ETP910C001(GE文件集成)
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X1Pro e用户手册文件编号:RGB-RD-UM-X1Pro e C001版本:V1.0目录声明 (3)声明/担保与赔偿 (3)安全操作概要 (3)安装安全概要 (4)第1章产品简介 (5)1.1随附配件 (5)1.2产品概述 (6)1.2.1后面板 (7)1.2.2前面板 (9)1.2.3外形尺寸图 (11)第2章产品安装 (12)2.1插入信号源 (12)2.2插入电源 (12)2.3设备上电 (12)第3章产品使用 (14)3.1使用菜单键 (14)3.2菜单结构 (15)3.3使用菜单 (16)3.3.1默认菜单 (16)3.3.2主菜单 (17)3.3.3模式菜单 (17)3.3.4高级设置菜单 (18)3.3.5语言菜单 (21)3.3.6工厂复位菜单 (21)3.4常规模式 (22)3.4.1单面面切换 (22)3.4.2输出分辨率设置 (22)3.4.2.1选择标准输出分辨率 (22)3.4.2.2自定义输出分辨率 (23)3.4.3画面选择设置 (24)3.5拼接模式 (27)3.5.1拼接模式 (27)3.5.2多机级联拼接 (34)3.5.2.1连接 (34)3.5.2.2拼接设置 (34)3.6预监模式 (36)3.7独立输出模式 (39)3.8输出亮度设置 (40)3.9LOGO设置 (41)3.10使用黑场 (43)3.11保存参数 (44)第4章订购编码 (46)4.1产品 (46)4.2选配模块 (46)4.2.1输入模块 (46)4.2.1选配输入模块 (46)4.2.2输出模块 (46)第5章技术支持 (47)5.1联系我们 (47)第6章附录 (48)6.1规格 (48)6.2术语和定义 (54)首先感谢您选购我们的产品!为了让您迅速掌握如何使用这款视频处理器,我们为您送上了详细的产品使用手册。
您可以在使用视频处理器之前阅读产品介绍以及使用方法,请仔细阅读我们所提供给您的所有信息,以便于您正确地使用我们的产品。
Table of ContentsI.Introduction (3)II.Conditions and Limitations (3)III.How to start (3)mand List (4)V.Revision History (6)Important notice:This document is provided as a guideline and must not be disclosed without consent of DediProg. However, no responsibility is assumed for errors that might appear.DediProg reserves the right to make any changes to the product and/or the specification at any time without notice. No part of this document may be copied or reproduced in any form or by any means without prior written consent of DediProg.--device arg (Work with all Basic Switches)- 1: Activate only the programmer connected to USB1- n: Activate only the programmer connected to USBnNote: If '--device' is not used, the command will be executed on allconnected programmer.--fix-device arg Fix programmer serial number with programmer sequence.- Instructions must be enclosed in double quotation marks("")Example:dwcmd --fix-device "1 SPU000001"--list-device-id arg - 0 : List all programmers’ ID from USB1 to USBn (Default)Note: The sequence is assigned by OS during USB plug-in.- 1: Prompt the device ID of programmer connected to USB1.- n: Prompt the device ID of programmer connected to USBn. Miscellaneous options:-t [ --timeout ] arg (=600) Timeout value in seconds-i [ --silent ] Suppress the display of real-time timer counting- Used when integrating with 3rd-party tools(e.g. IDE)--log arg Write operation result into a file(Default is located underC:\DediLog\dwcmd-xxxxx.log)Example:dwcmd --usb-prj d:\test.dprj --log d:\result.txtNote:Windows Command Line does not support ProgMaster series.Usage Examples:1. dwcmd -d file.dprj -rDownload project file to StarProg and run it.2. dwcmd -rRun project from the StarProg embedded SD card.3. dwcmd --usb-prj file.dprjExecute project file via USB.4. dwcmd --usb-prj file.dprj --device 1Execute Programmer 1 project file.5. dwcmd -d file.dprj --device 1Download project file to programmer 16. dwcmd -r --device 1Execute project file7. dwcmd -d file.dprj -r --device 2Download project file to StarProg and run the project file on programmer 2.8. dwcmd -d file.dprj -r --log d:\result.txtDownload project file to StarProg and save the operation result to d:\result.txt.V.Revision HistoryDate Version Changes05/11/2016 1.0 Initial releaseDediProg Technology Co., Ltd- Taiwan Headquarter TEL: 886-2-2790-7932FAX: 886-2-2790-79164F., No.7, Ln. 143, Xinming Rd., Neihu Dist., Taipei City 114, Taiwan- Shanghai Office TEL: 86-21-5160-0157 FAX: 86-21-6126-3530Room 503, Block E, No.1618, Yishan Road, Shanghai, ChinaTechnical Support:support@Sales Support:sales@Information furnished is believed to be accurate and reliable. However, DediProg assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties which may result from its use. Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.All rights reservedPrinted in Taiwan.。
ge ic200手册
GE IC200系列是一系列工业控制器,常见的手册包括
IC200CPU001/002/003/004/005/006/007/008/009/010 CPU模块用
户手册、IC200UEX001/002/003/004/005扩展模块用户手册、
IC200UEX011/012/013扩展模块用户手册等。
这些手册通常包括产
品概述、安装指南、使用说明、参数设置、故障诊断、维护保养等
内容。
在阅读GE IC200手册时,用户应首先了解所使用的具体型号和
版本,以确保参考的是正确的手册。
在阅读手册的过程中,用户需
要注意各个模块的功能特点、接线方式、参数设置方法等,以便正
确地安装、配置和使用IC200系列控制器。
此外,用户还需要关注手册中的安全注意事项和故障排除方法,以确保设备的安全运行和及时解决可能出现的问题。
在实际操作中,用户还可以根据手册中的示例和案例进行参考,以更好地掌握
IC200系列控制器的使用技巧和注意事项。
总之,阅读GE IC200手册是掌握和使用IC200系列工业控制器
的重要途径,用户应该认真阅读并全面理解手册中的内容,以确保设备的安全稳定运行。
说明除列明随产品配置的配件外,本手册包含的内容并不代表本公司的承诺,本公司保留对此手册更改的权利,且不另行通知。
对于任何因安装、使用不当而导致的直接、间接、有意或无意的损坏及隐患概不负责。
订购产品前,请向经销商详细了解产品性能是否符合您的需求。
本手册所涉及到的其他商标,其所有权为相应的产品厂家所拥有。
本手册内容受版权保护,版权所有。
未经许可,不得以机械的、电子的或其它任何方式进行复制。
温馨提示1、产品使用前,务必请仔细阅读产品说明书。
2、对未准备安装的主板,应将其保存在防静电保护袋中。
3、在从包装袋中拿主板前,应将手先置于接地金属物体上一会儿,以释放身体及手中的静电4、在使用前,宜将主板置于稳固的平面上。
5、请保持主板的干燥,散热片的开口缝槽是用于通风,避免机箱内的部件过热。
请勿将此类开口掩盖或堵塞。
6、在将主板与电源连接前,请确认电源电压值。
7、请将电源线置于不会被践踏的地方,且不要在电源线上堆置任何物件。
8、当您需连接或拔除任何设备前,须确定所有的电源线事先已被拔掉。
9、为避免人体被电击或产品被损坏,在每次对整机、板卡进行拔插或重新配置时,须先关闭交流电源或将交流电源线从电源插座中拔掉。
10、请留意手册上提到的所有注意和警告事项。
11、为避免频繁开关机对产品造成不必要的损伤,关机后,应至少等待30秒后再开机。
12、设备在使用过程中出现异常情况,请找专业人员处理。
13、请不要将本设备置于或保存在环境温度高于70℃上,否则会对设备造成伤害。
目录1.产品简介 (1)1.1概述 (1)1.2产品特点 (2)1.3产品优势 (2)1.4技术指标 (3)2.细参数说明 (4)2.1产品图片 (4)2.2 测试套板接口图片 (5)2.3 COMe外形尺寸 (6)2.4 COMe连接器接口定义 (7)1.产品简介1.1概述随着具备高性能计算能力的智能装备在诸如:工业、农业、能源、国防、医疗、交通、民生等多个领域的推广和应用,越来越多的企业将大量资源,投入到高性能计算能力的智能装备的研发和生产中。
GE要点零部件可靠性测试标准GE要点零部件可靠性测试标准1 范围。
本标准规定了房间空气调治器上要点零部件的可靠性测试标准本标准适用于所有销售给 GE的除湿机产品。
2 标准性引用文件以下文件中的条款经过本标准的引用而成为本标准的条款。
凡是注日期的引用文件,其随后所有的更正单〔不包括勘误的内容〕或校订版均不适用于本标准,可是,激励依照本标准完成协议的各方研究可否可使用这些文件的最新版本。
凡是不注日期的引用文件,其最新版本适用于本标准。
152B2233P001 Appendix M GE零部件可靠性测试方法SI209066S012 RAC fan qualification procedures GE风轮风叶可靠行认可程序SI209066S015 Room air conditioner fan motor GE风机可靠性测试标准ETP910C001-Rev6 GE产品可靠性试验要求E9C26S、 F50L008S、 F50L012S、 F50LD19 GE表面办理类标准3定义本标准采用以下定义。
3.1 GE除湿机销售给 GE客户的除湿机产品。
3.2 要点零部件指 GE除湿机上的压缩机、风轮风叶、风机、控制按键、风机电容、压缩机电容、万向轮、微动开关、感温器、湿度传感器、 PCB板〔变压器〕、继电器等对产品性能有重要影响、作用的零部件。
4风轮风叶可靠性测试在现有企业标准〔空调风机用风轮风叶技术条件〕的基础之上,增加以下测试工程。
序号测试工程实验过程描述经过标准样品数量高温测试风轮放到 60℃的高温试验箱中,放风轮没有变形、没有破坏和破3置 24 小时后。
裂。
低温测试将风轮放到 -20 ℃的低温试验箱中,风轮没有变形、没有破坏和破3放置 24 小时后。
裂。
冷热冲击实验将风轮先放到 80℃的高温试验箱中,四个循环后风轮没有变形、没3放置 4 小时,再放到 -20 ℃的低温试有破坏和破裂。
验箱,放置 4 小时,以上为一个循环。
10 CFR 50 • AERB • ASME QME-1* • ASME QSC (NCA-3800) • ASME 第 III 部分 • ASME U核级认证核级认证 • ASN • CNSC CRN-N* HAF 604 • IAEA SC-QA 780 298* • IEEE* • ISO 9001: •E 派克核电门户网站无论您是要建新的发电厂,还是要改进现有电厂,派克都会依照行业统一的质量保证计划,使不同部门的各种产品进入核电市场,提高生产率和利润率。
这些产品包括安全专项和安全相关的核级子系统和组件,以及为非管制工厂区提供的优质的“成熟”商品。
派克门户网站是我们投入数百万美元用于核能研究和发展的承诺之一,是我们承诺提获得越来越多在全球供应且通过认证的核能产品的单一途径。
供行业所要求的高效性、可靠性和成本效益的体现。
我们支持单源购买各种产品系列,通过最新的订购方式提高工厂生产率和利润率。
另外,我们在将近 50 个国家拥有 50,000 名员工,因而门户网站产品在全球都有供应。
有关订购门户网站产品的更多信息,请:拨打电话 256 885 3833(销售)、256 885 3880(技术支持)或 发送电子邮件至 ipdusnuclear@parker .com派克核电门户网站是根据派克现行的 NQA- 1 和 10CFR50 附录 B 规定的质量保证计划开发的,并且采用了行业及规范性文件中规定的最佳实3 级阀门的 ASME N 核级认证外,派克核电门户网站上提供的产品符合 10CFR 第 21 部分中对基本组件的规定,按照认可的质保计划或是商品级物项执行。
专项不会提高质量,而是验证并记录专用项目中已有的的质量。
EU PED*HAF 604*IAEA SC-QA KTA 3507NNSANQA-1Parker Hannifin Ltd.Tachbrook Park DriveTachbrook Park,Warwick, CV34 6TU英国电话:+44 (0) 1926 317 878传真:+44 (0) 1926 317 855********************欧洲、中东和非洲AE – 阿联酋,迪拜电话:+971 4 8127100********************AT – 奥地利,维也纳新城电话:+43 (0)2622 23501-0*************************AT – 东欧,维也纳新城电话:+43 (0)2622 23501 900****************************AZ – 阿塞拜疆,巴库电话:+994 50 2233 458****************************BE/LU – 比利时,尼韦尔电话:+32 (0)67 280 900*************************BY – 白俄罗斯,明斯克电话:+375 17 209 9399*************************CH – 瑞士,埃托瓦电话:+41 (0)21 821 87 00*****************************CZ – 捷克共和国,Klecany电话:+420 284 083 111*******************************DE – 德国,卡尔斯特电话:+49 (0)2131 4016 0*************************DK – 丹麦,巴勒鲁普电话:+45 43 56 04 00*************************ES – 西班牙,马德里电话:+34 902 330 001***********************FI – 芬兰,万塔河电话:+358 (0)20 753 2500parker. ****************FR – 法国,Contamine s/Arve电话:+33 (0)4 50 25 80 25************************GR – 希腊,雅典电话:+30 210 933 6450************************HU – 匈牙利,布达佩斯电话:+36 23 885 470*************************IE – 爱尔兰,都柏林电话:+353 (0)1 466 6370*************************IT – 意大利,Corsico (MI)电话:+39 02 45 19 21***********************KZ – 哈萨克斯坦,阿拉木图电话:+7 7273 561 000****************************NL – 荷兰,奥尔登扎尔电话:+31 (0)541 585 000********************NO – 挪威,阿斯克尔电话:+47 66 75 34 00************************PL – 波兰,华沙电话:+48 (0)22 573 24 00************************PT – 葡萄牙,莱萨·达·帕尔梅拉电话:351 22 999 7360**************************RO – 罗马尼亚,布加勒斯特电话:+40 21 252 1382*************************RU – 俄罗斯,莫斯科电话:+7 495 645-2156************************SE – 瑞典,Spånga电话:+46 (0)8 59 79 50 00************************SK – 斯洛伐克,班斯卡·比斯特里察电话:+421 484 162 252**************************SL – 斯洛文尼亚,新梅斯托电话:+386 7 337 6650**************************TR – 土耳其,伊斯坦布尔电话:+90 216 4997081************************UA – 乌克兰,基辅电话:+380 44 494 2731*************************UK – 英国,沃里克电话:+44 (0)1926 317 878********************ZA – 南非,坎普顿公园电话:+27 (0)11 961 0700*****************************北美地区CA – 加拿大,安大略省米尔顿电话:+1 905 693 3000US – 美国,克利夫兰电话:+1 216 896 3000亚太地区AU – 澳大利亚,城堡山电话:+61 (0)2-9634 7777CN – 中国,上海电话:+86 21 2899 5000HK – 香港电话:+852 2428 8008IN – 印度,孟买电话:+91 22 6513 7081-85JP – 日本,东京电话:+81 (0)3 6408 3901KR – 韩国,首尔电话:+82 2 559 0400MY – 马来西亚,莎阿南电话:+60 3 7849 0800NZ – 新西兰,惠灵顿电话:+64 9 574 1744SG – 新加坡电话:+65 6887 6300TH – 泰国,曼谷电话:+662 186 7000-99TW – 台湾,台北电话:+886 2 2298 8987南美AR – 阿根廷,布宜诺斯艾利斯电话:+54 3327 44 4129BR – 巴西,圣若泽杜斯坎普电话:+55 800 727 5374CL – 智利,圣地亚哥电话:+56 2 623 1216MX – 墨西哥,阿波达卡电话:+52 81 8156 6000核电门户网站手册 M&K 12/10 1M派克授权的本地经销商© 2010 派克汉尼汾公司派克全球办事处联系信息欧洲产品信息中心免费电话:00 800 27 27 5374(AT, BE, CH, CZ, DE, DK, EE, ES, FI, FR, IE,IL, IS, IT, LU, MT, NL, NO, PL, PT, RU, SE,SK, UK, ZA)– 一点的方式。
