最新RED_X_中文

《Red》Taylor Swift2012-10-22Contents1.State of Grace (1)2.Red (3)3.Treacherous (5)4.I Know You Were Trouble (7)5.All Too Well (9)6.22 (11)7.I Almost Do (13)8.We Are Never Getting BackTogether (15)9.Stay Stay Stay (17)10.The Last Time (18)11.Holy Ground (20)12.Sad Beautiful Tragic (21)13.The Lucky One (22)14.Everything Has Changed (24)15.Starlight (26)16.Begin Again (28)17.The Moment I Knew (30)e Back...Be Here .. (32)19.Girl At Home (34)State of GraceI'm walking fast through the traffic lightsBusy streets and busy livesAnd all we know is touch and goWe are alone with our changing mindsWe fall in love 'til it hurts or bleeds or fades in timeAnd I never saw you comingAnd I'll never be the sameYou come around and the armor fallsPierce the room like a cannon ballNow all we know is don't let goWe are in love just you and meUp in your room and our slates are cleanJust twin fire signs, four blue eyesSo you were never a saint and I love that the shades are wrong?We learn to live with the pain mostly our broken hearts?But this love is brave and wild?And I never saw you comingAnd I'll never be the sameThis is a state of graceThis is the worthwhile fightLove is a ruthless gameUnless you play it good and rightThese are the hands of faithYou're my Achilles heelThis is the golden age of something good and right and realAnd I never saw you comingAnd I'll never be the sameAnd I never saw you comingAnd I'll never be the sameThis is a state of graceThis is the worthwhile fight Love is a ruthless game Unless you play it good and rightRedLoving him is like driving a new Maserati down a dead end streetFaster than the windPassionate as sin, ended so suddenlyLoving him is like trying to change your mindOnce you’re already flying through the free fallLike the colors in autumnSo bright just before they lose it allLosing him was blue like I’d never knownMissing him was dark grey all aloneForgetting him was like trying to know somebody you've never metBut loving him was redLoving him was redTouching him is like realizing all you ever wanted was right there in front of youMemorizing him was as easy as knowing all the words to your old favorite songFighting with him was like trying to solve a crossword and realizing there’s no right answer Regretting him was like wishing you never found out love could be that strongLosing him was blue like I’d never knownMissing him was dark grey all aloneForgetting him was like trying to know somebody you've never metBut loving him was redOh red burning redRemembering him comes in flashbacks and echoesTell myself it’s time now, gotta let goBut moving on from him is impossibleWhen I still see it all in my headBurning red!Darling it was red!Oh, losing him was blue like I’d never knownMissing him was dark grey all aloneForgetting him was like trying to know somebody you've never metCause loving him was red yeah yeah redWe're burning redAnd that's why he's spinning round in my headComes back to me burning redYeah yeahCause love was like driving a new Maserati down a dead end streetTreacherousPut your lips close to mineAs long as they don't touchOut of focus out of eyeTill the gravity is too muchAnd I’ll do anything you sayIf you say it with your handsAnd i'd be smart to walk away but you're quick sandThis love is TreacherousThis path is recklessThis love is TreacherousAnd I I I like itI can't decide if it's a choiceGetting swept awayI hear the sound of my own voiceAsking you to stayAnd all we are is skin and bone trained to get alongForever going with the flow but you're frictionThis love is TreacherousThis path is recklessThis love is TreacherousI I I like itSomewhere like sharp to the sleepless nightAnd I will get will get you aloneYour name has echoed through my mindAnd I just think you should think you should knowThem not being safe is worth the driving I will follow you follow you homeI follow you follow you homeThis hope is TreacherousThis day dream is dangerousThis hope is TreacherousI I I , I I I, I I ISomewhere like sharp to the sleepless nightAnd I will get will get you aloneYour name has echoed through my mindAnd I just think you should think you should knowThem not being safe is worth the driving I will follow you follow you home I follow you follow you homeI follow you follow you homeI follow you follow you homeThis love is TreacherousI I I like itI Know You Were TroubleOnce upon a time a few mistakes agoI was in your sights, you got me aloneYou found me, you found me, you found meI guess you didn't care, and I guess I liked thatAnd when I fell hard you took a step backWithout me, without me, without meAnd he's long gone when he's next to meAnd I realize the blame is on me'Cause I knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never been'Til you put me down, ohI knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never beenNow I'm lying on the cold hard groundOh, oh, trouble, trouble, troubleOh, oh, trouble, trouble, troubleNo apologies, he'll never see you cryPretend he doesn't know that he's the reason whyYou're drowning, you're drowning, you're drowningNow I heard you moved on from whispers on the streetA new notch in your belt is all I'll ever beAnd now I see, now I see, now I seeHe was long gone when he met meAnd I realize the joke is on me, hey!'Cause I knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never been'Til you put me down, ohI knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never beenNow I'm lying on the cold hard groundOh, oh, trouble, trouble, troubleOh, oh, trouble, trouble, troubleAnd the saddest fear comes creeping inThat you never loved me or her, or anyone, or anything, yeah I knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never been'Til you put me down, ohI knew you were trouble when you walked inSo shame on me nowFlew me to places I'd never beenNow I'm lying on the cold hard groundOh, oh, trouble, trouble, troubleOh, oh, trouble, trouble, troubleI knew you were trouble when you walked inTrouble, trouble, troubleI knew you were trouble when you walked inTrouble, trouble, troubleAll Too WellI walked through the door with youIt was cold, but something 'bout it felt like home somehow and I Left my scarf there at your sister's houseAnd you still got it in your drawer even nowOh your sweet dispositionAnd my wide eyed gazeWe're singing in a car getting lost upstateThe autumn leaves falling down like pieces in their placeAnd I can picture it after