FM_application_notes

AN235Si4700/01/02/03/08/09 E VALUATION B OARD Q UICK-S TART G UIDE Thank you for purchasing the Skyworks Solutions Si4700/01/02/03/08/09 FM Tuner Evaluation Board (EVB). The EVB and associated software have been designed to speed the overall development process and decrease required development time. We look forward to working with you and have posted support articles, answers to fre-quently asked questions, and application notes on the Si47xx Customer Support Site at https:///en/Support.Note: A more comprehensive user's guide for configuring your system is available on the EVB CD (Si4700/01/02/03 Evalua-tion Board User's Guide or Si4708/09 Evaluation Board User’s Guide) and on the Si47xx Customer Support Site. If you have any difficulty or questions about any of the steps below, please consult the EVB users guide prior to plugging in your EVB.1.Make sure any prior versions of the GUI are removed prior to installation of the GUI application softwareshipped with the evaluation board kit.- You can use "Add or Remove Programs" in the Windows control panel to remove the old version of the GUI.2.Insert the Skyworks Solutions CD into host CD drive.3.Install the Development GUI located in CD:\Si47xx\Setup.exe.- The setup program may prompt to install the DotNetFramework which is required for the program to function.This may be installed from the DotNetFramework directory on the Installation CD or from the Microsoftwebsite.4.Connect the USB cable to the evaluation board USB connector.5.Make sure that switch SW1 is in the USB position to use USB power.unch the Si47xx Development GUI.General Debugging GuidelinesIf your EVB is not functional, please refer to the following troubleshooting tips.1.Make sure the EVB is recognized by your PC. Right-click on "My Computer", and select "Properties" →"Hardware" → "Device Manager". Under "Human Interface Devices", select each "HID-Compliant Device" →“Details" entry, and confirm one contains "VID_10C4&PID_8193."2.If the EVB is not recognized by the GUI, uninstall .NET Framework V2.0, and reinstall from Microsoft's WindowsUpdate.SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Rev. 0.6 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 8, 2021Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters.Skyworks, the Skyworks symbol, Sky5®, SkyOne ®, SkyBlue™, Skyworks Green™, Clockbuilder ®, DSPLL ®, ISOmodem ®, ProSLIC ®, and SiPHY ® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.Portfolio Quality /quality Support & Resources /supportSkyworksSolutions,Inc.|Nasdaq:SWKS|*********************|USA: 781-376-3000 | Asia: 886-2-2735 0399 | Europe: 33 (0)1 43548540 |。

电子的自旋现象及其应用郭爱文（61010112）（东南大学吴健雄学院，南京市 211100）摘要：物理课本中主要从相对论的角度对电子自旋理论进行相关阐述与计算，旨在简单地引入近代所发现的较为反常的电子自旋现象。

本文立足于课本知识，重点在于探讨电子自旋理论的应用与发展，对课本未提到的后续内容做一些补充说明。

关键词：电子自旋；Stern-Gerlach实验；巨磁阻效应（GMR）；自旋电子学；电子自旋共振；Application notes for electron spinGuo Aiwen(Southeast university, Nanjin 211100)Abstract: To introduce electron spin simply, the author of our class book explained it with calculation based on the theory of relativity. This article mainly focuses on discussing the application and development of electron spin, which can make some additional remarks to our class book.key words: Electron spin; Stern-Gerlach experiment; Giant Magneto Resistance（GMR）; Spintronics; electron spin resonance;基础物理学教程第二十三章谈到了电子自旋这一概念，书中从假设提出、状态描述、对赛曼效应的影响等方面对电子自旋做了相关的理论分析，重点放在了概念的引入以及相关参数的计算上。

而随着时代的发展，自旋电子学这一门新兴的学科在生产生活中得到了越来越重要的体现。

P R O D U C T A P P L I C A T I O N N O T E S16MMIC SWITCH DRIVER TECHNIQUESFigure 1: Floating Ground Driver for the HMC182S14 SP4T Switch.Positive Voltage Control of MMICMulti-Throw Switches with Floating Ground TechniqueHittite Microwave Corporation devel-oped multi-throw switches with on-The Hittite Microwave SPNT switch product line includes non-refl ective and refl ective switches in standard confi guratoins of HMC165S14 SP4T , HMC182S14 SP4T SP6T , and HMC183QS24 SP8T . All are plastic encapsulated devices in industry standard SOIC and QSOP packages, readily used in automated assembly environments.The decoder-on-board technology developed by Hittite Microwave pro-vides the user with the advantage of a simplifi ed control interface. Decoder topologies for each switch style are as follows: 2:4 decoder for the SP4T , 3:6 decoder for the SP6T , and 3:8 decoder for the SP8T switch. This directly sim-plifi es board layout by reducing the number of driver lines required to con-trol the switch. The reduction of con-trol lines on the PCB serves directly to reduce pathways for RF crosstalkon the bias & control lines and ingress of signal from one channel to another thus enhancing isolation performance of the multi-throw switch. There is a −Vee bias requirement (-5.0 to -6.5 Vdc +/-10%) for each SPNT switch and the control lines accept negative logic voltages of; Low = 0.0 to -1.0 Vdc & High = Vee +/-0.25 Vdc.The RF performance using Hittite Microwave proprietary driver & RF circuitry has inherently low loss & linear performance. The active ele-ments of the circuit are depletionmode MESFET’s (Metal Semiconduc-tor Field Effect T ransistor) or “FETs”,a voltage controlled device. In stan-dard operation, the drain & source ofeach FET is held at DC ground withthe potential at the gate of the FETheld at 0 volts placing the FET in thelow loss or “on” state, and the potential of the gate held at -5 volts for the high impedance or “off” state.The system designer may not have negative voltage bias & control signals readily available. The fl oating ground switch dri8ver method described below can be used to enable positive bias & control opera-tion of the GaAs multi-throw switch. By the use of blocking capacitors,pull-up resistors, and careful attention to layout details of the PCB, the fl oating ground switch driver approach can be used with good results and a minimum of additional circuitry. Because the FET is a voltage controlled deivce there must be apotential difference of >-3.5 Vdc to <- 7 Vdc between the gate and drain-source channel to establish the certain pinch-off of the channel, thereforacheiving the high loss or “off” state in the FET . This can be accom-plished by holding the source and drain at +5 Vdc +/-10% and togglingthe gate between 0 and +5 Vdc +/- 10% to change the state of the FET .All DC bias points and control signals are therefore raised +5Vdc fromtheir normal potentials.An example of this floating ground technique using microstrip trans-mission lines is shown in Figure 1 for the HMC182S14 SP4T non-re-16P R O D U C T A P P L I C A T I O N N O T E SMMIC SWITCH DRIVER TECHNIQUESfl ective switch. Please note that the use of coplanar waveguide (CPW) ciruit techniques will save space and enhance RF performance, lower loss and higher iso-lation. See Hittite Microwave catalog application note, “Design T echniques Enhance Isolation in Switch Assem-blies” page 8-24, for further deiscussion of the use of CPW transmission lines and printed circuit board design techniques.In Figure 1, the internal switch shunt FET sources are pulled to +5 volts through the 270 nH inductor (L1) applying bias to the fl oating ground plane. The internal switch FET drains are held at +5 volts potential via the 10 Kohm resistor (R1) and capacitor (C9) arrangement shown at the RF Common Node. The 10 Kohm resistor is critical for reducing RF crosstalk, with capacitor C9 providing a path to ground for stray RF signals. It is criti-cal in all cases for capacitors to be placed as closely as possible to the body of the switch for best RF per-formance. The 10 Kohm resistor should be placed on the RF trace without use of a “stub” landing solder pad for the resistor on the trace. If a resistor landing pad is required for PCB manufacturing yield issues then it’ssize should be minimized to reduce RF signal loss. The con-nections to hard RF/DC ground must have many via holes to ensure a low impedance path to ground at the highest RF frequency of operation.High Q capacitors should be used for best perfor-mance in all cases, C1-C10. DC block, decoupling & bypass applications shoulduse 100 pF to 0.01 uF capac-itors. For a typical operating range of 10 - 1500 MHz, the 0.01 uF capacitor provides for a low resistance path to ground for RF in the decoupling & bypass functions and a low insertion loss element in the DC block func-tion. Switch users at predomnantly higher frequencies (through 2 GHz) may wish to substitute lower value capacitors as 100 to 330 pF for Dc block, decoupling and bypass functions. In Figure 1, the bypass capac-itors C1-C4 should be placed as clost to the fl oating ground plane as possilbe to minimize ground inductance and maximize isolation. For broadband operation of this circuit, 10-2000 MHz, it is recommended that a com-bination of 0.01 uF capacitors (C2 & C4) and 100 pF capacitors (C1 & C3) be used bor the bypass function on the RF circuit ground.The bias pin, Vee, of the HMC182S14 must now be held to Vdc (DC ground) versus it’s normal non-fl oating bias of -5 to -6.5 Vdc. Direct connection to the HMC182S14 switch A & B control lines by the +5 Vdc biased 74HCT04 hex inverter (or any positive logic HCT TTL logic driver device) is now possible. Table I shows the truth table of the HMC182S14in positve bias operation for the fl oating ground cir-cuit topology of Figure 1.TABLE 1P R O D U C T A P P L I C A T I O N N O T E S16Notes:MMIC SWITCH DRIVER TECHNIQUES16P R O D U C T A P P L I C A T I O N N O T E SNotes:MMIC SWITCH DRIVER TECHNIQUES。

KTMicro FM 接收电路设计指导一、介绍我公司自成立以来推出多款FM接收芯片，鉴于不同的终端用户在使用中不能够发挥芯片的最佳性能，问题多出在PCB的布局及元器件的摆放没有最优化，故此制作本文档，本文档说明KTMicro公司FM接收系列IC产品的设计指导建议。

二、应用原理图首先我们从应用原理图的层次来说明IC的应用注意事项。

1.电源上：尽量靠近PIN9处放置一个电源滤波电容；尽量靠近PIN1处放置一个电源滤波电容，不小于104；2.I2C连线上需要串接R3,R4两颗1kΩ的电阻以便阻止其他控制系统的噪声及干扰信号通过I2C总线窜入FM接收电路中。

并且在做布线时需要将R3,R4靠近I2C的主控端，远离FM接收电路，如Figure1中标示；3.如果使用晶振，晶振的起振电容必须与晶振厂家提供的参数相匹配，晶振的负载电容CL与起振电容C0的关系如下：C0 = 2 * CL (1)在实际使用中由于PCB存在分布参数，各家的PCB的分布参数都不一样，所以起振电容必须在理论计算的基础上进行微调，以便达到最佳的效果和直通率。

4：RFIN输入端的建议天线端口接一个100NH的电感到地，绕线电感效果最好，但价格偏贵；一般使用的是叠层电感，请尽量选择Q值较高的使用4.在音频输出端需要串接两个较大的耦合电容，如Figure1中的C1，C2，KT系列的芯片音频输出可以直接驱动32欧姆以上的耳机，如果是驱动耳机等大负载器件，容值必须选在10uF以上，如果音频输出的后继接有放大器，而放大器的输入是高阻，则可以串接较小的电容。

耦合电容的大小取决于耦合电容与放大器输入阻抗或耳机阻抗形成的RC回路的时间常数能否满足用户对音频低频响应的需要。

5.PIN脚说明针对KT0830EG等，可是使用短天线功能，并有以下请注意a)PIN12:PWR_ON引脚可以直接悬空，IC内部有上拉电阻;b)PIN15:天线输入前端只需要安装一颗并联电感100NH即可；c)I2C内置上拉电阻，无需上拉电阻;6.参考时钟的输入电路当使用外部参考时钟（Reference Clock）输入来作为FM芯片的频率源时，参考时钟信号须从XTALP引脚输入，并在时钟输入电路中串接一个隔直电容C5(0.001uF)防止芯片的偏置电压差异影响到时钟源的起振或是准确度；三、layout注意事项强烈建议用户使用两层以上的印刷电路板，下面以两层板为例来说明FM Receiver 的layout要求。

安卓系统精简列表对照表，适用于大部分Android系统，大家请参考对照精简。

AirkanPhoneService 可删AntiSpam 可删AdupsFot.apk无线升级（可删）AdupsFotaReboot.apk重启升级操作（可删）ApplicationGuide.apk-应用程度指南（不可删）ApplicationsProvider.apk-应用程序存储服务（不可删）AtciService.apk--系统服务（不可删）Backup.apk 可删BackupRestoreConfirmation.apkGoogle邮箱的备份，可删BasicDreams.apk 4.2新增，休眠模式，不可删BatteryWarning.apk--电池警告（建议保留）Browser.apk-谷歌浏览器（可删）BugReport 可删Calculator.apk---计算器（可删）Calendar.apk日历（可删，换第三方日历）CalendarImporter.apk日历服务（同上）CalendarProvider.apk-日历存储（同上）CDS_INFO.apk--常见数据服务（不可删）CellBroadcastReceiver.apk小区广播（可删）CellConnService.apk---电话连接服务（不可删）CertInstaller.apk-证书安装，可删（亲测，没发现问题）Cit可删CloudService可删ChromeBookmarksSyncAdapter.apk-Google书签同步（可删）com.google.android.apps.docs.apk--云端硬盘（可删）com.google.android.apps.maps.apk-谷歌地图（可删）com.google.android.googlequicksearchbox.apk-Google搜索（可删）com.google.android.street.apk--街景视图（可删）Contacts.apk--通讯录/联系人（不可删）ContactsProvider.apk--通讯录/联系人数据存储服务（不可删）DataHubProvider.apk. 会导致流量红圈不可删DataTransfer.apk-备份与恢复（可删）DataUsageLockScreenClient.apk数据应用和锁定屏幕客户端（不可删）DefaultContainerService.apk-默认存储服务（不可删）DeskClock.apk闹钟，时钟（建议保留）DownloadProvider.apk 下载管理器，可删（删了就不能在谷歌电子市场和谷歌浏览器下载东西了，需要的留着）DownloadProviderUi.apk 下载内容，可删（同上）DrmProvider.apk 受DRM保护的内容的存储，可删（有DRM保护的东西就留着这个）Email.apk-电子邮件（可删）EngineerMode.apk--工程模式（不可删）EngineerModeSim.apksim卡工程模式（不可删）EventReceiver 翻译过来就是事件接收还是别删了这个网上没查到多少资料Exchange2.apk--消息协作服务（可删）Facelock---人脸解锁（可删）FactoryMode.apk工厂模式（不可删）FileManager.apk-文件管理（觉得无用可删）FM 可删FMRadio.apk-收音机（建议保留）FusedLocation.apk-GPS定位辅助文件（不可删）无限重启）Galaxy4.apk--动态壁纸黑洞（可删）Gallery2.apk--图库/相机（建议保留）GenieWidget.apk新闻和天气（可删）Gmail.apk--谷歌邮箱（可删）Gmail2.apk谷歌邮箱（可删）GmsCore.apkGoogleplay服务（可删）GoogleBackupTransport.apk--谷歌备份传输（可删）GoogleCalendarSyncAdapter.apk谷歌日历同步（可删）GoogleContactsSyncAdapter.apk谷歌联系人同步（可删）GoogleEars.apk--GooglePlay声音搜索（可删）GoogleFeedback.apk---谷歌电子市场反馈（可删）GoogleLoginService.apkGoogle账户管理（可删）GoogleOta.apk---谷歌系统升级（可删）GoogleOtaSysOper.apk---谷歌系级升级辅助操作（跟上面是一起的，可删）GoolePartnerSetup.apkGoole合作伙伴设置（可删）GoogleServicesFramework.apk-谷歌同步支持服务架构（可删）GoogleTTSGoogle文字转语音引擎（可删）HoloSpiralWallpaper.apk--壁纸（可删）HTMLViewer.apk查看本地网页（建议保留）HoloSpiralWallpaper 可删InputDevices.apk OTG功能需要的别删KeyChain.apk输入服务（不可删）密码管理--帐号切换、密码存储，建议保留LatinIME.apk-Android键盘（可删）Launcher2.apk---启动器(不可删，可替换)LiveWallpapers.apkAndroid动态壁纸（可删）LBESEC_MIUI.apk 这个是授权管理LBE安全大师MIUI系统专版的安装包可能会影响自带的root功能先不删LiveWallpapersPicker.apk-动态壁纸选择器(不要动态壁纸可删)LocationEM.apk工程师模式（不可删）Matcli 应该是自己装的第三方软件自动装进了系统app文件里吧网上也没详细说明还是别删了怕系统不稳定MagicSmokeWallpapers.apk魔幻动态壁纸（可删）mainkeys.apk虚拟按键开启/关闭（建议保留）MediaProvider.apk--媒体数据存储服务（不可删，删后无法设置铃声）MediaTekLocationProvider.apk-联发科定位存储（可删）MediaUploader.apk---上传的内容（建议保留）MiuiCompass.apk MIUI 指南针可删(可替代)MiuiGallery.apk MIUI 图库勿删MiuiHome.apk MIUI 启动器删之前必须在系统设置——全部设置——显示——默认桌面——自己选择好第三方桌面才行MiuiSystemUI.apk MIUI 系统用户界面勿删MiuiVideo 可删MiuiVideoPlayer 可删MiWallpaper 可删Mms.apk短信和彩信(可用第三方短信软件来代替) MTKAndroidSuiteDaemon.apk-联发科安卓套件精灵（可删）MtkBt.apk-MTK蓝牙（不可删）MTKLogger.apk--MTK移动日志记录器（可删）MTKThermalManager.apk联发科温度检测和管理（建议保留）MtkVideoLiveWallpaper.apk-MTK动态壁纸（可删）MtkWeatherProvider--天气服务（可删）MtkWeatherWidget.apk天气插件（不用系统天气软件的可删）MtkWorldClockWidget.apk-世界时钟插件（可删）Music.apk---音乐播放器（可删，可用第三方程序代替）MusicFX.apk-音乐播放器的音效均衡器（可删）mx86.apk-虚拟按键开启/关闭设置net.cactii.flash2.apk---手电筒（建议保留）Networkassistant.apk 自带流量监控可删NetworkLocation.apk提供网络位置(GPS辅助定位，不能删）NFC.apk 近距离无线通讯技术重要的新鲜的功能别删NoiseField.apk--泡沫动态壁纸（可删）NoteBook.apk---记事本（可删）Notes 小米便签可删nvcplsvc.apk 省电功能别删NvwfdProtocolsPack网上说是跟连接小米盒子有关系可删但还是别删吧网上搜索结果资料很少说明不详细怕不稳定NvwfdService同上还是别删吧Omacp.apk--手机内部配置信息（不可删）OneTimelnitializer.apk谷歌一次性备份恢复（可删）OOBE.apk设置向导（可删）PackageInstaller.apk---APK软件安装器（不可删）PhaseBeam.apk-动态壁纸光之韵律（可删）PhaseBeam.apk-动态壁纸雷光（可删）Phone.apk电话连接服务(不可删)Phonesky.apk谷歌电子商店（可删）PhotoT able.apk 互动屏保，可删（我删了，我不用那屏保）PicoTts.apk文字转语音服务（可删）Protips.apk桌面小绿人插件（可删）Provision.apk系统初始开机引导（不可删）QuickSearchBox.apk---快速搜素（可删）Ringdroid.apk铃声剪辑（可删）SchedulePiowerOnOff.apk定时开关机（建议保留）Settings.apk--系统设置(不可删）SettingsProvider.apk---设置储存（不可删）SetupWizard.apk设置向导（可删）SharedStorageBackup.apk 共享存储备份可删作用不大删了很多游戏就不能玩了SmartcardService.apk 智能卡服务作用大概和电脑的CPU一样，很重要还是别删sougoushurufa.apk--搜狗拼音输入法（可删，安装其它的）SoundRecorder.apk---录音机（建议保留）Stk1.apk卡1的stk开机提示服务（可删）Stk2.apk卡2的STK开机提示服务（可删）StkSelection.apk-SIM卡服务，就是移动和联通的服务（可删）SuperUser.apk---超级用户权限（建议保留）SystemUpdate.apk-安卓4.2.1系统文件（建议保留）tag.apk 据说是NFC近距离无线通信服务和ncf.apk有关的ncf删了的话tag也没用，就可以删了的和nfc一样还是别删了Talk.apk---谷歌语音信息服务（可删）Talkback.apk--系统设置-辅助功能里面的盲人补丁（可删）TaskManager2.apk-任务管理器（可删）TelephonyProvider.apk拨号记录存储服务（不可删）ThemeManager.apk MIUI 主题风格建议保留可删Todos.apk待办事项（可删）Torch.apk-手电筒（建议保留，也可换成别的手电筒）Transfer 快传软件可删Updater.apk MIUI 系统更新可删(影响在线升级)UpdateSystem.apk系统升级（可删）Userbook 用户手册可删UserbookProvider 用户手册存储可删UserDictionaryProvider.apk用户字典存储服务（可删）VideoEditor.apk电影工作室（可删）VideoFavorites.apk最爱联系人（可删）VideoPlayer.apk-视频播放器/视频壁纸选择器（可删）VisualizationWallpapers.apk---音乐可视化壁纸（可删）VoiceAssist 语音助手可删就是类似哦啦语音那种的VioceCommand.apk--声音指命/语音指挥官（可删）VoiceSearchStub.apk-语音搜索存根（可删）VoiceUnilck.apk语音解锁（可删）VpnDialogs.apk--拨号，公司内部登陆和翻墙用的（建议保留）WallpaperChooser.apk---壁纸（可删）XiaomiServiceFramework 可删小米服务框架kYGPS.apkGPS（不可删）YellowPage 不可删未存号码拨打删了就不能打还未保存的号码，只可以打名片夹里有名字的号码。

