EL2004中文资料

欧洲标准 EN103272004.6ICS 77.140.50; 77.140.10 替代 EN 10142:2000EN 10154:2002EN 10214:1995EN 10215:1995 冷成形用连续热浸镀低碳钢钢板和钢带——交货技术条件CEN欧洲标准化委员会1 范围1.1 本标准规定了厚度在0.35mm~3.0mm(除非另有协议,见1.2的连续热浸镀低碳钢镀锌(Z、镀锌铁合金(ZF、镀锌铝合金(ZA、镀铝锌合金(AZ和镀铝硅合金(AS(见表1的钢板和钢带的交货技术要求。

这里的厚度是指交货产品镀层后的最终厚度。

本标准适用于所有宽度的钢带和从宽度≥600mm的钢带剪切而成的钢板及从宽度<600mm的钢带剪切而成的定尺产品。

1.2 如果在询价和订货时有协议,本标准也适用于厚度>3.0mm的连续热浸镀镀层扁平材产品。

在这种情况下,产品的力学性能、镀层附着性和表面质量要求都应在订货或询价时进行协商。

1.3 本标准规定的产品主要用于那些将冷成形性和耐腐蚀性作为重要参考因素的场合下。

合金的耐腐蚀性与镀层厚度成正比(见7.3.2。

1.4 本标准不适用于:• 结构用热浸镀镀层扁平材产品(见EN10326;• 冷轧电镀扁平材钢产品(见EN 10152;• 连续有机镀层(涂层带卷扁平材钢产品(见EN 10169-1、EN 10169-2和EN 10169-3• 冷成形用较高屈服强度的连续热浸镀涂层钢板和钢带(见EN 10292。

2 引用标准下列文件中的条款通过本标准的引用而成为本标准的条款。

凡是注日期的引用文件,仅该版本适用于本标准。

凡是不注日期的引用文件,其最新版本适用于本标准(包括修改单。

EN 10002-1 金属材料-拉伸试验-第1部分:室温实验方法EN 10020:2000 钢牌号定义和分类EN 10021:1993 钢及钢产品交货一般技术要求EN 10027-1 钢代号体系—第1部分:钢名称、基本符号EN 10027-2 钢代号体系—第2部分:数字代号体系EN 10079 钢产品分类EN 10143 连续热浸镀金属镀层钢板和钢带—尺寸外形及允许偏差EN 10204 金属产品—检验文件的类型EN 10113 金属材料—钢板和钢带—塑性应变比的测定EN 10275金属材料—钢板和钢带—拉伸应变硬化指数的测定EN 10260 钢代号体系—补充符号3 术语和定义本标准除采用EN 10020:2000、EN 10021:1993、EN 10079:1992、EN 10204:1991中的术语和定义外,还采用如下术语和定义:注1 钢铁的防护一般导则见EN ISO 14713.注2 连续热浸镀钢带镀层的成分见3.1到3.4。

