戴尔Latitude 5285产品白皮书

并且能够灵活地远程工作。

使用 100% 回收和可再生包装18， 包括更加环保的多件包装。

Intelligent Privac y 功能： 提醒您注意 旁观者，保护屏幕上显示的您不看屏幕时，系统会感知到，并调暗屏幕以保护隐私和节省电增强的音频效果改善音频质量，优化协作体验。

触控板升级，改善了触感以提高生产力。

ExpressConnect 智能双网连接支持同时利用 2 个或更多网络连接，该同时多网络连接技术可加快数据和视频下载速度。

主流商用笔记本的大部分安全选项14 配备的选项包括接触式/非接触式智能卡、TPM 、Control Vault 3、指纹读取器、 楔形钥匙锁插槽、摄像头隐私挡板、Windows Hello/红外摄像头和 Intelligent Privacy 。

更多可扩展性能选项 全新英 13 代 U 和 系列处理器。

提供各种内存 LPDDR5 (13”)、可，以及独立。

ExpressSign-in 智慧感知登录功能可在您靠近时唤醒您的系统，并在您离开时将其锁定。

适合每一类用户的显示屏入门级屏幕和摄像头升级为全高清，并且可选选项。

13电池续航时间的面板，能够尽可能提高生产力，还可以让您体验Glass 屏幕。

卓越的多功能性13” 可作为笔记本电脑或二合一笔记本。

出色的运行时间，并可以利用ExpressCharge 快速充电更快完成充电提供多种电池选项，电池容量最高 54 瓦时，以及下一代可延长电池续航时间的面板。

Intelligent Audio 智能音频，采用神经降噪功能借助基于 AI 的背景噪声消除功能，自信地开展协作。

拥有出众可持续性的 Latitude 系列Latitude 5000 中使用的可回收塑料和可再生 塑料增加了 64%（按重量）14，生物基/ PCR 含量扩展到 B/C/D 护盖、扬声器外壳、掌托和内框架。

所有尺寸全部支持 Wi-Fi 6E 17 和 5G 网络。

在桌面办公或出差时保持联网。

2011年4月白皮书为DELL PRECISION工作站选择适当的CPU配置Mitch Markow，Core Technologies的总监在针对您的业务需求优化Dell Precision™工作站时，选择适当的处理器是一个重要注意事项。

虽然内存容量和图形卡硬盘对于特定工作负载会更重要，但处理器性能经常会决定工作完成得有多快。

通过与行业领先公司合作，戴尔为塔式、机架式和移动工作站提供多种中央处理器(CPU)配置选择。

许多Dell Precision工作站型号使用用于高性能服务器中的同样的英特尔®至强®处理器，以便提供超过台式机级别系统的更高的可靠性与性能。

选择CPU平台时的考虑事项选择CPU时，大家通常会想到的第一个问题是性能与成本。

技术考虑事项包括1个插槽(1S)还是2个插槽(2S)、核心数量、处理器频率和内存通道数量。

虽然这些确实是重要的考虑事项，但却不能脱离业务环境来回答这些问题。

选择处理器时，首先有必要确定对于您的业务而言什么是重要的，因为处理器要求取决于您尝试做的事情。

了解您的应用程序和工作负载模式对于处理器性能的依赖程度，是选择适当的处理器的重要前提条件。

台式机系统(DT)中的1个插槽与 2个插槽与1个插槽相比，2个插槽的主要益处在于核心数量以及可用于一个或多个并发应用程序的内存容量/带宽。

2S设计能够通过英特尔设计中名为QuickPath互连的一致总线来添加第二个处理器。

此总线的速度（通常以GT/秒为单位）非常重要，因为它是确定互联的带宽、处理器与相关内存之间的延迟（在NUMA[非统一内存访问]配置的系统中非常关键）的重要因素。

确保您的应用程序可以通过更多核心或更高的内存带宽和内存量来进行扩展，因为2S设计有成本和功耗方面的劣势。

核心数量、SMT和应用程序线程您需要的核心数量取决于两个重要因素：1. 您的工作负载/代码的平行程度有多高（同样，了解您的工作负载至关重要）2. 您希望同时运行多少项任务一般来讲，如果您的工作负载高度平行，可通过英特尔的超线程技术(HTT)来使用物理和逻辑核心很好地扩展性能。