第版8.5Participant 用户指南法律声明♦本文档中的内容如有更改，恕不另行通知；这些内容亦不构成 AT&T Inc.之承诺。

♦本文档所叙述的软件与/或数据库按照许可协议或保密协议提供。

软件与/或数据库只允许按照协议进行使用或复制。

购买者可出于备份目的制作一份本软件的副本。

♦AT&T Connect Participant 应用程序整合了获得 DSP Algorithms 公司 () 许可的回声消除技术。

♦未经 AT&T Inc. 明确书面同意，不得出于购买者个人使用之外的任何目的，以任何形式或通过任何电子或机械手段（包括影印、录制或信息存储与检索系统）复制或传输本“用户指南”的任何部分。

♦除非另有说明，本文所含的所有公司、产品、街道地址以及人员的名称均纯属虚构，其用途仅限于介绍 AT&T Connect 产品的用法。

♦Windows 是 Microsoft Corporation 的商标。

所有其它商标属于各自的拥有者。

♦© 1996-2008 AT&T Inc. 版权所有。

保留所有权利。

目录第 1 章 (8)AT&T Connect Participant 应用程序简介 (8)会议中的主持人和与会人角色 (8)AT&T Connect 与 AT&T TeleConference Service 中的角色 (9)第 2 章 (10)安装AT&T Connect Participant 应用程序 (10)系统要求 (10)从 Web 进行 Participant 安装 (11)从光盘安装 (11)第 3 章 (12)开始使用AT&T Connect Participant 应用程序 (12)Participant 窗口 (12)状态面板 (13)开始页面 (14)第 508 部分符合性 (14)使用辅助菜单 (15)第 4 章 (18)召开 Web 会议 (18)邀请他人加入 Web 会议 (19)加入会议 (20)将 AT&T TeleConference Service 用于 Web 会议音频 (25)使用“呼我” (27)断开与重新连接事件 (28)第 5 章 (30)使用与会人工具 (30)使用表情 (30)使用便条 (31)发送便条 (32)回复/转发便条 (34)删除便条 (34)保存便条 (34)定义便条设置 (35)暂时离开事件 (36)扩展 Participant 窗口 (37)将音频静音/取消静音 (37)使用白板 (38)清除白板 (39)在显示器上指点 (39)在白板上书写 (40)在白板上绘制线条与形状 (40)在白板上绘制对号 (41)保存白板内容 (41)插入文件 (41)使用电子邮件邀请其他与会人 (43)响应问题与调查 (43)查看响应统计数据 (45)第 6 章 (46)演示人工具 (46)演示人权限 (46)传递演示人权限 (48)通过电话与拨出邀请 (48)链接与会人数据和音频流 (49)重命名与会人 (50)使用举手列表 (50)清除与会人 (51)启用广播模式 (52)查看事件材料的加载状态 (52)将文件加载到白板 (53)查看文件属性 (53)重新发送文件 (54)删除文件 (54)查看文件状态 (55)文件类型 (55)插入 PowerPoint 文件 (56)将插入的文件设置为在白板外部打开 (58)事件设置 (59)第 7 章 (60)高级演示人选项 (60)Web 会议中的应用程序共享 (60)与 Web 会议与会人共享应用程序 (60)使用“应用程序共享导航栏” (62)以“远程指导”方式共享应用程序 (65)定义应用程序共享设置 (65)定义输出带宽控制 (65)定义图像质量 (67)定义快捷键 (68)显示应用程序共享导航栏 (68)将 Participant 窗口定义成在“放大”模式中打开 (68)发起调查 (69)共享响应统计数据 (73)执行 Web 浏览 (73)第 8 章 (76)高级 Participant 应用程序选项 (76)概述 (76)定义用户界面语言 (77)定义连接协议/代理设置 (78)定义服务器设置 (79)第 9 章 (80)图标与状态消息 (80)工具栏图标 (80)状态消息 (80)与会人列表图标 (81)第 10 章 (84)Log Submission 实用程序 (LSU) (84)LSU 激活 (84)自动激活 (84)手工激活 (84)使用 LSU (85)发送报告 (85)发送操作失败时 (87)查看收集的数据（可选） (88)第 1 章 AT&T Connect Participant 应用程序简介AT&T Connect 借助可视化演示与互动方面的基于 PC 的工具，扩展了AT&T TeleConference Service (ATCS) 的语音会议功能。

