PROJECT PROFILE – SUMMARY SHEET

常见封装形式简介DIP= Dual Inline Package = 双列直插封装HDIP= Dual Inline Package with Heat Sink= 带散热片的双列直插封装SDIP= Shrink Dual Inline Package = 紧缩型双列直插封装SIP= Single Inline Package= 单列直插封装HSIP= Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP= Small Outline Package = 小外形封装HSOP= Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP= Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装SSOP= Shrink Small Outline Package= 紧缩型小外形封装TSSOP= Thin Shrink Small Outline Package= 薄体紧缩型小外形封装TQPF= Thin Profile Quad Flat Package= 薄型四边引脚扁平封装PQFP= Plastic Quad Flat Package = 方形扁平封装LQPF= Low Profile Quad Package= 薄型方形扁平封装eLQPF= Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT= Small Outline of Transistor= 小外形晶体管BGA = Ball Grid Array= 球栅阵列封装BQFP = Quad Flat Package With Bumper= 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design= 计算机辅助设计CBGA = Ceramic Ball Grid Array= 陶瓷焊球阵列CCGA = Ceramic Column Grid Array= 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装DFP = Dual Flat Package = 双侧引脚扁平封装DSO = Dual Small Outline= 双侧引脚小外形封装3D = Three-Dimensional = 三维2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output= 输入/输出LSI = Large Scale Integrated Circuit= 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module= 多芯片组件MCP = Multichip Package =多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路OLB = Outer Lead Bonding= 外引脚焊接PBGA =Plastic BGA= 塑封BGAPC = Personal Computer = 个人计算机PGA = Pin Grid Array = 针栅阵列SIP = System In a Package= 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package= 小外形封装SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合WLP = Wafer Level Package = 晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请ECR(Engineering Change Request) 持续改善计划CIP(continuous improvement plan)戴尔专案Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表Yearly report年度报表Annual report财务报表Financial report品质报表Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告First article inspection report 初步报告（或预备报告）Preliminary report一份更新报告An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report) 出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明）COC(Certificate of Compliance) 稽核报告Audit report品质稽核报告Quality audit report制程稽核报告Process audit report5S 稽核报告5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告Annual audit report内部稽核报告Internal audit report外部稽核报告External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限Upper limit（规格）下限Lower limit规格上限Upper Specification Limit(USL) 规格下限Lower Specification Limit(LSL)上控制限（或管制上限）Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值Maximum value平均值Average value最小值Minimum value临界值Threshold value / critical value MRB 单(生产异常通知报告) Material Review Board Report 工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表）BOM (Bill of Materials )合格供应商名录AVL (Approved Vendor List)异常报告单CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡）Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer [‘weifə] n .威化饼干、电子晶片（晶圆薄片）Grind [ɡraind ]vt. & vi. 磨碎;嚼碎n .磨,碾Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Ink [iŋk] n. 墨水, 油墨Die [dai] vt. & vi. 死亡（芯片）Dot [dɔt] n . 点, 小圆点Mounting [‘mauntiŋ] n. 装备,衬托纸Tape [teip] n. 带子；录音磁带; 录像带Size [saiz] n. 大小, 尺寸，尺码Thick [θik]adj. 厚的，厚重的Thickness [‘θiknis]n. 厚(度), 深(度)宽(度) Position [pə‘ziʃən]n. 方位，位置Rough [rʌf] adj . 粗糙的; 不平的Fine [fain]adj. 美好的, 优秀的, 优良的, 杰出的Speed [spi:d]n. 速度, 速率Spark[spɑ:k] n. 火花; 火星Out [aut]adv. 离开某地, 不在里面；(火或灯)熄灭Grindstone [‘ɡraindstəun]n. 磨石、砂轮Mount[maunt]vt. & vi. 装上、配有Mounter装配工;安装工;镶嵌工Mounting [‘mauntiŋ]n. 装备,衬托纸Magazine [,mæɡə‘zi:n]n. 杂志, 期刊，弹药库（传递料盒）Cassette [kə‘set]n. 盒式录音带；盒式录像带Inspect [in‘spekt] vt. 检查，检验，视察Inspection [in‘spekʃən]n. 检查，视察Card [kɑ:d] n. 卡, 卡片, 名片划片：Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Sawing ['sɔ:iŋ]n. 锯,锯切,锯开Film [film] n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Clean [kli:n]adj. 清洁的, 干净的；纯净的Cleaner [‘kli:nə]n. 作清洁工作的人或物Oven [‘ʌvən] n . 烤箱, 炉Cassette [kə‘set]n. 盒式录音带；盒式录像带Handler[‘hændlə]n. (物品、商品)的操作者Scribe [skraib] n . 抄写员, 抄书吏Street n. 大街, 街道Blade [bleid] n. 刀口, 刀刃,刀片Cut [kʌt] vt. & vi. 切, 剪, 割, 削Speed[spi:d]n. 速度, 速率Spindle [‘spindl]n. 主轴，(机器的)轴Size [saiz]n. 大小, 尺寸 ,尺码Cooling ['ku:liŋ]adj. 冷却(的)Kerf [kə:f]n. 锯痕,截口,切口Width [widθ] n . 宽度, 阔度, 广度Chip [tʃip] n. 碎片、缺口Chipping[‘tʃipiŋ]n. 碎屑,破片Crack[kræk]vt . (使…)开裂,破裂n . 裂缝, 缝隙Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Die [dai]vt. & vi. 死亡（芯片）Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Street [stri:t]n. 大街, 街道Film [film]n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Tape [teip]n. 带子；录音磁带; 录像带Bubble ['bʌbl] n. 泡, 水泡, 气泡mount---贴wafer---晶圆frame---框架blade---刀片tape---膜cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化open---打开air---空气pressure---压力failure---失败vacuum---真空alignment---校准ink---黑点die---芯片error---错误limit---限制cover---盖子device---产品data---数据saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高rotary---旋转check---检查feed---进给 cutter---切割speed---速度height---高度new---新shift---轮班pause---暂停clean---清洗center---中心chip---崩边 change---变换enter---确认Off center---偏离中心broken---破的alarm---报警上芯：Attach [ə‘tætʃ]vt. & vi. 贴上; 系; 附上Bond [bɔnd]n. 连接, 接合, 结合vt. 使粘结, 使结合Bonder [‘bɔndə]n. 联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy [e‘pɔksi]n. 环氧树脂（导电胶）Material [mə‘tiəriəl]n. 材料, 原料Non-conductive epoxy绝缘胶Conductive [kən‘dʌktiv] adj. 传导的Dispenser [dis‘pensə]n. 配药师, 药剂师Nozzle [‘nɔzl]n. 管嘴, 喷嘴Rubber [‘rʌbə]n. (合成)橡胶，橡皮Tip [tip] n. 尖端, 末端Die pick-up tool 吸嘴Tool [tu:l]n. 工具, 用具Collect [kə‘lekt]vt. 收集, 采集（吸嘴）Ejector [i‘dʒektə]n. 驱逐者,放出器,排出器Pin [pin]n. 针,大头针, 别针Lead Frame引线框架Lead [li:d]vt. & vi. 带路, 领路, 指引Frame [freim]n. 框架，骨架，构架Magazine [,mæɡə‘zi:n] n. 杂志, 期刊（料盒）Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Oven [‘ʌvən]n. 烤箱, 炉Scrap [skræp]n. 小片, 碎片, 碎屑Dent [dent] n. 凹痕, 凹坑Die Lift-off 晶粒脱落（芯片脱落，掉芯）Skew [skju:] adj. 歪, 偏, 斜Misorientation [mis,ɔ:rien‘teiʃən] n. 定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del 写胶后气压延时Squeeze [skwi:z] vt. 榨取, 挤出n. 挤, 榨, 捏Eject [i‘dʒekt]vt. & vi . 弹出, 喷出, 排出Delay [di'lei]n. 延迟Height [hait] n. 高度, 身高Level [‘levl]n. 水平线, 水平面; 水平高度Head [hed]n. 头部，领导, 首脑Eject up delay 顶针延迟Eject up heigh t 顶针高度Bond level粘片高度Pick Level 捡拾芯片高度Head pick delay 粘接头拾取延迟Head bond delay 粘接头粘接延时Pick delay捡拾芯片延时Bond delay 粘接芯片延时Index [‘indeks] n. 索引;标志, 象征; 量度Clamp [klæmp]vt. & vi. 夹紧; 夹住n. 夹具Index clamp delay 步进夹转换延时Index delay 框架步进延时Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Test [test] n. 测验,化验,试验, 检验Die shear test 推晶试验Thickness ['θiknis] n. 厚(度), 粗Coverage [‘kʌvəridʒ] n. 覆盖范围Epoxy thickness & coverage 导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən] n. 方向, 目标Die Orientation 芯片方向Void [vɔid] adj. 空的, 空虚的n. 太空, 宇宙空间;空隙, 空处; 空虚感, 失落感Epoxy void 导电胶空洞Chip [tʃip] n. 碎片Damage[‘dæmidʒ] vt. & vi. 损害, 毁坏, 加害于n. 损失, 损害, 损毁Chip damage芯片损伤Backside [‘bæksaid] n. 臀部, 屁股，背面Chip backside damage 芯片背面损伤Tilt [tilt] vt. & vi. (使)倾斜Tilted die 芯片歪斜Epoxy on die 芯片粘胶Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Crack die 芯片裂缝/芯片裂痕Lift [lift]vt. & vi. 举起, 抬起n. 抬, 举Lifted die翘芯片Misplace [,mis‘pleis] vt. 把…放错位置Misplaced die 设置芯片NO die on L/F 空粘Insufficient [,ɪnsə‘fiʃənt] adj. 不足的, 不够的Insufficient epoxy 导电胶不足Epoxy crack 导电胶多胶Epoxy curing银浆烘烤Edge [edʒ] n. 边, 棱, 边缘Partial [‘pɑ:ʃəl] adj. 部分的, 不完全的Mirror [‘mirə] n. 镜子Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Edge die / partial die边缘片/ 边沿芯片Mirror die光片/ 镜子芯片Missing die 掉芯/ 漏芯/ 掉片Splash [splæʃ]vt. 使(液体)溅起vi.(液体)溅落Splatter [‘splætə] vt. & vi. (使某物)溅泼Diagram [‘daiəɡræm] n. 图解, 简图, 图表Ink splash / ink splatter墨溅Die bonding diagram 上芯图Die shesr test 推片实验/推晶试验Die shear tester 推片试验机Die shesr tool 推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system 芯片分级系统System ['sistəm] n. 系统; 体系wafer---晶圆die---芯片attach---粘贴glue---银胶substrate---基板magazine---盒子inspection---检查parameter---参数manual---操作手册reset---重设enter---确定error---错误input---输入speed---速度stop---停止pressure---压力vacuum---真空sensor---传感器back side---背面pin---针statistics---统计calibration---校正bond---贴片conversion---改机thickness---厚度tilt---倾斜度shape---形状adjust---调整contact---接触cover---覆盖device---产品chip---崩边pause---暂停elevator---升降机initial---初始化alignment---校准cassette---盒子tape---膜frame---框架ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头writer---划胶头压焊：Wire [‘waiə] n. 金属丝, 金属线;电线, 导线Bond [bɔnd] n. 接合, 结合vt. 使粘结, 使结合Wire bond / Wiring bonding 压焊/焊丝/球焊Gold wire金丝Pad [pæd]vt. 给…装衬垫, 加垫子n.垫,护垫Bond pad 焊点、铝垫1st bond第一焊点Pad size焊点尺寸/ 铝垫尺寸Capillary [kə‘piləri] n.毛细管;毛细血管（劈刀）Pitch [pitʃ] 程度; 强度; 高度Pad pitch铝垫间距/ 焊点间距Elongation [i:lɔŋ‘ɡeiʃən] n.延长;延长线;延伸率Breaking [‘breikiŋ] n. 破坏,阻断Load [ləud] n. 负荷; 负担;工作量, 负荷量Breaking Load 破断力Pull [pul]vt. & vi.拉, 扯, 拔Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Wire pull / ball pull（焊丝）拉力Wire shear / ball shear（焊丝）推力Ultrasonic [,ʌltrə‘sɔnik] adj. (声波)超声的Power [‘pauə]n. 功力, 动力, 功率Force [fɔ:s]n. 力; 力量; 力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature [‘tempəritʃə] n. 温度, 气温Bonding temperature 温度Ultrasonic wire bonding 超声波压焊EFO打火烧球loop [lu:p]n. 圈, 环, 环状物Loop height 孤高Wire pull test 拉力试验Ball shear test 金球推力试验PIN 1 第一脚Ball height 球高Ball diameter球径Cratering [‘kreitəriŋ] n. 缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test 压焊腐蚀试验(弹坑试验)Thermal [‘θə:məl] adj. 热的，热量的Compression [kəm‘preʃən] n. 挤压, 压缩TCB（Thermal Compression Bond）热压焊Bonding Diagram 压焊图/ 布线图Wrong Bonding 布线错误Incomplete[,ɪnkəm‘pli:t] adj.不完全的,未完成的Incomplete bond 焊不牢No bonding 无焊N2 BOX 氮气柜RTPC 实时过程监控Tray [trei] n. 盘子, 托盘Handing Tray 产品盘FBI 压焊后目检FBI insp-M/C 压焊检验机Microscope [‘maikrəskəup] n. 