第五章 常态分配 (The Normal Distribution)

资料收集手法认识P-1何谓QC手法QC手法有人称为 QC手法有人称为 品管七大手法、 品管七大手法、品管七大工具 QC技巧 QC道具 技巧、 QC技巧、QC道具•其实无论是哪一种说词或说法QC手法都是工 厂管理与进行改善的重要而有效的工具•经过一些品质管理大师将实务上的运用及各 方管理 •的创新融合，又再建立了一些新的QC管理手 法，称之为「新QC手法」。

P-2认识QC手法查核表(查检表) Sheet/List： 1. 查核表(查检表) Check Sheet/List：用于观察现状及协助其 他手法搜集数据 Stratification： 2. 层别法 Stratification：协助其他手法分层过滤问题 特性要因图鱼骨图) CauseDiagram/Fishbone： 3. 特性要因图鱼骨图) Cause-Effect Diagram/Fishbone：用于 结果与原因间之分析 Chart：用于重点提示、 4. 柏拉图 Pareto Chart：用于重点提示、协助目标订定 直方图(次数表) Histogram： 5. 直方图(次数表) Histogram：用于观察管制状态之分布 Plot：用于观察两变量间分布之关联性。

6. 散布图 Scatter Plot：用于观察两变量间分布之关联性。

图 形的表达， 形的表达，能够一目了然知道数据之分布状态 Chart：用于制程状态下之异常管制( 7. 管制图 Control Chart：用于制程状态下之异常管制(此主题 另外解说P-31查核表简介就有关项目及预定收集的数据，依 其使用目的，使用简单记号填记，并予 统计整理，以作进一步分析或作为核对 、检查之用而设计的一种表格。

P-41查核表制作程序综合各项分类，一个完整的查核表制作程序是： 先确定目的所在，将目的明确化。

决定记录的项目。

决定取样方式。

决定记录的格式，设计记录的格式实施检查。

数据资料来源依据需清楚。

PCB Jargon (PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PP Bonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away Tab Break Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水(De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉RivetFFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测High Potential Test Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际标准组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局(configuration, general arrangement)Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解析度Resolving Power 解析力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商管理系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带试验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之T ouch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业试验Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitDLD: Direct Laser Drilling (CO2 Laser, YAG Laser)DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only MemoryEMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP (產品質量先期策劃和控制計劃) Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析)Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage) 边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes) 对孔之套准度（各种表处理层）Registration to Other Conductive Patterns 其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands) 球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands) 球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam) 球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes 针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified) 焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection 内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection 内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度试验Solderability Testing焊锡性试验Plated-Through Holes镀通孔Electrical Integrity电性之完整平行光曝光机：Collimated ExposureCollimated Exposure二次元测量仪two dimension measuring instrument,镀层厚度测试仪Plating Thickness Tester电导率测试仪：Conductometer剥离强度测试仪peel strength TesterROHS检测仪ROHS TesterLCR测试仪LCR Tester喷砂机：sandblasting machine磨板机：Scrubbing立式圆角机Corner rounding Machine开短路测试机short circuit tester碱性蚀刻机：alkalineetchingmachine剪板机: steel plate shearer高温烤箱high-temperature oven飞针测试机：Flying Probe E-Test Machine铣边机edge milling machine超声波清洗机ultrasonic cleanersDES水平线DES level自私，让我们只看见自己却容不下别人。

PCB电路板术语PCB Jargon (PCB专业术语) AAbsorption 吸收、吸入Accelerated T est（Aging）加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PP Bonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away Tab Break Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法DDatum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水(De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉RivetFFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具(Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用标准板Grid 标准格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测High Potential T est Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际标准组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应Keyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局(configuration, general arrangement) Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板Nail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解析度Resolving Power 解析力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商管理系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带试验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之Touch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业试验Underwriters Laboratories/INC Ultra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitDLD: Direct Laser Drilling (CO2 Laser, YAG Laser)DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only MemoryEMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP (產品質量先期策劃和控制計劃) Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析)Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And T olerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage) 边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes) 对孔之套准度（各种表处理层）Registration to Other Conductive Patterns 其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands) 球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands) 球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam) 球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes 针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Cra ck孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified) 焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection 内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection 内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度试验Solderability Testing焊锡性试验Plated-Through Holes镀通孔Electrical Integrity电性之完整平行光曝光机：Collimated ExposureCollimated Exposure二次元测量仪two dimension measuring instrument,镀层厚度测试仪Plating Thickness Tester电导率测试仪：Conductometer剥离强度测试仪peel strength TesterROHS检测仪ROHS TesterLCR测试仪LCR Tester喷砂机：sandblasting machine磨板机：Scrubbing立式圆角机Corner rounding Machine开短路测试机short circuit tester碱性蚀刻机：alkalineetchingmachine剪板机: steel plate shearer高温烤箱high-temperature oven飞针测试机：Flying Probe E-Test Machine铣边机edge milling machine超声波清洗机ultrasonic cleanersDES水平线DES level自私，让我们只看见自己却容不下别人。

