MAX4163芯片手册~~

General DescriptionThe MAX6161–MAX6168 are precision, low-dropout,micropower voltage references. These three-terminal devices operate with an input voltage range from (V OUT + 200mV) to 12.6V and are available with output volt-age options of 1.25V, 1.8V, 2.048V, 2.5V, 3V, 4.096V,4.5V, and 5V. They feature a proprietary curvature-cor-rection circuit and laser-trimmed thin-film resistors that result in a very low temperature coefficient of 5ppm/°C (max) and an initial accuracy of ±2mV (max).Specifications apply to the extended temperature range (-40°C to +85°C).The MAX6161–MAX6168 typically draw only 100µA of supply current and can source 5mA (4mA for MAX6161) or sink 2mA of load current. Unlike conven-tional shunt-mode (two-terminal) references that waste supply current and require an external resistor, these devices offer a supply current that is virtually indepen-dent of the supply voltage (8µA/V variation) and do not require an external resistor. Additionally, the internally compensated devices do not require an external com-pensation capacitor. Eliminating the external compen-sation capacitor saves valuable board area in space-critical applications. A low-dropout voltage and a supply-independent, ultra-low supply current make these devices ideal for battery-operated, high-perfor-mance, low-voltage systems.The MAX6161–MAX6168 are available in 8-pin SO packages.________________________ApplicationsAnalog-to-Digital Converters (ADCs)Portable Battery-Powered Systems Notebook Computers PDAs, GPS, DMMs Cellular PhonesPrecision +3V/+5V Systems____________________________Features♦±2mV (max) Initial Accuracy♦5ppm/°C (max) Temperature Coefficient ♦5mA Source Current at 0.9mV/mA ♦2mA Sink Current at 2.5mV/mA ♦Stable with 1µF Capacitive Loads ♦No External Capacitor Required ♦100µA (typ) Quiescent Supply Current ♦200mV (max) Dropout at 1mA Load Current ♦Output Voltage Options: 1.25V, 1.8V, 2.048V, 2.5V,3V, 4.096V, 4.5V, 5V19-1650; Rev 3; 8/05MAX6161–MAX6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References________________________________________________________________Maxim Integrated Products 1___________________Pin Configuration*Insert the code for the desired initial accuracy and temperature coefficient (from the Selector Guide) in the blank to complete the part number.Typical Operating Circuit and Selector Guide appear at end of data sheet.Ordering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 6161–M A X 6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltages Referenced to GNDIN …………............................................................-0.3 to +13.5V OUT………………........................................-0.3V to (V IN + 0.3V)Output Short-Circuit Duration to GND or IN (V IN ≤6V)...Continuous Output Short-Circuit Duration to GND or IN (V IN > 6V)…...........60sContinuous Power Dissipation (T A = +70°C)8-Pin SO (derate 5.88mW/°C above +70°C)...............471mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range………….…………-65°C to +150°C Lead Temperature (soldering, 10s)……………………….+300°CELECTRICAL CHARACTERISTICS—MAX6161 (V OUT = 1.25V)MAX6161–MAX6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS—MAX6168 (V OUT = 1.800V)M A X 6161–M A X 6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX6162 (V OUT = 2.048V)MAX6161–MAX6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References_______________________________________________________________________________________5ELECTRICAL CHARACTERISTICS—MAX6166 (V OUT = 2.500V)M A X 6161–M A X 6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References 6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS —MAX6163 (V OUT = 3.000V)MAX6161–MAX6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References_______________________________________________________________________________________7ELECTRICAL CHARACTERISTICS—MAX6164 (V OUT = 4.096V)M A X 6161–M A X 6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References 8_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS —MAX6167 (V OUT = 4.500V)MAX6161–MAX6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References_______________________________________________________________________________________9ELECTRICAL CHARACTERISTICS—MAX6165 (V OUT = 5.000V)Note 2:Temperature Coefficient is specified by the “box” method; i.e., the maximum ΔV OUT is divided by the maximum ΔT.Note 3:Thermal Hysteresis is defined as the change in T A = +25°C output voltage before and after temperature cycling of thedevice (from T A = T MIN to T MAX ). Initial measurement at T A = +25°C is followed by temperature cycling the device to T A = +85°C then to T A = -40°C, and another measurement at T A = +25°C is compared to the original measurement at T A = +25°C.Note 4:Dropout voltage is the minimum input voltage at which V OUT