Tekelec EAGLE® 5 Integrated Signaling SystemMaintenance Manual910-5272-001 Revision BMay 2008Copyright 2008 TekelecAll Rights Reserved.Printed in U.S.A.NoticeInformation in this documentation is subject to change without notice. Unauthorized use, copying, or translation of this documentation can result in civil or criminal penalties.Any export of Tekelec products is subject to the export controls of the United States and the other countries where Tekelec has operations.No part of this documentation may be reproduced, translated, or transmitted in any form or by any means, electronic or mechanical, including photocopying or recording, for any purpose without the express written permission of an authorized representative of Tekelec.Other product names used herein are for identification purposes only, and may be trademarks of their respective companies.RoHS 5/6 - As of July 1, 2006, all products that comprise new installations shipped to European Union member countries will comply with the EU Directive 2002/95/EC "RoHS" (Restriction of Hazardous Substances). The exemption for lead-based solder described in the Annex will be exercised. RoHS 5/6 compliant components will have unique part numbers as reflected in the associated hardware and installation manuals.WEEE - All products shipped to European Union member countries comply with the EU Directive 2002/96/EC, Waste Electronic and Electrical Equipment. All components that are WEEE compliant will be appropriately marked. For more information regarding Tekelec's WEEE program, contact your sales representative.TrademarksThe Tekelec logo, EAGLE, G-Flex, G-Port, IP7, IP7 Edge, and IP7 Secure Gateway are registered trademarks of Tekelec. TekServer, A-Port, and V-FLEX are trademarks of Tekelec. All other trademarks are the property of their respective owners. PatentsThis product is covered by one or more of the following U.S. and foreign patents:U.S. Patent Numbers:5,732,213; 5,953,404; 6,115,746; 6,167,129; 6,324,183; 6,327,350; 6,456,845; 6,606,379; 6,639,981; 6,647,113; 6,662,017; 6,735,441; 6,745,041; 6,765,990; 6,795,546; 6,819,932; 6,836,477; 6,839,423; 6,885,872; 6,901,262; 6,914,973; 6,940,866; 6,944,184; 6,954,526;6,954,794; 6,959,076; 6,965,592; 6,967,956; 6,968,048; 6,970,542; 6,987,781; 6,987,849; 6,990,089; 6,990,347; 6,993,038; 7,002,988; 7,020,707; 7,031,340; 7,035,239; 7,035,387; 7,043,000; 7,043,001; 7,043,002; 7,046,667; 7,050,456; 7,050,562; 7,054,422; 7,068,773; 7,072,678; 7,075,331; 7,079,524; 7,088,728; 7,092,505; 7,108,468; 7,110,780; 7,113,581; 7,113,781; 7,117,411; 7,123,710; 7,127,057; 7,133,420; 7,136,477; 7,139,388; 7,145,875; 7,146,181; 7,155,206; 7,155,243; 7,155,505; 7,155,512; 7,181,194; 7,190,702; 7,190,772; 7,190,959; 7,197,036; 7,206,394; 7,215,748; 7,219,264; 7,222,192; 7,227,927; 7,231,024; 7,242,695; 7,254,391; 7,260,086; 7,260,207; 7,283,969; 7,286,516; 7,286,647; 7,286,839; 7,295,579; 7,299,050; 7,301,910; 7,304,957; 7,318,091; 7,319,857; 7,327,670Foreign Patent Numbers:EP1062792; EP1308054; EP1247378; EP1303994; EP1252788; EP1161819; EP1177660; EP1169829; EP1135905;EP1364520; EP1192758; EP1240772; EP1173969; CA2352246Ordering InformationTo order additional copies of this document, contact your Tekelec Sales Representative.Table of Contents Chapter 1. Introduction ..................................................................................................... 1-1Overview .................................................................................................................................... 1-1Scope and Audience ................................................................................................................... 1-2Related Publications ................................................................................................................... 1-2Documentation Availability, Packaging, and Updates ............................................................... 1-2Locate Product Documentation on the Customer Support Site .................................................. 1-3Admonishments and Conventions .............................................................................................. 1-4Customer Care Center ................................................................................................................ 1-4Problem Report (PR) ........................................................................................................... 1-5Emergency Response .......................................................................................................... 1-6Hardware Repair and Return ...................................................................................................... 1-6Maintenance Strategy ................................................................................................................. 1-9Application Self Recovery .................................................................................................. 1-9System Maintenance Software Intervention ........................................................................ 1-9Maintenance Personnel Intervention ................................................................................. 1-10System Maintenance Log ......................................................................................................... 1-10 Chapter 2. Preventive Maintenance ................................................................................. 2-1Introduction ................................................................................................................................ 2-1Maintaining the Fuse and Alarm Panel ...................................................................................... 2-21U FAP P/N 870-2804-01 ................................................................................................... 2-33U FAP ................................................................................................................................ 2-8MO Removable Cartridge Description ..................................................................................... 2-15Removable Cartridge Handling Procedures ............................................................................. 2-17Daily Procedures ....................................................................................................................... 2-18System Reports Analysis ................................................................................................... 2-19Reports Description ........................................................................................................... 2-19File Transfer for LNP and INP Measurements ................................................................. 2-20Weekly Procedures ................................................................................................................... 2-21Printer Inspection .............................................................................................................. 2-22Remote Access Verification .............................................................................................. 2-22Monthly Procedures .................................................................................................................. 2-23FAP Load Balance Verification (PN 870-0243-XX only) ................................................ 2-24Change the Fan Tray Filter ................................................................................................ 2-28Changing the Air Supply Filter ......................................................................................... 2-28Cleaning Printer ................................................................................................................. 2-29Fuse Spares Inventory ....................................................................................................... 2-30Wrist Strap Test ................................................................................................................. 2-30Quarterly Procedures ................................................................................................................ 2-31 910-5272-001 Revision B, May 2008iTable of Contents Maintenance ManualPreventing Dust Buildups .................................................................................................. 2-31Rectifier Voltage Inspection/Recording ............................................................................ 