质量管理常用缩写【A】ABC Activity-Based Costing 作业制成本制度AR Account Receivable 应收款AP Account Payable 应支AVL Approval Vendor List 合格厂商ACC accept 允收APP Approve 核准,认可,承认ASSY Assembly 装配,组装A.S.A.P As Soon As Possible 尽可能快的AOD Accept On Deviation 特采（n,背离）AQL Acceptable Quality Level 运作类允收品质水准ANOVA Analysis of Variance 变异数分析/方差分析APQP Advanced Production Quality Plan 产品质量先期计划ADM Absolute Dimension Measurement 全尺寸测量AR Average Range 全距平均值AOQL Average Output Quality Level 平均出货品质水平【B】BOM Bill Of Material 物料清单BTF Build To Forecast 计划生产BTO Build To Order 订单生产BSC Balanced Scoreboard 平衡计分卡【C】CAR Corrective Action Request 改进对策要求CAR Correction Action Report 改善报告CPM Complaint per Million 每一百万个使用者会有几次抱怨CPM Critical Path Method 要径法CRM Customer Relationship Management 客户关系管理CRP Capacity Requirements Planning 产能需求规划CS Customer Satisfaction 顾客满意度CS Customer Service 顾客服务CTO Configuration To Order 客制化生产CTQ Critical to quality 质量关键COGS Cost Of Goods Sold 销售成本CQA Customer Quality Assurance 客户品质保证CSA Customer Simulate Analysis 客户模拟分析CIP Continual Improvement Plan 持续改善计划CRA corrective action report 改正行动报告(改善报告) CON Concession / Waive 特采CAT Carriage Alignment T ool 载器调整具CR Critical 极严重的CP capability index 能力指数/准确度C=0 Critical=0 极严重不允许CHK Check 确认CPU Central Processing Unit 中央处理器CTN Carton 卡通箱CPK capability process index 过程能力参数Conformity 合格（符合）Characteristic 特性continual improvement 持续改进Correction 纠正Cost down 降低成本Confidence interval 信赖区间Control chart 管制图Cause and Effect matrix 因果图.鱼骨图Center line 中心线check 检查Check Sheet 查检表Characteristic Diagram 特性要因图Complaint 投诉CPI: continuous Process Improvement 连续工序改善【D】DIM Dimension 尺寸DIA Diameter 直径DWG Drawing 图面DC Document Center 资料中心D/C Date Code 生产日期码DQA Design Quality Assurance 设计品质保证DOE Design of Experiments 实验设计DCC Document Control Center 数据控制中心DPPM Defective Pieces Per Million units 百万件中有损件数DPMO Defects per million opportunities 每百万个机会的缺点数DPU Defects per unit 单位缺点数DFSS Design for six sigma 六个希格玛设计DOE Design of experiment 实验设计DVT Design Verification Testing 设计验证DSS Decision Support System 决策支持系统DCN Design Change Notice 设计变更通知DMR Defective Material Report 材料缺陷报告DWG Drawing 图面系统文件类DOE Design of Experiments 实验设计DSA Defects Analysis System 缺陷分析系统Data Collection 数据收集Description 描述Device 装置Digital 数字Do 执行Design of manufacturing 制造设计deviation permit 偏离许可degrade 降级design and development 设计和开发dependability 可信性Defect 缺陷Decision 决心Data 数据Data Collection 数据收集Data concentrator 资料集中缓存器Decision 决策.判定Defects per unit 单位缺点数Description 描述Detection 难检度Device 装置Digital 数字Do 执行【E】EC Engineer Change 设计变更／工程变更EC Electronic Commerce 电子商务EMC Electric Magnetic Capability 电磁相容EOQ Economic Order Quantity 基本经济订购量ERP Enterprise Resource Planning 企业资源规划ECN Engineering Change Notice 工程变更通知(供货商) ECO Engineering Change Order 工程改动要求(客户)ERS External Reference Spec 外部规格ERP Enterprise Resource Programming 企业资源项目ES Engineering Standard 工程标准E-MAIL Electrical-Mail 电子邮件EAR Engineering Analysis Request 工程分析要求EV Equipment Variation 设备变异ES Engineering Standardization 工程标准Environmental 环境Equipment 设备Effectiveness 有效性Efficiency 效率Element 元素Else 否则Engineering technology 工程技术Entropy 函数Estimated accumulative frequency 计算估计累计数External Failure 外部失效,外部缺陷Event 事件【F】FMEA Failure Mode and Effect analysis 失效模式与效果分析FA Failure Analysis 不良分析FQA Final Quality Assurance 最终品质保证FQC Final Quality control 最终品质控制FAI first article inspection 首件检查FAA first article assurance 首件确认FPIR First Piece Inspection Report 首件检查报告F/T Function Test 功能测试FMS Flexible Manufacture System 弹性制造系统FQC Finish or Final Quality