changes ≤0.2% from V OUT at V IN = 5.0V (V IN = 5.5V forMAX6165).M A X 6161–M A X 6168Precision, Micropower, Low-Dropout, High-Output-Current, SO-8 Voltage References 10______________________________________________________________________________________Typical Operating Characteristics(V IN = +5V for MAX6161–MAX6168, V IN = +5.5V for MAX6165, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)MAX6161OUTPUT VOLTAGE TEMPERATURE DRIFTTEMPERATURE (°C)O U T P U T V O L T A G E (V )70552540-1010-251.24961.24971.24981.24991.25001.25011.25021.25031.25041.25051.2495-4085MAX6165OUTPUT VOLTAGE TEMPERATURE DRIFTTEMPERATURE (°C)O U T P U T V O L T A G E (V )7055-25-102510404.99854.99904.99955.00005.00055.00105.00155.00204.9980-4085MAX6161LONG-TERM DRIFTM A X 6161/68 t o c 03TIME (hrs)D R I F T (p p m )768192384576-30-20-100102030405060-40960MAX6165LONG-TERM DRIFTM A X 6161/68 t o c 04TIME (hrs)D R I F T (p p m )768192384576-90-80-70-60-50-40-30-20-100-100960-300-200-100010020030024681012MAX6161LINE REGULATIONINPUT VOLTAGE (V)O U T P U T V O L T A G E C H A N G E (μV )-1200-600-800-1000-400-20002005971113MAX6165LINE REGULATIONINPUT VOLTAGE (V)O U T P U T V O L T A G E C H A N G E (μV )-310-1-22345-4-224LOAD CURRENT (mA)O U T P U T V O L T A G E C H A N G E (m V)MAX6161LOAD REGULATION-620-2-44861012-6-2-4246LOAD CURRENT (mA)O U T P U T V O L T A G E C H A N G E (m V )MAX6165LOAD REGULATION0.100.050.200.150.250.30021345MAX6166DROPOUT VOLTAGE vs. LOAD CURRENTLOAD CURRENT (mA)D R O P O U T V O L T A GE (V )MAX6161–MAX6168Output-Current, SO-8 Voltage References______________________________________________________________________________________11Typical Operating Characteristics (continued)(V IN = +5V for MAX6161–MAX6168, V IN = +5.5V for MAX6165, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)00.050.150.100.200.2521345LOAD CURRENT (mA)D R O P O U T V O L T A GE (V )MAX6165DROPOUT VOLTAGE vs. LOAD CURRENTM A X 6161/68 t o c 11FREQUENCY (kHz)P S R R (d B )0-10-20-30-40-50-60-70-80-900.0011101000.010.11000MAX6161POWER-SUPPLY REJECTION RATIOvs. FREQUENCY-70-800.001101000-60-50-40-30-20-100FREQUENCY (kHz)P S R R (d B )0.1MAX6165POWER-SUPPLY REJECTION RATIOvs. FREQUENCYM A X 6161/68 t c 12MAX6161SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (μA )1210864108116124132140148156164172180100214MAX6165SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (μA )1312101178969610210811412012613213814415090514MAX6161SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (μA )603510-15108116124132140148156164172180100-4085MAX6165SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (μA )603510-159610210811412012613213814415090-408500.00110100040206080100140120160180200220M A X 6161/68 t o c 17FREQUENCY (kHz)O U T P U T I M P E D A N C E (Ω)0.1MAX6161OUTPUT IMPEDANCE vs. FREQUENCY1800.00110100040206010080120140160M A X 6161/68 t o c 18FREQUENCY (kHz)O U T P U T I M P E D A N C E (Ω)0.1MAX6165OUTPUT IMPEDANCE vs. FREQUENCYM A X 6161–M A X 6168Output-Current, SO-8 Voltage References 12______________________________________________________________________________________Typical Operating Characteristics (continued)(V IN = +5V for MAX6161–MAX6168, V IN = +5.5V for MAX6165, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)V OUT 10μV/div 1s/div MAX61610.1Hz TO 10Hz OUTPUT NOISEM A X 6161/68 t o c 19V OUT 10μV/div1s/divMAX6165NOISEM A X 6161/68 t o c 20V OUT 500mV/divV IN 5V/div10μs/divMAX6161TURN-ON TRANSIENT(C L = 50pF)M A X 6161/68 t o c 21V OUT 2V/divV IN 5V/div40μs/divMAX6165TURN-ON TRANSIENT(C L = 50pF)M A X 6161/67 t o c 22I OUT 500μA/divV OUTAC-COUPLED 100mV/div400μs/div MAX6161LOAD TRANSIENT(I OUT = ±250μA, V IN = 5.0, C L = 0)+250μA -250μAMAX6161/68 toc23I OUT 500μA/divV OUTAC-COUPLED50mV/div400μs/divMAX6165LOAD TRANSIENT(I OUT = ±250μA, C L = 0, V IN = 5.5V)+250μA -250μAMAX6161/68 toc24MAX6161–MAX6168Output-Current, SO-8 Voltage References______________________________________________________________________________________13I OUT 5mA/divV OUTAC-COUPLED50mV/div400μs/divMAX6165LOAD TRANSIENT(C L = 0, I OUT = ±2mA, V IN = 5.5V)+2mA -2mAMAX6161/68 toc28I OUT 5mA/divV OUTAC-COUPLED 100mV/div 400μs/div MAX6161LOAD TRANSIENT(V IN = 5.0V, C L = 0, I OUT = ±2mA)+2mA-2mAMAX6161/68 toc27I OUT 5mA/divV OUTAC-COUPLED50mV/div400μs/divMAX6161LOAD TRANSIENT(V IN = 5.0V, C L = 1μF, I OUT = ±2mA)+2mA-2mAMAX6161/68 toc29I OUT 5mA/divV OUTAC-COUPLED20mV/div400μs/divMAX6165LOAD TRANSIENT(C L = 1μF, I OUT = ±2mA, V IN = 5.5V)+2mA-2mAMAX6161/68 toc30I OUT 500μA/divV OUTAC-COUPLED10mV/div 400μs/div MAX6161LOAD TRANSIENT(I OUT = ±250μA, V IN = 5.0V, C L = 1μF)+250μA -250μAMAX6161/68 toc25I OUT 500μA/divV OUTAC-COUPLED20mV/div400μs/divMAX6165LOAD TRANSIENT(I OUT = ±250μA, C L = 1μF, V IN = 5.5V)+250μA-250μAMAX6161/68 toc26Typical Operating Characteristics (continued)(V IN = +5V