显微镜Low Power Microscope 低倍显微镜Flux [flʌks] n. 熔剂、焊剂；助熔剂，助焊剂Hook [huk] vt. & vi. 钩住, 吊住, 挂住Wire pull hook线钩（测拉力）Ball shear tool 推球头（测推力）Metal [‘metl] n. 金属Discolor [dis‘kʌlə]v.使脱色;(使)变色,(使)褪色Oxide [‘ɔksaid]n. 氧化物Metal Discolor铝条变色Bond Pad Discolor 铝垫变色Bond Pad Oxide铝垫氧化Stick [stik] vt. & vi. 粘贴, 张贴Peeling [‘pi:liŋ] n. 剥皮,剥下的皮Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）Nonstick bond on pad 铝垫不粘Bond pad peeling 铝垫脱落Bond pad cratering铝垫弹坑Limit [‘limit] vt. 限制; 限定Scratch [skrætʃ] vt. & vi. 抓, 搔，刮伤Over rework limit超过返工数Bond remove / scratch 剔球划伤Ball bond non-stick金球脱落Ball to large （small）金球过大（小）Ball bond short 金球短路Non-stick on lead 引脚脱落（鱼尾脱落）misplace [,mis‘pleis]vt. 把…放错位置connection [kə‘nekʃən]n. 连接, 联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection 错打defective [di‘fektiv] adj. 有缺陷的，欠缺的Defective looping弧度不良Sagging [‘sæɡiŋ]n. 下垂[沉,陷],松垂,垂度Loop sagging 弧度下陷Low loop 弧度太低High loop弧度太高Loop short 弧度短路Overhang [,əuvə‘hæŋ]vt. 伸出; 悬挂于…之上Residue [‘rezidju:] n. 剩余, 余渣Distortion [dis‘tɔ:ʃən] n. 歪曲,曲解Wire overhang on LD 跨越引线框架Wire residue 残丝LF distortion 引线框架变形Quantity [‘kwɔntiti]n. 数目, 数量Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Scrap [skræp] n. 废料vt. 废弃, 丢弃Scratch [skrætʃ] vt. 刮伤Quantity Mismatch 数量不符Empty M. not scrap空粘未报废Gold Wire Scratch 金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO ---电子打火Linear power ---线性马达Vacuum sensor---真空感应器Step driver—步进驱动Post bond inspection—焊接后检查Wire pull—拉线Ball shape—推球Ball size—焊球大小Ball thickness—焊球高度Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损Fine adjust–精确调整Conversion–换产品1st bond non stick—第一点不粘2nd bond non stick—第二点不粘peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形servo motor—伺服电机weld off---管脚脱焊crater---裂缝gold wire---金线missing ball---球未烧好weak bond---虚焊塑封：Mold [məuld] n. 模子,铸型vt. 浇铸,塑造Molding [‘məuldiŋ] n. 成型（塑封）Compound [‘kɔmpaund] n.复合物, 化合物Moiding M/C；Mold Press塑封机Press [pres] n. 印刷机Heater [‘hi:tə] n. 加热器; 炉子Pre-heater 预热机Chase [tʃeis]n.追捕, 追猎Mold die / Mold chase 塑封模具MGP mold MGP多缸模具Auto mold 自动包封机load [ləud]vt. & vi. 1 把…装上车[船] 2 装…loader ['ləudə] n. 装货的人,装货设备,装弹机Auto L / F loader自动排片机handler [‘hændlə] n. (动物)驯化者（抓手）temperature [‘tempəritʃə]n. 温度, 气温Pre-heat Temperature 料饼预热温度Mold Temperature 模具温度Clamp [klæmp] vt. & vi. 夹紧; 夹住n. 夹具Pressure [‘preʃə] n. 压(力), 压强Clamp Pressure 合模压强Transfer pressure 注塑压强Transfer [træns‘fə:]vt. & vi. 转移; 迁移n. 转移Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Curing time 固化时间Curing temperature 固化温度Pre-heat Time （料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep [swi:p] vt. & vi. 扫, 打扫, 拂去Wire Sweep 冲丝Open 开路Short 短路Fill [fil] vt. & vi. (使)充满, (使)装满, 填满Underfill ['ʌndəfil] n. (孔型)未充满Body underfilled胶体未灌满Incomplete [,ɪnkəm‘pli:t] adj. 不完全的, 未完成的Incomplete mold 未封满Chip [tʃip] n. 碎片，缺口Chip package / body chip-out崩角Porosity [pɔ:‘rɔsiti] n. 多孔性,有孔性Porosity Body 胶体麻点Bubble [‘bʌbl] n.泡, 水泡, 气泡Blister [‘blistə] n. 气泡vt. & vi. (使)起水泡Smear [smiə] vt.弄脏, 弄污n. 污迹, 污斑Surface [‘sə:fis] n. 面, 表面Roough surface 不均匀（表面）Delaminate [di:‘læməneit] v. 将…分层,分成细层Delaminating 分层Void [vɔid]adj. 空的, 空虚的PKG Void 胶体空洞Deep [di:p] adj. 深的Scratch [skrætʃ] vt. 刮伤Body deep scratch胶体刮痕Dimension [di‘menʃən] n.尺寸, 度量Mold PKG dimension 塑封体尺寸BTM width / length 背面宽/ 长Top width / length 正面宽/ 长PKG thick 塑封体厚度Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Mold mismatch / PKG mismatch 包封偏差(胶体错位) Offset [‘ɔfset] vt. 抵消, 补偿Misalignment [‘misəlainmənt] n. 未对准Mold offset / PKG misalignment偏心PMC（post mold cure）后固化Dummy [‘dʌmi] n. 人体模型Strip [strip] vt.剥去, 剥夺, 夺走Dummy molded strip空封Mold flash 废胶Gate [ɡeit]n.门, 栅栏门Mold gate 注浇口、进浇口Remain [ri‘mein] n. 剩余物; 残余Gate remain 小脚Compound [‘kɔmpaund] n.复合物, 化合物Aging [‘eidʒiŋ]n. 老化,成熟的过程Compound Aging 料饼醒料（回温过程）Locator [ləu‘keitə]n. 表示位置之物,土地Block [blɔk] n.大块(木料、石料、金属、冰等) Locator Block 定位块Ejector [i‘dʒektə] n. 驱逐者,放出器Pin [pin]n. 大头针, 别针，针Depth [depθ] n.深, 深度Ejector Pin 顶针E-pin Depth顶针深度Storage [‘stɔ:ridʒ] n.储藏处, 仓库Cold room / compound storage冷藏库/料饼存放库Air [ɛə] n. 空气Gun [ɡʌn] n. 枪, 炮Coating [‘kəutiŋ] n. 涂层, 覆盖层Material [mə‘tiəriəl]n. 材料, 原料,素材, 资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C 芯片涂胶机Die Coating Material覆晶胶Cart [kɑ:t] n. 手推车ASS’YB Cart 后站推车Tablet [‘tæblit]n. 药片、胶囊Loader [‘ləudə] n. 装货的人,装货设备,装弹机Preheater [‘pri:’hi:tə] n. 预热器Fixture [‘fikstʃə] n. (房屋等的)固定装置Auto Tablet Loader 自动排胶粒机Compoud Preheater 高频预热机Load /Unload Fixture 上料/下料架Tablet Magazine 胶粒盒Compoud Tablets 塑封料饼Molding Cleaning Compoud 洗模饼misorientation [mis,ɔ:rien‘teiʃən]n. 定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead 塑封溢胶Mold crack 胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable –预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达Station–模腔Cleaning brush—清洁刷Cylinder---气缸Sensor---传感器Solenoid---电磁阀Turn over –翻转器Degate–切料口Bearing---轴承Picker---爪子Pusher–推动器Cull bin –垃圾箱Pin---针Vacuum pump—真空泵Mornitor–显示器Cable–导线Profile---温度曲线Alarm---报警Error---错误Driver---驱动Sensor–感应器Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Guide–导轨Substrate---基板Device---产品种类Lot Traveller---随工单Magazine---盒子Cylinder –汽缸Bearing–轴承Stop---停止Emergency Stop---紧急停止Gripper --夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体Molding –模封Operation–操作Flange–法兰盘Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching---扭曲Overflow---漏胶Misalignment---模封错位Package mismatch---模封错位Resin Hole / Void ---气孔Foreign materials ---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng. Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME--- 损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂SPC sample ---SPC样品切筋Trim-Form1 切筋Trimming Dambar cut2 切筋模Trim die3 成形模Form die4 分离模singulate5 冲废De-junk6 检测Inspection 外观检测7 再成型机模具Reform Die8 再成型机Reform system9 料盘Plastic tray10 连筋Uncut dambar11 毛刺burr14 溢料Junk15 裂纹Crack16 离层（分层）Delaminating17 管脚反翘Lead tip bend18 筋未切Dam-bar uncut19 筋凸出Dam-bar protrusion20 筋切入Dam-bar cut in打印Marking1 打印Marking2 印章Marking layout3 激光打印Laser marking4 油墨打印Ink (UV) marking5 正印Top side mark6 背印Back side mark7 镜头Lens8 打印不良\模糊Illegible marking9 漏打No marking10 断字Broken character11 缺字Missing character12 印字倾斜Slant marking13 印记错误Wrong marking14 重印Remark15 印字模糊（褪色）Fade mark16 印字粘污Smear19 电流current21 字体（字形）Font22 定位针Location pin23 胶皮打印机Pad printer24 激光打印机Laser Marking M/C25 后固化PMC(Post Mold Cure)26 后固化烤箱PMC Oven27 打印污斑Marking stain28 印记移位Marking shift电镀Plating1 电镀Plating2 来料Incoming3 冲废Dejunk4 热煮软化槽Socking Tank7 检验Inspection 外观检测8 烘烤Curing / Baking 150℃; 60-90ms9 出料Unload10 高速线电镀High-speed Plating Line11 统计过程控制SPC12 搭锡Solder bridge13 锡丝、锡须Solder flick / Whisker14 镀层不良Plating defects15 发黄Yellowish16 发黑Blacken17 变色Discolor18 露底材（露铜）Expose copper19 粘污Smear20 镀层厚度Plating thickness 7-20um21 镀层成分Plating composition 电镀成分, Sn22 外观Outgoing23 易焊性Solder ability24 无铅化Pb-free / lead free25 结合力Adhesive force26 可靠性Reliability27 电解Electrolytic deflash28 清洗（自来水）City water29 高压清洗High pressure rinse30 脱脂Descale31 清洗（纯水）DI water32 活化（合金）Activation33 预镀、预浸Pre-dip34 电镀Plating35 吹风Air blow36 中和Neutralization37 褪镀Stripper38 拖出Drag out39 上料机Loader40 下料机Unloader41 纯锡Tin42 纯水(去离子水) DI water43 水压Water pressure44 理化分析Physical and chemical analysis45 测厚仪Plating Thickness Meter / Electroplated CoatingThickness Test46 离子污染度测试仪Ion Contamination Tester Contamino CT10047 C含量测试仪Carbon Tester51 去氧化HSCU Descale52 预浸Pre-dip53 电镀电流Current54 镀液温度Temperature电镀液plating solution55 电镀槽plating tank56 中和Neutralization59 烘干Curing60 锡球Solder ball61 锡厚度和成分Sn thickness & composition62 冲废De-junk去胶渣63 去溢料Degate 冲塑，冲胶64 去飞边Deflash 去胶(塑封工序)65 锡铅电镀Tin lead plating66 无铅电镀Lead free plating; Pure tin plating67 镀层起泡Solder bump68 镀层剥落Solder peel off69 镀层偏厚或偏薄Thick or Thin Plating70 退锡Solder remove71 电镀报废Plating scrap72 锡渣Solder peeling73 电镀锡块Solder bump74 电镀桥接Plating bridge75 电镀变色SP Discoloration76 电镀污染SP Contamination77 电镀锡攀爬SP adhere 78 电解除油Electro-degreasing测试Testing1 测试Testing2 打印Laser mark3 编带机Tape & Reel Machine4 编带Reel5 测试机Tester6 分选机Tray Test Handler7 Vision检测Direction vision8 划伤Scratch9 打错Wrong mark10 断字Broken character11 漏字No marking12 模糊Fade mark13 脚长Lead length14 脚宽Lead width15 站立度Stand up16 脚间距Lead pitch17 共面性Coplanarity18 跨度Row space19 电性能测试Electrical test20 塑料管Plastic tube21 编带Reel / Tape22 托盘，盘装Tray23 扫描测脚Leads Scan/Inspection24 扫描测脚机Leads scanner25 投影仪Profile Projector测试TestingLaser 激光Lamp 灯管Lamp current 灯管电流Marking layout打印内容Power supply 电源Frequency 频率On-loader 上料部分Off-loader 下料部分Marking box 打印区域Track 轨道Location pin 定位针Scanner 扫描器Beam 光束Beam path 光路Bar code 条形码Sensor 传感器Motor 马达Driver 驱动器Index 步进Tool 模具Press 模具Punch 刀具Jam 卡料Forming 成型Cylinder气缸Laser head 光头Magazine 盒子Tube 管子Tray 板子Arm 机械臂Safety door 安全门Reset 复位Lamp 灯管Keyboard 键盘Alarm 报警Error 错误Open/Short(O/S) 开路／短路Function Reject 功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject 电流失效Test Program 测试程序Cold test冷测Retest 重新测试Rework 返工Sample 抽样Resample 重新抽样Black box盛放未测试产品的黑盒子Testing area 测试区域Test chuck 测试平台Device Interface Board(DIB) 芯片测试接口板DUT 正在测试芯片A/D (analog-to-digital) converter 模/数转换模块EOT 测试结束信号SOT测试开始信号BIN signal 分BIN 信号Socket 测试座JIG/Test Head 测试盒/测试头Interface Card 接口通讯卡Interface Cable 接口通讯线Coaxial Cable 同轴线Test parameter 测试参数Tester Computer 测试机主机Test limit 测试结果的上下限AC Multiplexer 多路交流信号板Digital Driver and Detector 数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker 检测程序High-Speed Digital (HSD) Instrument 高速数字测试设备High-Current-Voltage-Source 高电流电压源Finger 金手指Contactor 金手指动作模块Convey motor 变送马达Contact side 测试位置General Control Panel 总控制面板Ionizer 离子风扇Capacitor box 电容盒。