Control 成品质量管理FGI Finished goods Inventory 成品存货FTA Fault Tree Analysis 故障树分析FREQ Frequency 频率FIN Finance 财务Fix OH Fix Overhead 固定管理费用Finance Accounting 财务账目Failure rate 故障率Fact control 事实管理FPY 合格率Full-steer 完全转向function 职能【G】GS General Specification 一般规格GRR Gauge Reproducibility & Repeatability 量具之再制性及重测性判断量测可靠与否Gauge system 量测系统Grade 等级General Affair 总务【H】H/W hardware 硬件H/T High Temperature Test 高温测试HQ Headquarter 总公司HR Human Resource 人力资源部Histogram 直方图Hypothesis testing 假设检定Health meter 体重计Heat press 冲压粘着Hi-tech 高科技【I】IMD Image Management Division 影像管理事业部ITS Information Technology System 计算机部IPQC In Process Quality Control 制程品质控制IQC Incoming Quality Control 来料品质控制IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织IS Inspection Specification 成品检验规范IE Industrial Engineering 工业工程ID/C Identification Code (供货商)识别码ID Industrial Design 工业设计(外观设计)IS Information System 资讯系统IT Information Technology 系统技术ISAR Initial Sample Approval Request 首批样品认可I/O input/output 输入/输出Improvement 改善Inductance 电感Information 信息Initial review 先期审查Inspection 检验Internal Failure 内部失效,内部缺陷Interested party 相关方Infrastructure 基础设施Inspection 检验【J】JIT Just In Time 实时管理JQE Joint Quality Engineer 客服工程师【L】LCL Lower Control limit 管制下限LQC Line Quality Control 生产线品质控制LQL Limiting Quality Level 最低品质水准L/T Lead Time 前置时间(生产前准备时间)LRR Lot Reject Rate 批退率LSL Lower Size Limit 规格下限L/T Low Temperature Test 低温测试L/N Lot Number 批号LAB Laboratory 实验室LPCL Lower Per-control Limit 前置管制下限Love 爱心Link 连接Life Test 寿命测试Law of large number 大数法则【M】MSA Measurement System Analysis 量测系统分析MPS Mass Production Schedule 量产计划MTF Modulation Transfer Function 调整转换功能MC Material Control 物料控制MVT Mass Verification Test 多项验证测试MIL-STD Military Standard 军用标准MIS Management Information System 管理资讯系统MTBF Mean Time Between Failure 平均故障间隔MAJ Major 主要的MIN Minor 轻微的MIN Minimum 最小值MAX Maximum 最大值MQA Manufacture Quality Assurance 制造品质保证MRP Material Requirement Planning 物料需求计划MRB Material Review Board 物料评审委员会MRB Material Reject Bill 退货单MO Manufacture Order 生产单MFG Manufacturing 制造部MES Manufacturing Execution System 制造执行系统management system 管理体系Materials 物料Measurement 量测management 管理Machine 机械Materials 物料Median 中位数Miss feed 漏送Momentum 原动力Multiplication rule 乘法运算规则【N】N/A Not Applicable 不适用NG Not Good 不行,不合格N Number 样品数NFCF Notice for Changing Forecast 更改预估量的通知Nonconformity 不合格（不符合）Normal distribution 常态分配【O】OQA output quality assurance 出货质量保证OQC Out going Quality Control 出货质量控制OPT Optimized Production Technology 最佳生产技术ORT On Going Reliability T est 出货可靠性测试OBA Open Box Audit 成品检验OEM Original Equipment Manufacture 原设备制造OBA out of box audit 开箱检查Occurrence 发生率Organization 组织organizational structure 组织结构Operation Instruction 作业指导书【P】PR Public relation 公共关系PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制P&L Profit & Lose 利润与损失PV Performance Variance 性能差异PRS Pairs 双(对等)PO Purchasing Order 采购订单PD Product Department 生产部POC passage quality control 检人员P/N Part Number 番号PPM Percent Per Million 百万分之一PS Package Specification 包装规范PD Product Department 生产部PCBA Printed Circuit Board Assembly 电路板组装PVT Production Verification Test 生产验证测试PDCA Plan-Do-Check-Action 管理循环PQC process quality control 制程检查管制PQA Process Quality Assurance 制程品质保证PPAP Production Parts Approval Procedure 生产件批准程序PCL Per-control Central Limit 前置管制中心限PO Purchase Order 订单PUR Purchasing 采购President 总裁preventive action 预防措施Plato Diagram 柏拉图Parameter 参数Part 零件Pulse 脉冲Policy 方针Procedure 流程Process 过程Product 产品Production 生产Program 方案Projects 项目Progress 进步Passive 消极的,被动的Population 群体Power 