for MAX6161–MAX6168, V IN = +5.5V for MAX6165, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)M A X 6161–M A X 6168Output-Current, SO-8 Voltage References 14______________________________________________________________________________________I OUT 5mA/divV OUTAC-COUPLED50mV/div 400μs/div MAX6161LOAD TRANSIENT(V IN = 5.0V, C L = 1μF, I OUT = ±4mA)+4mA-4mAMAX6161/68 toc33I OUT 5mA/divV OUTAC-COUPLED50mV/div400μs/divMAX6165LOAD TRANSIENT(I OUT = ±5mA, C L = 1μF, V IN = 5.5V)+5mA-5mAMAX6161/68 toc34V IN500mV/divV OUTAC-COUPLED20mV/div 40μs/div MAX6161LINE TRANSIENT(C L = 0)+0.25V-0.25VMAX6161/68 toc35V IN500mV/divV OUTAC-COUPLED20mV/div40μs/divMAX6165LINE TRANSIENT(C L = 0)+0.25V -0.25VMAX6161/68 toc36Note 5:Many of the Typical Operating Characteristics of the MAX6161 family are extremely similar. The extremes of these characteristicsare found in the MAX6161 (1.25V output) and the MAX6165 (5.0V output). The Typical Operating Characteristics of the remain-der of the MAX6161 family typically lie between these two extremes and can be estimated based on their output voltages.Typical Operating Characteristics (continued)(V IN = +5V for MAX6161–MAX6168, V IN = +5.5V for MAX6165, I OUT = 0, T A = +25°C, unless otherwise noted.) (Note 5)I OUT 5mA/divV OUTAC-COUPLED 200mV/div400μs/div MAX6161LOAD TRANSIENT(V IN = 5.0V, C L = 0, I OUT = ±4mA)+4mA-4mAMAX6161/68 toc31I OUT 5mA/divV OUTAC-COUPLED 100mV/div400μs/divMAX6165LOAD TRANSIENT(I OUT = ±5mA, C L = 0, V IN = 5.5V)+5mA-5mAMAX6161/68 toc32MAX6161–MAX6168Output-Current, SO-8 Voltage References______________________________________________________________________________________15Applications InformationInput BypassingF or the best line-transient performance, decouple the input with a 0.1µF ceramic capacitor as shown in the Typical Operating Circuit . Locate the capacitor as close to IN as possible. When transient performance is less important, no capacitor is necessary.Output/Load CapacitanceDevices in the MAX6161 family do not require an output capacitor for frequency stability. In applications where the load or the supply can experience step changes,an output capacitor of at least 0.1µF will reduce the amount of overshoot (undershoot) and improve the cir-cuit’s transient response. Many applications do not require an external capacitor, and the MAX6161 family can offer a significant advantage in applications when board space is critical.Supply CurrentThe quiescent supply current of the series-mode MAX6161 family is typically 100µA and is virtually inde-pendent of the supply voltage, with only an 8µA/V (max) variation with supply voltage. Unlike series refer-ences, shunt-mode references operate with a series resistor connected to the power supply. The quiescent current of a shunt-mode reference is thus a function of the input voltage. Additionally, shunt-mode references have to be biased at the maximum expected load cur-rent, even if the load current is not present at the time.In the MAX6161 family, the load current is drawn from the input voltage only when required, so supply current is not wasted and efficiency is maximized at all input voltages. This improved efficiency reduces power dissi-pation and extends battery life.When the supply voltage is below the minimum speci-fied input voltage (as during turn-on), the devices can draw up to 400µA beyond the nominal supply current.The input voltage source must be capable of providing this current to ensure reliable turn-on.Output Voltage HysteresisOutput voltage hysteresis is the change in the input voltage at T A = +25°C before and after the device is cycled over its entire operating temperature range.Hysteresis is caused by differential package stress appearing across the bandgap core transistors. The typical temperature hysteresis value is 125ppm.Turn-On TimeThese devices typically turn on and settle to within 0.1% of their final value in 50µs to 300µs, depending on the output voltage (see electrical table of part used).The turn-on time can increase up to 1.5ms with the device operating at the minimum dropout voltage and the maximum load.Typical Operating Circuit__________________________Chip Information TRANSISTOR COUNT: 117PROCESS: BiCMOSPin DescriptionPIN NAME FUNCTIONNo Connection. Not internally connected.N.C.1, 3, 5, 7, 82IN Input Voltage GroundGND 46OUTReference OutputM A X 6161–M A X 6168Output-Current, SO-8 Voltage References 16______________________________________________________________________________________Selector GuideMAX6161–MAX6168Maxim cannot assume responsibility f or use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600_____________________17©2005 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products, Inc.S O I C N .E P SOutput-Current, SO-8 Voltage ReferencesPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

