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MIL-S8TA8-Port 10/100/1000 BASE-T Unmanaged Switch User GuideRev. A22012-09-17Regulatory Approval- FCC Class A- UL 1950- CSA C22.2 No. 950- EN60950- CE- EN55022 Class A- EN55024Canadian EMI NoticeThis Class A digital apparatus meets all the requirements of the Canadian Interference-Causing Equipment Regulations.Cet appareil numerique de la classe A respecte toutes les exigences du Reglement sur le materiel brouilleur du Canada.European NoticeProducts with the CE Marking comply with both the EMC Directive (89/336/EEC) and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community Compliance with these directives imply conformity to the following European Norms:EN55022 (CISPR 22) - Radio Frequency InterferenceEN61000-X - Electromagnetic ImmunityEN60950 (IEC950) - Product SafetyFive-Year Limited WarrantyTransition Networks warrants to the original consumer or purchaser that each of it's products,and all components thereof, will be free from defects in material and/or workmanship for aperiod of five years from the original factory shipment date. Any warranty hereunder isextended to the original consumer or purchaser and is not assignable.Transition Networks makes no express or implied warranties including, but not limited to, anyimplied warranty of merchantability or fitness for a particular purpose, except as expressly setforth in this warranty. In no event shall Transition Networks be liable for incidental orconsequential damages, costs, or expenses arising out of or in connection with theperformance of the product delivered hereunder. Transition Networks will in no case coverdamages arising out of the product being used in a negligent fashion or manner.TrademarksThe MiLAN logo and Transition Networks trademarks are registered trademarks of Transition Networks in the United States and/or other countries.To Contact Transition NetworksFor prompt response when calling for service information, have the following information ready:- Product serial number and revision- Date of purchase- Vendor or place of purchaseYou can reach Transition Networks technical support at:E-mail:**********************Telephone: +1.800.260.1312 x 200Fax: +1.952.941.2322Transition Networks6475 City West ParkwayEden Prairie, MN 55344United States of AmericaTelephone: +1.800.526.9267Fax: : +1.952.941.2322*******************© Copyright 2006 Transition NetworksThis equipment has been tested and found to comply with the limits for a class A device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a commercial installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with instructions, may cause harmful interference on radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case, the user will be requires to correct the interference at the user’s own expense.Content Introduction (1)Features (1)Package Contents (2)Hardware Description (3)Physical Dimensions (3)Front Panel (3)LEDs Indicators (3)Rear Panel (4)Installation (6)Attaching Rubber Feet (6)Mounting on the Wall (6)Power On (7)Technical Specification (8)IntroductionThe 8-port 10/100/1000BASE-T Switch with Auto MDI/MDIX is an unmanaged multi-port Switch that can be used to build high-performance switched networks. This switch is a store-and-forward device that offers low latency for high-speed networking. The Switch is designed for the core of the network backbone computing environment to solve traffic block problems at SME (small, medium enterprise) businesses.The 8-port 10/100/1000BASE-T Switch features a “store-and-forward”switching technology. This allows the switch to auto-learn and store source addresses in an 8K-entry MAC address table.Features⏹Conforms to IEEE 802.3, 802.3u, 802.3ab and 802.3x⏹8 Gigabit copper SOHO switch, compact size with universal internalpower⏹Auto-MDIX on all ports⏹16 Gbps back-plane⏹ N-Way Auto-Negotiation⏹8K MAC address table⏹Back pressure half duplex⏹Flow control full duplex⏹ Store-and-Forward switching architecture⏹ 144Kbytes memory buffer⏹True non-blocking switching⏹Support 8Kbytes Jumbo Frame1Package ContentsUnpack the contents of the switch and verify them against the checklist below.⏹ 8-port Switch⏹Power Cord.⏹User Guide.8-port Switch Power Cord User manualPackage ContentCompare the contents of your switch package with the standard checklist above. If any item is missing or damaged, please contact your local dealerfor service.23Hardware DescriptionPhysical DimensionsThe physical dimensions of the Switch is 165mm x 100mm x 32.5 mm (L x W x H)Front PanelThe front panel of the 8-Port Gigabit switch consists of LED-indicators (100/1000, Link/Activity, Full duplex/Collision) for each Gigabit port and power LED-indicator for unit.RJ-45 Ports (Auto MDI/MDIX): 8 10/100/1000 N-way auto-sensing for 10Base-T, 100Base-TX or 1000Base-T connections. (In general, MDI means connecting to another Hub or Switch while MDIX means connecting to a workstation or PC. Therefore, Auto MDI/MDIX allows you to connect to another Switch or workstation without changing to non-crossover or crossover cabling.)LEDs IndicatorsThe LED Indicators gives real-time information of systematic operation status. The following table provides descriptions of LED status and their meaning.Green PowerOnOff Power is not connectedGreen The port is operating at the speed of 1000Mbps.Orange The port is operating at the speed of 100Mbps.Off No device attached or in 10Mbps modeGreen The port is connecting with the device.Blinking The port is receiving or transmitting data.Off Nodeviceattached.Orange The port is operating in Full-duplex mode.Blinking Packet collision occurred on this port.Off No device attached or in half-duplex mode. Rear PanelThe rear panel of the 8-port Gigabit Switch consists of 8 auto-negotiation 10/100/1000Mbps Ethernet RJ-45 connectors (support Automatic4MDI/MDIX function).RJ-45 Ports (Auto MDI/MDIX): 8 port auto-negotiation 10/100/1000 Mbps Ethernet RJ-45 connectors[Auto MDI/MDIX means that you can connect to another Switch or workstation without changing non-crossover or crossover cabling.]5InstallationThis section shows the installation procedures of the switch.Set the Switch on a sufficiently large flat space with a power outlet nearby.The surface where you put your Switch should be clean, smooth, level, and sturdy. Make sure there is enough clearance around the Switch to allow attachment of cables, power cord and air circulation.Attaching Rubber FeetA. Make sure mounting surface on the bottom of the Switch is grease anddust free.B. Remove adhesive backing from your Rubber Feet.C. Apply the Rubber Feet to each corner on the bottom of the Switch.These footpads can prevent the Switch from shock/vibration. Mounting on the WallThe switch can be mounted on the wall. The switch has two wallmountbrackets included in the package.Power OnConnect the cord of power to the power socket on the rear panel of the Switch. The other side of power cord connects to the power outlet. Check the power indicator on the upper panel to see if power is properly supplied.7Technical SpecificationThe following table provides the technical specification of 8-ports Gigabit Switch.IEEE 802.3 10BASE-T EthernetIEEE 802.3u 100BASE-TX Fast EthernetIEEE 802.3ab Gigabit EthernetIEEE 802.3x Flow Control and Back-pressureCSMA/CDStore-and-Forward switching architecture14,880 pps for 10Mbps148,800 pps for 100Mbps1,488,000 pps for 1000MbpsRJ-45; Auto-MDIX on all ports8K Mac address table144Kbytes memory bufferSupports 8Kbytes jumbo packet size16Gbps810BASE-T: 2-pair UTP/STP Cat. 3, 4, 5 cable EIA/TIA-568 100-ohm (100m)100BASE-TX: 2-pair UTP/STP CAT. 5 cable EIA/TIA-568 100-ohm (100m)Gigabit Copper: 4 pair UTP/STP CAT. 5 cable EIA/TIA 568 100-ohm (100M)Per port: 100/1000, Link/Activity, Full duplex/ CollisionPer unit: PowerAC 110~240V, 50/60Hz7.6 Watt (maximum)0℃ to 45℃ (32℉ to 113℉)-40℃ to 70℃ (-40℉ to 158℉)10% to 90% (Non-condensing)0% to 95% (Non-condensing)165mm x 100mm x 32.5mm (L x W x H) Compliance with FCC Class A, CE Compliance UL, cUL,CE/EN609509。
Technical Assistance (800) 343-1391 110kV and 15kV DigitalMegohmmetersModels 6550 & 6555► Insulation measurementup to 30T Ω► Test voltages up to 15,000V► Step, ramp & fixed voltagetesting► Multiple test modes: voltageramp and step with “Burn-In”, “Early-Break” and “I-Limit” modes► 3 filter choices to optimize measurement stability► Selectable voltage from40V to 10,000 / 15,000V ► Storage of up to 80,000 measurements► Optically-isolated USBcommunication for data transfer to PC and report generation using DataView ® softwareExpert tools for testing insulation safely & accuratelyIP 54Our products are backed by over 130 years of experience in test and measurement equipment, and encompass the latest international standards for quality and safety.Technical Hotline: (800) 343-13912 Technical Assistance (800) 343-1391Models 6550 & 6555HIGH-END & PORTABLEThe Megohmmeter Models 6550 and 6555 are high-end portable instruments intended for measuring a wide variety of electrical insulation resistance values oncables and devices operating at high voltage. They are packaged in a rugged case that is IP54 rated (cover closed). Test results and configuration information is provided on a graphical LCD screen, as well as exportable throughthe use of the DataView ® software provided. TheMegohmmeters can operate on battery or AC power while testing.These Megohmmeters contribute to the safety ofelectrical installations and equipment. Their operation is managed by microprocessors that acquire, process, display and store the measurements.The Model 6550 makes insulation measurements at voltages up to 10,000 V , the Model 6555 up to 15,000 V .Main Functions:• Detection and measurement of input voltage, frequency, and current prior to running a test.• Quantitative and qualitative insulation measurements.• Measurements at a fixed test voltage of 500, 1000, 2500, 5000, 10,000 or 15,000 V dc .• Measurements at an adjustable test voltagebetween 40 and 15,000 V dc preselected by the user prior to the test. Three preselected test voltages can be stored in the instrument and can be modified as needed prior to starting a test.IP 54• Ramp voltage measurements with a ramp from 40 to 10,000 V or 15,000 V , model dependent. Three ramp profiles can be stored in the instrument. Each ramp profile includes the starting and ending test voltage and the ramp time between the two.• Step voltage measurements with steps from 40 to 10,000 V or 15,000 V , model dependent.Three step voltage profiles can be stored in the instrument. Each contains up to 10 steps that include test voltage and duration.• Three test current choices: Burn-In, Early-Break and I-Limit provide qualitative analysis tools for detection breaks in insulation.• Quality ratio calculations for DAR, PI, and DD are calculated and displayed.• Temperature correction of the measured resistance to a reference temperature.• Capacitance measurement of the device tested.• Residual current measurement.Model 6555 checking insulation resistance on feed cables to a three-phase motor.Technical Assistance (800) 3►► SELECTABLE VOLTAGE FROM 40V TO 10kV / 15kV MODELSINSULATION TESTSTest VoltageAPPLICATIONS► Acceptance testing and preventive maintenance ► Test motors, cables, switchgears and wiring installations4 Technical Assistance (800) 343-1391CONTROL FEATURESFront Panel Features for Models 6550 & 6555Socket for connection to the ACpower and recharging of thebuilt-in batteriesmeasurementbuttonsUSB connector forcommunicationto a PC Seven position access to the fixed voltage, adjustable voltage,ramp and stepLarge, digital, backlit, Models 6550 and 6555 have the same front panel with differences in the display only .5Measurement Results Display AreaDisplay ofResultsTechnical Assistance (800) 5FUNCTIONSModels 6550 & 65556 Technical Assistance (800) 343-1391bargraphterminalsExample of display during measurement.resistanceresistance referred to the reference temperature.cursor Resistance versus time graph.This curve is useful primarily in the case of a measurement in V-RAMP mode.When Timed Run (test with programmed duration) or Timed Run + DD is selected, the duration of the measurement (m:s) can be set.The number of measurements that can be recorded depends on the number of samples stored for each measurement.quality ofof memory white).indicated.T est with programmed durationExample of display before measurement.FUNCTIONAL DISPLAYSSOFTWARE & ANALYSIS SCREENSEasy identification of all stored test results.Real-time display of measurement results.Step voltage set up screen.Technical Assistance (800) 7ORDERING INFORMATION M egohmmeter Model 6550 Ramp, StepV , Variable, Auto DAR/PI/DD, USB w/DataView Megohmmeter Model 6555 Ramp, StepV , Variable, Auto DAR/PI/DD, USB w/DataView AEMC ® Instruments • 15 Faraday Dr. • Dover, NH 03820 USA • (800) 343-1391•Fax(603)742-2346•E-mail:**************Export Department: +1 (603) 749-6434 x520 • Fax +1(603)742-2346•E-mail:***************© Chauvin Arnoux ®, Inc. d.b.a. AEMC ®Instruments Call the AEMC ® Instruments Technical Assistance Hotline for immediate consultation with an applications engineer: (800) 343-1391950.BR-6550-6555_0323 • Printed in the USA M u lt i-p u r p o s e C la m p -O n M e t e r s ca o tl in M E G O H MM E T E R SFo r a ll of y ou r I ns ul at io n Te st in g ne ed s...ch ni ca l H o tl in e: (800) 343-1391.a em c.co mP O W E R Q U A L I T Y Fo rA ll Y ou r Po w er Q ua li ty N ee ds ...Te 43-1391w w w ( Fo r a ll of yo ur G ro un d In te gr ity T es tin g ne ed s...G R O U N D R E S IS TA N C E T E S TE R S Te ch ni ca l H ot lin e: (800) 343-1391w w w .a em c.co mTEST & MEA SUREM ENT INSTR UMEN TSVOLUM E 23WWW.AEM TECHNICA L HOTLINE : (800) 343-1391Family of ProductsTo learn more, visit 。