2-32 Semi-Annual Procedures .......................................................................................................... 2-32Chapter 3. Corrective Maintenance ................................................................................. 3-1 Introduction .............................................................................................................................. 3-19System Alarm Levels ................................................................................................................ 3-20 Critical ............................................................................................................................... 3-20Major ................................................................................................................................. 3-20Minor ................................................................................................................................. 3-20 Trouble Detection ..................................................................................................................... 3-20 Audible Alarms ................................................................................................................. 3-20Visual Alarms .................................................................................................................... 3-21MDAL LEDs ..................................................................................................................... 3-21Alarm LEDs on the Fuse and Alarm Panel (FAP) ............................................................ 3-22Alarms appearing on a terminal screen ............................................................................. 3-25Alarms on Application Cards ............................................................................................ 3-26End Cabinet Alarm Indicators ........................................................................................... 3-26Event/Error Messages ........................................................................................................ 3-26IMT Bus States .................................................................................................................. 3-26IMT System Alarm Level Determination ......................................................................... 3-27 Unsolicited Alarm Messages (UAM) ....................................................................................... 3-28Unsolicited Information Messages ........................................................................................... 3-43Output Messages ....................................................................................................................... 3-56UAM/UIM Changes ................................................................................................................. 3-57 EAGLE 5 ISS Release 33.0 UAM/UIM Changes ............................................................. 3-57EAGLE 5 ISS Release 34.0 UAM/UIM Changes ............................................................. 3-63EAGLE 5 ISS Release 34.3 UAM/UIM Changes ............................................................. 3-66EAGLE 5 ISS Release 35.0 UAM/UIM Changes ............................................................. 3-67EAGLE 5 ISS Release 35.1 UAM/UIM Changes ............................................................. 3-71EAGLE 5 ISS Release 36.0 UAM/UIM Changes ............................................................. 3-71EAGLE 5 ISS Release 37.0 UAM/UIM Changes ............................................................. 3-72EAGLE 5 ISS Release 37.5 UAM/UIM Changes ............................................................. 3-73 Alarm Clearing Procedures ...................................................................................................... 3-75Retrieve Trouble Report ........................................................................................................... 3-75Hourly Status Message Reports ................................................................................................ 3-76Maintenance System Event Logs ............................................................................................. 3-80Obituaries .................................................................................................................................. 3-82Terminal Not Responding ........................................................................................................ 3-82Printer Not Working ................................................................................................................. 3-84Modem Not Working ................................................................................................................ 3-85Remove Removable Cartridge Stuck in Drive on MDAL ....................................................... 3-85Link Maintenance ..................................................................................................................... 3-87 Link Fault Sectionalization ............................................................................................... 3-87Hardware Configuration .................................................................................................... 3-88Test Indicators ................................................................................................................... 3-90Test Report ........................................................................................................................ 3-91LFS Test Details ................................................................................................................ 3-91 ii910-5272-001 Revision B, May 2008Maintenance Manual Table of ContentsLink Maintenance Enhancements ..................................................................................... 3-93 Power Down of In-Service System .......................................................................................... 3-99Power Up of the System ......................................................................................................... 3-101UAM and UIM Troubleshooting Procedures ......................................................................... 3-101 0001 - Card has reset ....................................................................................................... 3-1020002 - Card is not running approved GPL ...................................................................... 3-1020003 - Alarm cleared for GPL ......................................................................................... 3-1090004 - Card is running non-activated GPL ..................................................................... 3-1090005 - Alarm cleared running non-activated GPL .......................................................... 3-1100008 - Active MASP has become isolated ...................................................................... 3-1100009 - MASP became active ........................................................................................... 3-1100010 - MASP became standby ........................................................................................ 3-1110011 - Entering forced simplex mode ............................................................................. 3-1110013 - Card is isolated from the system .......................................................................... 3-1120014 - Card is present ...................................................................................................... 3-1130018 - Exiting forced simplex mode ............................................................................... 3-1140021 - Clock A for card failed, B normal ........................................................................ 3-1140022 - Clock B for card failed, A normal ........................................................................ 3-1150023 - Clocks A and B for card failed ............................................................................. 3-1160024 - Clock A for card normal ...................................................................................... 3-1160025 - Clock B for card normal ....................................................................................... 3-1170026 - Clocks A and B for card normal .......................................................................... 3-1170033 - Card database has been corrected ........................................................................ 3-1170034 - Card database is inconsistent ............................................................................... 3-1180035 - Card database is corrupted ................................................................................... 3-1200036 - Card backup database has been corrected ............................................................ 