ICT操作要领

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ICT測試作業標準流程

(Quick Start)

ICT 編程技術指導書

(Technical Reference)

PART I ICT測試作業標準流程

(ICT操作密笈V6.10C)

I. 針床製作準備及注意事項 ........................................................................................................ 5

A. 治具(針床) ......................................................................................................................... 5

i. 治具製作須提供給治具廠商之資料 ........................................................................ 5

ii. 治具製作需注意事項 ................................................................................................ 5

B. 測試程式製作 .................................................................................................................... 7

II. 針床的安裝及程式匯入 ............................................................................................................ 8

A. 安裝針床 ............................................................................................................................ 8

B. 連接針床與開關卡排線 .................................................................................................. 11

C. 讀入測試檔案 .................................................................................................................. 12

i. 開啟ICT舊檔: ..................................................................................................... 12

ii. 匯入他廠程式: ...................................................................................................... 13

III. 參數的設定及注意事項 .......................................................................................................... 14

A. 測試參數的設定 .............................................................................................................. 14

i. 待測板參數 .............................................................................................................. 15

ii. O/S參數的設定 ...................................................................................................... 16

iii. TAJ設定參數 .......................................................................................................... 17

iv. 測試參數設定 .......................................................................................................... 18

B. 系統參數的設定 .............................................................................................................. 19

i. 壓床參數的設定 ...................................................................................................... 19

ii. 周邊參數設定 .......................................................................................................... 19

IV. 程式學習及偵錯 ...................................................................................................................... 20

A. 開短路學習(O/S Learning)及偵錯(Debug) .................................................................... 21

i. 測試項目設定 .......................................................................................................... 21

ii. O/S學習及偵錯 ...................................................................................................... 21

iii. 壓台上下測試 .......................................................................................................... 22

iv. 多片良品板交換進行測試 ...................................................................................... 23

B. 元件的學習及除錯 .......................................................................................................... 24

i. 參數的設定 .............................................................................................................. 24

ii. 元件自動學習、測試及除錯 .................................................................................. 24

iii. 壓台上下測試 .......................................................................................................... 25

iv. 多片良品板交換進行測試 ...................................................................................... 25

C. IC學習(IC Leaning)及偵錯(Debug) ............................................................................... 26

i. 參數設定 .................................................................................................................. 26

ii. IC自動學習及測試 ................................................................................................. 29

iii. 壓台上下測試 .......................................................................................................... 31

iv. 多片良品板交換進行測試 ...................................................................................... 31