Features➤Fast charge and conditioning of nickel cadmium or nickel-metal hydride batteries ➤Hysteretic PWM switch-mode current regulation or gated con-trol of an external regulator ➤Easily integrated into systems or used as a stand-alone charger ➤Pre-charge qualification of tem-perature and voltage ➤Configurable,direct LED outputs display battery and charge status ➤Fast-charge termination by ∆tem-perature/∆time,peak volume de-tection,-∆V,maximum voltage,maximum temperature,and maxi-mum time ➤Optional top-off charge and pulsed current maintenance charging ➤Logic-level controlled low-power mode (<5µA standby current)General DescriptionThe bq2004E and bq2004H Fast Charge ICs provide comprehensive fast charge control functions together with high-speed switching power con-trol circuitry on a monolithic CMOS device.Integration of closed-loop current control circuitry allows the bq2004to be the basis of a cost-effective so-lution for stand-alone and system-integrated chargers for batteries of one or more cells.Switch-activated discharge-before-charge allows bq2004E/H-based charg-ers to support battery conditioning and capacity determination.High-efficiency power conversion is accomplished using the bq2004E/H as a hysteretic PWM controller for switch-mode regulation of the charg-ing current.The bq2004E/H may al-ternatively be used to gate an exter-nally regulated charging current.Fast charge may begin on application of the charging supply ,replacement of the battery ,or switch depression.For safety ,fast charge is inhibited unless/until the battery tempera-ture and voltage are within config-ured limits.Temperature,voltage,and time are monitored throughout fast charge.Fast charge is terminated by any of the following:nRate of temperature rise (∆T/∆t)n Peak voltage detection (PVD)n Negative delta voltage (-∆V)n Maximum voltage n Maximum temperature nMaximum timeAfter fast charge,optional top-off and pulsed current maintenance phases with appropriate display mode selections are available.The bq2004H differs from the bq2004E only in that fast charge,hold-off,and top-off time units have been scaled up by a factor of two,and the bq2004H provides different display selections.Timing differ-ences between the two ICs are illus-trated in Table 1.Display differ-ences are shown in Table 2.1Fast-Charge ICsbq2004E/HDCMDDischarge command DSEL Display select VSEL Voltage termination selectTM 1Timer mode select 1TM 2Timer mode select 2TCO Temperature cutoff TS Temperature sense BATBattery voltage1PN2004E01.eps16-Pin Narrow DIP or Narrow SOIC234 5678161514131211109INH DIS MOD V CC V SS LED 2LED 1SNSDCMD DSEL VSEL TM 1TM 2TCO TS BATSNS Sense resistor input LED 1Charge status output 1LED 2Charge status output 2V SS System ground V CC 5.0V ±10% power MOD Charge current control DISDischarge control outputINH Charge inhibit inputPin Connections 6/99 EPin NamesPin DescriptionsDCMD Discharge-before-charge control inputThe DCMD input controls the conditionsthat enable discharge-before-charge.DCMDis pulled up internally.A negative-goingpulse on DCMD initiates a discharge to end-of-discharge voltage(EDV)on the BAT pin,followed by a new charge cycle start.TyingDCMD to ground enables automaticdischarge-before-charge on every new chargecycle start.DSEL Display select inputThis three-state input configures the chargestatus display mode of the LED1and LED2out-puts and can be used to disable top-off andpulsed-trickle.See Table2.VSEL Voltage termination select inputThis three-state input controls the voltage-termination technique used by thebq2004E/H.When high,PVD is active.When floating,-∆V is used.When pulled low,both PVD and-∆V are disabled.TM1–TM2Timer mode inputsTM1and TM2are three-state inputs thatconfigure the fast charge safety timer,voltagetermination hold-off time,“top-off”,andtrickle charge control.See Table1.TCO Temperature cut-off threshold inputInput to set maximum allowable batterytemperature.If the potential between TSand SNS is less than the voltage at the TCOinput,then fast charge or top-off charge is ter-minated.TS Temperature sense inputInput,referenced to SNS,for an externalthermister monitoring battery temperature. BAT Battery voltage inputBAT is the battery voltage sense input,refer-enced to SNS.This is created by a high-impedance resistor-divider network con-nected between the positive and the negativeterminals of the battery.SNS Charging current sense inputSNS controls the switching of MOD based onan external sense resistor in the currentpath of the battery.SNS is the reference po-tential for both the TS and BAT pins.IfSNS is connected to V SS,then MOD switcheshigh at the beginning of charge and low atthe end of charge.LED1–LED2Charge status outputsPush-pull outputs indicating chargingstatus.See Table2.Vss GroundV CC V CC supply input5.0V,±10%power input.MOD Charge current control outputMOD is a push-pull output that is used tocontrol the charging current to the battery.MOD switches high to enable charging cur-rent to flow and low to inhibit chargingcurrent flow.DIS Discharge control outputPush-pull output used to control an externaltransistor to discharge the battery beforecharging.INH Charge inhibit inputWhen low,the bq2004E/H suspends allcharge actions,drives all outputs to high im-pedance,and assumes a low-power opera-tional state.When transitioning from low tohigh,a new charge cycle is started.2bq2004E/HFunctional DescriptionFigure2shows a block diagram and Figure3shows a state diagram of the bq2004E/H.Battery Voltage and Temperature MeasurementsBattery voltage and temperature are monitored for maximum allowable values.The voltage presented on the battery sense input,BAT,should represent a two-cell potential for the battery under charge.A resistor-divider ratio of:RB1 RB2=N2- 1is recommended to maintain the battery voltage within the valid range,where N is the number of cells,RB1is the resistor connected to the positive battery terminal, and RB2is the resistor connected to the negative bat-tery terminal.See Figure1.Note:This resistor-divider network input impedance to end-to-end should be at least200kΩand less than1MΩ.A ground-referenced negative temperature coefficient ther-mistor placed in proximity to the battery may be used as a low-cost temperature-to-voltage transducer.The tempera-ture sense voltage input at TS is developed using a resistor-thermistor network between V CC and V SS.See Figure1.Both the BAT and TS inputs are referenced to SNS,so the signals used inside the IC are:V BAT-V SNS=V CELLandV TS-V SNS=V TEMPDischarge-Before-ChargeThe DCMD input is used to command discharge-before-charge via the DIS output.Once activated,DIS becomes active (high) until V CELL falls below V EDV,at which time DIS goes low and a new fast charge cycle begins.The DCMD input is internally pulled up to V CC(its inac-tive state).Leaving the input unconnected,therefore, results in disabling discharge-before-charge.A negative going pulse on DCMD initiates discharge-before-charge at any time regardless of the current state of the bq2004.If DCMD is tied to V SS,discharge-before-charge will be the first step in all newly started charge cycles. Starting A Charge CycleA new charge cycle is started by:1.Application of V CC power.2.V CELL falling through the maximum cell voltage,V MCV where:V MCV= 0.8∗V CC±30mV3.A transition on the INH input from low to high.If DCMD is tied low,a discharge-before-charge will be executed as the first step of the new charge cycle.Oth-erwise,pre-charge qualification testing will be the first step.The battery must be within the configured temperature and voltage limits before fast charging begins.The valid battery voltage range is V EDV<V BAT<V MCV where:V EDV= 0.4∗V CC±30mV3bq2004E/HFigure 1.Voltage and Temperature MonitoringThe valid temperature range is V HTF <V TEMP <V LTF ,where:V LTF = 0.4∗V CC ±30mVV HTF = [(1/3∗V LTF ) + (2/3∗V TCO )]±30mVV TCO is the voltage presented at the TCO input pin,and is configured by the user with a resistor divider between V CC and ground.The allowed range is 0.2to 0.4∗V CC .If the temperature of the battery is out of range,or the voltage is too low ,the chip enters the charge pending state and waits for both conditions to fall within their al-lowed limits.During the charge-pending mode,the IC first applies a top-off charge to the battery .The top-off charge,at the rateof of the fast charge,continues until the fast-charge are met or the top-off time-out period is exceeded.The IC then trickle charges until the fast-charge conditions are met.There is no time limit on the charge pending state;the charger remains in this state as long as the voltage or tempera-ture conditons are outside of the allowed limits.If the voltage is too high,the chip goes to the battery absent state and waits until a new charge cycle is started.Fast charge continues until termination by one or more of the six possible termination conditions:n Delta temperature/delta time (∆T/∆t)n Peak voltage detection (PVD)n Negative delta voltage (-∆V)n Maximum voltage n Maximum temperature nMaximum timePVD and -∆V TerminationThe bq2004E/H samples the voltage at the BAT pin once every 34s.When -∆V termination is selected,if V CELL is lower than any previously measured value by 12mV ±4mV (6mV/cell),fast charge is terminated.When PVD termination is selected,if V CELL is lower than any previ-ously measured value by 6mV ±2mV (3mV/cell),fast charge is terminated.The PVD and -∆V tests are valid in the range 0.4∗V CC <V CELL <0.8∗V CC .4bq2004E/HFigure 2.Block Diagram5VSEL InputVoltage TerminationLow DisabledFloat -∆V HighPVDVoltage SamplingEach sample is an average of voltage measurements.The IC takes 32measurements in PVD mode and 16measurements in -∆V mode.The resulting sample peri-ods (9.17ms and 18.18ms,respectively)filter out har-monics centered around 55Hz and 109Hz.This tech-nique minimizes the effect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources.Tolerance on all timing is ±16%.Temperature and Voltage Termination Hold-offA hold-off period occurs at the start of fast charging.During the hold-off period,-∆V and ∆T/∆t termination are disabled.The MOD pin is enabled at a duty cycle of 260µs active for every 1820µs inactive.This modulation results in an average rate 1/8th that of the fast charge rate.This avoids premature termination on the voltage spikes sometimes produced by older batteries when fast-charge current is first applied.Maximum voltage and maximum temperature terminations are not af-fected by the hold-off period.∆T/∆t TerminationThe bq2004E/H samples at the voltage at the TS pin every 34s,and compares it to the value measured two samples earlier.If V TEMP has fallen 16mV ±4mV or more,fast charge is terminated.The ∆T/∆t termination test is valid only when V TCO <V TEMP <V LTF .Temperature SamplingEach sample is an average of 16voltage measurements.The resulting sample period (18.18ms)filters out har-monics around 55Hz.This technique minimizes the ef-fect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources.Tol-erance on all timing is ±16%.Maximum Voltage,Temperature,and TimeAnytime V CELL rises above V MCV ,the LEDs go off and cur-rent flow into the battery ceases immediately .If V CELL then falls back below V MCV before t MCV =1.5s ±0.5s,the chip transitions to the Charge Complete state (maximum voltage termination).If V CELL remains above V MCV at the expiration of t MCV ,the bq2004E/H transitions to the Bat-tery Absent state (battery removal).See Figure 3.Maximum temperature termination occurs anytime V TEMP falls below the temperature cutoff threshold V TCO .Charge will also be terminated if V TEMP rises above the low temperature fault threshold,V LTF ,after fast charge begins.Corresponding Fast-ChargeRate TM1TM2Typical Fast-Charge Safety Time (min)Typical PVD, -∆V Hold-Off Time (s)Top-Off RatePulse-Trickle Rate Pulse-Trickle Period (Hz)2004E 2004H 2004E 2004H 2004E 2004H 2004E 2004H2004E2004HC/4C/8Low Low 325650137273Disabled Disabled Disabled C/2C/4Float Low 154325546546Disabled C/51215301C C/2High Low 77154273546Disabled C/5127.5152C 1C Low Float 3977137273Disabled C/512 3.757.54C 2C Float Float 193968137Disabled C/512 1.88 3.75C/2C/4High Float 154325546546C/16C/32C/51215301C C/2Low High 77154273546C/8C/16C/5127.5152C 1C Float High 3977137273C/4C/18C/512 3.757.54C2CHighHigh193968137C/2C/4C/5121.883.75Note:Typical conditions = 25°C,V CC = 5.0V .Table 1.Fast Charge Safety Time/Hold-Off/Top-Off Tablebq2004E/Hbq2004E/HTable 2.bq2004E/H LED Output SummaryNote:Pulse trickle is inhibited in Mode 2.6Maximum charge time is configured using the TM pin. Time settings are available for corresponding charge rates of C/4,C/2,1C,and2C.Maximum time-out termi-nation is enforced on the fast-charge phase,then reset, and enforced again on the top-off phase,if selected. There is no time limit on the trickle-charge phase.Top-off ChargeAn optional top-off charge phase may be selected to follow fast charge termination for the C/2through4C rates.This phase may be necessary on NiMH or other battery chemistries that have a tendency to terminate charge prior to reaching full capacity.With top-off en-abled,charging continues at a reduced rate after fast-charge termination for a period of time equal to 0.235∗the fast-charge safety time(See Table1.)Dur-ing top-off,the MOD pin is enabled at a duty cycle of 260µs active for every1820µs inactive.This modula-tion results in an average rate1/8th that of the fast charge rate.Maximum voltage,time,and temperature are the only termination methods enabled during top-off.Pulse-Trickle ChargePulse-trickle charging may be configured to follow the fast charge and optional top-off charge phases to com-pensate for self-discharge of the battery while it is idle in the charger.In the pulse-trickle mode,MOD is active for260µs of a period specified by the settings of TM1and TM2.See Table1.The resulting trickle-charge rate is C/512. Both pulse trickle and top-off may be disabled by tying TM1and TM2to V SS or by selecting Mode2in the dis-play.Charge Status IndicationCharge status is indicated by the LED1and LED2out-puts.The state of these outputs in the various charge cy-cle phases is given in Table2and illustrated in Figure3.In all cases,if V CELL exceeds the voltage at the MCV pin,both LED1and LED2outputs are held low regard-less of other conditions.Both can be used to directly drive an LED.Charge Current ControlThe bq2004E/H controls charge current through the MOD output pin.The current control circuitry is designed to sup-port implementation of a constant-current switching regulator or to gate an externally regulated current source.When used in switch mode configuration,the nominal regulated current is:I REG= 0.225V/R SNSCharge current is monitored at the SNS input by the voltage drop across a sense resistor,R SNS,between the low side of the battery pack and ground.R SNS is sized to provide the desired fast charge current.If the voltage at the SNS pin is less than V SNSLO,the MOD output is switched high to pass charge current to the battery.When the SNS voltage is greater than V SNSHI,the MOD output is switched low—shutting off charging current to the battery.V SNSLO= 0.04∗V CC±25mVV SNSHI= 0.05∗V CC±25mVWhen used to gate an externally regulated current source,the SNS pin is connected to V SS,and no sense re-sisitor is required.7bq2004E/Hbq2004E/HFigure 3.Charge Algorithm State Diagram8Absolute Maximum RatingsSymbol Parameter Minimum Maximum Unit NotesV CC V CC relative to V SS-0.3+7.0VV T DC voltage applied on any pin ex-cluding V CC relative to V SS-0.3+7.0VT OPR Operating ambient temperature-20+70°C CommercialT STG Storage temperature-55+125°CT SOLDER Soldering temperature-+260°C10 sec max.T BIAS Temperature under bias-40+85°CNote:Permanent device damage may occur if Absolute Maximum Ratings are exceeded.Functional opera-tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet.Expo-sure to conditions beyond the operational limits for extended periods of time may affect device reliability.DC Thresholds(T A=T OPR;V CC±10%)Symbol Parameter Rating Tolerance Unit NotesV SNSHI High threshold at SNS result-ing in MOD = Low0.05*V CC±0.025VV SNSLO Low threshold at SNS result-ing in MOD = High0.04 *V CC±0.010VV LTF Low-temperature fault0.4*V CC±0.030V V TEMP ≥V LTF inhib-its/terminates charge V HTF High-temperature fault(1/3*V LTF) + (2/3*V TCO)±0.030V V TEMP≤V HTF inhibitschargeV EDV End-of-discharge voltage0.4*V CC±0.030V V CELL<V EDV inhibitsfast chargeV MCV Maximum cell voltage0.8*V CC±0.030V V CELL>V MCV inhibits/terminates chargeV THERM TS input change for∆T/∆tdetection-16±4mV V CC= 5V,T A= 25°C-∆V BAT input change for-∆Vdetection-12±4mV V CC= 5V,T A= 25°CPVD BAT input change for PVDdetection-6±2mV V CC= 5V,T A= 25°Cbq2004E/H9Recommended DC Operating Conditions(T A= T OPR)Symbol Condition Minimum Typical Maximum Unit NotesV CC Supply voltage 4.5 5.0 5.5VV BAT Battery input0-V CC VV CELL BAT voltage potential0-V CC V V BAT- V SNSV TS Thermistor input0-V CC VV TEMP TS voltage potential0-V CC V V TS- V SNSV TCO Temperature cutoff0.2*V CC-0.4*V CC V Valid∆T/∆t rangeV IHLogic input high 2.0--V DCMD,INHLogic input high V CC- 0.3--V TM1, TM2, DSEL, VSEL V ILLogic input low--0.8V DCMD,INHLogic input low--0.3V TM1, TM2, DSEL, VSELV OH Logic output high V CC- 0.8--V DIS, MOD, LED1, LED2,I OH≤-10mAV OL Logic output low--0.8V DIS,MOD,LED1,LED2,I OL≤10mAI CC Supply current-13mA Outputs unloadedI SB Standby current--1µA INH= V ILI OH DIS,LED1,LED2,MOD source-10--mA@V OH= V CC- 0.8VI OL DIS,LED1,LED2,MOD sink10--mA@V OL= V SS+ 0.8VI LInput leakage--±1µA INH, BAT, V = V SS to V CC Input leakage50-400µA DCMD, V = V SS to V CCI IL Logic input low source--70µA TM1, TM2, DSEL, VSEL,V = V SS to V SS+ 0.3VI IH Logic input high source-70--µA TM1, TM2, DSEL, VSEL,V = V CC- 0.3V to V CCI IZ Tri-state-2-2µA TM1,TM2,DSEL,and VSEL should be left disconnected (floating)for Z logic input stateNote:All voltages relative to V SS except as noted. bq2004E/H10ImpedanceSymbol Parameter Minimum Typical Maximum Unit R BAT Battery input impedance50--MΩR TS TS input impedance50--MΩR TCO TCO input impedance50--MΩR SNS SNS input impedance50--MΩTiming(T A= 0 to +70°C; V CC±10%)Symbol Parameter Minimum Typical Maximum Unit Notest PW Pulse width for DCMDand INH pulse command 1--µsPulse start for charge or dischargebefore charged FCV Time base variation-16-16%V CC= 4.75V to 5.25Vf REG MOD output regulationfrequency--300kHzt MCV Maximum voltage termi-nation time limit 1-2sTime limit to distinguish battery re-moved from charge complete.Note:Typical is at T A= 25°C,V CC= 5.0V.bq2004E/H1112bq2004E/H16-Pin DIP Narrow (PN)16-Pin PN (0.300" DIP )DimensionInchesMillimeters Min.Max.Min.Max.A 0.1600.180 4.06 4.57A10.0150.0400.38 1.02B 0.0150.0220.380.56B10.0550.065 1.40 1.65C 0.0080.0130.200.33D 0.7400.77018.8019.56E 0.3000.3257.628.26E10.2300.280 5.847.11e 0.3000.3707.629.40G 0.0900.110 2.29 2.79L 0.1150.150 2.92 3.81S0.0200.0400.511.02bq2004E/H 16-Pin SOIC Narrow (SN)16-Pin SN(0.150" SOIC)DimensionInches MillimetersMin.Max.Min.Max.A0.0600.070 1.52 1.78A10.0040.0100.100.25B0.0130.0200.330.51C0.0070.0100.180.25D0.3850.4009.7810.16E0.1500.160 3.81 4.06e0.0450.055 1.14 1.40H0.2250.245 5.72 6.22L0.0150.0350.380.8913bq2004E/HData Sheet Revision HistoryChange No.Page No.Description Nature of ChangeClarification 1All Combined bq2004E and bq2004H,revised andexpanded format of this data sheetClarification 27Separated bq2004E and bq2004H in Table 2,LEDOutput Summary35Description of charge-pending state Clarification4Note:Change 1 = Oct.1997 B changes from Sept.1996 (bq2004E),Feb.1997 (bq2004H).Change 2 = Feb.1998 C changes from Oct.1997 B.Change 3 = Dec.1998 D changes from Feb.1998 C.Change 4 = June 1999 E changes from Dec.1998 D.14bq2004E/H Ordering Informationbq2004Package Option:PN=16-pin narrow plastic DIPSN=16-pin narrow SOICDevice:E=bq2004E Fast-Charge ICH=bq2004H Fast-Charge IC15IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