3-1220037 - Card backup database is inconsistent ................................................................... 3-1220038 - Card backup database is corrupted ....................................................................... 3-1230039 - GPL has been corrected ....................................................................................... 3-1230040 - GPL is corrupted .................................................................................................. 3-1240041 -LSMS bulk load required ...................................................................................... 3-1240042 - LSMS bulk load complete .................................................................................... 3-1240043 - Incorrect feature configuration ............................................................................. 3-1250044 - Real time clock battery low ................................................................................. 3-1250045 - Real time clock battery restored ........................................................................... 3-1250046 - Terminal enabled .................................................................................................. 3-1260047 - Card type not valid for application ...................................................................... 3-1260048 - Terminal failed ..................................................................................................... 3-1260051 - TSC sync is in simplex mode ............................................................................... 3-1270052 - TSC sync feature is available ............................................................................... 3-1270053 - Standby TDM failure ........................................................................................... 3-1270054 - Standby TDM failure cleared ............................................................................... 3-1280055 - Persistent device state tbl corrupt ......................................................................... 3-1280056 - Persistent device state tbl diff version .................................................................. 3-1290057 - Persistent device state tbl corrected ..................................................................... 3-1290058 - Critical customer trouble detected ....................................................................... 3-1290059 - Major customer trouble detected .......................................................................... 3-1300060 - Minor customer trouble detected ......................................................................... 3-130 910-5272-001 Revision B, May 2008iiiTable of Contents Maintenance Manual0061 - Customer trouble detected ................................................................................... 3-1300062 - Customer trouble cleared ..................................................................................... 3-1310063 - Critical holdover clock trbl detected .................................................................... 3-1310064 - Major holdover clock trouble detected ................................................................ 3-1310065 - Minor holdover clock trouble detected ................................................................ 3-1310066 - Holdover clock trouble cleared ............................................................................ 3-1320077 - Card temperature is critical lvl:T2 ....................................................................... 3-1320078 - Card temperature exceeds nominal lvl:T1 ........................................................... 3-1340079 - Card temperature again at nominal levels ............................................................ 3-1360082 - Alarm in Fuse panel ............................................................................................. 3-1360083 - Fuse Panel alarm has cleared ............................................................................... 3-1370084 - IP Connection Unavailable .................................................................................. 3-1380085 - IP connection available ........................................................................................ 3-1410086 - IP Connection Congested ..................................................................................... 3-1410087 - IP Connection manually removed ........................................................................ 3-1420088 - Clocks A and B TSCs are out of sync .................................................................. 3-1420089 - Clocks A and B TSCs are resynchronized ........................................................... 3-1430092 - MDAL not responding ......................................................................................... 3-1430093 - MDAL alarm cleared ........................................................................................... 3-1430096 - Card has been reloaded ........................................................................................ 3-1440097 - IMT allowed ......................................................................................................... 3-1440098 - IMT inhibited ....................................................................................................... 3-1440099 - Incompatible HW for provisioned slot ................................................................. 3-1450102 - Motherboard BIP invalid ..................................................................................... 3-1450103 - Motherboard BIP valid ......................................................................................... 3-1460106 - IMT Bus alarm cleared ........................................................................................ 3-1460107 - Minor IMT failure detected .................................................................................. 3-1460108 - Major IMT failure detected .................................................................................. 3-1480109 - All IMT System level alarms cleared .................................................................. 3-1510110 - Failure detected on one IMT bus ......................................................................... 3-1510111 - Failure on both IMT A and IMT B ...................................................................... 3-1530112 - Major failures detected on both IMTs .................................................................. 3-1530113 - Clock alarm(s) cleared ......................................................................................... 3-1540115 - Linkset IP TPS threshold exceeded ..................................................................... 3-1540116 - Link expected IP TPS threshold exceeded ........................................................... 3-1550118 - Linkset IP TPS normal ......................................................................................... 3-1550119 - Link IP TPS normal ............................................................................................. 3-1560128 - All clocks have failed ........................................................................................... 3-1560130 - Card successfully loaded with data ...................................................................... 3-1560132 - Loading failed: table not found ............................................................................ 3-1570133 - Loading failed: data read Error ............................................................................ 3-1570134 - Loading failed: bad checksum returned ............................................................... 3-1580135 - Loading failed: GPL load timeout ....................................................................... 3-1580136 - Loading failed: data load timeout ........................................................................ 3-1580137 - Loading failed: invalid GPL ................................................................................ 3-1590138 - Loading failed: GPL format error ........................................................................ 3-1590139 - Loading failed: disk read prep error ..................................................................... 3-1590140 - Loading failed: disk read response error .............................................................. 3-160 iv910-5272-001 Revision B, May 2008Maintenance Manual Table of Contents0141 - Loading failed: disk read failed ........................................................................... 3-1600142 - System release alarm cleared ............................................................................... 3-1600143 - System release GPL(s) not approved ................................................................... 