MAX1631的引脚说明PIN1：CSH3。

3.3V SMPS（开关电源Switch Mode Power Supply )电流检测输入，以CSL3为参考限流电平为100mV。

PIN2：CSL3。

电流检测输入。

常在固定输出模式里作为反馈输入。

PIN3：FB3。

3.3V SMPS的反馈输入；将FB3调整在REF（约2.5V）时为输出可调模式。

当FB3接地时，为固定3.3V输出。

当FB3连接一个分压电阻时为输出可调节模式。

PIN4：对MAX1630、MAX1632来说，此脚为12V输出。

可往外提供12V，120mA的电压。

但要外接一个1uF电容。

对MAX1631来说，此脚为STEER。

次级反馈的逻辑控制输入。

用来选择PWM采用那路变压器和次级反馈信号。

当STEER为GND时，SECFB（secondary feedback次级反馈采用3.3V 变压器次级反馈。

当STEER为VL时，SECFB采用5V 变压器次级反馈。

PIN5：对MAX1630、MAX1632，VDD。

内置线性12V的电源。

对MAX1631，SECFB，次级线圈反馈输入。

通常从辅助输出连接一个电阻分压器。

SECFB调整在。

当接时为不采用。

2.5V VLPIN6：SYNC，振荡同步和频率选择。

连接到VL时工作在300kHZ；接地工作在200kHZ。

当有外接同步时时钟范围可在240kHZ至350Khz。

PIN7：TIME/ON5，具有双用途，用作定时电容引脚和开关控制输入。

PIN8：GND，低噪音模拟地和反馈参考点。

PIN9：REF，2.5V参考电压输出。

接1uF电容至地。

PIN10：SKIP#。

逻辑控制输入。

当为高电平时取消空闲模式。

接地为正常模式。

PIN11：RESET#，低电平有效的定时复位输出。

RESET#在地至VL之间变化。

在上电后的32,000个周32000期变高电平。

PIN12：FB5，5V SMPS反馈输入；调整到FB5=REF（约2.5V）工作输出可调整模式。

EFR32MG12 2.4 GHz 19 dBm Radio Board BRD4161A Reference ManualRADIO BOARD FEATURES•Wireless SoC:EFR32MG12P432F1024GL125•CPU core: ARM Cortex ®-M4 with FPU •Flash memory: 1024 kB •RAM: 256 kB•Operation frequency: 2.4 GHz •Transmit power: 19 dBm•Integrated PCB antenna, UFL connector (optional).•Touch Slider•Crystals for LFXO and HFXO: 32.768 kHz and 38.4 MHz.The BRD4161A Mighty Gecko Radio Board enables developers to develop Zigbee ®, Thread,Bluetooth ® low energy and proprietary wireless applications. The board con-tains a Mighty Gecko Wireless System on Chip 2.4 GHz and optimized for operation with 19 dBm output power. With the on-board printed antenna and RF connector radi-ated and conducted testing is supported.The BRD4161A Mighty Gecko Radio Board plugs into the Wireless Starter Kit Main-board provided with the Mighty Gecko Starter Kit to get access to display, buttons and additional features from Expansion Boards. With the supporting Simplicity Studio suite of tools, developers can take advantage of graphical wireless application development; mesh networking debug and packet trace; and visual energy profiling and optimization. The board also serves as an RF reference design for applications targeting 2.4 GHz wireless operation with 19 dBm output power.This document contains brief introduction and description of the BRD4161A Radio Board features focusing on the RF sections and performance.| Smart. Connected. Energy-friendly.Rev. 1.00Introduction 1. IntroductionThe EFR32 Mighty Gecko Radio Boards provide a development platform (together with the Wireless Starter Kit Mainboard) for the Silicon Labs EFR32 Mighty Gecko Wireless System on Chips and serve as reference designs for the matching network of the RF inter-face.The BRD4161A Radio Board is designed to operate in the 2400-2483.5 MHz band with the RF matching network optimized to operate with 19 dBm output power.To develop and/or evaluate the EFR32 Mighty Gecko, the BRD4161A Radio Board can be connected to the Wireless Starter Kit Main-board to get access to display, buttons and additional features from Expansion Boards and also to evaluate the performance of the RF interface.2. Radio Board Connector2.1 IntroductionThe board-to-board connector scheme allows access to all EFR32MG12 GPIO pins as well as the RESETn signal. For more informa-tion on the functions of the available pin functions, see the EFR32MG12 data sheet.2.2 Radio Board Connector Pin AssociationsThe figure below shows the pin mapping on the connector to the radio pins and their function on the Wireless Starter Kit Mainboard.GNDF9 / PA3 / VCOM_RTS 3v3VCOM_RTS / PA3 / P36P200Upper RowNC / P38NC / P40PF9 / P42PF11 / P44DEBUG.TMS_SWDIO / PF1 / F0DISP_ENABLE / PD15 / F14UIF_BUTTON0 / PF6 / F12UIF_LED1 / PF4 / F10VCOM_CTS / PA2 / F8DEBUG.RESET / RADIO_#RESET / F4DEBUG.TDO_SWO / PF2 / F2DISP_SI / PC6 / F16VCOM_TXD / PA0 / F6PTI_DATA / PB12 / F20DISP_EXTCOMIN / PD13 / F18USB_VBUS5VBoard ID SCLGNDBoard ID SDAUSB_VREG F7 / PA1 / VCOM_RXD F5 / PA5 / VCOM_ENABLE F3 / PF3 / DEBUG.TDIF1 / PF0 / DEBUG.TCK_SWCLK P45 / PF12P43 / PF10P41 / PF8P39 / NC P37/ PB10 / SENSOR_ENABLE F11 / PF5 / UIF_LED1F13 / PF7 / UIF_BUTTON1F15 / PC8 / DISP_SCLK F17 / PD14 / DISP_SCS F19 / PB13 / PTI_FRAME F21 / PB11 / PTI_CLK GND VMCU_IN PD8 / P0P201Lower RowPD9 / P2PD10 / P4PD11 / P6GNDNCP35 / PA2 / VCOM_CTS P7 / PA9P5 / PA8P3 / PA7P1 / PA6P33 / PA0 / VCOM_TXD P31 / PK2P29 / PK0P27 / PJ14P25 / PI2P23 / PI0P21 / PF14P19 / NC P17 / PC5P15 / PB9P13 / PC11P11 / PB7P9 / PB6VCOM_RXD / P34 / P34BODEN / P32PK1/ P30PJ15 / P28PI3 / P26PI1 / P24PF15 / P22PF13 / P20NC / P18PC4 / P16PB8 / P14PC10 / P12PC9 / P10PD12 / P8Figure 2.1. BRD4161A Radio Board Connector Pin MappingRadio Board Connector3. Radio Board Block Summary3.1 