Project Manager 项目管理窗口Drawing Board 绘图板FLOMOTION 后处理Profiles 收敛曲线Tables 表FLO/MCAD CAD 接口Command Center 优化设计 V olume Flow Resistance 体积流场阻尼 Project Name 项目 Notes 备注 Option/Units 选择/单位LENGTH 长度 Use 使用 Dismiss 离开 Modeling 建模 Turbulence 干扰 Gravity 重力3-dimensional 三维空间 Radiation off 辐射关闭 Steady state 稳态状态Solar off 太阳辐射关闭 System 系统 Location 位置Alloys 合金 Attach 贴上 Cuboid 立方体Prism 棱柱 Component 元件 Sloping block 斜体Enclosure 箱体 Cylinder 圆柱体 Hole 孔Fan 风扇 Thin 薄 Thick 厚Radiation 辐射 impedance 电阻 ToolTip 冒泡提示Overall Solution Domain 所有求解域 Ambient Attribute Name 名称Heat Transfer Coefficient 换热系数 Material 材料属性Ambient Attribute 环境属性 Mild Steel 低碳钢Resisstance 阻尼 Resistance Type 阻尼类型V olume Flow Resistance 体积流动阻尼 Loss Coefficient Based On 损失系数基于Device V elocity 设备速度 Free Area RatioLoss Coefficient 损失系数 Assembly 组件Source 热源 Heat sink 散热器Recirculation 回流器 Fixed flow 特定流体Compact component 简化元件 Porforated plate 孔板integration 数值积分 discretization 离散化outer iteration 外迭代 Interpolated 内插depend variable 应变量 cost function 目标函数Heat flow 通过风机等的空气的焓值。

Microsoft Office Project 2007教程1.1 使用Project管理项目世界上最好的管理工具也不能替代您自己的准确判断。

但是，工具可以也应该有助于您完成下列工作。

, 跟踪您收集的与工作有关的所有信息:项目的工期、成本和资源需求。

, 以标准、美观的格式形象具体地呈现项目计划。

, 一致而高效地安排任务和资源。

, 与其他Microsoft Office 系统应用程序交换项目信息;, 作为项目经理的您在保持对项目的最终控制权的同时，又能与资源和其他项目干系人交流。

, 使用外观和操作类似桌面程序的应用来管理项目。

Microsoft Office Project 2007系列包括的产品众多，具体有以下几种。

, Microsoft Office Project Standard 2007 用于项目管理的基于 Windows 的桌面应用程序。

此版本为单一项目管理人员设计，并且不能与Project Server交互。

, Microsoft Office Project Professional 2007 基于 Windows的桌面应用程序，包括Standard版的完整特性集，还有使用Project Server时需要的项目团队计划和通信功能。

Project Professional加上Project Server是Microsoft的企业项目管理( EnterpriseProject Management，EPM)产品的代表。

, Microsoft Office Project Server 2007 基于内联网的解决方案。

结合ProjectProfessional使用时支持企业级的项目合作、时间表报表和状态报表。

, Microsoft Office Project Web Access 2007 使用Project Server时所用的基于Internet Explorer的界面。

, Microsoft Office Project Portfolio Server 2007 组合(Portfolio)管理解决方案。

英文求职信的格式规范而能否在芸芸求职者中脱颖而出，求职信和简历在公平的竞争中就成了一个非常重要的因素。

无可置疑，完全英文书写的求职者获得面试的机会比其他竞争者往往高出许多。

下面，结合我的经验和其他人以及雇主们的经验和推荐，介绍一些常用而标准的英式写法。

第一部分求职信（Cover letter）在今天，绝大部分雇主指出，他们是从来不会看没有求职信（Cover letter）的个人简历的。

因此，求职信是必要的。

但求职信不是对个人简历的简单复述，而是礼貌而鲜明的突出自己的目标和要求，促使阅读者有兴趣阅读你的个人简历和推荐信。

求职信的目的和好处在于：1，可保证个人简历到达正确的阅读人的桌面。

如果招聘广告上没有收信人的姓名，我推荐打电话询问将会处理求职申请的人的姓名（这显示你的诚意以及专业精神，给雇主深刻印象）。

假如不能的话按照以下原则：小型企业—经理（Managing director），中型企业—部门负责人（Head of section/department），大型企业—全体职员或者人事部（Personnel or Human Resource Department）。

2，说服收信者阅读你的个人简历3，清楚地表明你对具体哪一个职位感兴趣4，表明为什么对该职位有兴趣，为什么你认为自己胜任该职位5，提及一到两点在个人简历里面的内容，以及回应广告的要求所以，求职信并不能保证你找到工作，但，做好这一点，它能给你带来面试的机会，或者至少令雇主打开你的个人简历。

那么，Cover letter要包括那些内容呢，至少有以下几点。

1，招聘广告中给出的收信人姓名，头衔和地址2，你所感兴趣的职位以及你从何处得知招聘消息（或许朋友推荐）3，用三到四个―项目符号‖（如Word工具栏）列举出你为什么能胜任该职位的背景和特长，回应招聘广告的要求。

4，表明有兴趣获得一个面试的机会，讨论申请问题。

5，检查拼写和语法错误6，千万不要提及薪酬问题，也不要提及雇主想要或者可能想要的但你又不能达到的技能或要求7，除非注明要求手写，否则应用打字机或者文字处理软件打印。

Project Report Template 项目报告模板英文版Project Title: XXXXXX。

this report XXX。

We extend our XXX。

our supervisor。

for his guidance。

n。

encouragement。

support。

and knowledge XXX project。

We would also like to express our deep gratitude to our financial supporters。

XXX made this project possible。

XXX。

we would like to thank the XXX project.To our families。

we want to express our XXX nal love。

patience。

support。

encouragement。

XXX.Table of ContentsAbstractTable of ContentsAcronymsList of Figures and TablesChapter 1: n1.1 Problem StatementOur families have been a constant source of support and XXX。

They have always been there for us。

no XXX and sacrifices。

which have helped us e the people we are today.In this report。

we will discuss XXX it。

We will also provide an overview of XXX that we have identified to address this problem.AcronymsList of Figures and TablesChapter 1: n1.1 Problem StatementThe problem we are addressing in this report is the lack of access to quality XXX lives of individuals and communities。

目录1．安装软件________________________________________________________ 3 1.1．环境要求 ___________________________________________________________ 31.2．程序安装 ___________________________________________________________ 31.3．设置 _______________________________________________________________ 71.3.1．添加本地地址解析________________________________________________________ 71.3.2．PWA设为可信站点并自定义级别 ___________________________________________ 91.3.3．Project professional 2003添加服务器账号___________________________________ 15 2．联机模式制订计划_______________________________________________ 192.1．如何建立项目？ ____________________________________________________ 192.1.1．运行Project2003，创建新项目 ___________________________________________ 192.1.2．设置project2003软件参数_______________________________________________ 212.1.3．设置项目日历__________________________________________________________ 232.2．如何输入和组织任务列表？ __________________________________________ 242.2.1．输入任务及其工期 ______________________________________________________ 242.2.2．创建里程碑____________________________________________________________ 262.2.3．创建周期性任务________________________________________________________ 282.2.4．将任务按结构组织到逻辑大纲中 __________________________________________ 292.2.5．编辑任务列表__________________________________________________________ 312.3．任务何时开始、何时完成？ __________________________________________ 332.3.1．建立任务间的关系 ______________________________________________________ 332.3.2．重叠任务或在其间加入延隔时间 __________________________________________ 362.3.3．设定任务的开始或完成日期 ______________________________________________ 372.3.4．设定任务期限__________________________________________________________ 382.3.5．拆分任务______________________________________________________________ 392.4．如何分配资源？ ____________________________________________________ 392.4.1．创建资源列表__________________________________________________________ 402.4.2．更改资源的工作日程 ____________________________________________________ 422.4.3．为任务分配资源________________________________________________________ 432.4.4．检查和编辑资源分配 ____________________________________________________ 442.5．如何输入成本？（可选部分） ________________________________________ 452.5.1．为资源分配成本________________________________________________________ 452.5.2．设置固定任务成本 ______________________________________________________ 462.5.3．定义成本累算的时间 ____________________________________________________ 462.5.4．查看任务或资源成本 ____________________________________________________ 472.5.5．查看整个项目的成本 ____________________________________________________ 472.6．如何查看日程及其详细信息？（可选部分） ____________________________ 482.6.1．在屏幕上查看整个项目 __________________________________________________ 482.6.2．检查项目的完成日期或开始日期 __________________________________________ 482.6.3．确定关键路径__________________________________________________________ 482.6.4．切换到不同的视图 ______________________________________________________ 492.6.5．查看视图中不同的域 ____________________________________________________ 492.6.6．通过使用筛选器显示指定的信息 __________________________________________ 502.6.7．将视图中的信息进行排序 ________________________________________________ 502.6.8．将视图中的信息进行分组 ________________________________________________ 512.7．如何调整日程？（可选部分） ________________________________________ 512.7.1．检查和调整任务相关性 __________________________________________________ 512.7.2．重叠任务______________________________________________________________ 522.7.3．检查和调整对任务的限制 ________________________________________________ 532.7.4．修改缩短关键任务的工期 ________________________________________________ 542.7.5．通过拆分任务可能有助于调整日程 ________________________________________ 542.8．如何逐步保存计划（可选部分） ______________________________________ 542.8.1．保存比较基准计划 ______________________________________________________ 542.8.2．保存中期计划__________________________________________________________ 54 2.9．发布 ______________________________________________________________ 55 3．联机模式跟踪和管理项目 _________________________________________ 553.1．向工作组成员请求进度信息 __________________________________________ 553.2．项目成员如何更新自己的任务进度 ____________________________________ 583.2.1．Project实现和office outlook2003的集成____________________________ 583.2.2．通过office out2003更新任务进度 ____________________________________ 593.2.3．通过project web access更新任务进度 _______________________________ 623.2.4．项目经理通过project pro2003更新进度 ______________________________ 63 3.3．项目经理发布请求提交状态报告__________________________________ 66 3.4．项目成员向项目经理提交状态报告 ________________________________ 693.5．文档库___________________________________________________________ 703.5.1．项目经理建立文档库分类_____________________________________________ 713.5.2．项目经理上传文档___________________________________________________ 72 4．脱机模式使用补充说明 ___________________________________________ 754.1．脱机模式制订计划 __________________________________________________ 75 4.2．项目文件发布到服务器实现联机协同 __________________________________ 761．安装软件1.1．环境要求◆Windows XP professional 或者更高版本◆Internet Explorer 6或者更高版本◆Microsoft Office Outlook 2003 对于将任务导入到Outlook 日历中来说是必需的1.2．程序安装◆打开网络位置：\\192.168.0.5\应用软件\office\PROJECT2003◆运行SETUP.EXE◆默认下一步安装◆接收软件“许可协议”下一步安装◆建议选择“完全安装”◆安装位置可根据自己硬盘空间调整◆下一步安装完成。