GigaSPEED XL® 3071E-B ETL Verified Category 6 U/UTP Cable, lowsmoke zero halogen, white jacket, 4 pair count, 1000 ft (305 m) length,reelProduct ClassificationRegional Availability EMEAPortfolio SYSTIMAX®Product Type Twisted pair cableProduct Brand GigaSPEED XL®General SpecificationsProduct Number3071EANSI/TIA Category6Cable Component Type HorizontalCable Type U/UTP (unshielded)Conductor Type, singles SolidConductors, quantity8Jacket Color WhitePairs, quantity4Separator Type BisectorTransmission Standards ANSI/TIA-568.2-D | CENELEC EN 50288-6-1 | ISO/IEC 11801 Class E DimensionsCable Length304.8 m | 1000 ftDiameter Over Insulated Conductor 1.041 mm | 0.041 inDiameter Over Jacket, nominal 5.918 mm | 0.233 inJacket Thickness0.559 mm | 0.022 inConductor Gauge, singles23 AWG13Page ofCross Section DrawingElectrical Specificationsdc Resistance Unbalance, maximum 5 %dc Resistance, maximum7.61 ohms/100 m | 2.32 ohms/100 ftDielectric Strength, minimum2500 VdcMutual Capacitance at Frequency 5.6 nF/100 m @ 1 kHzNominal Velocity of Propagation (NVP)70 %Operating Frequency, maximum300 MHzOperating Voltage, maximum80 VRemote Powering Fully complies with the recommendations set forth by IEEE 802.3bt (Type4) for the safe delivery of power over LAN cable when installed accordingto ISO/IEC 14763-2, CENELEC EN 50174-1, CENELEC EN 50174-2 or TIATSB-184-ASegregation Class cMaterial SpecificationsConductor Material Bare copperInsulation Material PolyolefinJacket Material Low Smoke Zero Halogen (LSZH)Separator Material PolyolefinPage of23Mechanical SpecificationsPulling Tension, maximum11.34 kg | 25 lbEnvironmental SpecificationsInstallation temperature0 °C to +60 °C (+32 °F to +140 °F)Operating Temperature-20 °C to +60 °C (-4 °F to +140 °F)Acid Gas Test Method EN 50267-2-3EN50575 CPR Cable EuroClass Fire Performance B2caEN50575 CPR Cable EuroClass Smoke Rating s1aEN50575 CPR Cable EuroClass Droplets Rating d0EN50575 CPR Cable EuroClass Acidity Rating a1Environmental Space Low Smoke Zero Halogen (LSZH)Smoke Test Method IEC 61034-2Packaging and WeightsCable weight38.097 kg/km | 25.6 lb/kftPackaging Type ReelRegulatory Compliance/CertificationsAgency ClassificationCENELEC EN 50575 compliant, Declaration of Performance (DoP) availableCHINA-ROHS Below maximum concentration valueISO 9001:2015Designed, manufactured and/or distributed under this quality management system REACH-SVHC Compliant as per SVHC revision on /ProductCompliance ROHSCompliantPage of33。
¡ SemiconductorMSM6636GENERAL DESCRIPTIONThe MSM6636 is a transmission controller for automotive LAN based on data communication protocol SAE-J1850. This LSI can realize a data bus topology bus LAN system with a PWM bit encoding method (41.6 K bps). In addition to a protocol control circuit, MSM6636 has an enclosed quartz oscillation circuit, host CPU interface (clock synchronous serial / UART), a transmit/receive buffer, and a bus receiver circuit that decreases the burden on the host CPU.FEATURES•Based on SAE-J1850 CLASS B DATA COMMUNICATION NETWORK INTERFACE (issued August 12, 1991)•CSMA/CD (Carrier-sense multiple access with collision detection)•Internal transmit buffer (1 frame) and receive buffer (2 frames)•Bit encoding: PWM (Pulse Width Modulation)•Transmission Speed: 41.6K bps•Multi-address setting with physical addressing: 1 type / functional addressing: 15 types •Address filter function by multi-addressing (broadcasting possible)•Automatic retransmission function by arbitration loss and non ACK •3 types of in-frame response support:q Single-byte response from a single recipientw Multi-byte response from a single recipient (with CRC code)e Single-byte response from multiple recipients (ID response as ACK)•Error detection by cyclic redundancy check (CRC)•Various communication error detections•Dual-wire bus abnormality detection by internal bus receiver and fault tolerance function •Host CPU interface is LSB first / serial, 4 modes supported q Clock synchronous serial (no parity)Normal mode:8-bit data MPC Mode:8-bit data + MPC bit (1: address / 0: data select bit)w UART (yes/no parity selectable)Normal mode: 1 start bit + 8-bit data + (parity) + 1 stop bit MPC mode: 1 start bit + 8-bit data + MPC bit + (parity) + 1 stop bit •Sleep FunctionLow current consumption mode by oscillation stop (IDS Max < 50µA)SLEEP / WAKE UP control from host CPU, WAKE UP via LAN bus •Available package 18pin DIP, 18 pin QFJ (PLCC) and 24pin SOP.¡ Semiconductor MSM6636SAE-J1850 Communication Protocol Conformity Transmission Controller for Automo-tive LANMSM6636¡ Semiconductor BLOCK DIAGRAM¡ Semiconductor MSM6636PIN CONFIGURATION (TOP VIEW)PIN DESCRIPTIONPin Name I/O FunctionAVDD 1—Analog power supply pin BO –2O LAN - BUS output –BI –3I BI +4I BO +5O AGND 9—Analog ground pin U - C 10I 0: UART1: clock synchronous serial select pinM - N 11I 0: MPC mode 1:normal mode select pinDGND 12—Digital ground pin OSC 113O Crystal oscillation output OSC 014I Crystal oscillation input A - D 15I 0: data communication 1: address communication SCLK / PAE 16I Serial clock input/Parity select pin RXD 20I Serial data input pin TXD 21O Serial data output pin INT 22O Interrupt output pin RES 23I Reset input pin DVDD24—Digital power supply pinPin #123456789101112131415161718DIP/QFJ SOP LAN - BUS input –LAN - BUS input +LAN - BUS output +18pin Plastic DIP AVDD DVDD BO–RES BI–INT BI+TXD BO+RXD AGND SCLK /PAE U-C A-D M-NOSC0DGND OSC1BI– INT BI+TXD BO+RXD AGND SCLK /PAE U-CA-DB O –M -N A V D D D G N D D V D D O SC 1R E SO S C 018pin Plastic QFJ AVDD DVDD BO–RES BI–INT BI+TXD BO+RXD NC NC NC NC NC NCAGND SCLK/PAE U-C A-D M-N OSC0DGNDOSC124pin Plastic SOPNC: No Connection123456789876543210111111*********891011345671615141312123456789101112242322212019181716151413MSM6636¡ SemiconductorABSOLUTE MAXIMUM RATINGSParameter Symbol ConditionRated Value Unit Power Supply VoltageDVDD, AVDD-0.3~7.0V Input Voltage V I -0.3~DVDD+0.3V Output Voltage V O -0.3~DVDD+0.3V P D(DIP)*1Ta = 25°C 860mW Storage TemperatureT STG-55~150°CDGND = AGND = 0VAVDD = DVDD AVDD = DVDD Power Dissipation P D(QFJ)*2Ta = 25°C 960mW P D(SOP)*3Ta = 25°C 830mW P D(DIP)*1:18PIN DIP package power dissipation P D(QFJ)*2:18PIN QFJ package power dissipation PD(SOP)*3:24PIN SOP package power dissipation Power Dissipation Curve1000860500-4025125150Ambient temperature Ta (°C)P o w e r d i s s i p a t i o n P D (D I P) [m W ]1000960500-4025125150Ambient temperature Ta (°C)P o w e r d i s s i p a t i o n P D (Q F J ) [m W ]1000830500-4025125150Ambient temperature Ta (°C)P o w e r d i s s i p a t i o n P D (S O P ) [m W ]< 24PIN SOP package >< 18PIN DIP package >< 18PIN QFJ package >¡ Semiconductor MSM6636 OPERATION RANGEParameter Symbol Condition Rated Value Unit Power Supply Voltage DVDD, AVDD AVDD = DVDD 4.5~5.5VOperating Frequency f OSC DVDD = AVDD = 5V±10%2~16MHzOperating Temperature Ta-40~+125°CDGND = AGND = 0VELECTRICAL CHARACTERISTICSDC CharacteristicsH Level Input Voltage V IH1—A DVDD ¥ 0.8—DVDD + 0.3VParameter Symbol Condition Application MIN TYP MAX Unit L Level Input Voltage V IL1—A DGND - 0.3—DVDD ¥ 0.2VH Level Input Current I IH1V I = V DD B——+1µAL Level Input Current I IL1V I = 0V B——- 1µAH Level Input Current I IH2V I = V DD C——+1µAL Level Input Current I IL2V I = 0V C——- 100µAH Level Input Current I IH3V I = V DD BI (+)——+ 100µAL Level Input Current I IL3V I = 0V BI (-)——- 100µAH Level Output Voltage V OH1I O = -400µA D DVDD - 0.4——VL Level Output Voltage V OL1I O = +3.2mA D——DGND + 0.4VH Level Output Voltage V OH2I O = -4.0mA E DVDD - 0.4——VL Level Output Voltage V OL2I O = +4.0mA E——DGND + 0.4VCurrent Consumption 1I DS During sleep——50µACurrent Consumption 2I DD f = 16MHz,no load——10mA DVDD = AVDD = 5V±10%, DGND = AGND = 0V, Ta = -40 ~ +125°CH Level Input Voltage V IH2—F DVDD - 2.0—DVDD + 1.0VL Level Input Voltage V IL2—F DGND - 1.0—DGND + 2.0V Receiver Hysteresis Width V H—F100—400mVGND Offset Voltage V OFF——±1V————A: RES, SCLK/PAE, RXD, U-C, M-N, A-D, OSC0B: SCLK/PAE, RXD, U-C, M-N, A-DC: RESD: TXD, INTE: BO-, BO+F: BI-, BI+MSM6636¡ SemiconductorAC Chacteristics PWM Bit Timingmin typ max min max Bit Length TP123.6424.0024.3621.0028.00µs Parameter Symbol TransmitReceive Unit "1" Dominant Width TP2 6.907.007.11 5.0012.00µs "0" Dominant Width TP314.8715.0015.2313.0020.00µs "SOF" Dominant Width TP430.5431.0031.4729.0036.00µs "SOF,BRK" Length TP547.2848.0048.7245.0052.00µs "BRK" Dominant Width TP638.4239.0039.5937.0044.00µs "EOD" + Bit Length TP747.2848.0048.7243.0051.00µs "EOF" + Bit Length TP870.9272.00—69.0076.00µs "0" Passive WidthTP108.869.009.144.0015.00µs"EOF + IFS" + Bit Length TP994.5696.00—86.00—µs Note:DVDD = AVDD = 5 V ± 10%, Ta = -40 ~ +125˚C, In setting 41.6 K bpsDominantPassive " 1 "DominantPassive" 0 "DominantPassive" SOF "" EOD "DominantPassiveDominantPassive" BRK "" EOF "" IFS "Dominant Passive¡ Semiconductor MSM6636CPU Serial Interface Timing m Clock synchronous SerialOSCO (source oscillation) Pulse Cycle tø62500ns ParameterSymbol Min Typ Max Unit SCLK-L Interval Width t CKLW 8tø—ns SCLK-H Interval Width t CKHW 8tø—ns SCLK ≠ - RXD Setup Time t SRS 4tø—ns SCLK ≠ - RXD Hold Time t SRH 4tø—ns SCLK ≠ - TXD Output Delay Time t STD 4tø6tø + 100ns A-D - SCLK ≠ Setup Time t AS 0—ns SCLK ≠ - A-D Hold Time t AH 8tø—ns SCLK Frame Interval Time *1t INT18tø—ns SCLK Frame Interval Time *2t INT216tø—nsDVDD=AVDD=5V±10%, Ta =-40~+125°C——————————SCLK Frame Interval Time *1Between “Communication type (WR) and address setting” frame and “WR data” frame.Between “WR data” frame and “WR data” frame during continuous WR.SCLK Frame Interval Time *2Between “Communication type (RD) and address setting” frame and “RD data” frame.Between “RD data” frame and “RD data” frame during continuous RD.MSM6636¡ Semiconductorm UARTA-D - STOP bit ≠ Setup Time t UAS 0—ns ParameterSymbol Min Typ Max Unit STOP bit Ø – A-D Hold Time t UAH 0—ns START bit Ø – TXD Output Delay Time t UTD 48tø50tø + 100ns Write Frame Interval Time *3t INT30—ns Read Frame Interval Time *4t INT410tø—nsDVDD=AVDD=5V±10%, Ta =-40~+125°C—————Write Frame Interval Time *3Between “Communication type (WR) and address setting” frame and “WR data” frame.Between “WR data” frame and “WR data” frame during continuous WR.Read Frame Interval Time *4Between “Communication type (RD) and address setting” frame and “RD data” frame.¡ Semiconductor MSM6636Wakeup Input SignalLAN bus Passive Æ Dominant Change Pulse Width t WD 7—µs ParameterSymbol Min Typ Max Unit RXD Terminal Input Pulse Width t WR 300—ns Bus Receiver Stable Time *5t RS1—µsDVDD=AVDD=5V±10%, Ta =-40~+125°C———OSC0A-D RXDTXDNote: The time chart shows the wakeup input signals from each sleep status Bus Receiver Stable Time *5The stable time of the bus receiver is from just after wakeup to the restart of message trans-mission and reception. However, the clock oscillation source should use an external clock.(A clock is input even in the sleep status.)MSM6636¡ SemiconductorFault Tolerant Function Operation ConditionsLAN bus (+) GND Short Circuit Detection Pulse Width t PG5—µs ParameterSymbol Min Typ Max Unit LAN bus (+) VDD Short Circuit Detection Pulse Width t PV 48—µs LAN bus (-) VDD Short Circuit Detection Pulse Widtht NV5—µsDVDD=AVDD=5V±10%, Ta =-40~+125°C, In setting 41.6Kbps———LAN bus (-) GND Short Circuit Detection Pulse Width t NG 48—µs —BUS(+)BUS(-)BUS(+)BUS(-)Reset Input Pulse WidthReset Input Pulse Widtht RES0.1—µsParameterSymbol Min Typ Max Unit DVDD=AVDD=5V±10%, Ta=–40~+125°C—RES¡ Semiconductor MSM6636 APPLICATION EXAMPLEHost CPU and LAN bus Connection ExampleHost CPU and LAN bus connection example of MSM6636 is shown below.The above connection example is when "UART, MPC and parity no mode" was used as the "host CPU interface, and when CLKOUT output of the host CPU" was used as the clock for MSM6636.Depending on the control target, an optimum host CPU (number of ports, A/D converter yes / no) can be selected, and an optimum system can be constructed.11。