Dell PowerEdge T30擁有者手冊管制型號： D13M Series管制類型： D13M002註、警示與警告註: 「註」表示可以幫助您更有效地使用產品的重要資訊。

警示: 「警示」表示有可能會損壞硬體或導致資料遺失，並告訴您如何避免發生此類問題。

警告: 「警告」表示有可能會導致財產損失、人身傷害甚至死亡。

版權所有© 2016 Dell Inc. 或其子公司。

版權所有，翻印必究。

Dell、EMC 與其他商標均為 Dell Inc. 或其子公司的商標。

其他商標為其各自所有者的商標。

2016 - 11修正版 A00目錄1 Dell PowerEdge T30 系統概觀 (7)Dell PowerEdge T30 系統支援的組態 (7)支援的作業系統 (7)前面板 (8)PowerEdge T30 系統的前背面板功能 (8)背面板 (10)PowerEdge T30 系統的背面板功能 (10)診斷指示燈 (11)前面板上的診斷指示燈。

(11)NIC 指示燈代碼 (11)開啟 LED 指示燈代碼 (12)電源供應器的電源指示燈代碼 (13)2 說明文件資源 (15)3 技術規格 (16)機箱尺寸 (16)機箱重量 (17)處理器規格 (17)PSU 規格 (17)系統電池規格 (17)擴充匯流排規格 (17)記憶體規格 (17)磁碟機規格 (18)硬碟機 (18)光碟機 (18)連接埠和連接器規格 (18)USB 連接埠 (18)NIC 連接埠 (19)視訊規格 (19)環境規格 (19)粒子和氣體污染規格 (20)4 初始系統設定與組態 (21)設定您的系統 (21)安裝作業系統的選項 (21)下載韌體和驅動程式的方法 (21)5 系統設定 (22)Boot Sequence (22)導覽鍵 (23)3更新 BIOS (29)BIOS recovery (30)使用 USB 金鑰進行 BIOS 復原 (30)可信賴平台模組規格 (30)升級可信賴平台模組至版本 2.0 (30)降級可信賴平台模組至版本 1.2 (31)設定 TPM Bitlocker 金鑰 (32)系統與設定密碼 (33)指定系統密碼與設定密碼 (33)刪除或變更現有的系統及／或設定密碼 (34)停用系統密碼 (34)Intel 主動管理技術 (35)6 安裝和卸下系統元件 (36)安全說明 (36)拆裝系統內部元件之前 (36)拆裝系統內部元件之後 (36)建議的工具 (37)系統機箱蓋 (37)卸下系統機箱蓋 (37)安裝系統機箱蓋 (38)前蓋 (39)卸下前蓋 (39)安裝前蓋 (40)系統內部 (41)電源開關 (42)卸下電源開關 (42)安裝電源開關 (43)機箱侵入切換開關 (44)卸下機箱侵入切換開關 (44)安裝機箱侵入切換開關 (45)輸入/輸出 (I/O) 面板 (46)卸下 I/O 面板 (46)安裝 I/O 面板 (47)硬碟機 (48)卸下硬碟固定框架 (49)安裝硬碟固定框架 (49)從硬碟固定框架卸下 3.5 吋硬碟承載器 (50)將 3.5 吋硬碟承載器安裝在硬碟固定框架中 (51)從光碟機凹槽卸下 2.5 吋硬碟 (52)將 2.5 吋硬碟安裝在光碟機凹槽 (54)從硬碟凹槽中卸下 3.5 吋硬碟承載器 (56)將 3.5 吋硬碟承載器安裝在硬碟凹槽 (56)從硬碟承載器卸下硬碟 (57)將硬碟安裝至硬碟承載器 (58)4卸下光碟機 (59)安裝光碟機 (61)卸下光碟機填充 (62)安裝光碟機擋板 (63)系統記憶體 (65)一般記憶體模組安裝指引 (66)記憶體組態範例 (66)卸下一個記憶體模組 (67)安裝記憶體模組 (68)系統風扇 (69)卸下系統風扇 (69)安裝系統風扇 (70)擴充卡 (71)擴充卡安裝指引 (71)卸下擴充卡 (71)安裝擴充卡 (72)處理器和散熱器 (73)卸下散熱器 (73)卸下處理器 (74)安裝處理器 (75)安裝散熱器 (76)電源供應器 (77)卸下電源供應器 (78)安裝電源供應器 (78)系統電池 (79)裝回系統電池 (79)主機板 (80)卸下主機板 (80)安裝主機板 (82)使用 Intel 主動式管理技術輸入系統服務標籤 (83)使用系統設定輸入系統服務標籤 (83)7 使用系統診斷 (84)Dell 嵌入式系統診斷 (84)從 Boot Manager 執行嵌入式系統診斷 (84)系統診斷程式控制 (84)8 跳線與連接器 (85)主機板連接器 (85)主機板跳線設定 (87)停用忘記的密碼 (87)9 故障排除您的系統 (88)人身及系統安全至上 (88)最小 POST (88)5故障排除系統啟動故障 (88)故障排除外部連線 (88)故障排除影像子系統 (88)故障排除 USB 裝置 (89)故障排除序列 I/O 裝置 (89)故障排除 NIC (90)故障排除受潮的系統 (90)故障排除受損的系統 (91)故障排除系統電池 (91)故障排除電源供應器 (92)故障排除電源問題 (92)電源供應器問題 (92)電源供應器內建自我測試按鈕 (93)故障排除散熱風扇 (93)故障排除系統記憶體 (94)故障排除光碟機 (95)故障排除硬碟 (95)故障排除擴充卡 (96)故障排除處理器 (96)10 取得說明 (98)與 Dell 公司聯絡 (98)說明文件意見反應 (98)使用 QRL 存取系統資訊 (98)快速資源定位器 (99)找出系統服務標籤 (99)61 Dell PowerEdge T30 系統概觀Dell PowerEdge T30 是直立式系統，最多支援 :•一個 Intel Xeon E3-1200 v5 處理器或 Intel Core i3 系列處理器或 Intel Pentium 處理器•四個 3.5 吋 SATA 硬碟和其他兩個 2.5 吋 SATA 硬碟 (使用擴充套件以及控制卡)•四個 DIMM 插槽支援高達 64 GB 的記憶體•三個全高 PCIe 第 3 代插槽和一個全高 PCI 插槽•一個 AC 纜線式電源供應器 (PSU)Dell PowerEdge T30 系統支援的組態Dell PowerEdge T30 系統支援下列組態。

