Reference for Nick

Categories of DefectCategories of defect depends on experience of maintenance practic e.In this manual,the defaultMethod used to categorize the defect found on the aircraft into fou r areas.Structure defect,Material defect,Common parts and Compo nents defect and General defect.缺陷分类缺陷的分类一般依照维修实践中的经验来分。

在本手册中，我们将缺陷分为四类：结构缺陷、材料缺陷、零部件缺陷和一般性缺陷。

mon Structure Defects Terms结构缺陷术语凹坑（1）dent凹槽（2）notch变形（3）deform划痕（4）nick点腐蚀（5）pitting断裂（6）broken腐蚀（7）corrode划伤（8）scratch裂纹（9）crack毛刺（10）butt磨损（11）chafe凸起（12）protrude凹陷（13）sag粗糙（14）rough漆层剥落（15）finish missing褪色（16）fade积水（17）entrapped watermon material defect terms材料缺陷术语Material is divided in two categories:metallic and non-metallic.材料分为两类：金属材料及非金属材料1）Common metallic defect:一般性金属材料缺陷：氧化（18）oxidize划伤（8）scratch扭曲（19）distort跷起（20）not in contour穿孔（21）puncture碎屑（22）chip腐蚀（7）corrode磨损（11）chafe变形（3）deform风蚀/风化（23）erode裂纹（9）crack2)Common non-metallic defect:一般性非金属材料缺陷：发霉（24）mildew分层（25）delaminate风蚀/风化（23）erode裂纹（9）crack老化（26）deteriorate起皱（27）wrinkle受潮（28）saturated撕裂（29）tear穿孔（21）puncture变色（16）fade陈旧（30）worn脱胶（31）adheremon part component defect terms设备及零部件缺陷术语Common part and component including:Plumbing,Wiring,Mechanical linkage,Fastener and Miscellaneous.设备及零部件分为：管路、线路、传动机构、紧固件及其他。

Some oneThe information about the prof.September 1, 2018Jane KielDirector, Human ResourcesAnytown Riding Institute123 Business Rd.Anytown, CA 54321Dear Ms. Kiel,I have known Jane Doe in a variety of capacities for many years. She has been my daughter's riding instructor for the past several years. In addition, she is my partner in a small business where she is responsible for writing and editing articles and website content.Jane is efficient, detail-oriented, and extremely competent. She often successfully finishes a task well before the deadline. She is extremely organized, and never misses a deadline or forgets an assignment.Jane also has an excellent rapport with people of all ages. She has taught riding to both young children and the elderly, and every age in between. Her excellent communication skills (both written and verbal) allow her to connect with all kinds of people and to inspire them to put for their best effort.In summary, I highly recommend Jane for any position or endeavor that she may seek to pursue. She will be a valuable asset for any organization.If you have any questions, please do not hesitate to contact me.Sincerely,John Smith。

114-93037Issue 1, April 20168-Position Cat6/6A Shielded Slim-Line Modular Plug1. IntroductionThis specification covers the requirements for application of Category 6/6A shielded slim-line modular plugconnectors. These requirements are applicable to hand or automatic machine terminating tools. Round, twisted-pair, shielded cables with 24-26 AWG stranded conductors are approved for use with these connectors. The insulated conductor outside diameter must be between 0,89 and 1,09 [.035 and .043], and a cable jacket outside diameter between 4,7 and 7,0 [.185 and .276].When corresponding with CommScope ®personnel, use the terminology provided in this document to facilitate your inquiries for information. Components of the slim-line modular plug connectors are provided in Figure 1. Note: All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Figures and illustrations are for identification only and are not to scale.Figure 1. Slim-Line Modular Plug ComponentsBoot/strain reliefShieldSubassy 8 positionContact no. 1Contact no. 8HousingOptional color clip© 2016 CommScope, Inc.All rights reservedThis product is covered by one or more U.S.patents or their foreign equivalents. For patents, see/ProductPatent/ProductPatent.aspxPage 1 of 11114-93037Application Specification 2. How to Contact Us•To find out more about CommScope® products, visit us on the web at /•For technical assistance:-Within the United States, contact your local account representative or technical support at 1-800-344-0223. Outside the United States, contact your local account representative orPartnerPRO™ Network Partner.-Within the United States, report any missing/damaged parts or any other issues to CommScope Customer Claims at 1-866-539-2795 *****************************.OutsidetheUnitedStates, contact your local account representative or PartnerPRO Network Partner.3. Reference Material3.1 Revision SummaryThis paragraph is reserved for a revision summary of changes and additions made to this specification. The following changes were made for this revision:•Initial release3.2 Customer AssistancePart numbers 2111981 and 2111984 are representative numbers of 8-position Category 6/6A shielded slim-line modular plug connectors. Use of these numbers will identify the product line and expedite your inquires through a service network established to help you obtain product and tooling information. Such information can be obtained through a local CommScope Representative (Field Sales Engineer, Field Applications Engineer, etc.).3.3 DrawingsCustomer drawings for specific products are available from the service network. The information contained in the customer drawings takes priority if there is a conflict with this specification or with any other technical documentation supplied by CommScope.3.4 SpecificationsProduct Specification 108-131013 provides test results and product performance requirements.3.5 Instructional MaterialThe following list includes available instruction sheets (408-series) and customer manuals (409-series) that provide operation, maintenance, and repair of tooling. In addition, follow the instructions and procedures outlined in paragraph 3.2 of this specification for product assembly procedures.Document Number Document Title408-4389 Crimp Height Gage 904170-1408-8734 Terminating Modules 791804-[ ] for Use with Modular Plug Dual Terminators.408-8738 PRO-CRIMPER III Hand Crimping Tool Assembly 790163-[ ].408-9930 PRO-CRIMPER III Hand Crimping Tool Frame Assembly 354940-[ ]409-10010 Modular Plug Dual Terminator 1320840-[ ]Page 2 of 11 114-93037Application Specification 4. Requirements4.1 StorageA. Ultraviolet LightProlonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector components.B. Shelf LifeAll components products should remain in the shipping containers until ready for use to prevent damage. These products should be used on a first in, first out basis to avoid storage contamination.C. Chemical ExposureDo not store connector components near any chemicals listed below, as they may cause stress corrosion cracking in the product.•Alkalies •Ammonia •Citrates •Phosphates Citrates •Sulfur Compounds •Amines •Carbonates •Nitrites •Sulfur Nitrites •TartratesNote: Where the above environmental conditions exist, phosphor-bronze contacts are recommended if available.4.2 Cable SpecificationsCable Type: Round jacketed, shielded, four twisted pairs.Conductor Type: Stranded Conductor: 24-26 AWG, 7-strands.Conductor Insulation0,80-1,09 [.031-.043] for any one conductor.Outside Diameter:Cable Jacket Insulation4,7 – 7,0 [.185 - .276]Diameter:Shield Type: Foil and/or braid, with or without drain wireCable Pair Arrangement: The arrangement of color-coded pairs within the cable jacket applicable to TIA/EIA T568Bwiring and the termination procedures described in this specification is shown in Figure 2.Cable end A applies to one end of the cable and cable end B to the opposite end. ForTIA/EIA T568A wiring or termination of cables with pair arrangements other than shown inFigure 2, contact the responsible CommScope Engineering Department.Cable Filler (Optional) Cable Filler (Optional)Figure 2. Arrangement of Color-Coded PairsPage 3 of 11114-93037Application Specification 5. Assembly5.1 Cable Preparation1. Slide each boot over the relevant end of the cable before the cable stripping operation (Figure 3).2. Strip the cable jacket 30-40 [1.18–1.58] as shown.CAUTION: Do not nick the insulation of the conductors or the shield of the cable (if present).3. Fold the outside shield and drain wire (if present) back over the jacket. In case of braid and foil together, foilmust be trimmed up to 2.0 [.079] max from the jacket end. Individual pair shields must be trimmed up to 2.0 [.079] max. from the jacket end.4. If present, cut and remove any cable filler, ripcord or plastic wrap.5. Slide the plug shield over the cable jacket and cable shield.CAUTION: Do not tear the cable shield. Do not slide the plug shield past the folded-back end of the cable shield.2 mmmaxFigure 3: Cable Preparation5.2 Cable Positioning1. While firmly holding the cable jacket next to the stripped end, untwist the pairs as much as possible asshown in Figure 4.Page 4 of 11 114-93037Application SpecificationCable pairs twisted Cable pairs untwistedFigure 4. Untwist Cable Pairs2. Position the pairs according to the preferred wiring diagram (T568B or T568A) Avoid twisting between pairsas much as possible. See Figure 5.Position pairs accordingly (Wiring B shown)Figure 5. Cable Positioning3. While firmly holding the positioned pairs, make a preliminary cut to the pairs to help the insertion of theconductors into the wire holder. See Figure 6.Figure 6. Trim Cable PairsPage 5 of 11114-93037Application Specification4. Insert the conductors through the wire holder and slide it up to the end. Make sure jacket end is placedbetween the wire holder slot. See Figure 7.Figure 7. Insert Conductors through Wire Holder5. While holding all conductors down against the wire holder in a flat layer, trim all conductors evenly andsquare with appropriate tooling just beyond the front edge of the wire holder as shown in Figure 8.Conductors perfectly aligned at the wire holder edgeFigure 8. Trim Conductors Even with Wire Holder6. Insert the front of the wire holder and the ends of the conductors into the cavity of the plug housing. SeeFigure 9.Page 6 of 11 114-93037Application SpecificationFigure 9. Insert Wire Holder into Plug Housing7. Push the wire holder into the housing until it latches into both sides of the plug housing. A double click shallbe heard when both latches are in their place. See Figure 10.Figure 10. Secure Wire Holder into Housing8. Visually verify that all conductors are fully inserted into the housing with the ends of the conductors seatedagainst the end of the housing cavity. If not, push the cable into the wire holder and check if the wire holder has latched into both sides of the plug housing. See Figure 11.CAUTION: Do not rotate the cable relative to the plug and do not allow the wire holder to cock at an angle relative to the plug.Figure 11. Verify Conductors are Fully Inserted4.3 Connector TerminationRefer to Tooling section for appropriate crimp tooling and machines that are compatible with this connector and proceed as follows:1. Shield orientation: Place the shield so the slots are in the same side as the contacts. See Figure 12.2. Slide the plug shield over the plug subassembly until it seats against the front edge of recessed area aroundthe outside of the plug housing. See Figure 13.CAUTION: At the same time, braid must be holding to avoid the shield drags and folds the braid.Page 7 of 11114-93037Application Specification Figure 12. Orient Shield3. Insert the plug and shield assembly into the appropriate tooling and crimp the connector according to theinstruction sheet packaged with the tooling. The shield must be free of bulges, tears and must be uniform after the crimping operation.CAUTION: Continue pushing the cable toward the plug during crimping to ensure that the conductors remain seated against the front of the housing cavity.4. The shield end must be against the raised edge of the housing. The strain relief end must be held firmly inplace on the cable. See Figure 13.Figure 13. Shield Against Raised End of Housing5. Trim away any braid or foil and drain wire left extending beyond the end of the plug shield. See Figure 14.Figure 14. Trim any Braid or Foil6. Slide the boot over the crimped plug and shield up to the end. A double click shall be heard when bothlatches are in their place See Figure 15.Page 8 of 11114-93037Application SpecificationFigure 15. Slide Boot over Crimped Plug4.4 Terminated Connector RequirementsFigure 16 shows a cutaway of a typical terminated plug and the required location of the conductors. A visual check through the plastic housing of the plug should reveal whether the conductors are within the acceptable range.For optimum transmission performance, it is preferred that all conductors be fully inserted into the plug housing with the ends of the conductors bottomed against the end of the housing cavity. For reliable electricaltermination, the conductors must at least be inserted past the contact and into the 0.80 [.032] reference zone. Proper crimp height can be inspected using an indicator with needle-point probes or equivalent. The crimp height shall be measured at the front of the contact as shown in Figure 16.Figure 16. Plug TolerancesIn addition, make sure that maximum gap between shield and housing is less than indicated in Figure 17.Figure 17. Gap Between Shield and Housing6,02 ±0,13 0,80 [.032] maxMeasure contact height here0,15 [.006] maxPage 9 of 11114-93037Application Specification4.5. Repair/ReplacementDamaged components must not be used. If a damaged component is evident, it must be replaced with a new one.5. QualificationsThe modular plug connectors are not required to be listed or recognized by Underwriters Laboratories Inc. (UL), or certified to the Canadian Standards Association (CSA).6. ToolingThis section provides a selection of tools for termination of the modular plugs. Hand tools are designed for field terminations, and low volume production. Automatic machines are designed for high productivity cable assembly terminations. Refer to Figure 18 for available termination tooling (and instructional material).Dual Terminator Machine (409-10010) 1320840-1 (Power Supply AC Adapter) 1320840-2 (Power Supply DC Output)791804-[ ]PRO CRIMPER IIIHand Tool Assembly 790163-[ ] Frame Assembly354940-1 (with Screws) 354940-2 (without Screws) (408-9930)Die Set 790163-[ ]Page 10 of 11114-93037Application SpecificationCAT6/6APlug Connector that AcceptsCable O.D.Hand Tool (Document) Dual Terminator (Document) Pro-Crimper III Hand Tool Assembly Die Set OnlyTerminating ModuleDual Terminator 4,7 - 5,5 [.185 - .216] 790163-7 (408-8738) 790163-8 791804-4 (408-8734) 1320840-[ ] 5,1 - 6,0 [.201- .236] 790163-1 (408-8738) 790163-2 791804-1 (408-8734) 1320840-[ ] 5,7 - 7,0 [.224 - .276]790163-5 (408-8738)790163-6 791804-3 (408-8734)1320840-[ ]Figure 18: Crimping Tools7. Visual AidFigure 19 shows typical applications of modular plug connectors. These illustrations should be used byproduction personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling.Figure 19: Visual AidAll contacts terminatedShield seated against plugCrimped strain relief must be held firmly in place on cableBoot positioned over plug and shieldPage 11 of 11。