3GPP TS 36.331 V13.2.0 (2016-06)Technical Specification3rd Generation Partnership Project;Technical Specification Group Radio Access Network;Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Resource Control (RRC);Protocol specification(Release 13)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2016, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationBluetooth® is a Trade Mark of the Bluetooth SIG registered for the benefit of its membersContentsForeword (18)1Scope (19)2References (19)3Definitions, symbols and abbreviations (22)3.1Definitions (22)3.2Abbreviations (24)4General (27)4.1Introduction (27)4.2Architecture (28)4.2.1UE states and state transitions including inter RAT (28)4.2.2Signalling radio bearers (29)4.3Services (30)4.3.1Services provided to upper layers (30)4.3.2Services expected from lower layers (30)4.4Functions (30)5Procedures (32)5.1General (32)5.1.1Introduction (32)5.1.2General requirements (32)5.2System information (33)5.2.1Introduction (33)5.2.1.1General (33)5.2.1.2Scheduling (34)5.2.1.2a Scheduling for NB-IoT (34)5.2.1.3System information validity and notification of changes (35)5.2.1.4Indication of ETWS notification (36)5.2.1.5Indication of CMAS notification (37)5.2.1.6Notification of EAB parameters change (37)5.2.1.7Access Barring parameters change in NB-IoT (37)5.2.2System information acquisition (38)5.2.2.1General (38)5.2.2.2Initiation (38)5.2.2.3System information required by the UE (38)5.2.2.4System information acquisition by the UE (39)5.2.2.5Essential system information missing (42)5.2.2.6Actions upon reception of the MasterInformationBlock message (42)5.2.2.7Actions upon reception of the SystemInformationBlockType1 message (42)5.2.2.8Actions upon reception of SystemInformation messages (44)5.2.2.9Actions upon reception of SystemInformationBlockType2 (44)5.2.2.10Actions upon reception of SystemInformationBlockType3 (45)5.2.2.11Actions upon reception of SystemInformationBlockType4 (45)5.2.2.12Actions upon reception of SystemInformationBlockType5 (45)5.2.2.13Actions upon reception of SystemInformationBlockType6 (45)5.2.2.14Actions upon reception of SystemInformationBlockType7 (45)5.2.2.15Actions upon reception of SystemInformationBlockType8 (45)5.2.2.16Actions upon reception of SystemInformationBlockType9 (46)5.2.2.17Actions upon reception of SystemInformationBlockType10 (46)5.2.2.18Actions upon reception of SystemInformationBlockType11 (46)5.2.2.19Actions upon reception of SystemInformationBlockType12 (47)5.2.2.20Actions upon reception of SystemInformationBlockType13 (48)5.2.2.21Actions upon reception of SystemInformationBlockType14 (48)5.2.2.22Actions upon reception of SystemInformationBlockType15 (48)5.2.2.23Actions upon reception of SystemInformationBlockType16 (48)5.2.2.24Actions upon reception of SystemInformationBlockType17 (48)5.2.2.25Actions upon reception of SystemInformationBlockType18 (48)5.2.2.26Actions upon reception of SystemInformationBlockType19 (49)5.2.3Acquisition of an SI message (49)5.2.3a Acquisition of an SI message by BL UE or UE in CE or a NB-IoT UE (50)5.3Connection control (50)5.3.1Introduction (50)5.3.1.1RRC connection control (50)5.3.1.2Security (52)5.3.1.2a RN security (53)5.3.1.3Connected mode mobility (53)5.3.1.4Connection control in NB-IoT (54)5.3.2Paging (55)5.3.2.1General (55)5.3.2.2Initiation (55)5.3.2.3Reception of the Paging message by the UE (55)5.3.3RRC connection establishment (56)5.3.3.1General (56)5.3.3.1a Conditions for establishing RRC Connection for sidelink communication/ discovery (58)5.3.3.2Initiation (59)5.3.3.3Actions related to transmission of RRCConnectionRequest message (63)5.3.3.3a Actions related to transmission of RRCConnectionResumeRequest message (64)5.3.3.4Reception of the RRCConnectionSetup by the UE (64)5.3.3.4a Reception of the RRCConnectionResume by the UE (66)5.3.3.5Cell re-selection while T300, T302, T303, T305, T306, or T308 is running (68)5.3.3.6T300 expiry (68)5.3.3.7T302, T303, T305, T306, or T308 expiry or stop (69)5.3.3.8Reception of the RRCConnectionReject by the UE (70)5.3.3.9Abortion of RRC connection establishment (71)5.3.3.10Handling of SSAC related parameters (71)5.3.3.11Access barring check (72)5.3.3.12EAB check (73)5.3.3.13Access barring check for ACDC (73)5.3.3.14Access Barring check for NB-IoT (74)5.3.4Initial security activation (75)5.3.4.1General (75)5.3.4.2Initiation (76)5.3.4.3Reception of the SecurityModeCommand by the UE (76)5.3.5RRC connection reconfiguration (77)5.3.5.1General (77)5.3.5.2Initiation (77)5.3.5.3Reception of an RRCConnectionReconfiguration not including the mobilityControlInfo by theUE (77)5.3.5.4Reception of an RRCConnectionReconfiguration including the mobilityControlInfo by the UE(handover) (79)5.3.5.5Reconfiguration failure (83)5.3.5.6T304 expiry (handover failure) (83)5.3.5.7Void (84)5.3.5.7a T307 expiry (SCG change failure) (84)5.3.5.8Radio Configuration involving full configuration option (84)5.3.6Counter check (86)5.3.6.1General (86)5.3.6.2Initiation (86)5.3.6.3Reception of the CounterCheck message by the UE (86)5.3.7RRC connection re-establishment (87)5.3.7.1General (87)5.3.7.2Initiation (87)5.3.7.3Actions following cell selection while T311 is running (88)5.3.7.4Actions related to transmission of RRCConnectionReestablishmentRequest message (89)5.3.7.5Reception of the RRCConnectionReestablishment by the UE (89)5.3.7.6T311 expiry (91)5.3.7.7T301 expiry or selected cell no longer suitable (91)5.3.7.8Reception of RRCConnectionReestablishmentReject by the UE (91)5.3.8RRC connection release (92)5.3.8.1General (92)5.3.8.2Initiation (92)5.3.8.3Reception of the RRCConnectionRelease by the UE (92)5.3.8.4T320 expiry (93)5.3.9RRC connection release requested by upper layers (93)5.3.9.1General (93)5.3.9.2Initiation (93)5.3.10Radio resource configuration (93)5.3.10.0General (93)5.3.10.1SRB addition/ modification (94)5.3.10.2DRB release (95)5.3.10.3DRB addition/ modification (95)5.3.10.3a1DC specific DRB addition or reconfiguration (96)5.3.10.3a2LWA specific DRB addition or reconfiguration (98)5.3.10.3a3LWIP specific DRB addition or reconfiguration (98)5.3.10.3a SCell release (99)5.3.10.3b SCell addition/ modification (99)5.3.10.3c PSCell addition or modification (99)5.3.10.4MAC main reconfiguration (99)5.3.10.5Semi-persistent scheduling reconfiguration (100)5.3.10.6Physical channel reconfiguration (100)5.3.10.7Radio Link Failure Timers and Constants reconfiguration (101)5.3.10.8Time domain measurement resource restriction for serving cell (101)5.3.10.9Other configuration (102)5.3.10.10SCG reconfiguration (103)5.3.10.11SCG dedicated resource configuration (104)5.3.10.12Reconfiguration SCG or split DRB by drb-ToAddModList (105)5.3.10.13Neighbour cell information reconfiguration (105)5.3.10.14Void (105)5.3.10.15Sidelink dedicated configuration (105)5.3.10.16T370 expiry (106)5.3.11Radio link failure related actions (107)5.3.11.1Detection of physical layer problems in RRC_CONNECTED (107)5.3.11.2Recovery of physical layer problems (107)5.3.11.3Detection of radio link failure (107)5.3.12UE actions upon leaving RRC_CONNECTED (109)5.3.13UE actions upon PUCCH/ SRS release request (110)5.3.14Proximity indication (110)5.3.14.1General (110)5.3.14.2Initiation (111)5.3.14.3Actions related to transmission of ProximityIndication message (111)5.3.15Void (111)5.4Inter-RAT mobility (111)5.4.1Introduction (111)5.4.2Handover to E-UTRA (112)5.4.2.1General (112)5.4.2.2Initiation (112)5.4.2.3Reception of the RRCConnectionReconfiguration by the UE (112)5.4.2.4Reconfiguration failure (114)5.4.2.5T304 expiry (handover to E-UTRA failure) (114)5.4.3Mobility from E-UTRA (114)5.4.3.1General (114)5.4.3.2Initiation (115)5.4.3.3Reception of the MobilityFromEUTRACommand by the UE (115)5.4.3.4Successful completion of the mobility from E-UTRA (116)5.4.3.5Mobility from E-UTRA failure (117)5.4.4Handover from E-UTRA preparation request (CDMA2000) (117)5.4.4.1General (117)5.4.4.2Initiation (118)5.4.4.3Reception of the HandoverFromEUTRAPreparationRequest by the UE (118)5.4.5UL handover preparation transfer (CDMA2000) (118)5.4.5.1General (118)5.4.5.2Initiation (118)5.4.5.3Actions related to transmission of the ULHandoverPreparationTransfer message (119)5.4.5.4Failure to deliver the ULHandoverPreparationTransfer message (119)5.4.6Inter-RAT cell change order to E-UTRAN (119)5.4.6.1General (119)5.4.6.2Initiation (119)5.4.6.3UE fails to complete an inter-RAT cell change order (119)5.5Measurements (120)5.5.1Introduction (120)5.5.2Measurement configuration (121)5.5.2.1General (121)5.5.2.2Measurement identity removal (122)5.5.2.2a Measurement identity autonomous removal (122)5.5.2.3Measurement identity addition/ modification (123)5.5.2.4Measurement object removal (124)5.5.2.5Measurement object addition/ modification (124)5.5.2.6Reporting configuration removal (126)5.5.2.7Reporting configuration addition/ modification (127)5.5.2.8Quantity configuration (127)5.5.2.9Measurement gap configuration (127)5.5.2.10Discovery signals measurement timing configuration (128)5.5.2.11RSSI measurement timing configuration (128)5.5.3Performing measurements (128)5.5.3.1General (128)5.5.3.2Layer 3 filtering (131)5.5.4Measurement report triggering (131)5.5.4.1General (131)5.5.4.2Event A1 (Serving becomes better than threshold) (135)5.5.4.3Event A2 (Serving becomes worse than threshold) (136)5.5.4.4Event A3 (Neighbour becomes offset better than PCell/ PSCell) (136)5.5.4.5Event A4 (Neighbour becomes better than threshold) (137)5.5.4.6Event A5 (PCell/ PSCell becomes worse than threshold1 and neighbour becomes better thanthreshold2) (138)5.5.4.6a Event A6 (Neighbour becomes offset better than SCell) (139)5.5.4.7Event B1 (Inter RAT neighbour becomes better than threshold) (139)5.5.4.8Event B2 (PCell becomes worse than threshold1 and inter RAT neighbour becomes better thanthreshold2) (140)5.5.4.9Event C1 (CSI-RS resource becomes better than threshold) (141)5.5.4.10Event C2 (CSI-RS resource becomes offset better than reference CSI-RS resource) (141)5.5.4.11Event W1 (WLAN becomes better than a threshold) (142)5.5.4.12Event W2 (All WLAN inside WLAN mobility set becomes worse than threshold1 and a WLANoutside WLAN mobility set becomes better than threshold2) (142)5.5.4.13Event W3 (All WLAN inside WLAN mobility set becomes worse than a threshold) (143)5.5.5Measurement reporting (144)5.5.6Measurement related actions (148)5.5.6.1Actions upon handover and re-establishment (148)5.5.6.2Speed dependant scaling of measurement related parameters (149)5.5.7Inter-frequency RSTD measurement indication (149)5.5.7.1General (149)5.5.7.2Initiation (150)5.5.7.3Actions related to transmission of InterFreqRSTDMeasurementIndication message (150)5.6Other (150)5.6.0General (150)5.6.1DL information transfer (151)5.6.1.1General (151)5.6.1.2Initiation (151)5.6.1.3Reception of the DLInformationTransfer by the UE (151)5.6.2UL information transfer (151)5.6.2.1General (151)5.6.2.2Initiation (151)5.6.2.3Actions related to transmission of ULInformationTransfer message (152)5.6.2.4Failure to deliver ULInformationTransfer message (152)5.6.3UE capability transfer (152)5.6.3.1General (152)5.6.3.2Initiation (153)5.6.3.3Reception of the UECapabilityEnquiry by the UE (153)5.6.4CSFB to 1x Parameter transfer (157)5.6.4.1General (157)5.6.4.2Initiation (157)5.6.4.3Actions related to transmission of CSFBParametersRequestCDMA2000 message (157)5.6.4.4Reception of the CSFBParametersResponseCDMA2000 message (157)5.6.5UE Information (158)5.6.5.1General (158)5.6.5.2Initiation (158)5.6.5.3Reception of the UEInformationRequest message (158)5.6.6 Logged Measurement Configuration (159)5.6.6.1General (159)5.6.6.2Initiation (160)5.6.6.3Reception of the LoggedMeasurementConfiguration by the UE (160)5.6.6.4T330 expiry (160)5.6.7 Release of Logged Measurement Configuration (160)5.6.7.1General (160)5.6.7.2Initiation (160)5.6.8 Measurements logging (161)5.6.8.1General (161)5.6.8.2Initiation (161)5.6.9In-device coexistence indication (163)5.6.9.1General (163)5.6.9.2Initiation (164)5.6.9.3Actions related to transmission of InDeviceCoexIndication message (164)5.6.10UE Assistance Information (165)5.6.10.1General (165)5.6.10.2Initiation (166)5.6.10.3Actions related to transmission of UEAssistanceInformation message (166)5.6.11 Mobility history information (166)5.6.11.1General (166)5.6.11.2Initiation (166)5.6.12RAN-assisted WLAN interworking (167)5.6.12.1General (167)5.6.12.2Dedicated WLAN offload configuration (167)5.6.12.3WLAN offload RAN evaluation (167)5.6.12.4T350 expiry or stop (167)5.6.12.5Cell selection/ re-selection while T350 is running (168)5.6.13SCG failure information (168)5.6.13.1General (168)5.6.13.2Initiation (168)5.6.13.3Actions related to transmission of SCGFailureInformation message (168)5.6.14LTE-WLAN Aggregation (169)5.6.14.1Introduction (169)5.6.14.2Reception of LWA configuration (169)5.6.14.3Release of LWA configuration (170)5.6.15WLAN connection management (170)5.6.15.1Introduction (170)5.6.15.2WLAN connection status reporting (170)5.6.15.2.1General (170)5.6.15.2.2Initiation (171)5.6.15.2.3Actions related to transmission of WLANConnectionStatusReport message (171)5.6.15.3T351 Expiry (WLAN connection attempt timeout) (171)5.6.15.4WLAN status monitoring (171)5.6.16RAN controlled LTE-WLAN interworking (172)5.6.16.1General (172)5.6.16.2WLAN traffic steering command (172)5.6.17LTE-WLAN aggregation with IPsec tunnel (173)5.6.17.1General (173)5.7Generic error handling (174)5.7.1General (174)5.7.2ASN.1 violation or encoding error (174)5.7.3Field set to a not comprehended value (174)5.7.4Mandatory field missing (174)5.7.5Not comprehended field (176)5.8MBMS (176)5.8.1Introduction (176)5.8.1.1General (176)5.8.1.2Scheduling (176)5.8.1.3MCCH information validity and notification of changes (176)5.8.2MCCH information acquisition (178)5.8.2.1General (178)5.8.2.2Initiation (178)5.8.2.3MCCH information acquisition by the UE (178)5.8.2.4Actions upon reception of the MBSFNAreaConfiguration message (178)5.8.2.5Actions upon reception of the MBMSCountingRequest message (179)5.8.3MBMS PTM radio bearer configuration (179)5.8.3.1General (179)5.8.3.2Initiation (179)5.8.3.3MRB establishment (179)5.8.3.4MRB release (179)5.8.4MBMS Counting Procedure (179)5.8.4.1General (179)5.8.4.2Initiation (180)5.8.4.3Reception of the MBMSCountingRequest message by the UE (180)5.8.5MBMS interest indication (181)5.8.5.1General (181)5.8.5.2Initiation (181)5.8.5.3Determine MBMS frequencies of interest (182)5.8.5.4Actions related to transmission of MBMSInterestIndication message (183)5.8a SC-PTM (183)5.8a.1Introduction (183)5.8a.1.1General (183)5.8a.1.2SC-MCCH scheduling (183)5.8a.1.3SC-MCCH information validity and notification of changes (183)5.8a.1.4Procedures (184)5.8a.2SC-MCCH information acquisition (184)5.8a.2.1General (184)5.8a.2.2Initiation (184)5.8a.2.3SC-MCCH information acquisition by the UE (184)5.8a.2.4Actions upon reception of the SCPTMConfiguration message (185)5.8a.3SC-PTM radio bearer configuration (185)5.8a.3.1General (185)5.8a.3.2Initiation (185)5.8a.3.3SC-MRB establishment (185)5.8a.3.4SC-MRB release (185)5.9RN procedures (186)5.9.1RN reconfiguration (186)5.9.1.1General (186)5.9.1.2Initiation (186)5.9.1.3Reception of the RNReconfiguration by the RN (186)5.10Sidelink (186)5.10.1Introduction (186)5.10.1a Conditions for sidelink communication operation (187)5.10.2Sidelink UE information (188)5.10.2.1General (188)5.10.2.2Initiation (189)5.10.2.3Actions related to transmission of SidelinkUEInformation message (193)5.10.3Sidelink communication monitoring (195)5.10.6Sidelink discovery announcement (198)5.10.6a Sidelink discovery announcement pool selection (201)5.10.6b Sidelink discovery announcement reference carrier selection (201)5.10.7Sidelink synchronisation information transmission (202)5.10.7.1General (202)5.10.7.2Initiation (203)5.10.7.3Transmission of SLSS (204)5.10.7.4Transmission of MasterInformationBlock-SL message (205)5.10.7.5Void (206)5.10.8Sidelink synchronisation reference (206)5.10.8.1General (206)5.10.8.2Selection and reselection of synchronisation reference UE (SyncRef UE) (206)5.10.9Sidelink common control information (207)5.10.9.1General (207)5.10.9.2Actions related to reception of MasterInformationBlock-SL message (207)5.10.10Sidelink relay UE operation (207)5.10.10.1General (207)5.10.10.2AS-conditions for relay related sidelink communication transmission by sidelink relay UE (207)5.10.10.3AS-conditions for relay PS related sidelink discovery transmission by sidelink relay UE (208)5.10.10.4Sidelink relay UE threshold conditions (208)5.10.11Sidelink remote UE operation (208)5.10.11.1General (208)5.10.11.2AS-conditions for relay related sidelink communication transmission by sidelink remote UE (208)5.10.11.3AS-conditions for relay PS related sidelink discovery transmission by sidelink remote UE (209)5.10.11.4Selection and reselection of sidelink relay UE (209)5.10.11.5Sidelink remote UE threshold conditions (210)6Protocol data units, formats and parameters (tabular & ASN.1) (210)6.1General (210)6.2RRC messages (212)6.2.1General message structure (212)–EUTRA-RRC-Definitions (212)–BCCH-BCH-Message (212)–BCCH-DL-SCH-Message (212)–BCCH-DL-SCH-Message-BR (213)–MCCH-Message (213)–PCCH-Message (213)–DL-CCCH-Message (214)–DL-DCCH-Message (214)–UL-CCCH-Message (214)–UL-DCCH-Message (215)–SC-MCCH-Message (215)6.2.2Message definitions (216)–CounterCheck (216)–CounterCheckResponse (217)–CSFBParametersRequestCDMA2000 (217)–CSFBParametersResponseCDMA2000 (218)–DLInformationTransfer (218)–HandoverFromEUTRAPreparationRequest (CDMA2000) (219)–InDeviceCoexIndication (220)–InterFreqRSTDMeasurementIndication (222)–LoggedMeasurementConfiguration (223)–MasterInformationBlock (225)–MBMSCountingRequest (226)–MBMSCountingResponse (226)–MBMSInterestIndication (227)–MBSFNAreaConfiguration (228)–MeasurementReport (228)–MobilityFromEUTRACommand (229)–Paging (232)–ProximityIndication (233)–RNReconfiguration (234)–RNReconfigurationComplete (234)–RRCConnectionReconfiguration (235)–RRCConnectionReconfigurationComplete (240)–RRCConnectionReestablishment (241)–RRCConnectionReestablishmentComplete (241)–RRCConnectionReestablishmentReject (242)–RRCConnectionReestablishmentRequest (243)–RRCConnectionReject (243)–RRCConnectionRelease (244)–RRCConnectionResume (248)–RRCConnectionResumeComplete (249)–RRCConnectionResumeRequest (250)–RRCConnectionRequest (250)–RRCConnectionSetup (251)–RRCConnectionSetupComplete (252)–SCGFailureInformation (253)–SCPTMConfiguration (254)–SecurityModeCommand (255)–SecurityModeComplete (255)–SecurityModeFailure (256)–SidelinkUEInformation (256)–SystemInformation (258)–SystemInformationBlockType1 (259)–UEAssistanceInformation (264)–UECapabilityEnquiry (265)–UECapabilityInformation (266)–UEInformationRequest (267)–UEInformationResponse (267)–ULHandoverPreparationTransfer (CDMA2000) (273)–ULInformationTransfer (274)–WLANConnectionStatusReport (274)6.3RRC information elements (275)6.3.1System information blocks (275)–SystemInformationBlockType2 (275)–SystemInformationBlockType3 (279)–SystemInformationBlockType4 (282)–SystemInformationBlockType5 (283)–SystemInformationBlockType6 (287)–SystemInformationBlockType7 (289)–SystemInformationBlockType8 (290)–SystemInformationBlockType9 (295)–SystemInformationBlockType10 (295)–SystemInformationBlockType11 (296)–SystemInformationBlockType12 (297)–SystemInformationBlockType13 (297)–SystemInformationBlockType14 (298)–SystemInformationBlockType15 (298)–SystemInformationBlockType16 (299)–SystemInformationBlockType17 (300)–SystemInformationBlockType18 (301)–SystemInformationBlockType19 (301)–SystemInformationBlockType20 (304)6.3.2Radio resource control information elements (304)–AntennaInfo (304)–AntennaInfoUL (306)–CQI-ReportConfig (307)–CQI-ReportPeriodicProcExtId (314)–CrossCarrierSchedulingConfig (314)–CSI-IM-Config (315)–CSI-IM-ConfigId (315)–CSI-RS-Config (317)–CSI-RS-ConfigEMIMO (318)–CSI-RS-ConfigNZP (319)–CSI-RS-ConfigNZPId (320)–CSI-RS-ConfigZP (321)–CSI-RS-ConfigZPId (321)–DMRS-Config (321)–DRB-Identity (322)–EPDCCH-Config (322)–EIMTA-MainConfig (324)–LogicalChannelConfig (325)–LWA-Configuration (326)–LWIP-Configuration (326)–RCLWI-Configuration (327)–MAC-MainConfig (327)–P-C-AndCBSR (332)–PDCCH-ConfigSCell (333)–PDCP-Config (334)–PDSCH-Config (337)–PDSCH-RE-MappingQCL-ConfigId (339)–PHICH-Config (339)–PhysicalConfigDedicated (339)–P-Max (344)–PRACH-Config (344)–PresenceAntennaPort1 (346)–PUCCH-Config (347)–PUSCH-Config (351)–RACH-ConfigCommon (355)–RACH-ConfigDedicated (357)–RadioResourceConfigCommon (358)–RadioResourceConfigDedicated (362)–RLC-Config (367)–RLF-TimersAndConstants (369)–RN-SubframeConfig (370)–SchedulingRequestConfig (371)–SoundingRS-UL-Config (372)–SPS-Config (375)–TDD-Config (376)–TimeAlignmentTimer (377)–TPC-PDCCH-Config (377)–TunnelConfigLWIP (378)–UplinkPowerControl (379)–WLAN-Id-List (382)–WLAN-MobilityConfig (382)6.3.3Security control information elements (382)–NextHopChainingCount (382)–SecurityAlgorithmConfig (383)–ShortMAC-I (383)6.3.4Mobility control information elements (383)–AdditionalSpectrumEmission (383)–ARFCN-ValueCDMA2000 (383)–ARFCN-ValueEUTRA (384)–ARFCN-ValueGERAN (384)–ARFCN-ValueUTRA (384)–BandclassCDMA2000 (384)–BandIndicatorGERAN (385)–CarrierFreqCDMA2000 (385)–CarrierFreqGERAN (385)–CellIndexList (387)–CellReselectionPriority (387)–CellSelectionInfoCE (387)–CellReselectionSubPriority (388)–CSFB-RegistrationParam1XRTT (388)–CellGlobalIdEUTRA (389)–CellGlobalIdUTRA (389)–CellGlobalIdGERAN (390)–CellGlobalIdCDMA2000 (390)–CellSelectionInfoNFreq (391)–CSG-Identity (391)–FreqBandIndicator (391)–MobilityControlInfo (391)–MobilityParametersCDMA2000 (1xRTT) (393)–MobilityStateParameters (394)–MultiBandInfoList (394)–NS-PmaxList (394)–PhysCellId (395)–PhysCellIdRange (395)–PhysCellIdRangeUTRA-FDDList (395)–PhysCellIdCDMA2000 (396)–PhysCellIdGERAN (396)–PhysCellIdUTRA-FDD (396)–PhysCellIdUTRA-TDD (396)–PLMN-Identity (397)–PLMN-IdentityList3 (397)–PreRegistrationInfoHRPD (397)–Q-QualMin (398)–Q-RxLevMin (398)–Q-OffsetRange (398)–Q-OffsetRangeInterRAT (399)–ReselectionThreshold (399)–ReselectionThresholdQ (399)–SCellIndex (399)–ServCellIndex (400)–SpeedStateScaleFactors (400)–SystemInfoListGERAN (400)–SystemTimeInfoCDMA2000 (401)–TrackingAreaCode (401)–T-Reselection (402)–T-ReselectionEUTRA-CE (402)6.3.5Measurement information elements (402)–AllowedMeasBandwidth (402)–CSI-RSRP-Range (402)–Hysteresis (402)–LocationInfo (403)–MBSFN-RSRQ-Range (403)–MeasConfig (404)–MeasDS-Config (405)–MeasGapConfig (406)–MeasId (407)–MeasIdToAddModList (407)–MeasObjectCDMA2000 (408)–MeasObjectEUTRA (408)–MeasObjectGERAN (412)–MeasObjectId (412)–MeasObjectToAddModList (412)–MeasObjectUTRA (413)–ReportConfigEUTRA (422)–ReportConfigId (425)–ReportConfigInterRAT (425)–ReportConfigToAddModList (428)–ReportInterval (429)–RSRP-Range (429)–RSRQ-Range (430)–RSRQ-Type (430)–RS-SINR-Range (430)–RSSI-Range-r13 (431)–TimeToTrigger (431)–UL-DelayConfig (431)–WLAN-CarrierInfo (431)–WLAN-RSSI-Range (432)–WLAN-Status (432)6.3.6Other information elements (433)–AbsoluteTimeInfo (433)–AreaConfiguration (433)–C-RNTI (433)–DedicatedInfoCDMA2000 (434)–DedicatedInfoNAS (434)–FilterCoefficient (434)–LoggingDuration (434)–LoggingInterval (435)–MeasSubframePattern (435)–MMEC (435)–NeighCellConfig (435)–OtherConfig (436)–RAND-CDMA2000 (1xRTT) (437)–RAT-Type (437)–ResumeIdentity (437)–RRC-TransactionIdentifier (438)–S-TMSI (438)–TraceReference (438)–UE-CapabilityRAT-ContainerList (438)–UE-EUTRA-Capability (439)–UE-RadioPagingInfo (469)–UE-TimersAndConstants (469)–VisitedCellInfoList (470)–WLAN-OffloadConfig (470)6.3.7MBMS information elements (472)–MBMS-NotificationConfig (472)–MBMS-ServiceList (473)–MBSFN-AreaId (473)–MBSFN-AreaInfoList (473)–MBSFN-SubframeConfig (474)–PMCH-InfoList (475)6.3.7a SC-PTM information elements (476)–SC-MTCH-InfoList (476)–SCPTM-NeighbourCellList (478)6.3.8Sidelink information elements (478)–SL-CommConfig (478)–SL-CommResourcePool (479)–SL-CP-Len (480)–SL-DiscConfig (481)–SL-DiscResourcePool (483)–SL-DiscTxPowerInfo (485)–SL-GapConfig (485)。