1/2 提出日 年 月 日 Date ／ ／1.一般事項(General)(1) 会 社 名(Company Name)(2) 住 所(Address)(3) 電 話(Phone Number) (4) F A X(5) 会社設立(Established)(6) 代表者名(Representative Name)(7) 筆頭株主(Leading Stockholder)(8) 出資比率(controlling share)(9) 技術提携先(Technical Agreement)(10) 従業員数(Number of employees) （全従業員数TTL ） ／（生産Production ）（品質 Quality ） ／（その他Others ） (11) 平均年齢・平均勤続年数 （平均年齢Avg.age ） ／（勤続年数Avg.serviceYrs ） (Avg. age/Avg.Service years)2.会社経営概況(General)(12) 資 本 金(Capital)(13) 自己資本比率(equity ratio)(14) 一人当り経営利益(working profit/p) (15) 売上高増加率／前年比(sales growth rate) (16) 総資本経常利益率(curr.profit/gross capital )3.品質･環境ｼｽﾃﾑ及び･安全規格(General)(17) 取得品質ｼｽﾃﾑ認証(Acquisition of Certificates for Quality System)ISO- [認証機関(Certification Body) ] QS- [認証機関(Certification Body) ] (18) 環境ﾏﾈｰｼﾞﾒﾝﾄｼｽﾃﾑ認証(Acquisition of Certificates for Environment Management System) ISO- [認証機関(Certification Body) ] (19) 安全規格(Safety Standards)BSI,BEAB,UL,CSA,VDE,SEMCO,その他(Other)( )会社概要調査表C o m p a n y P r o f i l e S u r v e y S h e e t4.主要生産品目(Primary Product)2/2 5.主要取引先(Main Clients)6.原材料/構成部品の購入先名(Companies for Purchasing Raw Materials and Components.)7.下記資料添付下さい｡(Please attach the following documents.)(1) 会社案内(含経歴書)/製品カタログCompany Guide (Including Company History) / Product Catalogue(2) 品質保証体系,クレーム処理体系Quality Assurance System / Claim Handling System(3) 組織図(含主要人物名) Organization Chart (Including Names of Key Persons)。

GeneralThe following questionnaires are used to select sensors according to the client's requirements.The characteristics shown in the catalogue are given with respect to a defined environment (worst case conditions).The technical requirements will not always reach these extreme limits, and it is possible, following confirmation by us, to propose higher maximum electrical or thermal values to those published, thanks to a knowledge and detailed analysis of the sensor operating environment.A technical relationship between the client and ABB will allow the proposal of the best selection of sensors, equally from the viewpoint of performance and economy.Two principal areas are considered in the selection of a sensor:–the electrical aspect–the thermal aspectThe sensor performance is based on a combination of electrical and thermal conditions; any values other than those indicated in this catalogue cannot be guaranteed unless validated by us. The information below is only valid for sensors using closed loop Hall effect technology.Contact your local supplier for other technologies.Profile missionDue to the design of converters with integrate more power with less volume, sensors are very constraint; leading to reduce their life time. As a matter of fact, even though the application main conditions are well within the sensors characteristics, these conditions have an impact on the sensor life time.The main general characteristics that involves the sensors life time are the following:–the ambient temperature above 40 °C. It is usually said that every additional 10 °C, the life time is reduced by a factor of 2. Of course, this value is a theoretical value and has to be defined in line with the concerned project.–the ambient temperature variations also impact the sensor life time. Even small variations (like 10 °C) can change the life time of the sensor especially on the electronic part.–the way the sensors are used also impact its duration (numbers of ON/OFF per day, average current or voltage value, powersupply value, load resistor value, vibrations levels…)The above general impacting conditions are well defined in standards like IEC 62380, UTE C 80-810 and must be consider during any new converter design.ABB can provide theoretical reliability calculation based on specific profile mission of your projects.Electrical characteristicsThe electrical characteristics values mentioned in this catalogue are given for a particular sensor operating point. These values may vary, according to the specific technical requirement, in the following way:–The primary thermal current (voltage) (I PN or U PN) may be increased if:-t he maximum operating temperature is lower than thevalue shown in the technical data sheet-the sensor supply voltage (V A) is reduced-the load resistance value (R M) is increased–The maximum current (voltage) measurable by the sensor may be increased if:-the maximum operating temperature is lower than thevalue shown in the technical data sheet-the sensor supply voltage (V A) is increased-the secondary winding resistance value (R S) is reduced(e.g. by using a lower transformation ratio)-the load resistance value (R M) is reducedThermal characteristicsThe operating temperature values mentioned in this catalogue are given for a particular sensor operating point. These values may vary, according to the specific technical requirement, in the following way:–The maximum operating temperature may be increased if: -the primary thermal current (voltage) (I PN or U PN) is reduced -the sensor supply voltage (V A) is reduced-the load resistance value (R M) is increasedPS: The minimum operating temperature cannot be lower than that shown in the technical data sheet as this is fixed by the lower temperature limit of the components used in the sensor.74S21Application1. Application :–Variable speed drive ................................................................ –UPS ....................................................................................... –Wind generator ....................................................................... –Active harmonic filter ............................................................... –Welding machines ................................................................... –Solar ...................................................................................... –Other (description) ......................................................................2. Quantity per year: ...........................................................................Mechanical characteristics1. Sensor fixing:–By soldering to the PCB .......................................................... –By the enclosure ..................................................................... –By the primary conductor ........................................................ 2. Primary conductor:–Cable diameter ................................................................... (mm) –Cable connection size ......................................................... (mm) –Bar size .............................................................................. (mm)3. Secondary connection:–By connector .......................................................................... –By cable without connector ..................................................... –Other ......................................................................................Sensor environmental conditions1. Minimum operating temperature ................................................ (°C)2. Maximum operating temperature ............................................... (°C)3. Presence of strong electromagnetic fields ....................................4. Max. continuous primary conductor voltage ................................ (V)5. Main reference standards ................................................................Electrical characteristics1. Nominal current (I PN ) ......................................................... (A r.m.s.)2. Current type (if possible, show current profile on graph):–Direct ..................................................................................... –Alternating .............................................................................. 3. Bandwidth to be measured ...................................................... (Hz)4. Current measuring range:–Minimum current .................................................................... (A) –Maximum current ................................................................... (A) –Duration (of max. current) .................................................... (sec) –Repetition (of max. current) ......................................................... –Measuring voltage (on R M ) at max current .............................. (V)5. Overload current (not measurable):–Not measurable overload current ........................................... (A) –Duration.............................................................................. (sec) –Repetition ...................................................................................6. Sensor supply voltage:–Bipolar supply voltage .......................................................... (±V) –Unipolar supply voltage .......................................... (0 +V or 0 -V)7. Output current–Secondary current at nominal current I PN ............................. (mA) 8. Current output (NCS range only)–Secondary current at maximum current I PMAX ....................... (mA)9. Voltage output–Secondary voltage at nominal current I PN ............................... (V)10. Voltage output (NCS range only)–Secondary voltage at maximum current I PMAX (V)Company:Address:Tel:Name:Fax:Email:Other requirements (description)74S 0201Company:Address:Tel:Name:Fax:Email:Other requirements (description)Application1. Project name ...................................................................................2. Application:Rolling stock:–Power converter ..................................................................... –Auxiliary converter ................................................................... –Other ......................................................................................Short or long distance train:–Power converter ..................................................................... –Auxiliary converter ...................................................................Metro or tramway:–Power converter ..................................................................... –Auxiliary converter ................................................................... Fixed installation (e.g. substation)..................................................... 3. Quantity per year: ............................................................................4. Total quantity for the project.............................................................Mechanical characteristics1. Sensor fixing:–By the enclosure ..................................................................... –By the primary conductor ........................................................ 2. Primary conductor:–Cable diameter ................................................................... (mm) –Bar size .............................................................................. (mm) 3. Secondary connection:–Screw or Faston...................................................................... –By connector .......................................................................... –By shielded cable .................................................................... –Other ...................................................................................... Electrical characteristics1. Nominal current (I PN ) .......................................................... (A r.m.s.)2. C urrent type (if possible, show current profile on graph):–Direct ..................................................................................... –Alternating .............................................................................. 3. Bandwidth to be measured ....................................................... (Hz)4. Current measuring range:–Minimum current .................................................................... (A) –Maximum current ................................................................... (A) –Duration (of max. current) .................................................... (sec) –Repetition (of max. current) ......................................................... –Measuring voltage (on R M ) at max current .............................. (V)5. Overload current (not measurable):–Not measurable overload current ............................................(A) –Duration.............................................................................. (sec) –Repetition ...................................................................................6. Sensor supply voltage:–Bipolar supply voltage .......................................................... (±V) –Unipolar supply voltage .......................................... (0 +V or 0 -V)7. Output current–Secondary current at nominal current I PN ............................. (mA) 8. Current output (NCS125 & NCS165 only for fixed installations)–Secondary current at maximum current I PMAX ....................... (mA)9. Voltage output (NCS125 & NCS165 only for fixed installations)–Secondary voltage at nominal current I PN ............................... (V)10. Voltage output (NCS125 & NCS165 only for fixed installations)–Secondary voltage at maximum current I PMAX (V)Sensor environmental conditions1. Minimum operating temperature ................................................ (°C)2. Maximum operating temperature ............................................... (°C)3. Average nominal operating temperature ......................................(°C)4. Maximum continuous primary conductor voltage ..........................(V)5. Main reference standards ................................................................74S 0201Company:Address:Tel:Name:Fax:Email:Other requirements (description)Application1. Project name ...................................................................................2. Application:Short or long distance train:–Power converter ..................................................................... –Auxiliary converter ...................................................................Metro or tramway:–Power converter ..................................................................... –Auxiliary converter ...................................................................Fixed installation (e.g. substation) ................................................ 3. Quantity per year: ............................................................................4. Total quantity for the project.............................................................Mechanical characteristics1. Primary connection:–By screw ................................................................................ –Other ...................................................................................... 2. Secondary connection:–Screw or Faston...................................................................... –By connector .......................................................................... –Other ...................................................................................... Electrical characteristics1. Nominal voltage (U PN ) ........................................................ (V r.m.s.)2. Voltage type (if possible, show voltage profile on graph):–Direct ..................................................................................... –Alternating .............................................................................. 3. Bandwidth to be measured ...................................................... (Hz)4. Voltage measuring range:–Minimum voltage .................................................................... (V) –Maximum voltage ................................................................... (V) –Duration (at max. voltage) .................................................... (sec) –Repetition (at max. voltage) ......................................................... –Measuring voltage (on R M ) at max voltage ............................... (V)5. Overload voltage (not measurable):–Not measurable overload voltage ............................................ (V) –Duration.............................................................................. (sec) –Repetition ................................................................................... –Category (from OV1 to OV3) ........................................................6. Sensor supply voltage:–Bipolar supply voltage .......................................................... (±V) –Unipolar supply voltage .......................................... (0 +V or 0 -V)7. Output current–Secondary current at nominal voltage U PN ............................ (mA)Sensor environmental conditions1. Minimum operating temperature ................................................ (°C)2. Maximum operating temperature ............................................... (°C)3. Average nominal operating temperature .....................................(°C)4. Main reference standards ................................................................74S 0201Company:Address:Tel:Name:Fax:Email:Other requirements (description)Application1. Project name ...................................................................................2. Application:Short or long distance train:–Power converter ..................................................................... –Auxiliary converter ...................................................................Metro or tramway:–Power converter ..................................................................... –Auxiliary converter ...................................................................Fixed equipment (e.g. substation) ................................................ 3. Quantity per year: ...........................................................................4. Total quantity for the project.............................................................Electrical characteristics1. Nominal voltage (U PN ) ............................................................ (V DC)2. Maximum voltage long duration: 5 min (U MAX2) ........................ (V DC)3. Maximum voltage overload: 20 ms (U MAX3) .............................. (V DC)4. Minimum voltage to be detected . (V)Sensor environmental conditions1. Minimum operating temperature ................................................ (°C)2. Maximum operating temperature ............................................... (°C)3. Average nominal operating temperature ..................................... (°C)4. Pollution degree ..............................................................................5. Over voltage category (from OV1 to OV3) .........................................6. Maximum ambient light level ......................................................(lux)7. Main reference standards ................................................................74S 0201。