英国标准BS EN 14427:2004合并修正案1液化石油气（LPG）用可移动的可再充填式全包装复合气瓶，设计和建造欧洲标准EN 14427: 2004, 纳入合并修正案 A1: 2005, 位同英国标准ICS 23.020.30未经BSI和版权法允许不得抄袭国际前言英国标准EN 14427: 2004包括修正案A1:2005是官方的英语语言版本。

CEN欧洲标准化委员会修正案介绍或更改的文本的开始和结尾地方用a1标记。

根据更改的的标签标号与CEN修正案上的标注一致。

例如，通过CEN修正案A1改变的文本被a1所指出。

技术委员会PVE/19委托英国参与LPG容器和相关的配件的准备阶段，有如下责任：-----帮助询问者理解文本-----给予负责的国际/欧洲的委员会询问者解释，改变方案，保持了解英国利益情况-----与国际和欧洲发展有关的监控器，并在英国发布经秘书处的要求，将提供一个代表委员会组织的列表相互参照在文中提及的国际或欧洲出版的英国标准可能会在英国标准协会目录，题为国际标准对应索引项下找到，或通过搜索英国标准协会电子目录，在线英国标准找到。

这个发表不包括合同里所有的必要条款。

用户应正确的应用。

遵守此英国标准并不意味着免除自身的法律义务。

本英国标准是2004 年 7 月 20 日根据管理局公布标准政策和战略委员会所出版本页摘要此文件包括封页，内封面，EN题目页，2-48页，一个内部回封底和封底。

文献上显示的英国标准协会（BSI）版权日期表明了此文献最近一次发行的时间。

自出版以来修正案的发行修正案编号日期评论16037 2006．3 见国家前言英文版本液化石油气（LPG）用可移动的可再充填式全包装复合气瓶-设计和建造（包括修正案 A1:2005）欧洲标准在2004.3.18被CEN所认证。

修正案A1在2005.11.17被CEN所认证。

欧洲标准化成员有义务遵循欧洲标准化委员会/欧洲电工标准化委员会的内部规定，该规定阐述了在不做任何更改的前提下，给予这一欧洲标准某一国家标准地位的条件。

FEATURESORDERING INFORMATIONStock Number Standard Data LoggerEL-USB-4(Data Logger,Measurement Leads,Software on CD and Battery)Replacement BatteryBAT 3V6LASCAR ELECTRONICS L TD.MODULE HOUSE WHITEP ARISHWIL TSHIRE SP52SJ UKTEL:+44(1794)884567FAX:+44(1794)884616E-mail:sales@lascar LASCAR ELECTRONICS (HK)LIMITED FLAT C,5/FL.,LUCKY FTY .BLDG.63-65HUNG TO ROAD KWUN TONG KOWLOON HONG KONGTEL:+852********FAX:+852********E-mail:b4lascar@LASCAR ELECTRONICS INC.3750West 26th Street ErieP A 16506USATEL:+1(814)8350621FAX:+1(814)8388141E-mail:us-sales@ •4-20mA d.c.Current Loop Measurement Range Logging Rates between 1s and 12hr Stores 32,000readingsConnection via two screw terminalsUSB Interface for Set-up and Data Download User-Programmable Alarm Thresholds Red and Green LED Status Indication Replaceable Internal Lithium BatterySpecifications liable to change without prior warning EL-USB-4Issue 1July/2005M.C.Applies to EL-USB-4/1This data logger measures and stores up to 32,000current loop readings over a 4-20mA d.c.measurement range.The user can easily set up the logging rate and start time,and download the stored data by plugging the module straight into a PC's USB port and running the purpose designed software under Windows 98,2000or XP .The data can then be graphed,printed and exported to other applications.The data logger is supplied complete with a long-life lithium battery .Correct functioning of the unit is indicated by a flashing red and green LED.The data logger features a pair of screw terminals and is is supplied complete with a set of measurement leads terminating in crocodile clips.WINDOWS CONTROL SOFTWAREEasy to install and use,the control software runs under Windows 98,2000and XP (Home and Professional Editions).It allows the user to set up and download any EL-USB-4.DATA LOGGER SET -UPSLogger NameLogging Rate (1s,10s,1m,5m,30m,1hr ,6hr ,12hr) High and Low Alarms Start Date and Start Time*depending on ambient temperature,logging rate and use of alarm LEDs.PO Box 770, Londonderry, NH 03053 BATTERY REPLACEMENTrecommend that you replace the battery every 12months,or prior EL-USB-44-20mA Current Loop USB Data Loggerprior warningEL-USB-4Issue 1July/2005M.C.Applies to EL-USB-4/1PO Box 770, Londonderry, NH 03053 1-800-821-0023分销商库存信息: MARTEL-ELECTRONICS EL-USB-4。