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产品名称产品类型应急咨询电话(带值班时间):::企业标识:化学品的推荐用途和限制用途产品代码:8080游艇全效自抛光防污漆产品描述:油漆。
用于涂料 - Consumer use: 本产品的使用必须符合标签说明。
用于涂料 - 用于专业领域佐敦涂料(张家港)有限公司中国江苏扬子江国际化学工业园南海路39号 215634电话: +86 512 58937988传真: +86 512 58937986Jotun Coatings (Zhangjiagang) Co. LtdNO.39 Nanhai Road Jiangsu Yangtze River International Chemical Industry Park,Jiangsu Province 215634 China Tel: +86 512 58937988Fax: +86 512 58937986中远佐敦船舶涂料(青岛)有限公司中国山东省青岛市高新区春阳路800号总机电话: +86-532-68689888总机传真: +86-532-66726750Jotun COSCO Marine Coatings (Qingdao) Co. Ltd.No. 800, Chunyang Road, High-tech Zone, Qingdao, P. R. China Tel: +86-532-68689888Fax: +86-532-66726750******************中国化学事故应急服务 Tel: +86 532 83889090易燃液体 - 类别 3急性毒性 (口服) - 类别 5皮肤腐蚀/刺激 - 类别 3严重眼损伤/眼刺激 - 类别 1皮肤致敏物 - 类别 1致癌性 - 类别 2特异性靶器官毒性 一次接触 (呼吸道刺激) - 类别 3特异性靶器官毒性 一次接触 (麻醉效应) - 类别 3危害水生环境一急性危险 - 类别 1危害水生环境一长期危险 - 类别 1GHS危险性类别:物质或混合物的分类根据 GB13690-2009 和 GB30000-2013警示词:危险.危险性说明:H226 - 易燃液体和蒸气。
安全技术说明书页: 1/11 扬子石化—巴斯夫有限责任公司安全技术说明书日期 / 修订: 09.09.2010版本: 7.1产品: Diethylenetriamine(30036876/SDS_GEN_CN/ZH)印刷日期 02.06.20111. 物质/制剂及公司信息Diethylenetriamine推荐用途和限制用途: 工业化学品公司:扬子石化—巴斯夫有限责任公司江苏省南京市六合区新华东路8号邮政编码 210048电话: +86 25 5773-6769传真号: +86 25 5856-9278E-mail地址: ******************.cn紧急联络信息:扬子石化—巴斯夫有限责任公司紧急响应中心(中国, 南京)电话: +86 25 5856-2402传真号: +86 25 5856-9077Company:BASF-YPC Company LimitedLuhe District,Nanjing,JiangsuPostal Code:210048, CHINA Telephone: +86 25 5773-6769 Telefax number: +86 25 5856-9278E-mail address: ******************.cnEmergency information:BYC ERC(China,Nanjing) Telephone: +86 25 5856-2402 Telefax number: +86 25 5856-90772. 危险性识别纯物质和混合物的分类:急性毒性: 分类4 (口服)急性毒性: 分类3 (皮肤接触)皮肤腐蚀/刺激: 分类1B皮肤致敏物: 分类1对水环境的急性危害: 分类3扬子石化—巴斯夫有限责任公司安全技术说明书日期 / 修订: 09.09.2010版本: 7.1产品: Diethylenetriamine(30036876/SDS_GEN_CN/ZH)印刷日期 02.06.2011标签要素和警示性说明:警示词:危险危险性说明:可导致严重的皮肤灼伤及眼睛损伤。
UL2556 2011译版通过UL UL安全标准的保护。
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Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
分散染料产品索引号分散染料产品索引号分散黄A-G------------------C.I. Disperse Yellow 3分散黄E-3RL----------------C.I. Disperse Yellow 23分散黄E-3G-----------------C.I. Disperse Yellow 54分散黄3GF-------------------C.I. Disperse Yellow 64 200%分散黄BRL-S----------------C.I. Disperse Yellow 163 200% 分散黄4G--------------------C.I. Disperse Yellow 211 200% 分散黄5G--------------------C.I. Disperse Yellow 119 200% 分散黄5GL-------------------C.I. Disperse Yellow 241 200% 分散黄6GSL------------------C.I. Disperse Yellow 114 200% 分散黄8GFF------------------C.I. Disperse Yellow 82 200% 分散红⽟B-------------------C.I. Disperse Red 1 200%分散红⽟BD------------------C.I. Disperse Red 13 200%分散⼤红S-3GL--------------C.I. Disperse Red 54 100%分散红⽟S-5BL--------------C.I. Disperse Red 167 100%分散红FB--------------------C.I. Disperse Red 60 200%分散红FB--------------------C.I. Disperse Red 60 220%分散红⽟SE-4RB-------------C.I. Disperse Red 73 200%分散⼤红S-R----------------C.I. Disperse Red 74 100%分散红BEL-------------------C.I. Disperse Red 92 200%分散红BS--------------------C.I. Disperse Red 152 200%分散⼤红GS------------------C.I. Disperse Red 153 100%分散红FRL-------------------C.I. Disperse Red 177 200%分散红⽟C-2R---------------C.I. Disperse Red 179 220%分散红G---------------------C.I. Disperse Red 277 100%分散红SE-3B----------------C.I. Disperse Red 13 200%分散红BG--------------------C.I. Disperse Red 362 200%分散红SE-B-----------------C.I. Disperse Red 82 200%分散橙E-RL-----------------C.I. Disperse Orange 25 200% 分散橙SE-GL----------------C.I. Disperse Orange 29 200% 分散橙S -4RL----------------C.I. Disperse Orange 30 200% 分散橙S-3RFL---------------C.I. Disperse Orange 44 200% 分散橙2RL-------------------C.I. Disperse Orange 61 200%分散橙GLS-------------------C.I. Disperse Orange 62 200% 分散橙R-SF-----------------C.I. Disperse Orange 73 200% 分散橙S-2RCW---------------C.I. Disperse Orange 76 200% 分散橙3R--------------------C.I. Disperse Orange 5 200%分散艳蓝E-4R---------------C.I. Disperse Blue 56 100%分散艳蓝E-4R---------------C.I. Disperse Blue 56 150%分散翠蓝S-GL---------------C.I. Disperse Blue 60 200%分散深蓝S-3BG--------------C.I. Disperse Blue 79 100%分散蓝S-BF-----------------C.I. Disperse Blue 86分散翠蓝S-BL---------------C.I. Disperse Blue 87 200%分散翠蓝R-SF---------------C.I. Disperse Blue 143 200% 分散蓝3RT-------------------C.I. Disperse Blue 148 200%分散蓝BBLS------------------C.I. Disperse Blue 165 200%分散蓝AR--------------------C.I. Disperse Blue 281 200%分散蓝S-BGL----------------C.I. Disperse Blue 73 200%分散蓝SE-5R----------------C.I. Disperse Blue 183 200% 分散蓝3GR-------------------C.I. Disperse Blue 291∶1 200% 分散蓝S-3G-----------------C.I. Disperse Blue 301 150%分散蓝3G--------------------C.I. Disperse Blue 291 300%分散棕S-3R-----------------C.I. Disperse Brown 1 100%分散紫FBL-------------------C.I. Disperse Violet 26 200%分散紫2RL-------------------C.I. Disperse Violet 28 200%分散紫RB--------------------C.I. Disperse Violet 33 200%分散紫RL--------------------C.I. Disperse Violet 63 200%分散紫3RL-S-----------------C.I. Disperse Violet 77 200%分散紫BNL -----------------C.I. Disperse Violet 93分散蓝CR-E-----------------C.I. Disperse Blue 366分散蓝RD--------------------C.I. Disperse Blue 106分散蓝GFD-------------------C.I. Disperse Blue 102分散绿C-6B-----------------C.I.分散绿9分散嫩黄H-4GL--------------C.I. Disperse Yellow 134分散橙SE-RH----------------C.I. Disperse Orange 288分散红RR--------------------C.I. Disperse Red 50分散红SEB-------------------C.I. Disperse Red 82分散红REL-------------------C.I. Disperse Red 91分散红S-2BL----------------C.I. Disperse Red 145分散黄SE-5R----------------C.I. Disperse Yellow 104分散紫HFRL------------------C.I. Disperse Violet 31分散染料染料名称 C.I.索引号1 分散嫩黄 SE-5GL 200% Y-1192 分散黄棕 S-2RFL 150% O-303 分散橙 3GL 200% O-294 分散黄 RGFL 100% Y-235 分散⾦黄 4GL 200% Y-46 分散⾦黄 S-3RL 200%7 分散黄 SE-RGF 200%8 分散红 FB 200% R-609 分散红 3B 100% R-6010 分散⼤红 G-S 200% R-15311 分散⼤红 S-GF 150% R-13512 分散⼤红 E-2GFL 200% R-5013 分散⼤红 S-BWFL 100% R-7414 分散红⽟ SE-2GF 200%15 分散红⽟ S-2GFL 100% R-16716 分散红⽟ SE-GFL 200% R-7317 分散红⽟ SE-BBL 200% R-8218 分散红⽟ 2BL-S 200% R-14519 分散紫 BNL 200% V-9320 分散蓝 2BNL 100% B-56染料名称 C.I.索引号21 分散蓝 GLS 300% B-371:122 分散蓝 S-BBL 200% B-16523 分散蓝 SE-2R 100% B-183:124 分散蓝 SE-3RF 200% B-14825 分散深蓝 H-GL 200% B-7926 分散蓝 EXSFN 300%27 分散灰 N 100%28 分散深蓝棕 S-2BL 200%29 分散⿊ S-2BL 150%30 分散⿊ S-3BL 150%31 分散⿊ EXSFN 300%32 分散黄 C-4G 200%33 分散橙 C-2R 150%34 分散红 C-2G 150%35 分散红⽟ C-2B 150%36 分散蓝 C-2RB 150%37 分散深蓝 C-2G 200%38 分散蓝 C-3R 150%。
Designation:A663/A663M −12Standard Specification forSteel Bars,Carbon,Merchant Quality,Mechanical Properties 1This standard is issued under the fixed designation A663/A663M;the number immediately following the designation indicates the year of original adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.A superscript epsilon (´)indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1.Scope*1.1This specification covers hot-wrought merchant quality carbon steel bars and bar size shapes produced to mechanical property requirements and intended for noncritical construc-tional applications (see 7.2).1.2Merchant quality hot-wrought steel bar is available in the following ranges of size and section:1.2.1Rounds,squares,and hexagons with diameters or distance across flats under 3in.[75mm].1.2.2Bar size shapes with maximum dimensions under 3in.[75mm].1.2.3Other bar sections with weight per foot under 40.84lb/ft [60.78kg/m].1.2.4Flats 6in.[152mm]or under in width,over 0.203in.[over 5mm in thickness up to 150mm in width]in thickness,and under 40.84lb/ft or 12in.2[77.4cm 2]in cross-sectional area.1.2.5Flats over 6in.to 8in.,inclusive in width,0.230in.and over [over 6mm in thickness and over 50mm through 200mm in width]in thickness and under 40.84lb/ft [60.78kg/m]or 12in.2[77.4cm 2]in cross-sectional area.1.2.6Hot-wrought merchant quality carbon steel bars sub-ject to mechanical property requirements are hot wrought in straight lengths only.1.3Some applications may require one or more of the available designations shown under supplementary require-ments.N OTE 1—Special quality hot-wrought carbon steel bars subject to mechanical property requirements are covered in Specification A675/A675M .1.4The values stated in either SI units or inch-pound units are to be regarded separately as standard.The values stated in each system may not be exact equivalents;therefore,eachsystem shall be used independently of the bining values from the two systems may result in non-conformance with the standard.2.Referenced Documents2.1ASTM Standards:2A29/A29M Specification for Steel Bars,Carbon and Alloy,Hot-Wrought,General Requirements forA370Test Methods and Definitions for Mechanical Testing of Steel ProductsA675/A675M Specification for Steel Bars,Carbon,Hot-Wrought,Special Quality,Mechanical PropertiesE290Test Methods for Bend Testing of Material for Ductil-ity3.Ordering Information3.1Orders for material under this specification should include the following information:3.1.1Quantity (weight or number of pieces),3.1.2Dimensions (cross-sectional shape,size,and length),3.1.3Name of material (merchant quality carbon steel bars),3.1.4Specification number and date of issue,3.1.5Grade designation,3.1.6Copper bearing steel (if required),3.1.7Heat analysis or test report (request,if required),3.1.8Application and processing,and3.1.9Supplementary requirements (if required).4.Manufacture4.1The steel shall be made by the basic-oxygen or electric-furnace process.5.Chemical Composition5.1The steel shall conform on heat analysis to the following chemical requirements:1This specification is under the jurisdiction of Committee A01on Steel,Stainless Steel and Related Alloys and is the direct responsibility of Subcommittee A01.15on Bars.Current edition approved May 1,2012.Published May 2012.Originally approved in st previous edition approved in 2006as A663/A663M –89(2006).DOI:10.1520/A0663_A0663M-12.2For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at service@.For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.*A Summary of Changes section appears at the end of this standardCopyright ©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959.United StatesThis international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for theDevelopment of International Standards,Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT)Committee.Phosphorus,max,percent 0.04Sulfur,max,percent0.05Copper,when copper steel is specified,min,percent0.206.Mechanical Properties6.1Tensile Requirements:6.1.1The material as represented by the test specimen shall conform to the applicable requirements in Table 1.6.1.2Test specimens shall be prepared for testing from the material in its as-rolled condition.The tension specimen may be aged as described in Test Methods and Definitions A370.6.1.3Test specimens shall be taken longitudinally and may be tested in full thickness or section,or they may be machined to the dimensions shown in Figs.4or 5of Test Methods and Definitions A370.If test specimens are selected conforming to the dimensions of Fig.5,they shall be machined from a position midway between the center and the surface of the bar.6.1.4Test specimens for shapes and flats may be machined to the form and dimensions shown in Fig.4of Test Methods and Definitions A370or with both edges parallel.Test speci-mens for material over 11⁄2in.[40mm]in thickness or diameter may be machined to a thickness or diameter of at least 3⁄4in.[20mm]for a length of at least 9in.[230mm],or they may conform to the dimensions shown in Fig.5of Test Methods and Definitions A370.6.1.5Tensile requirements shall be determined in accor-dance with Test Methods and Definitions A370.6.1.6For material over 3⁄4in.[19mm]in thickness or diameter,a deduction from the percentage of elongation in 8in.