all these daysAnd I know it's long gone, and that magic’s not here no moreAnd it might be okay, but I'm not fine at allCause here we are again on that little town streetYou almost ran the red cause you were looking over meWind in my air I was there I remember it all too wellPhoto album on my counterYour cheeks were turning redYou used to be a little kid with glasses in a twin size bedAnd your mother's telling stories 'bout you on the t-ball teamYou tell me about your past thinking your future was meAnd I know it's long gone, and there was nothing else I could do And I forget about you long enough to forget why I needed to Cause here we are again in the middle of the nightWe're dancing round the kitchen in the refrigerator lightDown the stairs I was there I remember it all too wellAnd maybe we got lost in translationMaybe I asked for too muchBut maybe this thing was a masterpiece´til you tore it all upRunning scared, I was there I remember it all too wellHey you called me up again just to break me like a promiseSo casually cruel in the name of being honestI'm a crumbled up piece of paper lying hereCause I remember it all all all too wellTime won't fly it's like I'm paralyzed by itI’d like to be my old self againBut I'm still trying to find itAfter plaid shirt days and nights when you made me your own Now you mail back my things and I walk home aloneBut your keep my old scarf from that very first weekCause it reminds you of innocence and it smells like meYou can't get rid of it, cause you remember it all too well year Cause there we are again when I loved you soBack before you lost the one real thing you've ever knownIt was where, I was there, I remember it all too wellWind in my air you were there you remember it allDown the stairs you were there you remember it allIt was where, I was there I remember it all too well22It feels like a perfect night to dress up like hipstersAnd make fun of our exes, uh uh uh uhIt feels like a perfect night for breakfast at midnightTo fall in love with strangers uh uh uh uhYeaaaahWe're happy free confused and lonely at the same timeIt's miserable and magical oh yeahTonight's the night when we forget about the deadlines, it's time uh uhI don't know about you but I’m feeling 22Everything will be alright if you keep me next to youYou don't know about me but I bet you want toEverything will be alright if we just keep dancing like we're 22, 22It seems like one of those nightsThis place is too crowded too many cool kids uh uhIt seems like one of those nightsWe ditch the whole scene and end up dreaming instead of sleepingYeaaaahWe're happy free confused and lonely in the best wayIt's miserable and magical oh yeahTonight's the night when we forget about the heartbreaks, it's time uh uhI don't know about you but I’m feeling 22Everything will be alright if you keep me next to youYou don't know about me but I bet you want toEverything will be alright if we just keep dancing like we're 22, 22I don't know about you, 22, 22It feels like one of those nightsWe ditch the whole sceneIt feels like one of those nightsWe won't be sleepingIt feels like one of those nightsYou look like bad news I gotta have you, I gotta have youI don't know about you but I'm feeling 22Everything will be alright if you keep me next to youYou don't know about me but I bet you want toEverything will be alright if we just keep dancing like we're 22, 22 Dancing like 22, yeah, 22, yeah yeahIt feels like one of those nightsWe ditch the whole sceneIt feels like one of those nightsWe won't be sleepingIt feels like one of those nightsYou look like bad news I gotta have you, I gotta have youI Almost DoI bet this time of night you’re still upI bet you’re tired from a long, hard weekI bet you’re sitting in your chair by the window, looking out at the cityAnd I bet sometimes you wonder about meAnd I just want to tell youIt takes everything in me not to call youAnd I wish I could run to youAnd I hope you know thatEvery time I don’t，I almost do, I almost doI bet you think I either moved on or hate you’Cause each time you reach out there’s no replyI bet it never, ever occurred to you that I can’t say hello to youAnd risk another goodbyeAnd I just want to tell youIt takes everything in me not to call youAnd I wish I could run to youAnd I hope you know thatEvery time I don’t,I almost do, I almost doWe made quite a mess, babeIt’s probably better off this wayAnd I confess, babeThat in my dreams you’re touching my faceAnd asking me if I want to try again with youAnd I almost doAnd I just want to tell youIt takes everything in me not to call youAnd I wish I could run to youAnd I hope you know thatEvery time I don’t,I almost do, I almost doI bet this time of night you’re still upI bet you’re tired from a long, hard weekI bet you’re sitting in you r chair by the window, looking out at the city And I hope sometimes you wonder about meWe Are Never Ever Getting Back TogetherI remember when we broke up the first timeSeeing this is, and had enough, it's likeWe haven't seen each other in a monthWhen you, said you, needed space, what?When you come around again and sayBaby, I miss you and I swear I'm gonna changeTrust me, remember how that lasted for a dayI say, I hate you, we break up, you call me, I love youOooh we called it off again last nightBut Oooh, this time I'm telling you, I'm telling youWe are never ever ever ever getting back togetherWe are never ever ever ever getting back togetherYou go talk to your friends talkAnd my friends talk to meBut we are never ever ever ever getting back together Like ever...I'm really gonna miss you picking fightsAnd me, falling for a screaming that I'm rightAnd you, will hide away and find your piece of minewith some indie record that's much cooler than mineOooh you called me up again tonightBut Oooh, this time I'm telling you, I'm telling youWe are never ever ever ever getting back togetherWe are never ever ever ever getting back togetherYou go talk to your friends talkAnd my friends talk to meBut we are never ever ever ever getting back togetherI used to think, that we, were forever ever everAnd I used to say never say neverHuh, he calls me up and he's like, I still love youAnd I'm like, I mean, I mean this is exhausting, you know We are never getting back together, like everWe are never ever ever ever getting back togetherWe are never ever ever ever getting back togetherYou go talk to your friends talkAnd my friends