Dell EMC PowerEdge R250技术指南2021 12注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。

:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。

:“警告”表示可能会导致财产损失、人身伤害甚至死亡。

© 2021 Dell Inc. 或其子公司。

保留所有权利。

Dell、EMC 和其他商标是 Dell Inc. 或其附属机构的商标。

其他商标可能是其各自所有者的商标。

章 1: 系统概览 (5)新技术 (5)关键工作负载 (6)章 2: 系统功能和代际比较 (7)章 3: 机箱视图和功能部件 (9)机箱视图 (9)系统的前视图 (9)系统的后视图 (10)系统内部 (11)快速资源定位器 (13)章 4: 处理器 (14)处理器特性 (14)支持的处理器 (14)章 5: 内存子系统 (15)支持的内存 (15)内存速度 (15)章 6: 存储 (16)存储控制器 (16)存储控制器功能值表 (16)内部存储配置 (17)服务器存储控制器用户指南 (17)IDSDM (17)内置 USB (19)RAID - 独立磁盘冗余阵列 (19)数据表和 PERC 性能扩展平台 (19)Boot Optimized Storage Solution (20)支持的驱动器 (20)硬盘 (HDD) (21)固态硬盘 (SSD) (23)外部存储器 (25)章 7: 扩展卡和扩展卡转接卡 (26)扩展卡安装原则 (26)章 8: 功率、散热和声音 (28)功率 (28)散热 (29)声音 (29)声音性能 (29)目录3章 9: 机架、导轨和线缆管理 (31)机架导轨 (31)章 10: 支持的操作系统 (34)章 11: Dell EMC OpenManage 系统管理 (35)服务器和机箱管理器 (35)Dell EMC 控制台 (36)自动化启用程序 (36)集成第三方控制台 (36)连接第三方控制台的接口 (36)Dell EMC 更新公用程序 (36)戴尔资源 (36)章 12: Dell Technologies 服务 (38)Dell EMC ProDeploy Enterprise Suite (38)Dell EMC ProDeploy Plus (39)Dell EMC ProDeploy (39)基本部署 (39)Dell EMC 服务器配置服务 (39)Dell EMC 派驻服务 (39)Dell EMC 远程咨询服务 (39)Dell EMC 数据迁移服务 (39)Dell EMC ProSupport Enterprise Suite (39)面向企业的 Dell EMC ProSupport Plus (40)面向企业的 Dell EMC ProSupport (40)Dell EMC ProSupport One for Data Center (41)ProSupport for HPC (41)支持技术 (42)Dell Technologies Education Services (43)Dell Technologies 咨询服务 (43)Dell EMC 托管服务 (43)章 13: 附录 A：附加规格 (44)机箱尺寸 (44)机箱重量 (45)视频规格 (45)NIC 端口规格 (45)USB 端口 (46)内置 USB (46)电源装置 (46)环境规格 (47)微粒和气体污染规格 (48)散热限制 (48)章 14: 附录 B.标准遵从性 (50)章 15: 附录 C 其他资源 (51)4目录1系统概览Dell EMC™ PowerEdge™ R250 是戴尔最新的 1U 机架式服务器，旨在使用可高度扩展的内存运行复杂的工作负载。