Points of Contact (3)Prime Contractor Information Company (3)Project Executive Summary (4)Business Need/Problem (4)Statement of Work (4)Project Objectives (4)Project Approach (4)Technical Project Components (4)Scope Statement Template (5)Project Description (5)Project Justification (5)Project’s Product (5)Phase Description (5)Major Deliverables for this(these) phase(s) (5)Functional Scope (5)Organization/Stakeholder Scope (5)Technical Scope (5)Geographical Scope (6)Costs/Benefits Summary (6)Assumptions and Constraints (6)Risk Factors (6)Critical Success Factors (6)Scope Management Plan (6)Commitment and Approval (6)Cost Analysis Template (7)Project Overview and Background (7)Discussion of Alternatives (7)Lifecycle Costs and Benefits (7)Project Resource Plan Template (8)Project Resource Information (8)Assumptions (8)Risks (8)Resource Staffing Plan (9)Risk Plan Template (10)Procurement Plan Template (11)Description of the Items and Services to be Purchased (11)Market Analysis (11)Requirements Analysis (11)Contracts (12)Deliverables and the Procuremen t Schedule (12)Communications Planning Template (13)Distribution (13)Updating the Communication Plan (13)Communication Plan Storage (13)Project Budget Estimate Template (14)Cost Management Plan Template (16)Project Variance Levels (16)Budget Updates (16)Project Plan FormatProject Name: Date:Project Number: Agency:Modification Dates: Prepared by:Please answer the following questions by providing a response as appropriate.Budget for project by fiscal year andBudget Amount:Fiscal Year: Funded:Budget Amount:Fiscal Year:Funded:Budget Amount:Fiscal Year:Funded:Total Budget:Points of Contact:This should be the list of individuals that will be involved with the project during the Execution Phase.Position Name/Agency Phone E-mailProject ManagerSenior ManagementSponsorSenior TechnicalSponsorProcurement ContactProject Team MemberProject Team MemberCustomers:Other Stakeholders:Other Stakeholders:Prime Contractor Information Company:Position Name Phone E-MailProject ManagerSenior TechnicalSponsorContracts ContactOtherPROJECT EXECUTIVE SUMMARYProvides an executive level overview of the Project Plan: Identify the business need or problem, identify the project goals and objectives, and define the management strategy used to implement the project.Business Need/Problem:All projects start with a business problem/issue to solve.Statement of Work:This statement should be short and to the point. It should not contain language or terminologyProject Objectives:Provide a brief, concise list of what the project is to accomplish.Project Approach:Describe the strategy to deliver the project. For example, it may describe a phased strategy, contracting approach, reference to implementation, etc. Subsections may be created to presentTECHNICAL PROJECT COMPONENTSProvides a detailed listing of the Requirements Definition, Specification, Design, and Implementation and Training Plans for inclusion into the project activities.Scope Statement TemplateProject DescriptionGeneral description of the projectProject JustificationWhat is the business need that the project will address?Project’s ProductBrief summary of the product descriptionPhase DescriptionSummary of phase or multiple phases that are the subject of this planning activity Major Deliverables for this(these) phase(s)High level description of the deliverable, approach to be used, and completion criteria Deliverable Approach Completion CriteriaFunctional ScopeHigh level business process flow charts, process descriptions, boundaries, etc. Organization/Stakeholder ScopeOrganizations/Stakeholders that will be involved/impacted and howTechnical ScopeTechnologies that will be used or excluded, and whyGeographical ScopeSites that will be or will not be impactedCosts/Benefits SummarySummary of cost/benefits expected or not expected from this(these) phase(s)Assumptions and ConstraintsKey project assumptions and constraints for this(these) phase(s)Risk FactorsDescription of potential risks that could impact on project successCritical Success FactorsDescription of what will be the determining factors that are needed to ensure project success Scope Management PlanDescription of how project scope will be managed and how scope changes will be integrated into the projectCommitment and ApprovalPosition Name Date Project ManagerSenior ManagementSponsorResource ManagerCustomerCost Analysis TemplateProject Overview and BackgroundBrief overview, background and definition of the project. Discussion of AlternativesDiscuss the project ground rules and assumptions.Status Quo – Current Process (As-Is-Model)Discussion of Alternative concepts and GoalsProgram ConceptFunctional ConceptTechnical ConceptProject Alternatives (To-Be-Model)Acquisition StrategyDiscussion of AlternativesScheduleLifecycle Costs and BenefitsDiscuss the costs and benefits of the product according to its lifecycle. Lifecycle Cost and Benefit SummaryRisk and Sensitivity AnalysisLifecycle Cost-Benefit ComparisonProject Resource Plan TemplateProject Resource InformationDetermine the major resources that will be needed in the execution of the project. For each resource determine the cost, availability, and skill level or specification required. These resources may include the following: people, money, equipment, facilities, materials and supplies, and information technology.Resource Cost Estimate Availability Skill/Specification AssumptionsDocument any assumptions made in resource allocation.RisksDocument any particular risks involved in resource allocation.Resource Staffing PlanAfter establishing the human resources required for the project, develop a staffing plan that shows the number of personnel, by type, that will be required on the project on a monthly basis.Example:MonthPersonnelCategory January February March April MayX X X X XProjectManagerX X X X XQualityEngineerCA X X X X XProgrammer X X X XTech Writer X XPersonnelMonthCategoryRisk Plan TemplateRisk DescriptionProbability Impact ExposureCurrent Status AffectedPhaseImpact TimeFrameRisk Area Critical Path SectionControl ResponsiblePerson Date IdentifiedContingency Plan Mitigation Plan Historical EventsProcurement Plan TemplateDescription of the Items and Services to be PurchasedThe intended use of the itemsThe performance requirements to be met by the itemsThe benefits and/or justification of the purchaseMarket AnalysisGeneral market conditionsTechnological trendsAvailable productsSimilar systems in use and performanceDetailed sources of information on the itemNumber of potential clients participatingRequirements AnalysisProcess requirements ensuring that the system will meet the requirements of the work process Technical requirements ensuring that the system will have the capabilities and the capacity required, and will fit into the State’s technical infrastructure and operation environment Project management requirements including definition of vendor and agency responsibilitiesSpecifications including the technical data required in specifying and inspecting the selected productContractsTypes of contracts/ordering agreementsThe Selection Process and CriteriaNegotiation strategiesDeliverables and the Procurement ScheduleA list of all major deliverablesA description of and timeline for the procurement process, including all required approvalsCommunications Planning Template DistributionFlow of project information throughout the projectStakeholder What info dothey need Why do theyneed itWhen will theyget itHow will they get itUpdating the Communication PlanDescribe how and when the Communications Plan will be updated throughout the project. Communication Plan StorageDescribe where physical project files will be kept within the agency as well as where electronic media might be stored for project team access.Project Budget Estimate TemplateProject Task LaborHourLaborCostMaterialCostTravelCostEducationCostOtherCostTotalperTask $ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $$ $ $ $ $ $ Other:$ $ $ $ $ $$ $ $ $ $ $ Sub-Totals:$ $ $ $ $ $ Risk (Contingency)$ $ $ $ $ $ TOTAL (scheduled)Comments: (List assumptions for costs as appropriate.)Cost Management Plan TemplateProject Variance Levels(Describe the cost variance levels approved for this project)Variance Management(Describe how variances will be measured and managed throughout the project) Budget Updates(Describe how budget updates will be handled)。

