50 PCB常用名词解释 1

A/W (artwork) Ablation abrade abrasion resistance ACC ( accept ) accelerated corrosion test accelerated test acceleration
底片 燒溶(laser),切除 粗化 耐磨性 允收 加速腐蝕 加速試驗 速化反應
陰極濺射法 隔板;鋼板 中心光束法 集中式投射線 倒角 (金手指) 切斜邊;倒角 特性阻抗 電量傳遞過電壓
chelator chemical bond chemical vapor deposition circumferential void clad metal clean room coat coating error
accelerator acceptable activator active work in process adhesion adhesive method air inclusion air knife
加速劑 允收 活化液 實際在製品 附著力 黏著法 氣泡 風刀
amorphous change amount amyl nitrite analyzer anneal annular ring anode slime (sludge) anodizing
K. 成型 (Profile) (Form) k-1 撈型 (N/C Routing ) (Milling) k-2 模具沖 (Punch)
k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜邊 ( Beveling of G/F) L. 短斷路測試 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學檢查 ( AOI Inspection) l-2 VRS 目檢 (Verified & Repaired) l-3 泛用型治具測試 (Universal Tester)
N-2 雷射曝光對位孔(Laser Ablation Registration Hole) N-3 雷射Mask製作(Laser Mask) N-4 雷射鑽孔(Laser Ablation) N-5 AOI 檢查及VRS ( AOI Inspection & Verified &
Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除膠渣 (Desmear) N-8 微蝕 (Microetching )
線路露銅 鏡銅 銅箔圓配 銅渣 腐蝕速率計數系統 抗蝕性 庫倫定律 喇叭孔
coupon location covering power Crack crazing cross linking cross talk crosslinking crystal collection
試樣點 遮蓋力 破裂;裂痕 裂痕;白斑 交聯聚合 呼應作用 交聯 結晶收集
curing current efficiency cut-outs cutting cyanide deburring dedicated degradation
J. 噴錫 (Hot Air Solder Leveling) j-1 水平噴錫 (Horizontal Hot Air Solder Leveling) j-2 垂直噴錫 ( Vertical Hot Air Solder Leveling) j-3 超級焊錫 (Super Solder ) j-4. 印焊錫突點 (Solder Bump)
d-2 微 蝕 (Microetching) d-3 鉚釘組合 (eyelet ) d-4 疊板 (Lay up) d-5 壓 合 (Lamination) d-6 後處理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 銑靶 (spot face) d-9 去溢膠 (resin flush removal)
f-6 剝錫鉛 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 預烤 (Precure) g-3 表面刷磨 (Scrub) g-4 後烘烤 (Postcure) H. 防焊(綠漆): (Solder Mask)
傳統張力測試法
conversion coating
轉化層
copper claded laminates (CCL) 銅箔基板
copper exposure copper mirror copper pad copper residue (copper splash) corrosion rate numbering corrosion resistance coulombs law countersink
PCB 常用 名詞解釋
Process Module 說明 : A. 下料 ( Cut Lamination)
a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size) B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling)
c-6 去膜 (Stripping) c-7 初檢 ( Touch-up) c-8 化學前處理,化學研磨 ( Chemical Milling ) c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination) c-10 顯 影(Developing ) c-11 去膜(Stripping ) D. 壓 合 (Lamination) d-1 黑 化 (Black Oxide Treatment)
E. 減銅 (Copper Reduction) e-1 薄化銅(Copper Reduction)
F. 電鍍 (Horizontal Electrolytic Plating) f-1 水平電鍍 (Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂帶研磨 (Belt Sanding)
m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination Test )
(Cleanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderability Testing ) N. 雷射鑽孔(Laser Ablation) N-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole)
b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling) C. 乾膜製程 ( Photo Process (D/F))
c-1 前處理 (Pretreatment) c-2 壓 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 顯 影 (Developing) c-5 蝕銅 (Etching)
預留在製 基材 基準績效 批 貝他射線照射法 切斜邊;斜邊 二方向之變形 黑化
blank controller blank panel blanking blip blister blow hole board-thickness error bonding plies
空白對照組 空板 挖空 彈開 氣泡;起泡 吹孔 板厚錯誤 黏結層
不定形的改變 總量 硝基戊烷 分析儀 回火 環狀墊圈; 孔 陽極泥 陽極處理
AOI ( automatic optical inspection ) 自動光學檢測
applicable documents
引用之文件
AQL sampling
允收水準抽樣
aqueous photoresist
液態光阻
aspect ratio
l-4 專用治具測試 (Dedicated Tester) l-5 飛針測試 (Flying Probe) M. 終檢 ( Final Visual Inspection) m-1 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝 及出貨 (Packing & shipping) m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking)
h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice) (Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask) I . 鍍金 Gold plating i-1 金手指鍍鎳金 ( Gold Finger ) i-2 電鍍軟金 (Soft Ni/Au Plating) i-3 浸鎳金 ( Immersion Ni/Au) (Electroless Ni/Au)
蟹和劑 化學鍵防焊覆蓋錯誤 化學蒸著鍍 圓周性之孔破 包夾金屬 無塵室
鍍外表
coefficient of thermal expansion (CTE) 熱澎脹系數
cold solder joint
冷焊點
color error
顏色錯誤
compensation
補償
complex salt
錯化物
component hole
bow ; bowing break out bridging burning burr carbide carrier catalyzing
板彎 從平環內破出 搭橋;橋接 燒焦 毛邊(毛頭) 碳化物 載運劑 催化
catholic sputtering caul plate center beam method central projection Chamfer chamfering characteristic impedance charge transfer overpotential
零件孔
component side
零件面
Байду номын сангаас
concentric
同心
conformance
密貼性
consumer products
消費性產品
contact resistance
接觸電阻
controlled split
均裂式
conventional flow
亂流方式
conventional tensile test
h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 靜電噴塗 (Spray Coating) h-4 前處理 (Pretreatment) h-5 預烤 (Precure) h-6 曝光 (Exposure) h-7 顯影 (Develop) h-8 後烘烤 (Postcure)
縱橫比(厚寬比)
As received
到貨時
back lighting
背光
back-up
墊板
banked work in process base material baseline performance batch beta backscattering beveling biaxial deformation black-oxide