[200mm]specified in Table 1of 0.25%shall be made for each increase of 1⁄32in.[0.8mm]in the specified thickness or diameter above 3⁄4in.[19mm].6.1.7For material under 5⁄16in.[8mm]in thickness or diameter,a deduction from the percentage of elongation in 8in.[200mm]specified in Table 1of 2.00%shall be made for eachdecrease of 1⁄32in.[0.8mm]in the specified thickness or diameter below 5⁄16in.[8mm].6.1.8For material over 2in.[50mm]in thickness or diameter,a deduction from the percentage of elongation in 2in.[50mm]specified in Table 1of 1.00%shall be made for each 1in.[25mm]of specified thickness or diameter or fraction thereof over 2in.[50mm]in thickness or diameter.6.2Number of Tests:6.2.1Two tension tests shall be made from each heat,unless the finished material from a heat is less than 50tons [45Mg],when one tension test will be sufficient.However,for material 2in.[50mm]and under in thickness,when the material from one heat differs 3⁄8in.[9.5mm]or more in thickness,one tension test shall be made from both the thickest and the thinnest material rolled,regardless of weight represented.For material over 2in.[50mm]thick,when the material from one heat differs 1in.[25mm]or more in thickness,one tension test shall be made from both the thickest and the thinnest material rolled that is more than 2in.[50mm]thick regardless of the weight represented.6.3Test Reports:6.3.1When test reports are required by the purchase order,the report shall show the results of each test required by 6.2,except that only one test need be reported when the amount of material from a heat in a shipment is less than 10tons [9Mg]and when the thickness variations described in 6.2are not exceeded.6.3.2The thickness of the product tested may not necessar-ily be the same as an individual ordered thickness since it is the heat that is tested rather than each ordered item.6.3.3When Supplementary Requirements are specified,the report shall include a statement of compliance with the requirement or the results of tests when the requirement involves measured test values.7.General Requirements7.1Material furnished under this specification shall con-form to the requirements of the current edition of Specification A29/A29M ,except as stated in 1.2and 3.2.7.2Merchant quality bars shall be free from visible pipe;however,they may contain pronounced chemical segregation.Internal porosity,surface seams,and other surface irregularities may be present in this quality.Deoxidation practice and grain size are at the manufacturer’s option.7.3Unless otherwise specified,the bars shall be furnished as rolled and not pickled,blast cleaned,or oiled.8.Keywords8.1carbon steel bars;merchant quality steel bars;steel barsTABLE 1Tensile RequirementsElongation,min,%Grade Designation Tensile Strength,ksi [MPa]Yield Point,Amin,ksi [MPa]8-in.or [200-mm]Gage Length2-in.or [50-mm]Gage Length45[310]45–55[310–380]25.0[175]273350[345]50–60[345–415]28.0[195]253055[380]55–65[380–450]30.0[210]232660[415]60–72[415–495]33.0[230]212265[450]65–77[450–530]36.0[250]172070[485]70–85[485–585]39.0[270]141875[515]75–90[515–620]41.0[285]141880[550]80min [550min]44.0[305]1317AWhen the tension test does not show a yield point (drop of the beam,halt of the pointer or sharp-kneed stress-strain diagram),yield strength shall be deter-mined by either 0.5%extension-under-load or 0.2%offset.The minimum ksi (MPa)requirement does not change.The test report,if required,shall show yieldstrength.SUPPLEMENTARY REQUIREMENTSOne or more of the following supplementary requirements shall apply when specified by the purchaser.S1.Special StraightnessS1.1Bars may be specified to special straightness tolerance (refer to Specification A29/A29M ).S2.CleaningS2.1The purchaser may specify that the surface of bars be descaled by pickling or blast cleaning.S3.CoatingS3.1The purchaser may specify oil on bars which have been descaled.S4.Bend TestsS4.1Requirements:S4.1.1The bend test specimen shall stand being bent at room temperature through 180°without cracking on the outside of the bent portion,to an inside diameter which shall have the relation to the thickness or diameter of the specimen as given in Table S4.1.S4.2Test Specimens:S4.2.1Bend test specimens for material 11⁄2in.[40mm]and under in diameter or thickness may be the full thickness of the section.For flat bars over 2in.[50mm]in width,the width may be reduced by milling to 11⁄2in.[40mm].S4.2.2Bend test specimens for material over 11⁄2in.[40mm]in diameter or thickness may be machined to a thickness or diameter of at least 3⁄4in.[20mm]or to 1in.by 1⁄2in.[25by 12.5mm]in section.Machined sides of bend test specimens may have the corners rounded to a radius of not over 1⁄16in.[1.6mm]for material 2in.[50mm]and under inthickness,and not over 1⁄8in.[3.2mm]in radius for material over 2in.[50mm]in thickness.S4.3Number of Tests:S4.3.1Two bend tests shall be made from each heat unless the finished material from a heat is less than 50tons [45Mg]when one bend test will be sufficient.However,for material 2in.[50mm]and under in thickness,when the material from one heat differs 3⁄8in.[9.5mm]or more in thickness,one bend test shall be made from the thickest and the thinnest material rolled,regardless of weight represented.For material over 2in.[50mm]thick,when the material from one heat differs 1in.[25mm]or more in thickness,one bend test shall be made from both the thickest and the thinnest material rolled that is more than 2in.[50mm]thick regardless of the weight represented.S4.4Test Methods:S4.4.1Bend tests shall be made in accordance with Test Methods E290.SUMMARY OF CHANGESCommittee A01has identified the location of selected changes to this standard since the last issue (A663/A663M –89(2006))that may impact the use of this standard.(Approved May 1,2012.)(1)Removed previous subsection 6.1.6.TABLE S4.1Bend RequirementsRatio of Bend Diameter to Thickness of Specimenfor Thickness or Diameter of Bar,in.(mm)Grade Designation 3⁄4[20]andUnder Over 3⁄4[20]to1[25],inclOver 1[25]to 11⁄2[40],inclOver 11⁄2[40]to 2[50],incl Over 2[50]to under 3[75]45[310]flat flat 1⁄21150[345]flat 1⁄2111⁄221⁄255[380]1⁄2111⁄2221⁄260[415]1⁄2111⁄221⁄2365[450]111⁄22331⁄270[485]11⁄2221⁄2331⁄275[515]22331⁄2480[550]221⁄2331⁄24ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed everyfive years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM International Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,at the address shown below.This standard is copyrighted by ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959, United States.Individual reprints(single or multiple copies)of this standard may be obtained by contacting ASTM at the above address or at610-832-9585(phone),610-832-9555(fax),or service@(e-mail);or through the ASTM website ().Permission rights to photocopy the standard may also be secured from the ASTM website(/ COPYRIGHT/).。
安全技术说明书1 .物质/制剂及公司/企业标识HD 30产品名称454311安全技术说明书号码物质/制程的使用Motor oils.如果需要特殊用途建议, 请参考恰当的技术数据表或者咨询我们公司的代表。
BP Singapore Pte Ltd #02-01 Keppel Bay Tower 1 Harbour Front Avenue Singapore, 098632电话: 65-6371 8888供应商+ 65 6371 8999紧急电话号码成分/组成信息2 .此产品不含任何等于或高于规定限值的有害成分。
危险性概述3 .此制备方法未被划分为危险类。
健康危险不归类为危险物质。
不归类为危险物质。
健康影响及症状物理/化学危险如果眼睛意外的接触到,仅会发生暂时性的刺痛或发红。
长期和反复接触可使皮肤脱脂并导致刺激和/或皮肤炎。
用过的发动机油:用过的发动机油可能含有会引起皮肤癌的有害成分。
请参阅本“安全数据表”的第 11 部分“毒理学数据”。
吸入油雾或高温蒸气会刺激呼吸道。
虽然大量吞服可能会导致恶心和腹泻,但是如果意外吞服了微小剂量,也不太可能导致伤害。
眼睛接触皮肤接触吸入食入其他危险无资料。
4 .急救措施皮肤接触如接触,请立即以大量清水冲洗眼睛至少 15 分钟。
如果感到疼痛,请就医治疗。
立即用肥皂和水清洗受暴露的皮肤。
脱去受污染的衣服和鞋子。
衣物重新使用前应清洗。
鞋子在重新使用前应彻底清洗。
如有发炎症状,应寻求医疗救治。
如吸入,移至空气新鲜处。
如显现症状,寻求医疗救护。
吸入眼睛接触食入禁止催吐,除非有专业医疗人士指导。
切勿给失去意识者任何口服物。
如吞下大量该物质,立即电话联络医师。
消防措施5 .灭火介质合适的使用泡沫或多功能干粉灭火。
本产品对水生生物有害。
必须收集被本产品污染了的消防水,且禁止将其排放到任何水道(下水道或排水沟)。
禁止使用直流水。
不适用的燃烧产物可能包括:碳氧化物危险的分解产物本产品在现行法规标准中不归类为易燃易爆品。
PC87366 128-Pin LPC SuperI/O with System Hardware Monitoring, MIDI and Game PortsGeneral DescriptionThe PC87366,a member of National Semiconductor’s 128-pin LPC SuperI/O family,combines National’s System Hardware Monitoring capability with a Musical Instrument Digital Interface (MIDI)Port and game port inputs for up to two joysticks.The PC87366is PC99and ACPI compliant,and offers a single-chip solution to the most commonly used PC I/O peripherals.System Hardware Monitoring provides minimum power con-sumption and maximum operating efficiency within the system environment.It integrates National’s diode-based or thermistor-based Temperature Sensor (TMS)with National’s Voltage Lev-el Monitor (VLM)for full,PC system thermal control.The PC87366monitors system voltages using 8-bit Analog to Dig-ital (A/D)conversion with seven analog input channels and four internal measuring points.The PC87366also incorporates:Fan Speed Control and Monitor (FSCM)for three fans,extended wake-up support for a wide range of wake-up events,system design protection features,a Floppy Disk Controller (FDC),a Keyboard and Mouse Controller (KBC),a full IEEE 1284Parallel Port,two enhanced Serial Ports (UARTs),one with Infrared (IR)sup-port,ACCESS.bus ®Interface (ACB),System Wake-Up Control (SWC),General-Purpose Input/Output (GPIO)sup-port for 40ports,Interrupt Serializer for Parallel IRQs and an enhanced WATCHDOG ™ timer (WDT).Outstanding FeaturesqSystem Hardware Monitoring including:—Diode-based or thermistor-based T emperature Sen-sor (TMS)—Voltage Level Monitor (VLM) with VID inputs q MIDI interface compatible with MPU-401UART mode q Game port inputs for up to two joysticksqExtended Wake-Up support,including legacy/ACPI power button support,direct power supply control in response to wake-up events,power-fail recovery qProtection features,including chassis intrusion detection,GPIO lock and pin configuration lockq Fan Speed Control and Monitor for three fans q Serial IRQ support (15options)q Interrupt Serializer (11Parallel IRQs to Serial IRQ)qBus interface,based on Intel’s LPC Interface Specifi-cation Revision 1.0,September 29th,1997q ACCESS.bus interface,SMBus physical layer compatible q40GPIO Ports (29standard,including 15with Assert IRQ/SMI/PWUREQs interrupts;11V SB -powered)q Blinking LEDsq128-pin PQFP PackageBlock DiagramSystem Wake-UpSerial Port 2IEEE 1284Parallel PortPorts Keyboard &Mouse I/F SCL ACCESS.bus Floppy Disk ControllerFloppy Drive InterfaceKeyboard &Serial Infrared Interface InterfaceControl Bus InterfaceLPC Interface I/O3 Control WATCHDOGTimer WDOSerial Port 1Serial InterfaceOutputs Fan Speed Control & Monitor Interface Mouse Controllerwith IRGPIO Ports3 Monitor InputsSDA Serial IRQ Analog Inputs System Parallel Port Interface Diode InterfaceSMI PortsHardware MonitoringV REF MIDIInterface MIDI &Game PortsGame Inputs Wake-Up EventsPWUREQ Power Control V DD V BdAT V SBAV DD ACCESS.bus® is a registered trademark of Digital Equipment Corporation.I2C® is a registered trademark of Philips Corporation.IBM®, MicroChannel®, PC-AT® and PS/2® are registered trademarks of International Business Machines Corporation.Microsoft® and Windows® are registered trademarks of Microsoft Corporation.TRI-STATE® is a registered trademark of National Semiconductor Corporation.WATCHDOG‰ is a trademark of National Semiconductor Corporation.SMBus® is a registered trademark of Intel Corporation.