力量,能源Practice 实务Precision 精密度preemptive 先占式多任务Pressure 压缩Prevention 预防Probability 机率Probability density function 机率密度函数Process capability analysis 制程能力分析图Process control and process capability 制程管制与制程能力Producer’s risk 生产者之风险【Q】QA Quality Assurance 品质保证QC Quality Control 品质控制QE Quality Engineering 品质工程QFD Quality Function Design 品质架构设计OQA output quality assurance 出货质量保证人员QRA Quality & Reliability Assurance 质量与可靠性保证QE Quality Engineer 质量工程师QRA Quality Reliability Assurance 品保部QCC Quality Control Circle 品管圈QP Quality Policy 目标方针QIT Quality Improvement Team 品质改善小组QI Quality Improvement 品质改善Q/R/S Quality/Reliability/Service 品质/可靠度/服务QTY Quantity 数量QVL Qualified Vendor List 合格厂商QFD quality function deployment 质量机能展开QS Quality System 品质系统QRA Quality Reliability Assurance 品质保证(处)QSA Quality System Audit 品质系统审核QT Quality Target 品质目标QCP Quality Control Procedures 品管程序quality objective 质量目标quality plan 质量计划qualification process 鉴定过程Quality manual 品质手册【R】RMA Return Material Audit 退料认可R&D Research & Design 设计开发部RMA Return Material Administration 材料回收管理RMA Returned Material Approval 退货验收ROP Re-Order Point 再订购点REE Reject 拒收RMA Return Material Authorization/Authority 退料认可RPN Risk Priority Number 风险系数Record 记录Reflow 回流Repair 返修Repeatability 可重复性Reproducibility 再现性Requirement 要求Residual 剩余的，残留的Response 响应Responsibilities 职责Review 评审Rework 返工Rolled yield 直通率Release 放行Range 全距Random experiment 随机试验Random numbers 随机数Range 全距Reject 拒收Response 响应Responsibility 职责Robustness 稳健性Rolled yield 直通率【S】SOP Standard Operation Procedure 标准作业书SPC Statistical Process Control 统计制程管制SQA Source(Supplier) Quality Assurance 供应商品质保证SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范SPC Statistical Process Control 统计过程管制SQC Statistical Quality Control 统计质量管理SSQA standardized supplier quality audit 合格供货商品质评估S/S Sample size 抽样检验样本大小SQA Strategy Quality Assurance 策略品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证SPEC Specification 规格SWR Special Work Request 特殊工作需求SAP System Application Programming 体系运行计划S/W software 软件SFC Shop Floor Control 现场控制SO Sales Order 订单SIP Specification Inspection Process 制程检验规格SQM Supplier Quality Management 供应商品质管理SL Size Line 规格中心线Stratification 层别法System 体系(系统)Sales 销售Supplier 供方sample 抽样,样本Scrap 报废sample 抽样,样本Scatter diagram 散布图分析Screw 螺旋Severity 严重度Size 规格Slip 滑动Special cause 特殊原因Specification 规范Stage sampling 分段随机抽样statistical table 统计(数值)表Sum of squares 统计表systematic sampling 系统抽样Sample space 样本空间Simple random sampling 简单随机取样Stratified random sampling 分层随机抽样Sampling with replacement 放回抽样Sampling without replacement 不放回抽样【T】TQC Total Quality Control 全面品质控制TQM T otal Quality Management 全面品质管理TPM Total Production Maintenance 全面生产保养T/P True Position 真位度T/C Temperature Cycle 温度循环T/O Turn Over Rate=Monthly 周转率TOC Theory of Constraints 限制理论TVR tool verification report 模具确认报告Taguchi-method 田口方法top management 最高管理者Test 试验traceability 可追溯性Technical committees 技术委员会Test piece 测试片Theory 原理Time stamp 时间戳印Time-lag 延迟Title 标题Torque 转矩Total 求和Traceability 追溯Training 培训Trouble 困扰Transaction processing and logging 交易处理【U】UCL Upper Control Limit 管制上限USL Upper Size Limit 规格上限UTS Units To Stock 存货单元UPCL Upper Per-control Limit 前置管制上限Up and down 上和下【V】VQM endor Quality Management 厂商质量管理VMI Visual Mechanical Inspection 外观机构检验VOC voice of Customer 客户需求VOE Voice of Engineer 工程需求Vice President 副总裁Verification 验证Validation 确认Variable 计量值Version 版本Vector 向量【W】WIP Work In Process 在制品WDR Weekly Delivery Requirement 周出货要求work environment 工作环境【Z】ZD Zero Defect 零缺点。

品质术语-中英文对照英文缩写中文名称英文全名SPC 统计制程管制Statistical Process ControlUSL 规格上限Upper Specification LimitLSL 规格下限Lower Specification LimitUCL 管制上限Upper control limitLCL 管制下限Lower control limitPCL 前置管制中心限Per-control Central Limit UPCL 前置管制上限Upper Per-control LimitLPCL 前置管制下限Lower Per-control LimitCaCpPpPpkContinuous Improvement Process ModelANOV A 变异数分析Analysis of VarianceBSC 平衡计分卡Balanced Scoredoard信赖区间Confidence interval管制图Control chartCTQ 品质关键Critical to qualityDPMO 每百万个机会的缺点数Defects per million opportunitiesDPM 每百万单位的缺点数Defects per millionDPU 单位缺点数Defects per unitDFSS 六个希格玛设计Design for six sigmaDOE 实验设计Design of experiment制造设计Design of manufactringFMEA 故障型态与效应分析Failure mode and effect analysis故障率Failure rateGage R & R 量规重复能力与重制能力Gage repeatability & reproducibility直方图Histogram假设检定Hypothesis testingKM 知识管理Knowledge ManagementMRP 物料需求规划Material require planning 常态分配Normal distributionQFD 品质机能展开Quality function deployment6 σ六个希格玛Six Sigmaσ, s标准差Standard deviation σ2, S2变异数VarianceABC 作业制成本制度Activity-Based CostingBTF 计划生产Build To ForecastBTO 订单生产Build To OrderCPM 要径法Critical Path MethodCPM 每一百万个使用者会有几次抱怨Complaint per MillionCRM 客户关系管理Customer Relationship ManagementCRP 产能需求规划Capacity Requirements Planning CS 顾客满意度Customer SatisfactionCTO 客制化生产Configuration To OrderDVT 设计验证Design Verification TestingDSS 决策支持系统Decision Support SystemEC 设计变更／工程变更Engineer ChangeEC 电子商务Electronic CommerceEMC 电磁兼容Electric Magnetic CapabilityEOQ 基本经济订购量Economic Order Quantity ERP 企业资源规划Enterprise Resource Planning FMS 弹性制造系统Flexible Manufacture System FQC 成品品质管制Finish or Final Quality Control IPQC 制程品质管制In-Process Quality ControlIQC 进料品质管制Incoming Quality ControlISO 国际标准组织International Organization for StandardizationISAR 首批样品认可Initial Sample Approval Request JIT 实时管理Just In TimeMES 制造执行系统Manufacturing Execution System MO 制令Manufacture OrderMPS 主生产排程Master Production ScheduleMRO 请修(购)单Maintenance Repair Operation MRP 物料需求规划Material Requirement Planning MRPII 制造资源计划Manufacturing Resource PlanningNFCF 更改预估量的通知Notice for Changing ForecastOEM 委托代工Original Equipment Manufacture ODM 委托设计与制造Original Design & ManufactureOPT 最佳生产技术Optimized Production Technology OQC 出货品质管制Out-going Quality Control PDCA PDCA管理循环Plan-Do-Check-ActionPO 订单Purchase OrderQA 品质保证Quality AssuranceQC 品质管制Quality ControlQCC 品管圈Quality Control CircleQE 品质工程Quality EngineeringRMA 退货验收Returned Material ApprovalROP 再订购点Re-Order PointSCM 供应链管理Supply