联邦法律公报2004年度第1部分第40号，2004年7月31日于波恩公布关于重新调整电力领域可再生能源法的法律12004年7月21日联邦议会通过了以下法律：第一部分可再生能源优先法（可再生能源法—EEG）第1条法律目的(1) 为了实现能源供应的可持续发展，在同时兼顾长期外部效应的前提下减少能源供应的国民经济成本，保护自然和环境，为避免围绕化石能源可能发生的冲突作出贡献，进一步推动可再生能源发电技术的利用和开发，特以保护气候、自然和环境为宗旨，制定本法。

(2) 此外，制定本法旨在促进提高可再生能源在电力供应中所占的比重，至2010年至少提高到12.5%，至2020年至少提高到20%。

1制定本法旨在实施欧洲议会和欧洲理事会于2001年9月27日颁布的关于在欧盟内部电力市场促进利用可再生能源发电的第2001/77/EG号指令（欧洲共同体公报「ABl. EG」第 L 283号, 第 33页），最近一次修改见2003年4月16日的欧盟入盟文件（欧盟公报「ABl. EU」第 L 236, 第 586页）。

第2条适用范围(1) 依本法规定，1.凡属联邦领域包括德国专属经济区（法律效力范围）内利用可再生能源和矿井废气从事生产的发电设施，优先并入公共供电网，2.电网经营商优先接收和输送这些电力并支付电价，3.在联邦范围内对收购上网的电量进行平衡。

(2) 凡属25%以上归德意志联邦共和国或某一个联邦州所有且在2004年7月31日前已投入运营的发电设施，不适用本法。

第3条概念界定(1) 可再生能源，是指水力包括波浪能、潮汐能、盐度差能和海流能，风能，日辐射能，地热能，生物质能包括沼气、垃圾填埋场气体和污水净化气体以及生活垃圾和工业废料中可生物降解部分产生的能量。

(2) 发电设施，是指任何利用可再生能源或矿井废气发电的独立技术设施。

多个利用同样种类的可再生能源或矿井废气进行生产的发电设施，若是在本法效力范围内建立且与运营必需的共用技术设备或建筑设施直接相连的，被视为一套设施，如果本法第6条至第12条未作出有其它的规定。

NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative.Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use.Recommended Substitutions:High Voltage High Current Darlington ArraysA2003, A2004, A2023, A2024Date of status change: May 2, 2005Deadline for receipt of LAST TIME BUY orders: October 28, 2005These parts are in production but have been determined to be LAST TIME BUY . This classification indicates that the product is obsolete and notice has been given. Sale of this device is currently restricted to existing customer applications. The device should not be purchased for new design applications because of obsolescence in the near future. Samples are no longer st Time Buy2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENT DARLINGTON ARRAYSTest ApplicableLimits Characteristic Symbol Fig.DevicesTest Conditions Min.Typ.Max.Units Output Leakage CurrentI CEX1AA llV CE = 50 V, T A = 25°C —< 150µA V CE = 50 V, T A = 70°C—< 1100µA 1BULN2004A/LV CE = 50 V, T A = 70°C, V IN = 1.0 V—< 5500µA Collector-EmitterV CE(SAT)2A llI C = 100 mA, I B = 250 µA—0.9 1.1V Saturation Voltagel C = 200 mA, I B = 350 µA— 1.1 1.3V I C = 350 mA, I B = 500 µA— 1.3 1.6V Input CurrentI IN(ON)3ULN2003A/LV IN = 3.85 V —0.93 1.35mA ULN2004A/LV IN = 5.0 V —0.350.5mA V IN = 12 V— 1.0 1.45mA I IN(OFF)4A ll l C = 500 µA, T A = 70°C5065—µA Input VoltageV IN(ON)5ULN2003A/LV CE = 2.0 V, l C = 200 mA—— 2.4V V CE = 2.0 V, I C = 250 mA—— 2.7V V CE = 2.0 V, l C = 300 mA—— 3.0V ULN2004A/LV CE = 2.0 V, l C = 125 mA—— 5.0V V CE = 2.0 V, l C = 200 mA—— 6.0V V CE = 2.0 V, I C = 275 mA——7.0V V CE = 2.0 V, l C = 350 mA——8.0V Input Capacitance C IN —A ll —1525pF Turn-On Delay t PLH 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Turn-Off Delay t PHL 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Clamp DiodeI R 6A ll V R = 50 V, T A = 25°C ——50µA Leakage Current V R = 50 V, T A = 70°C——100µA Clamp Diode V F7AllI F = 350 mA—1.72.0VForward VoltageComplete part number includes suffix to identify package style: A = DIP, L = SOIC.Types ULN2003A, ULN2003L, ULN2004A, and ULN2004L ELECTRICAL CHARACTERISTICS at +25°C (unless otherwise noted).2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Test Applicable LimitsCharacteristic Symbol Fig.DevicesTest ConditionsMin.Typ.Max.Units Output Leakage CurrentI CEX1AA ll V CE = 95 V, T A = 25°C—< 150µA V CE = 95 V, T A = 70°C—< 1100µA 1BULN2024A/LV CE = 95 V, T A = 70°C, V IN = 1.0 V—< 5500µA Collector-EmitterV CE(SAT)2A llI C = 100 mA, I B = 250 µA—0.9 1.1V Saturation Voltagel C = 200 mA, I B = 350 µA— 1.1 1.3V I C = 350 mA, I B = 500 µA— 1.3 1.6V Input CurrentI IN(ON)3ULN2023A/LV IN = 3.85 V —0.93 1.35mA ULN2024A/LV IN = 5.0 V —0.350.5mA V IN = 12 V— 1.0 1.45mA I IN(OFF)4A ll l C = 500 µA, T A = 70°C5065—µA Input VoltageV IN(ON)5ULN2023A/LV CE = 2.0 V, l C = 200 mA—— 2.4V V CE = 2.0 V, I C = 250 mA—— 2.7V V CE = 2.0 V, l C = 300 mA—— 3.0V ULN2024A/LV CE = 2.0 V, l C = 125 mA—— 5.0V V CE = 2.0 V, l C = 200 mA—— 6.0V V CE = 2.0 V, I C = 275 mA——7.0V V CE = 2.0 V, l C = 350 mA——8.0V Input Capacitance C IN —A ll —1525pF Turn-On Delay t PLH 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Turn-Off Delay t PHL 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Clamp DiodeI R 6A ll V R = 95 V, T A = 25°C ——50µA Leakage Current V R = 95 V, T A = 70°C——100µA Clamp Diode V F7A llI F = 350 mA—1.72.0VForward VoltageComplete part number includes suffix to identify package style: A = DIP, L = SOIC.Types ULN2023A, ULN2023L, ULN2024A, and ULN2024LELECTRICAL CHARACTERISTICS at +25°C (unless otherwise noted).115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Dwg. GP-067COLLECTOR-EMITTER SATURATION VOLTAGE Dwg. GP-068INPUT CURRENT IN µA2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000PACKAGE DESIGNATOR “A”Dimensions in Inches (controlling dimensions)Dimension in Millimeters (for reference only)NOTES:1.Leads 1, 8, 9, and 16 may be half leads at vendor’s option.2.Lead thickness is measured at seating plane or below.3.Lead spacing tolerance is non-cumulative.4.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-001-16A mm18Dwg. MA-001-16A in182003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENT DARLINGTON ARRAYSPACKAGE DESIGNATOR “L”Dimensions in Inches (for reference only)Dimension in Millimeters (controlling dimensions)NOTES:1.Lead spacing tolerance is non-cumulative.2.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-007-16A mm169Dwg. MA-007-16 in1692003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000The products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, ormanufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.元器件交易网。

ICS 91.140.70 替代EN 200：1989英文版卫生用龙头——单一把手和混合龙头（PN 10）一般技术规范此份欧洲标准草案递交给CEN成员进行投票表决，它是由技术委员会CEN/TC 164编制的。

如果本草案成为欧洲标准，CEN成员国必须符合CEN/CENELEC一般规定的要求，并且在无任何更改的情况下，将本欧洲标准作为其成员国的国家标准。

本欧洲标准有三种正式版本（英语，法语，德语）。

任何其它语言的版本是由CEN成员国翻译成其本国语言，且知会中央秘书处后，等同于正式版本。

CEN成员国是以下这些国家的国家标准组织：澳大利亚、比利时、丹麦、芬兰、法国、德国、希腊、冰岛、爱尔兰、意大利、卢森堡、荷兰、挪威、葡萄牙、西班牙、瑞典、瑞士和英国。