3Content1 Getting started.......................................................................................................4 2 Power supply .........................................................................................................5 3 Onboard network concept.....................................................................................5 4 Technical data........................................................................................................6 5 Inputs and Outputs................................................................................................8 5.1 Input Channels. (8)5.1.1 Analog Inputs.................................................................................................................8 5.1.2 Digital Inputs.................................................................................................................8 5.2 Output Channels . (8)5.2.1 PWM Output..................................................................................................................8 5.2.2 Sensor power supply.....................................................................................................8 5.3 Communication Channels .. (8)5.3.1 CAN Bus.........................................................................................................................8 5.3.2 Ethernet Channels.........................................................................................................8 5.3.3 RS232 Ports ..................................................................................................................9 5.3.4 Vehicle Diagnosis Connector.........................................................................................9 5.4 Sensor recommendation Clubsport ........................................................................10 5.5 Sensor recommendation Professional ....................................................................12 5.6 Pin Layout Life Connector.......................................................................................14 5.7 Pin Layout Sensor Connector..................................................................................15 6 Mechanical drawing.............................................................................................16 7 Starting up the C 60.............................................................................................17 7.1 Start-Up...................................................................................................................18 7.2 Feature activation....................................................................................................29 7.3 My first recording....................................................................................................34 8 Details of the C 60...............................................................................................45 8.1 CAN-Bus...................................................................................................................46 8.2 Analog and Frequency.............................................................................................69 8.3 Online measurement.............................................................................................102 8.4 Recording and Telemetry ......................................................................................131 8.5 Lap Trigger ............................................................................................................161 8.6 Firmware ...............................................................................................................182 8.7 GPS .......................................................................................................................188 8.8 Fuel Consumption. (194)1 Getting startedImportant Notes:Use the C 60 only as intended in this manual. Any maintenance or repair must be performed by authorized and qualified personnel approved by Bosch Motorsport.Operation of the C 60 is only certified with the combinations and accessories that are specified in this manual. The use of variant combinations, accessories, and other devices outside the scope of this manual are only permitted when they have been determined to be compliant from a performance and safety standpoint by a representative from Bosch Motorsport.For systems with drive-by-wire additional safety provisions apply. For details please refer to the document …Safety Instructions for Drive-by-Wire Systems in Motorsport Applications“.Disclaimer:Due to continuous enhancements we reserve the rights to change any illustrations, photos and technical data within this manual.Please retain this manual for your records.Edition: 07 February 2011Before starting:Before operating the C 60 for the first time, install the complete software from the installation CD. Bosch Motorsport software is developed for Windows 2000/XP. Connect the Ethernet line to your computer and install the driver. Read the manual carefully and follow the application hints step by step. Don’t hesitate to contact us, contact data can be found on the last page of this document. 42Power supplyPlease ensure that you have a good ground installation. That means:∙ A ground that has a solid, low resistance connection to the negative battery terminal.∙Connection should be free from dirt, grease, paint, anodizing, etc.∙Use large diameter wire∙More metal-to-metal contact is better!The following notations for power signals are used:∙term15 is a switched battery rail controlled by the IGN-switch∙term30 is an unswitched battery positive rail (same as battery positive terminal)∙term31 is an unswitched ground rail (same as battery negative terminal)Be careful to observe current limits of wires and connector pins!3Onboard network concept56 4 Technical dataThe Data Logger C 60 is a compact and lightweight data logging system for motorsport applications. This allows for synchronized acquisition of engine data from the ECU, and chassis data from up to 26 analog and 4 digital input channels. Additional input devices can be connected via Ethernet and CAN buses.Recorded data from the internal 2 GB flashmemory can be downloaded via high speed Ethernet or via wireless connection with the BT 60 burst telemetry system.As a base system the C 60 is sold as data logger only. A software upgrade for the C 60(field upgradable by entering a key) activates additional input channels. Application8 kHz AD converters with digital low pass filter Configurable math channelsUser configurable CAN in/out messages Up to 1,000 Hz acquisition rate for all channels 2 GB storage capacity Online data compressionUp to 200 KB/s data acquisition rate Up to 720 recording channels 1,000 KB/s upload rate 3-port network switchBT 60 WLAN burst telemetry supportConnectorsAutosport connectors double density 2 x 41 pinMating connector I AS DD 6-12-41SN F 02U 002 216-01Mating connector II AS DD 6-12-41SAF 02U 004 180-01Mechanical DataSize105 x 34.5 x 137.5 (149) mmWeight 465 g Dust and splashwater proof aluminium housing Operating temperature (internal)-20 … +65 °CMax. vibration Vibration profile 1 (see Appendix or )SoftwareConfiguration via RaceCon over Ethernet or MSA-Box IIPart NumberData Logger C 60[1] F 02U V00 553-01Software Upgrade 1 [2] F 02U V00 703-01additional analog channels and second connector unlocked7C 60 Feature ListC 60 Base LoggerSoftware Upgrade 1Application Storage capacityBT 60 burst telemetry support FM 40 long range telemetry support GPS input Electrical Data Supply voltageMax. power consumption (w/o loads) InputsTotal analog channels Input rangeResolution Switchable pull up resistorRotational channels (Input Hall/Inductive) OutputsPWM outputs (low side switch 2 A each)Sensor supply 5 V (350 mA each) Sensor supply 10 V (350 mA each) Sensor supply 12 V (1 A non regulated) Communication interfaces CAN interfaces Ethernet 100BaseTRS232 Laptrigger input2 GB • • - 8 … 18 V 10 W at 14 V6 0 … 5 V12 bit 3 k Ω - 4 1 - - 2 3Telemetry 12 GB • • • 8 … 18 V 10 W at 14 V26 0 … 5 V 12 bit 3 k Ω 4 4 4 1 1 2 3GPS 15Inputs and Outputs5.1Input Channels5.1.1Analog InputsThe C 60 analog inputs accept an input signal of 0 to 5 V. A 3.01 kOhm pull-up resistor can be activated by software.5.1.2Digital InputsThe digital input of the C 60 accept 0 V to 5 V signals of Hall-effect sensors by default. Connect the output of the Hall-effect sensor to the REVn_P pin and leave the REVn_M pin open. Support of inductive speed sensors is available as a hardware option. Inductive sensors are connected to the REVn_P and REVn_M pins.5.2Output Channels5.2.1PWM OutputThe C 60 has 4 low side switch outputs controlled by pulse width modulation (PWM). Each switch is rated 2 A max current. Maximum PWM switch frequency is 8 kHz with a 0 % to 100 % duty cycle. Each output is short circuit protected to GND and battery volatage. It is mandatory to connect the LS_PWM pins to vehicle GND as indicated in the circuit diagram when using the PWM outputs. 5.2.2Sensor power supplyThe C 60 has three types of sensor power supply: 12 V unregulated battery voltage, 5 V and 10 V regulated voltage. The 12 V unregulated output is fused and rated 1 A max. The regulated 5 V and 10 V outputs can deliver 350 mA each. They are short circuit protected to battery voltage and GND.5.3Communication Channels5.3.1CAN BusThe C 60 has 2 CAN buses configurable as input and output. Different baud rates are selectable. Please note that the C 60 does not contain any CAN termination resistors. Thus the CAN termination restors need to be integrated into the wiring loom.5.3.2Ethernet ChannelsThe C 60 has three 100 MBit full duplex Ethernet communication ports. The ports are internally connected with an Ethernet switch. The ethernet ports have 'cable auto crossover' functionality.85.3.3RS232 PortsThe C 60 has two RS232 serial ports. Baudrate for both ports is programmable. RS232 port 1 is reserved for online telemetry, port 2 can be used for reception of data from a serial GPS receiver.5.3.4Vehicle Diagnosis ConnectorThe Bosch Motorsport vehicle diagnosis connector is used as a standard interface to connect the vehicle to a PC e.g. via a MSA-Box II. Loom connector: AS 0-12-35SNPin Name Description Used for C 60 Pin 1 Terminal 30 Permanent positive +Pin 2 Terminal 15 Switched positive +Pin 3 Terminal 31 GND +Pin 4 CAN High Diagnostic CAN busPin 16 CAN Low Diagnostic CAN busPin 10 K-Line ECU diagnosisPin 8 Ethernet RxD + Ethernet interface +Pin 9 Ethernet RxD - Ethernet interface +Pin 11 Ethernet TxD + Ethernet interface +Pin 12 Ethernet TxD - Ethernet interface +Pin 22 Screen Cable screen +9105.4 Sensor recommendation ClubsportThe sensors shown on this page are partly based on production type parts and proved hundreds oftimes in races all over the world. They offer good value for money.NTC M12-LNTC M12-HTCP-NFPSA-CPSS-10DP-CPTMini-HA-PRP 86LP 50WP 100RP 308RHSAM 600-3YRS 3Model Range of applicationNTC_M12-L Ambient air temperature11125.5 Sensor recommendation ProfessionalA lot of the sensors shown on this page are developed for high end applications. You can find moremotorsports sensors at NTC M8-HSTCP-NFTI-100PSA-CPSC-10PSB-4Mini-HA-PHA-MRP 100LP 50DP-CPTRHSAM 600-3YRS 3Model Range of application Connector Loom Part No. NTC M8-HS Fluid temperature (oil, water, fuel) ASL 0-06-05SN-HE F 02U V00 509TCP-NF Exhaust gas temperature D261 205 357 B 261 209 825T-100 Brake disk and tire temperature ASL 0-06-05SD-HE F 01T A21 210 PSA-C Ambient air pressure D 261 205 289 0 261 230 037PSC-10 Fluid pressure (oil, water, fuel) ASL 0-06-05SC-HE F 01T A21 304PSB-4 Air pressure (manifold, boost) ASL-0-06-05SC-HE B 261 209 348Mini-HA-P Wheel speed D 261 205 335 F 02U V00 566HA-M Wheel speed ASL 0-06-05SN-HE F 02U V00 227_01 RP 100 Rotary movement ASL 0-06-05SA-HE B 261 209 127LP 50 Linear movement KPSE 0E8-33S-DN B 261 209 133DP-C Air speed ASL 0-06-05SC-HE B 261 209 701PT Pitot static tube B 261 209 700RHS Vehicle ride height ASL 0-06-05SD-HE B 261 209 674AM 600-3 Acceleration ASL 0-06-05SA-HE B 261 209 313-01 YRS 3 Yaw rate F 02U B00 435-01 0 265 005 8381314 5.6 Pin Layout Life ConnectorLife Connector ASDD-2-12-41PN (Red) Pin NameDescriptionDirectionRemark1 UBATTpower supply Ubatinput 2 switched positive Kl.15 switched power supply Ubat input 3 switched positive Kl.15 switched power supply Ubat input 4 unit ground ground power supply input 5 unit ground ground power supplyinput 6 7 8 9 ETH1_TX+ ETH1_TX- ETH1_RX+ ETH1_RX- Ethernet interface 1 (10/100BaseT)bidirectional dataline 10 ETH_SCR screen for Ethernetscreen 11 12 13 14 ETH2_TX+ ETH2_TX- ETH2_RX+ ETH2_RX-Ethernet interface 2 (10/100BaseT)bidirectional dataline15 16 17 18 ETH3_TX+ ETH3_TX- ETH3_RX+ ETH3_RX- Ethernet interface 3 (10/100BaseT)bidirectional dataline19 20 CAN1_H CAN1_L CAN interface 1 (upto 1 MBit/s)bidirectional dataline MS 3/MS 4 CardMemory 21 22 CAN2_H CAN2_L CAN interface 2 (upto 1 MBit/s) bidirectional dataline 23 not connected unused spare do not connect 24 not connected unused spare do not connect 25 not connected unused spare do not connect 26 not connected unusedspare do not connect 27 SENSPWR5_1 5 V power supply for analog sensors output28 SENSGND_1 sensor ground 1output29 TimeSyncsignal of synchronisationinout used for timing of system components 30 LS_GND_1 PWM groundoutput 31 LS_SWITCH_1 PWM lowside switch 1 input 32 LS_SWITCH_2 PWM lowside switch 2 input 33 LS_SWITCH_3 PWM lowside switch 3 input 34 LS_SWITCH_4 PWM lowside switch 4 input 35 LS_GND_2 PWM ground output 36 ANA01 analog signal 1 input 37 ANA02 analog signal 2 input 38 ANA03 analog signal 3 input 39 ANA04 analog signal 4 input 40 ANA05 analog signal 5 input 41ANA06analog signal 6input155.7 Pin Layout Sensor ConnectorSensor Connector ASDD-2-12-41PA (Yellow) PinNameDescriptionDirectionRemark1 UBATT_FUSE1 battery voltage supplyoutput 2 SENSPWR10_1 10 V power supply for analog sensors output 3 SENSPWR5_2 5 V power supply for analog sensors output 4 SENSPWR5_3 5 V power supply for analog sensors output 5 SENSPWR5_4 5 V power supply for analog sensors output 6 SENSGND_2 sensor ground 2 output 7 SENSGND_3 sensor ground 3 output8 9 RS232_1_TX RS232_1_RX RS232_1 transmit data RS232_1 receive data bidirectional dataline used fortelemetry link 10 11 RS232_2_TX RS232_2_RX RS232_2 transmit data RS232_2 receive data bidirectional dataline used for GPS-sensor 12 RS232_GND RS232 ground13 14 REV1_P REV1_M speed signal 1 positive (ind. and hall) speed signal 1 negative (ind.)input 15 16 REV2_P REV2_M speed signal 2 positive (ind. and hall) speed signal 2 negative (ind.)input 17 18 REV3_P REV3_M speed signal 3 positive (ind. and hall) speed signal 3 negative (ind.)input 19 20 REV4_P REV4_M speed signal 4 positive (ind. and hall) speed signal 4 negative (ind.) input 21 ANA07 analog signal 7 input 22 ANA08 analog signal 8 input 23 ANA09 analog signal 9 input 24 ANA10 analog signal 10 input 25 ANA11 analog signal 11 input 26 ANA12 analog signal 12 input 27 ANA13 analog signal 13 input 28 ANA14 analog signal 14 input 29 ANA15 analog signal 15 input 30 ANA16 analog signal 16 input 31 ANA17 analog signal 17 input 32 ANA18 analog signal 18 input 33 ANA19 analog signal 19 input 34 ANA20 analog signal 20 input 35 ANA21 analog signal 21 input 36 ANA22 analog signal 22 input 37 ANA23 analog signal 23 input 38 ANA24 analog signal 24 input 39 ANA25 analog signal 25 input 40 ANA26 analog signal 26 input 41LAP_TRIGlaptrigger inputinput。