冲压模具词汇Counter bored hole 沉孔Chamfer 倒斜角Fillet 倒圆角padding block垫块stepping bar垫条upper die base上模座lower die base下模座upper supporting blank上承板upper padding plate blank上垫板spare dies模具备品spring 弹簧bolt螺栓document folder活页夹file folder资料夹to put file in order整理资料spare tools location手工备品仓first count初盘人first check初盘复棹人second count 复盘人second check复盘复核人equipment设备waste materials废料work in progress product在制品casing = containerization装箱quantity of physical inventory second count 复盘点数量Quantity of customs count 会计师盘,点数量the first page第一联filed by accounting department for reference会计部存查end-user/using unit(department)使用单位Summary of year-end physical inventory bills 年终盘点截止单据汇总表bill name单据名称This sheet and physical inventory list will be sent to accounting department together (Those of NHK will be sent to financial department)本表请与盘点清册一起送会计部－(NHK厂区送财会部)Application status records of year-end physical inventory List and physical inventory card 年终盘点卡与清册使用－状况明细表blank and waste sheet NO. 空白与作废单号plate电镀mold成型material for engineering mold testing工程试模材料not included in physical inventory不列入盘点sample样品incoming material to be inspected进货待验description品名steel/rolled steel钢材material statistics sheet 物料统计明细表meeting minutes会议记录meeting type 会别distribution department分发单位location地点chairman主席present members出席人员subject主题conclusion结论decision items决议事项responsible department负责单位pre-fixed finishing date预定完成日approved by / checked by / prepared by核准/审核/承办PCE assembly production schedule sheetPCE组装厂生产排配表model机钟work order工令revision版次remark备注production control confirmation生产确认checked by初审approved by核准department部门Stock age analysis sheet 库存货龄分析表on-hand inventory现有库存available material良品可使用obsolete material良品已呆滞to be inspected or reworked 待验或重工total合计cause description原因说明part number/ P/N 料号type形态item/group/class类别quality品质prepared by制表notes说明year-end physical inventory difference analysis sheet 年终盘点差异分析表physical inventory盘点数量physical count quantity帐面数量difference quantity差异量cause analysis原因分析raw materials原料materials物料finished product成品semi-finished product半成品packing materials包材good product/accepted goods/ accepted parts/good parts良品defective product/non-good parts不良品disposed goods处理品warehouse/hub仓库on way location在途仓oversea location海外仓spare parts physical inventory list备品盘点清单spare molds location模具备品仓skid/pallet栈板tox machine自铆机wire EDM线割EDM放电机coil stock卷料sheet stock片料tolerance工差score=groove压线cam block滑块pilot导正筒trim剪外边pierce剪内边drag form压锻差pocket for the punch head挂钩槽slug hole废料孔feature die公母模expansion dwg展开图radius半径shim(wedge)楔子torch-flame cut火焰切割set screw止付螺丝form block折刀stop pin定位销round pierce punch=die button圆冲子shape punch=die insert异形子stock locater block定位块under cut=scrap chopper清角active plate活动板baffle plate挡块cover plate盖板male die公模female die母模groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板bushing block衬套insert 入块club car高尔夫球车capability能力parameter参数factor系数phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂（degrease）main manifold主集流脉bezel斜视规blanking穿落模dejecting顶固模demagnetization去磁;消磁high-speed transmission高速传递heat dissipation热传rack上料degrease脱脂rinse水洗alkaline etch龄咬desmut剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔revision版次part number/P/N料号good products良品scraped products报放心品defective products不良品finished products成品disposed products处理品barcode条形码flow chart流程窗体assembly组装stamping冲压molding成型 spare parts=buffer备品coordinate坐标dismantle the die折模auxiliary function辅助功能poly-line多义线heater band 加热片thermocouple热电偶sand blasting喷沙grit 砂砾deducting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response=reaction=interaction感应edge finder巡边器concave 凹convex凸short射料不足nick缺口speck瑕疪shine亮班splay 银纹gas mark焦痕delamination起鳞cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线patent专利grit沙砾granule=peuet=grain细粒grit maker抽粒机cushion缓冲magnalium镁铝合金magnesium镁金metal plate钣金lathe车plane刨grind磨drill钻boring镗blinster气泡fillet镶;嵌边through-hole form通孔形式voller pin formality滚针形式cam driver铡楔shank摸柄crank shaft曲柄轴angle offset角度偏差velocity速度production tempo生产进度现状torque扭矩spline=the multiple keys花键quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的organic solvent有机溶剂bracket小磁导liaison联络单volatile挥发性resistance电阻ion离子titrator滴定仪beacon警示灯coolant冷却液crusher破碎机plain die简易模pierce die冲孔模forming die成型模progressive die连续模gang dies复合模shearing die剪边模riveting die铆合模pierce冲孔forming成型(抽凸,冲凸) draw hole抽孔bending折弯trim切边emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线blanking下料stamp letter冲字(料号) shearing剪断tick-mark nearside正面压印tick-mark farside反面压印extension dwg展开图procedure dwg工程图die structure dwg模具结构图material材质material thickness料片厚度factor系数upward向上downward向下press specification冲床规格die height range适用模高die height闭模高度burr毛边gap间隙weight重量total wt.总重量punch wt.上模重量inner guiding post内导柱inner hexagon screw内六角螺钉dowel pin固定销coil spring弹簧lifter pin顶料销eq-height sleeves=spool等高套筒pin销lifter guide pin浮升导料销guide pin导正销wire spring圆线弹簧outer guiding post外导柱stop screw止付螺丝located pin定位销outer bush外导套top plate上托板（顶板）top block上垫脚punch set上模座punch pad上垫板punch holder上夹板stripper pad脱料背板up stripper上脱料板male die公模(凸模)feature die公母模female die母模(凹模)upper plate上模板lower plate下模板die pad下垫板die holder下夹板die set下模座bottom block下垫脚bottom plate下托板(底板)stripping plate内外打(脱料板)outer stripper外脱料板inner stripper内脱料板lower stripper下脱料板punch冲头insert入块(嵌入件)deburring punch压毛边冲子groove punch压线冲子stamped punch字模冲子round punch圆冲子special shape punch异形冲子bending block折刀roller滚轴baffle plate挡块located block定位块supporting block for location 定位支承块air cushion plate气垫板air-cushion eject-rod气垫顶杆trimming punch切边冲子stiffening rib punch = stinger 加强筋冲子ribbon punch压筋冲子reel-stretch punch卷圆压平冲子guide plate定位板plain die简易模pierce die冲孔模forming die成型模progressive die连续模gang dies复合模shearing die剪边模riveting die铆合模pierce冲孔forming成型(抽凸,冲凸)draw hole抽孔bending折弯trim切边emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线blanking下料stamp letter冲字(料号) shearing剪断tick-mark nearside正面压印tick-mark farside反面压印extension dwg展开图procedure dwg工程图die structure dwg模具结构图material材质material thickness料片厚度factor系数upward向上downward向下press specification冲床规格die height range适用模高die height闭模高度burr毛边gap间隙weight重量total wt.总重量punch wt.上模重量air vent vale 通气阀anchor pin 锚梢angular pin 角梢baffle 调节阻板baffle plate 折流档板ball button 球塞套ball plunger 定位球塞ball slider 球塞滑块binder plate 压板blank holder 防皱压板blanking die 落料冲头bolster 上下模板bottom board 浇注底板bolster 垫板bottom plate 下固定板bracket 托架bumper block 缓冲块buster 堵口casting ladle 浇注包casting lug 铸耳cavity 模穴(模仁)cavity retainer plate 模穴托板center pin 中心梢clamping block 锁定块coil spring 螺旋弹cold punched nut 冷冲螺母cooling spiral 螺旋冷却栓core 心型cotter 开口梢cross 十字接头cushion pin 缓冲梢diaphragm gate 盘形浇口die approach 模头料道die bed 型底die block 块形模体die body 铸模座die bush 合模衬套die button 冲模母模全球模具网die clamper 夹模器die fastener 模具固定用零件die holder 母模固定板die lip 模唇die plate 冲模板die set 冲压模座direct gate 直接浇口dog chuck 爪牙夹头dowel 定位梢dowel hole 导套孔dowel pin 合模梢dozzle 辅助浇口dowel pin 定位梢draft 拔模锥度draw bead 张力调整杆drive bearing 传动轴承ejection pad 顶出衬垫ejector 脱模器ejector guide pin 顶出导梢ejector leader busher 顶出导梢衬套ejector pad 顶出垫ejector pin 顶出梢ejector plate 顶出板ejector rod 顶出杆ejector sleeve 顶出衬套ejector valve 顶出阀eye bolt 环首螺栓filling core 椿入蕊film gate 薄膜形浇口finger pin 指形梢finish machined plate 角形模板finish machined round plate 圆形模板fixed bolster plate 固定侧模板flanged pin 带凸缘?flash gate 毛边形浇口flask 上箱floating punch 浮动冲头gate 浇口gate land 浇口面gib 凹形拉紧goose neck 鹅颈管guide bushing 引导衬套guide pin 导梢guide post 引导柱guide plate 导板guide rail 导轨head punch 顶冲头headless punch 直柄冲头heavily tapered solid 整体模蕊盒hose nippler 管接头impact damper 缓冲器injection ram 压射柱塞inlay busher 嵌入衬套inner plunger 内柱塞inner punch 内冲头insert 嵌件insert pin 嵌件梢king pin 转向梢king pin bush 主梢衬套knockout bar 脱模杵land 合模平坦面land area 合模面leader busher 导梢衬套lifting pin 起模顶?lining 内衬locating center punch 定位中心冲头locating pilot pin 定位导梢locating ring 定位环lock block 压块locking block 定位块locking plate 定位板loose bush 活动衬套making die 打印冲子manifold block 歧管档块汽车英语first gear 一档second gear 二档reverse 倒车档two-stroke engine 二冲程发动机diesel 柴油机limousine 豪华轿车drophead 活动车篷汽车(美作:convertible) racing car 赛车saloon 轿车(美作:sedan)wecker, beat-up car, jalopy 老爷车notchback 客货两用车four-wheel drive 四轮驱动front-wheel drive 前轮驱动trailer 拖车truck 卡车compact car 小型汽车light-van 小型货车front wheel 前轮rear wheel 后轮tread 轮距chassis 底盘bodywork, body 车身rear window 后窗玻璃windscreen 挡风玻璃(美作:windshield)windscreen wiper 风档刮水器,风档雨雪刷(美作:windshield wiper) fender, wing, mudguard 挡泥板radiator grille 水箱wing mirror 后视镜bonnet 发动机盖(美作:hood)boot 行李箱(美作:trunk)roof rack, luggage rack 行李架license plate, number plate 