© 1999 National Semiconductor CorporationPRELIMINARYJanuary 11,1999PC87366128-Pin LPC SuperI/O with System Hardware Monitoring,MIDI and Game PortsFeatures•Voltage Level Monitor (VLM)—Seven analog inputs that can support both positive and negative voltages—Four internal measuring points—Three thermistor-based temperature monitoring channels—Internal or external V REF—VID inputs—Meets ACPI and DMI requirements for system volt-age monitoring•Temperature Sensor (TMS)—Up to two remote diode inputs—Environment temperature sensing via an internal di-ode—A/D analog channels provide thermal inputs to di-rectly sense die temperature of remote diodes —Meets ACPI and DMI requirements for thermal man-agement—Standby mode to minimize power consumption •Extended Wake-Up—Legacy and ACPI power button support—Direct power supply control in response to wake-up events—Power-fail recovery•Musical Instrument Digital Interface (MIDI) Port —Compatible with MPU-401 UART mode—16-byte Receive and T ransmit FIFOs—Loopback mode supportq Game Port—Full digital implementation—Supports up to two analog joysticks •Protection—Chassis intrusion detection (CHASI, CHASO)—GPIO lock—Pin configuration lock•40 General-Purpose I/O (GPIO) Ports—29standard,with Assert IRQ/SMI/PWUREQ for15 ports—11 V SB-powered—Programmable drive type for each output pin(open-drain, push-pull or output disable)—Programmable option for internal pull-up resistor on each input pin—Output lock option—Input debounce mechanism•Fan Speed Control and Fan Speed Monitor (FSCM)—Supports different fan types—Speed monitoring for three fanst Digital filtering of the tachometer input signalt Alarm for fan slower than programmable thresh-old speedt Alarm for fan stop—Three speed control lines with Pulse Width Modula-tion (PWM)t Output signal in the range of 6 Hz to 93.75 KHzt Duty cycle resolution of 1/256•LPC System Interface—Synchronous cycles, up to 33 MHz bus clock—8-bit I/O cycles—Up to four DMA channels—8-bit DMA cycles—Basic read,write and DMA bus cycles are13clock cycles long•PC99 and ACPI Compliant—PnP Configuration Register structure—Flexible resource allocation for all logical devices t Relocatable base addresst15 IRQ routing optionst4optional8-bit DMA channels(where applicable)•Floppy Disk Controller (FDC)—Programmable write protect—FM and MFM mode support—Enhanced mode command for three-mode Floppy Disk Drive (FDD) support—Perpendicular recording drive support for 2.88 MB—Burst and non-burst modes—Full support for IBM T ape Drive register(TDR)im-plementation of AT and PS/2 drive types—16-byte FIFO—Software compatible with the PC8477,which con-tains a superset of the FDC functions in themicroDP8473,the NEC microPD765A and theN82077—High-performance, digital separator—Standard 5.25” and 3.5” FDD support•Parallel Port—Software or hardware control—Enhanced Parallel Port(EPP)compatible with new version EPP 1.9 and IEEE 1284 compliant—EPP support for version EPP1.7of the Xircom spec-ification—EPP support as mode4of the Extended Capabilities Port (ECP)—IEEE 1284 compliant ECP, including level 2—Selection of internal pull-up or pull-down resistor for Paper End (PE) pin—PCI bus utilization reduction by supporting a de-mand DMA mode mechanism and a DMA fairnessmechanism—Protection circuit that prevents damage to the paral-lel port when a printer connected to it powers up oris operated at high voltages,even if the device is inpower-down—Output buffers that can sink and source 14 mA•Serial Port 1 (UART1)—Software compatible with the 16550A and the 164502Features(Continued)3—Shadow register support for write-only bit monitoring —UART data rates up to 1.5 Mbaud•Serial Port 2 with Infrared (UART2)—Software compatible with the 16550A and the 16450—Shadow register support for write-only bit monitoring —UART data rates up to 1.5 Mbaud —HP-SIR—ASK-IR option of SHARP-IR —DASK-IR option of SHARP-IR—Consumer Remote Control supports RC-5,RC-6,NEC, RCA and RECS 80—Non-standard DMA support −1 or 2 channels —PnP dongle support •Keyboard and Mouse Controller (KBC)—8-bit microcontroller—Software compatible with the 8042AH and PC87911microcontrollers— 2 KB custom-designed program ROM —256 bytes RAM for data—Five programmable dedicated open-drain I/O lines —Asynchronous access to two data registers and onestatus register during normal operation —Support for both interrupt and polling —93 instructions —8-bit timer/counter—Support for binary and BCD arithmetic—Operation at 8MHz,12MHz or 16MHz (programma-ble option)—Can be customized by using the PC87323,which in-cludes a RAM-based KBC as a development plat-form for KBC code•ACCESS.bus Interface (ACB)—Serial interface compatible with SMBus physical layer —Compatible with Philips’ I 2C ®—ACB master and slave—Supports polling and interrupt controlled operation —Optional internal pull-up on SDA and SCL pins•WATCHDOG Timer (WDT)—Times out the system based on user-programmabletime-out period—System power-down capability for power saving —User-defined trigger events to restart WATCHDOG —Optional routing of WATCHDOG output on IRQand/or SMI lines•System Wake-Up Control (SWC)—Power-up request upon detection of Keyboard,Mouse,RI1,RI2,RING activity and General-Pur-pose Input Events, as follows:t Preprogrammed Keyboard or Mouse sequence t External modem ring on serial portt Ring pulse or pulse train on the RING input signal t Preprogrammed CEIR address in a preselectedstandard (NEC, RCA or RC-5)t General-Purpose Input Events t IRQs of internal logical devices —Optional routing of power-up request on IRQ,SMIand/or PWBTOUT—Battery-backed event configuration—Programmable V SB -powered output for blinkingLEDs (LED1, LED2) control•Clock Sources—48 MHz clock input—LPC clock, up to 33 MHz—On-chip low frequency clock generator for wake-up•Power Supplies— 3.3V supply operation —Main (V DD and AV DD )—Standby (V SB )—Battery backup (V BA T )—All pins are 5V tolerant and back-drive protected,ex-cept LPC bus pins•Strap Configuration—Base Address (BADDR)strap to determine the baseaddress of the Index-Data register pair—T est strap to force the device into test mode (re-served for National Semiconductor use)—Power Supply and LED Configuration (PSLDC0,1)straps to determine the power suppy control func-tions and the V SB power-up defaults of LED2—Power Supply On Polarity (PSONPOL)strap to setPSON active state and output typeDatasheet Revision RecordRevision Date Status CommentsNovember1998Draft0.3Specification subject to change without notice;MIDI andGame Port information is incompleteJanuary1999Preliminary1.0Specification subject to change without notice;PowerSupply Control and LED sections in Chapter2areincompleteItem Topic Change/Correction Location 4Table of ContentsDatasheet Revision Record (4) (4)1.0Signal/Pin Connection and Description1.1CONNECTION DIAGRAM (16)1.2BUFFER TYPES AND SIGNAL/PIN DIRECTORY (17)1.3PIN MULTIPLEXING (22)1.4DETAILED SIGNAL/PIN DESCRIPTIONS (24)1.4.1ACCESS.bus Interface (ACB) (24)1.4.2Bus Interface (24)1.4.3Clock (24)1.4.4Fan Speed Control and Monitor (FSCM) (24)1.4.5Floppy Disk Controller (FDC) (25)1.4.6Game Port (26)1.4.7General-Purpose Input/Output (GPIO) Ports (26)1.4.8Infrared (IR) (26)1.4.9Keyboard and Mouse Controller (KBC) (27)1.4.10Musical Instrument Digital Interface (MIDI) Port (27)1.4.11Parallel Port (28)1.4.12Power and Ground (28)1.4.13Protection (29)1.4.14Serial Port 1 and Serial Port 2 (29)1.4.15Strap Configuration (30)1.4.16System Hardware Monitoring (30)1.4.17System Wake-Up Control (31)1.4.18WATCHDOG Timer (WDT) (31)1.5INTERNAL PULL-UP AND PULL-DOWN RESISTORS (32)2.0Device Architecture and Configuration2.1OVERVIEW (34)2.2CONFIGURATION STRUCTURE AND ACCESS (34)2.2.1The Index-Data Register Pair (34)2.2.2Banked Logical Device Registers Structure (36)2.2.3Standard Logical Device Configuration Register Definitions (37)2.2.4Standard Configuration Registers (39)2.2.5Default Configuration Setup (40)2.2.6Power States (40)2.2.7Address Decoding (41)2.3PROTECTION (41)2.3.1Chassis Intrusion Detection (41)2.3.2Pin Configuration Lock (41)2.3.3GPIO Pin Function Lock (42)2.4POWER SUPPLY CONTROL (PSC) (42)2.5LED OPERATION AND STATES (44)2.6POWER SUPPLY CONTROL AND LED CONFIGURATION (44)2.7REGISTER TYPE ABBREVIATIONS (45)2.8SUPERI/O CONFIGURATION REGISTERS (45)2.8.1SuperI/O ID Register (SID) (46)2.8.2SuperI/O Configuration 1 Register (SIOCF1) (46)2.8.3SuperI/O Configuration 2 Register (SIOCF2) (47)2.8.4SuperI/O Configuration 3 Register (SIOCF3) (48)2.8.5SuperI/O Configuration 4 Register (SIOCF4) (49)2.8.6SuperI/O Configuration 5 Register (SIOCF5) (50)2.8.7SuperI/O Revision ID Register (SRID) (50)2.8.8SuperI/O Configuration 8 Register (SIOCF8) (51)2.8.9SuperI/O Configuration A Register (SIOCFA) (52)2.8.10SuperI/O Configuration B Register (SIOCFB) (53)2.8.11SuperI/O Configuration C Register (SIOCFC) (54)2.8.12SuperI/O Configuration D Register (SIOCFD) (55)2.9FLOPPY DISK CONTROLLER (FDC) CONFIGURATION (56)2.9.1General Description (56)2.9.2Logical Device 0 (FDC) Configuration (56)2.9.3FDC Configuration Register (57)2.9.4Drive ID Register (58)2.10PARALLEL PORT CONFIGURATION (59)2.10.1General Description (59)2.10.2Logical Device 1 (PP) Configuration (60)2.10.3Parallel Port Configuration Register (60)2.11SERIAL PORT 2 CONFIGURATION (61)2.11.1General Description (61)2.11.2Logical Device 2 (SP2) Configuration (61)2.11.3Serial Port 2 Configuration Register (61)2.12SERIAL PORT 1 CONFIGURATION (62)2.12.1Logical Device 3 (SP1) Configuration (62)2.12.2Serial Port 1 Configuration Register (62)2.13SYSTEM WAKE-UP CONTROL (SWC) CONFIGURATION (63)2.13.1Logical Device 4 (SWC) Configuration (63)2.14KEYBOARD AND MOUSE CONTROLLER (KBC) CONFIGURATION (64)2.14.1General Description (64)2.14.2Logical Devices 5 and 6 (Mouse and Keyboard) Configuration (65)2.14.3KBC Configuration Register (66)2.15GENERAL-PURPOSE INPUT/OUTPUT (GPIO) PORTS CONFIGURATION (67)2.15.1General Description (67)2.15.2Implementation (67)2.15.3Logical Device 7 (GPIO) Configuration (68)2.15.4GPIO Pin Select Register (69)2.15.5GPIO Pin Configuration Register (70)2.15.6GPIO Event Routing Register (71)62.16ACCESS.BUS INTERFACE (ACB) CONFIGURATION (72)2.16.1General Description (72)2.16.2Logical Device 8 (ACB) Configuration (72)2.16.3ACB Configuration Register (73)2.17FAN SPEED CONTROL AND MONITOR (FSCM) CONFIGURATION (74)2.17.1General Description (74)2.17.2Logical Device 9 (FSCM) Configuration (74)2.17.3Fan Speed Control and Monitor Configuration 1 Register (75)2.17.4Fan Speed Control and Monitor Configuration 2 Register (76)2.17.5Fan Speed Control OTS Configuration Register (76)2.18WATCHDOG TIMER (WDT) CONFIGURATION (77)2.18.1Logical Device 10 (WDT) Configuration (77)2.18.2WATCHDOG Timer Configuration Register (77)2.19GAME PORT (GMP) CONFIGURATION (78)2.19.1Logical Device 11 (GMP) Configuration (78)2.19.2Game Port Configuration Register (78)2.20MIDI PORT (MIDI) CONFIGURATION (79)2.20.1Logical Device 12 (MIDI) Configuration (79)2.20.2MIDI Port Configuration Register (79)2.21VOLTAGE LEVEL MONITOR (VLM) CONFIGURATION (80)2.21.1Logical Device 13 (VLM) Configuration (80)2.22TEMPERATURE SENSOR (TMS) CONFIGURATION (80)2.22.1Logical Device 14 (TMS) Configuration (80)3.0System Wake-Up Control (SWC)3.1OVERVIEW (81)3.2FUNCTIONAL DESCRIPTION (82)3.3EVENT DETECTION (83)3.3.1Modem Ring (83)3.3.2Telephone Ring (83)3.3.3Keyboard and Mouse Activity (84)3.3.4CEIR Address (84)3.3.5Standby General-Purpose Input Events (84)3.3.6GPIO-Triggered Events (84)3.3.7Software Event (84)3.3.8Module IRQ Wake-Up Event (85)3.4SWC REGISTERS (85)3.4.1SWC Register Map (85)3.4.2Wake-Up Events Status Register 0 (WK_STS0) (88)3.4.3Wake-Up Events Status Register (WK_STS1) (89)3.4.4Wake-Up Events Enable Register (WK_EN0) (90)3.4.5Wake-Up Events Enable Register 1 (WK_EN1) (91)3.4.6Wake-Up Configuration Register (WK_CFG) (92)3.4.7Wake-Up Events Routing to SMI Enable Register 0 (WK_SMIEN0) (93)3.4.8Wake-Up Events Routing to SMI Enable Register 1 (WK_SMIEN1) (94)3.4.9Wake-Up Events Routing to IRQ Enable Register 0 (WK_IRQEN0) (95)3.4.10Wake-Up Events Routing to IRQ Enable Register 1 (WK_IRQEN1) (96)3.4.11Wake-Up Extension 1 Enable Register 0 (WK_X1EN0) (97)3.4.12Wake-Up Extension 1 Enable Register 1 (WK_X1EN1) (98)3.4.13Wake-Up Extension 2 Enable Register 0 (WK_X2EN0) (99)3.4.14Wake-Up Extension 2 Enable Register 1 (WK_X2EN1) (100)3.4.15Wake-Up Extension 3 Enable Register 0 (WK_X3EN0) (101)3.4.16Wake-Up Extension 3 Enable Register 1 (WK_X3EN1) (102)3.4.17PS/2 Keyboard and Mouse Wake-Up Events (103)3.4.18PS/2 Protocol Control Register (PS2CTL) (104)3.4.19Keyboard Data Shift Register (KDSR) (104)3.4.20Mouse Data Shift Register (MDSR) (105)3.4.21PS/2 Keyboard Key Data Registers (PS2KEY0 - PS2KEY7) (105)3.4.22CEIR Wake-Up Control Register (IRWCR) (106)3.4.23CEIR Wake-Up Address Register (IRWAD) (107)3.4.24CEIR Wake-Up Address Mask Register (IRWAM) (107)3.4.25CEIR Address Shift Register (ADSR) (108)3.4.26CEIR Wake-Up Range 0 Registers (108)3.4.27CEIR Wake-Up Range 1 Registers (109)3.4.28CEIR Wake-Up Range 2 Registers (109)3.4.29CEIR Wake-Up Range 3 Registers (110)3.4.30Standby General-Purpose I/O (SBGPIO) Register Overview (111)3.4.31Standby GPIO Pin Select Register (SBGPSEL) (114)3.4.32Standby GPIO Pin Configuration Register (SBGPCFG) (115)3.4.33Standby GPIOE/GPIE Data Out Register 0 (SB_GPDO0) (117)3.4.34Standby GPIOE/GPIE Data In Register 0 (SB_GPDI0) (117)3.4.35Standby GPOS Data Out Register 1 (SB_GPDO1) (118)3.4.36Standby GPIS Data In Register 1 (SB_GPDI1) (118)3.5SWC REGISTER BITMAP (119)4.0Fan Speed Control4.1OVERVIEW (123)4.2FUNCTIONAL DESCRIPTION (123)4.3FAN SPEED CONTROL REGISTERS (124)4.3.1Fan Speed Control Register Map (124)4.3.2Fan Speed Control Pre-Scale Register (FCPSR) (124)4.3.3Fan Speed