警告：本文件不是一份欧洲标准，它根据评论和注释来分类。

未经通知就进行更改，则不能作为欧洲标准来参考。

管理委员会：rue de Stassart, 36 B-1050 Brussels参考编号pr N 200：2004E目录前言 (3)介绍 (4)1 范围和应用领域 (5)2 标准参考 (7)3 名称 (8)4 标记和标识 (8)5 材料 (9)6 尺寸特性 (9)7 紧密特性 (16)8 抗压特性—在压力下的机械性能 (19)9 水压特性 (20)10 机械强度特性—操作机构的扭力测试 (21)11 机械耐久性 (21)12 回流保护 (25)13 声学特性 (25)附录A.（信息）减压三通 (28)参考书目 (31)本文件（prEN 200：2004）由技术委员会CEN/TC 164“水供应”编制，其秘书处由AFNOR所有。

本文件当前递交进行投票表决。

本文件将代替EN 200：1989。

第1类水供应系统（参照图1和表1）的压力范围为0.05MPa（0.5bar）到1.0MPa（10bar）。

第2类水供应系统（参照图2和表1）的压力范围为0.01MPa（0.5bar）到1.0MPa（10bar）。

欧盟新版EMC指令——2004／104／EC介绍最新版的欧盟指令2004／104／EC于2004年11月13日在欧洲官方期刊OJ(officialjournalofEu—ropeanunion)上发布，取代欧盟关于汽车电磁兼容指令95／54／EC，并自发布之日20天后生效，于2006年1月1日开始执行，2009年1月1日全面执行。

该指令的历次修订情况介绍如下：首次制定并由欧洲官方发布于1972年7月6日OJNo．L152，指令号为72/245/EEC；历次修订情况为：1989年8月15日OJNo．L238发布89/491/EEC；1995年11月8日OJNo．L266发布95/54/EC；2004年11月13日OJNo．L337发布2004/104/EC。

下面就最新版的欧盟指令2004/104/EC(以下简称为“04指令”)的特点和与旧版指令95/54/EC(以下简称为“95指令”)的内容变化差异进行介绍。

1适用产品和应用范围要求1.1适用于车辆的电磁兼容性及车辆上安装的零部件或独立技术单元的电磁兼容性。

车辆可以是厂家提供的汽车或挂车(以下统称“车辆”)。

1.2车辆上安装的零部件或独立技术单元的某些功能涉及电磁抗扰性要求，这些功能是关于车辆的直接控制功能；关于驾驶员、乘客和其它道路使用者的保护功能；关于造成驾驶员和其它道路使用者驾驶混乱的功能。

1.3指令旨在控制无用的辐射发射和传导发射以保护自己或邻近或附近的车辆上的电气或电子设备的正常使用；提高汽车抗骚扰的能力。

1.4关于车辆抗扰性的功能，涉及的电气／电子组件(ESA)功能有：1.4.1关于车辆直接控制的功能：◇发动机、传动装置、制动器、悬挂、自动驾驶、速度限制器等设备的性能降级或改变；◇影响驾驶员的位置，如座位或方向盘位置；◇影响驾驶员的视野，如前照灯、雨刮器。

1.4.2关于驾驶员、乘客和其它道路使用者保护的功能：◇安全气囊和安全约束系统。

1.4.3受到骚扰时，引起驾驶员或其它道路使用者陷入混乱的功能：◇视觉骚扰：转向灯、制动灯、示廓灯、后位灯、应急系统、警示灯等的错误操作；◇声音骚扰：防盗警报、喇叭等的误操作。

TL F 9647DS2003 DS9667 DS2004 High Current Voltage Darlington DriversDecember1995 DS2003 DS9667 DS2004High Current Voltage Darlington DriversGeneral DescriptionThe DS2003 DS9667 DS2004are comprised of seven highvoltage high current NPN Darlington transistor pairs Allunits feature common emitter open collector outputs Tomaximize their effectiveness these units contain suppres-sion diodes for inductive loads and appropriate emitter baseresistors for leakageThe DS2003 DS9667has a series base resistor to eachDarlington pair thus allowing operation directly with TTL orCMOS operating at supply voltages of5 0VThe DS2004has an appropriate input resistor to allow directoperation from CMOS or PMOS outputs operating from sup-ply voltages of6 0V to15VThe DS2003 DS9667 DS2004offer solutions to a greatmany interface needs including solenoids relays lampssmall motors and LEDs Applications requiring sink currentsbeyond the capability of a single output may be accommo-dated by paralleling the outputsFeaturesY Seven high gain Darlington pairsY High output voltage(V CE e50V)Y High output current(I C e350mA)Y TTL PMOS CMOS compatibleY Suppression diodes for inductive loadsY Extended temperature rangeConnection Diagram16-Lead DIPTL F 9647–1Top ViewOrder NumbersJ Package N Package M PackageNumber Number NumberJ16A N16E M16ADS2003DS2003MJ DS2003TN DS2003TMDS9667DS2003TJ DS2003CN DS2003CMDS2003CJ DS9667TNDS9667MJ DS9667CNDS9667TJDS9667CJDS2004DS2004MJ DS2004TN DS2004TMDS2004TJ DS2004CN DS2004CMDS2004CJC1996National Semiconductor Corporation RRD-B30M66 Printed in U S AAbsolute Maximum Ratings(Note1)If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature RangeCeramic DIP b65 C to a175 C Molded DIP b65 C to a150 C Operating Temperature RangeDS2003M DS9667M b55 C to a125 C DS2004M b55 C to a125 C DS2003T DS9667T b40 C to a105 C DS2004T b40 C to a105 C DS2003C DS9667C0 C to a85 C DS2004C0 C to a85 C Lead TemperatureCeramic DIP(Soldering 60seconds)300 C Molded DIP(Soldering 10seconds)265 C Maximum Power Dissipation at25 CCavity Package2016mW Molded Package1838mW S O Package926mW Derate cavity package16 13mW C above25 C derate molded DIP pack-age14 7mW C above25 C Derate S O package7 4mW CInput Voltage30V Output Voltage55V Emitter-Base Voltage6 0V Continuous Collector Current500mA Continuous Base Current25mAElectrical Characteristics T A e25 C unless otherwise specified(Note2)Symbol Parameter Conditions Min Typ Max Units I CEX Output Leakage T A e25 C V CE e50V(Figure1a)20Current TA e85 C V CE e50V(Figure1a)for Commercial Grade100m AT A e25 C V CE e50V V I e1 0V(Figure1b)DS2004500V CE(Sat)Collector-Emitter I C e350mA I B e500m A(Figure2)(Note3)1 251 6 Saturation Voltage IC e200mA I B e350m A(Figure2)1 11 3VI C e100mA I B e250m A(Figure2)0 91 1I I(ON)Input Current V I e3 85V(Figure3)DS2003 DS96670 931 35mAV I e5 0V(Figure3)DS20040 350 5V I e12V(Figure3)1 01 45I I(OFF)Input Current T A e85 C for Commercial50100m A(Note4)I C e500m A(Figure4)V I(ON)Input Voltage V CE e2 0V I C e200mA(Figure5)DS2003 DS96672 4 (Note5)VCE e2 0V I C e250mA(Figure5)2 7V CE e2 0V I C e300mA(Figure5)3 0VV CE e2 0V I C e125mA(Figure5)DS20045 0V CE e2 0V I C e200mA(Figure5)6 0V CE e2 0V I C e275mA(Figure5)7 0V CE e2 0V I C e350mA(Figure5)8 0C I Input Capacitance1530pF t PLH Turn-On Delay0 5V I to0 5V O1 0m s t PHL Turn-Off Delay0 5V I to0 5V O1 0m s I R Clamp Diode V R e50V(Figure6)T A e25 C50m ALeakage Current T A e85 C100m A V F Clamp Diode I F e350mA(Figure7)1 72 0V Forward VoltageNote1 ‘‘Absolute Maximum Ratings’’are those values beyond which the safety of the device cannot be guaranteed They are not meant to imply that the devices should be operated at these limits The tables of‘‘Electrical Characteristics’’provide conditions for actual device operationNote2 All limits apply to the complete Darlington series except as specified for a single device typeNote3 Under normal operating conditions these units will sustain350mA per output with V CE(Sat)e1 6V at70 C with a pulse width of20ms and a duty cycle of 30%Note4 The I I(OFF)current limit guaranteed against partial turn-on of the outputNote5 The V I(ON)voltage limit guarantees a minimum output sink current per the specified test conditionshttp www national com2Typical Performance CharacteristicsSaturation VoltageCollector Current vs Input CurrentCollector Current vs Input VoltageInput Current vs DS2003 DS9667Input Voltage Input Current vs DS2004Outputs (Molded Package)Duty Cycle and Number of Peak Collector Current vs Outputs (Ceramic Package)Duty Cycle and Number of Peak Collector Current vs TL F 9647–6http www national com3Equivalent CircuitsTL F 9647–3TL F 9647–5Test CircuitsTL F 9647–7FIGURE 1a TL F 9647–8FIGURE 1bTL F 9647–9FIGURE 2TL F 9647–10FIGURE 3TL F 9647–11FIGURE 4TL F 9647–12FIGURE 5TL F 9647–13FIGURE 6TL F 9647–14FIGURE 7http www national com 4Typical ApplicationsBuffer for Higher Current LoadsTL F 9647–16TL F 9647–175http www national comhttp www national com6Physical Dimensions inches(millimeters)unless otherwise notedCeramic Dual-In-Line Package(J)Order Number DS2003CJ DS9667CJ DS2003MJ D9667MJDS2003TJ DS9667TJ DS2004CJ DS2004MJ or DS2004TJNS Package Number J16ASurface Mount Package(M)Order Number DS2003CM DS9667CM DS2003TM DS9667TM DS2004CM or DS2004TMNS Package Number M16A7http www national comD S 2003 D S 9667 D S 2004H i g h C u r r e n t V o l t a g e D a r l i n g t o n D r i v e r sPhysical Dimensions inches (millimeters)unless otherwise noted (Continued)Molded Dual-In-Line Package (N)Order Number DS2003CN DS9667CN DS2003TN DS9667TN DS2004CN or DS2004TNNS Package Number N16ELIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor CorporationEuropeHong Kong LtdJapan Ltd1111West Bardin RoadFax a 49(0)180-530858613th Floor Straight Block Tel 81-043-299-2308。