车号牌wing 前翼子板hubcap 轮毂罩bumper 保险杠front blinker 前信号灯taillight, tail lamp 尾灯backup light, reversing light 倒车灯stoplight, stop lamp 刹车灯rear blinker 转弯指示灯trunk, boot 行李箱bumper 保险杠tailpipe 排气管back seat, rear seat 后座driver's seat, driving seat 驾驶席passenger seat 旅客席steering wheel, wheel 方向盘rear-view mirror, driving mirror 后视镜horn, hooter 喇叭choke 熄火装置gear stick, gear change 变速杆(美作:gearshift) gearbox 变速箱starter, self-starter 起动器,起动钮brake pedal 刹车踏板clutch pedal 离合器踏板hand brake 手制动器foot brake 脚制动器dashboard 仪表板milometer 里程表speedometer, clock 速度表transmission 传动piston 活塞radiator 散热器fan belt 风扇皮带shaft 传动轴inner tube 内胎drain tap 排气阀门silencer 消音器(美作:muffler)tank 油箱overflow 溢流孔valve 阀门exhaust pipe 排气管spare wheel 备胎,备用轮胎carburettor 汽化器(美化:carburetor) electrical system, wiring 电气系统lights 灯光headlight 大灯,头灯dipped headlight 近光灯rear lights 尾灯sidelights, parking lights 位置灯,边灯direction indicator 方向标,转向标indicator, blinker 方向指示灯sparking plug 火花塞(美作:spark plug) (spare) battery (备用)蓄电池to accelerate 加速to brake 制动,刹车to engage the clutch 接上离合器to declutch 分开离合器to stall 发动机停转to change gear 变速to decelerate 减速top speed 最高速度speed limit 速度限制to park 停车to switch off the motor 熄火模具工程常用词汇模具钢材alloy tool steel 合金工具钢 aluminium alloy 铝合金钢 bearing alloy 轴承合金 blister steel 浸碳钢 bonderized steel sheet 邦德防蚀钢板carbon tool steel 碳素工具钢clad sheet 被覆板clod work die steel 冷锻模用钢emery 金钢砂 ferrostatic pressure 钢铁水静压力forging die steel 锻造模用钢galvanized steel sheet 镀锌铁板hard alloy steel 超硬合金钢high speed tool steel 高速度工具钢hot work die steel 热锻模用钢low alloy tool steel 特殊工具钢low manganese casting steel 低锰铸钢marging steel 马式体高强度热处理钢martrix alloy 马特里斯合金meehanite cast iron 米汉纳铸钢meehanite metal 米汉纳铁merchant iron 市售钢材molybdenum high speed steel钼系高速钢 molybdenum steel钼钢 nickel chromium steel 镍铬钢prehardened steel 顶硬钢silicon steel sheet 硅钢板stainless steel 不锈钢tin plated steel sheet 镀锡铁板tough pitch copper 韧铜troostite 吐粒散铁tungsten steel 钨钢vinyl tapped steel sheet 塑料覆面钢板四、模具零件：mold components三板模：3-plate mold二板模：2-plate mold边钉/导边：leader pin/guide pin边司/导套：bushing/guide bushing中托边L：guide pin顶针板：ejector retainner plate托板：support plate螺丝： screw管钉：dowel pin开模槽：ply bar scot内模管位：core/cavity inter-lock顶针：ejector pin司筒：ejector sleeve司筒针：ejector pin推板：stripper plate缩呵：movable core,return core core puller 扣机（尼龙拉勾）：nylon latch lock斜顶：lifter模胚（架）： mold base上内模：cavity insert下内模：core insert行位（滑块）： slide镶件：insert压座/斜鸡：wedge耐磨板/油板：wedge wear plate压条：plate撑头: support pillar唧嘴： sprue bushing挡板：stop plate定位圈：locating ring锁扣：latch扣鸡：parting lock set推杆：push bar栓打螺丝：S.H.S.B顶板：eracuretun活动臂：lever arm分流锥：spure sperader水口司:bush垃圾钉：stop pin隔片：buffle弹弓柱：spring rod弹弓:die spring中托司：ejector guide bush中托边：ejector guide pin镶针：pin销子：dowel pin波子弹弓：ball catch喉塞: pipe plug锁模块：lock plate斜顶：angle from pin斜顶杆：angle ejector rod尼龙拉勾：parting locks活动臂：lever arm气阀：valves斜导边：angle pin术语：terms承压平面平衡：parting surface support balance模排气：parting line venting回针碰料位：return pin and cavity interference模总高超出啤机规格：mold base shut hight顶针碰运水：water line interferes withejector pin料位出上/下模：part from cavith (core) side模胚原身出料位：cavity direct cut on A-plate,core direct cut on B-plate. 不准用镶件：Do not use (core/cavity) insert用铍铜做镶件：use beryllium copper insert初步（正式）模图设计：preliinary (final) mold design反呵：reverse core弹弓压缩量：spring compressed length稳定性好：good stability,stable强度不够：insufficient rigidity均匀冷却：even cooling扣模：sticking热膨胀：thero expansion公差：tolorance铜公(电极）：copper electrode模具工程常用词汇die 模具die shoe 模瓦figure file, chart file图档cutting die, blanking die冲模progressive die, follow (-on)die 连续模compound die复合模punched hole冲孔panel board镶块to cutedges=side cut=side scrap切边to bending折弯to pull, to stretch拉伸Line streching, line pulling线拉伸engraving, to engrave刻印upsiding down edges翻边to stake铆合design modification设计变化die block模块folded block折弯块sliding block滑块location pin定位销lifting pin顶料销die plate, front board模板padding block垫块stepping bar垫条upper die base上模lower die base下模座upper supporting blank上承板upper padding plate blank上垫板spring 弹簧bolt螺栓plate电镀mold成型material for engineering mold testing工程试模材料not included in physical inventory不列入盘点incoming material to be inspected进货待验PCE assembly production schedule sheet PCE组装厂生产排配表model机锺work order工令revision版次production control confirmation生产确认checked by初审approved by核准stock age analysis sheet 库存货龄分析表on-hand inventory现有库存available material良品可使用obsolete material良品已呆滞to be inspected or reworked 待验或重工cause description原因说明part number/ P/N 料号item/group/class类别prepared by制year-end physical inventory difference analysis sheet 年终盘点差异分析表 physical inventory盘点数量physical count quantity帐面数量difference quantity差异good product/accepted goods/ accepted parts/good parts良品defective product/non-good parts不良品disposed goods处理品on way location在途仓oversea location海外仓spare parts physical inventory list备品盘点清单 spare molds location模具备品仓skid/pallet栈板tox machine自铆机wire EDM线割EDM放电机coil stock卷料sheet stock片料tolerance工差score=groove压线cam block滑块pilot导正筒trim剪外边pierce剪内边drag form压锻差pocket for the punch head挂钩槽slug hole废料孔feature die公母模expansion dwg展开图radius半径torch-flame cut火焰切割set screw止付螺丝form block折刀stop pin定位销round pierce punch=die button圆冲子shape punch=die insert异形子stock locater block定位块under cut=scrap chopper清角active plate活动板baffle plate挡块cover plate盖板male die公模female die母模groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板bushing block衬套insert 入块capability能力parameter参数factor系数phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂main manifold主集流脉bezel斜视规blanking穿落模dejecting顶固模demagnetization去磁;消磁high-speed transmission高速传递heat dissipation热传rack上料degrease脱脂rinse水洗alkaline etch龄咬desmut剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔revision版次part number/P/N料号good products良品scraped products报放心品defective products不良品finished products成品disposed products处理品barcode条码flow chart流程表单assembly组装stamping冲压molding成型spare parts=buffer备品coordinate座标dismantle the die折模auxiliary fuction辅助功能poly-line多义线heater band 加热片thermocouple热电偶sand blasting喷沙grit 砂砾derusting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response=reaction=interaction感应ram连杆edge finder巡边器concave凸convex凹short射料不足nick缺口speck瑕疵shine亮班splay 银纹gas mark焦痕delamination起鳞cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线patent专利grit沙砾granule=peuet=grain细粒grit maker抽粒机cushion缓冲magnalium镁铝合金magnesium镁金metal plate钣金lathe车mill锉plane刨grind磨drill铝boring镗blinster气泡fillet镶;嵌边through-hole form通孔形式voller pin formality滚针形式cam driver铡楔shank摸柄crank shaft 曲柄augular offset角度偏差velocity速度production tempo生产进度现状torque扭矩spline=the multiple keys花键quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的organic solvent有机溶剂bracket小磁导liaison联络单volatile挥发性resistance电阻ion离子titrator滴定仪beacon警示灯coolant 冷却液crusher破碎机模具工程类plain die简易模pierce die冲孔模forming die成型模progressive die连续模gang diesemboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线blanking下料stamp letter冲字(料号) shearing剪断tick-mark nearside正面压印tick-mark farside反面压印冲压名称类extension dwg展开图procedure dwg工程图die structure dwg模具结构图material材质material thickness料片厚度press specification冲床规格die height range适用模高die height闭模高度burr毛边gap间隙punch wt.上模重量。