IntroductionThis section gives a short introduction to the blocks of the BRD4161A Radio Board.3.2 Radio Board Block DiagramThe block diagram of the EFR32MG Radio Board is shown in the figure below.Figure 3.1. BRD4161A Block Diagram3.3 Radio Board Block Description3.3.1 Wireless MCUThe BRD4161A Mighty Gecko Radio Board incorporates an EFR32MG12P432F1024GL125 Wireless System on Chip featuring 32-bit Cortex®-M4 with FPU core, 1024 kB of flash memory and 256 kB of RAM and a 2.4 GHz band transceiver with output power up to 19 dBm. For additional information on the EFR32MG12P432F1024GL125, refer to the EFR32MG12 Data Sheet.3.3.2 LF Crystal Oscillator (LFXO)The BRD4161A Radio Board has a 32.768 kHz crystal mounted.3.3.3 HF Crystal Oscillator (HFXO)The BRD4161A Radio Board has a 38.4 MHz crystal mounted.| Smart. Connected. Energy-friendly.Rev. 1.00 | 33.3.4 Matching Network for 2.4 GHzThe BRD4161A Radio Board incorporates a 2.4 GHz matching network which connects the 2.4 GHz TRX pin of the EFR32MG12 to the one on-board printed Inverted-F antenna. The component values were optimized for the 2.4 GHz band RF performace and current con-sumption with 19 dBm output power.For detailed description of the matching network, see Chapter 4.2.1 Description of the 2.4 GHz RF Matching.3.3.5 Inverted-F AntennaThe BRD4161A Radio Board includes a printed Inverted-F antenna (IFA) tuned to have close to 50 Ohm impedance at the 2.4 GHz band.For detailed description of the antenna see Chapter 4.5 Inverted-F Antenna.3.3.6 UFL ConnectorTo be able to perform conducted measurements, Silicon Labs added an UFL connector to the Radio Board. The connector allows an external 50 Ohm cable or antenna to be connected during design verification or testing.Note: By default the output of the matching network is connected to the printed Inverted-F antenna by a series component. It can be connected to the UFL connector as well through a series 0 Ohm resistor which is not mounted by default. For conducted measurements through the UFL connector the series component to the antenna should be removed and the 0 Ohm resistor should be mounted (see Chapter 4.2 Schematic of the RF Matching Network for further details).3.3.7 Radio Board ConnectorsTwo dual-row, 0.05” pitch polarized connectors make up the EFR32MG Radio Board interface to the Wireless Starter Kit Mainboard. For more information on the pin mapping between the EFR32MG12P432F1024GL125 and the Radio Board Connector, refer to Chapter 2.2 Radio Board Connector Pin Associations.3.3.8 Capacitive Touch SliderThe touch slider (T2) utilizes the capacitive touch capability of the Capacitance Sense Module of the EFR32MG12. The slider interpo-lates 4 separate pads to find the exact position of a finger.The figure below shows the pin mapping of the touch slider to the Wireless SoC.Wireless SoCFigure 3.2. Touch Slider Pin MappingRev. 1.00 | 44. RF Section4.1 IntroductionThis section gives a short introduction to the RF section of the BRD4161A.4.2 Schematic of the RF Matching NetworkThe schematic of the RF section of the BRD4161A Radio Board is shown in the following figure.2.4 GHz Matching 2.4 GHz RF OutputSelection & Inverted-F AntennaFigure 4.1. Schematic of the RF Section of the BRD4161A4.2.1 Description of the 2.4 GHz RF MatchingThe 2.4 GHz matching connects the 2G4RF_IOP pin to the on-board printed Inverted-F Antenna. The 2G4RF_ION pin is connected to ground. For higher output powers (13 dBm and above), besides the impedance matching circuitry, it is recommended to use additional harmonic filtering as well at the RF output. The targeted output power of the BRD4161A board is 19 dBm. Therefore, the RF output of the IC is connected to the antenna through a four-element impedance matching and harmonic filter circuitry.For conducted measurements the output of the matching network can also be connected to the UFL connector by removing the series R1 component between the antenna and the output of the matching and adding a 0 Ohm resistor to the R2 resistor position between the output of the matching and the UFL connector.4.3 RF Section Power SupplyOn the BRD4161A Radio Board the power supply pins of the RF section (RFVDD, PAVDD) are directly connected to the output of the on-chip DC-DC converter. This way, by default, the DC-DC converter provides 1.8 V for the entire RF section (for details, see the sche-matic of the BRD4161A).4.4 Bill of Materials for the 2.4 GHz MatchingThe Bill of Materials of the 2.4 GHz matching network of the BRD4161A Radio Board is shown in the following table.