DIRECTIVE2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCILof15December2004on the approximation of the laws of the Member States relating to electromagnetic compatibilityand repealing Directive89/336/EEC(Text with EEA relevance)THE EUROPEAN PARLIAMENT AND THE COUNCIL OF THE EURO-PEAN UNION,Having regard to the Treaty establishing the European Com-munity,and in particular Article95thereof,Having regard to the proposal from the Commission,Having regard to the opinion of the European Economic and Social Committee(1),Acting in accordance with the procedure referred to in Article 251of the Treaty(2),Whereas:(1)Council Directive89/336/EEC of3May1989on theapproximation of laws of the Member States relating toelectromagnetic compatibility(3)has been the subject ofa review under the initiative known as Simpler Legisla-tion for the Internal Market(SLIM).Both the SLIMprocess and a subsequent in-depth consultation haverevealed the need to complete,reinforce and clarify theframework established by Directive89/336/EEC.(2)Member States are responsible for ensuring that radio-communications,including radio broadcast receptionand the amateur radio service operating in accordancewith International Telecommunication Union(ITU)radioregulations,electrical supply networks and telecommuni-cations networks,as well as equipment connectedthereto,are protected against electromagnetic distur-bance.(3)Provisions of national law ensuring protection againstelectromagnetic disturbance should be harmonised inorder to guarantee the free movement of electrical andelectronic apparatus without lowering justified levels ofprotection in the Member States.(4)Protection against electromagnetic disturbance requiresobligations to be imposed on the various economicoperators.Those obligations should be applied in a fairand effective way in order to achieve such protection.(5)The electromagnetic compatibility of equipment shouldbe regulated with a view to ensuring the functioning ofthe internal market,that is to say,of an area withoutinternal frontiers in which the free movement of goods,persons,services and capital is assured.(6)The equipment covered by this Directive should includeboth apparatus and fixed installations.However,separateprovision should be made for each.This is so because,whereas apparatus as such may move freely within theCommunity,fixed installations on the other hand areinstalled for permanent use at a predefined location,asassemblies of various types of apparatus and,whereappropriate,other devices.The composition and func-tion of such installations correspond in most cases tothe particular needs of their operators.(7)Radio equipment and telecommunications terminalequipment should not be covered by this Directive sincethey are already regulated by Directive1999/5/EC of theEuropean Parliament and of the Council of9March1999on radio equipment and telecommunications term-inal equipment and the mutual recognition of theirconformity(4).The electromagnetic compatibilityrequirements in both Directives achieve the same levelof protection.(8)Aircraft or equipment intended to be fitted into aircraftshould not be covered by this Directive,since they arealready subject to special Community or internationalrules governing electromagnetic compatibility.(9)This Directive need not regulate equipment which isinherently benign in terms of electromagnetic compat-ibility.(10)This Directive should not deal with the safety of equip-ment,since that is dealt with by separate Community ornational legislation.(11)Where this Directive regulates apparatus,it should referto finished apparatus commercially available for the firsttime on the Community market.Certain components orsub-assemblies should,under certain conditions,beconsidered to be apparatus if they are made available tothe end-user.(1)OJ C220,16.9.2003,p.13.(2)Opinion of the European Parliament of9March2004(not yetpublished in the Official Journal)and Council Decision of29November2004.(3)OJ L139,23.5.1989,p.19.Directive as last amended by Directive93/68/EEC(OJ L220,30.8.1993,p.1).(4)OJ L91,7.4.1999,p.10.Directive as amended by Regulation(EC)No1882/2003(OJ L284,31.10.2003,p.1).(12)The principles on which this Directive is based are thoseset out in the Council Resolution of7May1985on anew approach to technical harmonization and stan-dards(1).In accordance with that approach,the designand manufacture of equipment is subject to essentialrequirements in relation to electromagnetic compat-ibility.Those requirements are given technical expressionby harmonised European standards,to be adopted bythe various European standardisation bodies,EuropeanCommittee for Standardisation(CEN),EuropeanCommittee for Electro-technical Standardisation(CENELEC)and European Telecommunications StandardsInstitute(ETSI).CEN,CENELEC and ETSI are recognisedas the competent institutions in the field of this Directivefor the adoption of harmonised standards,which theydraw up in accordance with the general guidelines forcooperation between themselves and the Commission,and with the procedure laid down in Directive98/34/ECof the European Parliament and of the Council of22June1998laying down a procedure for the provision ofinformation in the field of technical standards and regu-lations and of rules on Information Society services(2).(13)Harmonised standards reflect the generally acknowl-edged state of the art as regards electromagnetic compat-ibility matters in the European Union.It is thus in theinterest of the functioning of the internal market to havestandards for the electromagnetic compatibility of equip-ment which have been harmonised at Community level.Once the reference to such a standard has beenpublished in the Official Journal of the European Union,compliance with it should raise a presumption ofconformity with the relevant essential requirements,although other means of demonstrating such conformityshould be pliance with a harmonisedstandard means conformity with its provisions anddemonstration thereof by the methods the harmonisedstandard describes or refers to.(14)Manufacturers of equipment intended to be connected tonetworks should construct such equipment in a way thatprevents networks from suffering unacceptable degrada-tion of service when used under normal operating condi-work operators should construct theirnetworks in such a way that manufacturers of equip-ment liable to be connected to networks do not suffer adisproportionate burden in order to prevent networksfrom suffering an unacceptable degradation of service.The European standardisation organisations should takedue account of that objective(including the cumulativeeffects of the relevant types of electromagneticphenomena)when developing harmonised standards.(15)It should be possible to place apparatus on the marketor put it into service only if the manufacturersconcerned have established that such apparatus has beendesigned and manufactured in conformity with therequirements of this Directive.Apparatus placed on themarket should bear the‘CE’marking attesting to compli-ance with this Directive.Although conformity assess-ment should be the responsibility of the manufacturer,without any need to involve an independent conformityassessment body,manufacturers should be free to usethe services of such a body.(16)The conformity assessment obligation should require themanufacturer to perform an electromagnetic compat-ibility assessment of apparatus,based on relevantphenomena,in order to determine whether or not itmeets the protection requirements under this Directive.(17)Where apparatus is capable of taking different configura-tions,the electromagnetic compatibility assessmentshould confirm whether the apparatus meets the protec-tion requirements in the configurations foreseeable bythe manufacturer as representative of normal use in theintended applications;in such cases it should be suffi-cient to perform an assessment on the basis of theconfiguration most likely to cause maximum disturbanceand the configuration most susceptible to disturbance.(18)Fixed installations,including large machines andnetworks,may generate electromagnetic disturbance,orbe affected by it.There may be an interface betweenfixed installations and apparatus,and the electromag-netic disturbances produced by fixed installations mayaffect apparatus,and vice versa.In terms of electromag-netic compatibility,it is irrelevant whether the electro-magnetic disturbance is produced by apparatus or by afixed installation.Accordingly,fixed installations andapparatus should be subject to a coherent and compre-hensive regime of essential requirements.It should bepossible to use harmonised standards for fixed installa-tions in order to demonstrate conformity with the essen-tial requirements covered by such standards.(19)Due to their specific characteristics,fixed installationsneed not be subject to the affixation of the‘CE’markingor to the declaration of conformity.(20)It is not pertinent to carry out the conformity assessmentof apparatus placed on the market for incorporation intoa given fixed installation,and otherwise not commer-cially available,in isolation from the fixed installationinto which it is to be incorporated.Such apparatusshould therefore be exempted from the conformityassessment procedures normally applicable to apparatus.However,such apparatus should not be permitted tocompromise the conformity of the fixed installation intowhich it is incorporated.Should apparatus be incorpo-rated into more than one identical fixed installation,identifying the electromagnetic compatibility characteris-tics of these installations should be sufficient to ensureexemption from the conformity assessment procedure.(1)OJ C136,4.6.1985,p.1.(2)OJ L204,21.7.1998,p.37.Directive as last amended by the2003Act of Accession.(21)A transitional period is necessary in order to ensure thatmanufacturers and other concerned parties are able toadapt to the new regulatory regime.(22)Since the objective of this Directive,namely to ensurethe functioning of the internal market by requiringequipment to comply with an adequate level of electro-magnetic compatibility,cannot be sufficiently achievedby Member States and can therefore,by reason of itsscale and effects,be better achieved at Community level,the Community may adopt measures,in accordancewith the principle of subsidiarity as set out in Article5of the Treaty.In accordance with the principle ofproportionality,as set out in that Article,this Directivedoes not go beyond what is necessary in order toachieve that objective.(23)Directive89/336/EEC should therefore be repealed, HAVE ADOPTED THIS DIRECTIVE:CHAPTER IGENERAL PROVISIONSArticle1Subject matter and scope1.This Directive regulates the electromagnetic compatibility of equipment.It aims to ensure the functioning of the internal market by requiring equipment to comply with an adequate level of electromagnetic compatibility.This Directive applies to equipment as defined in Article2.2.This Directive shall not apply to:(a)equipment covered by Directive1999/5/EC;(b)aeronautical products,parts and appliances as referred to inRegulation(EC)No1592/2002of the European Parliament and of the Council of15July2002on common rules in the field of civil aviation and establishing a European Avia-tion Safety Agency(1);(c)radio equipment used by radio amateurs within themeaning of the Radio Regulations adopted in the frame-work of the Constitution and Convention of the ITU(2), unless the equipment is available commercially.Kits of components to be assembled by radio amateurs and commercial equipment modified by and for the use of radio amateurs are not regarded as commercially available equipment.3.This Directive shall not apply to equipment the inherent nature of the physical characteristics of which is such that: (a)it is incapable of generating or contributing to electromag-netic emissions which exceed a level allowing radio and telecommunication equipment and other equipment to operate as intended;and(b)it will operate without unacceptable degradation in thepresence of the electromagnetic disturbance normally consequent upon its intended use.4.Where,for the equipment referred to in paragraph1,the essential requirements referred to in Annex I are wholly or partly laid down more specifically by other Community direc-tives,this Directive shall not apply,or shall cease to apply,to that equipment in respect of such requirements from the date of implementation of those directives.5.This Directive shall not affect the application of Com-munity or national legislation regulating the safety of equip-ment.Article2Definitions1.For the purposes of this Directive,the following defini-tions shall apply:(a)‘equipment’means any apparatus or fixed installation;(b)‘apparatus’means any finished appliance or combinationthereof made commercially available as a single functional unit,intended for the end user and liable to generate elec-tromagnetic disturbance,or the performance of which is liable to be affected by such disturbance;(c)‘fixed installation’means a particular combination ofseveral types of apparatus and,where applicable,other devices,which are assembled,installed and intended to be used permanently at a predefined location;(d)‘electromagnetic compatibility’means the ability of equip-ment to function satisfactorily in its electromagnetic envir-onment without introducing intolerable electromagnetic disturbances to other equipment in that environment; (e)‘electromagnetic disturbance’means any electromagneticphenomenon which may degrade the performance of equipment.An electromagnetic disturbance may be electro-magnetic noise,an unwanted signal or a change in the propagation medium itself;(1)OJ L240,7.9.2002,p.1.Regulation as amended by CommissionRegulation(EC)No1701/2003(OJ L243,27.9.2003,p.5).2and Convention of the International Telecommunica-tion Union adopted by the Additional Plenipotentiary Conference (Geneva,1992)as amended by the Plenipotentiary Conference (Kyoto,1994).