Using S32K148 QuadSPI Moduleby: NXP Semiconductors1.IntroductionThis application note describes the QuadSPI module onthe S32K148 devices. It provides a description of howthe module is implemented on these devices,specifically focusing on setting up LUT sequences,using commands to interface with an external memoryand using the AHB interface. More details about theQuadSPI module can be found in the devices respectivereference manual.The application note is supported by two softwareexamples, a bare metal example code and an SDKexample. The bare metal example can be found in theattached zip file, while the SDK example is part of theSDK release. 2. QuadSPI protocolQuad Serial Peripheral Interface (QuadSPI) is acommunications protocol used for communicationsbetween a microcontroller and external flash memory. Itis based on the popular Serial Peripheral Interface (SPI).Whereas an SPI makes use of up to four connections –Data In, Data Out, Clock, and Chip Select (used tosignify that a transmit or receive is active) – QuadSPIuses Clock, up to six Chip Select channels, and up tofour bi-directional data channels. This extraconnectivity allows for data to be read from the flash ina prompt manner, making QuadSPI an excellent choicefor using additional off-chip memoryNXP SemiconductorsDocument Number: AN12193 Application Notes Rev. 0 , 05/2018 Contents 1.Introduction ........................................................................ 12.QuadSPI protocol ............................................................... 13.S32Kxxx QuadSPI implementation ................................... 23.1.Side A and Side B ................................................... 24.Look-up Table (LUT) Functionality .................................. 35.Peripheral bus (Commands) interface ................................ 56.AHB Interface .................................................................... 87.Software Example .............................................................. 98.Reference (9)S32K148 QuadSPI implementationDue to the smaller number of pins, requests for reads/writes/erases are carried out by sending commands across the bus. For example, to read data from flash memory the “Read Data (0xEB)” command is sent, followed by the 24-bit address to be read. The data is then sent to the microcontroller. The figure below shows a typical read instruction using four data lines.Figure 1. Read command (QuadSPI frame)There are several suppliers of QuadSPI-compatible memory, such as Winbond, Spansion, Macronix, and Numonyx. The examples provided in this application note will focus on the Macronix devices as the external memory populated on the S32K148 EVB is a Macronix chip. Like SPI before it, QuadSPI does not adhere to a set standard, but as a rule different manufacturers’ devices interface via a similar command set.3. S32K148 QuadSPI implementationThe following section will describe a couple of features of the QuadSPI module that only applies on the S32K148 due to the way It was implemented on these3.1. Side A and side BThe QuadSPI module is divided into two “sides.” A and B, mainly due to the limited amount of high speed pads available in the device, each side has its advantages and disadvantages so it is up to the application to select between them.The main advantage of side A is speed, it supports up to 80 MHz. However, it does not support DDR, neither Hyperbus functionality.Using S32K148 QuadSPI Module, Rev. 0, 05/20182NXP SemiconductorsLook-up Table (LUT) functionality On the other hand, Side B operates slower, up to 20 MHz, but it does support DDR and Hyperbus protocol for HyperRAM devices.It is important to clarify that even though there are two “sides” of the QuadSPI module, It does not mean that it can be implemented as if there were two separate instances of the QuadSPI module. One side can only be used at the same time.Figure 2. S32K148 Pinout: QuadSPI module side A and side B4. Look-up Table (LUT) functionalityThe Look-up table also known as LUT is the mechanism used by the QuadSPI module to communicate with the external memory. It is used for either sending commands, reading, writing or waiting. This device consists of a total of 64 LUT register, and these 64 registers are divided into groups of four registers that make a valid sequence. Therefore, QSPI_LUT[0], QSPI_LUT[4], QSPI_LUT[8] till QSPI_LUT[60] are the starting registers of a valid sequence.The following table lists some of the most common commands for LUT operations. For the complete list go to Table 34-14 Instruction set of reference manual:Table 1. Common LUT commandsCommand Coding (6 bits)CMD 0x01ADDR 0x02DUMMY 0x03MODE 0x04Using S32K148 QuadSPI Module, Rev. 0, 05/2018NXP Semiconductors 3Look-up Table (LUT) functionalityCommand Coding (6 bits)READ 0x07WRITE 0x08STOP 0x00As a safety mechanism, the LUT table is locked by default. Therefore, the first step to start using the LUT is to unlock it. To unlock it, the key must be written into the LUTKEY register. The key value is 0x5AF05AF0, then a value of 0x02 must be written into the Lock configuration register. The LUT must be unlocked at this point. The following code snip shows how this looks on the S32K148 device.Figure 3. Unlock LUT codeOnce the LUT has been unlocked the user can modify the LUT sequences having in consideration that QSPI_LUT[0], QSPI_LUT[4], QSPI_LUT[8] till QSPI_LUT[60] are the starting registers of a valid sequence. Some of the features of the look-up table are:•Each instruction-operand unit is 16-bit wide. However, LUT registers are 32-bit wide, so two instructions can be placed within each LUT register.•Depending on the complexity of the QSPI transaction, a sequence may consist of a single instruction-operand set or several of them.Each LUT instruction-operand has the following structure:Figure 4. LUT operand structureWhere the INSTR field represents the LUT commands presented previously in Table 1, the PADs field represents the amount of data lines used by the command and the operand field varies depending on the INSTR used, this can be found in Table 34-14 Instruction set of reference manual.For example, having the value 0x1C08. If viewed as binary the value is 0b0001110000001000. If we divide it into the different fields:INSTR PADs OPERAND0 0 0 1 1 1 0 0 0 0 0 0 1 0 0 0 INSTR = 0x07 (Read)Using S32K148 QuadSPI Module, Rev. 0, 05/20184NXP SemiconductorsPeripheral bus (commands) interfacePADs = 0x00 (1 PAD)OPERAND = 0x08 (8 bytes)When this sequence is launch the module will read 8 bytes of data through 1 data line.Once all the LUT sequences had been filled the LUT table must be locked again. The sequence to locking down the LUT is very similar to unlocking it. The key must be written into the LUTKEY register. The key value is 0x5AF05AF0, then a value of 0x01 must be written into the Lock configuration register. The following code snip shows how this looks on the S32K148 device.Figure 5. Lock LUT code5. Peripheral bus (commands) interfaceThe QSPI module offer two different paths to communicate with an external memory Peripheral Bus (left side of the figure below) or AHB bus (left side of the figure below). In this section the Pheripheral Bus interface will be explained in more detail.Figure 6. QSPI block diagramUsing S32K148 QuadSPI Module, Rev. 0, 05/2018NXP Semiconductors 5Peripheral bus (commands) interfaceIf they user wants to write, erase or change the configuration of the external memory the only option is the Peripheral bus interface. It uses the LUT table sequences to communicate with the external memory. Once the LUT table has been filled out with the required LUT sequences the user can simple launch the desired sequence. For example, suppose that the LUT is filled out as the following figure:SEQ0Read Memory StatusSEQ1Erase SectorSEQ2Write Page…Figure 7. Example LUTSequence 0 contains the necessary commands to read the status of the memory, sequence 1 the necessary commands to erase a selected sector, and the sequence 2 the necessary commands to write the whole page of the memory. If for example, the user would like to erase one sector of the memory, it would be as simple of calling out the sequence 1 of the LUT as many times as the application needs. The following code snip exemplifies how simple is to call out a sequence of the LUT table.Figure 8. Launch LUT sequence codeEven tough launching a LUT sequence will execute the necessary commands to communicate with the memory, some actions such as reading or writing require the use of other registers to correctly receive or send the data. For example, when reading the MCU stores the data in an internal data buffer accessed through the RBDR[0-31] registers, it also requires the user specify the address to be read in the SFAR register and clearing up the CLR_RXF flag. The following code snip shows a function that is able to read a configurable amount of bytes from an specified address.Using S32K148 QuadSPI Module, Rev. 0, 05/20186NXP SemiconductorsPeripheral bus (commands) interfaceFigure 9. QuadSPI read codeSimilar considerations apply for writing data. User must first full a buffer of data, which is then send to the external memory depending on the amount of data specified in the command. The buffer is filled out through the TBDR[0-31] registers. Just as the read sequence, user must specify the address to be written to in the SFAR register. The following snip of code shows a write routine.Figure 10. QuadSPI page program codeUsing S32K148 QuadSPI Module, Rev. 0, 05/2018NXP Semiconductors 7AHB interface6. AHB interfaceThe AHB block diagram is shown in the right side of Figure 6. Differently from the Peripheral Bus Access, the AHB interface only allows read operations. However, the main advantage of the AHB access is that it allows to see the external memory as if it was mapped to an internal memory address of the device, meaning that the user does not need to perform any LUT sequence launch. In the S32K148, the QuadSPI AHB region is 128 MB long, it is mapped to starting address 0x68000000. For example, if the user tries to access address 0x000000 of the memory using peripheral bus access, then a certain LUT sequence would need to be launched and the user would need to read the Rx buffer of QuadSPI to get the data. On the other hand, when using AHB the user could simply access memory address 0x68000000 (start address for QuadSPI) and get the data. The following figure shows the memory accessed through the debugger after the QuadSPI was programmed with some data, as it can be noticed, the data is read as internal memory.Figure 11. QuadSPI memory regionAHB access uses LUT sequence 0 as its default read sequence. Therefore, user must make sure to program sequence 0 with a valid read command before trying to use AHB access, by default sequence 0 is programmed with typical values for a simple (one data line) read.Using S32K148 QuadSPI Module, Rev. 0, 05/20188NXP SemiconductorsIt is important to notice that data read from external memory would be accessed significantly slower than from internal memory, due to the following factors:•Data from external memory is retrieved at the QuadSPI clock frequency, while the internal data is accessed at core frequency.•Internal memory data is within cache range, QuadSPI region is not.•QuadSPI AHB buffer can be configured up to 4 KB, accessing data outside those 4 KB will require the QuadSPI to retrieve data from external memory, increasing the delay.Another benefit of using AHB access is that it allows the execution of code from external memory, considering that it would be significantly slower as stated above.7. Software exampleThis application note is accompanied by software. The software project can be open in the S32DS and runs over the S32K148 EVB using the MX25L6433F external memory available on the board. The example uses routines for both types of accesses, AHB and peripheral bus, it programs the external memory with a pre-compiled application and verifies that it was correctly written by reading it, both actions using peripheral bus access. Once it was verified, the program executes the application using AHB access. The application is a simple red LED toggling.8. Reference•AN5412, Quad Serial Peripheral Interface (QuadSPI) Module Updates•AN4186, Using the QuadSPI Module on MPC56XXS•AN5244, How to use QuadSPI on KL8x SeriesUsing S32K148 QuadSPI Module, Rev. 0, 05/2018NXP Semiconductors 9Document Number: AN12193 Rev. 0 05/2018 How to Reach Us: Home Page: Web Support: /support Information in this document is provided solely to enable system and software implementers to use NXP products. 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KT0803L常见问题解答1 KT0803L相比于KT0803K、KT0803M有什么改进？ (2)2 KT0803L和KT0803K、KT0803M硬件上兼容吗？ (2)3 KT0803L和KT0803K、KT0803M软件上兼容吗？ (2)4 什么是Reference Clock？ (2)5 KT0803L如何选择不同频率的晶体或Reference clock作为系统时钟？ (2)6 KT0803L和KT0803K、KT0803M的默认频率是否相同吗？ (3)7 KT0803L的ALC功能如何使用？ (3)8 KT0803L的Silence Detection功能如何使用？ (3)9 如何设置FM的发射频率？ (4)10 I2C接口中的SCL和SDA两个引脚是否需要上拉电阻？ (4)11 MCU与KT0803L的I2C接口如何设置？ (4)12 KT0803L如何进入待机（Standby）模式？ (4)13 KT0803L如何实现重低音加强的功能？ (4)14 KT0803L的参考设计是什么样的？ (5)15 PCB版图有什么需要注意的？ (5)1 KT0803L相比于KT0803K、KT0803M有什么改进？1)增加了参考时钟可编程设置的支持，可以通过软件配置频率范围从32KHz到26MHz不同的工作时钟.2)增加了待机（Standby）功能，可以通过I2C接口使芯片进入待机模式；3)原有自动静音检测（Silence Detection）功能下增加了自动关闭RF PA的功能，并延长了自动静音检测的时间（最长64s）；4)增加了ALC（Automatic Level Control）功能；5)内部集成I2C上拉电阻。

6)噪底进一步降低，提高了芯片SNR；7)改进了音频的频率响应，声音更饱满；2 KT0803L和KT0803K、KT0803M硬件上兼容吗？KT0803L与KT0803K、KT0803M是Pin to pin兼容的。

Effective: January 2019K-75-001Wheelock Series MT Multitone Horns and Multitone Horn-StrobesFEATURES•Approvals include: UL 1971, UL 1638, UL 464, and Cali-fornia State Fire Marshal (CSFM). The MT-12/24-R and MTWP-2475W-FR are FM approved and also US Coast Guard Approved for applications with the Autroprime fire alarm system•Designed to meet or exceed ADA/NFPA/UFC/ANSI Stan-dards and Accessibility Guidelines •Meets OSHA 29 Part 1910, 165•One alarm appliance with eight (8) selective signals to provide superior sound penetration for various ambient and wall conditions with two field selectable sound out-put levels•Audible and strobe can operate from a single signaling circuit with any of the eight (8) audible signals•Code-3 Horn and Tone meet ANSI/NFPA temporal pattern for standard emergency evacuation signaling •Multi-Candela MT Strobe models available with field selectable 15/30/75/110 candela settings•Weatherproof MT Strobe models available with 180candela rating•FIRE and AGENT markings available•Polarized inputs for compatibility with standard reverse polarity type supervision of circuit wiring by an alarm panel•Flush and surface mount options; no additional trim-plate required for flush mounting•IN and OUT wiring terminations that accept two (2) #12 to #18 AWG wires at each terminalDESCRIPTIONEaton’s Wheelock Series MT Multitone Horns and Horn-Strobes are compatible with Kidde Fire Systems'AEGIS™ and ARIES ® families of Fire Alarm-Suppression Control Units and offer a choice of eight (8) nationally and internationally recognized alerting sounds: Horn, Bell,March Time Horn, Code-3 Tone, Code-3 Horn, Slow Whoop, Siren or Hi/Lo Tone. The Code-3 horn and tone patterns are engineered to comply with NFPA/ANSI Tem-poral Pattern specifications without requiring additional equipment.The MT Strobes are designed for ADA applications with maximum performance, reliability and cost-effectiveness while meeting or exceeding the requirements of NFPA 72, ANSI 117.1, UFC and UL Standard 1971 as well as meeting ADA requirements concerning photosensitive epilepsy.Each MT and MT Strobe appliance has two user selec-tive sound output levels: STANDARD dBA and HIGH dBA. The MT-12/24 provides dual voltage capability in one unit, 12 VDC or 24 VDC operation, filtered or FWR.The MT Strobe Electronic appliances operate with 24VDC and may be used with filtered or unfiltered (full-wave-rectified) input voltages. Separate input terminals are available and shunt wires are provided to enable both tone and strobe to operate simultaneously from a single input.The Multitone Strobe appliances are UL Listed for indoor wall mount applications, under Standard 1971 for Devices for the Hearing Impaired and under Standard 464 for Audible Signal Appliances. MT Strobe models are listed for indoor use with a temperature range of 32°F to 120°F (0°C to 49°C) and maximum humidity of 93% ±2%.Series MT HornSeries MT Horn-Strobe with IOB BackboxThe MT-12/24 and MTWP models for outdoor use are Listed for -31°F to 150°F (-35°C to 66°C) and maximum humidity of 95%. The strobe devices use a Xenon flash-tube with solid state circuitry enclosed in a rugged Lexan ® (or equivalent) lens to provide maximum reliabil-ity for effective visible signaling. Strobe lens markings available for “Fire” and “Agent” labeled applications.The MT-12/24-R and MTWP-2475W-FR are US Coast Guard Approved for applications with the Autroprime fire alarm system.The Series MT appliances have IN and OUT wiring termi-nations that accept two #12 to #18 AWG wires at each terminal. Inputs are polarized for compatibility with stan-dard reverse polarity type supervision.GENERAL NOTES•Strobes are designed to flash at 1 flash per second minimum over their “Regulated Voltage Range” (16-33v for 24VDC units and 8-17.5v for 12VDC units).•All candela ratings represent minimum effective Multitone Strobe intensity based on UL 1971.•The MT Audible is UL 464 Listed.•“Regulated Voltage Range” is the terminology used by UL to identify the voltage range. Prior to this change, UL used the terminology “Listed Voltage Range.”SPECIFICATIONSTable 3: UL dBA and Current Ratings for Series MT Audible Portion*RMS current ratings are per UL average RMS method. UL max current rating is the maximum RMS current within the listed voltage range (16-33v for 24v units). Forstrobes the UL max current is usually at the minimum listed voltage (16v for 24v units). For audibles the max current is usually at the maximum listed voltage (33v for 24v units). For unfiltered FWR ratings, see installation instructions.ToneRMS Current (Amps)dBA @ 10 FT (UL Reverberant)per UL 46424 VDC12 VDC24 VDC12 VDCHI Output STD Output HI Output STD Output HI OutputSTD OutputHI OutputSTD Output@ 24 VDCUL max *@ 24 VDC UL max *@ 12 VDC UL max *@ 12 VDC UL max *Horn 0.0740.1080.0330.0440.1450.1760.0230.03492879077Bell0.0400.0530.0180.0240.0770.0950.0140.020********March Time Horn 0.0670.1040.0330.0380.1090.1420.0230.03489848974Code-3 Horn 0.0690.0910.0260.0350.1000.1420.0230.03488838873Code-3 Tone 0.0610.0750.0260.0350.0880.1050.0150.021********Slow Whoop 0.0690.0980.0280.0370.1000.1420.0250.0359*******Siren 0.0800.1040.0270.0360.1220.1520.0210.03089848975HI/LO0.0440.0570.0200.0260.0890.1140.0180.02686818671Table 1: Alarm TonesTone Alarm Tones Pattern DescriptionHorn Broadband Horn (Continuous)Bell1560 Hz Modulated (0.07 sec ON/Repeat)March Time Horn Horn (0.25 sec ON/0.25 sec. OFF/Repeat)Code-3 Horn Horn (ANSI S3.41 Temporal Pattern)Code-3 Tone 500 Hz (ANSI S2.41 Temporal Pattern)Slow Whoop500-1200 Hz SWEEP(4.0 sec ON/0.5 sec. OFF/Repeat)Siren 600-1200 HZ SWEEP (1.0 sec. ON/Repeat)Hi/Lo1000/800 (0.25 sec. ON/Alternate)*RMS current ratings are per UL average RMS method. UL max current rating is the maximum RMS current within the listed voltage range (16-33v for 24v units). Forstrobes the UL max current is usually at the minimum listed voltage (16v for 24v units). For audibles the max current is usually at the maximum listed voltage (33v for 24v units). For unfiltered FWR ratings, see installation instructions.Table 2: Current Ratings for Series MT Strobe PortionModelRMS Current (Amps)MTWP-2475MT-24MCW Candela 180cd 15cd 30cd 75cd 110cd 24.0 VDC 0.0940.0410.0630.1090.140UL Max *0.1380.0600.0920.1850.220- 2 -WIRING DIAGRAMSINSTALLATION NOTES1.If the strobe and audible operate on the same cir-cuit, add the strobe current from Table 2 to the audi-ble current from Table 3. For Peak and Inrush current across the listed voltage range, refer to Installation Instructions.2.The average current indicated is per actual Produc-tion Testing at listed VDC. For rated average and Peak current across the UL listed voltage range for both filtered DC and unfiltered VRMS, see Installa-tion Instructions.3.Contact Kidde for Installation Instruction sheets onthese products. These materials contain important information that should be read prior to specifying or installing these products, including:•Total current required by all devices connected to system primary and secondary power sources.•Fuse ratings on signaling circuits to handle maxi-mum inrush or peak currents from all devices onthose circuits.•Composite flash rate from multiple strobes withina person’s field of view.•Installation in office areas and other specification and installation issues.•Use strobes only on circuits with continuously applied operating voltage. Do not use strobes oncoded or interrupted circuits in which the appliedvoltage is cycled on and off, as the strobe maynot flash.•The voltage applied to these products must be within their rated input voltage range.•Conductor size (AWG), length and ampacity should be taken into consideration prior to designand installation of these products, particularly inretrofit installations.4.These notification appliances must be used withintheir published specifications and must be PROP-ERLY specified, applied, installed, operated, main-tained and operationally tested in accordance with their installation instructions at the time of installa-tion and at least twice a year or more often and in accordance with local, state and federal codes, reg-ulations and laws. Specification, application, installa-tion, operation, maintenance and testing must be performed by qualified personnel for proper opera-tion in accordance with all of the latest National Fire Protection Association (NFPA), Underwriters’ Labo-ratories (UL), National Electrical Code (NEC), Occu-pational Safety and Health Administration (OSHA), local, state, county, province, district, federal and other applicable building and fire standards, guide-lines, regulations, laws and codes including, but not limited to, all appendices and amendments and the requirements of the local Authority Having Jurisdic-tion (AHJ). Failure to comply with the installationinstruction sheets could result in improperinstallation, application, and/or operationof these products in an emergency situa-tion, which could result in property damageand serious injury or death.- 3 -This literature is provided for informational purposes only. KIDDE-FENWAL, INC. believes this data to be accurate, but it is published and presented without any guarantee or warranty whatsoever. KIDDE-FENWAL, INC. assumes no responsibility for the product's suitability for a particular application. The fire suppression system design, installation, maintenance, service and troubleshooting must be performed by trained, authorized Kidde Fire Systems distributorsfor the product to work correctly. If you need more information on this product, or if you have a particular problem or question, contact KIDDE-FENWAL, INC., Ashland, MA 01721 USA. Telephone: (508) 881-2000.K-75-001 Rev AD© 2019 Kidde-Fenwal Inc.400 Main Street Ashland, MA 01721 USA Tel: 508.881.2000ARCHITECTS AND ENGINEERS SPECIFICATIONSThe notification appliance shall be an MT Series audible/ visual device or equivalent. Notification appliance shall be electronic and use solid state components. Electrome-chanical alternatives are not approved. Each electronic signal shall provide eight (8) field selectable alarm tones. The tones shall consist of: HORN, BELL, MARCH TIME HORN, CODE-3 HORN, CODE-3 TONE, SLOW WHOOP, SIREN AND HI/LO. Tone selection shall be by durable dip switch assembly and not clips or jumpers. The Multitone Audible appliance shall be UL Listed under Standard 464 for Audible Signal Appliances. The audible and the strobe shall be able to operate from a single noti-fication circuit while producing any of these tones. The device shall provide two output sound levels: STAN-DARD and HIGH dBA. The HIGH dBA setting shall pro-vide a minimum 5 dBA increase in sound output at nominal voltage. The HIGH reverberant dBA measure-ment at 10 feet for the alarm HORN SETTING shall be 88 dBA minimum. Operating voltages shall be 24 VDC using filtered power or unfiltered power supply (full-wave-rectified). All models shall have provisions for standard reverse polarity type supervision and IN/OUT field wiring using terminals that accept #12 to #18 AWG wiring. Combination audible/visual appliances shall incorporate a Xenon flashtube enclosed in a rugged Lexan® lens or equivalent with solid state circuitry. Strobe shall produce a flash rate of one (1) flash per second minimum over the voltage range. The strobe intensity shall be rated per UL and Listed under Standard 1971 for Signaling Devices for the Hearing Impaired with field selectable 15/30/75/110 candela settings. Strobe models shall incorporate cir-cuitry for synchronized strobe flash and shall be designed for compatibility with Kidde Fire Systems’AEGIS and ARIES families of Fire Alarm-Suppression Control Units and DSM Sync Modules. The strobes shall not drift out of synchronization at any time during opera-tion. If the module fails to operate (i.e., contacts remain closed), the strobes shall revert to a non-synchronized default flash rate.All Listed strobe appliances shall incorporate low tem-perature compensation to insure the lowest possible cur-rent consumption. Strobe activation shall be via independent input or from the same input circuit as the audible.The combination audible/visual appliances may be installed indoors and surface or flush mounted. They shall mount to standard electrical hardware requiring no additional trimplate or adapter. The aesthetic appearance shall not have any mounting holes or screw heads visible when the installation is completed. The appliance shall be finished in a textured red color.The audible device may be installed indoors or outdoors with the proper backbox.For weatherproof applications where specifications require 75 cd at -31°F (-35°C) and full temperature range of -31°F to 150°F, the Model MTWP-2475W FR shall be used.ORDERING INFORMATION*Letters correspond to letter of applicable mounting options from datasheet K-75-008. Notes:1.MT-12/24 Audible can be used with the RSSP Multi-Candela for applications requiring 15, 30, 75, 110 cd wall strobes.2.MTWP-2475W is weatherproof and rated for 180 cd@ 77°F (25°C) and 75 cd @ -31°F (-35°C) with low current draw.3.DSM Dual Circuit Modules are rated for 3.0amperes per circuit. Maximum number of intercon-nected DSM modules is twenty (20). Refer to Data Sheet K-75-012 Series DSM Sync Modules. MOUNTING OPTIONSPartNumberInputVoltageRatedCandelaStrobeLabelMounting*OptionsMT-12/24-R12/24------B,H,I,J,K MT-24MCW-FR2415/30/75/110FIRE B,H,I,J,K MT-24MCW-AR2415/30/75/110AGENT B,H,I,J,KMTWP-2475W-FR24180@ 77°F (25°C)75 cd @ -31°F (-35°C)FIREH, H+WP-KIT,SPart Number Mounting Options*DBB-R AISP-R BWBB-R EIOB-R HRP-R JIOB + WP-KIT H, H plus WP-KITWFP SThe MT-12/24-R and the MTWP-2475W-FR can be used in weatherproof applications using mounting options H, H plus the WP-KIT and S.*Letters correspond to letter of applicable mounting options from datasheet K-75-008. For complete mounting options, refer to the Notification Appliance Mounting Accessories datasheet K-75-008.ARIES is a registered trademark of Kidde-Fenwal, Inc. or its parents, subsidiaries or affiliates.EXPORT INFORMATION (USA)Jurisdiction: EARCertification: EAR99 This document contains technical data subject to the EAR.。

