DELL STSM Audit check list(中英文)1.13

戴尔DELL新版BIOS中英文对照表在计算机的世界里，BIOS（Basic Input/Output System，基本输入/输出系统）扮演着至关重要的角色。

它是计算机启动时最先运行的程序，负责初始化硬件设备、检测系统配置，并为操作系统的加载做好准备。

对于戴尔（DELL）电脑用户来说，了解新版 BIOS 中的中英文对照是解决问题、优化系统设置的关键。

一、Main（主要）System Information（系统信息）System Time（系统时间）System Date（系统日期）BIOS Version（BIOS 版本）Service Tag（服务标签）Processor Information（处理器信息）Processor Type（处理器类型）Processor Speed（处理器速度）Core Count（核心数量）Memory Information（内存信息）Installed Memory（已安装内存）Memory Speed（内存速度）Storage Information（存储信息）Hard Disk Drive（硬盘驱动器）Optical Drive（光盘驱动器）二、Advanced（高级）Chipset Configuration（芯片组配置）North Bridge Configuration（北桥配置） South Bridge Configuration（南桥配置）Power Management（电源管理）ACPI Suspend Type（ACPI 挂起类型） Wake on LAN（网络唤醒）USB Configuration（USB 配置）USB Legacy Support（USB 传统支持） USB Wake Support（USB 唤醒支持）SATA Operation（SATA 操作）AHCI Mode（AHCI 模式）RAID Mode（RAID 模式）三、Security（安全）Set Supervisor Password（设置管理员密码）Password Status（密码状态）Set User Password（设置用户密码）Password on Boot（启动时密码）Secure Boot（安全启动）Secure Boot Enable/Disable（安全启动启用/禁用）四、Boot（启动）Boot Sequence（启动顺序）1st Boot Device（第一启动设备）2nd Boot Device（第二启动设备）Boot List Option（启动列表选项）Legacy（传统）UEFI五、Exit（退出）Exit Saving Changes（退出并保存更改）Discard Changes（放弃更改）Load Setup Defaults（加载设置默认值）Save Changes（保存更改）需要注意的是，不同型号的戴尔电脑 BIOS 界面和选项可能会有所差异，但上述对照表中的常见词汇和设置在大多数情况下是通用的。

Sub-tier Supplier Management Audit4Sustaining Management Assessment Criterion Supplier TH Remarks Dell Audit CommentsSelf-Assess ("0" or "1")Actual ("0" or "1")1. Quality Management Plans1.1Does the Supplier set standard requirements for their supplier through the use ofQuality Management Plans or equivalent?(NOTE: QMPs must be structured toaccount for differences and unique requirements by part, commodity type, or someother rationale which can explained by the supplier.)QMP-Rev.D11Need update1.2Does the QMP include the following specific requirements to ensure that sub-tierprocesses affecting end product quality are carried out in a controlled condition:1.2.1Expectations of sub-tier support/staffing to deliver and maintain all qualitydeliverables? (NOTE: Requirements to be set by the supplier. Recommendedto include basic staffing levels, technical competency (including knowledge ofstatistics and SPC), governance/reporting, etc)supplier must define a JQE on this111.2.2Process FMEAs performed for all critical Sub-tier manufacturing processes?FMEA of all critical parts , update PMP111.2.3Detailed plans/strategy with implementation schedule to migrate risk of any sub-processes with high RPN (Risk Priority Number) values?Improvement plan for high RPN0tbv show FMEA action translatedinto PMP1.2.4Documented work instructions that provide clear and concise direction forproduct assembly, inspection, tests and acceptance criteria?WI( include:裝配﹑檢驗﹑測試及接受標准)111.2.5Identification of critical parameters which require implementation of StatisticalProcess Controls and initiation of corrective actions when necessary? (NOTE:SPC requirements should include guidance on utilization control and monitoringtools such as control charts, Cp, Cpk, Ppk, etc.)SPC's rules﹐if any abnormal﹐How toimporve. Critical dimensions list01Bring along the critical dimensionlist developed jointly by DanWong/Seutsugu1.2.6Defined and documented methodology for setting quality related Trigger Limitsand Run Rules for initiating stop build &/or stop shipment actions?Line stop procedure (review detail)01fully comprehend the details ofdoc.1.2.7Validation that manufacturing equipment (including fixtures) can produce aproduct meeting design intent and customer requirements? (NOTE: This shouldinclude formal gage repeatability and reproducibility (GR&R) studies whereappropriate, gap assessments related to product/process technology andcapability, etc.)GR&R reports (include: fixtures)11Included in the PPAP1.2.8Preventive maintenance program for all equipment used in the manufacturing,inspection and test of products 設備的維護與保養程序及檢驗與測試儀器的校驗程序。