Chain ManagementSFC 现场控制Shop Floor ControlSO 订单Sales OrderSOR 特殊订单需求Special Order RequestTOC 限制理论Theory of ConstraintsTPM 全面生产管理Total Production Management TQC 全面品质管制Total Quality ControlTQM 全面品质管理Total Quality ManagementWIP 在制品Work In Process5S Sort, Storage, Shine, Standardize, SustainA PartABC Activity Based CostingABM Activity Based ManagementAPS Advanced Planning SystemAOP Annual Operating PlanAPQP Advanced Product Quality PlanningASQ/AIAG American Society of Quality/Automotive Industry Action GroupB PartBOM Bill of MaterialC PartCAD Computer Added DesignCAM Computer Added ManufacturingCNC Computer Numerically ControlledCOPQ Cost of Poor QualityCpk Capability Index for Stable ProcessD PartDFM Design for ManufacturabilityDFX Brings Six Sigma tools to the design process. DFX includes:DFM (Design for Manufacturing),DFC (Design for Cost),DFT (Design for Test),DFS (Design for Service) DOE Design of ExperimentsE PartEDI Electronic Data InterchangeEPA Environmental Protection AgencyESI Early Supplier InvolvementF PartFAI First Article InspectionFMEA Failure Modes and Effects AnalysisG PartG&A General & AdministrativeGR&R Gage Repeatability & ReproducibilityH PartHS&E Health Safety and EnvironmentI PartIPDS Integrated Product & Development System ISO International Standards OrganizationISW Initial Sample WarrantL PartL/T Lead TimeM PartMPS Master Production ScheduleMRP Material Resource PlanningMSA Measurement System AnalysisMSDS Material Data Safety SheetsN PartNPD New Product DevelopmentNRE Non Reoccurring EngineeringO PartOHSA Occupational Heath and Safety ActP PartPEP Product Excellence ProcessPFMEA Process Failure Modes and Effects Analysis P/N Part NumberPPM Parts Per MillionPPAP Production Part Approval ProcessQ PartQS-9000 Quality System Requirements (Automotive)R PartRCCA Root Cause and Corrective ActionRCCP Rough Cut Capacity PlanningRFQ Request for QuoteRMA Returned Material AuthorizationS PartSA VE Supply Chain Assisted Value Engineering SIOP Sales, Inventory & Operations PlanningSLT Short Lead TimeSOP Sales and Operations PlanningSPC Statistical Process ControlSPRS Supplier Performance Rating SystemSTS Ship to StockT PartTPM Total Preventative MaintenanceTQ Total QualityTSCA Toxic Substance Control ActW PartWIP Work In Progress3C 原理customer take chargecompetition intensifieschangebecome constant三、常用词ATL 生产常用英语一、文件二、部门名称文件架构三个层次品质/环境管理手册品质体系/环境体系程序品质/环境系统指示书四、其它。