UNIVERSAL APPLICA TION AND BENEFITS OF AIR CONT AINMENT: A PRACTICAL GUIDEA Dell™ Technical White PaperDavid L. MossDell|Data Center InfrastructureTHIS WHITE PAPER IS FOR INFORMATIONAL PURPOSES ONLY, AND MAY CONTAIN TYPOGRAPHICAL ERRORS AND TECHNICAL INACCURACIES. THE CONTENT IS PROVIDED AS IS, WITHOUT EXPRESS OR IMPLIED WARRANTIES OF ANY KIND.© 2009 Dell Inc. All rights reserved. Reproduction of this material in any manner whatsoever without the express written permission of Dell Inc. is strictly forbidden. For more information, contact Dell.Dell and the DELL logo are trademarks of Dell Inc. Liebert is a trademark of Liebert Corporation. APC is a registered trademark of American Power Conversion.Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade names other than its own.Table of ContentsIntroduction (2)Nomenclature (3)Greenfield vs. Brownfield (4)Supply vs. Return (4)Materials and Flexibility (5)Tightly Coupled vs. Loosely Coupled Containment (5)More on Rack Level Containment (6)Non Hot/Cold Aisle Facilities (8)Summary (8)To operate more efficiently and at higher densities with the ability to predictably deploy IT hardware with less thermal risk, implement containment. Embrace containment aggressively; the approach to containment is a bit like the approach to virtualization. If you experiment with it lightly, you might only see minor benefits like rack density increases. Like virtualization, it takes a strong commitment. You need to contain most, if not all, of the data center in order to tap into large efficiency benefits. Both Liebert™ and APC® have good papers 1,2•An increase in coil capacity accompanying the higher return temperatures associated with containment on containment. Although they do show some bias for their own solutions, they agree on major benefits such as:•Near or absolute 100% sensible operation (no energy lost to condensation and humidification) • The opportunity to raise temperatures and save energy in the chilling processIn addition to these benefits, it should also be mentioned that the elimination of hot spots would result in theimmediate lowering of IT equipment fan power in the affected areas. For a more detailed example of containment-related energy savings, please refer to The Energy Advantages of Containment Systems 3The goal of this paper is not to come to an absolute conclusion as to which solution is the best. What is ideal for one facility will not be ideal for another. However, this paper will point out some of the key considerations to explore in determining the best solution for your facility. The following points are addressed in this paper:Dell whitepaper.•Greenfield vs. Brownfield? •Supply (intake) vs. return (exhaust) containment •Materials and flexibility •Rack level vs. row level containment •Closely coupled vs. loosely coupled1 Focused Cooling Using Cold Aisle Containment, Emerson Network Power, 2009; /common/ViewDocument.aspx?id=12952 Hot Aisle vs. Cold Aisle Containment, John Neimann, 2008; /salestools/DBOY-7EDLE8_R0_EN.pdf3 The Energy Advantages of Containment Systems; David Moss; 2009; /us/en/corp/d/business~solutions~whitepapers~en/Documents~dci-energy-advantages-of-containment-systems.pdf.aspxFor the purposes of this paper, we will attempt to categorize and name different types of containment. StationaryAisle containment like the APC Hot Aisle Containment (HAC) or Liebert Cold Aisle Containment (CAC) is a hard-paneled structure assembled in place that contains integral attachment points to the IT racks. These solutionscontain multiple racks. APC’s solution is designed specifically around their InRow coils,and it contains the hot aisle. Liebert’s solution contains the cold aisle and can bedesigned to contain raised-floor venting and Liebert XD systems. In each solution,hard-paneled construction includes doors and a ceiling structure. This type ofcontainment is typically more stationary and requires more effort to refresh new racksor additional cooling units in comparison to other solutions that are not as integrated. Hanging PartitionsHanging partitions are often referred to as meat locker curtains. Vendorsof these products have both hard and flexible material versions. They aretypically hung from ceiling structures and lightly touch the racks (if theytouch at all). They often are intentionally hung with gaps at the ceiling toallow smoke to pass horizontally and activate fire prevention systems aswell as the fuse links used to hang the partitions themselves. Since thepartitions are not tied to the IT racks, it is generally easier to refreshindividual