GEC3/GES312&24VDC S E R I E SS t a n d a r d F F e a t ur e s • Nominal voltage 12VDC and 24VDC• 24VDC units have field selectable candela options of 15, 30, 60, 75 & 110• 12VDC units have field selectable candela options of 15, 30, 60 & 75 • GEH horn is available in 12VDC or 24VDC• Super-Slide ®Bracket - Ease of Supervision T esting • Checkmate ®- Instant Voltage Verification• U n i t DD i m e n s i o n s : 5” high x 4.5” wide x 2.5” deep • Synchronize strobe and/or horn with Gentex AVSM Control Module • Prewire entire system, then install signals • Lower installation and operating costs • Input terminals 12 to 18 AWG• Switch selection for high or low dBA• Switch for chime, whoop, mechanical and 2400Hz tone • Tamperproof re-entrant grill• Switch for continuous or temporal 3 (not available on whoop tone)•Surface mount with the GSB (Gentex Surface Mount Box)•Silence horn while strobes remain flashing•Wide voltage range 8-17.5VDC (12VDC units) 16-33VDC or FWR (24VDC units)•Faceplate available in red or off-whiteA p p l i c a t i o n sThe Commander 3Series is a low profile strobe and horn/strobe combination thatoffers dependable audible and visual alarms and the lowest current available.The GE3 Series 24VDC offers tamperproof field selectable candela options of 15,30, 60, 75, and 110 candela. The 12VDC offers tamperproof field selectable candela options of 15, 30, 60, and 75 candela.The Commander 3Series horn offers a continuous or synchable temporal three in 2400Hz and mechanical tone, a chime and whoop tone. All tones are easy for the professional to change in the field by using switches.The GE3 Series has a minimal operation current and has a minimum flash rate of 1Hz regardless of input voltage.The Commander 3Series is shipped with the standard 4" metal mounting plate which incorporates the popular Super-Slide ®feature that allows the installer to easily test for supervision. The product also features a locking mechanism which secures the product to the bracket without any screws showing.The Commander 3also features the Checkmate ® - Instant Voltage Verification feature which allows the installer to check the voltage drop draw and match it to the blueprint.The GE3 Series appliances are ANSI/UL 464 and ANSI/UL 1971, listed for usewith fire protective systems and are warranted for three years from date of purchase. C o m m a n d e r 3S e r i e sS e l e c t a b l e CC a n d e l a E E v a c u a t i o n S S i g n a l s P r o d u c t L L i s t i n g sP r o d u c t C C o m p l i a n c e•N F P A 772•A m e r i c a n s w w i t h D D i s a b i l i t i e s A A c t ((A D A )• Q Q u a l i t y M M a n a g e m e n t S S y s t e m i i s c c e r t i f i e d t o : I I S O 99001:2008• A A N S I /U L 4464 && A A N S I /U L 11971 L L i s t e d • F F M A A p p r o v e d • C C S F M : 77135-0569:122 ((G E C 3-24 && G G E H -24)7125-0569:123 ((G E S 3-24)7125-0569:129 ((G E S 3-12)7135-0569:130 ((G E C 3-12 && G G E H -12)• M M E A : 2285-91-E ((G E C 3-24 && G G E S 3-24)580-06-E ((G E C 3-12 && G G E S 3-12)L o w e r C u rr e n t Dr a w !!N O T E S :• Operating temperature: 32°to 120°F (0° to 49° C). The GE3 Series is not listed for outdoor use.• The sound output for the temporal 3 tone is rated lower since the time the horn is off is averaged into the sound output rating. While the horn is producing a tone in the temporal 3 mode its sound pressure is the same as the continuous mode.• For nominal and peak current across UL regulated voltage range for filtered DC power and unfiltered (FWR [Full Wave Rectified]) power, see installation manual. 12VDC models are DC only.• G e n t e x dd oe s n n o t r r e c o mm e n d u u s i n g a a c c o d e d o o r p p u l s i n g s s i g n a l i n g c c i r c u i t w w i t h a a n y o o f o o u r s s t r o b e p p r o d u c t s ((s e e T T e c h n i c a l B B u l l e t i n 0014).*Operating the horn in this mode at this voltage will result in not meeting the minimum UL reverberant sound level required for public mode fire protection service. Thesesettings are acceptable only for private mode fire alarm use. Use the high dBA setting for public mode application (not applicable when using the chime tone. The chime tone is always private mode).1RMS current ratings are per UL average RMS method. UL max current rating is the maximum RMS current within the listed voltage range (16-33VDC for 24VDC units) (8-17VDC for 12VDC units). For strobes the UL max current is usually at the minimum listed voltage (16VDC for 24VDC units) (8VDC for 12VDC units). For audibles the max current is usually at the maximum listed voltage. For unfiltered FWR ratings, see installation manual.U P T O 30%C u r r e n tD r a wR e d u c t io nConventional Wiring Diagrams for Emergency Notification Evacuation SeriesM o u n t i n g S S u p e r -S l i d e ®Note:- Switch Positions 1 and 2 in the OFF position to select isolated horn and strobe power inputs - Switch Position 6 ON = HIGH dBA - Switch Position 6 OFF = LOW dBAT o n e S S w i t c h L L o c a t i o n sC a n d e l a S S e l e c t i o nThe access holes are provided in the back of the terminalblock to allow the voltage to be measured directly without removing the device. Typically this would be done at the end of the line to confirm design criteria. Most measure-ments will be taken using the S+ and S- locations although access is provided to other locations. NOTE: Care should be taken to not short the test probes.Checkmate ®- Instant Voltage VerificationGEC3/GES312 & 24 VDC S E R I E S551-0050-04The audible and/or visible signal shall be Gentex GE3 Series or approved equal and shall be listed by Underwriters Laboratories, Inc. per UL 1971and/or UL 464. The notification appliance shall also be listed with Factory Mutual Listing Service (FM), the California State Fire Marshal (CSFM) and the Bureau of Standards and Appeals (NYC).The notification appliance (combination audible/visible) shall produce a peak sound output of 100dBA or greater at 12VDC or 24VDC as measured in an anechoic chamber. The signaling appliance shall also have the capability to silence the audible signal while leaving the visible signal energized with the use of a single pair of power wires. Additionally, the user shall be able to select either continuous or temporal tone output with the temporal signal having the ability to be synchronized.Unit shall be capable of being installed so that any unauthorized attempt to change the candela setting will result in a trouble signal at the fire alarm control panel.The audible/visible and visible signaling appliance shall also maintain a minimum flash rate of 1Hz or up to 2Hz regardless of power input voltage. The appliance shall have an operating current of 55mA or less at 24VDC for the 15Cd strobe circuit and 106mA or less at 12VDC for the 15Cd strobe circuit.The appliance shall be polarized to allow for electrical supervision of the system wiring. The unit shall be provided with a mounting bracket with termi-nals and barriers for input/output wiring and be able to mount to a single gang or double gang box or double workbox without the use of an adapter plate.The unit shall have an input voltage range of 16-33 volts with either direct current or full wave rectified power for 24VDC models or a voltage range of 8-17.5 volts for 12VDC models.The appliance shall be capable of testing supervision without disconnecting wires. Also the appliance shall be capable of mounting to a surface back box. The unit shall also be able to verify voltage at the unit without removing unit.24 units per carton 28 pounds per cartonW i r i n g D D i a g r a m G G E 3 S S e r i e s w w i t h G G e n t e x S S y n c h r o n i z a t i o n M M o d u l eN o t e :See T echnical Bulletin 015 for proper synchronization module for application.N o t e : W W h e n s s y n c h r o n i z i n g t t h e G G E 3 112V D C S S e r i e s , t t h e A A V S M s s y n c h r o n i z a t i o n m m o d u l e M M U S T b e u u s e d .Important Notice:These materials have been prepared by Gentex Corporation ("Gentex") for informational purposes only, are necessarily summary, and are not purported to serve as legal advice and should not be used as such.Gentex makes no representations and warranties, express or implied, that these materials are complete and accurate, up-to-date, or in compliance with all relevant local, state and federal laws, regulations and rules.The materials do not address all legal considerations as there is inevitable uncertainty regarding interpreta-tion of laws, regulations and rules and the application of such laws, regulations and rules to particular fact patterns. Each person's activities can differently affect the obligations that exist under applicable laws, regu-lations or rules. Therefore, these materials should be used only for informational purposes and should not be used as a substitute for seeking professional legal advice. Gentex will not be responsible for any action or failure to act in reliance upon the information contained in this material.A r c h i t e c t && E E n g i n e e r i n g S S p e c i f i c a t i o n s。

Airport 飞机场Turkey 土耳其Port 码头Singapore 新加坡World-wide/ throughout the wold 全球Iran 伊朗Universal 宇宙Japan 日本English 英语India 印度People’s Republic ofChina中华人民共和国Israel 以色利British 英国Spoken English 英语control生管Section chief 课级主管MC/ material control 物管Engineer 工程师Manufacturing 制造Technologist 技术员RD/ Research & 研发Secretary 秘书DevelopmentME/ manufacturingengineering制造工程Assistant 助理ME/ mechanicalengineering技术工程G/L; group leader 组长Buying 买入Delivery 交货Selling 卖出Transfer 传送,传输Purchasingmanagement采购管理M/T; mail transfer 信传Supplier 公司供应商T/T; telegraphic transfer 电传Contract/ order Open account 开户Responsibility andauthority权责D/P; document against payment 付款交单Raw material 原材料D/R; deposit receipt 存款收据General merchandise 通用商品As per; according to 依据,依照,根据Line/ one’s trade oroccupation生意行Discount 回扣Trade terms 贸易条款Firm offer 实盘Samples/ specimen 样品Non-firm offer 虚盘Quotes/ quotations 报价单Shipping mark 唛头Devaluation 贬值Retail price 零售单价Revaluation 升值Wholesale price 批发价Home market price 国内市场价中国国际贸易促进会Arbitration award 裁决SEMKO 瑞典Claims 索赔SEV 瑞士Shortage 短装;少装IMQ 意大利Slump 暴跌,萧条SAA; CSA 澳洲,加拿大S. S. ; steam ship 汽船GS; VDE; TUVM. V. ; motor ship 摩托艇SA () 澳大利亚安规标准Insurance policy 保险单OVE () 奥地利安规标准Discharge 卸货CEBEC () 比利时安规标准Production budget 生产预算Check book 支票薄Accountant 会计员Practice (事务所) 事务所License 执照,证书Income 收入Statement 财务报表Economic Entity 经济实体Economic condition 经济条件,经济状况 Salary 薪水Stock 股票 Wage工资Tax 税收 Earnings 全部收入 Reserve 订购 Operation 营运 Input 投入 Owner 拥有者 Output 产出 Banker 银行家Cash Disbursement(支出)现金支出Residual valve剩余 Cash receipts 现金收集据 Percentage 百分之几 Deduct 扣款、扣除 Fraction分数Invoice Register 发票本、发票薄Accumulated depreciation累计折旧Double-entry 复式记帐 To be consistent with 相一致 Single-entry 单式记帐 Tax burden税收General ledger 总分类帐 Income tax return 纳税审请表 Accounting cycle 会计循环 Inflated 通货膨胀的 Sequence次序、顺序 Charge 费用Parent company 总公司 Customs duties 关税 Securities exchanges 证券交易 Operation tax 营业税 Brokerage houses 经纪行 Sales tax销售税 Marketable debt securities有价债务性证券Investor’s equities投资人权益Marketable equitysecurities有价债权性证券Premium on capital 资本溢价Takeover 吞并Reserve fund 储存基金Single economic unit 单独的经济实体Undistributed profits 不可分配的利润Single legal entity 单独的法律实体Cost of production 生产成本Chapter ⅤQuality Characteristic Diagram 制性要因Quality department 品质部Check list 查核表IQC/ incoming qualitycontrol进料品质管制Histogram 直方图QA/ quality assurance 品保Control chart 管制图散布图QE/ qualityAppearance check 外观检查moral; safetyInside constructioncheck内部构造检查QFD/ quality functiondeployment品质功能开发(展)Electrical test 电气测试QCC/ quality control cycle 品管圈Hi-pot test 高压测试Standardization 标准化Drop test 落地测试TQC/ total quality control 全面品质管制Temperature-risingtest温升测试Instability 不稳定性Vibration test 振动试验Unreasonably 不明原因Function test 功能测试Special cause 特殊原因Shipping test 装船测试Substantial cause 本质原因ESP/ electricalstatistics potential静电压Unavoidable cause 不可避免的原因Current leakage 漏电Certification 认证Symptom 症状;符号Number of defectives 不良数Too loose/ tight 太松/太紧Classification of defectives 不良品归类Come off 脱落Clearance 问隙Poor assembly 组装不良Coefficient of reliability 信赖性系数Scratch 刮伤Coefficient of variation 变异指数traceabilityIncoming materialcontrol进料管制Process control 制程管制Incoming materialinspection进料检验Inspection and testing 检验与测试Inflation point 转折点Accredited laboratories 指定的实验室Lot-by-lot inspection 逐批检验Control of inspection, measuringand test equipment检验,量测与测试设备之管制In- process inspection 制程检验Measuring system analysis 量测系统分析Control of nonconformingAccreditation body 认证机构Temp. Humidity meter 湿度计Chapter ⅣEngineering and R&DFo meter Fo仪Engineering department 工程部Transistor character meter 晶体管制特性仪R&D department 研发部Capacitor loss and error meter 电容损耗误差分选仪Industrial revolution 工业革命Impedance meter 阻抗仪Engineer; eng’r工程师AC voltage regulator 交流稳压器Engineering; eng’g工程In circuit tester ICT,在线测试仪RD; R&D; ResearchMulti-meter 万用表Drawing number 图号AC voltage adjuster AC调压器Part number 料号Leakage current meter 漏电流仪Carton 卡通箱Dielectric/ insulationtester高压Carton number 卡通箱号Digital torque meter 扭力计Gift box 彩盒Impedance box 电阻箱Speaker system 白箱Draw meter 绘图仪Speaker driver 喇叭单体Electron sound meter 电声仪Magnetically shielded speakersystem防磁音箱X’fmr/ transformer变压器Rated value 额定值Adopter/ AD 整流器Bushing 衬套Jack 插座Flux density 助焊剂密度RCA jack RCA座Foil side铜箔面V olt./ voltage电压Mesh. Steel mesh; cloth mesh网,铁网,布网Cord/ power cord电源线Grill; steel grill; cloth grill 网,铁网,布网Frame铁盆Screw post螺丝,柱Damper弹波Stop/ stopper挡板V oice coil音圈Knob; switch cap旋钮Washer华司Cable/ lead收线Grinder 磨床Salary; wage月薪、周薪Color chip色板IR/ industrial relations工业关系PR/ public relations公共关系Terminate; terminator; 解雇terminationFire解雇Retire退休DL/ direct labor直接员工Multi-speaker多媒体音箱IDL/ indirect labor间接员工Card; Add-on card卡片/附加卡U; you你I/O card输入,输出卡TKS; thanks; many Display card显示卡thanks; thank youRGDS; BESTREGARDS敬礼RAM card随机存取卡DD; dated日期Sound card声卡RTN; return退货,回信,返回Modem card 数据卡Fire control消防SPS/ switching power supply可调式电源Consume 消耗USP/ un-interruptive powersupply不间隔电源供给器Computer English电脑(计算机)英语Driver驱动器MIS/ management 管理信息系统FDD/ floppy disk driver软盘驱动器information systemLight pen1D disk; single-density 单面磁盘Scan; scanner扫描/扫描器Hard disk driver硬盘驱动器Touch screen触模式屏幕Keyboard键盘Computer code计算机代码Flow chart流程图Data and structure数据结构Module模块,模式Program design程序设计Subroutine子程序Typical language典型计算机语言Installation Software engineering软件工程Menu-driven interface菜单驱动界面Program language程序语言Window窗口Software tools软件工具Macro 宏指令User interfaces用户界面Files inquires文件查询Software maintenance软件维护Shared resource资源共享Link up联络Packing包装Coordinate协调,沟通Print印(盖印) Contact联络,联系Paint涂Liaison联络员Faxed documents/ files传真文件Inform知会Brand 商标Notice 通知,知会Manufacturing date生产日期Reply回复,回答Weekly/ monthly report周/月报Order change订单变更MRP/ material requisition plan物料需求计划Revision修订,修改Passport number通行证号码Customer order客户订单A- item贵重材料New product 新产品Oil-house item化学品料Planner计划员AR/ as required material需求物品Pick list提配单Label; tag贴纸;标签Issue slip领料单Tie; wire tie; cable tie线扣Scrap报废Warrantee card保证卡Pending scrap 待报废Card board卡板纸Inventory库存Foam泡沫;泡棉Inventory torn-overrate存货周转率Equipment设备Grease膏ASM; assemble组装;装配(vt) Silicon grease; siliconcompound硅胶ASS’Y assembly组装;装配(n) H/S; head sink散热片Insertion插件Heat sink compound 散热膏 D/I. Drop-in插入Barrier 隔板;围栏 Reversed; tilted; wrong 插反;插斜;插错 Brochure 说明书 Missing 漏插Leaflet单面说明书 Lead 引线;引脚 IC dispenser IC 结合度 Icing冰柱Strip off箔面脱落;翘起 A/I; auto-insertion 自动插件 Component side 元件面A/I machine自动插件机Solder side 锡面,焊接面 Axial type A/I machine 卧式自动插件机 Foil side箔面Radial type A/I machine直式插件机Blow holes吹气孔;通风孔 SMD; surface mount device 表面安装装置 Cold soldering joints 冷焊点 Place machine 堆放机 Incomplete fillets 焊点不完整 Oven 锅炉Unfilled holes 焊锡不饱满 Regulator 稳压器;调节器 Pin holes 针孔Transformer 变压器 Cutter 剪钳 Inferred oven 红外线炉 Pliers 钳子 Ultra-violet oven 紫外线炉 Tweezers 镊子 Grinder 粉碎机 Screw driver 起子 Fixture 夹具 Glue gun胶枪Jig治具A/G; Air gun气枪Tooling trial run试模E/G; Electronic gun电子枪Customer supplied tooling客供模具Blower吹风机Inner cartoon风箱。