This publication adds the Eight Channel RTD module to the Ovation I/O Reference Manual. It should be placed between Sections 19 and 20.Date: 04/03IPU No.243Ovation ® Interim Publication UpdatePUBLICATION TITLEOvation I/O Reference ManualPublication No. R3-1150Revision 3, March 2003Section 19A. Eight Channel RTDModule19A-1. DescriptionThe Eight (8) channel RTD module is used to convert inputs from Resistance Temperature Detectors (RTDs) to digital data. The digitized data is transmitted to the Controller.19A-2. Module Groups19A-2.1. Electronics ModulesThere is one Electronics module group for the 8 channel RTD Module:n5X00119G01 converts inputs for all ranges and is compatible only with Personality module 5X00121G01 (not applicable for CE Mark certified systems).19A-2.2. Personality ModulesThere is one Personality module groups for the 8 channel RTD Module:n5X00121G01 converts inputs for all ranges and is compatible only with Electronics module 5x00119G01 (not applicable for CE Mark certified systems).19A-2.3. Module Block Diagram and Field Connection WiringDiagramThe Ovation 8 Channel RTD module consists of two modules an electronics module contains a logic printed circuit board (LIA) and a printed circuit board (FTD). The electronics module is used in conjunction with a personalty module, which contains a single printed circuit board (PTD). The block diagram for the 8 channel RTD moduleis shown in Figure 19A-1.Table 19A-1. 8 Channel RTD Module Subsystem ChannelsElectronic Module Personality Module85X00119G015X00121G01Figure 19A-1. 8 Channel RTD Module Block Diagram and Field Connection Wiring Diagram19A-3. SpecificationsElectronics Module (5X00119)Personality Module (5X00121)Table 19A-2. 8 Channel RTD Module SpecificationsDescription ValueNumber of channels8Sampling rate50 HZ mode: 16.67/sec. normally. In 3 wire mode, leadresistance measurement occurs once every 6.45 sec.during which the rate drops to 3/sec.60 HZ mode: 20/sec. normally. In 3 wire mode, leadresistance measurement occurs once every 6.45 sec.during which the rate drops to 2/sec.Self Calibration Mode: Occurs on demand only. The ratedrops to 1/sec. once during each self calibration cycle.RTD ranges Refer to Table 19A-3.Resolution12 bitsGuaranteed accuracy (@25°C)0.10% ±[0.045 (Rcold/Rspan)]% ± [((Rcold + Rspan)/4096 OHM)]% ± [0.5 OHM/Rspan]% ±10 m V ± 1/2LSBwhere:Rcold and Rspan are in Ohms.Temperature coefficient 10ppm/°CDielectric isolation:Channel to channel Channel to logic 200V AC/DC 1000 V AC/DCInput impedance100 M OHM50 K OHM in power downModule power 3.6 W typical; 4.2 W maximumOperating temperature range0 to 60°C (32°F to 140°F)Storage temperature range-40°C to 85°C (-40°F to 185°F)Humidity (non-condensing)0 to 95%Self Calibration On Demand by Ovation ControllerCommon Mode Rejection120 dB @ DC and nominal power line frequency+/- 1/2%Normal Mode Rejection100 dB @ DC and nominal power line frequency+/- 1/2%Table 19A-3. 8 Channel RTD RangesScale #(HEX)Wires Type Tempo FTempo CRcold(ohm)Rhot(ohm)Excitationcurrent(ma)Accuracy± ±countsAccuracy± ±% ofSPAN1310OhmPL0 to1200–18 t o6496106.3 1.090.222310OhmCU 0 to302–18 t o1508.516.5 1.0 130.32D350OhmCU 32 to2840 to1405080 1.0110.2711350OhmCU 32 to2300 to1105378 1.0120.30193100Ohm PL –4 to334–16 t o16892163.671.0110.27223100Ohm PL 32 to5200 to269100200 1.0100.25233100Ohm PL 32 to10400 to561100301 1.0100.25253120Ohm NI –12 t o464–11 t o240109360 1.0100.25263120Ohm NI 32 to1500 to70120170 1.0130.32283120Ohm NI 32 to2780 to122120225 1.0110.27804100Ohm PL 32 to5440 to290100 208 1.0100.25814100Ohm PL 356 t o446180 t o230168 186 1.0300.74824200Ohm PL 32 to6980 to370200 473 1.0120.30834200Ohm PL 514 t o648268 t o342402452 1.0290.71844100Ohm PL 32 to1240 to51100120 1.0190.47854100Ohm PL 32 to2170 to103100 140 1.0130.3286 4100Ohm PL 32 to4120 to211100 180 1.0110.27874100Ohm PL 32 to7140 to379100 240 1.0100.25884120Ohm PL 511 t o662266 t o350200230 1.0240.5919A-4. 8 Channel RTD Terminal Block Wiring Information19A-4.1. Systems Using Personality Module 5X00121G01 Each Personality module has a simplified wiring diagram label on its side, which appears above the terminal block. This diagram indicates how the wiring from the field is to beconnected to the terminal block in the base unit. The following table lists and defines the abbreviations used in this diagram.Table 19A-4. Abbreviations Used in the DiagramAbbreviation Definition+IN, -IN Positive and negative sense input connectionEarth ground terminal. Used for landing shields when the shield is to begrounded at the module.PS+, PS-Auxiliary power supply terminals.RTN Return for current source connection.SH Shield connector. used for landing shields when the shield is to begrounded at the RTD.SRC Current source connection.Note:PS+ and PS- are not used by this module.19A-5. 8 Channel RTD Module Address Locations19A-5.1. Configuration and Status RegisterWord address 13 (D in Hex) is used for both module configuration and module status. The Module Status Register has both status and diagnostic information. The bit information contained within these words is shown in Table 19A-5.Definitions for the Configuration/Module Status Register bits:Bit 0:This bit configures the module (write) or indicates the configuration state of the module (read). A “1” indicates that the module is configured. Note that until the module is configured, reading from addresses #0 through #11 (B in Hex) will produce an attention status.Bit 1:This bit (write “1”) forces the module into the error state, resulting in the error LED being lit. The read of bit “1” indicates that there is an internal module error,or the controller has forced the module into the error state. The state of this bit is always reflected by the module’s Internal Error LED. Whenever this bit is set,an attention status is returned to the controller when address #0 through #11(B in Hex) are read.Table 19A-5. 8 Channel RTD Configuration/Status Register (Address 13 0xD in Hex)Bit Data Description -Configuration Register (Write)Data Description -Status Register (Read)0Configure Module Module Configured(1 = configured; 0 = unconfigured)1Force errorInternal or forced error(1 = forced error; 0 = no forced error)250/60 Hz select (0 = 60Hz, 1 = 50Hz)50/60 Hz System (1 = 50Hz) d(read back)3SELF_CAL (Initiates Self Calibration)Warming bit (set during power up or configuration)40050060Module Not Calibrated 708CH.1 _ 3/4 Wire.CH.1 _ 3/4 Wire - Configuration (read back)9CH.2 _ 3/4 Wire.CH.2 _ 3/4 Wire - Configuration (read back)10CH.3 _ 3/4 Wire.CH.3 _ 3/4 Wire - Configuration (read back)11CH.4 _ 3/4 Wire.CH.4 _ 3/4 Wire - Configuration (read back)12CH.5 _ 3/4 Wire.CH.5 _ 3/4 Wire - Configuration (read back)13CH.6 _ 3/4 Wire.CH.6 _ 3/4 Wire - Configuration (read back)14CH.7 _ 3/4 Wire.CH.7 _ 3/4 Wire - Configuration (read back)15CH.8 _ 3/4 Wire.CH.8 _ 3/4 Wire - Configuration (read back)Bit 2:The status of this bit (read) indicates the conversion rate of the module, write to this bit configures the conversion rate of A/D converters as shown below.see Table 19A-6.Bit3:Write: This bit is used to initiate self-calibration. Read: This bit indicates that the module is in the “Warming” state. this state exists after power up and ter-minates after 8.16 seconds. the module will be in the error condition during the warm up period.Bit4 & 5:These bits are not used and read as “0” under normal operation.Bit 6:This bit (read) is the result of a checksum test of the EEPROM. A failure of this test can indicate a bad EEPROM, but it typically indicates that the module has not been calibrated. A “0” indicates that there is no error condition. If an error is present, the internal error LED is lit and attention status will be returned for all address offsets 0-11 (0x0 - 0xB). The “1” state of this bit indicates an unre-coverable error condition in the field.Bit 7:This bits is not used and read as “0” under normal operation.Bit 8 - 15:These bits are used to configure channels 1 - 8 respectively for 3 or 4 wire op-eration. A “0” indicates 3 wire and a “1” indicates 4 wire operation, see Table 19A-7 and Table 19A-8).Word address 12 (0xC) is used to configure the appropriate scales for Channels 1 - 4 (refer to Table 19A-7 and Table 19A-8).Table 19A-6. Conversion Rate Conversion Rate (1/sec.)Bit 260 (for 60Hz systems)050 (for 50Hz systems)1Table 19A-7. Data Format for the Channel Scale Configuration Register(0xC)Bit Data Description Configuration (Write)Data Description Status (Read)0 Configure Channel #1scale - Bit 0Channel #1 scale