(f)‘immunity’means the ability of equipment to perform asintended without degradation in the presence of an electro-magnetic disturbance;(g)‘safety purposes’means the purposes of safeguardinghuman life or property;(h)‘electromagnetic environment’means all electromagneticphenomena observable in a given location.2.For the purposes of this Directive the following shall be deemed to be an apparatus within the meaning of paragraph 1(b):(a)‘components’or‘sub-assemblies’intended for incorporationinto an apparatus by the end user,which are liable to generate electromagnetic disturbance,or the performance of which is liable to be affected by such disturbance; (b)‘mobile installations’defined as a combination of apparatusand,where applicable,other devices,intended to be moved and operated in a range of locations.Article3Placing on the market and/or putting into serviceMember States shall take all appropriate measures to ensure that equipment is placed on the market and/or put into service only if it complies with the requirements of this Directive when properly installed,maintained and used for its intended purpose.Article4Free movement of equipment1.Member States shall not impede,for reasons relating to electromagnetic compatibility,the placing on the market and/ or the putting into service in their territory of equipment which complies with this Directive.2.The requirements of this Directive shall not prevent the application in any Member State of the following special measures concerning the putting into service or use of equip-ment:(a)measures to overcome an existing or predicted electromag-netic compatibility problem at a specific site;(b)measures taken for safety reasons to protect public telecom-munications networks or receiving or transmitting stations when used for safety purposes in well-defined spectrum situations.Without prejudice to Directive98/34/EC,Member States shall notify those special measures to the Commission and to the other Member States.The special measures which have been accepted shall be published by the Commission in the Official Journal of the Euro-pean Union.3.Member States shall not create any obstacles to the display and/or demonstration at trade fairs,exhibitions or similar events of equipment which does not comply with this Directive,provided that a visible sign clearly indicates that such equipment may not be placed on the market and/or put into service until it has been brought into conformity with this Directive.Demonstration may only take place provided that adequate measures are taken to avoid electromagnetic distur-bances.Article5Essential requirementsThe equipment referred to in Article1shall meet the essential requirements set out in Annex I.Article6Harmonised standards1.‘Harmonised standard’means a technical specification adopted by a recognised European standardisation body under a mandate from the Commission in conformity with the proce-dures laid down in Directive98/34/EC for the purpose of establishing a European pliance with a ‘harmonised standard’is not compulsory.2.The compliance of equipment with the relevant harmo-nised standards whose references have been published in the Official Journal of the European Union shall raise a presumption, on the part of the Member States,of conformity with the essen-tial requirements referred to in Annex I to which such stan-dards relate.This presumption of conformity is limited to the scope of the harmonised standard(s)applied and the relevant essential requirements covered by such harmonised standard(s).3.Where a Member State or the Commission considers thata harmonised standard does not entirely satisfy the essential requirements referred to in Annex I,it shall bring the matter before the Standing Committee set up by Directive98/34/EC (hereinafter‘the Committee’),stating its reasons.The Committee shall deliver an opinion without delay.4.Upon receipt of the Committee's opinion,the Commis-sion shall take one of the following decisions with regard to the references to the harmonised standard concerned:(a)not to publish;(b)to publish with restrictions;(c)to maintain the reference in the Official Journal of the Euro-pean Union;(d)to withdraw the reference from the Official Journal of theEuropean Union.The Commission shall inform the Member States of its decision without delay.CHAPTER IIAPPARATUSArticle7Conformity assessment procedure for apparatus Compliance of apparatus with the essential requirements referred to in Annex I shall be demonstrated by means of the procedure described in Annex II(internal production control). However,at the discretion of the manufacturer or of his authorised representative in the Community,the procedure described in Annex III may also be followed.Article8‘CE’marking1.Apparatus whose compliance with this Directive has been established by means of the procedure laid down in Article7 shall bear the‘CE’marking which attests to that fact.The affixing of the‘CE’marking shall be the responsibility of the manufacturer or his authorised representative in the Com-munity.The‘CE’marking shall be affixed in accordance with Annex V.2.Member States shall take the necessary measures to prohibit the affixing to the apparatus,or to its packaging,or to the instructions for its use,of marks which are likely to mislead third parties in relation to the meaning and/or graphic form of the‘CE’marking.3.Any other mark may be affixed to the apparatus,its packaging,or the instructions for its use,provided that neither the visibility nor the legibility of the‘CE’marking is thereby impaired.4.Without prejudice to Article10,if a competent authority establishes that the‘CE’marking has been unduly affixed,the manufacturer or his authorised representative in the Com-munity shall bring the apparatus into conformity with the provisions concerning the‘CE’marking under conditions imposed by the Member State concerned.Article9Other marks and information1.Each apparatus shall be identified in terms of type,batch, serial number or any other information allowing for the identi-fication of the apparatus.2.Each apparatus shall be accompanied by the name and address of the manufacturer and,if he is not established within the Community,the name and address of his authorised repre-sentative or of the person in the Community responsible for placing the apparatus on the Community market.3.The manufacturer shall provide information on any specific precautions that must be taken when the apparatus is assembled,installed,maintained or used,in order to ensure that,when put into service,the apparatus is in conformity with the protection requirements set out in Annex I,point1.4.Apparatus for which compliance with the protection requirements is not ensured in residential areas shall be accom-panied by a clear indication of this restriction of use,where appropriate also on the packaging.5.The information required to enable apparatus to be used in accordance with the intended purpose of the apparatus shall be contained in the instructions accompanying the apparatus.Article10Safeguards1.Where a Member State ascertains that apparatus bearing the‘CE’marking does not comply with the requirements of this Directive,it shall take all appropriate measures to withdraw the apparatus from the market,to prohibit its placing on the market or its putting into service,or to restrict the free move-ment thereof.2.The Member State concerned shall immediately inform the Commission and the other Member States of any such measure,indicating the reasons and specifying,in particular, whether non-compliance is due to:(a)failure to satisfy the essential requirements referred to inAnnex I,where the apparatus does not comply with the harmonised standards referred to in Article6;(b)incorrect application of the harmonised standards referredto in Article6;(c)shortcomings in the harmonised standards referred to inArticle6.3.The Commission shall consult the parties concerned as soon as possible,following which it shall inform the Member States whether or not it finds the measure to be justified.4.Where the measure referred to in paragraph1is attrib-uted to a shortcoming in harmonised standards,the Commis-sion,after consulting the parties,shall,if the Member State concerned intends to uphold the measure,bring the matter before the Committee and initiate the procedure laid down in Article6(3)and(4).5.Where the non-compliant apparatus has been subject to the conformity assessment procedure referred to in Annex III, the Member State concerned shall take appropriate action in respect of the author of the statement referred to in Annex III, point3,and shall inform the Commission and the other Member States accordingly.Article11Decisions to withdraw,prohibit or restrict the free move-ment of apparatus1.Any decision taken pursuant to this Directive to withdraw apparatus from the market,prohibit or restrict its placing on the market or its putting into service,or restrict the free move-ment thereof,shall state the exact grounds on which it is based. Such decisions shall be notified without delay to the party concerned,who shall at the same time be informed of the remedies available to him under the national law in force in the Member State in question and of the time limits to which such remedies are subject.2.In the event of a decision as referred to in paragraph1, the manufacturer,his authorised representative,or any other interested party shall have the opportunity to put forward his point of view in advance,unless such consultation is not possible because of the urgency of the measure to be taken as justified in particular with respect to public interest require-ments.Article12Notified bodies1.Member States shall notify the Commission of the bodies which they have designated to carry out the tasks referred to in Annex III.When determining the bodies to be designated, Member States shall apply the criteria laid down in Annex VI.Such notification shall state whether the bodies are designated to carry out the tasks referred to in Annex III for all apparatus covered by this Directive,and/or the essential requirements referred to in Annex I or whether the scope of designation is limited to certain specific aspects and/or categories of appa-ratus.2.Bodies which comply with the assessment criteria estab-lished by the relevant harmonised standards shall be presumed to comply with the criteria set out in Annex VI covered by such harmonised standards.The Commission shall publish in the Official Journal of the European Union the references of those standards.3.The Commission shall publish in the Official Journal of the European Union a list of notified bodies.The Commission shall ensure that the list is kept up to date.4.If a Member State finds that a notified body no longer meets the criteria listed in Annex VI,it shall inform the Commission and the other Member States accordingly.The Commission shall withdraw the reference to that body from the list referred to in paragraph3.CHAPTER IIIFIXED INSTALLATIONSArticle13Fixed installations1.Apparatus which has been placed on the market and which may be incorporated into a fixed installation is subject to all relevant provisions for apparatus set out in this Directive.However,the provisions of Articles5,7,8and9shall not be compulsory in the case of apparatus which is intended for incorporation into a given fixed installation and is otherwise not commercially available.In such cases,the accompanying documentation shall identify the fixed installation and its elec-tromagnetic compatibility characteristics and shall indicate the precautions to be taken for the incorporation of the apparatus into the fixed installation in order not to compromise the conformity of that installation.It shall furthermore include the information referred to in Article9(1)and(2).2.Where there are indications of non-compliance of the fixed installation,in particular,where there are complaints about disturbances being generated by the installation,the competent authorities of the Member State concerned may request evidence of compliance of the fixed installation,and, when appropriate,initiate an assessment.Where non-compliance is established,the competent authori-ties may impose appropriate measures to bring the fixed instal-lation into compliance with the protection requirements set out in Annex I,point1.3.Member States shall set out the necessary provisions for identifying the person or persons responsible for the establish-ment of compliance of a fixed installation with the relevant essential requirements.CHAPTER IVFINAL PROVISIONSArticle14RepealDirective89/336/EEC is hereby repealed as from20July2007.References to Directive89/336/EEC shall be construed as refer-ences to this Directive and should be read in accordance with the correlation table set out in Annex VII.。