racks. The containment is looser than with stationary solutions. This picture in one of Dell’s data centers depicts cold aisle containment with both floor and overhead delivery. Hanging partitions can also be used effectively as hot aisle containment.Rack ChimneysRack Chimney solutions add ductwork to each rack. With the rear of the rack closed up, this rack istightly coupled to the IT systems. The chimney is typically extended to a false ceiling which is usedas a return plenum and also ducted to the CRAC units. Unless the chimney contains fans or theCRAC units pull air through the return plenum to aid the flow through the rack, the rack andchimney add pressure to the IT systems. This either slows the flow rate through the systems orcauses them to speed up to maintain proper airflow. There is some debate in the industry as towhether chimneys should be deployed with serial fan units that help the IT fans to evacuate therack.If you have the luxury of a Greenfield opportunity, your options are obviously less limited. Some containment solutions are less invasive in the installation process. Since hanging partitions are not structurally tied to the racks, they tend to be an easier solution to use in a retrofit situation. As a retrofit, a chimney may require serverdowntime, especially for servers located high in the rack. Stationary solutions require attachment to existing racks and possibly drilling holes; this might make some owners uncomfortable. Even if you prefer a more substantial containment system like a stationary HAC or CAC, you might consider the hanging partition products for the retrofit portion of the data center and use your preferred choice for all new racks. The partition products areinexpensive and might be eventually switched out with your preferred choice as IT product is refreshed. Whatever solution you choose, your goal should be to get the entire data center contained so you can reap full efficiency benefits.Supply vs. ReturnHVAC vendors often have strong opinions that favor their own products, and suggest sharp contrasting density limitations specifically for cold aisle containment. However, both Cold Aisle Containment (CAC) and Hot AisleContainment (HAC) can be set up for high density. Hot aisle may offer more flexibility to apportion more density in one area at the detriment of another. In either case, the goal is to provide an adequate compliment to the air consumption rate of the IT equipment. It is the volumetric delivery of the facility that establishes any densitylimitation that might exist for each rack. This is why hot aisle containment may offer a local advantage. With a cold aisle solution there is a finite number of vent tiles. Since the aisle containment captures the vent tiles, the number of vents cannot be increased; it is typically no more than a single vent per rack. In contrast, a hot aisle containment solution does not capture the vents. Venting outside the perimeter of the pod can actually supply the pod with additional airflow.APC makes a similar argument regarding the limitations of cold aisle delivery 4,5Consider this high-density example computed using Dell’s Energy Smart Solutions Advisor(. The APC papers go one step further; they make assumptions about typical raised floor limitations, arguing that a maximum of approximately 600 CFM on average can be delivered through a single vent. APC equates this to a limitation of 6 kW per cabinet which takes their argument past the differences between HACs and CACs, resulting in an argument between raised floor delivery and their InRow products. It can be argued that this as an artificial limitation used to support the claim of superiority of the row cooling product. Higher CRAC-to-vent ratios allow a raised floor to easily achieve higher flow rates. A data center lab at one of the Dell facilities averages twice that value (1200 CFM) per vent. The APC argument of 100 CFM per kW is a good rule of thumb for generic legacy hardware. Today’s Dell servers,however, have much more efficient thermal designs and typically operate closer to 80 CFM per kW. If you combine higher vent flow rates with the fact that newer IT consumes less than 100 CFM per kW, an argument similar in approach to that in the aforementioned APC paper can be made in support of greater than 10 kW per rack. /calc ). A 1U server with high-end processors and 32 GB of memory consumes 324 watts and uses 25.6 CFM, which amounts to just 79 CFM per kW. Assuming 80 CFM per kW and an average of 1200 CFM per vent, the raised floor would support 15 kW per vent if that flow