3-1600144 - System release version unknown ......................................................................... 3-1610145 - HS Clock A for card failed, B normal ................................................................. 3-1610146 - HS Clock B for card failed, A normal ................................................................. 3-1620147 - High Speed Clocks A and B for card failed ......................................................... 3-1630148 - High Speed Clock A for card normal ................................................................... 3-1640149 - High Speed Clock B for card normal ................................................................... 3-1640150 - STPLAN is available ........................................................................................... 3-1650151 - STPLAN capacity normal,card(s) abnormal ........................................................ 3-1650152 - LIM(s) have been denied STPLAN service ......................................................... 3-1660153 - STPLAN not available ......................................................................................... 3-1660154 - STPLAN is removed ............................................................................................ 3-1670155 - STPLAN connection unavailable ......................................................................... 3-1670156 - STPLAN connection available ............................................................................. 3-1680157 - X25 logical channels available ............................................................................ 3-1680158 - X25 no logical channels available ....................................................................... 3-1680159 - High Speed Clocks A and B for card normal ....................................................... 3-1690160 - 1116-S clock failed .............................................................................................. 3-1690161 - 1116-P clock failed .............................................................................................. 3-1690162 - 1116-P, 1116-S clocks failed ............................................................................... 3-1700163 - 1114-S clock failed .............................................................................................. 3-1700164 - 1114-S, 1116-S clocks failed ............................................................................... 3-1710165 - 1114-S, 1116-P clocks failed ............................................................................... 3-1710166 - 1114-S, 1116-P, 1116-S clocks failed .................................................................. 3-1720167 - 1114-P clock failed .............................................................................................. 3-1730168 - 1114-P, 1116-S clocks failed ............................................................................... 3-1730169 - 1114-P, 1116-P clocks failed ............................................................................... 3-1740170 - 1114-P, 1116-P, 1116-S clocks failed .................................................................. 3-1740171 - 1114-P, 1114-S clocks failed ............................................................................... 3-1750172 - 1114-P, 1114-S, 1116-S clocks failed .................................................................. 3-1750173 - 1114-P, 1114-S, 1116-P clocks failed .................................................................. 3-1760174 - %full threshold reached -upload required ............................................................ 3-1770175 - LOGBUFROVFL-SECULOG - upload required ................................................ 3-1770176 - Stdby security log - upload required .................................................................... 3-1780177 - Security log exception cleared ............................................................................. 3-1780178 - Security log failed ................................................................................................ 3-1780179 - NDC Q.3 association is unavailable .................................................................... 3-1790180 - NDC Q.3 association is available ........................................................................ 3-1790181 - NDC Subsystem is not available .......................................................................... 3-1790182 - NDC Subsystem is available ................................................................................ 3-1810183 - 1116-SHS clock failed ......................................................................................... 3-1810184 - 1116-PHS clock failed ......................................................................................... 3-1820185 - 1116-PHS, 1116-SHS clocks failed ..................................................................... 3-1820186 - 1114-SHS clock failed ......................................................................................... 3-1830187 - 1114-SHS, 1116-SHS clocks failed ..................................................................... 3-1840188 - 1114-SHS, 1116-PHS clocks failed ..................................................................... 3-184 910-5272-001 Revision B, May 2008v。
西门子S7-300/S7-400模块连接MCGS步骤北京华科远创科技有限研发的远创智控转以太网模块,型号有MPI-ETH-YC01和PPI-ETH-YC01,PLC转以太网通讯模块适用于西门子S7-200/S7-300/S7-400、SMART S7-200、西门子数控840D、840DSL、合信、亿维PLC的PPI/MPI/PROFIBUS转以太网。
用于西门子S7-200/S7-300/S7-400程序上下载、上位监控、设备联网和数据采集。
支持与 S7-200SMART 、S7-1200/1500、S7-200/300/400的以太网接口进行通讯的功能和ModbusTCP主从站功能。
直通型和桥接型可拨码选择,直通型的九针母口,可以连西门子和Proface触摸屏和主站,桥接型的九针母口可以连非西门子触摸屏。
不占用PLC编程口,即编程软件/上位机软件通过以太网对PLC数据监控和采集的同时,触摸屏可以通过扩展RS485口与PLC进行通讯。
转以太网模块可以连非西门子触摸屏,如昆仑通态、威纶、台达、步科等。
转以太网模块连接S7300西门子S7-300/400 采用模块连接MCGS,可以采用:S7TCP 驱动。
一.采用S7TCP 驱动1、打开昆仑通态MCGS 组态环境——设备窗口,在设备管理器中选择【PLC-西门子-S7CP343&443TCP-西门子CP443-1 以太网模块】;2、在设备属性设置中,将计算机的IP 地址填入【本地IP 地址】,模块的IP 地址填入【远端IP地址】,【远端端口号】填入102;3、点击【设置设备内部属性】,弹出设置窗口,点击【增加通道】进行变量的新建;4、新建变量后点击“快速连接变量”,再点击“启动设备调试”,进行变量的监视。
ET软件和丝绸之路软件连接富怡喷墨机(一)、丝绸之路软件连接富怡喷墨机1、打开丝绸之路绘图图标后,打开排料文件如图2打开文件后,点击,出现绘图任务管理器对话框后,点击对话框中的后。
出现绘图配置对话框,按照下图所示选择(输出设备)、(输出模式)、(输出目标)。
文件名称选择图中如下图文件另存到富怡绘图中心文件夹中的PLOT文件中,输入一个文件名,点击保存。
再点击。
3、在中,点击绘图文件,再点绘图图标,即可绘图。
(二)、ET软件连接富怡喷墨机1、打开ET排料软件,在“文件”中点击“新建”,打开文件。
排好后,点击“绘图仪”中的绘图仪设定,出现绘图仪设定对话框,设置图中的“设备名”,“图仪类型”“有效宽度”,设备名选择HPGL文件路径,图仪类型选择HP系列,有效宽度写入180厘米即可如下图点击图中的一项,找到富怡喷墨机绘图中心的PLOT文件夹中即可。
点击,设定好后点击“绘图仪”的“出图”,点击,,保存好后。
打开富怡喷墨机绘图中心,打开PLT格式文件在点击绘图图标即可绘图。
如下图丝绸之路软件连接富怡平板切割机1、打开丝绸之路软件的图纸输出系统,打开排料文件后,点击,出现绘图任务管理器,点击,出现绘图配置对话框,,按照下图所示选择(输出设备)、(输出模式)、(输出目标)、(输出端口)串口设置、流控量等设置如图所示2、设置好后,点击确认,再点击绘图任务管理器中的文件,点击后,即可出图。
ET软件连接富怡平板切割机1、点击电脑桌面的开始菜单中的“设置”里的“打印机和传真”。
2、右击,点击“属性”。
出现打印机属性对话框点击端口一栏,根据切割机选择适合的端口,COM口或者LPT口。
点击“应用”。
3、点击高级一栏,点击,出现,点击“下一步”,打印机一项中选择,点击“下一步”,点击“完成”。
电脑会自动安装。
再点击确定。
4、右击,点击“设为默认打印机”,创建一个快捷方式到桌面。
5、打开ET软件的排料系统,载入文件,点击“绘图仪设置”,出现绘图仪设定对话框,设置图中的“设备名”,“图仪类型”“有效宽度”,“每页长度”,等。
龙芯1x嵌入式集成开发环境 1.0使用说明书苏州市天晟软件科技有限公司2021年4月目 录1、简介 (5)1.1 主要特点 (6)1.2 目录结构 (6)1.3 文档约定 (7)1.3.1 文件扩展名 (7)1.3.2 指定文件名 (7)1.3.3 头文件 (7)1.4 项目开发过程 (7)2、初次使用 (8)2.1 语言设置 (8)2.2 工作区目录 (9)2.3 GNU 工具链 (9)3、用户界面 (12)3.1 菜单栏 (12)3.2 工具栏 (14)3.3 编辑面板 (14)3.3.1项目视图 (15)3.3.2 代码解析 (17)3.3.3 文本编辑器 (18)3.3.4 消息窗口 (19)3.4 调试面板 (20)3.4.1 断点列表 (21)3.4.2 CPU 寄存器 (21)3.4.3 观察值 (22)3.4.4 汇编代码 (22)3.4.5 函数调用回溯 (22)3.4.6 GDB 交互命令 (22)3.5 状态栏 (23)4、项目管理 (24)4.1 新建项目向导 (24)4.1.1 第一步项目基本信息 (24)4.1.2 第二步设置Mcu、工具链和操作系统 (25)4.1.3 第三步实时操作系统选项 (26)4.1.4 第四步确认并完成向导 (29)4.1.5 新建项目示例 (30)4.2 基本操作 (30)4.2.1 打开项目 (30)4.2.2 保存项目 (31)4.2.3 关闭项目 (31)4.2.4 项目另存为 (31)4.2.5 成批添加文件 (32)4.2.6 成批移除文件 (33)4.3 项目属性 (34)5、文档管理 (37)5.1 文件操作 (37)5.1.1 新建源代码文件 (37)5.1.2 新建头文件 (37)5.1.3 文件重命名 (38)5.1.4 文件移动 (38)5.1.5 文件删除 (39)5.2 文件夹操作 (39)5.2.1 新建文件夹 (39)5.2.2 重命名文件夹 (39)5.2.3 移动文件夹 (40)5.2.4 删除文件夹 (40)5.3 Drag & Drop (40)6、文本编辑器 (41)6.1 编辑器选项 (41)6.1.1 常用 (41)6.1.2 字体 (42)6.1.3 颜色 (42)6.1.4 代码解析 (43)6.1.5 符号补全 (43)6.1.6 自动保存 (44)6.2 基本操作 (44)6.2.1 编辑 (44)6.2.2 查找 (44)6.2.3 替换 (45)6.2.4 在文件中查找 (46)6.3 其它操作 (47)6.3.1 打开头文件/文件夹 (47)6.3.2 定位语句定义原型 (47)6.3.3 代码解析项跳转 (48)6.4 插入代码向导 (49)6.4.1 插入RTOS 任务代码 (49)6.4.2 插入SPI/I2C驱动代码 (50)6.5 信息提示 (52)7、项目编译 (53)7.1 编译选项 (53)7.1.1 MIPS & BSP Options (54)7.1.2 GNU C Compiler - C 编译器 (54)7.1.3 GNU Assembler - 汇编语言编译器 (58)7.1.4 GNU C++ Compiler - C++ 编译器 (58)7.1.5 GNU C Linker - C 链接器 (58)7.1.6 软浮点算术库 (60)7.2 开始编译 (61)7.2.1 编译成功 (61)7.2.2 编译失败 (62)7.3 项目清理 (62)8、项目调试 (63)8.1 调试选项 (63)8.1.1 主要项 (63)8.1.2 调试器 (64)8.1.3 启动项 (65)8.1.4 源代码 (66)8.2 调试断点 (66)8.2.1 在编辑器中设置断点 (66)8.2.2 断点列表 (67)8.3 开始调试 (67)8.3.1 代码下载 (67)8.3.2 单步运行 (68)8.3.3 连续运行 (69)8.3.4 停止调试 (69)8.3.5 观察值 (69)8.3.6 函数调用回溯 (70)9、实用工具 (71)9.1 NOR Flash 编程 (71)9.2 NAND Flash 编程 (72)9.3 硬件设计助手 (73)9.3.1 龙芯 1B 芯片 (74)9.3.2 龙芯 1C 芯片 (75)10、系统安装 (76)10.1 运行环境 (76)10.1.1 安装MSYS 1.0 (76)10.1.2 安装MSYS2 (76)10.2 安装LoongIDE (76)10.2.1 运行安装向导 (77)10.2.2 LxLink驱动 (77)10.3 GNU 工具链 (78)10.3.1 SDE Lite for MIPS工具链 (78)10.3.2 RTEMS GCC for MIPS工具链 (78)10.4 注意事项 (78)1、简介缩写LS1x DTK:Embedded DTK for LS1x 龙芯1x嵌入式开发工具LoongIDE: Embedded IDE for LS1x 龙芯1x嵌入式集成开发环境LS1x DTK用于龙芯1x芯片的嵌入式开发解决方案,包括创建、构建以及调试用户应用项目,完美支持龙芯1x芯片的工业级应用的开发。