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)ULN2004AID ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2004AINE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2004AINSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AINSRE4ACTIVESONS162000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM5-Feb-2007Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. 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Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。

欧洲标准 EN103272004.6ICS 77.140.50; 77.140.10 替代 EN 10142:2000EN 10154:2002EN 10214:1995EN 10215:1995 冷成形用连续热浸镀低碳钢钢板和钢带——交货技术条件CEN欧洲标准化委员会1 范围1.1 本标准规定了厚度在0.35mm~3.0mm(除非另有协议,见1.2的连续热浸镀低碳钢镀锌(Z、镀锌铁合金(ZF、镀锌铝合金(ZA、镀铝锌合金(AZ和镀铝硅合金(AS(见表1的钢板和钢带的交货技术要求。

这里的厚度是指交货产品镀层后的最终厚度。

本标准适用于所有宽度的钢带和从宽度≥600mm的钢带剪切而成的钢板及从宽度<600mm的钢带剪切而成的定尺产品。

1.2 如果在询价和订货时有协议,本标准也适用于厚度>3.0mm的连续热浸镀镀层扁平材产品。

在这种情况下,产品的力学性能、镀层附着性和表面质量要求都应在订货或询价时进行协商。

1.3 本标准规定的产品主要用于那些将冷成形性和耐腐蚀性作为重要参考因素的场合下。

合金的耐腐蚀性与镀层厚度成正比(见7.3.2。

1.4 本标准不适用于:• 结构用热浸镀镀层扁平材产品(见EN10326;• 冷轧电镀扁平材钢产品(见EN 10152;• 连续有机镀层(涂层带卷扁平材钢产品(见EN 10169-1、EN 10169-2和EN 10169-3• 冷成形用较高屈服强度的连续热浸镀涂层钢板和钢带(见EN 10292。

2 引用标准下列文件中的条款通过本标准的引用而成为本标准的条款。

凡是注日期的引用文件,仅该版本适用于本标准。

凡是不注日期的引用文件,其最新版本适用于本标准(包括修改单。

EN 10002-1 金属材料-拉伸试验-第1部分:室温实验方法EN 10020:2000 钢牌号定义和分类EN 10021:1993 钢及钢产品交货一般技术要求EN 10027-1 钢代号体系—第1部分:钢名称、基本符号EN 10027-2 钢代号体系—第2部分:数字代号体系EN 10079 钢产品分类EN 10143 连续热浸镀金属镀层钢板和钢带—尺寸外形及允许偏差EN 10204 金属产品—检验文件的类型EN 10113 金属材料—钢板和钢带—塑性应变比的测定EN 10275金属材料—钢板和钢带—拉伸应变硬化指数的测定EN 10260 钢代号体系—补充符号3 术语和定义本标准除采用EN 10020:2000、EN 10021:1993、EN 10079:1992、EN 10204:1991中的术语和定义外,还采用如下术语和定义:注1 钢铁的防护一般导则见EN ISO 14713.注2 连续热浸镀钢带镀层的成分见3.1到3.4。

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)ULN2004AID ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIDRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AIN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2004AINE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2004AINSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AINSRE4ACTIVESONS162000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM5-Feb-2007Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。

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内容目录宣告 (i)內容目錄 (i)表格目錄..................................................................................................................................................... ..ii1 產品說明...................................................................................................................... 1-11.1 檢查內容 ...................................................................................................................... 1-11.2 如何安裝 ...................................................................................................................... 1-11.3 功能簡介 ...................................................................................................................... 1-11.4 產品特色 ...................................................................................................................... 1-21.5 硬體需求 ...................................................................................................................... 1-21.6 如何使用手冊.............................................................................................................. 1-31.7 EzFIX操作流程圖........................................................................................................ 1-41.8 EzFIX簡易操作說明.................................................................................................... 1-62 使用說明...................................................................................................................... 2-12.1 [如何讀取檔案] ........................................................................................................... 2-12.2 [Gerber編輯介面] ........................................................................................................ 2-92.3 工具列 .......................................................................................................................... 2-292.4 [測試點編輯介面]....................................................................................................... 2-322.5 工具列 .......................................................................................................................... 2-382.6 [網路瀏覽介面] ........................................................................................................... 2-413 技巧與提示 (i)3.1 網路分析的解析度設定 (i)3.2 瀏覽異常設計的選項設定 (i)3.3 測孔破的選項設定...................................................................................................... i i4 常見問題解答Q&A (i)4.1 介面的設定 (i)4.2 軟體使用問題.............................................................................................................. i i5 附录 (i)表格目录表2-1：[共用工具列] 圖示功能與熱鍵 ................................................................................................. 2-29 表2-2：Gerber[編輯工具列] 圖示功能與熱鍵....................................................................................... 2-30 表2-3：Gerber[檢視工具列] 圖示功能與熱鍵....................................................................................... 2-31 表2-4：測試點[編輯工具列] 圖示功能與熱鍵..................................................................................... 2-38 表2-5：測試點[檢視工具列] 圖示功能與熱鍵..................................................................................... 2-39 表2-6：逐一瀏覽網路[檢視工具列] 圖示功能與熱鍵 ........................................................................ 2-42 表2-0：RX-274X和RX-274D的內容......................................................................................................... 2-2 表2-0a：NC Drill檔案格式內容................................................................................................................ 2-81产品说明1.1检查内容本产品包含一张程序磁盘(或光盘片)、一本使用手册、和一个保护锁。