常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装PQFP = Plastic Quad Flat Package = 方形扁平封装LQPF = Low Profile Quad Package = 薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array = 球栅阵列封装BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design = 计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装DFP = Dual Flat Package = 双侧引脚扁平封装DSO = Dual Small Outline = 双侧引脚小外形封装3D = Three-Dimensional = 三维2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output = 输入/输出LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module = 多芯片组件MCP = Multichip Package =多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路OLB = Outer Lead Bonding = 外引脚焊接PBGA = Plastic BGA = 塑封BGAPC = Personal Computer = 个人计算机PGA = Pin Grid Array = 针栅阵列SIP = System In a Package = 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package = 小外形封装SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合WLP = Wafer Level Package = 晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请 ECR(Engineering Change Request) 持续改善计划CIP(continuous improvement plan)戴尔专案 Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单 Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表 Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表 Yearly report年度报表 Annual report财务报表 Financial report品质报表 Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告 First article inspection report 初步报告（或预备报告）Preliminary report一份更新报告 An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report) 出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明） COC(Certificate of Compliance) 稽核报告 Audit report品质稽核报告 Quality audit report制程稽核报告Process audit report5S 稽核报告 5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告 Annual audit report内部稽核报告 Internal audit report外部稽核报告External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限Upper limit（规格）下限 Lower limit规格上限Upper Specification Limit(USL)规格下限 Lower Specification Limit(LSL)上控制限（或管制上限） Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值 Maximum value平均值Average value最小值Minimum value临界值 Threshold value / critical value MRB 单(生产异常通知报告) Material Review Board Report工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表） BOM (Bill of Materials )合格供应商名录AVL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡） Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡 Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer [‘weifə] n .威化饼干、电子晶片（晶圆薄片）Grind [ɡraind ]vt. & vi. 磨碎;嚼碎n .磨,碾Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Ink [iŋk] n. 墨水, 油墨Die [dai] vt. & vi. 死亡（芯片）Dot [dɔt] n . 点, 小圆点Mounting [‘mauntiŋ] n. 装备,衬托纸Tape [teip] n. 带子；录音磁带; 录像带Size [saiz] n. 大小, 尺寸，尺码Thick [θik]adj. 厚的，厚重的Thickness [‘θiknis]n. 厚(度), 深(度)宽 (度)Position [pə‘ziʃən]n. 方位，位置Rough [rʌf] adj . 粗糙的; 不平的Fine [fain]adj. 美好的, 优秀的, 优良的, 杰出的Speed [spi:d]n. 速度, 速率Spark[spɑ:k]n. 火花; 火星Out [aut]adv. 离开某地, 不在里面；(火或灯)熄灭Grindstone [‘ɡraindstəun]n. 磨石、砂轮Mount[maunt]vt. & vi. 装上、配有Mounter装配工;安装工;镶嵌工Mounting [‘mauntiŋ]n. 装备,衬托纸Magazine [,mæɡə‘zi:n] n. 杂志, 期刊，弹药库（传递料盒）Cassette [kə‘set] n. 盒式录音带；盒式录像带Inspect [in‘spekt] vt. 检查，检验，视察Inspection [in‘spekʃən] n. 检查，视察Card [kɑ:d]n. 卡, 卡片, 名片划片：Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Sawing ['sɔ:iŋ]n. 锯,锯切,锯开Film [film] n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Clean [kli:n]adj. 清洁的, 干净的；纯净的Cleaner [‘kli:nə]n. 作清洁工作的人或物Oven [‘ʌvən] n . 烤箱, 炉Cassette [kə‘set]n. 盒式录音带；盒式录像带Handler[‘hændlə]n. (物品、商品)的操作者Scribe [skraib] n . 抄写员, 抄书吏Street n. 大街, 街道Blade [bleid] n. 刀口, 刀刃,刀片Cut [kʌt] vt. & vi. 切, 剪, 割, 削Speed[spi:d]n. 速度, 速率Spindle [‘spindl]n. 主轴， (机器的)轴Size [saiz]n. 大小, 尺寸,尺码Cooling ['ku:liŋ]adj. 冷却(的)Kerf [kə:f]n. 锯痕,截口,切口Width [widθ] n . 宽度, 阔度, 广度Chip [tʃip] n. 碎片、缺口Chippi ng[‘tʃipiŋ]n. 碎屑,破片Crack[kræk]vt . (使…)开裂,破裂n . 裂缝, 缝隙Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Die [dai]vt. & vi. 死亡（芯片）Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Street [stri:t]n. 大街, 街道Film [film]n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Tape [teip]n. 带子；录音磁带; 录像带Bubble ['bʌbl] n. 泡, 水泡, 气泡mount---贴wafer---晶圆frame---框架blade---刀片tape---膜cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化open---打开air---空气pressure---压力failure---失败vacuum---真空alignment---校准ink---黑点die---芯片error---错误limit---限制cover---盖子device---产品data---数据saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高rotary---旋转check---检查feed---进给cutter---切割speed---速度height---高度new---新shift---轮班pause---暂停clean---清洗center---中心chip---崩边change---变换enter---确认Off center---偏离中心 broken---破的 alarm---报警上芯：Attach [ə‘tætʃ]vt. & vi. 贴上; 系; 附上Bond [bɔnd]n. 连接, 接合, 结合vt. 使粘结, 使结合Bonder [‘bɔndə]n. 联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy [e‘pɔksi] n. 环氧树脂（导电胶）Material [mə‘tiəriəl]n. 材料, 原料Non-conductive epoxy绝缘胶Conductive [kən‘dʌktiv] adj. 传导的Dispenser [dis‘pensə]n. 配药师, 药剂师Nozzle [‘nɔzl]n. 管嘴, 喷嘴Rubber [‘rʌbə]n. (合成)橡胶，橡皮Tip [tip] n. 尖端, 末端Die pick-up tool 吸嘴Tool [tu:l]n. 工具, 用具Collect [kə‘lekt]vt. 收集, 采集（吸嘴）Ejector [i‘dʒektə]n. 驱逐者,放出器,排出器Pin [pin]n. 针,大头针, 别针Lead Frame引线框架Lead [li:d]vt. & vi. 带路, 领路, 指引Frame [freim]n. 框架，骨架，构架Magazine [,mæɡə‘zi:n]n. 杂志, 期刊（料盒）Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Oven [‘ʌvən]n. 烤箱, 炉Scrap [skræp]n. 小片, 碎片, 碎屑Dent [dent] n. 凹痕, 凹坑Die Lift-off 晶粒脱落（芯片脱落，掉芯）Skew [skju:] adj. 歪, 偏, 斜Misorientation [mis,ɔ:rien‘teiʃən] n. 定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del 写胶后气压延时Squeeze [skwi:z] vt. 榨取, 挤出n. 挤, 榨, 捏Eject [i‘dʒekt]vt. & vi . 弹出, 喷出, 排出Delay [di'lei]n. 延迟Height [hait] n. 高度, 身高Level [‘levl]n. 水平线, 水平面; 水平高度Head [hed]n. 头部，领导, 首脑Eject up delay 顶针延迟Eject up heigh t 顶针高度Bond level粘片高度Pick Level 捡拾芯片高度Head pick delay 粘接头拾取延迟Head bond delay 粘接头粘接延时Pick delay捡拾芯片延时Bond delay 粘接芯片延时Index [‘indeks]n. 索引;标志, 象征; 量度Clamp [klæmp]vt. & vi. 夹紧; 夹住n. 夹具Index clamp delay 步进夹转换延时Index delay 框架步进延时Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Test [test] n. 测验,化验,试验, 检验Die shear test 推晶试验Thickness ['θiknis] n. 厚(度), 粗Coverage [‘kʌvəridʒ] n. 覆盖范围Epoxy thickness & coverage 导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən] n. 方向, 目标Die Orientation 芯片方向Void [vɔid] adj. 空的, 空虚的n. 太空, 宇宙空间;空隙, 空处; 空虚感, 失落感Epoxy void 导电胶空洞Chip [tʃip] n. 碎片Damage[‘dæmidʒ] vt. & vi. 损害, 毁坏, 加害于n. 损失, 损害, 损毁Chip damage芯片损伤Backside [‘bæksaid]n. 臀部, 屁股，背面Chip backside damage 芯片背面损伤Tilt [tilt] vt. & vi. (使)倾斜Tilted die 芯片歪斜Epoxy on die 芯片粘胶Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Crack die 芯片裂缝/芯片裂痕Lift [lift]vt. & vi. 举起, 抬起n. 抬, 举Lifted die翘芯片Misplace [,mis‘pleis]vt. 把…放错位置Misplaced die 设置芯片NO die on L/F 空粘Insufficient [,ɪnsə‘fiʃənt] adj. 不足的, 不够的Insufficient epoxy 导电胶不足Epoxy crack 导电胶多胶Epoxy curing银浆烘烤Edge [edʒ] n. 边, 棱, 边缘Partial [‘pɑ:ʃəl] adj. 部分的, 不完全的Mirror [‘mirə] n. 镜子Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Edge die / partial die边缘片 / 边沿芯片Mirror die光片 / 镜子芯片Missing die 掉芯 / 漏芯 / 掉片Splash [splæʃ]vt. 使(液体)溅起vi.(液体)溅落Splatter [‘splætə] vt. & vi. (使某物)溅泼Diagram [‘daiəɡræm]n. 图解, 简图, 图表Ink splash / ink splatter墨溅Die bonding diagram 上芯图Die shesr test 推片实验/推晶试验Die shear tester 推片试验机Die shesr tool 推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system 芯片分级系统System ['sistəm] n. 系统; 体系wafer---晶圆die---芯片attach---粘贴glue---银胶substrate---基板magazine---盒子inspection---检查parameter---参数manual---操作手册reset---重设enter---确定error---错误input---输入speed---速度stop---停止pressure---压力vacuum---真空sensor---传感器back side---背面pin---针statistics---统计calibration---校正bond---贴片conversion---改机thickness---厚度tilt---倾斜度shape---形状adjust---调整contact---接触cover---覆盖device---产品chip---崩边pause---暂停elevator---升降机 initial---初始化alignment---校准cassette---盒子tape---膜 frame---框架ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头 writer---划胶头压焊：Wire [‘waiə] n. 金属丝, 金属线;电线, 导线Bond [bɔnd] n. 接合, 结合vt. 使粘结, 使结合Wire bond / Wiring bonding 压焊/焊丝/球焊Gold wire金丝Pad [pæd]vt. 给…装衬垫, 加垫子n.垫,护垫Bond pad 焊点、铝垫1st bond第一焊点Pad size焊点尺寸 / 铝垫尺寸Capillary [kə‘piləri] n.毛细管;毛细血管（劈刀）Pitch [pitʃ] 程度; 强度; 高度Pad pitch铝垫间距 / 焊点间距Elongation [i:lɔŋ‘ɡeiʃən] n.延长;延长线;延伸率Breaking [‘breikiŋ] n. 破坏,阻断Load [ləud] n. 负荷; 负担;工作量, 负荷量Breaking Load 破断力Pull [pul]vt. & vi.拉, 扯, 拔Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Wire pull / ball pull（焊丝）拉力Wire shear / ball shear（焊丝）推力Ultrasonic [,ʌltrə‘sɔnik] adj. (声波)超声的Power [‘pauə]n. 功力, 动力, 功率Force [fɔ:s]n. 力; 力量; 力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature [‘tempəritʃə] n. 温度, 气温Bonding temperature 温度Ultrasonic wire bonding 超声波压焊EFO打火烧球loop [lu:p]n. 圈, 环, 环状物Loop height 孤高Wire pull test 拉力试验Ball shear test 金球推力试验PIN 1 第一脚Ball height 球高Ball diameter球径Cratering [‘kreitəriŋ] n. 缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test 压焊腐蚀试验(弹坑试验)Thermal [‘θə:məl] adj. 热的，热量的Compression [kəm‘preʃən] n. 挤压, 压缩TCB（ Thermal Compression Bond）热压焊Bonding Diagram 压焊图 / 布线图Wrong Bonding 布线错误Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incomplete bond 焊不牢No bonding 无焊N2 BOX 氮气柜RTPC 实时过程监控Tray [trei] n. 盘子, 托盘Handing Tray 产品盘FBI 压焊后目检FBI insp-M/C 压焊检验机Microscope [‘maikrəskəup] n. 显微镜Low Power Microscope 低倍显微镜Flux [flʌks] n. 熔剂、焊剂；助熔剂，助焊剂Hook [huk] vt. & vi. 钩住, 吊住, 挂住Wire pull hook线钩（测拉力）Ball shear tool 推球头（测推力）Metal [‘metl]n. 金属Discolor [dis‘kʌlə]v.使脱色;(使)变色,(使)褪色Oxide [‘ɔksaid]n. 氧化物Metal Discolor铝条变色Bond Pad Discolor 铝垫变色Bond Pad Oxide铝垫氧化Stick [stik] vt. & vi. 粘贴, 张贴Peeling [‘pi:liŋ] n. 剥皮,剥下的皮Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）Nonstick bond on pad 铝垫不粘Bond pad peeling 铝垫脱落Bond pad cratering铝垫弹坑Limit [‘limit]vt. 限制; 限定Scratch [skrætʃ] vt. & vi. 抓, 搔，刮伤Over rework limit超过返工数Bond remove / scratch 剔球划伤Ball bond non-stick金球脱落Ball to large （small）金球过大（小）Ball bond short 金球短路Non-stick on lead 引脚脱落（鱼尾脱落）misplace [,mis‘pleis]vt. 把…放错位置connection [kə‘nekʃən]n. 连接, 联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection 错打defective [di‘fektiv]adj. 有缺陷的，欠缺的Defective looping弧度不良Sagging [‘sæɡiŋ]n. 下垂[沉,陷],松垂,垂度Loop sagging 弧度下陷Low loop 弧度太低High loop弧度太高Loop short 弧度短路Overhang [,əuvə‘hæŋ]vt. 伸出; 悬挂于…之上Residue [‘rezidju:]n. 剩余, 余渣Distortion [dis‘tɔ:ʃən] n. 歪曲,曲解Wire overhang on LD 跨越引线框架Wire residue 残丝LF distortion 引线框架变形Quantity [‘kwɔntiti]n. 数目, 数量Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Scrap [skræp]n. 废料vt. 废弃, 丢弃Scratch [skrætʃ] vt. 刮伤Quantity Mismatch 数量不符Empty M. not scrap空粘未报废Gold Wire Scratch 金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏 Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀 Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO ---电子打火Linear power ---线性马达Vacuum sensor---真空感应器 Step driver—步进驱动Post bond inspection—焊接后检查 Wire pull—拉线Ball shape—推球 Ball size—焊球大小Ball thickness—焊球高度 Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损 Fine adjust–精确调整Conversion–换产品 1st bond non stick—第一点不粘2nd bond non stick—第二点不粘 peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形 servo motor—伺服电机 weld off---管脚脱焊 crater---裂缝 gold wire---金线missing ball---球未烧好 weak bond---虚焊塑封：Mold [məuld] n. 模子,铸型vt. 浇铸,塑造Molding [‘məuldiŋ] n. 成型（塑封）Compound [‘kɔmpaund] n.复合物, 化合物Moiding M/C；Mold Press塑封机Press [pres] n. 印刷机Heater [‘hi:tə] n. 加热器; 炉子Pre-heater 预热机Chase [tʃeis]n.追捕, 追猎Mold die / Mold chase 塑封模具MGP mold MGP多缸模具Auto mold 自动包封机load [ləud]vt. & vi. 1 把…装上车[船] 2 装…loader ['ləudə] n. 装货的人,装货设备,装弹机Auto L / F loader自动排片机handler [‘hændlə] n. (动物)驯化者（抓手）temperature [‘tempəritʃə]n. 温度, 气温Pre-heat Temperature 料饼预热温度Mold Temperature 模具温度Clamp [klæmp] vt. & vi. 夹紧; 夹住n. 夹具Pressure [‘preʃə] n. 压(力), 压强Clamp Pressure 合模压强Transfer pressure 注塑压强Transfer [træns‘fə:]vt. & vi. 转移; 迁移n. 转移Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Curing time 固化时间Curing temperature 固化温度Pre-heat Time （料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep [swi:p] vt. & vi. 扫, 打扫, 拂去Wire Sweep 冲丝Open 开路Short 短路Fill [fil] vt. & vi. (使)充满, (使)装满, 填满Underfill ['ʌndəfil] n. (孔型)未充满Body underfilled胶体未灌满Incomplete [,ɪnkəm‘pli:t]adj. 不完全的, 未完成的Incomplete mold 未封满Chip [tʃip] n. 碎片，缺口Chip package / body chip-out崩角Porosity [pɔ:‘rɔsiti] n. 多孔性,有孔性Porosity Body 胶体麻点Bubble [‘bʌbl] n.泡, 水泡, 气泡Blister [‘blistə] n. 气泡vt. & vi. (使)起水泡Smear [smiə] vt.弄脏, 弄污n. 污迹, 污斑Surface [‘sə:fis] n. 面, 表面Roough surface 不均匀（表面）Delaminate [di:‘læməneit] v. 将…分层,分成细层Delaminating 分层Void [vɔid]adj. 空的, 空虚的PKG Void 胶体空洞Deep [di:p] adj. 深的Scratch [skrætʃ] vt. 刮伤Body deep scratch胶体刮痕Dimension [di‘menʃən] n.尺寸, 度量Mold PKG dimension 塑封体尺寸BTM width / length 背面宽 / 长Top width / length 正面宽 / 长PKG thick 塑封体厚度Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Mold mismatch / PKG mismatch 包封偏差(胶体错位) Offset [‘ɔfset] vt. 抵消, 补偿Misalignment [‘misəlainmənt] n. 未对准Mold offset / PKG misalignment偏心PMC（post mold cure）后固化Dummy [‘dʌmi] n. 人体模型Strip [strip] vt.剥去, 剥夺, 夺走Dummy molded strip空封Mold flash 废胶Gate [ɡeit]n.门, 栅栏门Mold gate 注浇口、进浇口Remain [ri‘mein]n. 剩余物; 残余Gate remain 小脚Compound [‘kɔmpaund] n.复合物, 化合物Ag ing [‘eidʒiŋ]n. 老化,成熟的过程Compound Aging 料饼醒料（回温过程）Locator [ləu‘keitə]n. 表示位置之物,土地Block [blɔk] n.大块(木料、石料、金属、冰等) Locator Block 定位块Ejector [i‘dʒektə] n. 驱逐者,放出器Pin [pin]n. 大头针, 别针，针Depth [depθ] n.深, 深度Ejector Pin 顶针E-pin Depth顶针深度Storage [‘stɔ:ridʒ] n.储藏处, 仓库Cold room / compound storage冷藏库/料饼存放库Air [ɛə] n. 空气Gun [ɡʌn] n. 枪, 炮Coating [‘kəutiŋ] n. 涂层, 覆盖层Material [mə‘tiəriəl]n. 材料, 原料,素材, 资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C 芯片涂胶机Die Coating Material覆晶胶Cart [kɑ:t]n. 手推车ASS’YB Cart 后站推车Tablet [‘tæblit]n. 药片、胶囊Loader [‘ləudə] n. 装货的人,装货设备,装弹机Preheater [‘pri:’hi:tə] n. 预热器Fixture [‘fikstʃə] n. (房屋等的)固定装置Auto Tablet Loader 自动排胶粒机Compoud Preheater 高频预热机Load /Unload Fixture 上料/下料架Tablet Magazine 胶粒盒Compoud Tablets 塑封料饼Molding Cleaning Compoud 洗模饼misorientation [mis,ɔ:rien‘teiʃən]n. 定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead 塑封溢胶Mold crack 胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable –预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达 Station–模腔Cleaning brush—清洁刷Cylinder---气缸 Sensor---传感器Solenoid---电磁阀Turn over –翻转器 Degate–切料口 Bearing---轴承Picker---爪子 Pusher–推动器 Cull bin –垃圾箱Pin---针Vacuum pump—真空泵 Mornitor–显示器Cable–导线 Profile---温度曲线 Alarm---报警Error---错误 Driver---驱动 Sensor–感应器Inspection---检查Parameter---参数 Manual---手动,手册Reset---复位 Initialing---初始化 Guide–导轨Substrate---基板 Device---产品种类 Lot Traveller---随工单Magazine---盒子 Cylinder –汽缸 Bearing–轴承Stop---停止Emergency Stop---紧急停止 Gripper --夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体 Molding –模封Operation–操作Flange–法兰盘 Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching---扭曲Overflow---漏胶Misalignment---模封错位 Package mismatch---模封错位Resin Hole / Void ---气孔Foreign materials ---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng. Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME--- 损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂 SPC sample ---SPC样品切筋 Trim-Form1 切筋Trimming Dambar cut2 切筋模 Trim die3 成形模Form die4 分离模singulate5 冲废De-junk6 检测Inspection 外观检测7 再成型机模具Reform Die8 再成型机 Reform system9 料盘 Plastic tray10 连筋 Uncut dambar11 毛刺burr14 溢料Junk15 裂纹Crack16 离层（分层） Delaminating17 管脚反翘 Lead tip bend18 筋未切 Dam-bar uncut19 筋凸出 Dam-bar protrusion20 筋切入Dam-bar cut in打印 Marking1 打印Marking2 印章 Marking layout3 激光打印 Laser marking4 油墨打印 Ink (UV) marking5 正印 Top side mark6 背印 Back side mark7 镜头 Lens8 打印不良\模糊Illegible marking9 漏打 No marking10 断字 Broken character11 缺字 Missing character12 印字倾斜 Slant marking13 印记错误 Wrong marking14 重印 Remark15 印字模糊（褪色）Fade mark16 印字粘污 Smear19 电流current21 字体（字形） Font22 定位针 Location pin23 胶皮打印机 Pad printer24 激光打印机 Laser Marking M/C25 后固化 PMC(Post Mold Cure)26 后固化烤箱 PMC Oven27 打印污斑 Marking stain28 印记移位Marking shift电镀 Plating1 电镀 Plating2 来料Incoming3 冲废 Dejunk4 热煮软化槽 Socking Tank7 检验 Inspection 外观检测8 烘烤 Curing / Baking 150℃; 60-90ms9 出料 Unload10 高速线电镀 High-speed Plating Line11 统计过程控制 SPC12 搭锡 Solder bridge13 锡丝、锡须Solder flick / Whisker14 镀层不良 Plating defects15 发黄 Yellowish16 发黑 Blacken17 变色 Discolor18 露底材（露铜） Expose copper19 粘污 Smear20 镀层厚度 Plating thickness 7-20um21 镀层成分 Plating composition 电镀成分, Sn22 外观 Outgoing23 易焊性Solder ability24 无铅化 Pb-free / lead free25 结合力 Adhesive force26 可靠性Reliability27 电解Electrolytic deflash28 清洗（自来水）City water29 高压清洗 High pressure rinse30 脱脂 Descale31 清洗（纯水） DI water32 活化（合金） Activation33 预镀、预浸 Pre-dip34 电镀Plating35 吹风 Air blow36 中和Neutralization37 褪镀Stripper38 拖出 Drag out39 上料机 Loader40 下料机 Unloader41 纯锡Tin42 纯水(去离子水) DI water43 水压Water pressure44 理化分析Physical and chemical analysis45 测厚仪Plating Thickness Meter / Electroplated CoatingThickness Test46 离子污染度测试仪 Ion Contamination Tester Contamino CT10047 C含量测试仪Carbon Tester51 去氧化HSCU Descale52 预浸 Pre-dip53 电镀电流 Current54 镀液温度 Temperature电镀液 plating solution55 电镀槽 plating tank56 中和Neutralization59 烘干 Curing60 锡球 Solder ball61 锡厚度和成分 Sn thickness & composition62 冲废De-junk去胶渣63 去溢料 Degate 冲塑，冲胶64 去飞边 Deflash 去胶(塑封工序)65 锡铅电镀 Tin lead plating66 无铅电镀 Lead free plating; Pure tin plating67 镀层起泡Solder bump68 镀层剥落 Solder peel off69 镀层偏厚或偏薄 Thick or Thin Plating70 退锡 Solder remove71 电镀报废Plating scrap72 锡渣 Solder peeling73 电镀锡块Solder bump74 电镀桥接Plating bridge75 电镀变色SP Discoloration76 电镀污染 SP Contamination77 电镀锡攀爬SP adhere 78 电解除油Electro-degreasing测试 Testing1 测试 Testing2 打印 Laser mark3 编带机 Tape & Reel Machine4 编带 Reel5 测试机 Tester6 分选机 Tray Test Handler7 Vision检测 Direction vision8 划伤 Scratch9 打错 Wrong mark10 断字 Broken character11 漏字No marking12 模糊 Fade mark13 脚长Lead length14 脚宽 Lead width15 站立度 Stand up16 脚间距 Lead pitch17 共面性 Coplanarity18 跨度 Row space19 电性能测试 Electrical test20 塑料管 Plastic tube21 编带 Reel / Tape22 托盘，盘装 Tray23 扫描测脚 Leads Scan/Inspection24 扫描测脚机Leads scanner25 投影仪 Profile Projector 测试 TestingLaser 激光Lamp 灯管Lamp current 灯管电流Marking layout打印内容Power supply 电源Frequency 频率On-loader 上料部分Off-loader 下料部分Marking box 打印区域Track 轨道Location pin 定位针Scanner 扫描器Beam 光束Beam path 光路Bar code 条形码Sensor 传感器Motor 马达Driver 驱动器Index 步进Tool 模具Press 模具Punch 刀具Jam 卡料Forming 成型Cylinder气缸Laser head 光头Magazine 盒子Tray 板子Arm 机械臂Safety door 安全门Reset 复位Lamp 灯管Keyboard 键盘Alarm 报警Error 错误Open/Short(O/S) 开路／短路Function Reject 功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject 电流失效Test Program 测试程序Cold test冷测Retest 重新测试Rework 返工Sample 抽样Resample 重新抽样Black box盛放未测试产品的黑盒子Testing area 测试区域Test chuck 测试平台Device Interface Board(DIB) 芯片测试接口板DUT 正在测试芯片A/D (analog-to-digital) converter 模/数转换模块EOT 测试结束信号SOT测试开始信号BIN signal 分BIN 信号JIG/Test Head 测试盒/测试头Interface Card 接口通讯卡Interface Cable 接口通讯线Coaxial Cable 同轴线Test parameter 测试参数Tester Computer 测试机主机Test limit 测试结果的上下限AC Multiplexer 多路交流信号板Digital Driver and Detector 数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker 检测程序High-Speed Digital (HSD) Instrument 高速数字测试设备High-Current-Voltage-Source 高电流电压源Finger 金手指Contactor 金手指动作模块Convey motor 变送马达Contact side 测试位置General Control Panel 总控制面板Ionizer 离子风扇Capacitor box 电容盒。