talk to meBut we are never ever ever ever getting back together Not getting back together, weOh, getting back togetherYou go talk to your friends talkAnd my friends talk to meBut we are never ever ever ever getting back togetherStay Stay StayI'm pretty sure we almost broke up last nightI threw my phone across the room at youI was expecting some dramatic turn away but you stayedThis morning I said we should talk about itCause I read you should never leave a file unresolvedThat's when you came in wearing a football helmetAnd said okay let's talkAnd I said...Stay stay stay I've been loving you for quite some time time timeYou think that it's funny when I'm mad mad madBut I think that it's best if we both stayBefore you I only dated self indulgent takes who took all of their problems out on meBut you carrying my groceries and now I'm always laughingAnd I love you because you have given me no choice but toStay stay stay I've been loving you for quite some time time timeYou think that it's funny when I'm mad mad madBut I think that it's best if we both stay stay stay stayYou took the time to memorize me my feels my hopes and dreamsI just like hanging out with you all the timeAll those times that you didn't leave it's been occurring to me i'd like to hang out with you for my whole lifeStay and I'll be loving you for quite some timeNo one else is gonna love me when I get mad mad madSo I think that it's best if we both stay stay stay stayStay stay stay I've been loving you for quite some time time timeYou think that it's funny when I'm mad mad madBut I think that it's best if we both stay stay stay stayStay stay stay I've been loving you for quite some time time timeYou think that it's funny when I'm mad mad madBut I think that it's best if we both stayThe Last TimeFound myself at your door,Just like all those times before,I’m not sure how I got there,All roads they lead me here.I imagine you are home,In your room, all alone,And you open your eyes into mine,And everything feels better,Right before your eyes,I’m breaking a nd fast,No reasons why,Just you and me.This is the last time I’m asking you this，Put my name on the top of your list, This is the last time I’m asking you why, You break my heart in the blink of an eye. You find yourself at my door,Just like all those times before,You wear your best apology,But I was there to watch you leave,And all the times I let you in,Just for you to go again,Disappear when you come back, Everything is better.When right before your eyes,I’m aching, run fast,Nowhere to hide,Just you and me…This is the last time I’m asking you this, Put my name on the top of your list,This is the last time I’m asking you why,You break my heart in the blink of an eye, eye, eye…This is the last time you tell me I’ve got it wrong,This is th e last time I say it’s been you all along,This is the last time I let you in my door,This is the last time, I won’t hurt you anymore.Oh, oh, oh,This is the last time I’m asking you this,Put my name on the top of your list,This is the last time I’m as king you why,You break my heart in the blink of an eye.This is the last time I’m asking you this, (this is the last time I’m asking you this) Put my name on the top of your list, (name on the top of your list)This is the last time I’m asking you why, (this is the last time I’m asking you why) You break my heart in the blink of an eye. (You break my heart…)This is the last time I’m asking you this,Time I’m asking you this,Time I’m asking you this,Time I’m asking you this…Time I’m asking you this…T ime I’m asking you this…Time I’m asking you this…Holy GroundI was reminiscing just the other day,While having coffee all alone and Lord, it took me away.Back to a first-glance feeling on New York time.Back when you fit in my poems like a perfect rhyme.Took off fast through the green light, go,Hey, skip the conversation and you already know.I left a note on the door with a joke we’d made,And that was the first day.And darling, it was good never looking down.And right there where we stood was holy ground.Spinning like a girl in a brand new dress,We had this big wide city all to ourselves.We blocked the noise with the sound of ‘I need you’,And for the first time I had something to lose,Well I guess we fell apart in the usual way.And the story’s got dust on every page,Sometimes I wonder how you think about it now.And I see your face in every crowd.Cause darling, it was good never looking down.And right there where we stood was holy ground.Tonight I’m gonna dance for all that we’ve been through.But I don’t wanna dance if I’m not dancing with you.Tonight I’m gonna dance like you were in the next room.But I don’t wanna dance if I’m not dancing with you,It was good never looking down.And right there where we stood was holy ground.Tonight I’m gonna dance for all that we’ve been through.But I don’t wanna dance if I’m not dancing with you.Tonight I’m gonna dance like you were in the next room.But I don’t wanna dance if I’m not dancing with youSad Beautiful TragicLong handwritten note, deep in your pocketWords, how little they mean, when they're a little too lateI stood right by the tracks, your face in a locketGood girls, hopeful they'll be and lonely will waitWe had a beautiful magic love affairWhat a sad beautiful tragic love affairIn dreams, I meet you in long conversationWe both wake in lonely beds, and different citiesAnd time is ticking a sweet summer race in youAnd you've got your demons and darling they all look like me Cause we had a beautiful magic love affairWhat a sad beautiful tragic love affairDistance, tire me, break down, fightingSilence, this train runs off its tracksKiss me, try to fix it, would you just try to listenHang up, give up, for the life of us we can't get it backA beautiful magic love affairWhat a sad beautiful tragic, beautiful tragic, beautifulWhat we had, a beautiful magic love affairWhat a sad beautiful tragic love affairWe had a beautiful magic love affairWhat a sad beautiful tragic love affairThe Lucky OneNew to town with a made up name in the angel city,Chasing fortune and fame.And the camera flashes, make it look like a dream.You had it figured out since you were in school.Everybody loves pretty, everybody loves cool.So overnight you look like a sixties’ queen.Another name goes up in lights, like diamonds in the sky.And they’ll tell you now, you’re the lucky one.Yeah, they’ll tell you now, you’re the lucky