PCBA Quality Process AuditAdd a 'Y' to the Box if the Process Was AssessedGeneralProcess#Audit Criterion1, 23, 45, 67, 8 Environme nta l an d ES D Co ntr ol Enter 1 or 0. NA may be a valid response for shaded cells.^1.1Are there temperature & humidity sensors in the Manufacturing area to monitor temperature & humidity over time?是否整個生產區域都有設置溫度及溼度感應器,以隨時監視溫溼度之變化?1.2Are there documented upper & lower specification limits for temperature and humidity to assure Paste viscosity, ESD & MSD control?是否有文件規定溫度和濕度的上下限以保障錫膏粘度和ESD&MSD的控制?1.3Is there evidence to demonstrate that effective action was taken when the temperature/humidity was outside the defined limits?是否有証据証明當溫度或濕度超出定義的极限時采取了有效的行動?1.4If AC Ground is used as Earth Ground for ESD purposes, is it clearly understood that AC Ground must be connected to a grounding rod?對ESD控制, 如果把交流地用作大地(Earth Ground), 有關人員是否理解交流地必須与接地柱相連?1.5Is ESD Earth Ground impedance (grounding rod to earth) measured at least annually?ESD大地阻抗(接地柱到大地)是否至少每年測量一次?1.6Does the above measurement result comply with established specifications?上面的測量結果与制定的規格一致嗎?1.7Is either an ESD Conductive or Static Dissipative floor installed in the Manufacturing areas? ESD Matting also scores 0, except for 7 thru 10.制造區有否裝ESD傳導或靜電耗散地板?ESD地毯也得0分; 不影響7到10.Dell Computer Corporation Confidential Document No. COR.40.WWP.SQ.0023 Rev 3.0Note*: Due to a safety concern some personal may not be required to wear ESD Smocks and two ESD Shoe Straps / ESD Shoes?如果你覺得NA是個合适的輸入, 請看Instructions一章對NA的詳細說明.注意:出于對安全的考慮,一些人可允許不需穿靜電服和兩個靜電鞋套/靜電鞋.。

戴尔（DELL）新版BIOS中英文对照表1.System InfoDescription ------------------------------------中文对照system ------------------------------------------系统BIOS version bios ---------------------------版本service tag ------------------------------------服务编号Express service code ----------------------快速编号asset tag ---------------------------------------资产编号None of these fields can be changed.- 本页不能修改-----------------------------------------------------------------------------------------2.Processor Infoprocessor type -------------------------- cpu类型processor ID ------------------------------ CPU IDcurrent clock speed ----------------------- 当前时钟频率Minimum clock speed -----------------------最小时钟频率maximum clock speed ---------------------- 最大时钟频率processor cache size ---------------------- 缓存大小dual core present -------------------------当前双核状态None of these fields can be changed. ------------ 本页不能修改-----------------------------------------------------------------------------------------3.Memory Infomemory installed ----------------------安装内存memory available -----------------------可用内存memory speed ----------------------- 内存频率memory channel mode -------------------- 内存通道memory technology ----------------------- 内存技术-----------------------------------------------------------------------------------------4.Device InfoPrimary hard disk drive ----------------------主硬盘modular bay device -----------------------光驱模板video controller ---------------------------显卡Video bios version ---------------------------显卡BIOS版本video memory ---------------------------显存panel type -------------------------- 液晶类型native resolution ----------------------------- 分辨率audio controller -----------------------------声卡modem controller -----------------------------modemWi-Fi device --------------------------------minipci设备cellular device -------------------------------Celluar设备Blue tooth device ------------------------------蓝牙设备AC adapter device --------------------------- 电源类型-------------------------------------------------------------------------------5. Battery Infothe primary battery and the module bay --------------------------查看主电池和备用电池充电状态battery status. AC adapter status -----------------------------电源状态-------------------------------------------------------------------6.Battery HealthIndicates the primary battery and the module bay battery status.-----------------查看主电池和备用电池健康状态----------------------------------------------------------------------7. Date/TimeDisplays current date and time settings. --------------------------------------------显示当前系统日期和时间8.Boot SequenceThe computer attempts to boot from the sequence of devices specified in this list. ---- 计算机将按列表顺序来启动Diskette or USB floppy drive ---------------------------软驱Internal hard disk drive ----------------------------------硬盘usb storege device usb ---------------------------------存储设备CD/DVD/CD-RW -----------------------------------------光驱模板modular bay hard disk drive --------------------------第二块硬盘cardbus NIC -----------------------------------------------cardbus网卡D/Dock PCI slot NIC dock pci -----------------------插槽网卡onboard NIC -------------------------------------------- 主板网OFF,COM1,COM2,COM3,COM4 ------------------选择红外端口或关闭红外端口Default setting: Off ------------------------------------ 默认：关闭，推荐启用红外时选择COM2或COM4-----------------------------------------------------------------------------.9.Integrated NICOff, Enable,enable w/ PXE or enable w/RPL. ------------ 启用或关闭NICDefault setting: enable w/ PXE ------------------------------- 默认：enable w/ PXE10.Internal ModemEnables or Off the onboard internal modem. --------------启用或关闭ModemDefault setting: Enabled ---------------------------------------默认：启用------------------------------------------------------------------------11.External USB portsEnables or off the external USB ports. ---------------------启用或关闭外置usb口Default setting: Enabled --------------------------------------- 默认：启用 Parallel PortOFF,AT,PS/2,ECP ----------------------------------------------并口Default setting: ECP --------------------------------------------默认：ECP--------------------------------------------------------------------------12.Serial PortCOM1, COM2, COM3 and COM4.------------------------- 串口设置Default setting: COM1----------------------------------------- 默认是com1----------------------------------------------------------------------13.PC CardThis field lets you enable and off the PC card Slot -------------------启用或禁用pcmcia卡Default setting: Enabled--------------------------------------------------- 默认：启用，D820还可以控制139414.ALS Enabledoff -------------------------------------------------------------- ------------------关闭环境观光设备，需要通过调节亮度组合键来调节亮度。