英文缩写英文全称4M&1E Man, Machine, Method, Material, Environment "BABT" Mark British Approval Board of Telecommunications "BEAB" Mark British Electrotechnical Approval Board "CCC" Mark China Compulsory Certificate"CE" Mark Conformite Europenne"CSA" Mark Canadian Standard Association"D" Mark Demko (Denmark National Certification Body) "ENEC" Mark European Norm Electrical Certification. "FCC" Mark Federal Communication Commission"FI" Mark Fimko (Finland National Certification Body) "GS" Mark Geprufte Siecherheit (Safety-Tested in German) "N" Mark Nemko (Norway National Certification Body) "S" Mark Semko (Sweden National Certification Body) "UL" Mark Underwriters Laboratory"VCCI" Mark Voluntary Control Council for Interference3S Standardization Simplfication Specification4M Man Machine Material Method5S Housekeeping Term (Japanese)7QC Tools7 Quality Control Tools8-D8-DisciplineA2LA American Assosiation for LaboratoryAC Alternating CurrentAc/Re Accept/RejectACR Action and Countermeasure ReportADSL Asymmetric Digital Subscriber LineAGM Assistant Genaral ManagerAGPAI Automatic InsertionAL Aluminium wireAM Assistant ManagerANSI American National Standard InstituteAP Accounts PayableAPQP Advanced Product Quality PlanAPS Advanced Planning SchedulingAQL Acceptable Quality LevelAQL Acceptance Quality LevelAQL Acceptable Qulity LevelART ArtworkARTWRK ArtworkASAP As soon as possibleASFASL Approved Supplier ListASP Analog Signal ProcessorASSY AssemblyASTM American Society of Testing MaterialATAPI AT Attachment Peripheral InterfaceATE Automatic Test EquipmentATO Assembly To OrderATP Available To PromiseATXAUDAVL Approved Vendor ListAWB Air Way BillB/L Bill of LadingB/L Bill of LandingB/S Balance SheetBAT Baby ATBBSBCC Blink Carbon CopyBD BoardBGA Ball Grid ArrayBIOS Basic Input Output SystemBL BaselineBL Back Light DisplayBLK Black ColourBM BenchmarkBOC Breach of ContractBOM Bill of MaterialBR Best RegardsBRKT BracketBS British StandardBTO Built to OrderBTW By the wayBUM Business Unit ManagerBV Book ValueBX BoxC&ED/CAED Cause and Effect DiagramC.O.O.Country of Origin / Certificate of OriginC.Y.Container YardC/N Credit NotesCA Corrective ActionCAD Computer-aided DesignCADCAD Computer Aided DesignCAM Computer Aided ManufacturingCAM Computer Aided CenterCAP Capacitor [C]CAR Corrective Action Request / Corrective Action ReportCAR Corrective Active ReportCAV Constant Angular VelocityCB Certification BodiesCBL Cable [J or W]CC Carbon CopyCCAP Ceramic Capacitor [C]CCAR Customer Corrective Action Request / Customer CorrectiveAction ReportCCB Change Control BoardCCIC China Import & Export Commodity Inspection Corporation CD Clock Digit DisplayCDBD Card BoardCD-DACD-I Computer Disc-InteractiveCD-MO CD-Magnet OpticalCD-ROM Compact Disc-Read Only MemoryCDTCD-WO CD-Write OnceCD-WriteCE Commuttee of EuropeCEO Chief Executive OfficerCFO Chief Finance OfficerCFR Cost And Freight (…named port of destination)CFS Container Freight StationCHFCI Continuous ImprovementCI Custom InvoiceCIF Cost, Insurance & Freight (…named port of destination)CIF Cost Insurance and FreightCIP Carriage and Insurance Paid to (…named port of destination) CIRC Cross-Interleaved Reed solomon CodeCI報單CKD Component KitCLCA Closed Loop Corrective ActionCLV Constant Linear VelocityCNYCOB Chip on BoardCOC Certificate of ConformanceCOD Cash on DeliveryCOM Customer Order ManagementCONN Connector [J or P]CONN HSG Connector HousingCOO Chief Operating OfficerCOQ Customer Oriented QualityCPK Indixes of Capability ProcessCPN Customer Part NumberCPT Carriage Paid to (…destination)CPU Central Processing UnitCPU Center processor UnitCQE Customer Quality EngineerCR Cargo ReceiptCR Critical DefectCRES Ceramic Resistor [R]CRP Capacity Requirement PlanningCRR Contract /PO Review RecordCS Customer SampleCT Cycle TimeCTF Critical-to-FunctionCTQ Critical-to-QualityCVR CoverCWO Cash with OrderCX Cotco Specially DisplayD&B Dice BondingD&T Data (electronic document)D.N.Delivery NoteD.O.Delivery OrderD/A Document Against AcceptanceD/A Delivery Against AcceptanceD/A Documents Against AcceptanceD/D Demand DraftD/L DownloadD/P Document Against Payment / Delivery PreformanceD/P Delivery Against PaymentD/P Documents Against PaymentDA Deviation AuthorizationDC Direct CircuitDCC Document Control CentreDCC Data Control CenterDE Design EngineerDFM Design for ManufacturabilityDFMEA Design Failure Mode and Effect Analysis DFMEA Design Failure Model Effective Analysis DFSS Design for Six SigmaDFT Design for TestDIO Diode [D]DIOD Diode [D]DIP Dual In-line PackageDJ Discrete JobDKKDLC Direct Labor CostDM Dot Matrix DisplayDMR Defect Material ReviewDN Deviation NoticeDOA Dead On ArrivalDOCCON Document ControlDOE Design of ExperimentDOE Design Of ExperimentsDP Decimal PointDPPM Defective Part Per MillionDR Delivery RequisitionDSC Differential Scanning ColorimeterDSP Digital Signal ProcessorDTD Door to DoorDV Design Verification / Design Validation DVD Digital Video DiscDVI Digital Video InteractiveDVT Design Verification TestDWG,DrawingDZDE.&.O.E Errors and Omissions Exceptede.g.For ExampleECC Error Checking and CorrectionECN Engineering Change NoticeECN Engineering Corrective NoticeECN Engineer Change NotesECO Engineering Change OrderECR Engineer Change RequestEDC Error Detection and CorrectionEDI Electronics Data InterchangeEE Electrical EngineerELG Export Letter of GuaranteeEMC Electromagnetic Compatibility Testing EMC Electromagtic ComponentEMCEMI Electromagnetic InterferenceEMI Electromagtic InterferenceEMIEMS Equipment Management System / Electronic ManagementSystemEMS Electronics Manufacturing ServicesEOL End-of-LifeEOM End of MonthEOW End of WeekEPP Engineering Pre-productionEPR Engineering Pilot RunEQ Emotion QuotientERP Enterprise Resource PlanningES Engineering SampleESD Electrostatic DischargeETA Expected Time of ArrivalETA Estimated Time of ArrivalETD Expected Time of DeliveryETD Estimated Time of DepartureEURF/T Functional TestF1FO First-In-First-OutFA First Article / Failure AnalysisFAE Failure Analysis EngineerFAE Field Application EngineerFAR Failure Analysis ReportFC Formal ContractFCA Free Carrier (…named place)FCB Flexible Circuit BoardFCBA Flexible Circuit Board AssemblyFCC Federal Communications CmmissionFCL Full Container LoadFCT Functional TestFDA Food and Drags AdministrationFERR FerriteFFF Fit Form FunctionFFT Final Functional TestFG Finished GoodsFGS Finished Goods StoreFI Final InspectionFIFO First-In & First-OutFIFO First In First OutFLTR Filter [FL]FM Force MajureFM Factory ManagerFMEA Failure Mode and Effect AnalysisFMEA Failure Model Effective AnalysisFOB Free On Board (…named port of shipment)FOB Free On BoardFPC Flexible Printed CircuitFPCA Flexible Printed Circuit AssemblyFPW Flexible Printed WiringFPWB Flexible Printed Wiring BoardFPY First Pass YieldFQC Final Quality ControlFSTNR FastenerFTY First Test YieldFU Fuse [F]FV Forward CircuitFW FirmwareFYI For your informationGBPGE General ElectronicGIP General Inspection PlanGM Genaral ManagerGR&R Gauge Repeatability & ReproducibilityGS Golden SampleHE Hardware EngineerHER Earn HoursHKDHL HandloadHPN Hip Fung Part NumberHR Human ResourcesHTOL High Temperature Operational LifeHV High VoltageI/M Instruction ManualI/O Input / OutputI/S Inspection StandardI/T Inventory TurnIBM International of Business AdministrationiBOM Indented Bill of MaterialIC Inspection CertificateIC Integrated CircuitIC Integrated Circuit [U]IC SKT IC SocketICT In-circuit TestIDA Infrared Data AssociationIDCTR Inductor [L, T, X]IDE Integrated Drive ElectronicsIE Industrial EngineerIE Industrial EngineeringIEC Internatonal Electrotechnical CommissionIEC International Electronics CommitteeIECEE International Electrotechnical Commission for ElectricalEquipmentIF Invariable FrequencyIFF Information Feedback FormILC Irrevocable Letter of CreditILC Indirect Labor CostILG Import Letter of GuaranteeIND Inductor [L, T, X]INSTR InstructionINSTR MNL Instruction ManualINT Inter mittentINV InvoiceINV InventoryIP Inspection ProcedureIPA Isopropyl AlcoholIPC Institute of Packaging and InterconnectsIPO International Purchasing OperationIPO Internation Purchasice OfficeIPQC In-process Quality ControlIQ Intelligence QuotientIQA Internal Quality AuditIQA Incoming Quality Assurance/ Internal Quality Auditor IQC Incoming Quality ControlIR Infra-redIR Reverse CurrentIRRISO International Organization for StandartizationISO International Standard OrganizationIT Information TechnologyITS Information Technology SystemJEDEC Joint Electron Device Engineering CouncilJIS Japanese Industrial StandardsJIS Japanese Industrial StandardJISC Japanese Industrial Standards CommitteeJIT Just In TimeJMPR Jumper wire [J or W]JPEG Joint Photographic Experts GroupJPYJQA Japan Quality Assurance OrganizationJSA Japanese Standards AssosiationJV Joint VentureKEMA K-E-M-AKETI Korean Electric Testing InstituteKPI Key Performance IndicatorKPIV Key Process Input VariableKPOV Key Process Output VariableKT Kepner Tregoe Potential Problem AnalysisKTL Korea Testing Laboratory (formerly KAITECH) KWDL/A Lead AuditorL/C Letter of CreditL1, L2, …L7Level 1, level 2…..level 7LAR Lot Acceptance RateLB Light Bar DisplayLBL LabelLC Letter of CreditLCD Liquid Crystal DisplayLCL Lower Control LimitLCL Loose Container Load / Less Than Container Load LD Led Digit DisplayLED Light Emitting Diode [LED or D]LED Light Emitting DiodeLG Letter of GuaranteeLIFO Last-In-First-OutLOB Line of BalanceLOI Letter of IntentLPXLQC Line Quality ControlLSL Lower Specification LimitLSR Line Stoppage ReportLYT Low Yield TriggingM ManagerMA Manual AssemblyMA Major DefectMAIC Measure-Analyze-Improve-ControlMAT'L MaterialMBP Master Build PlanMD Managing DirectorMD Mini DiscMDS Master Demand ScheduleME Manufacturing Engineer / Mechanical Engineer/MaterialEngineerME Manufacturering EngineerMEMO MEMOMES Management Execution SystemMFL Material Follow-up ListMI Manual InsertMI Minor DefectMIDI Musical Instrument Digital InterfaceMIL MilitaryMil-Std Military StandardMIS Management Information SystemMMS Material Management SystemMN Manufacturing NoticeMNC Multi-national CompaniesMNL ManualMOPMOQ Minimum Order QuantityMOU Memorandum of UnderstandingMP Mass ProductionMPEG Moving Picture Experts GroupMPI Manufacturing Process InstructionsMPN Manufacturing Part NumberMPS Master Production SchedulingMPS Mass Production ScheduleMR Material RequisitionMRB Material Review BoardMRP Material Requirement PlanningMRP Material Require PlanningMRR Management Review ReportMRS Marketing Require SpecificationMRSO Material Resume Ship OrderMS Manual SolderingMS Master SchedulingMSA Measurement System AnalysisMSD Moisture-sensitive DevicesMSDS Material Safety Data SheetMSSO Material Stop Ship OrderMT Mail TransferMTBA Mean Time Between AssistMTBF Mean Time Between FailureMTBF Mean Time Between FailureMTC Material Transfer ChitMTF Material Transfer FormMTM Motion & Time Study MethodMTO Make To OrderMTS Make To StockMTS Motion & Time StudyMTTR Mean Time To RepairMTTR Mean Time Te RepairMYRN/A Not AcceptanceN/A or NA Not ApplicableNCB National Certification BodiesNCN Non-conformity NoticeNCR Non-conformity / Non-conformance ReportNDA Non Disclosure AgreementNG No GoNIST National Institute of Standard & TechnologyNOKNPI New Product IntroductionNPXNRE Non Recovery Expanses /Non Returnable Expanses NRP Non-conformity Recurrent Prevention Report NRS Non-conformity Return SheetNZDO/E Order EntryO/I Operational InstructionOA Open AccountOA Open AccountOBA Out-of-Box AuditOBI Out-of-Box InspectionOBM OriginalOBUOC Out-of-ControlOCAP Out-of-Control Action PlanODM Original Design ManufacturerODM Original Design ManufacturingODM Original Design ManufactureOEM Original Equipment ManufacturerOEM Origianal Equipment ManufactureOFC Operation Flow ChartOHI On Hand InventoryOJT On-Job-TrainingOJT On Job TrainningOM Operations ManagerOpen Open circuitOQA Out-going Quality AssuranceOQC Out-going Quality ControlOQM Outgoing Quality ManagementORT On-going Reliability TestOSC Oscillator [Y]OSHA Occupational Safety and Health Administration OTD On time deliveryOTW On the wayOWB Ocean Way BillP&P Pick & PlaceP.O Purchase OrderP.O.Purchase Order / Payment OrderP/I Proforma InvoiceP/IP/L Packing ListP/N Purchase NumberP/N Parts NumberP/O Purchase OrderPA Preventive ActionPC Purchase ContractPC Production ControllerPC Personal ComputerPCB Printed Circuit BoardPCB Print Current BoardP-Chart Pecentage ChartPCM Pulse Code ModulationPCN Packing Corrective NoticePCP Process Control PlanPD Product DesignPDA Perisonal Digital AssistantPDC Passive Data CollectionPDCA Plan-Do-Check-ActionPDCC Production Data Control CenterPDR Process Deviation Request/ReportPE Product Engineer / Process Engineer/Procurement Engineer PE Product EngineeringPERT Program Evaluation and Review TechniquePFC Power Factor CorrectionPhoto-CDPHPPI Preforma InvoicePIC Person-in-ChargePKRPL Packing ListPM Preventive MaintenancePM Program Manager / Purchasing Manager / Production Manager PM Production MarketPMC Production Material ControllerPMC Production and Material planning&ControlPMG Process Monitor GroupPMI Product Manufacturing InstructionPMP Process Management PlanPN Purge NoticePNL PanelPO Purchase OrderPP Pre-productionPP Production PlanningPPA Potential Problem AnalysisPPAP Production Part Approval ProcessPPM Part per MillionPPM Parts Per MillionPPR Production Pilot RunPQC Production Quality CertificationPQC Process Quality ControlPQE Product Quality EngineerPQR Process Qualification Report / Product Qualification Report PR Process ReviewPR Purchase RequisitionPR Pilot RunPRO ProductionPROD ProductionPS Production SamplePS Production SupervisorPSS Production Scheduling SystemPTH Plated Through HolePV Product ValidationPW BRD Printed Wiring BoardPWA Printed Wiring AssemblyPWB Printed Wiring BoardPWBA Printed Wiring Board AssemblyQ.I.Quality IndexQ.I.P Quality Improvement ProgramQA Quality AssuranceQC Quality ControlQCC Quality Control CirclesQE Quality EngineerQM Quality Manual / Quality ManagerQM Quality ManagerQMR Quality Management RepresentativeQMS Quality Management SystemQP Quality PolicyQRE Quality Reliability EngineeringQS Quality System / Quality StandardQTY QuantityQ'TY QuantityQVL Quality Vendor ListQ監Quality AuditR&D Research & DevelopmentR&D Research&DevelopmentR.P.N Risk Process NumberRD Research & DevelopmentRef ReflectorRES Resistor [R]RESP ResponsibleREV RevisionRFC Response Flow ChartRFQ Request For QuotationRH Relative HumidityRI or R/I Receiving InspectionRLY Relay [K]RMA Return Material AuthorizationRMA Return Material AuthorizedRPN Risk Priority NumberRTV Return-to-VendorRVT RivetRWK ReworkS & P Sales and Purchase AgreementS.O.Sales OrderS/O Shipping OrderS/S or SS Sample SizeSA Shipping AdviceSA System AnalyseSA System AnalysisSAE Settement after exportSAR Supplier Audit ReportSBE Settement before exportSBR Special Build RequestSC Sales ContractSCAR Supplier Corrective Action Request/Report SCC Standards Council of CanadaSCHEM Schematic DiagramSCM Supplier Chain ManagementSCRN ScreenSCRW ScrewSCSI Small Computer System InterfaceSD Surface Digit DisplaySDSD Sale DepartmentSE Software Engineer / System Engineer SEKSFC Shop Floor ControlSGDSGS Sosiete Generale de SurveillanceShort Short CircuitSHR Standard HoursSI Source Inspector/ Source InspectionSI System IntegrationSIP Standard Inspection ProcedureSKD Semi KitSKT SocketSL Surface LED LampSL Sight Letter of CriditSLA Skipped-lot AuditSM Sales Manager / Senior ManagerSMD Surface-mount DevicesSMD Surface Mounted DeviceSML Shortage Material ListSMT Surface-mount TechnologySMT Surface Mounted TechnologySMT Surface Mount TechnologySNR Sample Run NoticeSO Shipping OrderSOP Standard Operating ProcedureSOP Standard Opeation ProcessSOP Standard Operation ProcedureSPC Statistical Process ControlSPC Statistic Process ControlSPC Statistical Prcess ControlSPCR SpacerSPEC SpecificationSQC Statistical Quality ControlSQE Supplier Quality EngineerSR Sales ReturnSR-Chart Short-Run ChartSSCRN Silk Screen PrintingSSO Stop Ship OrderSTS Ship-to-StockSTS Ship To StockSUB-ASSY Sub-AssemblySURSW Switch [SW]SWB Sea Way BillSWP Standard Work ProcedureT & C Term and ConditionT/S Trouble - ShootingT/T A Advance Telegraphic TransferTAT Turn-around-TimeTCB Telecommunication Certification Body TE Test EngineerTEMP TemperatureTg Glass TransitTH Through HoleTHBTMCL Temperature Cycle Reliability Test TNKY TurnkeyTOV Time of ValidityTPEDP Third Party Test Data ProgramTPM Total Prevention MaintenanceTPY Throughput YieldTQ Thank YouTQA Total Quality AssuranceTQM Total Quality ManagementTR Trust ReceiptTSD Test Support DepartmentTT Telegraphic TransferTUV TUV Rheinland GroupTWDTYP TypicalU/L UploadU/P or UP Unit PriceUAI Use-as-IsUC Undertaking ClauseUCL Upper Control LimitUKAS United Kingdom Accreditation ServiceUL Underwriters LaboratoriesUL Underwriter's LaboratoriesUL Usance Letter of CreditUML Urgent Material ListUSB Universal Serial BusUSDUSL Upper Specification LimitUV Ultra-violetUV UltravioletVA Visual AidVA/VE Value Anglysis / Value Engineering VAD Visual Aid DisplayVCAR Vendor Corrective Action Request/Report VE Value EngineeringVer VersionVF Variance FrequencyVHR Vendor History RecordVideo-CDVIP Very ImportantVMI Visual Mechancial InspectionVMI Vendor Managed InventoryVOC Voice of CustomerVP Vice PresidentVR Variance RateVR Voltage Regulator [VR, V or U]VSR Vendor Scoring &RatingW&B Wire BondingW/WithW/O WithoutWHT White ColourWHTOLWHTRBWI Work InstructionWIP Work In ProgressWIP Work In ProcessWIP Working in ProcessWN Waiver NoticeWR Wire [J or W]WR TERM Wire TerminalWS Work Standard / Workmanship Standard WS Working SampleWSHR WasherXFMR Transformer [T]XSTR Transistor [Q or U]X'TAL Crystal [Y]ZD Zero DefectsReviewAuditBurn-InQuality CostQuality PolicyQuality ObjectiveConformityNon-ConformityReliabilityLiabilityMIL-STD-105D Yield Rate Operation Process Operation Research Optimum Solution Work Simplify Brain Storming Outstanding Blance Debit Note Railway Bill Phase-InPhase-Out System Procedure IndexReleaseProject Plan WindowProject Leader Plug And Play Bare Bone PostponeWork In Process Lead Time Alternate BOM Pending Assemble Component Reservation Access Time Random Seek SwapDVD-RAMDVD-Title Inflation DeflationVendor Rating Life TestSpindle Motor Control Run Report Error CodeOrderBufferClean Room中文解释人，机器，方法，物料，环境- 可能导致或造成问题的根本原因为IT,无线电通讯和电讯产品提供认证和服务的机构为销售到英国（UK）的电气产品的安全性提供认证的独立机构中国强制认证 -中国于2003年8月1日将"CCIB"和"CCEE"归纳于"CCC"认证中，将原有的进出口货品检查和出口产品质量认证归纳于这一体系“CCC”。