one.But can you tell me now, you’re the lucky one.Now it’s big black cars, and Riviera views,And your lover in the foyer doesn’t even know youAnd your secrets end up splashed on the news front page.And they tell you that you’re lucky.But you’re so confused,’Cause you don’t feel pretty, you just feel used.And all the young things line up to take your place.Another name goes up in lights. You wonder if you’ll make it out alive.And they’ll tell you now, you’re the lucky one.Yeah, they’ll tell you now, you’re the lucky one.Can you tell me now, you’re the lucky one, oh, oh, oh.It was a few years later, I showed up here.And they still tell the legend of how you disappeared,How you took the money and your dignity, and got the hell out.They say you bought a bunch of land somewhere,Chose the Rose Garden over Madison Square,And it took some time, but I understand it now.’Cause now my name is up in lights, but I think you got it right,Let me tell you now, you’re the lucky one.Let me tell you now, you’re the lucky one.Let me tell you now, you’re the lucky one, oh, oh, oh. And they’ll tell you now, you’re the lucky one.Yeah, they’ll tell you now, you’re the lucky one.And they’ll tell you now, you’re the lucky one, oh, oh, oh. Oh, whoa, oh, oh…Everything Has ChangedAll I knew this morning when I wokeIs I know something now, know something now I didn't beforeAnd all I've seen since 18 hours ago is green eyes and freckles and your smile in the back of my mind making me feel rightI just want to know you better know you better know you better nowI just want to know you better know you better know you better nowI just want to know you better know you better know you better nowI just want to know you know you know you’Cause all I know is we said helloAnd your eyes look like coming homeAll I know is a simple name, everything has changedAll I know is we held the doorYou'll be mine and I'll be yoursAll I know since yesterday is everything has changedAnd all my walls stood tall painted blueBut I'll take them down, take them down and open up the door for youAnd all I feel in my stomach is butterflies the beautiful kindMaking up for lost time, taking flight, making me feel rightI just want to know you better know you better know you better nowI just want to know you better know you better know you better nowI just want to know you better know you better know you better nowI just want to know you know you know you’Cause all I know is we said helloAnd your eyes look like coming homeAll I know is a simple name, everything has changedAll I know is we held the doorYou'll be mine and I'll be yoursAll I know since yesterday is everything has changedCome back and tell me whyI'm feeling like I’ve missed you all this timeAnd meet me there tonightAnd let me know that it's not all in my mindI just want to know you better know you better know you better now I just want to know you know you know you’Cause all I know is we said helloAnd your eyes look like coming homeAll I know is a simple name, everything has changedAll I know is we held the doorYou'll be mine and I’ll be yoursAll I know since yesterday is everything has changedAll I know is we said helloSo dust off your highest hopesAll I know is pouring rainAnd everything has changedAll I know is a newfound brightnessAll my days, I’l l know your faceAll I know since yesterday is everything has changedStarlightI said oh my, what a marvellous tuneIt was the best night, never would forget how we movedThe whole place was dressed to the nines, and we were dancing dancing Like we're made of starlightLike we're made of starlightI'm a barbie on the boardwalk, summer of '45Picks me up, play one night at the windowHe was 17 and crazy, running wild, wildCan't remember what song it was playing when we walked inThe night we snook into a yacht club partyPretending to be a duchess and a princeI said oh my, what a marvellous tuneIt was the best night, never would forget how we movedThe whole place was dressed to the nines, and we were dancing dancing Like we're made of starlight, starlightLike we're made of starlight, starlightHe still looks at you worrying so much about things you can't changeYou'll spend your whole life singing the blues if you keep thinking away He was trying to skip rocks on the ocean saying to meDon't you see the starlight, starlight?Don't you dream impossible things?Like oh my, what a marvellous tuneIt was the best night, never would forget how we movedThe whole place was dressed to the nines, and we were dancing, dancing Like we're made of starlight, starlightLike we're made of starlight, starlightOoh ooh he's talking crazyOoh ooh dancing with meOoh ooh we could get marriedHave ten kids and teach them how to dreamOoh ooh oohOoh ooh oohOoh ooh oohOoh ooh oohOoh ooh oohOh my, what a marvellous tuneIt was the best night, never would forget how we movedThe whole place was dressed to the nines, and we were dancing, dancing Like we're made of starlight, starlightLike we're made of starlight, starlightLike we're made of starlight, starlightLike we dream impossible dreams like starlight starlightLike we dream impossible dreamsDon't you see the starlight starlightDon't you dream impossible thingsBegin AgainTook a deep breath in the mirrorHe didn't like it when I wore high heelsBut I doTurn the lock and put my headphones onHe always said he didn't get this songBut I do, I doWalked in expecting you'd be lateBut you got here early and you stand and waveI walk to youYou pull my chair out and help me inAnd you don't know how nice that isBut I doAnd you throw your head back laughingLike a little kidI think it's strange that you think I'm funny causeHe never didI've been spending the last 8 monthsThinking all love ever doesIs break and burn and endBut on a Wednesday in a cafeI watched it begin againYou said you never met one girl whoHad as many James Taylor records as youBut I doWe tell stories and you don't know whyI'm coming off a little shyBut I doAnd you throw your head back laughingLike a little kidI think it's strange that you think I'm funny cause。