1.ETP #910C001 ETP Title ELECTRONICS RELIABILITYETP Type: ReliabilityRevision # 0Revision Date 12/08/03 Revision Author J Holmes, Lucas Mallory (See section 13 for revision history)Superseded Doc # (if applicable) SI700000SI700002SI700003Applicable Product Line(s): All and/or (enter other here)Platform:Subsystem: ElectronicsComponent: Board assemblies and componentsKeywords: Reliability LifeElectronics ALT85/85 Temperature CyclingHumidity Cyclic TemperatureEvaluation HALTFlatness VibrationalWarpage EmbrittlementDesign MarginIonic ChromeotographyStatic RoseCoupon TinWhisker PrintedCircuit AcceleratedHighly ChamberContents1 INTRODUCTION (3)2 ACCELERATED LIFE TESTING (4)3 HIGHLY ACCELERATED LIFE TESTING (16)4 TIN WHISKER (31)5 CIRCUIT BOARD ASSEMBLY FLATNESS (37)6 CIRCUIT BOARD EMBRITTLEMENT (42)7 HIGHLY ACCELERATED STRESS AUDIT (46)8 DESIGN MARGIN EVALUATION (51)9 CYCLIC RELIABILITY (56)10 IONIC CHROMETOGRAPHY (61)11 STATIC ROSE TESTING (66)12 COUPON SAMPLING (69)13 THERMAL CYCLE RELIABILITY AUDIT TESTING (74)1 IntroductionAccelerated life testing consists of various tests that accelerate different failure modes. For example, thevibration testing may accelerate solder joint failures that can be a result of poor workmanship. GECIP uses a family of different tests that exercise various failure modes that can occur in electronics assemblies. The table below shows a summary of the failure modes exercised by the different tests in this document.This document contains test procedures that are used to evaluate the reliability and quality of electronicassemblies. Each test procedure accomplishes a different task. In some cases, two or more test procedures will test for the same failure mode or modes.The following table outlines common electronics design and qualification scenarios, as well as the tests that are appropriate for that intent.Reliability audit tests defined in the table above are the maximum amount of testing that could be done. Each program will specify which of the above tests are to be used in their quality audit plan. All products built with lead free solder should use the thermal cycle reliability audit test as a production audit with an initial baseline run done during the initial product launch.* It is recommended that the tin whisker test be done on a vendor by vendor basis, rather than a program by program basis.** In addition to the tests defined in this document, there are other product specific tests that may be required in the product specification. Some of those tests may include rack life, slat, salt spray, acid fog, HCC (under the bag), etc.2 Accelerated Life Testing2.1 ETP ObjectivePurpose: Introduction to Cyclic Temperature, Power & Humidity Evaluation ( ALT )The process elements to successfully implement and perform Cyclic Temperature,Humidity & Power cycle testing are defined in this section. This section of the ETP willdescribe the methodology, requirements and procedure for Accelerated Life Testing (ALT).For certain projects, an electromigration test may be required (as opposed to the completeALT test). When this test is required, the ALT procedure should be followed with a testduration of 2 weeks. Upon completion of the two week test a full microscopic exam of theunits under test should be done. This examination should focus on any evidence ofdendritic growth.Limitations: Any failures found during this testing should be fully investigated until root cause is found.There are components that can not operate without failure in high temperatures. Thesetypes of failures will no longer follow the Arrhenius equation. They will in fact be specialcause failures for which no acceleration can be calculated.2.2 Key Parameters & Requirement InputsThe test variables, which impact product performance, can either be classified as Key Noise Parameters or Key Control Parameters as described below. They may be set as test inputs, recorded for analysis or both as specified for this ETP in the following charts.Key Noise Parameters - A key noise parameter (KNP) is any product usage or interaction variablewhich cannot be controlled by design (i.e. voltage, ambient temperature, water quality, etc.). Note thatfor the purposes of this test, the parameter may be controlled (i.e. specified as an input below) in orderto understand the impact of the KNP upon product performance.Key Control Parameters- A key control parameter (KCP) is any product usage or interaction variablewhich can be controlled by design (dimensions, operating range, material, etc.).2.3 Test Equipment and Supplies2.4 Expected Test Duration(Based on average conditions; may vary significantly depending upon lab load)Set-up: 1 DayTest Procedures: Several weeks. The Lab shall inspect the UUTs each day for the durationof the test. Duration is dependent on the usage profile of the product & theacceleration factor.Post-test/Cleanup: 1 DayDocumentation: 0.5 DayTotal Expected Test Duration: Several Weeks, Dependent on Usage Profile & acceleration factor.2.5 Test SamplesSample SizeSample size shall be selected to support a 90% C.I. of being 90% reliable. If appropriate, alternative confidence intervals and reliability targets may be chosen. The sample size calculation shall be reviewed with the SCE as part of the test plan review. The reliability sample size, assuming an exponential distribution, can be calculated using:n = (L / (T * Af)) * (ln (1-CI)) / (ln (R))L: Specified product life in HoursT: Total number of hours on testAf: Acceleration factor (See the acceleration factor calculator)CI: Confidence intervalR: Reliabilitye.g., to get 90% CI, 90% R Where T * Af = L the required sample size is 22.Qualification/Preconditioning/SetupCompletion of Reliability 10 Step ProcessPrior to starting any accelerated life testing a completion of the first 8 steps in the 10 step process is required.These steps are necessary in order to understand what types of environments and the lifetime usage conditions are for the system being tested. The 10 step process is located at the Reliability Home page/TechnetRedirect.html?redirectTo=/upload/18174/doc _267672.htmTemperatures used in testing should incorporate temperatures that will be seen in real life applications . ( e.g., 105 C. for cooktop applications . )Assemblies shall be tested for twice life or 20 years of life, which ever of the 2 choices is less. Additionally, alternative test requirements may be accepted with prior review and approval of the electronics chief engineer.Request for testingA request for testing must be submitted prior to testing the boards. This should be submitted as soon as therequirement for testing is determined. The method of submitting a test request varies by site. Typical testrequest information may include:- Engineer(s) in charge of electrical design.- Complete item name and/or designation.- Date boards will be available.- Requested completion dates and reasons for that date (i.e. E-Review) for prioritizing purposes.Required for Test- Calculations of sample size> Use the Reliability website (available from technet) or Alta program- Hard copy of Acceleration calculation to be attached to the front of the chamber.> /eng/dept/electronics2/reliability.htm- Electrical interface box:- Complete schematic of circuit board and test box.- Load(s) required for operation.- Functional Test Procedure.- Mechanical Fixture.- Information sheet with the description of the test , start time, stop time and who to contact in case ofemergency . This will also be posted on the front of the test chamber.2.6 Test ProcedureThe electrical control system is used to verify the operation of the components that make up the units being tested. All systems that have microprocessor controls should be programmed with test software that allows for accelerated operation of all the function within the system . Dumb systems should incorporate a method toexercise these functions on a periodic basis to ensure that lifetime usage is met.Design- The electrical control system should be designed to power the units under test with a separate control and fuse for each board. The control system shall power each board in a repeating cycle of 180 minutes on and 20minutes off. This cycle shall repeat for the duration of the test.- Loads should simulate ( if possible ) to real life loads.