rate is delivered effectively to the rack.Containment is one way to ensure that the 1200 CFM supplied gets consumed effectively to achieve the full 15 kW.4 Hot Aisle vs. Cold Aisle Containment, John Neimann, 2008; /salestools/DBOY-7EDLE8_R0_EN.pdf5 Cooling Strategies for Ultra-High Density Racks and Blade Servers, Neil Rasmussen, 2006; /salestools/SADE-5TNRK6_R5_EN.pdfperceived density advantage. Ultimately, the data center is limited by the total amount of flow available from all the CRAC units. If a hot aisle containment enables an incremental advantage in one area because it can take advantage of adjacent vents outside of the perimeter of the pod, it uses up more of the aggregate CRAC flow rate, and other areas will be slighted. The HAC/CAC decision is more likely based on whether or not the facility already has a return ceiling plenum. It might also just be made on the basis of human comfort, since a HAC renders the personnel space comfortable in terms of temperature, and a CAC essentially uses the entire data center as a return plenum.Materials and FlexibilityAesthetics are important to many data center owners. Some may not have considered hanging partitions for that reason. These systems are gaining in popularity quickly, and their appearance is not as terrible as some people may think. Hard plastic versions are available; they are a bit more expensive than the meat-locker type material, but they are generally perceived as more attractive. Besides their cost advantage over other containment products, some Dell customers find more flexibility with this type of product. The stationary aisle containments typically tie the racks into a pod. Any reconfiguration that entails breaking up the pod will be easier with a hanging partition solution. Hanging partitions are readily available from a variety of vendors, and you can engage Dell Energy Optimization Services for assistance as they can install these types of products for you. Hanging partitions work well as either hot or cold aisle containment. Interestingly, in talking to the vendors of these products, the majority of their deployments have been cold aisle containment. Presumably, this is due to the absence of an existing ceiling return plenum. An additional consideration when contemplating flexible curtains is that, depending upon the criticality of the data center, the data center’s insurance company may have reservations about the flexible material. Even if a fire marshal has signed off on the product, the insurance company may be more conservative and oppose the flexible curtain material.Tightly Coupled vs. Loosely Coupled ContainmentThere are varying degrees of coupling between coil products and IT racks. The minimum goal behind containment is to separate supply and return paths. Above and beyond this minimum goal is an opportunity to more closely match coil flow rates to rack consumption (minimizing waste). The ability to achieve a flow match is proportional to the physical tightness of the coupling between the racks and coils.Hanging Partitions Stationary Rack LevelGreatest Air Over-Provision Least Air Over-ProvisionWith looser coupling, more air overage is required from the coils. Hanging partitions are arguably the loosest since they typically have designed gaps (for example, at the ceiling). The exhaust chimney appears to be the tightest common form of containment. Stationary containment systems range in between the two. Because aisle containment spans many racks, it is quite difficult to make it as “airtight” as a rack chimney. Gaps in the construction, under or between racks, are likely to exist. Any mismatch in flow rate between the coils and the racks will find these leaks. Stationary systems probably require more over-provision of air from the coils than a tightly coupled chimney but not as much as with hanging partitions.of external pressure added to a server, storage, or networking product elicits one of two responses―t he airflow slows and component temperatures climb, or the IT fans respond with additional fan energy to boost the flow rate back to its intended design point. What is meant by external pressure? A small amount of external pressure is added, for instance, when IT is put into a standard front-to-rear cooled rack and the front and rear perforated doors are closed. As a result, some negative pressure is applied to the front of the IT system and some positive pressure to the back of the system. Similarly, contained systems, like rack chimneys or door coils, typically impart two to three times the external pressure as a