ABSTRACTIn today's dynamic automotive environment, reducing the lead-time to introduce new product technologies to the market place can be a key competitive advantage. Employing proactive risk reduction techniques to define key product and process relationships is essential to enhance the production worthiness of a design while it is still in the advanced development phase of the program.This paper describes how Delphi Powertrain Systems applied the Shainin proactive risk reduction methodology in advanced product development to focus resources on understanding and mitigating the risk associated with the development of a new Delphi ammonia anizational and technical strategies to accelerate profound knowledge capture, along with corresponding test results, are presented and discussed.Due to the proprietary nature of the Delphi ammonia sensor's function and operation, this paper limits the disclosure of detailed product characteristics and specifications to generic nomenclature, while still maintaining the technical intent of the paper.INTRODUCTIONThe Delphi ammonia sensor uses a unique Delphi technology to directly measure ammonia levels in the exhaust of Diesel vehicles equipped with a selective catalytic reduction (SCR)aftertreatment system. The sensor output can be used to provide feedback to the SCR system helping provide optimal reduction of NO x emissions.In a Diesel engine SCR system, the ammonia sensor is typically situated behind the SCR catalyst. The SCR system helps reduce NO x emissions in Diesel powertrain systems through a chemical reaction in which ammonia reacts with NO x to produce nitrogen and water. Ammonia is typically introduced into the exhaust flow upstream from the SCR in the form of liquid urea. The ammonia sensor detects excess ammonia in the exhaust gas allowing for more precise dosing of urea and onboard diagnostics (OBD) functionality. This added precision allows for optimal SCR system efficiency and prevents the release of excess ammonia into the atmosphere.The Delphi ammonia sensor is typically used to detect ammonia within a range of 0 to 200 ppm. It is based on a planar alumina substrate with an integral temperature sensor and a thick-film heater for optimum performance. The sensor is equipped with two sensing electrodes. The first electrode outputs the concentration of ammonia as a voltage while the second electrode outputs the concentration of NO 2 as a voltage. Because the ammonia electrode is cross-sensitive to NO 2, the voltage from the NO 2 electrode is used as a correction factor to improve the accuracy of the ammonia sensor. [1]AMMONIA SENSORThe Delphi ammonia sensor (Figure 1) uses a unique Delphi technology to directly measure ammonia levels in the exhaust of a Diesel vehicle equipped with an SCR aftertreatment system. Electrical power is supplied by a sensor controller through an electrical harness with additional connector pinsfor data communication.Risk Reducing Product and Process Design During New Product Development2010-01-0391Published 04/12/2010Peter Bovenzi, Don Bender, Ray Bloink and Michael ConklinDelphi Corporation Advanced Powertrain - USAJohn AbrahamianShainin LLCCopyright © 2010 SAE InternationalFigure 1. Delphi ammonia sensor with harness electricalconnector - production intentFAST TO MARKET DEVELOPMENT STRATEGYThis product development methodology provides a framework for identifying and characterizing the significant factors contributing to the variation in key ammonia sensor product functions. It starts with a top-down management project selection that is provided to the team to ensure that the organizational priority is in place. It is an effective tool for getting a cross-functional team to rapidly define all the product's intended functions.Although this product is a sensor which provides both ammonia sensing and NO2gas sensing in the same planar ceramic element, this project's scope was limited to the ammonia sensing requirement.With management priorities established and the appropriate resources in place for this project, it took only approximately nine months to go from project selection to identification of key product characteristics that were driving variation in ammonia sensor outputs. CHARACTERIZATION OF THE NEW SENSOR BY HIGH RISK FUNCTION There are many customer requirements for this product, but all do not represent the same amount of risk. Some requirements are functions that have been successfully delivered in other products, while other functions are entirely new to this specific product. These new functions are referred to as high risk functions throughout this paper. To understand the relationship between customer requirements, risk and product function, a tool called function modeling was used. [2, 3, 4] The following high risk functions were included in the function model: 1) “Sense Ammonia” and 2) “Sense NO2,” both of which are customer requirements. The team's initial focus was on the “Sense Ammonia” function.The Function Model in Figure 2 shows that one of the key functions that must be achieved to “sense ammonia” is to create a voltage. There are many “intermediate functions”that must occur to “create voltage” as shown in Figure 2. Ultimately, those intermediate functions are achieved by “potential contributing variables” shown at the right side of the function model. The goal of the project team was to identify and separate the “vital few” from the “trivial many.”[5] These vital few characteristics then become the critical product and process characteristics that ultimately allow the“Sense Ammonia” function to be successfully achieved.Figure 2. Function Model - Functions to the right of a box answer the question “how” a function is achieved, or by what method. Functions to the left of a box answer the question “why” a function is achieved, or what is thegoal.Once completed, the function model provided those potential critical product characteristics (or potential critical process parameters) for the “Sense Ammonia” function.All prototype sensors built at the Delphi development facility were evaluated using a research-grade gas bench test. Performance run charts were created for important characteristics to assess product and process capability as shown in Figure 3. This historical prototype data indicated that performance characteristics tended to shift when new lots of materials were introduced. From this data, it was known that the raw materials in the ink used to make the sensor electrodes were among the most critical product characteristics. Thus the variables for the study were selected from among the materials used to formulate the ammonia electrode ink.Figure 3. Performance run chart of ammonia sensorvoltage output.The function model clearly identified the high risk process relationships