- All wiring inside the chamber must be rated for 125 degree C operation. Wiring outside of the chamber can be standard hook-up wire rated for the application used. The minimum length for the cable going into the chamber is ten feet (four feet inside the chamber and 6 feet outside). If this length presents a problem to the functioning of units, coordinate with Reliability engineering to determine a solution.Construction & MaterialsThe basic control system should be constructed to be to be intrinsically safe to the operator. All connections and terminals with hazardous voltages will be enclosed or covered. The test setup, wiring and device under test shall be in compliance with electrical safety rules.The functional test should use optical, audible, or other means to feedback system status in order for theoperator to determine whether that function of the system has failed. The goal of the functional test is to achieve 100% test coverage, or as much coverage as is possible, of the sample under test.A monitoring system ( optimal ) should be in place in order to capture any functional failures that might occurduring the testing process. Continuous data capture should be incorporated when possible. If not, then at aminimum, daily inspection shall be performed in order to determine whether a failure of the system has occurred.Mechanical FixtureThe mechanical fixture is used to hold the units being tested in the chamber. The fixture is designed not to mimic the real-life mounting of the product but rather maximize airflow.Design Considerations- The fixture should be made to be strong and safe but yet have the least amount of mass as possible in order to minimize the thermal loading inside the chamber.- Vertical mounting of UUTs is preferred.- The fixtures at no time should be allowed to come in contact with high potential voltages. The use of insulators and plastic tie wraps should be used in order to assure that wiring won’t move.- Proper airflow must be allowed to evenly heat and cool the units.- Room must be allowed for electrical connections and cables around the units.- If UUT must be handled or checked during test, make sure that the temperature in the chamber is allowed to stabilize at a safe level and that all power to the circuits are disconnected.MaterialThe material used ( plastic cases, LED displays ) must be able to withstand the temperature range that isprogrammed into the chamber . If temperatures exceed the rated limits of the plastic part, then the temperature must be lowered and the acceleration factor re-calculated.Product requirementsQualityAll units shall be constructed to standard quality levels as determined by the test type. Pre-production andproduction units shall go through the complete production cycle. Units shall be verified operational beforesubmission to testing.WarningsChamberDuring testing, the chamber and assemblies contained inside the chambers can reach temperatures that can cause severe burns if allowed to come in contact with the human body, also if the door is open prior to cool down, steam can rapidly escape from the chamber causing burns to the face. Before entering the chamber allow the chamber to cool to room temperature for at least ½ hour.Units under testAlways disconnect the power to any electrical test boxes prior to connecting and disconnecting units in thechamber. Take all precautions to avoid a shock hazard.System verification and startupProfilesProfile 1 :Segment SegmentTime(min) CycleTime(min)CycleTime(Hrs)Temp(degC)RH (%)1 30 30 0.50 85 402 15 45 0.75 85 853 570 615 10.25 85 854 15 630 10.50 85 405 30 660 11.00 30 406 60 720 12.00 30 40Note: The power cycles are 180 minutes on and 20 minutes off for a 200 minute cycle. Profile 2:Segment SegmentTime(min) Cycle Time(min)CycleTime(Hrs)Temp (degC) RH (%)1 70 70 1.17 105 402 30 100 1.67 105 403 10 110 1.83 85 854 180 290 4.83 85 855 10 300 5.00 85 406 60 360 6.00 0 40Note: The power cycles are 180 minutes on and 20 minutes off for a 200 minute cycle. Profile 3:Segment SegmentTime(min) CycleTime(min)CycleTime(Hrs)Temp(degC)RH (%)1 30 30 0.50 85 402 15 45 0.75 85 853 570 615 10.25 85 854 15 630 10.50 85 405 30 660 11.00 0 206 60 720 12.00 0 20Note: The power cycles are 180 minutes on and 20 minutes off for a 200 minute cycle.Selecting a ProfileProgram ProfileRange 2Refrigeration (inside) 3Refrigeration (outside) 1Dishwasher 1Washer / Dryer 1Microwave 1Lighting 1Profiles are used to assure that lifetime temperatures are fully simulated in the life testing of the assembly. If the profiles listed don’t cover the range of life temperatures then an alternate profile must be created with the approval of the Electronic Reliability Expert or the Chief Engineer.When using the acceleration calculator, you must use the profile that matches the appliance and application being tested. These acceleration calculations with profiles can be located on./eng/dept/electronics2/reliability.htmOnce the correct profile has been chosen then these temperatures, humidities and times must be programmed into the appropriate test chamber. The test assemblies can be power and verified functional. At this point the test may be started.Monitoring for FailuresThe test assemblies shall be checked continuously (if possible with computer assistance) or at a minimum should be checked once a day for a failure of the system. Once a failure has occurred, the board number and the time to failure should be logged into a spreadsheet or Reliasoft program for later calculation of the total reliability of the assemblies. When the temperature reaches a minimum, the failed assembly may be pulled out and replaced with a new assembly.A note must be made as to the start time of the new assembly. The new assembly will only accumulate the actual hours that it has been tested, not the hours before the failure.The failed board should under go root cause analysis and must be logged into FRACAS so as to keep a running record of the history of failures.ResultsResult Evaluation:Once the required time for testing life has been achieved the data should be tabulated using Weilbull ++ , Alta Pro or other reliability software in order to determine the 1, 10 and 20 year reliabilityMigration:All boards shall be both visual and microscopically evaluated for signs of electromigration. If migration has occurred, the Engineer in charge shall capture pictures for further investigation work.Evaluation of parts:The parts located on the board shall be free from distortion, corrosion, or burnt discoloration to the PCB.2.7 ResultsNote - All test results to include:∙Equipment used to generate data∙Calibration (accuracy) of test equipment∙Resolution of test∙Measurement error (variability, σe) of test2.8 Results Interpretation(Includes any pertinent guidelines, limitations or insights needed for interpreting results)2.9 Failure Modes Exercised/Acceleration Factors/Field Failure CorrelationThis test accellerates the life of an electronic control. The acceleration factor is taken at the system level as an average acceleration of the types of parts and assemblies being tested. The test duration (described below) is based on an acceleration factor calculated from the modified Arrhenius equation.The equation is modified to include the humidity effects as described by Hallberg-peck. According to Henry Livingston's paper, the equation is defined as:Af = ( [RHt / RHu] ^ p ) * exp [ (Ea/K) * (1/Tu - 1/Tt)]Where: Af - Acceleration factor, RH - test and usage humidity, Ea - Activation Energy, K - Boltzman's constant and T - test and usage temperatures.For GECP electronics typical numbers are p=2.66 and Ea = 0.7 eV.2.10 Nomenclature/VocabularyALT (Accelerated Life Test) – provide timely information about the life distribution of materials andproducts. Information from tests at high levels of stress is extrapolated, through a physically reasonable statistical model, to obtain estimates of life at lower, normal levels of stress.Cycle Time – The period of time that the temperature and/or Humidity takes to execute once through the program and return to the initial settings. ( e.g., 2 cycles per day )Test period – The time it takes to run a given number of test cycles that equates to an equivalent amount of real time years .UNIT - Electrical or mechanical part, subassembly, or the productProduct life – The time at which a product is deemed to not function per its specification.Activation Energy– ( State of activation ) energy (eV) to surmount the barrier of activationfrom the beginning of a starting system to its final reaction.Acceleration Factor – Magnification factor of the life of a system ( standard conditions ) and testing conditions ( accelerated conditions ) , respectively.SCE - Senior Consulting Engineer2.11 Background(Related theory, methods and standards used to develop test procedure)2.12 Reference(Technical studies, standards, articles, etc., which are related to this ETP)2.13 Revision History(Includes reasoning for release of current revision, with date and name of person releasing revision)2.14 Power Cycle ExampleOne of the requirements for this test is that the power be cycled to the controls on test. There are several ways to do this. One cost effective method to power the UUTs using a power box containing a repeat cycle timer relay with two independently adjustable T1 and T2 settings. A logic diagram of the appropriate connections and an example parts