Will we find life in the solar system?Do violent computer games contribute to anti-social behaviour?How can sports fitness improve through football?Y our Guide to ProjectLevel 1 (Foundation) and Level 2 (Higher)Is it ethical to genetically engineer babies for designer purposes?Is it right for me?Project has no exams, just coursework, so if you’re self-motivated and enjoy working independently - whether it’s more practical, like designing and making something, or involves researching and writing - then Project is for you. You can:•learn more about something that interests you•investigate a controversial topic•expand your knowledge of one of your GCSE subjects•gain practical skills that will help you in further education or in a jobWhat’s involved?With Project, you get a say in what you want to study. With the help of your teacher, you choose a topic to explore in-depth – one that interests you, which you might like to study in the future, or pursue as a career. It’s a good idea to link it to one of your GCSE or BTEC subjects, because you’ll already have some background knowledge of these, and you’ll be able to gain a greater understanding of them.For the Foundation and Higher Projects, you have to produce a written Report or an Artefact (something you make or design). Below are the titles of some Projects that students have already completed.Report-Have organic foods changed the waywe shop and eat?-Should children be forced to exercise?-Should human cloning be allowed?-Have smoking habits and attitudes changedsince the indoor smoking ban?-Do food labels affect how people shop?Artefact-Design and make a mask for a characterin a play or a film.-Design and produce a teaching aid to helpyoung children understand numbers.-Produce a series of photographs and text for apublicity brochure.-Make a short video film to promote alocal attraction where you live.-Redesign an everyday object to make it morefashionable.What will I learn and how will I be marked? Once you’ve agreed the title of what you want to study with your teacher you’ll be given guidance to help you develop the skills you need to manage your Project. Whatever Project you choose, you’ll be expected to work independently, supported by your teachers.You’ll learn and be assessed on:•How well you manage your work, such as planning your time and choosing what methods to use to complete your Project•How you select and use information and resources throughout the Project •The range of skills you develop and use to achieve what you set out to do •How effectively you review your own workIn other words it’s not what you produce but the process you used tomanage your Project. What you learn and how you perform throughout thetime spent on your Project all count towards your final grade.The skills you learn to complete your Project will be really helpful, whether you want to go into further education, such as progressing onto GCE courses, or get a job.Next steps•Talk to your teachers about taking Project.•Visit the Edexcel website to find out more and tosee examples of some of the work other studentshave done (called ‘exemplar material’)./ProjectWhat students have saidBelow is just some of the feedback we’ve received from students like you about Project.“The best thing about it is the way we can learn about and work at what interests us.”“I feel proud that my project is totally my own research and work.”“I’ve learnt a lot about self-motivation through this work.”Edexcel190 High Holborn,London WC1V 7BH Tel************Fax************About EdexcelEdexcel, a Pearson company, is the UK's largest awarding body offering academic and vocational qualifications and testing to schools, colleges, employers and other places of learning here and in over 85 countries worldwide.Edexcel Limited. Registered in England and Wales No. 4496750Registered office: 190 High Holborn, London WC1V 7BH. BTEC is a registered trademark of Edexcel Ltd.“No other course gives such scope for individualityand originality.”。

项目任务书(project charter)又名：任务说明书(mission statement)➢概述项目任务书是对一个改进项目审定和定义的文档。

➢适用场合·当一个项目开始时；·只要有人需要关于项目的信息或者目的阐述、范围、时机、状况等；·评估时，确保项目适当地集中且准时，更新目前进展任务书；·当项目过程中所得的信息表明需要变更任务书时。

➢实施步骤1项目的支持者（发起并且支持项目的管理成员）和项目小组领队在项目开始时共同起草任务书。

许多企业都有标准的格式。

这里是一些基本的元素，下面的注释和问题可以帮你完成表格。

项目题目报告以及最佳实践中的该项目如何命名？过程名以及产品或服务影响什么功能和企业的输出将成为项目焦点？问题描述目前过程、产品或服务出了什么问题？目标／目的希望有什么改进和结果？根据用来判断成功的过程测量指标阐述结果。

范围过程的哪些方面需要包含进去，哪些方面不需要包含进去？过程的起始点和结束点各是什么？商务方面过程的重要之处是什么？目前的不良质量的成本是什么？该项目有哪些对财务方面（成本节约、利润增长、成本避免）的影响？哪些将影响外部顾客？项目起始日项目任务书所定义的日期。

目标完成日基于项目复杂度、假期、工作量、旅游以及顾客合约要求等方面的估计。

预期里程碑日期检验、描述、客户参观等人员列出名单、角色以及联系信息：·项目发起人·项目领导·小组成员·小组督导者·专业技术人员·其他的过程或者项目专家·其他重要的利益相关者签名和日期准备和批准签名、日期以及修正日期。

