33<3sec SDNT1005X103H4050FTF10±3%4050±1%0.33<3sec SDNT1005X103H4050HTF10±3%4050±3%0.33<3sec SDNT1005X103J3380FTF10±5%3380±1%0.31<3sec SDNT1005X103J3380HTF10±5%3380±3%0.31<3sec SDNT1005X103J3950FTF10±5%3950±1%0.33<3sec SDNT1005X103J3950HTF10±5%3950±3%0.33<3sec SDNT1005X103J4050FTF10±5%4050±1%0.33<3sec SDNT1005X103J4050HTF10±5%4050±3%0.33<3sec SDNT1005X103K3380FTF10±10%3380±1%0.31<3sec SDNT1005X103K3380HTF10±10%3380±3%0.31<3sec SDNT1005X103K3950FTF10±10%3950±1%0.33<3sec SDNT1005X103K3950HTF10±10%3950±3%0.33<3sec SDNT1005X103K4050FTF10±10%4050±1%0.33<3sec SDNT1005X103K4050HTF10±10%4050±3%0.33<3sec SDNT1005X104F4150FTF100±1%4150±1%0.1<3sec SDNT1005X104F4250FTF100±1%4250±1%0.1<3sec SDNT1005X104F4360FTF100±1%4360±1%0.1<3sec SDNT1005X104H4150FTF100±3%4150±1%0.1<3sec SDNT1005X104H4150HTF100±3%4150±3%0.1<3sec SDNT1005X104H4250FTF100±3%4250±1%0.1<3sec SDNT1005X104H4250HTF100±3%4250±3%0.1<3secSDNT1005X104J4150FTF100±5%4150±1%0.1<3sec SDNT1005X104J4150HTF100±5%4150±3%0.1<3sec SDNT1005X104J4250FTF100±5%4250±1%0.1<3sec SDNT1005X104J4250HTF100±5%4250±3%0.1<3sec SDNT1005X104J4360FTF100±5%4360±1%0.1<3sec SDNT1005X104J4360HTF100±5%4360±3%0.1<3sec SDNT1005X104K4150FTF100±10%4150±1%0.1<3sec SDNT1005X104K4150HTF100±10%4150±3%0.1<3sec SDNT1005X104K4250FTF100±10%4250±1%0.1<3sec SDNT1005X104K4250HTF100±10%4250±3%0.1<3sec SDNT1005X104K4360FTF100±10%4360±1%0.1<3sec SDNT1005X104K4360HTF100±10%4360±3%0.1<3sec SDNT1005X153F3450FTF15±1%3450±1%0.25<3sec SDNT1005X153H3450FTF15±3%3450±1%0.25<3sec SDNT1005X153H3450HTF15±3%3450±3%0.25<3sec SDNT1005X153J3450FTF15±5%3450±1%0.25<3sec SDNT1005X153J3450HTF15±5%3450±3%0.25<3sec SDNT1005X153K3450FTF15±10%3450±1%0.25<3sec SDNT1005X153K3450HTF15±10%3450±3%0.25<3sec SDNT1005X154F4150FTF150±1%4150±1%0.08<3sec SDNT1005X154H4150FTF150±3%4150±1%0.08<3sec SDNT1005X154H4150HTF150±3%4150±3%0.08<3sec SDNT1005X154J4150FTF150±5%4150±1%0.08<3sec SDNT1005X154J4150HTF150±5%4150±3%0.08<3sec SDNT1005X154K4150FTF150±10%4150±1%0.08<3sec SDNT1005X154K4150HTF150±10%4150±3%0.08<3sec SDNT1005X222F3450FTF 2.2±1%3450±1%0.67<3sec SDNT1005X222F3950FTF 2.2±1%3950±1%0.67<3sec SDNT1005X222H3450FTF 2.2±3%3450±1%0.67<3sec SDNT1005X222H3450HTF 2.2±3%3450±3%0.67<3sec SDNT1005X222H3950FTF 2.2±3%3950±1%0.67<3sec SDNT1005X222H3950HTF 2.2±3%3950±3%0.67<3sec SDNT1005X222J3450FTF 2.2±5%3450±1%0.67<3sec SDNT1005X222J3450HTF 2.2±5%3450±3%0.67<3sec SDNT1005X222J3950FTF 2.2±5%3950±1%0.67<3sec SDNT1005X222J3950HTF 2.2±5%3950±3%0.67<3sec SDNT1005X222K3450FTF 2.2±10%3450±1%0.67<3sec SDNT1005X222K3450HTF 2.2±10%3450±3%0.67<3sec SDNT1005X222K3950FTF 2.2±10%3950±1%0.67<3sec SDNT1005X222K3950HTF 2.2±10%3950±3%0.67<3sec SDNT1005X223F3950FTF22±1%3950±1%0.23<3sec SDNT1005X223H3950FTF22±3%3950±1%0.23<3sec SDNT1005X223H3950HTF22±3%3950±3%0.23<3sec SDNT1005X223J3950FTF22±5%3950±1%0.23<3sec SDNT1005X223J3950HTF22±5%3950±3%0.23<3sec SDNT1005X223K3950FTF22±10%3950±1%0.23<3sec SDNT1005X223K3950HTF22±10%3950±3%0.23<3sec SDNT1005X224F4250FTF220±1%4250±1%0.06<3sec SDNT1005X224H4250FTF220±3%4250±1%0.06<3sec SDNT1005X224H4250HTF220±3%4250±3%0.06<3sec SDNT1005X224J4250FTF220±5%4250±1%0.06<3sec SDNT1005X224J4250HTF220±5%4250±3%0.06<3secSDNT1005X332F3450FTF 3.3±1%3450±1%0.55<3sec SDNT1005X332F3950FTF 3.3±1%3950±1%0.55<3sec SDNT1005X332H3450FTF 3.3±3%3450±1%0.55<3sec SDNT1005X332H3450HTF 3.3±3%3450±3%0.55<3sec SDNT1005X332H3950FTF 3.3±3%3950±1%0.55<3sec SDNT1005X332H3950HTF 3.3±3%3950±3%0.55<3sec SDNT1005X332J3450FTF 3.3±5%3450±1%0.55<3sec SDNT1005X332J3450HTF 3.3±5%3450±3%0.55<3sec SDNT1005X332J3950FTF 3.3±5%3950±1%0.55<3sec SDNT1005X332J3950HTF 3.3±5%3950±3%0.55<3sec SDNT1005X332K3450FTF 3.3±10%3450±1%0.55<3sec SDNT1005X332K3450HTF 3.3±10%3450±3%0.55<3sec SDNT1005X332K3950FTF 3.3±10%3950±1%0.55<3sec SDNT1005X332K3950HTF 3.3±10%3950±3%0.55<3sec SDNT1005X333F3950FTF33±1%3950±1%0.15<3sec SDNT1005X333H3950FTF33±3%3950±1%0.15<3sec SDNT1005X333H3950HTF33±3%3950±3%0.15<3sec SDNT1005X333J3950FTF33±5%3950±1%0.15<3sec SDNT1005X333J3950HTF33±5%3950±3%0.15<3sec SDNT1005X333K3950FTF33±10%3950±1%0.15<3sec SDNT1005X333K3950HTF33±10%3950±3%0.15<3sec SDNT1005X334F3950FTF330±1%3950±1%0.05<3sec SDNT1005X334F4300FTF330±1%4300±1%0.05<3sec SDNT1005X334H3950FTF330±3%3950±1%0.05<3sec SDNT1005X334H3950HTF330±3%3950±3%0.05<3sec SDNT1005X334H4300FTF330±3%4300±1%0.05<3sec SDNT1005X334H4300HTF330±3%4300±3%0.05<3sec SDNT1005X334J3950FTF330±5%3950±1%0.05<3sec SDNT1005X334J3950HTF330±5%3950±3%0.05<3sec SDNT1005X334J4300FTF330±5%4300±1%0.05<3sec SDNT1005X334J4300HTF330±5%4300±3%0.05<3sec SDNT1005X334K3950FTF330±10%3950±1%0.05<3sec SDNT1005X334K3950HTF330±10%3950±3%0.05<3sec SDNT1005X334K4300FTF330±10%4300±1%0.05<3sec SDNT1005X334K4300HTF330±10%4300±3%0.05<3sec SDNT1005X472F3500FTF 4.7±1%3500±1%0.46<3sec SDNT1005X472F3950FTF 4.7±1%3950±1%0.46<3sec SDNT1005X472H3500FTF 4.7±3%3500±1%0.46<3sec SDNT1005X472H3500HTF 4.7±3%3500±3%0.46<3secdissipationFacto ratedElecPowe size_code thickness 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 11000.6×0.30.3 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NTC热敏电阻原理及应用NTC热敏电阻是指具有负温度系数的热敏电阻。