Control Duty Cycle Register (FCDCR) (125)4.4FAN SPEED CONTROL BITMAP (125)5.0Fan Speed Monitor5.1OVERVIEW (126)5.2FUNCTIONAL DESCRIPTION (126)5.3FAN SPEED MONITOR REGISTERS (127)5.3.1Fan Speed Monitor Register Map (127)85.3.2Fan Monitor Threshold Register (FMTHR) (128)5.3.3Fan Monitor Speed Register (FMSPR) (128)5.3.4Fan Monitor Control and Status Register (FMCSR) (128)5.4FAN SPEED MONITOR BITMAP (129)6.0General-Purpose Input/Output (GPIO) Port6.1OVERVIEW (130)6.2BASIC FUNCTIONALITY (131)6.2.1Configuration Options (131)6.2.2Operation (131)6.3EVENT HANDLING AND SYSTEM NOTIFICATION (132)6.3.1Event Configuration (132)6.3.2System Notification (132)6.4GPIO PORT REGISTERS (133)6.4.1GPIO Pin Configuration (GPCFG) Register (134)6.4.2GPIO Pin Event Routing (GPEVR) Register (135)6.4.3GPIO Port Runtime Register Map (135)6.4.4GPIO Data Out Register (GPDO) (136)6.4.5GPIO Data In Register (GPDI) (136)6.4.6GPIO Event Enable Register (GPEVEN) (137)6.4.7GPIO Event Status Register (GPEVST) (137)7.0WATCHDOG Timer (WDT)7.1OVERVIEW (138)7.2FUNCTIONAL DESCRIPTION (138)7.3WATCHDOG TIMER REGISTERS (139)7.3.1WATCHDOG Timer Register Map (139)7.3.2WATCHDOG Timeout Register (WDTO) (139)7.3.3WATCHDOG Mask Register (WDMSK) (140)7.3.4WATCHDOG Status Register (WDST) (141)7.4WATCHDOG TIMER REGISTER BITMAP (141)8.0ACCESS.bus Interface (ACB)8.1OVERVIEW (142)8.2FUNCTIONAL DESCRIPTION (142)8.2.1Data Transactions (142)8.2.2Start and Stop Conditions (142)8.2.3Acknowledge (ACK) Cycle (143)8.2.4Acknowledge after Every Byte Rule (144)8.2.5Addressing Transfer Formats (144)8.2.6Arbitration on the Bus (144)8.2.7Master Mode (145)8.2.8Slave Mode (147)8.2.9Configuration (147)8.3ACB REGISTERS (148)8.3.1ACB Register Map (148)8.3.2ACB Serial Data Register (ACBSDA) (148)8.3.3ACB Status Register (ACBST) (149)8.3.4ACB Control Status Register (ACBCST) (150)8.3.5ACB Control Register 1 (ACBCTL1) (151)8.3.6ACB Own Address Register (ACBADDR) (152)8.3.7ACB Control Register 2 (ACBCTL2) (152)8.4ACB REGISTER BITMAP (153)9.0Game Port (GMP)9.1OVERVIEW (154)9.2FUNCTIONAL DESCRIPTION (154)9.2.1Game Device Axis Position Indication (154)9.2.2Capturing the Position (155)9.2.3Button Status Indication (156)9.2.4Operation Modes (156)9.2.5Operation Control (157)9.3GAME PORT REGISTERS (158)9.3.1Game Port Register Map (158)9.3.2Game Port Control Register (GMPCTL) (159)9.3.3Game Port Legacy Status Register (GMPLST) (160)9.3.4Game Port Extended Status Register (GMPXST) (161)9.3.5Game Port Interrupt Enable Register (GMPIEN) (162)9.3.6Game Device A X-Axis Position Low Byte (GMPAXL) (163)9.3.7Game Device A X-Axis Position High Byte (GMPAXH) (163)9.3.8Game Device A YAxis Position Low Byte (GMPAYL) (163)9.3.9Game Device A Y-Axis Position High Byte (GMPAYH) (163)9.3.10Game Device B X-Axis Position Low Byte (GMPBXL) (164)9.3.11Game Device B X-Axis Position High Byte (GMPBXH) (164)9.3.12Game Device B Y-Axis Position Low Byte (GMPBYL) (164)9.3.13Game Device B Y-Axis Position High Byte (GMPBYH) (164)9.3.14Game Port Event Polarity Register (GMPEPOL) (165)9.4GAME PORT BITMAP (166)10.0Musical Instrument Digital Interface (MIDI) Port10.1OVERVIEW (167)10.2FUNCTIONAL DESCRIPTION (167)10.2.1Internal Bus Interface Unit (168)10.2.2Port Control and Status Registers (168)10.2.3Data Buffers and FIFOs (168)10.2.4MIDI Communication Engine (168)10.2.5MIDI Signals Routing Control Logic (169)10.2.6Operation Modes (169)10.2.7MIDI Port Status Flags (170)1010.2.8MIDI Port Interrupts (171)10.2.9Enhanced MIDI Port Features (172)10.3MIDI PORT REGISTERS (173)10.3.1MIDI Port Register Map (173)10.3.2MIDI Data In Register (MDI) (173)10.3.3MIDI Data Out Register (MDO) (173)10.3.4MIDI Status Register (MSTAT) (174)10.3.5MIDI Command Register (MCOM) (174)10.3.6MIDI Control Register (MCNTL) (175)10.4MIDI PORT BITMAP (176)11.0Voltage Level Monitor (VLM)11.1OVERVIEW (177)11.2FUNCTIONAL DESCRIPTION (177)11.2.1Voltage Measurement, Channels 0 through 10 (178)11.2.2Thermistor-Based Temperature Measurement, Channels 11 to 13 (179)11.2.3 V OS, V HIGH and V LOW Limits, OTS and ALERT Output, IRQ and SMI (179)11.2.4Power-On Reset Default States (180)11.2.5Standby Mode (180)11.3ANALOG SUPPLY CONNECTION (180)11.3.1Recommendations (180)11.3.2Reference Voltage (181)11.4REGISTER BANK OVERVIEW (181)11.5VLM REGISTERS (182)11.5.1VLM Register Map (182)11.5.2Voltage Event Status Register 0 (VEVSTS0) (183)11.5.3Voltage Event Status Register 1 (VEVSTS1) (183)11.5.4Voltage Event to SMI Register 0 (VEVSMI0) (184)11.5.5Voltage Event to SMI Register 1 (VEVSMI1) (185)11.5.6Voltage Event to IRQ Register 0 (VEVIRQ0) (186)11.5.7Voltage Event to IRQ Register 1 (VEVIRQ1) (186)11.5.8Voltage ID Register (VID) (187)11.5.9Voltage Conversion Rate Register (VCNVR) (188)11.5.10VLM Configuration Register (VLMCFG) (189)11.5.11VLM Bank Select Register (VLMBS) (189)11.5.12Voltage Channel Configuration and Status Register (VCHCFST) (190)11.5.13Read Channel Voltage Register (RDCHV) (191)11.5.14Channel Voltage High Limit Register (CHVH) (191)11.5.15Channel Voltage Low Limit Register (CHVL) (191)11.5.16Overtemperature Shutdown Limit Register (OTSL) (191)11.6VLM REGISTER BITMAP (192)11.6.1VLM Control and Status Registers (192)11.6.2VLM Channel Registers (192)11.7USAGE HINTS (193)11.7.2Measuring Out of Range Positive and Negative Voltages (194)12.0Temperature Sensor (TMS)12.1OVERVIEW (195)12.2FUNCTIONAL DESCRIPTION (195)12.2.1Register Bank Overview (196)12.2.2T OS, T HIGH and T LOW Limits, OTS and ALERT Output, IRQ and SMI (196)12.2.3ALERT Response Read Sequence (197)12.2.4Power-On Reset Default States (197)12.2.5Temperature Data Format (198)12.2.6Standby Mode (198)12.2.7Diode Fault Detection (198)12.3TMS REGISTERS (199)12.3.1TMS Register Map (199)12.3.2Temperature Event Status Register (TEVSTS) (200)12.3.3Temperature Event to SMI Register (TEVSMI) (201)12.3.4Temperature Event to IRQ Register (TEVIRQ) (202)12.3.5TMS Configuration Register (TMSCFG) (203)12.3.6TMS Bank Select Register (TMSBS) (203)12.3.7Temperature Channel Configuration and Status Register (TCHCFST) (204)12.3.8Read Channel Temperature Register (RDCHT) (205)12.3.9Channel Temperature High Limit Register (CHTH) (205)12.3.10Channel Temperature Low Limit Register (CHTL) (205)12.3.11Channel Overtemperature Limit Register (CHOTL) (205)12.4TMS REGISTER BITMAP (206)12.4.1TMS Control and Status Registers (206)12.4.2TMS Channel Registers (206)12.5USAGE HINTS (206)12.5.1Remote Diode Selection (206)12.5.2ADC Noise Filtering (207)12.5.3PC Board Layout (207)12.5.4Twisted Pair and Shielded Cables (209)13.0Legacy Functional Blocks13.1KEYBOARD AND MOUSE CONTROLLER (KBC) (210)13.1.1General Description (210)13.1.2KBC Register Map (210)13.1.3KBC Bitmap Summary (210)13.2FLOPPY DISK CONTROLLER (FDC) (211)13.2.1General Description (211)13.2.2FDC Register Map (211)13.2.3FDC Bitmap Summary (212)13.3PARALLEL PORT (213)13.3.1General Description (213)13.3.3Parallel Port Bitmap Summary (214)13.4UART FUNCTIONALITY (SP1 AND SP2) (216)13.4.1General Description (216)13.4.2UART Mode Register Bank Overview (216)13.4.3SP1 and SP2 Register Maps for UART Functionality (217)13.4.4SP1 and SP2 Bitmap Summary for UART Functionality (219)13.5IR FUNCTIONALITY (SP2) (221)13.5.1General Description (221)13.5.2IR Mode Register Bank Overview (221)13.5.3SP2 Register Map for IR Functionality (222)13.5.4SP2 Bitmap Summary for IR Functionality (223)14.0Device Characteristics14.1GENERAL DC ELECTRICAL CHARACTERISTICS (225)14.1.1Recommended Operating Conditions (225)14.1.2Absolute Maximum Ratings (225)14.1.3Capacitance (225)14.1.4Power Consumption under Recommended Operating Conditions (226)14.2DC CHARACTERISTICS OF PINS, BY I/O BUFFER TYPES (226)14.2.1Input, CMOS Compatible (226)14.2.2Input, PCI 3.3V (226)14.2.3Input, SMBus Compatible (227)14.2.4Input, Strap Pin (227)14.2.5Input, TTL Compatible (227)14.2.6Input, TTL Compatible with Schmitt Trigger (227)14.2.7Output, PCI 3.3V (228)14.2.8Output, Totem-Pole Buffer (228)14.2.9Output, Open-Drain Buffer (228)14.2.10Input, Analog (228)14.2.11Input, Analog (228)14.2.12Input, Analog (229)14.2.13Output, Analog (229)14.2.14Output, Analog (229)14.2.15Exceptions (229)14.3INTERNAL RESISTORS (230)14.3.1Pull-Up Resistor (230)14.3.2Pull-Down Resistor (230)14.4ANALOG CHARACTERISTICS (230)14.4.1VLM (230)14.4.2TMS (230)14.5AC ELECTRICAL CHARACTERISTICS (232)14.5.1AC Test Conditions (232)14.5.2Clock Timing (232)14.5.3LCLK and LRESET (233)14.5.5Serial Port, Sharp-IR, SIR and Consumer Remote Control Timing (235)14.5.6Modem Control Timing (236)14.5.7FDC Write Data Timing (236)14.5.8FDC Drive Control Timing (237)14.5.9FDC Read Data Timing (237)14.5.10Standard Parallel Port Timing (238)14.5.11Enhanced Parallel Port Timing (238)14.5.12Extended Capabilities Port (ECP) Timing (239)。
Safety Data SheetDocument number First issued Revised date Revision Issued by Page 1796009-ENG-06 1998-02-18 2008-01-29 5 Jeanette Hasseson 1 of 4Alpacon 0091. Identification of the substance/preparation and of the company/undertakingTrade Name: Supplier:Alpacon 009 ALFA LAVAL ABHans Stahles vägProduct Type: S-147 80 TumbaEmulsion breaker SwedenTel: +46 8 530 650 00e-mail:Emergency number: +46 8 33 70 43 open 24 h2. Hazard identificationThe surfactant might cause serious damage to eyes and may cause long-term adverse effects in the aquatic environmentIf the product is used as recommended the surfactants will be soluble in oil and therefore they will be excluded in the water- phase.3. Composition/information on the ingredientsHazardous ingredients Weight-% CAS No ECNoClassification Risk PhrasesPolymer 5 – 15 - - NoneSurfactants 5 – 10 68989-03-7 - Xi, N R41, 51/53 See section 16 for explanations to R-phrases.4. First –aid measuresFirst aid – Inhalation Move to fresh air.First aid – Skin contact Wash off with plenty of water.First aid – Eye contact Rinse immediately with tepid water for several minutes. Proceedthe rinse during transport to hospital.Obtain medical attention.First aid – Ingestion Rinse mouth and drink at least 1-2 glasses of water. Do notinduce vomiting.Obtain medical attention.5. Fire- fighting measuresExtinguishing media All extinguishing media are suitable.Special hazards of product The product is not flammable. In case of fire the product mightform hazardous gases as NOx and COx.Protective equipment for fire fighting Not applicable.Fire –fight If the fire is extinguished with water environmental dangeroussubstances might be entering the environment.6. Accidental release measuresPersonal precautions Wear suitable goggles and gloves.Environmental precautions Prevent spills from reaching sewage, wells and watercourses. Spillage Absorb spills with sand, earth or other inert material. Collect andremove for destruction.Large spillage Contact local authority7. Handling and storageHandling Do not mix with other chemicals. Use recommended personalprotection according to section 8.Storage Store in a closed container.8. Exposure control / personal protectionRespiratory protection Appropriate ventilation. Provide facilities for rinsing eyes.Skin protection Protective gloves of nitrile.Eye protection Safety goggles.Ingestion Do not eat or drink during use. Wash hands before eating.9. Physical and chemical propertiesPhysical state Clear liquid.Colour Slightly yellow.Odour Weak smell.Density at 20 °C (g/ml) 1.025± 0.005.pH (as is) at 20 °C 7-9°brix 17.8±0.6.Viscosity at 25 °C (SP01/20 rpm) (cP) 1368±130.Cloud point during heating (°C) 50ºC.Flash point >100 º C10. Stability and reactivityStability The product is stable under normal conditions, but it decomposesat high temperatures.Conditions to avoid Extreme heatMaterials to avoid None knownHazardous decomposition products None known if the product is handled as recommended. In caseof fire the product might form hazardous gases as NOx and COx.11. Toxicological informationSkin At prolonged or frequently use of the product blush might occur.Eyes The product might cause serious damage to eyes.Consumption Low acute toxicity . Might be irritating to mucous membrane.LD50 oral rat 4500mg/kgSkin irritation test rabbit Slightly irritatingEye irritation test rabbit Strongly irritatingSensibillisation Not allergenicGen toxicity Not mutagenic12. Ecological informationLC50 96h (fish) >100mg/lNOEC 96 h (fish) > 100mg/lEC50 48h (Daphnia magna) > 100mg/lNOEC 48 h (Daphnia magna) > 100 mg/lDegradation No readily bodegradable13. Disposal considerationsDisposal of product: State and local disposal regulations may differ from federaldisposal regulations. Always dispose in accordance with federal,state and local requirements.Disposal of containers: Containers should be reused or disposed of by landfill orincineration as appropriate.14. Transport informationNot classified as a hazardous substance according to transport regulations.15. Regulatory informationLabel Symbol(s): XiIrritantRisk Phrases: R36 Irritating to eyes.R52/53 Harmful to aquatic organisms, may cause long-termadverse effects in the aquatic environment.Safety Phrases: S39 Wear eye/ face protection.16. Other informationExplanations to R-phrases in section 2 R41 Risk of serious damage to eyes.R51/53 Toxic to aquatic organisms, may cause long-term adverse effects in the aquatic environment.See also product label for product applications.Important changes have been made in section: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 and 15.DISCLAIM OF RESPONSIBILITYAlfa Laval provides the information contained herein in good faith but makes no representation as to its comprehensiveness or accuracy. This document is only a guide to the potential hazards of the product. All individuals working with or around the product should be properly trained. Persons coming into contact with the product must be capable of exercising their own independent judgment concerning the conditions or methods of handling, storage and usage of the product. Alfa Laval will not be responsible for claims, losses, or damages of any kind resulting from the information provided in this Safety Data Sheet or the use, handling, storage or disposal of the product. Alfa Laval makes no representations or warranties, either express or implied, including without limitation any warranties of merchantability or fitness for a particular purpose with respect to the information set out herein or the product to which the information refers.。
Ebony GritSafety Data SheetProduct Identifier Ebony Grit Other Means of IdentificationNot applicableOther Identification Granulated Copper Slag Opta Minerals Inc., 407 Parkside DriveP.O. Box 260, Waterdown, Ontario, Canada, L0R 2H0, (905) 689-7361,Recommended Use SDS No.Emergency Phone No.SECTION 1. IDENTIFICATIONManufacturer/Supplier IdentifierBlasting media.1044CHEMTREC, (outside North America), 1-703-527-3887, 24 hoursCHEMTREC (Canada & USA), 1-800-424-9300, 24 hoursSECTION 2. HAZARD IDENTIFICATIONClassified according to Canada's Hazardous Products Regulations (WHMIS 2015) and the US Hazard Communication Standard (HCS 2012).InhalationMove to fresh air. If experiencing respiratory symptoms (e.g. coughing, shortness of breath, wheezing), call a Poison Centre or doctor.Skin ContactWash gently and thoroughly with lukewarm, gently flowing water and mild soap for 5 minutes.Eye ContactImmediately rinse the contaminated eye(s) with lukewarm, gently flowing water for 15-20 minutes, while holding the eyelid(s) open.If eye irritation persists, get medical advice or attention.IngestionSECTION 4. FIRST-AID MEASURESFirst-aid MeasuresProduct Identifier:Ebony Grit 8200594IngestionNever give anything by mouth if person is rapidly losing consciousness, or is unconscious or convulsing. Do not induce vomiting. Call a Poison Centre or doctor if you feel unwell.Immediate Medical Attention and Special TreatmentTarget OrgansRespiratory system.Most Important Symptoms and Effects, Acute and Delayed If in eyes:May cause moderate to severe irritation.Extinguishing MediaSuitable Extinguishing MediaNot combustible. Use extinguishing agent suitable for surrounding fire.Unsuitable Extinguishing Media Not applicable.Specific Hazards Arising from the Product Does not burn.This product presents no unusual hazards in a fire situation.Not known to generate any hazardous decomposition products in a fire.Special Protective Equipment and Precautions for Fire-fighters Wear self contained breathing apparatus.SECTION 5. FIRE-FIGHTING MEASURESPersonal Precautions, Protective Equipment, and Emergency ProceduresUse the personal protective equipment recommended in Section 8 of this safety data sheet. Review Section 7(Handling) of this safety data sheet before proceeding with clean-up.Environmental PrecautionsIt is good practice to prevent releases into the environment.Methods and Materials for Containment and Cleaning UpAvoid generating dust. Collect using shovel/scoop or approved HEPA vacuum and place in a suitable container for disposal.SECTION 6. ACCIDENTAL RELEASE MEASURESPrecautions for Safe HandlingAvoid generating dusts. Wear personal protective equipment to avoid direct contact with this chemical. Avoid repeated or prolonged skin contact with product or with contaminated equipment/surfaces.It is good practice to: avoid breathing product; avoid skin and eye contact and wash hands after handling. Wash hands thoroughly after handling this product and before eating, using the washroom or leaving work area. Remove contaminated clothing and protective equipment before entering eating areas or leaving work area.Conditions for Safe Storage Store in an area that is: dry.SECTION 7. HANDLING AND STORAGESECTION 8. EXPOSURE CONTROLS/PERSONAL PROTECTIONACGIH TLV®OSHA PEL Chemical NameTWASTELTWACeilingControl ParametersAIHA WEEL 8-hr TWATWAProduct Identifier:Ebony GritIron Oxide5 mg/m3 * A410 mg/m3 *Aluminum oxide 1 mg/m3 * A4 5 mg/m3 *Calcium oxide 2 mg/m3 5 mg/m3Magnesium oxide 10 mg/m3 *A415 mg/m3Fused Silica (Amorphous)0.1 mg/m3Appropriate Engineering ControlsIndividual Protection MeasuresSkin ProtectionRespiratory ProtectionEye/Face Protection* respirable total dust, OSHA (PEL)= 15 mg/m3 crystalline Silica, ACGIH, TWA, 0.10 mg / m3 (ACGIH), 0.025 mg /m3,respirable.Wear a NIOSH approved air-purifying respirator with N95 or higher rating filter(s).In conditions where the levels of airborne dust exceed the capabilities of the above referenced respirators, a supplied-air respirator may be necessary.Avoid repeated or prolonged skin contact. Always wear insulated protective clothing, if contact is possible.Wear chemical safety goggles and face shield when contact is possible. Do not get in eyes.Do not allow product to accumulate in the air in work or storage areas, or in confined spaces. Use local exhaust ventilation, if general ventilation is not adequate to control amount in the air.pHNot applicableAppearanceBlack shiny.Partition Coefficient,n-Octanol/Water (Log Kow)Not applicable Vapour PressureNot applicable Odour Threshold Not applicable Vapour Density (air = 1)Not applicable Initial Boiling Point/Range Not applicable Evaporation RateNot applicableFlash PointNot applicable Melting Point/Freezing Point Not applicable (freezing)Relative Density (water = 1)Not availableUpper/Lower Flammability or Explosive Limit Not applicable (upper); Not applicable (lower)SolubilityNot applicable in water Auto-ignition TemperatureNot applicable SECTION 9. PHYSICAL AND CHEMICAL PROPERTIESBasic Physical and Chemical PropertiesSolidPhysical StateOther InformationChemical StabilityNormally stable.Conditions to AvoidPossibility of Hazardous Reactions Not applicable.SECTION 10. STABILITY AND REACTIVITYProduct Identifier:Ebony GritConditions to AvoidGeneration of dust.Water.Hazardous Decomposition Products Not applicable.Skin Corrosion/Irritation May cause irritation.May cause skin irritation.Serious Eye Damage/IrritationMay cause moderate to severe irritation.May cause moderate to severe irritation.SECTION 11. TOXICOLOGICAL INFORMATIONSTOT (Specific Target Organ Toxicity) - Single ExposureInhalationCan irritate the respiratory system.Skin Absorption May cause irritation.IngestionMay cause irritation of the mouth, throat and stomach.May cause irritation of the respiratory system.STOT (Specific Target Organ Toxicity) - Repeated Exposure Respiratory and/or Skin SensitizationMay cause respiratory or skin sensitization based on limited evidence.CarcinogenicityContains less than 0.1% crystalline silica Development of OffspringThere is no evidence this product contributes Teratogenicity or Embryotoxicity.There is no evidence this product contributes Teratogenicity or Embryotoxicity properties.Reproductive ToxicityNo ingredients in this product are known to contribute to reproductive toxicity.No ingredients in this product are known to contribute to reproductive toxicity.Germ Cell Mutagenicity Not known to be a mutagen.No ingredients in this product are known to cause mutagenicity.Interactive Effects None known.None known.Acute ToxicitySexual Function and FertilityInhalation. Skin contact. Eye contact. Ingestion.Likely Routes of ExposureChemical NameLC50LD50 (oral)LD50 (dermal)Iron Oxide Not available > 10,000 mg/kg (rat)Not available Aluminum oxide Not available > 5,000 mg/kg (rat)Not available Calcium oxide Not available > 2,000 mg/kg (rat)Not available Magnesium oxide Not available 810 mg/kg (mouse)Not available Fused Silica (Amorphous)Not available Not available Not available Product Identifier:Ebony GritInteractive EffectsNone known.None known.Although this product is not classified as an environmentally hazardous material, large or frequent spills may cause potential problems.This product and its degradation products are not known to bioaccumulate.SECTION 12. ECOLOGICAL INFORMATIONThis product is not biodegradable.EcotoxicityPersistence and Degradability Bioaccumulative PotentialSECTION 13. DISPOSAL CONSIDERATIONSDispose of waste in compliance with applicable Federal, State, Provincial and Local Regulations.Disposal MethodsSECTION 14. TRANSPORT INFORMATIONNot regulated under Canadian TDG regulations. Not regulated under US DOT Regulations.Special Precautions Not applicableTransport in Bulk According to Annex II of MARPOL 73/78 and the IBC CodeNot applicableSECTION 15. REGULATORY INFORMATIONCanadaWHMIS 1988 ClassificationDomestic Substances List (DSL) / Non-Domestic Substances List (NDSL)All ingredients are listed on the DSL/NDSL.This product has been classified in accordance with the hazard criteria of the Controlled Products Regulations and the SDS contains all of the information required by the Controlled Products Regulations.Custom Regulatory 1Employee exposure monitoring should be performed when using this product to determine exposure levels to not only the oxides contained in this product, but also the material being blasted.Safety, Health and Environmental Regulations Key to AbbreviationsACGIH® = American Conference of Governmental Industrial Hygienists OSHA = US Occupational Safety and Health Administration HSDB® = Hazardous Substances Data BankReferencesCHEMINFO database. Canadian Centre for Occupational Health and Safety (CCOHS).Registry of Toxic Effects of Chemical Substances (RTECS®) database. DassaultSystèmes/BIOVIA (“BIOVIA”). Available from Canadian Centre for Occupational Health and Safety (CCOHS). HSDB® database. US National Library of Medicine. Available from Canadian Centre for Occupational Health and Safety (CCOHS). NIOSH Pocket Guide database. National Institute for Occupational Safety and Health. Available from Canadian Centre for Occupational SECTION 16. OTHER INFORMATIONNFPA RatingSDS Prepared By Dave RumblePhone No.(905) 689-7361, ext 217Date of Preparation January 24, 2017Health - 0Flammability - 0Instability - 0March 08, 2016Date of Last Revision Product Identifier:Ebony GritCentre for Occupational Health and Safety (CCOHS). NIOSH Pocket Guide database. NationalInstitute for Occupational Safety and Health. Available from Canadian Centre for OccupationalHealth and Safety (CCOHS).Disclaimer To the best of our knowledge, the information contained herein is accurate.Although certain hazards are described herein, we can not guarantee that these are the onlyhazards that exist.Opta Minerals Inc. assumes no liability arising out of the use of this product by others.Product Identifier:Ebony Grit。