that needed to be understood and confirmed. It also provided a deeper understanding of how the product actually worked and identified the need for critical process control features. The high-level functions to create a sensor output voltage are shown as “Intermediate Functions” in the function model format in Figure 2.RISK REDUCING HIGH RISK FUNCTIONSThe completed function model captures the critical product characteristics (from the far right-hand side of the function model) that ultimately drive the function that meets the customer requirements (at the far left-hand side of the function model).To ensure that engineering resources were focused on the highest-risk functions, risk priority numbers (RPN) were assigned to each of the critical product functions based on three ranking criteria:1). The amount of cause-effect characterization work that had been done to understand the physics of how the sensor actually functions. If the physics was well understood and documented, the risk is lower than if the physics was not well understood and documented (analogous to “Occurrence” in FMEA [5]).2). The effectiveness of the measurement systems being used to characterize the physics of the sensor function. If a variable measurement system existed that had sufficient accuracy and repeatability, it was lower risk than an attribute measurement system that could only tell “good” from “bad”(analogous to “Detection” in FMEA [5]).3). The risk associated with the sensor failing to achieve the high risk function (analogous to “Severity” in FMEA [5]). The product of these three ranking criteria defines the RPN. After compiling the RPN scores, a Pareto [6] of high-risk functions was established, and the appropriate project teams were assigned based on the highest combined RPN score(Figure 4).Figure 4. Leveraging cumulative risk score for strategicproject selectionOUTPUT MEASUREMENT SYSTEM VERIFICATIONWhen attempting to characterize any cause-effect relationships, it is necessary to have a measurement system that is sufficient to discriminate the desired product performance output. Real differences in product performance outputs are masked by the “blind spot” of measurement error-if the “blind spot” is too large, important changes in the output might not be seen because measurement error is large. Consequently, a measurement system analysis must be performed to determine the size of the measurement error, or “blind spot.”The tool chosen for analyzing the key measurement systems in this analysis was the Shainin Isoplot®. Once completed, the measurement systems that had acceptable measurement error were identified (see Figure 5), and those that had unacceptably high measurement error were studied in more detail to identify the source of the error and correct it (see Figure 6).The primary product outputs that were verified using the Shainin Isoplot® technique were:• Ammonia sensor output voltage• Ammonia sensor response time• Ammonia sensor impedanceFigure 5. Isoplot® of Sensor Output VoltageMeasurement System with Good RepeatabilityFigure 6. Isoplot® of ammonia measurement systemwith poor repeatability The poor repeatability of the ammonia impedance measurement system drove the team to look for an alternative measurement system. In the past, a change in product output due to measurement error may have been misinterpreted as a change due to actual product variation.UNDERSTANDING FACTORS THAT CONTROL KEY PRODUCT PERFORMANCE OUTPUTSEleven ink-related variables were identified from the function model as being potentially significant to the “sense ammonia”function. With eleven variables, a standard full factorial experiment would require 2,048 separate experimental ing fractional factorial experiments would significantly reduce the number of trials needed, but could provide unclear results from the inherent confounding of interactions with main effects in such designs. This is an important consideration when the cause-effect relationships of thecritical characteristics and their interactions are not yet fully understood.Ultimately, Variable Search™ [7] was selected as the technique to understand which of the eleven variables are critical in the ink formulation. Variable Search™ is a technique that can be used when there are a large number of variables that need to be experimentally quantified as to their physical and statistical significance. It is appropriate to use when the list of variables is so long that a DOE would be too time intensive or expensive to screen out critical factors. It relies on the concept of a “binary search” to systematically eliminate variables or groups of variables that may be contributing to the cause-effect relationships.To begin the Variable Search, the team needs to have the candidate factors arranged in two sets: one set where the factor levels are expected to result in a high output and a second set where the same factors are set to levels expected to result in a low output. Repeat tests are run to confirm that the output differences are significant enough and that the results are repeatable. If the differences repeat, then the levels between the two sets are swapped, one factor or a group of related factors at a time until a change in output is seen in one or both of the sets. In this way, main effects as well as interactions will be exposed.The levels for all the ink-related variables in the experiment were chosen to provide a significant difference between the sensor performance outputs. If a significant difference was achieved, that difference could then be attributed to differences in the ink variable levels. The deviations from the nominal ink formulation were chosen to be slightly outside the expected range of variation, but not so far out as to create a non-functioning sensor.The aforementioned three sensor outputs were evaluated using Variable Search™. For illustrative purposes, only the results from the sensor output voltage are presented here.Figure 7 shows the results of the Variable Search™. Each graphed data point represents the output from an individual sensor. The three left-most pairs (called Stage I) show that the significant variables were captured in the eleven variables tested because there is complete separation between the sensor outputs from the “low” and “high” level groups of variables. Decision limits are then calculated around each set of data (dashed blue and red lines in Figure 7).Stage