list is included here for reference.3 Highly Accelerated Life Testing3.1 ETP ObjectivePurpose: (Overview of parameter(s) to be measured as well as scope of conclusions test is expected to facilitate)The process elements to successfully implement and perform HALT are defined in thissection of the document. This ETP will describe the methodology, requirements andprocedure for HALT testing.HALT should be used as part of the design process to rapidly expose design weaknessesby: combining a wide range of temperature (-100ºC to + 170ºC), rapid rate of temperaturechange (60ºC/min), multi-axis vibration (6 degrees of freedom, 2Hz-10KHz, up to 60Grms)and power cycling, and other product specific extremes.During HALT the boards are over-stressed to very quickly induce failures and expose theweak points. The goal of a HALT test is to quickly break the product and learn from thefailure modes. A HALT test is considered successful when: failures are induced, failuremodes are understood, corrective action taken and limits defined and pushed out as far aspossible.During HALT testing the products are stressed far beyond its specification as well as farbeyond what the product will encounter in the field. HALT is then used to precipitate anddetect failures or weakness in the design. As failures are identified and eliminated, designand process margins are extended to affect optimized field reliability and use-life. Limitations: (Any qualifications that apply to this test procedure or its results)HALT testing is not the same as Design Verification Testing. HALT testing quickly findsfailure modes that would not be discovered in Design Verification Testing. But, it is notintended to replace Design Verification Testing.3.2 Key Parameters & Requirement InputsThe test variables which impact product performance can either be classified as Key Noise Parameters or Key Control Parameters as described below. They may be set as test inputs, recorded for analysis or both as specified for this ETP in the following charts.Key Noise Parameters - A key noise parameter (KNP) is any product usage or interaction variablewhich cannot be controlled by design (i.e. voltage, ambient temperature, water quality, etc.). Note thatfor the purposes of this test, the parameter may be controlled (i.e. specified as an input below) in orderto understand the impact of the KNP upon product performance.Key Control Parameters- A key control parameter (KCP) is any product usage or interaction variablewhich can be controlled by design (dimensions, operating range, material, etc.).3.3 Test Equipment and SuppliesThe following equipment list is a typical list available at the Louisville Center. Appropriate substitutions may be made depending on the design center. The equipment list should be included in the results.3.4 Expected Test Duration(Based on average conditions; may vary significantly depending upon lab load)Set-up: 1HRTest Procedures: 48HRPost-test/Cleanup: 4HRDocumentation: 1HRTotal Expected Test Duration: 54HR3.5 Test SamplesSample Size (Number of samples and/or rationale for sample size selection)Quantity - Purpose3 - Hot Step3 - Cold Step3 - Vibration3 - Thermal Cycle3 - Combination Cycle3 - Spares-------------------------------------------18 - Total SamplesQualification/Preconditioning/Setup (Any test sample preparation, stabilization, preconditioning or certification required before testing)Test Request:A request for testing must be submitted prior to testing the boards. This should be submitted as soon as therequirement for testing is determined. The method of submitting a test request varies by site. The following items are typical in a lab request:- Engineer(s) in charge of electrical design.- Complete item name and/or designation.- Date boards will be available.- Requested completion date and reason for that date (i.e. E-Review) for prioritizing purposes.- Determine will supply the electrical interface box.- Account number for test fixtures and dock number for time charges.Test Prep:Prework should be done ahead of the testing schedule. Prework requires the following items.- Physical sample of the circuit board.- Pre-test inspection procedures and criteria. Written approval required for deviations.- If electrical interface box to be built by HALT engineering:> Complete schematic of circuit board and test box.> Load(s) required for operation.> Additional time will be required for in laboratory fabrication.- Functional Test Procedure.Functional Test Requirements:The electrical control system is used to verify the operation of the components that make up the units being tested. This is not a verification of the software programs of any microprocessors, but only that they and all other components function. The verification sequence should take less than five minutes.The electrical control system should be designed to power the units under test with a separate control and fuse for each board. Additionally, the system should have the ability to cycle the power to the unit under test while it is being tested.All wiring inside the chamber must be rated for 200 Degrees C operation. Wiring outside of the chamber can be standard hook-up wire rated for the application used. The minimum length for the cable going into the chamber is ten feet (four feet inside the chamber and 6 feet outside). If this length presents a problem to the functioning of units, coordinate with HALT engineering to determine a solution.The basic control system should be constructed to be to be intrinsically safe to the operator. All connections and terminals with hazardous voltages will be enclosed or covered. The test setup, wiring and device under test shall be in compliance with electrical safety rules.The functional test of should be of adequacy to determine the performance of the sample and the occurrence of multiple types of failure modes. The test must as a minimum exercise the major functions of the product with a feedback measurement of performance of these functions. The goal of the functional test is to achieve 100% test coverage, or as complete test coverage as is possible, of the sample under test.At each level of applied stress, functional testing is performed on the boards to evaluate the operation.Whenever possible product specific stresses should be performed during each step stress to enhance additional failure precipitation and detection. These stresses may include power cycling, line voltage margining, and line frequency margining, DC power supply margining, on-board oscillator margining, output loading, and any others that are applicable.Mechanical Fixture:The mechanical fixture is used to hold the units being tested in the chamber. The fixture is designed not to mimic the real-life mounting of the product but rather maximize the transmission of energy into the product, maximize airflow as well as improve the transmission of low frequency energy.Design Considerations:Three units should be mounted in the chamber for each step of the test.Units must be mounted to ensure maximum vibration energy transfer. Typically the units will be mounted to a Family plate constructed of Magnesium-Aluminum or Aluminum.The Family plate should be mounted in the center of the vibration platform to minimize the variation in vibration energy transmitted to each UUT. A 6-sigma experiment verified a minimum 2x reduction in variation between a center mount and an edge mount.Proper airflow must be allowed to evenly heat and cool the units. Airflow is can also maximized using the flexible air ducts.Room must be allowed for electrical connections and cables around the units.If UUT must be handled during test (buttons, pot, etc.), make sure all units will be in reach of glove port.For uniformity between UUT positions, mount fixture as close to the center as possible.Material:The material used must be able to withstand the temperature range in the chamber (-100 to +200 degrees C).The material must be rigid enough to transfer the vibration to the units under test without attenuating the energy.The recommended material is magnesium or aluminum alloys.Product Requirements:All units shall be constructed to standard quality levels as determined by the test type. Pre-production andproduction units shall go through the complete production cycle. Units shall be verified operational beforesubmission to testing.3.6 Test Procedure(Detailed, step-by-step directions for running test including photos/diagrams as appropriate) Warnings:Liquid NitrogenLiquid nitrogen is a colorless, odorless, extremely cold liquid and gas under pressure. It can cause rapidsuffocation when concentrations are sufficient to reduce oxygen levels below 19.5%. Contact with liquid or cold vapors can cause severe frostbite.In case of a leak, open door, evacuate area and turn off valve at tank. Contact security and other persons as required.DO NOT TOUCH LIQUID OR ANY UNINSULATED PIPING WITH LIQUID NITROGEN IN IT.Ref: GE MSDS 4889Chamber:。