configuration (read back) - Bit 01Configure Channel #1scale - Bit 1Channel #1 scale configuration (read back) - Bit 12Configure Channel #1scale - Bit 2Channel #1 scale configuration (read back) - Bit 23Configure Channel #1scale - Bit 3Channel #1 scale configuration (read back) - Bit 34Configure Channel #2 scale - Bit 0Channel #2 scale configuration (read back) - Bit 05Configure Channel #2 scale - Bit 1Channel #2 scale configuration (read back) - Bit 16Configure Channel #2 scale - Bit 2Channel #2 scale configuration (read back) - Bit 27Configure Channel #2 scale - Bit 3Channel #2 scale configuration (read back) - Bit 38Configure Channel #3 scale - Bit 0Channel #3 scale configuration (read back) - Bit 09Configure Channel #3 scale - Bit 1Channel #3 scale configuration (read back) - Bit 1Caution:Configuring any or all channel scales while the system is running will cause all channels to return attention status for up to two seconds following the reconfiguration.Caution:Configuring any or all channel scales while the system is running will cause all channels to return attention status for up to two seconds following the reconfiguration.10Configure Channel #3 scale - Bit 2Channel #3 scale configuration (read back) - Bit 211Configure Channel #3 scale - Bit 3Channel #3 scale configuration (read back) - Bit 312Configure Channel #4 scale - Bit 0Channel #4 scale configuration (read back) - Bit 013Configure Channel #4 scale - Bit 1Channel #4 scale configuration (read back) - Bit 114Configure Channel #4 scale - Bit 2Channel #4 scale configuration (read back) - Bit 215Configure Channel #4 scale - Bit 3Channel #4 scale configuration (read back) - Bit 3Table 19A-8. Data Format for the Channel Scale Configuration Register(0xE)Bit Data Description Configuration (Write)Data Description Status (Read)0 Configure Channel #5 scale - Bit 0Channel #5 scale configuration (read back) - Bit 01Configure Channel #5 scale - Bit 1Channel #5 scale configuration (read back) - Bit 12Configure Channel #5 scale - Bit 2Channel #5 scale configuration (read back) - Bit 23Configure Channel #5 scale - Bit 3Channel #5 scale configuration (read back) - Bit 34Configure Channel #6 scale - Bit 0Channel #6 scale configuration (read back) - Bit 05Configure Channel #6 scale - Bit 1Channel #6 scale configuration (read back) - Bit 16Configure Channel #6 scale - Bit 2Channel #6 scale configuration (read back) - Bit 27Configure Channel #6 scale - Bit 3Channel #6 scale configuration (read back) - Bit 38Configure Channel #7 scale - Bit 0Channel #7 scale configuration (read back) - Bit 09Configure Channel #7 scale - Bit 1Channel #7 scale configuration (read back) - Bit 110Configure Channel #7 scale - Bit 2Channel #7 scale configuration (read back) - Bit 211Configure Channel #7 scale - Bit 3Channel #7 scale configuration (read back) - Bit 312Configure Channel #8 scale - Bit 0Channel #8 scale configuration (read back) - Bit 013Configure Channel #8 scale - Bit 1Channel #8 scale configuration (read back) - Bit 114Configure Channel #8 scale - Bit 2Channel #8 scale configuration (read back) - Bit 215Configure Channel #8 scale - Bit 3Channel #8 scale configuration (read back) - Bit 3Table 19A-7. Data Format for the Channel Scale Configuration Register(0xC)19A-6. Diagnostic LEDsTable 19A-9. 8 Channel RTD Diagnostic LEDsLED DescriptionP (Green)Power OK LED. Lit when the +5V power is OK.C (Green)Communications OK LED. Lit when the Controller is communicatingwith the module.I (Red)Internal Fault LED. Lit whenever there is any type of error with themodule except to a loss of power. Possible causes are:n - Module initialization is in progress.n - I/O Bus time-out has occurred.n - Register, static RAM, or FLASH checksum error.n - Module resetn - Module is uncalibrated.n - Forced error has been received from the Controllern - Communication between the Field and Logic boards failedCH1 - CH 8 (Red)Channel error. Lit whenever there is an error associated with a channel or channels. Possible causes are:n - Positive overrangen - Negative overrangen Communication with the channel has failed。

Calibration Techniques for Millimetre-wave On-wafer S-parameterMeasurementsXiaobang Shang*, Jian Ding#, Nick Ridler*, Christopher Buck#, Mike Geen#*National Physical Laboratory, Teddington, TW11 0LW, UK#Filtronic Broadband Limited, Sedgefield, County Durham, TS21 3FD, UK Emails:*********************.uk,***********************,******************.uk,*******************************,***********************I. SummaryAccurate characterisation of S-parameters (scattering parameters) at chip level is of great importance to the development of next generation electronic devices. Such measurements are usually carried out on a Vector Network Analyzer (VNA), subject to an on-wafer calibration. Calibration techniques play a key role in determining the accuracy of on-wafer measurements. This paper is intended to provide an overview of conventional calibration techniques, including TRL (Thru, Reflect, Line), Multi-Line TRL,SOLT (Short, Open, Load, Thru), LRM (Line, Reflect, Match), and LRRM (Line, Reflect, Reflect, Match). Advantages and limitations of these different calibration techniques are discussed briefly and summarised. This paper also gives an insight into important factors that influence on-wafer measurement quality. These factors include design of calibration standards, testing environment (boundary and nearby structures), probes pitch sizes, etc.II. Conventional Calibration Techniques for Planar MeasurementsMost RF and microwave probes are designed to have probe tips suitable for probing on coplanar waveguide (CPW) structures. Fig. 1 shows the typical CPW ground-signal-ground (GSG) probe tip configuration. Calibrations using reference devices in the on-wafer domain are usually performed prior to further on-wafer measurements so as to remove the systematic and drift errors from measurement results. Basic calibration standards include OPEN, SHORT, LOAD, and THRU, as shown in Fig. 2, with each having electrical characteristics that are very different from each other, which is preferable for the calibration. These standards are however not ideal, due to parasitic capacitance or inductance, see Fig. 2. Such parasitic capacitance and inductance associated with standards need to be taken into account when performing an on-wafer calibration to the probe tips.Probe manufacturers usually specify calibration coefficients obtained using a commercial Impedance Standard Substrate (ISS).(a) (b)Fig. 1. (a) Illustration showing signal excitation at coplanar GSG probe tips [1]. (b) Photograph of the GSG probes tips of the D-band (110-170 GHz) probes at NPL. These probes have a pitch size of 100 µm.Fig. 2. Typical calibration standards with parasitic capacitance and inductance. [1]SOLT TRLLRM LRRMMTRLFig. 3. Diagrams of five conventional on-wafer calibration techniques.Fig. 3 illustrates five conventional on-wafer calibration techniques using these basic standards. These are briefly described below [1].•SOLT requires rigorous definitions of calibration standards. SOLT is robust, as long as all calibration standards are perfectly known. Calibration coefficients for standards are defined for a particular probe placement, therefore the resulting SOLT calibration is relatively sensitive to probe placement errors that are inherent in microwave probing.•TRL requires minimal knowledge of electrical behaviour of standards. The reference plane is usually set at the centre of the THRU standard. REFLECT standard can be either SHORT or OPEN, but identical reflects are required on both ports. LINE standard (with electrical phase around 20° ~ 160° at test frequencies) provides information about the characteristic impedance of the CPW transmission line. Each LINE standard can only cover a limited frequency range, hence multiple lines are required for broadband measurements.