II begins by swapping levels of variables or groups of variables to determine which drives a change to sensor voltage magnitude outside of the home decision limits. Any swap that results in a data point outside of its home decision limit means that variable is a suspected significant variable.Stage II, as shown in Figure 7, identified three potentialfactors that are suspected significant variables which appear to be driving sensor output voltage variation.Swapping levels of “Material A” caused the low-level combination data point to move out of its own decision limits and into the other. However, the high-level combination data point stayed in its home decision limits. Because there was not complete reversal of the data points, there must be another factor interacting with Material A.The next swap of levels of “Material B” showed a similar effect to swapping levels of Material A. In this case, however, the swap of levels resulted in the low-level combination data point to move outside its own decision limits and not into the other decision limits. Once again, there must be another factor interacting with Material B.The results of swapping levels of “Material D” were nearly identical to that of swapping levels of Material A. The magnitude of the change was slightly greater, however. The conclusion was again that Material D is interacting with another factor.At this point, a confirmation run (called Stage III) was performed involving a swap of all three factors' levels (A, B & D) together to confirm whether the difference seen in Stage I could be attributed to levels of those three materials.The confirmation run is shown as the last swap in Figure 7. Because swapping the levels of Materials A, B & D resulted in a complete reversal of data points, all three variables are significant.An additional conclusion can be drawn from these results. Because variation in these three materials' levels resulted in a complete reversal, the other eight factors not tested can be ruled out as significant contributors to the overall variation. By controlling the levels of these other eight factors to their Stage I values, the increase in variation in ammonia sensor output voltage will be minimal, providing Materials A, B & D are appropriately controlled.In summary, the Variable Search™ provided a sound framework to identify and confirm the significant factors that drive variation in ammonia sensor output voltage.The measurement device used to execute the initial Variable Search™ experiments was a research-grade gas test bench that required highly trained and certified personnel to operate the equipment. This research test bench only had the capability to test and collect product performance data on completed sensor assemblies. To accelerate test plan execution and avoid the complexity of the research gas bench, a simpler and leaner production-intent ammonia sensor element tester was designed and built. The product function model and measurement systems analysis were key inputs into the equipment specification created to define the ammonia sensor element tester requirements.Following the same methodology used to identify and reduce risk for the ammonia sensor element itself, the high-risk functions were identified for the element test equipment design and build. In this case, the customer requirements were internal, and were in regard to measurement system analysis (e.g. repeatability, reproducibility, stability, linearity, accuracy, etc.) for the sensor element outputs.The commissioned and qualified ammonia sensor element tester provides:1). the capture of lessons learned for both the production test equipment design and component performance characterization,2). development of software test modules that can be transferred to a production tester,3). more efficient testing with a device easily operated by non-specialized personnel, and4). faster execution of the “binary searches” in futureVariable Search™ experiments.Figure 7. Variable Search™ is used to identify potential significant factors that contribute to the overall variationof a given product output. MEANINGFUL SPECIFICATIONDEVELOPMENTOnce the most detailed product/process functions have been identified with the function model, and the cause-effect relationships of the variables that drive those functions have been identified and statistically confirmed with Variable Search™, the next step is to determine meaningful specifications for them.The Tolerance Parallelogram™ technique will be used to establish the natural tolerances for the critical productcharacteristics identified from the Variable Search™ (Figure 8). Tolerance Parallelogram™ establishes the cause-effect relationship between the independent and dependent variable using regression on a scatter plot, and then defines 95%tolerance bands based on the amount of scatter from the variation due to all of the other characteristics.The specifications for the product function are used to graphically determine the corresponding required control limits for the independent variable, vis-à-vis the criticalproduct characteristic.Figure 8. A Tolerance Parallelogram™ is used to define a realistic tolerance around a critical variable (Ink material D %) to capably meet the customer requirementfor ammonia sensor output voltage.TYING IT ALL TOGETHERThe linkage matrix (Figure 9) is a tool used to tie the new profound knowledge together in a single read-across document. The high-risk functions, all measurement system information, confirmation of cause-effect relationships of the critical characteristics to the high risk function and their corresponding natural tolerances are summarized in thelinkage matrix.Figure 9. Linkage matrix is a tool used to tie the profound knowledge together in a single read-across document. The high-risk function's documentation is shown on the left half of the document, with the causal variables and their corresponding tolerances and measurement systems shown on the right half.CONTROLLING VARIATION OF KEY PRODUCT PERFORMANCE OUTPUTSThe Variable Search™ experiments provided a methodology to more fully understand the cause-effect relationships of the product variables that are controlling critical sensor functions and outputs. This critical product / process understanding is essential to properly specify production-intent test equipment.The fully defined linkage matrix will be used to populate and develop the production