USA SAFETY DATA SHEET1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONProduct name:LORD 5206Product Use/Class: Acrylic Adhesive, Part 1 of 2LORD Corporation111 LORD DriveCary, NC 27511-7923 USATelephone: 814 868-3180Non-Transportation Emergency: 814 763-2345Chemtrec 24 Hr Transportation Emergency No.800 424-9300 (Outside Continental U.S. 703 527-3887)EFFECTIVE DATE: 03/01/20212. HAZARDS IDENTIFICATIONGHS CLASSIFICATION:Flammable liquids Category 2Skin corrosion/irritation Category 2Serious eye damage/eye irritation Category 1Skin sensitization Category 1Respiratory sensitization Category 1Specific target organ systemic toxicity (single exposure) Category 3Specific target organ systemic toxicity (single exposure) Category 1 Respiratory systemSpecific target organ systemic toxicity (single exposure) Category 3Specific target organ systemic toxicity (repeated exposure) Category 1 Respiratory system, Nervous system Hazardous to the aquatic environment - acute hazard Category 3Hazardous to the aquatic environment - chronic hazard Category 3GHS LABEL ELEMENTS:Symbol(s)Signal WordD ANGERHazard StatementsHighly flammable liquid and vapor.Causes skin irritation.Causes serious eye damage.May cause an allergic skin reaction.May cause allergy or asthma symptoms or breathing difficulties if inhaled.May cause respiratory irritation.Causes damage to organs.(Respiratory system)May cause drowsiness or dizziness.Causes damage to organs through prolonged or repeated exposure.(Respiratory system, Nervous system)Harmful to aquatic life.Harmful to aquatic life with long lasting effects.Precautionary StatementsPreventionKeep away from heat/sparks/open flames/hot surfaces. - No smoking.Ground/Bond container and receiving equipment.300001010441Use explosion-proof electrical/ventilating/lighting equipment.Use only non-sparking tools.Take precautionary measures against static discharge.Wear protective gloves/protective clothing/eye protection/face protection.In case of inadequate ventilation wear respiratory protection.Do not breathe dust/fume/gas/mist/vapors/spray.Wash thoroughly after handling.Do not eat, drink or smoke when using this product.Use only outdoors or in a well-ventilated area.Contaminated work clothing should not be allowed out of the workplace.Avoid release to the environment.ResponseIn case of fire: refer to section 5 of SDS for extinguishing media.Immediately call a POISON CENTER or doctor/physician.Specific treatment (see supplemental first aid instructions on this label).IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing.IF ON SKIN (or hair): Remove/Take off immediately all contaminated clothing. Rinse skin with water/shower.IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do.Continue rinsing.StorageStore in a well-ventilated place. Keep cool.Store in a well-ventilated place. Keep container tightly closed.Store locked up.Disposal:Dispose of contents/container in accordance with waste/disposal aws and regulations of your country or particular locality.Other Hazards:This product contains component(s) which have the following warnings; however based on the GHS classification criteria of your country or locale, the product mixture may be outside the respective category(s).Acute: Vapor harmful; may affect the brain or nervous system causing dizziness, headache or nausea. Possibleirritation of the respiratory system can occur causing a variety of symptoms such as dryness of the throat, tightness of the chest, and shortness of breath. May cause central nervous system depression characterized by the followingprogressive steps: headache, dizziness, staggering gait, confusion, unconsciousness or coma. May be harmful ifswallowed. Ingestion is not an expected route of entry in industrial or commercial uses.Chronic: Prolonged exposure to the silica-containing sanding dust of this product could cause long-term lungdamage. Crystalline silica is classified by IARC and NTP as a known human carcinogen as a respirable dust. The silica in LORD products is not in a form that can be inhaled and presents no risk to the end user. No exposure isexpected during normal use of this product. Sanding or abrading the cured materials is not recommended. Wear appropriate respiratory protection if exposure to dusts is possible.withheld.FIRST AID - EYE CONTACT: Flush eyes immediately with large amount of water for at least 15 minutes holding eyelids open while flushing. Get prompt medical attention.FIRST AID - SKIN CONTACT: Flush contaminated skin with large amounts of water while removing contaminated clothing. Wash affected skin areas with soap and water. Get medical attention if symptoms occur.FIRST AID - INHALATION: Move person to fresh air. Restore and support continued breathing. If breathing is difficult, give oxygen. Get immediate medical attention.FIRST AID - INGESTION: If swallowed, do not induce vomiting. Call a physician or poison control center immediately for further instructions. Never give anything by mouth if victim is rapidly losing consciousness, unconscious or convulsing.SUITABLE EXTINGUISHING MEDIA: Carbon Dioxide, Dry Chemical, Foam, Water FogUNSUITABLE EXTINGUISHING MEDIA: Not determined for this product.SPECIFIC HAZARDS POSSIBLY ARISING FROM THE CHEMICAL: Flammable liquid and vapor. Keep containers tightly closed. Isolate from heat, electrical equipment, sparks, open flame, and other sources of ignition. Closed containers may rupture when exposed to extreme heat. Use water spray to keep fire exposed containers cool. During a fire, irritating and/or toxic gases and particulate may be generated by thermal decomposition or combustion.SPECIAL PROTECTIVE EQUIPMENT AND PRECAUTIONS FOR FIRE-FIGHTERS: Wear full firefighting protective clothing, including self-contained breathing apparatus (SCBA). Water spray may be ineffective. If water is used, fog nozzles are preferable.PERSONAL PRECAUTIONS, PROTECTIVE EQUIPMENT AND EMERGENCY PROCEDURES: Remove all sources of ignition (flame, hot surfaces, and electrical, static or frictional sparks). Avoid contact. Avoid breathing vapors. Use self-contained breathing equipment.ENVIRONMENTAL PRECAUTIONS: Do not contaminate bodies of water, waterways, or ditches, with chemical or used container.METHODS AND MATERIALS FOR CONTAINMENT AND CLEANUP: Keep non-essential personnel a safe distance away from the spill area. Notify appropriate authorities if necessary. Avoid contact. Before attempting cleanup, refer to hazard caution information in other sections of the SDS form. Contain and remove with inert absorbent material.HANDLING: Keep closure tight and container upright to prevent leakage. Ground and bond containers when transferring material. Avoid skin and eye contact. Wash thoroughly after handling. Avoid breathing of vapor or spray mists. Do not handle until all safety precautions have been read and understood. Empty containers should not be re-used. Use with adequate ventilation. Because empty containers may retain product residue and flammable vapors, keep away from heat, sparks and flame; do not cut, puncture or weld on or near the empty container. Do not smoke where this product is used or stored.STORAGE: Do not store or use near heat, sparks, or open flame. Store only in well-ventilated areas. Do not puncture, drag, or slide container. Keep container closed when not in use. Refer to OSHA 29CFR Part 1910.106 "Flammable and Combustible Liquids" for specific storage requirements.INCOMPATIBILITY: Strong acids, bases, and strong oxidizers.Engineering controls: Sufficient ventilation in pattern and volume should be provided in order to maintain air contaminant levels below recommended exposure limits. Caution: Solvent vapors are heavier than air and collect in lower levels of the work area. Sufficient ventilation (using explosion-proof equipment) should be provided to prevent flammable vapor/air mixtures from accumulating.PERSONAL PROTECTION MEASURES/EQUIPMENT:RESPIRATORY PROTECTION: Use a NIOSH approved chemical/mechanical filter respirator designed toremove a combination of particulates and organic vapor if occupational limits are exceeded. For emergencysituations, confined space use, or other conditions where exposure limits may be greatly exceeded, use an approved air-supplied respirator. For respirator use observe OSHA regulations (29CFR 1910.134) or use in accordance with applicable laws and regulations of your country or particular locality.SKIN PROTECTION: Use neoprene, nitrile, or rubber gloves to prevent skin contact. If contact with the product is prolonged or repeated, Silver Shield or Butyl rubber gloves are recommended.EYE PROTECTION: Use safety eyewear including safety glasses with side shields and chemical goggles where splashing may occur.OTHER PROTECTIVE EQUIPMENT: Use disposable or impervious clothing if work clothing contamination is likely. Remove and wash contaminated clothing before reuse.HYGIENIC PRACTICES: Wash hands before eating, smoking, or using toilet facility. Do not smoke in anychemical handling or storage area. Food or beverages should not be consumed anywhere this product is handled or stored. Wash thoroughly after handling.Typical values, not to be used for specification purposes.ODOR: Methacrylate VAPOR PRESSURE: N.D.APPEARANCE: Off-white VAPOR DENSITY: Heavier than Air PHYSICAL STATE: Liquid LOWER EXPLOSIVE LIMIT: 1.6 %(V)UPPER EXPLOSIVE LIMIT: 8.8 %(V)FLASH POINT: 53 °F, 11 °C SetaflashClosed CupBOILING RANGE: N.A.EVAPORATION RATE: Faster than n-butyl-acetate.AUTOIGNITION TEMPERATURE:N.D.DENSITY: 1.04 g/cm3 (8.67 lb/gal) DECOMPOSITION TEMPERATURE:N.D. VISCOSITY, DYNAMIC: ≥80,000 mPa.s @ 25 °C ODOR THRESHOLD: N.D.VISCOSITY, KINEMATIC: ≥76,923 mm2/s @ 25 °CSOLUBILITY IN H2O: Insoluble VOLATILE BY WEIGHT: 0.04 %pH: N.A.VOLATILE BY VOLUME: 0.04 %FREEZE POINT: N.D. VOC CALCULATED: 0 lb/gal, 0 g/lN.D.COEFFICIENT OF WATER/OILDISTRIBUTION:LEGEND: N.A. - Not Applicable, N.E. - Not Established, N.D. - Not DeterminedHAZARDOUS POLYMERIZATION: Hazardous polymerization will not occur under normal conditions.STABILITY: Product is stable under normal storage conditions.CONDITIONS TO AVOID: High temperatures. Sources of ignition. INCOMPATIBILITY: Strong acids, bases, and strong oxidizers.HAZARDOUS DECOMPOSITION PRODUCTS: Carbon monoxide, carbon dioxideEXPOSURE PATH: Refer to section 2 of this SDS.SYMPTOMS:Refer to section 2 of this SDS.TOXICITY MEASURES:Germ cell mutagenicity: No classification proposedCarcinogenicity: No classification proposedReproductive toxicity: No classification proposedPERSISTENCE AND DEGRADABILITY:Not determined for this product.BIOACCUMULATIVE: Not determined for this product.MOBILITY IN SOIL: Not determined for this product.OTHER ADVERSE EFFECTS: Not determined for this product.DISPOSAL METHOD: Disposal should be done in accordance with Federal (40CFR Part 261), state and local environmental control regulations. If waste is determined to be hazardous, use licensed hazardous waste transporter and disposal facility.US DOT RoadProper Shipping Name: AdhesivesHazard Class: 3SECONDARY HAZARD: NoneUN/NA Number: 1133Packing Group: IIEmergency Response Guide Number: 128IATA CargoPROPER SHIPPING NAME: AdhesivesHazard Class: 3HAZARD CLASS: NoneUN NUMBER: 1133PACKING GROUP: IIEMS: 3LIMDGPROPER SHIPPING NAME: AdhesivesHazard Class: 3HAZARD CLASS: NoneUN NUMBER: 1133PACKING GROUP: IIEMS: F-EThe listed transportation classification applies to non-bulk shipments. It does not address regulatory variations due to changes in package size, mode of shipment or other regulatory descriptors. For the most accurate shipping information, refer to your transportation/compliance department.U.S. FEDERAL REGULATIONS: AS FOLLOWS:SARA SECTION 313This product contains the following substances subject to the reporting requirements of Section 313 of Title III of the Superfund Amendment and Reauthorization Act of 1986 and 40 CFR part 372.:Chemical Name CAS Number Weight % Less ThanMethyl methacrylate80-62-655.0%TOXIC SUBSTANCES CONTROL ACT:INVENTORY STATUSThe chemical substances in this product are on the TSCA Section 8 Inventory.EXPORT NOTIFICATIONThis product contains the following chemical substances subject to the reporting requirements of TSCA 12(B) if exported from the United States:NoneUnder HazCom 2012 it is optional to continue using the HMIS rating system. It is important to ensure employees have been trained to recognize the different numeric ratings associated with the HazCom 2012 and HMIS schemes.HMIS RATINGS - HEALTH: 2* FLAMMABILITY: 3 PHYSICAL HAZARD: 1* - Indicates a chronic hazard; see Section 2Revision: Section 2, Section 3, Section 8, Section 11, Section 12Effective Date: 03/01/2021The information contained herein is, to the best of our knowledge and belief, accurate. However, since the conditions of handling and use are beyond our control, we make no guarantee of results, and assume no liability for damages incurred by use of this material. It is the responsibility of the user to comply with all applicable federal, state and local laws and regulations.。