| Smart. Connected. Energy-friendly.Rev. 1.00 | 5Table 4.1. Bill of Materials for the BRD4161A 2.4GHz RF Matching Network4.5 Inverted-F AntennaThe BRD4161A Radio Board includes an on-board printed Inverted-F Antenna tuned for the 2.4 GHz band. Due to the design restric-tions of the Radio Board, the input of the antenna and the output of the matching network can't be placed directly next to each other. As a result, a 50 Ohm transmission line was necessary to connect them. With the actual line length the impedance of the antenna at the double-harmonic frequency is transformed closer to a "critical load impedance range" resulting in the radiated level of the harmonic increases.To reduce the harmonic radiation a tuning component was used between the matching network output and the antenna input. For the actual Radio Board design (with the actual transmission line length) a small value inductor was used (instead of the R1 resistor with value of 1.8 nH) to transform the impedance at the double-frequency harmonic away from the critical region while keeping the impe-dance at the funamental close to 50 Ohm. With this the suppression of the radiated double-frequency harmonic increases by approxi-mately 3-4 dB. The resulting impedance and reflection measured at the output of the matcing network are shown in the following figure. As it can be observed the impedance is close to 50 Ohm (the reflection is better than -10 dB) for the entire 2.4 GHz band.Figure 4.2. Impedance and Reflection of the Inverted-F Antenna of the BRD4161A Board Measured from the Matching Output Note: The same value and type of 1.8 nH inductor was used as the one in the matching network (L1). | Smart. Connected. Energy-friendly.Rev. 1.00 | 65. Mechanical DetailsThe BRD4161A Mighty Gecko Radio Board is illustrated in the figures below.Figure 5.1. BRD4161A Top View24 mmConnectorConnector Figure 5.2. BRD4161A Bottom ViewMechanical DetailsRev. 1.00 | 7EMC Compliance 6. EMC Compliance6.1 IntroductionCompliance of the fundamental and harmonic levels is tested against the following standards:• 2.4 GHz:•ETSI EN 300-328•FCC 15.2476.2 EMC Regulations for 2.4 GHz6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz BandBased on ETSI EN 300-328 the allowed maximum fundamental power for the 2400-2483.5 MHz band is 20 dBm EIRP. For the unwan-ted emissions in the 1 GHz to 12.75 GHz domain the specified limit is -30 dBm EIRP.6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz BandFCC 15.247 allows conducted output power up to 1 Watt (30 dBm) in the 2400-2483.5 MHz band. For spurious emmissions the limit is -20 dBc based on either conducted or radiated measurement, if the emission is not in a restricted band. The restricted bands are speci-fied in FCC 15.205. In these bands the spurious emission levels must meet the levels set out in FCC 15.209. In the range from 960 MHz to the frequency of the 5th harmonic it is defined as 0.5 mV/m at 3 m distance (equals to -41.2 dBm in EIRP).Additionally, for spurious frequencies above 1 GHz, FCC 15.35 allows duty-cycle relaxation to the regulatory limits. For the EmberZNet PRO the relaxation is 3.6 dB. Therefore, the -41.2 dBm limit can be modified to -37.6 dBm.If operating in the 2400-2483.5 MHz band the 2nd, 3rd and 5th harmonics can fall into restricted bands. As a result, for those the -37.6 dBm limit should be applied. For the 4th harmonic the -20 dBc limit should be applied.6.2.3 Applied Emission Limits for the 2.4 GHz BandThe above ETSI limits are applied both for conducted and radiated measurements.The FCC restricted band limits are radiated limits only. Besides that, Silicon Labs applies those to the conducted spectrum i.e., it is assumed that, in case of a custom board, an antenna is used which has 0 dB gain at the fundamental and the harmonic frequencies. In that theoretical case, based on the conducted measurement, the compliance with the radiated limits can be estimated.The overall applied limits are shown in the table below.Table 6.1. Applied Limits for Spurious Emissions for the 2.4 GHz Band | Smart. Connected. Energy-friendly.Rev. 1.00 | 87. RF Performance7.1 Conducted Power MeasurementsDuring measurements, the EFR32MG Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the Radio Board was 3.3 V.7.1.1 Conducted Measurements in the 2.4 GHz bandThe BRD4161A board was connected directly to a Spectrum Analyzer through its UFL connector (the R1 component was removed and a 0 Ohm resistor was soldered to the R2 resistor position). During measurements, the voltage supply for the board was 3.3 V provided by the mainboard. The supply for the radio (RFVDD) was 1.8 V provided by the on-chip DC-DC converter, the supply for the power amplifier (PAVDD) was 3.3 V (for details, see the schematic of the BRD4161A). The transceiver was operated in continuous carrier transmission mode. The output power of the radio was set to 19 dBm.The typical output spectrum is shown in the following figure.Figure 7.1. Typical Output Spectrum of the BRD4161AAs it can be observed, the fundamental is slightly lower than 19 dBm limit and the strongest unwanted emission is the double-frequency harmonic and it is under the -37.6 dBm applied limit.Note: The conducted measurement is performed by connecting the on-board UFL connector to a Spectrum Analyzer through an SMA Conversion Adapter (P/N: HRMJ-U.FLP(40)). This connection itself introduces approximately 0.3 dB insertion loss.RF PerformanceRev. 