standard “flow through” rack due to their added airflow resistance. The IT system’s thermal design will determine whether or not its response to pressure is an increase in component temperature, an increase in fan power, or some compromise of the two. Newer systems will likely tend toward a fan speed increase. They have more components enabled with temperature sensors that contribute to the system’s fan response algorithms. If the system design is optimized, it will respond to even small pressure changes that would otherwise have resulted in a component temperature increase. Older IT systems have less discrete component temperature measurement capability and are typically designed more conservatively with higher thermal margins. They typically respond with less of a fan speed increase unless the pressure is large. The IT manufacturer should be able to advise you as to the impact of pressure on his or her system. Dell has historically designed with enough margin to handle the pressure added by a standard rack (two perforated doors) and a full cable management apparatus (translating arm).Therefore, even if the fans do not spin up due to pressure, minor component temperature increases do not exceed specification limits. More details of how Dell systems respond to external pressure can be found in the IT Equipment Response to External Pressure Dell whitepaper6.More on Rack Level ContainmentChimney systems are not the only form of rack containment, although they are probably the most widely used. Enclosed racks with side-car coils also could be considered contained solutions since they separate the hot from the cold. Rear door coils are another product which could technically be considered contained. Any of these systems may have impacts on the IT fan response as mentioned in the paragraphs above.Passive Chimney SystemsCare should be used when deploying passive chimney systems. A good design should impart little to no external pressure on the IT systems within the racks. While in some cases the air handlers may facilitate the flow through the racks and chimneys by creating a significant negative pressure in the ceiling return, a test should always be carried out to determine the presence of negative pressure in the chimneys and rack rears. If the air handlers do not improve the flow through the chimney, an increase of IT fan energy may occur. In addition, you may risk a pressure build-up at the back of the rack because the IT equipment is pushing the air up the chimney, which will cause a larger recirculation between the IT systems. This may not be a concern with larger systems such as blades where there are only a few chassis per rack. However, the 20 to 40 small gaps between 1 and 2U systems can add up. Increased recirculation could raise inlet temperatures and limit the extent to which you raise the overall data center temperature, thus limiting savings at the chiller.New Dell Rack ContainmentDell is currently working on another form of containment―a rack-level containment product that alters the normal front-to-rear flow pattern and converts it to bottom-to-rear. The strategy is scheduled for release late next year. Like other containment solutions, it enables similar energy savings opportunities. It will be a tightly coupled6 IT Equipment Response to External Pressure, Robert Curtis/David Moss, 2009to the floor and not the ceiling, it is more of a plug-and-play solution than most other containment solutions. The rack can be rolled up with no connections other than the vent underneath. Since that coupling surrounds the vent, it has the ability to affect the flow exiting the vent. Up to a certain rack density, the floor tends to dominate and actually aid the IT system’s flow rate; it may lower the IT fan energy as the IT systems try to throttle down flow rates. Above that density, the IT systems in the rack tend to dominate, extracting a greater volume than normal out of the floor. There is no specific density limit with this rack. High densities mean higher airflow which typically translates into increased IT equipment fan energy. This energy increase is in line with the increases cited for other rack solutions in IT Equipment Response to External Pressure7. A slight increase in IT fan energy may be acceptable. in order to achieve facility energy savings like those detailed in The Energy Advantages of Containment Systems8 There are further advantages to this rack level containment strategy. Due to the tight coupling with the floor, the rack has the ability to affect the pressure under the floor. In the case