是使用单一高纯度材料、具有接近理论密度结构的高性能陶瓷。

因此，在实现小型化的同时，还具有电阻值、温度特性波动小、对各种温度变化响应快的特点，可进行高灵敏度、高精度的检测。

本公司提供各种形状、特性的小型、高可靠性产品，可满足广大客户的应用需求。

NTC负温度系数热敏电阻工作原理NTC是Negative Temperature Coefficient 的缩写,意思是负的温度系数,泛指负温度系数很大的半导体材料或元器件，所谓NTC热敏电阻器就是负温度系数热敏电阻器。

它是以锰、钴、镍和铜等金属氧化物为主要材料，采用陶瓷工艺制造而成的。

这些金属氧化物材料都具有半导体性质，因为在导电方式上完全类似锗、硅等半导体材料。

温度低时，这些氧化物材料的载流子（电子和孔穴）数目少，所以其电阻值较高；随着温度的升高，载流子数目增加，所以电阻值降低。

NTC热敏电阻器在室温下的变化范围在10O~1000000欧姆，温度系数-2%~-6.5%。

NTC热敏电阻器可广泛应用于温度测量、温度补偿、抑制浪涌电流等场合。

NTC负温度系数热敏电阻专业术语1，零功率电阻值 RT（Ω）RT指在规定温度 T 时，采用引起电阻值变化相对于总的测量误差来说可以忽略不计的测量功率测得的电阻值。

2，电阻值和温度变化的关系式为：RT = RN expB(1/T – 1/TN)RT ：在温度 T （ K ）时的 NTC 热敏电阻阻值。

RN ：在额定温度 TN （ K ）时的 NTC 热敏电阻阻值。

T ：规定温度（ K ）。

B ： NTC 热敏电阻的材料常数，又叫热敏指数。

exp ：以自然数 e 为底的指数（ e = 2.71828 …）。

该关系式是经验公式，只在额定温度 TN 或额定电阻阻值 RN 的有限范围内才具有一定的精确度，因为材料常数 B 本身也是温度 T 的函数。

3，额定零功率电阻值 R25 （Ω）根据国标规定，额定零功率电阻值是 NTC 热敏电阻在基准温度25 ℃时测得的电阻值 R25，这个电阻值就是 NTC 热敏电阻的标称电阻值。