1.00 | 97.2 Radiated Power MeasurementsDuring measurements, the EFR32MG Radio Board was attached to a Wireless Starter Kit Mainboard which was supplied by USB. The voltage supply for the Radio Board was 3.3 V. The radiated power was measured in an antenna chamber by rotating the DUT 360degrees with horizontal and vertical reference antenna polarizations in the XY , XZ and YZ cuts. The measurement axes are shown inthe figure below.Figure 7.2. DUT: Radio Board with the Wireless Starter Kit Mainboard (Illustration)Note: The radiated measurement results presented in this document were recorded in an unlicensed antenna chamber. Also the radi-ated power levels may change depending on the actual application (PCB size, used antenna, and so on). Therefore, the absolute levels and margins of the final application are recommended to be verified in a licensed EMC testhouse.7.2.1 Radiated Measurements in the 2.4 GHz bandFor the transmitter antenna the on-board printed Inverted-F antenna of the BRD4161A board was used (the R1 component was moun-ted). During measurements, the board was attached to a Wireless Starter Kit Mainboard (BRD4001 (Rev. A02) ) which was supplied through USB. During the measurements the voltage supply for the board was 3.3 V provided by the mainboard. The supply for the radio (RFVDD) was 1.8 V provided by the on-chip DC-DC converter, the supply for the power amplifier (PAVDD) was 3.3 V (for details, see the schematic of the BRD4161A). The transceiver was operated in continuous carrier transmission mode. The output power of the radio was set to 19 dBm based on the conducted measurement.The results are shown in the table below.Table 7.1. Maximums of the measured radiated powers in EIRP [dBm]As it can be observed, thanks to the high gain of the Inverted-F antenna, the level of the fundamental is higher than 19 dBm. The stron-gest harmonic is the double-frequency one and thanks to the additional suppression provided by the instead of the R1 resistor its level is under -50 dBm.RF PerformanceEMC Compliance Recommendations 8. EMC Compliance Recommendations8.1 Recommendations for 2.4 GHz ETSI EN 300-328 complianceAs it was shown in the previous chapter, the radiated power of the fundamental of the BRD4161A Mighty Gecko Radio Board complies with the 20 dBm limit of the ETSI EN 300-328 in case of the conducted measurement but due to the high antenna gain the radiated power is higher than the limit by 2 dB. In order to comply, the output power should be reduced (with different antennas, depending on the gain of the used antenna, the necessary reduction can be different). The harmonic emissions are under the -30 dBm limit. Although the BRD4161A Radio Board has an option for mounting a shielding can, that is not required for the compliance.8.2 Recommendations for 2.4 GHz FCC 15.247 complianceAs it was shown in the previous chapter, the radiated power of the fundamental of the BRD4161A Mighty Gecko Radio Board complies with the 30 dBm limit of the FCC 15.247. The harmonic emissions are under the -37.6 dBm applied limit both in case of the conducted and the radiated measurements. Although the BRD4161A Radio Board has an option for mounting a shielding can, that is not required for the compliance.Document Revision History 9. Document Revision HistoryTable 9.1. Document Revision HistoryBoard Revision History 10. Board Revision HistoryTable 10.1. BRD4161A Radio Board RevisionsErrata 11. ErrataThere are no known errata at present.Table of Contents1. Introduction (1)2. Radio Board Connector (2)2.1 Introduction (2)2.2 Radio Board Connector Pin Associations (2)3. Radio Board Block Summary (3)3.1 Introduction (3)3.2 Radio Board Block Diagram (3)3.3 Radio Board Block Description (3)3.3.1 Wireless MCU (3)3.3.2 LF Crystal Oscillator (LFXO) (3)3.3.3 HF Crystal Oscillator (HFXO) (3)3.3.4 Matching Network for 2.4 GHz (4)3.3.5 Inverted-F Antenna (4)3.3.6 UFL Connector (4)3.3.7 Radio Board Connectors (4)3.3.8 Capacitive Touch Slider (4)4. RF Section (5)4.1 Introduction (5)4.2 Schematic of the RF Matching Network (5)4.2.1 Description of the 2.4 GHz RF Matching (5)4.3 RF Section Power Supply (5)4.4 Bill of Materials for the 2.4 GHz Matching (5)4.5 Inverted-F Antenna (6)5. Mechanical Details (7)6. EMC Compliance (8)6.1 Introduction (8)6.2 EMC Regulations for 2.4 GHz (8)6.