TAPE APPLICATION NOTECONNECTING THE M2488 TOSGI CHALLENGE L, M AND S SYSTEMS RUNNING IRIX 5.3FOREWORDThis application note describes the procedure to use when attaching to SGI Challenge L, M and S systems running IRIX 5.3.Instructions cover installing the M2488 tape drive hardware and configuring the system to communicate with theM2488. The IRIX manuals provide detailed descriptions of many of the operations performed in this application note.The minimum M2488 microcode level for this application note is “2.C”.PROCEDURE** NOTE **This procedure changes system files. In order to leave a history, each file that is to be modifiedshould first be saved using a command of the form “cp -p file file.ori”.You must be superuser to perform the operations in this procedure.Displays are presented in this typeface:/etc/passwdUser entries are presented in this typeface:bootSTEP ACTION1Shut down the host and power the unit off.2Ensure that the M2488 is properly terminated and connect the M2488 tape drive to the system’s SCSI controller. The M2488 Cartridge Tape Drive Product Guide may be useful for configuration of theM2488.Set the SCSI target ID to any unused address (1-7) on this SCSI port. On SGI systems, target address0 is typically reserved for use by the initiator. Address 4 lun 0 on SCSI port 4 is used for the examplesin this section.3Power on the M2488 and wait for the power cycle to complete.4Turn the system AC power on and wait for the “System Maintenance Menu” prompt. At the prompt choose the “Enter Command Monitor” option (option?5).CG00000-016502 Rev. B4 (con’t)Enter the following command at the “>>” prompt:hinv -t -vThe system will respond with something like:..adapter SCSI WD33C95A key 4controller tape FUJITSU M2488x M2488 key 4peripheral tape unit 0 ( Removable Input Output )..If you do not see this message, then re-check the SCSI cables and termination to the M2488.5Enter the following command at the “>>” prompt:exit and wait for the “System Maintenance Menu” prompt. At the prompt choose the “Start System” option (option?1).6Login as root and enter the following command at the prompt:hinv -c tapeThe system will respond with something like:Tape drive: unit 4 on SCSI controller 4: unknown7Enter the following command:cd /usr/include/sys8Next, modify some system files. The files that will be changed are:/usr/include/sys/tpsc.h/usr/include/sys/invent.h/var/sysgen/master.d/scsi/dev/MAKEDEVNOTE: You must be superuser to edit these files.9Use your favorite editor to edit the file“/usr/include/sys/tpsc.h”. Find the“IS_CIPHER”,“IS_TANDBERG”, “IS_EXABYTE”, and/or “IS_DLT” drive type macros, and at the end of thissection add the following lines to the end of the drive type macros:/* Fujitsu M2488 36-track drive* Notes:* 1. compression turned on through device config page of mode select*/#define IS_FJM2488(ctinfo) (ctinfo->ct_typ.tp_type == FJM2488)10Just below this section is a list of “ct_typ.tp_type”s. It will have “N” entries. Add the follow-ing line to the end of the list:#define FJM2488“N+1” /* Fujitsu M2488 1/2” cartridge tape */Where “N+1” is the next sequential value in the list. For example if the list ends with 9, the new entrywill be:#define FJM248810 /* Fujitsu M2488 1/2” cartridge tape */NOTE: This is normally a read-only file. If you are editing with “vi”, you must end your session with“:x!”.11Edit (vi) the file “/var/sysgen/master.d/scsi” and find the “tpsc_types tpsc_types[] = {”structure. Add the following after the last entry (do not forget the “,”):2 of 6CG00000-016502 Rev. B May 199611 (con’t),/* FUJITSU 3490E-class tape drive */{ FJM2488, TP3480, 8, 5, “FUJITSU “, “M2488”,0, 0, {0x09, 0x09, 0x09, 0x09},MTCAN_BSF | MTCAN_BSR | MTCAN_APPEND |MTCAN_SYNC | MTCAN_LEOD | MTCAN_CHKRDY |MTCAN_VAR | MTCAN_SETSZ | MTCAN_SETDEN |MTCAN_SILI | MTCANT_RET | MTCAN_SEEK |MTCAN_CHTYPEANY,20, 8*60, 20*60, 5*60, 4096, 16*1024 }};/* end of structure */Where:•The first parameter (FJM2488) is a type from the ct_typ.tp_types area in/usr/include/sys/ tpsc.h. It is used for some capability, and some error code decoding•The second parameter (TP3480) is a type from the TP* tape types in/usr/include/sys/invent.h.It tells the system that the drive is a 1/2-inch cartridge drive.•The third parameter (8) is the length of the INQUIRY vendor ID string.•The fourth parameter (5) is the length of INQUIRY product id string.•The fifth parameter (FUJITSU)is the vendor id string that is returned by the M2488 on a SCSI INQUIRY command. Note that you must have one space at the end of FUJITSU.•The sixth parameter (M2488)is the product id string that is returned by the M2488 on a SCSI INQUIRY command.•The seventh parameter (0) is the number of extra bytes transferred on MODE SELECT.•The eighth parameter (0) should be null if the seventh parameter is 0.•The ninth parameter (0x09, 0x09, 0x09, 0x09) is a list of density codes supported by the M2488.Density code 0x09 is the default density code of the M2488 at power-up.•The tenth parameter is the drive options field, as defined in/usr/include/sys/mtio.h. The parame-ters mean the drive supports the following modes of operation:-MTCAN_BSF can backspace file-MTCAN_BSR can backspace record (block)-MTCAN_APPEND can append to existing tape files-MTCAN_SYNC can do synchronous mode SCSI-MTCAN_LEOD Use a logical EOD (as opposed to an EOD detectable by the drive).Currently only 9-track drives. If set, it is assumed EOD is markedby 2 sequential filemarks. Setting this also implies causes twosequential FM’s to be written on close, when writing.-MTCAN_CHKRDY can determine if a tape is present; some drives, such as Cipher540Sreturn OK on a test unit ready even if no cartridge is present.-MTCAN_V AR can do variable block sizes-MTCAN_SETSZ can set fixed block size-MTCAN_SETDEN can set tape density-MTCAN_SILI can set suppress illegal length errors; only on drives that supportvariable block sizesMay 1996CG00000-016502 Rev. B 3 of 611 (con’t)-MTCANT_RET some drives can’t retension; the driver will do it’s best by spacing toEOD and rewinding.-MTCAN_SEEK drive supports seeking to a particular block-MTCAN_CHTYPEANY drive can change density and/or fixed to variable at any point (if itcan change at all). Otherwise it can change only at BOT•The eleventh parameter (20) is the transfer timeout in seconds.•The twelfth parameter (8*60) is the minimum timeout for any command in seconds.•The thirteenth parameter (20*60) is the space FM and space EOM command timeout in seconds.•The fourteenth parameter (5*60) is the timeout for very long operations, like rewind, retension, and erase. The units are in seconds and the time is doubled for retension.•The fifteenth parameter (4096) is the default (and often only) block size in fixed block mode.•The sixteenth parameter (16*1024) is the recommended blocking factor; note that it is given in bytes, not as a multiplier for the blocksize.The “MTCAN_” equates are defined in the file/usr/include/sys/mtio.hNOTE: This is normally a read-only file. If you are editing with “vi”, you must end your session with “:x!”.12Edit (vi) the file “/dev/MAKEDEV”. Find the “tps:” SCSI tape driver section and at the end of this section, just above the “*Drive*) \” entry, add the following lines:*Drive?type:*3480*) \set s nrs ns ““ nrns nr sv nrsv nsv v nrnsv nrv ; \for add in 0 1 2 2 3 3 4 5 6 6 7 7 ; do \mdev=`expr $$minor + $$add`; \mknod $${prf}$$1 c ${C_TPS} $$mdev; \shift; \done ;; \13Find the “tapelinks:” SCSI tape driver section and at the end of this section, in the: “case “$$stat” {”section, just above the “*) \” entry, add the following lines:*Device:*FUJITSU**Drive?type:*3480?cartridge*) \echo \\tFujitsu M2488 cartridge tape drive; \echo \\tln -f rmt/tps$${c}d$${d}nsv tape; \ln -f rmt/tps$${c}d$${d}nsv tape; \echo \\tln -f rmt/tps$${c}d$${d}nrnsv nrtape; \ln -f rmt/tps$${c}d$${d}nrnsv nrtape; \echo \\tln -f rmt/tps$${c}d$${d}nsv tapens; \ln -f rmt/tps$${c}d$${d}nsv tapens; \echo \\tln -f rmt/tps$${c}d$${d}nsv abi/tape; \ln -f rmt/tps$${c}d$${d}nsv abi/tape; \echo \\tln -f rmt/tps$${c}d$${d}nrnsv nrtapens; \ln -f rmt/tps$${c}d$${d}nrnsv nrtapens;; \NOTE: This is normally a read-only file. If you are editing with “vi”, you must end your session with“:x!”.14Enter the following command:/etc/autoconfig -n and verify that a message like “New kernel would have been built:” is returned by the system.15If the previous command is successful, then enter the following commands in the order presented:4 of 6CG00000-016502 Rev. B May 1996May 1996CG00000-016502 Rev. B 5 of 6Installation and verification of the system is now complete.NOTESThis procedure has been tested on SGI Challenge L, M, and S Systems. This procedure may work on other Challenge Systems, but has not been tested on them.It is assumed that the user has a standard M2488 and is familiar with the SCSI-2 standard and host operating system conventions.The user assumes all responsibility for understanding the interrelationships of this information with other affected software or system products. Fujitsu Computer Products of America (FCPA) provides this information as a service only, and assumes no responsibility for any damages which could result from the use of this information.The information in this application note is subject to change without notice and is not to be construed as a commit-ment by FCPA.15(con’t)/etc/autoconfig /usr/sbin/lboot /etc/reboot 16Wait for the Shutdown to complete, then login as root and enter the following commands in the orderpresented:sucd /devrm *tape*./MAKEDEV tapeThe system creates special link files in /dev so that it can communicate with the M2488 (via files in /dev/rmt/). If the MAKEDEV is successful, the system displays:SCSI tape unit 4 on controller 4 assumed for main tape deviceFujitsu M2488 cartridge tape driveln -f rmt/tps4d4nsv tapeln -f rmt/tps4d4nrnsv nrtapeln -f rmt/tps4d4nsv tapensln -f rmt/tps4d4nsv abi/tapeln -f rmt/tps4d4nrnsv nrtapensNote that these “tape” devices have slightly different characteristics than the other tape devices cre-ated by this program. That is,/dev/tape is accessed as an non-swapping variable block tape drive.This allows easier interchange to non-SGI systems.17To test the M2488, save the “passwd” file to tape using the tar command *:tar -cvf /dev/tapens /etc/passwdThe system responds with:a /etc/passwd 3 blocksNOTE: Depending on the size of the file, a different number of blocks may be reported.* To read this file on a non-SGI system, then enter:tar -cvfb /dev/tapens 1 /etc/passwdThis forces the file to be written in 512 byte block tar format.18Verify that the “passwd” file was correctly saved to tape by executing the following command:tar Cf /dev/tapensThe system responds with: “= /etc/passwd ”.The “=” means that the tape and disk files compare.6 of 6CG00000-016502 Rev. B May 1996。