•Similar to TRL, characteristic impedance of LRM is determined by the MATCH standard (equivalent to an infinitely long reflectionless line). The reference plane is set at the middle of the LINE standard. REFLECT standard can be either SHORT or OPEN, however it should again beidentical on both ports. LRM does not need knowledge about parasitic capacitance of OPEN or parasitic inductance of SHORT. However, the behaviour of the MATCH needs to be well understood.•Reference plane of LRRM is usually set at the middle of LINE. REFLECT does not require known OPEN or SHORT, however it must be equal at both ports. MATCH standard could have known resistance and unknown inductance (assumed constant with frequency). MATCH inductance is calculable using OPEN. LRRM requires one MATCH standard, whereas LRM needs two. LRRM requires the same set of standards as SOLT but requires less information about the standards.This can give better results than SOLT and is less sensitive to small errors in probe placement. •Multi-Line TRL (MTRL), developed by NIST, has become established as a reference calibration technique. MTRL involves multiple lines and uses all lines, to some extent, at all frequencies.Varying weighting is applied to all the LINE data to resolve the problem of band breaks of conventional TRL.It is important to understand strengths and limitations of each calibration technique. Table I gives a comparison between these techniques. Note that the optimum calibration technique depends on the exact measurement requirements. Verification standards can be used to compare different calibration techniques.Table I: Comparison between conventional calibration techniques. [1]There are two common calibration approaches:•Probe tip calibration using ISSs (off-wafer) + de-embedding using additional on-wafer structures (optional)•On-wafer calibration using standards fabricated on the same wafer as the Device Under Test (DUT).III. TRL Calibrations Using Different Reflect StandardsTRL is a popular on-wafer calibration method, with the minimal requirement on prior knowledge of the standards. In addition, the desired reference plane for calibration can be set the same as the DUT. Therefore, TRL is ideally suited to on-wafer measurements for DUTs with the same reference plane and lead structure.A TRL calibration was applied to the measurement of some D-band (110-170 GHz) integrated circuits. The circuits and the TRL calibration standards were fabricated on the same GaAs substrate with a thickness of 50 µm. Two sets of TRL standards were produced, and the layout of one set of these standards is shown in Fig. 4 (a). The first set has launches from the GSG pads to the reference plane of 300 µm length (i.e. L=300 µm), the second set has 100 µm long launches. The launches should besufficiently long so that the microstrip mode can be fully established by the time it gets to the reference plane. EM full wave modelling of the launch can be carried out to calculate the optimum length. On the other hand, the launch length should be no greater than λg/8 [2], otherwise the LINE standard would behave like a λg/2 resonator and bring in resonance to the transmission response. In this work, the 100 µm long launches fulfil this requirement, and the 300 µm long launches are considerably longer than λg/8.For TRL calibration, the REFLECT standard can be either a SHORT or OPEN. In this work, both types of circuits have been implemented and utilised for de-embedding the raw measurement results of the verification device.The measurement was carried out at NPL on a manual probe station. The setup shown in Fig. 4 (b) was used to obtain uncorrected raw data for the TRL calibration standards and the DUT (verification line). This was then postprocessed by implementing the four different TRL calibrations (i.e. L=100 µm or 300 µm, and OPEN or SHORT as REFLECT standard). This approach minimises the uncertainty due to contact repeatability. The corrected results are shown in Fig. 5. It was found that better agreement with the physical structure of the verification line was obtained using the 100 µm launches because the 300 µm calibration set yielded transmission responses close to 0 dB at the high end of the frequency band which does not agree well with theory. The processed results using calibrations with different REFLECT standards are also shown in Fig. 5. There is not any noticeable difference between the results based on SHORT and OPEN.(a)(b)Fig. 4. (a) Diagram of the TRL calibration standards fabricated on the same wafer as the devices.(b) Test setup at NPL, for D-band on-wafer measurements.Fig. 5. Measurement results of the verification line subject to TRL calibrations using 4 different sets of standards (i.e. L=100 µm or 300 µm, and OPEN or SHORT as REFLECT standard).IV. Impact from Neighbouring StructuresFor on-wafer measurements, the probe shadow region should be kept free of structures, to avoid coupling between probes and the nearby structures surrounding the DUT or calibration standards, as shown in Fig. 6. Otherwise, there will be noticeable dips (or resonances) in the measured transmission responses, regardless of the calibration techniques employed. This is also discussed in detail in [3] and [4].The impact from neighbouring structures has also been studied in [5]. Full wave simulations have been carried out for a microstrip line with a short microstrip line nearby. The modelled structures together with the simulation results are shown in Fig. 7. It can be observed that the frequencies of these dips in the transmission responses are related to the lengths of the neighbouring lines. More dips could occur in the transmission responses if there were more than one neighbouring structures. This would degrade the accuracy of measurement and calibration.Fig. 6. Illustration diagram showing the probe shadow, where couplings between the probes and neighbouring structures may exist. This figure is reproduced from [4].mFig. 7. Simulated S21 of a microstrip line together with a nearby short microstrip line with three different lengths Lm. The frequency of dip in S21 response changes when Lm varies from 600 µm to 1400 µm. This figure is reproduced from [5].Fig. 8 (a) shows the layout of TRL calibration standards for on-wafer measurements at E-band (60-90 GHz). A line was measured after TRL calibration, and there is a dip (resonance) in the measured S21 response, as shown in Fig. 8 (b). Similarly, the measured S11 of an OPEN exhibits an unwanted resonance, whereas the S22seems normal, as can be observed from Fig. 8 (c). This is due to the calibration standards being too close to each other, resulting in coupling and parasitic from the neighbouring structures underneath the probes. To address this problem, the metal layer was removed from some areas of the calibration standards, as shown in Fig. 8 (d), so that the probe coupling to neighbouring structures was considerably reduced. A TRL calibration based on these modified standards was performed and the same devices measured. The corrected results are given in Fig. 8 (b) and (c). The unwanted resonances have been eliminated. This demonstrates that the calibration standards need to be properly separated on the wafer and no other standards or test structures should be underneath the probes during the calibration and measurement.The impact from neighbouring structures on on-wafer measurements can also be reduced by utilising special probe-to-pad transition, as shown in Fig. 9 (a). The closed and shielded probe-to-pad design has proved to be very effective, in terms of suppressing the influence from crosstalk, higher-order modes and neighbouring structures. This is demonstrated at D-band (110-170 GHz), using a set of calibration standards and DUTs that are placed close to each other on the same wafer, as shown in Fig. 9 (c). Both the closed and shielded probe-to-pad design and the conventional design [see Fig. 9 (b)] have been implemented and measured. The former offered better performance and greater consistency in results from different organisations, as described in detail in [6].