2任务书可以由管理层进行检查和批准。

3在早期定义顾客需求、伸展宽度问题以及建立测量系统的过程中，项目逐渐得到更准确的定义，应该检查、修订并重新审批任务书。

➢示例Medrad的财务人员想要减少处理货运清单所需的工作量，以使人们可以做更具增值性的工作，减少临时职位，也可以为公司未来的成长做准备。

模具专业术语模具专业术语——注塑模(锦浩塑胶模具厂）English Training——Injection Mold（一）模具专业基本用词Professional Terms1．塑料—plastic, resin2．样件—sample3．钢料—steel4．注塑机—injection machine, press5．产品—part, product, moulding6．模具—mold, mould, toolA 简易模（样板模）—prototype moldB 量产用模具—production mold 7．三维造型（数模）—model, 3D data8．二维产品图—2D part drawing9．设计—design10．制造—manufacture, build up, construction11．检验—chec k, inspection12．测量—measure, inspection13．修改—change, modify, correction14．工程更改—engineer change15．质量—quality16．数量—quantity17．基准—datum, reference（二）如何解析2D 产品图？How to read 2D part drawing?一．产品几何Geometry1．点—point2．线（边）—line, edge3．面faceA 侧面—sideB 表面—surfaceC 外观面—appearance surface 4．壁厚—wall thickness, stock thickness5．加强筋（骨位）—rib6．孔—hole7．细长的槽—slot8．柱位—boss9．角—cornerA 圆角—filletB 倒角—chamferC 尖角—sharp corner 10．斜度—angle, taper11. 凹槽—recess ,groove二．分模信息Splitting1．分型线—parting line (P/L), splitting line2．主分模方向—main direction, line of draw3．浇口设定—gating三．产品标识Part Identification1．产品名称—part name (P/N)2．产品编号+版本号—part number + revision (Rev.)3．型腔号—cavity number4．材料标记—material symbol5．模具编号—mold number (no.)6．日期印—dating insert, date code7．循环印—cycling code8．公司标志—company logo四．技术要求Specification (Special Requirement)1．项目启动表Kick-off sheet1）项目名称—program name, project name2）产品名称—part name, product name, part description3）产品编号—part number (P/N)4）客户模号—customer mold no.5）项目启动日期— kick off date,start date6）项目完成日期— due date, lead time7）内模件用钢— tool steel8）型腔数量—number of cavit ies9）数模文件编号—data file n o.10）注塑材料—resin,plastic, raw material11）收缩率—shrink, shrinkage, shrink factor12）注塑机吨位—molding machine size, injection machine size13）成型周期—cycle time14）型腔光洁度—cavity polish15）型芯光洁度—core polish16）皮纹（晒纹）—texture, grain17）拔模斜度—draft angle, removal taper18）注塑件颜色及光泽—molded color & gloss19）模具加工地— manufacturing facility20）热流道供应商—manifold manufacturer, manifold supplier 21）浇口位置—gate location / position22）浇口类型—gate type23）产品标识—stamp information, part identification24）特殊要求— special instructions2．产品质量及外观要求Part Quality & Appearance1）尺寸及公差Dimension & Tolerance①重要尺寸—critical dimension, important dim., key dim.②理论尺寸—nominal dimension③实际尺寸—actual dimension④公差—tolerance⑤公差带—tolerance range⑥尺寸超差—dimension deviation⑦接受（合格）—accept, OK⑧拒绝（不合格）—reject, refuse, obsolete, NG⑨让步接受—concession, special admit⑩返工—re-work2）产品缺陷（较常见）Defects (normal)①缩印—sink mark, shrinkage②飞边—flash, burr③段差—mismatch discrepancy④银丝纹—snake marks, streak⑤弯曲—warpage, distortion⑥打不足（缺料）—short shot⑦熔接线—weld line3．产品外观Part Appearance①产品颜色—part color②产品光泽—gloss③皮纹粒度—grain4．常用词汇、词组及短语Normal Word, Short Sentence1）单边—per side2）双边—both sides3）加入，添加—add, incorporate4）去除，取消—remove, cancel5）满足…的要求，符合，与…要求一致—according to, conform to, satisfy, meet 6）要求，需要—require, need, demand 7）确认—be approved, agreed by …8）允许—permit, allow9）在…范围之内—within10）不可以，不允许，禁止—free from,prevent, avoid11）…，除非有另指—…unless otherwise specified12）…或少于—…or less13）自动化运作—automatic operation14）未注尺寸（详细形状）见三维造型Non dimensioned contour (detailed shape) see 3D model.15）分型线上的飞边（披缝）或段差应小于…Burrs and discrepancy on the P/L shall be … or less.五．标题栏Title Block1．产品名称—part name2．图纸编号 + 版本号（索引号）—drawing no. + level (index) 3．一般公差[的标准] —general tolerance（三）如何阅读制模标准？How to read tooling standard?一．模具结构术语Mold Construction TerminologyA．模架Mold Base1．模架量化特征Measurement Feature①长X 宽X 高—Length X Width X Height②模具推高尺寸（模厚）—stack height of mould③模具重量—total weight of mould, mould thickness2．定模底板—front plate, top clamping plate, clamp plate, clamping plate3．定模板—cavity plate, fixed mould plate, A – plate4．动模板—core plate, moving mould plate, B – plate5．支撑板—support plate, backing plate6．模脚—support blocks, rails, risers, spacer block7．顶杆固定板—retaining plate, ejector retaining plate8．顶板—ejector plate9．动模底板—back plate10．导柱—guide pillar, leader pin, guide pin11．导套—guide bush, leader pin bush12．复位杆—return pin, push-back pin13．弹簧—spring14．撑头—support pillar15．推板导柱、导套—ejection guide pin / bush16．挡钉—stop pin, stop button17．站立脚—standing-off pillars18．标牌—plaque scutcheonB．成型零部件moulding components19．型芯—core20．型腔—cavity21．镶针—core pin22．镶块—insert, split23．滑块—slide, sliding split24．斜顶—lifter, angled-lift splitA 斜顶头—lifter headB 斜顶杆—lifter rod, lifter shaft25．成型顶杆—moulding face pin, form pinC．浇注系统Feed System1．塑料Mouldinga．主流道—sprueb．分流道runner①主分流道—main runner ②二级分流道— branch runner分流道断面形状cross-sectional shape of runner①圆形—full round②半圆形—semicircular③梯形—trapezoidalc．浇口gate常用浇口形式normal gate type :①边缘浇口（J型浇口）—edge gate, J – gate②侧浇口—side gate③潜伏式浇口—sub-gate, cashew gate, subsurface gate, submarine gate④潜伏式二次浇口(隧道式浇口) —tunnel gate onto feeder post⑤点浇口—pin gate⑥直接浇口(主流道型浇口) —sprue gate, direct gate⑦护耳式浇口—tab gated．模腔—impressione．冷料井—cold slug wellf．热流道—hot runner2．模具零件mold componentsa．定位圈—locating ring, location ring, register ringb．浇口套—sprue bushc．挡圈—stop ringd．浇口镶块—gate inserte．热流道板—manifoldf．热嘴—hot dropD．分型面及其锁紧、排气Parting Surface, inter-locking & venting1．分型线—parting line ( P/L )2．镶拼线—bodyline, joint line3．平/ 不平的分型面—flat / non – flat parting surface4．封胶面—shut off surfaces, seal-off surfaces5．擦位—shut off6．碰穿位—kiss-off7．管位—parting line lock8．分型面的释放(避空) —relief of parting surface9．分型面的平衡—balancing of parting surface10．锁紧角度—locking angle11．锁紧力—clamping force12．锁模板—safety strap13．精定位—Interlock, die lock14．困气—air trap15．排气槽—vent, vent slotE．滑块机构Slide1．驱动Actuation①斜导柱—angled pin, horn pin, cam pin②弹簧—spring③油缸—hydraulic cylinder2．制动Detention①滑块固定器— slide retainer②弹簧制动器— spring-loaded detention (plunger)③挡钉、挡板— stop pin, stop plate, slide stop3．导轨—gib, guide strip4．锁紧块（楔紧块）—heel block, locking heel, wedge block, chase block 5．耐磨片—wear plate, wear strip6．压板—retainer7．螺钉—screw8．定位销—dowelF．斜顶机构Lifter1．斜顶头—lifter head2．斜顶杆—lifter rod, lifter shaft3．开口销—split pin4．固定板（压板）— retainer plate5．耐磨片—wear plate6．铜导套— bronze bushing7．衬套— spacer8．导轨— L – gib9．滑动块— slideG．顶出系统Ejection System1．基本词汇Basic Word①顶出行程— ejection stroke②模具开档—daylight③粘模—stick④产品脱模—part is push off from, clear part of mould,separation of part 2．顶板机构Ejector plate assembly①顶板（推板）— ejector plate②顶板固定板— retaining plate③推板导柱— ejector guide pin④推板导套— ejector guide bush⑤撑头—support pillar, pillar support3．复位机构Return System①复位杆（回程杆）— return pin, push – back pin②挡钉—stop pin, stop button③压簧—compressed spring④碟簧—a stack of ―Belleville‖ washers⑤早复位机构—early return system⑥强制复位机构—positive return system4．顶出方法 Ejection Techniques1）顶杆顶出—pin ejection2）顶管顶出— sleeve ejection3）顶块顶出— bar ejection4）扁顶顶出— blade ejection5）顶板顶出— stripper ejection6）油缸顶出— hydraulic ejection7）气顶— air ejection8）阀门顶出—valve ejection5．顶出元件Ejection Elements1）拉料杆—sprue puller, sucker pin2）顶杆—ejector pin3）阶梯式顶杆— stepped ejector pin4）顶管— ejection sleeve,sleeve5）扁顶— ejector blade, slabbed off ejector pin6）顶块—stripper bar7）顶环—stripper ring8）推板—stripper plate9）加速顶— accelerated ejection6．顶出辅助机构Supplementary operating system1）弹簧柱塞器—spring – loaded plunger2）弹珠定位器— ball catch system3）插销式锁扣— Latch – lock4）尼龙拉杆装置— friction puller device7．电器元件Electric Components1）压力传感器—pressure transducer2）限位开关—limit switchF．冷却系统Cooling System1．基本词汇Basic Word1）温差—temperature variation2）水孔（水道）—waterlines, water-ways, flow-way, channel 3）水路—cooling circuit4）水路示意图—water schematic, schematic circuit5）冷却液—coolant, coolant fluid6）内连接—interconnect7）外连接—external connection8）出口、入口—outlet、inlet9）漏水—water leakage2．水路分布Circuits1）阶梯式水路—stepped system2）喷淋—baffled hole system3）斜孔式水路—angled hole system3．水路元件Components1）闷头（螺塞、止水栓）—（threadless）brass pressure plug : female plug & male2）隔水片—baffle3）密封圈—O – ring4）快插水路接头—quick disconnect fitting, quick connection adaptor5）弯头—elbow6）偶合器（连接器、接头）—adaptor (including a plug & a socket)7）橡皮管—rubber hose8）分水板—water manifoldG．螺纹、螺纹孔& 螺钉Thread, thread hole & screw1．螺纹—thread2．管螺纹—pipe thread3．螺纹孔—screw hole, tapped hole4．起吊孔—handling hole, jack screw hole, eye bolt hole5．螺钉—screw6．内六角螺钉—socket headed cap screw （s.h.c.s.）7．沉头螺钉—flat headed cap screw （f.h.c.s）8．螺栓—bolt, eye bolt9．螺母—nut10．锁紧螺母—locknut11．螺纹标准Thread Standard①公制标准—Metric②英制标准—Imperial③英制管螺纹标准—British Standard Pipe thread （BSP）④美制管螺纹标准—NPT⑤美制粗螺纹标准—United Coarse thread （UNC）⑥美制细螺纹标准—United Fine thread （UNF）H．润滑Lubrication1．润滑槽—grease groove2．加油管—grease line3．油杯—lubrication fittingI．测量仪器Measuring Instrument s1．游标卡尺—vernier caliper2．千分尺—micrometer3．高度规—height gauge4．刻度规—dial gauge5．三坐标测量仪—Coordinate Measure Machine（CMM）6．塞规—pin gauge7．圆角量规—radii gauge8．輪廓投影機—profile projectorJ．注塑机参数Injection Machine Parameter1．注塑机规格参数Injection Machine Specification①锁紧类型clamp typea．油缸—hydraulic b．肘杆式—toggle②垂直注塑机导柱间距—tie bar vertical clearance③水平注塑机导柱间距—tie bar horizontal clearance④台板尺寸—platen dim.⑤最小/ 最大模厚—mold height Min. / Max., Min. / Max. mold thickness⑥最小/ 最大注塑机开档—open daylight Min. / Max.⑦锁紧行程—clamp stroke⑧锁紧力—clamping force⑨顶出行程—ejector stroke⑩顶出力—ejector force2．试模工艺参数Moulding Process Parameter, machine setting①时间Timer（TM）, seca．注塑（充填）时间—filling time, injection timeb．冷却时间—cooling timec．补缩时间—packing timed．保压时间—holding timee．成型周期—cycle time②速率、速度Velocity, %、speed, in/seca．注塑（充填）速度—injection speedb．保压速率—hold pressure velocityc．螺杆转速—screw rotation speed③压力Pressure（Prs.）, psia．注塑压力—injection pressureb．保压压力—hold pressurec．回压（背压）—back pressure④温度T emperature（Temp.）, °Fa．注塑机喷嘴温度—nozzle temp.b．料筒前段、中段、后段温度—barrel front、middle、rear temp.c．模温—mould temp.d．料温—purged resin melt temp.e．空射料温—air shot melt temp.。