Sub-tier Supplier Management Audit2Personnel Requirements Assessment Criterion Supplier Dell Audit CommentsSelf-Assess ("0" or "1")Actual ("0" or "1")1.GeneralSQEWorkExperience andBackgroundRequirements1.1×Does the Supplier have a documented guideline to address SQE Roles & Responsibilities covering all aspects of the SQEjob function within the company? (NOTE: This should be a detailed guideline covering all aspects of the SEQ throughout theproduct life cycle.)111.2×Does the Supplier have a documented guideline to address SQE hiring which refers/utilizes the SQE Roles &Responsibilities document?111.3×Does the hiring guideline include:1.3.1×minimum experience::in the industry, in the specific commodity field, and in the quality field?111.3.2×job related certifications::auditing, supplier management, 6 sigma, SQC/SPC, ISO, environmental, etc (NOTE: certificationrequirements/expectations may vary by specific job role/commodity)111.4×Is the SQE organization staffed appropriately to allow for both domestic and international travel as related to on-site suppliermanagement (is appropriate SQE staff able to travel internationally with minimal restriction)?112.1Does the SQE Roles and Responsibilities document define or reference specific "hard skill" requirements and overall staffcertification levels for all key skills including:2.1.1 a through understanding of Quality Systems112.1.2statistical process/quality control (SPC/SQC)112.1.3problem solving (including 5C/8D, CLCA, etc)112.1.4FMEA112.1.5DOE002.1.6× 6 sigma methods (Green Belt level), including target certification levels (i.e.: 100% certification required for SQE dept)112.1.7x 6 sigma methods (Black Belt level), including target certification levels (i.e.: 20% certification required for SQE dept)002.2Does the SQE Roles and Responsibilities document define or refer to specific "soft skill" requirements and overall staffcertification levels for all key skills including: program/project management, command skill (influencing, negotiating,interpersonal savvy) and team building (establishing/leading teams, working effectively with teams, etc)112.3Are adequate training programs in place to address any deficiencies in the above mentioned areas?112. Specific SQE Skills Requirements3. SQE AssessmentNOTE: The following questions should be addressed by having the auditor randomly select Supplier SQEs and interviewing them.Number of interviews will be determined by the auditor based on size of the Supplier SQE organization and time constraints. It isrecommended to conduct at least 3 interviews with SQEs from different commodity areas. Interviews should take approximately 30minutes and be focused only on knowledge/understanding of the skills included in the audit checklist.Page 1 of 2Sub-tier Supplier Management Audit2Personnel Requirements Assessment Criterion Supplier Dell Audit CommentsSelf-Assess ("0" or "1")Actual ("0" or "1")3.1Does the Supplier SQE staff have an adequate understanding of Quality Systems, including:Page 2 of 2。