where multiple racks have spun up and increased their air consumption, a constantly supplied raised floor would normally see a decrease in under-floor pressure and a drop in the flow rate through other vents. Air handlers (CRAH units) can be configured to adjust their flow rates based on under-floor pressure. Rather than link airflow control with return or supply temperature (as is more common), variable speed fans in the air handlers speed up or slow down to maintain a specific pressure under the floor. This control strategy typically allows data centers to deploy new hardware with less concern about the adequacy of airflow delivery. As new racks are added, vents are installed as well. The increase in the number of vents would normally drop the pressure and the flow through all vents. The CRAH units, however, compensate to correct the pressure. As long as the CRAH unit flow rates are not at their maximum, the addition of new IT racks is accompanied by an increase in the CRAH unit flow rates.Similarly, as IT equipment dynamically drives rack flow rates up or down, a tightly coupled rack like the Dell containment rack could have a dynamic coupling to the CRAH units. This would be accomplished indirectly through their common pressure connection, the raised floor. Others companies have attempted to achieve similar results by much more complicated means (for example, a competitor introduced a dynamic service with a multitude of sensors feeding into a server to control the floor’s CRAH units).With the Dell solution, a company can have a data center set up such that whenever new racks are added, the CRAH units adjust their flow rates to compensate. Throughout the day, when the IT load changes and the rack airflow fluctuates up and down, the CRAH units also adjust up and down, supplying a near ideal match of air delivery versus rack consumption. The only task the company has is to monitor the Variable Frequency Drive (VFD) settings on the CRAH units to verify how close they are getting to 100%. At some point prior to the unit nearing 100%, another CRAH unit would have been scheduled for bulk airflow infusion into the floor. This situation is comparable to a type of “air buss” where multiple air handlers feed a common buss (the floor plenum) and multiple racks tap into and consume what they need from that buss. In addition to the energy and density advantages obtained with containment solutions, this dynamic coupling with the air handlers specific to the Dell containment rack offers a significant advantage.7 IT Equipment Response to External Pressure, Robert Curtis/David Moss, 20098 The Energy Advantages of Containment Systems; David Moss; 2009;/us/en/corp/d/business~solutions~whitepapers~en/Documents~dci-energy-advantages-of-containment-systems.pdf.aspxNon Hot/Cold Aisle FacilitiesThere are still plenty of facilities that have not converted to hot/cold aisle orientation. Aisle containment strategies rely on the fact that there is already hot/cold aisle orientation. Some of the rack level containment strategies actually do not require hot/cold aisle orientation. Chimneys, self-contained racks, the door coil, and Dell’s new rack containment would all work in a front-to-back oriented facility.SummaryRegardless of the type, containment solutions should be considered in almost any data center setting. The two major areas for reductions in cooling energy are at the chiller and air handler fans. Both of these energy reductions are aided by containment. Containment should be applied to as much of the data center as possible. With the main goal being an increase in overall data center temperature, it may be difficult to achieve without comprehensive containment. Rack densities are also improved with containment. Rack and associated costs are reduced by installing equipment in fewer racks. Finally, some tighter forms of containment, such as the new Dell rack, offer additional benefits in terms of coupling with facility airflow systems to set up a near ideal match of airflow and one that scales with IT load and IT additions..。

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2009 年 3 月P/N F271N Rev. A00关于计算机正面视图(2)关于计算机|31音量控制2环境光线传感器3设备状态指示灯4Dell EdgeTouch 控制5Latitude™ On 按钮6电源按扭/电源指示灯7DisplayPort8eSATA/USB 连接器9USB 连接器10音频（线路输出）和麦克风（线路输入）连接器11对接唤醒开关12指纹读取器4|关于计算机1冷却通风孔2无线开关后视图1网络连接器2电源指示灯3电池指示灯4安全缆线孔5交流电适配器连接器6|关于计算机快速安装|7快速安装警告：开始执行本节中的任何步骤之前，请阅读计算机附带的安全信息。

有关其它最佳方案的详情，请参阅/regulatory_compliance 。

1将交流电适配器分别连接到便携式计算机上的交流电适配器连接器和电源插座上。

2连接网络电缆（不含电缆）。

3。

4将显示器连接至 DisplayPort 或使用 VGA、DVI 或 HDMI 接口的 DisplayPort 适配器。