(a)(b)(c)(d) Fig. 8. (a) Layout of the TRL calibration standards for on-wafer measurement at E-band (60-90 GHz). (b) Measured S 21 responses of the Line subject to two calibrations, one using the original calibration standards, and the other using the modified standards with metal selectively removed. (c) Measured S 11 and S 22 responses of the OPEN, subject to two different calibrations. (d) Photographs showing the modified calibration standards after selectively removing metal from some areas. Purple rectangles indicate the standards used during the TRL calibration.Metal removed Metal removedMetal removedS 21, d BRed curve : Original standardsBlue curve : Modified standardsRed curve : Original standardsBlue curve : Modified standardsS 11 S 22Fig. 9. A set of CPW calibration standards and DUTs fabricated on a 50 µm thick wafer. Two different types of probe-to-pad transitions are shown. (a) Closed and shielded pad configuration, capable of offering lower crosstalk, less higher-order mode interference, and less neighbouring effects. (b) Direct probing contact configuration without any special probe-to-pad design. (c) Layout of the calibration standards and DUTs only. Both types of probe-to-pad transitions were implemented and characterised. This figure is reproduced from [6].V. Testing Boundary ConditionsAt millimetre-wave frequencies, the testing environments (e.g. boundary conditions) have a significant impact on measurement quality. Fig. 10 shows the experiment setups for the same device that was placed on two different types of sample holders, one is a Cascade absorber holder (PN 116-344) and the other is glass. Their corresponding return loss performance can be found in Fig. 11, in which the response without sample holder under the substrate is also given for comparison. It is evident that the absorber holder has reduced the ripples in the measured responses effectively. These ripples are introduced by unwanted spurious modes usually excited at frequencies higher than 50 GHz [7]. If the device is placed on a metallic chuck, a small fraction of the signal can propagate as microstrip modes in that the chuck acts as the ground plane. The absorber holder is capable of suppressing these modes and ultimately reducing the ripples. Note that the DUT is effectively a different structure (electromagnetically) with and without the absorber. Therefore, boundary conditions need to be specified during measurement comparisons.The absorber effectively acts like a lossy boundary during measurements, which has an impact on the loss and relative phase constants as well as the characteristic impedance of the CPW lines [8]. This may result in an inaccurate definition of the calibration reference impedance at high frequencies. More discussions on this topic can be found from [8], which reports on a detailed investigation into different boundary conditions and their impacts on calibration accuracy. Note that there is still active research in the testing boundary conditions, particularly at millimetre-wave and terahertz frequencies. Fig.10. Photographs of two different experiment setups with different boundary conditions.On glass On absorber Device Under Test(c)Fig. 11. Measured S 11 of the DUT with different experiment setups shown in Fig. 10.VI. Other Considerations for Planar MeasurementsThere exist many other factors that impact the accuracy of on-wafer measurements, these factors include design of CPW, probes with different pitch sizes, contact repeatability [9], cross-talk between probes [10], etc. This section includes a brief discussion on the first two factors. The investigation was carried out by colleagues across Europe and was described in detail in [3] and [4].Design of CPWMeasurement quality also depends upon the design of CPW, particularly the ground width and the ground-to-ground spacing. Dips may occur in the transmission responses (i.e. S 21 and/or S 12), as shown in Fig. 12, and this is attributed to radiation from the CPW and the ground plane. Full-wave simulations indicate that the total CPW width (W tot ) determines the frequency where the dip occurs, and the ground-to-ground spacing influences the significance of the dip behaviour [4], as shown in Fig. 12 (b) and (c). Minimizing ground-to-ground spacing is helpful in terms of eliminating the dips.Fig. 12 (d) exhibits the relationship between the CPW width and the dip frequency. To avoid the appearance of such dips, the recommended total CPW width can be calculated as follows [11].W tot < 2×cf max ×√2×(εr −1)where c is the velocity of light in free-space, εr is the relative permittivity of substrate, and f max is the upper frequency limit. There is excellent agreement between this equation and the full-wave simulation results, as shown in Fig. 12 (d).On metalchuck: ripplesOn glass: no ripplesOn absorber:no ripplesFrequency (GHz) S 11 (d B )(a)(b) (c) (d)Fig. 12. (a) Illustration diagram of the CPW. The total CPW width, W tot, equals to W g+S+W+S+W g.(b) Simulated transmission response as a function of frequency, for different CPW ground width W g. (c) Simulated transmission response as a function of frequency, for different ground-to-ground spacing S, whilst maintaining a characteristic impedance of 50 Ω and a width W tot of 1000 μm. (d) Relationship between W tot and dip frequency. The orange line was extracted from full-wave simulations whereas the blue line was plotted using the equation. These figures are reproduced from [4].Probes with different pitch sizeProbes of different pitch sizes can result in noticeable difference in on-wafer measurement results. Fig. 13 shows the error-corrected measured transmission responses of an attenuator using GGB probes with two different pitch sizes (100 µm versus 150 µm). The experiment was performed at PTB in a closely controlled environment, with the same measurement setup, calibration structures, chuck material (testing boundary), and the same operator. It can be observed from Fig. 13 that, there exists a systematic deviation for frequencies above 50 GHz, this can be attributed to the difference in probe geometries. It is expected that probes from different vendors could lead to even larger deviations in S-parameter results.Fig. 13. Influence of probe pitch width (blue – 100 µm, red – 150 µm) on transmission measurement of an attenuator. This figure is reproduced from [3].VII. ConclusionsThis paper has briefly reviewed conventional calibration techniques for on-wafer measurements. Some recent research activities in on-wafer measurements, at millimetre-wave frequencies, have been reviewed. Other considerations, e.g. repeatability of calibration, definition of reference plane, test environment, parasitic mode effects, etc, have not been covered in this paper. However, these also play an important role in the on-wafer measurement quality and should be taken into account for precise measurement.AcknowledgementsThis work was supported in part by the EMPIR research projects 18SIB09 TEMMT and 14IND02 PlanarCal, and in part by the Innovate UK Project 103438. The EMPIR initiative is co-funded by the European's Horizon 2020 research and innovation programme and the EMPIR Participating States.References[1] E. 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