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz Band (8)6.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz Band (8)6.2.3 Applied Emission Limits for the 2.4 GHz Band (8)7. RF Performance (9)7.1 Conducted Power Measurements (9)7.1.1 Conducted Measurements in the 2.4 GHz band (9)7.2 Radiated Power Measurements (10)7.2.1 Radiated Measurements in the 2.4 GHz band (10)8. EMC Compliance Recommendations (11)8.1 Recommendations for 2.4 GHz ETSI EN 300-328 compliance (11)8.2 Recommendations for 2.4 GHz FCC 15.247 compliance (11)9. Document Revision History (12)10. Board Revision History (13)11. Errata (14)Table of Contents (15)Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfolio /IoTSW/HW/simplicityQuality/qualitySupport and CommunityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. 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3.20.126ASSEMBLED FRONT VIEWBOTTOM HEATSINK APPLICATION SEE NOTE 26123 CHIP SHOWN HERETHERMAL INTERFACE SEE NOTE 3(A) OR 3(B)OPTION:SCREW (40578)INSTALLED FROM BOTTOM SIDE OF PCB.TORQUE TO 3 IN-LBS.(2) PL.SEE NOTE 2OPTION:LOCATING/GROUNDINGPIN (40249)SOLDERED TO PCB(2) PL.SEE NOTE 2TOP HEATSINK APPLICATION SEE NOTES 2 & 3PUSH-PINS SEE NOTE 3,4AND SELECTION TABLEGROUNDING TABS SOLDERED TO PCB SEE NOTE 3NOTES:FOR PCB LAYOUT SEE VICOR APPLICATION DRAWING 40483.1.OPTION: SOLDERED LOCATING/GROUNDING PIN 40249 CAN BE USED IN CONJUNCTION OR2.AS ALTERNATIVE TO SCREW 40578 INSTALLED FROM BACK OF PCB.THE SOLDERING METHOD USED FOR CHIPS (AND OPTIONAL HEATSINK GROUNDING) 3.IS IMPORTANT WHEN SELECTING A THERMAL INTERFACE MATERIAL (TIM).THE PHASE-CHANGE TIM SHOWN IN THESE ILLUSTRATIONS MAY BE DAMAGED BYTEMPERATURES OVER 125C, SO TWO ASSEMBLY PROCEDURES ARE DESCRIBED BELOW: (A) FOR HAND-SOLDERING ONLY,(B) FOR WAVE-SOLDERING AND/OR HAND-SOLDERING.(A) PLACE BOTTOM-SIDE HEATSINK (WITH PRE-ATTACHED PHASE-CHANGE TIM) ON PCB.PLACE CHIP AND TOP-SIDE HEATSINK (WITH PRE-ATTACHED TIM AND GROUNDING TABS).WHILE SUPPORTING PCB, INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB.(SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)IMPORTANT: TO SET FINAL THICKNESS OF PHASE-CHANGE TIM ENSURE THAT THE ENTIRE ASSEMBLY IS RAISED ABOVE 65C FOR SEVERAL MINUTES.HAND-SOLDER ALL CHIP AND GROUNDING PINS. ADDITIONAL SOLDERING IRON HEATMAY BE REQUIRED TO COMPENSATE FOR LOSSES TO THE HEATSINKS.(B) WAVE SOLDERING TEMPERATURES ARE UNSUITABLE FOR PLASTIC PUSH-PINS ANDPHASE-CHANGE TIM, SO VICOR TIM 40325 (PARKER CHOMERICS GEL8010) IS RECOMMENDED.APPLY A UNIFORM .003” (.076MM) LAYER OF TIM 40325 TO THE TOP AND BOTTOM SURFACE OF THE CHIP, OR TO THE CORRESPONDING HEATSINK SURFACES.PLACE BOTTOM-SIDE HEATSINK, CHIP, AND TOP-SIDE HEATSINK ON PCB.WITH A CUSTOM FIXTURE (OR VICOR WAVESOLDER FIXTURE 40416, 40417) APPLY APPROX. 10 LBS LOAD TO THE TOP-SIDE HEATSINK AND THEN WAVE-SOLDER ALL PINS.REMOVE FIXTURE AND INSERT PLASTIC PUSH-PINS THROUGH BOTH HEATSINKS AND PCB. (SELECT PROPER PUSH-PIN LENGTH FROM TABLE ON THIS DRAWING.)CARE SHOULD BE TAKEN TO AVOID FULLY COMPRESSING THE 4.PUSH-PIN SPRING DURING INSTALLATION AS THIS WOULD EXPOSE THE CHIP TO FORCES GREATER THAN THE RECOMMENDED LIMIT OF 3.1 LBF (13.8 N) PER PUSH-PIN.ROHS COMPLIANT PER CST-0001 LATEST REVISION.5.PUSH-PIN SELECTIONHEATSINK OPTIONSREV.DESCRIPTIONINTL DATE APVD 1RELEASE PER E140060REJH01/17/14REWPUSH-PINS W/ SPRINGS (100/BAG)COLORPCB THK NOMINALRANGE PCB THK MINIMUM PCB THK MAXIMUM 32436BLUE1.143 MM TO 1.854 MM[.045"] TO [.073"] 1.041 MM [.041"] 2.057 MM [.081"]32437GRAY1.880 MM TO2.438 MM[.074"] TO [.096"]1.676 MM [.066"]2.692 MM [.106"]HEATSINK TYPEP/N ASSY HEATSINKS, TIM AND GROUND TAB P/N ASSY HEATSINK W/GROUND TAB ONLY SOLDERING METHOD (SEE NOTE 2)-2(A) HAND SOLDERONLY2(B) WITH VICOR 40325THERMAL GEL4623DUAL 11MM 4051940526DUAL 19MM 40408-6123DUAL 11MM 4052040528DUAL 19MM40409-2F72F73B846C84A53CDAVICOR CONFIDENTIAL5ED6B1E1THIS DOCUMENT AND THE DATA DISCLOSED HEREIN OR HEREWITH IS NOT TO BE REPRODUCED, USED ORDISCLOSED IN WHOLE OR IN PART TO ANYONE WITHOUT THE PERMISSION OF VICOR CORP.SCALE TOLERANCES ARE:DECIMALS ANGLES X.XX [X.X] = ±0.01 [0.25] ±1°X.XXX [X.XX] = ±0.005 [0.127]SHEET OFSIZE67131CAGE CODE40191DWG NO1REVDRAWN BYDATE Robert Wasik7/12/2013APP DWG, DUAL HEATSINK,6123, 4623SWDVICORTHIRD ANGLE PROJECTIONDO NOT SCALE DRAWING113:1UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE : INCH / [MM]D。