process control plan [8] with significant control variables, realistic tolerances and meaningful reaction plans (Figure 10).It is important to fully understand all sensor product outputs and have the means to accurately test and measure the significant product variables upstream in the manufacturing process. Only by developing complete and thorough equipment specifications that fully define the testing requirements, can one be assured of compliant product moving forward through the manufacturing process.Figure 10. The linkage matrix drives development of ameaningful process control plan. LEVERAGING PROFOUND KNOWLEDGE IN THE ORGANIZATIONInstitutionalizing the applicable new knowledge to other sensor types and test equipment designs, current and future is the responsibility of management. The project leader needs to summarize discoveries in a clear and concise project format so that the rest of the organization can quickly assimilate the applicability of the new knowledge to existing product designs and/or manufacturing processes. The project sponsor is responsible for assessing the leverage opportunity of the new knowledge locally within the organization and communicating the findings to executive leadership for global leverage assessment.CONCLUSIONApplying the Shainin proactive risk reduction methodologies has been shown to accelerate profound knowledge capture in the early phases of new product development where risk can be more easily mitigated.This approach also provided an organizational framework to establish project priorities and promote early product and process cross-functional collaboration. The confirmed key factors that control critical product outputs can be used to develop meaningful specifications and a data-driven process control plan that targets processes to reduce variation.In this case study, the team identified the high risk function to be the “Sense Ammonia” function and developed a focused test plan to quantify the critical performance factors in the ink formulation controlling the ammonia sensor output voltage and other sensor performance characteristics. The Shainin ®Variable Search™ technique was able to quickly isolate the critical few factors responsible for controlling the ammonia sensor output without the need for sophisticated computer simulations or exhaustive full factorial Design of Experiments. This knowledge provides the basis for developing meaningful incoming ink material specifications as well as an element fabrication process control plan to effectively manage the sensor output variation in production. To date, this approach to product development has been shown to systematically expose problems earlier in the process as opposed to identifying them later when the risk to the product and customer would be much higher. ACKNOWLEDGMENTSThe authors would like to gratefully acknowledge the contribution of the Delphi Powertrain Systems Advanced Engineering Team responsible for the development of the ammonia sensor at the Customer Technology Center Michigan in Auburn Hills, Michigan, as well as the technical consulting provided by Shainin LLC. REFERENCES1. Wang, D.Y., Yao, S., Shost, M., Yoo, J.-H. et al.,“Ammonia Sensor for Closed-Loop SCR Control,” SAE Int. J. Passeng. Cars - Electron. Electr. Syst. 1(1):323-333, 2008.2. Kaufman J. Jerry, Value Engineering for the Practitioner, North Carolina State University, 3rd edition 19893. Bytheway Charles, Fast Creativity & Innovation: Rapidly Improving Processes, Product Development and Solving, J. Ross Publishing, 20064. Miles Lawerence, Techniques of Value Analysis and Engineering, Mcgraw-Hill (Tx); 2 edition, 19725. Automotive Industry Action Group (AIAG) Manual -Potential Failure Mode & Effects Analysis, 4th Edition, 20086. Pareto Vilfredo, Manual of political economy, Translated by Schwier Ann S.. Edited by Schwier Ann S. and Page Alfred N., MacMillan, 19727. Shainin Dorian and Shainin Peter, Better than Taguchi Orthogonal Tables, Shainin Consultants, Inc., Manchester, CT 19888. Automotive Industry Action Group (AIAG) Manual -Advanced Product Quality Planning and Control Plan (APQP), 2nd Edition, 2008The Engineering Meetings Board has approved this paper for publication. It has successfully completed SAE's peer review process under the supervision of the session organizer. This process requires a minimum of three (3) reviews by industry experts.All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.ISSN 0148-7191doi:10.4271/2010-01-0391Positions and opinions advanced in this paper are those of the author(s) and not necessarily those of SAE. The author is solely responsible for the content of the paper. SAE Customer Service:Tel: 877-606-7323 (inside USA and Canada)Tel: 724-776-4970 (outside USA)Fax: 724-776-0790Email: CustomerService@SAE Web Address: Printed in USA。

red中文翻译
Red一词有许多不同的翻译，其中略有区别，可以根据上下文场景
和使用的方式来获得准确的翻译。

最常见的翻译就是“红色”，它表示一种颜色，是光谱图中所有
波长介于610至780纳米之间的可见光的总称，也是R、G、B的最重
要的一种颜色，可用RGB模型中的数值(255, 0, 0)来表示。

另外，Red还可以翻译为“热情”，意即“热烈而充满热情的”，
指人们发出热情、乐观、积极、有活力、勤奋精进及努力奋斗、献身
事业等激情情感，这还可以拓展到其他方面，例如热烈的政治场合，
以及对某事物的狂热的热情。

此外，Red还可以被翻译为“红宝石”，在我国古代，红宝石被认
为是吉祥、幸运的宝石，可以抵御魔鬼带来的厄运，保护主人不受恶
劣环境之害，它也象征着爱情、婚姻、和睦，所以广泛用于婚宴礼服、礼品等。

最后，Red还可以被翻译为“稳定”，指在一定时期内，能够保持
良好的持续性，并能确保实体价值的稳定，这是企业中很重要的一环。

RED SCARLET-X 摄影机V2.0.5中文操作手册英文版权所有：中文版权所有：拍电影论坛网友讠讠免费索取，欢迎传播目录RED SCARLET-X 摄影机V2.0.5中文操作手册 (1)1.声明 (7)1.1.版权提示 (7)1.2.注册商标声明 (7)2.遵循标准 (7)2.1.加拿大 (7)2.2.FCC (7)2.3.澳大利亚和新西兰 (7)2.4.欧盟 (7)3.开始之前 (7)3.1.安全提示 (7)4.操作原理 (7)4.1.MYSTERIUM X感光器 (8)4.2.图像处理 (8)4.3.HDR X (8)4.4.M AGIC M OTION (8)4.5.录音 (8)4.6.M IC L EVEL输入 (8)4.7.L INE L EVEL输入 (8)4.8.监看输出 (8)4.9.RED LCD/BOOM EVF取景器 (8)4.10.RED MOTE遥控器 (8)4.11.D IGITAL M AGAZINE数字弹匣（存储介质） (8)5.摄影机操控部件 (8)5.1.主机 (8)5.2.SSD固态硬盘 (8)5.3.手柄 (8)5.4.RED MOTE遥控器 (11)5.5.BOOM EVF取景器 (11)5.6.LCD触摸屏 (11)6.基本操作 (11)6.1.供电 (11)6.2.图形化用户界面与操作 (11)6.3.使用LCD触摸屏操作菜单 (11)7.初次使用：设置你的RED SCARLET-X (11)7.1.连接电源 (12)7.2.开机 (12)7.3.准备录制 (12)7.4.连接与格式化存储介质 (12)7.5.进行B LACK S HADING校准 (12)7.6.调整项目设置 (12)7.7.录制 (12)7.8.录制指示器 (12)7.9.回放 (12)8.菜单操作 (12)8.1.设置调整 (12)8.1.1.使用基本设置菜单 (12)8.1.2.使用高级设置菜单 (13)9.主菜单 (13)9.1.FPS帧速 (14)9.1.1.非时基帧速 (14)9.1.2.基本设置 (14)9.1.3.高级设置 (15)9.2.ISO感光度 (15)9.3.光圈（F值） (16)9.3.1.使用DSMC TI PL接口 (16)9.3.2.使用佳能EOS接口 (16)9.4.1/秒（曝光） (17)9.4.1.基本设置 (17)9.4.2.高级设置 (18)9.5.白平衡 (20)9.5.1.基本设置 (20)9.5.2.高级设置 (20)9.6.分辨率 (22)9.7.RED CODE编码 (23)9.7.1.REDCODE与帧速对应表 (23)10.二级菜单 (23)10.1.HDR菜单 (24)10.1.1.HDR开启/关闭 (24)10.1.2.STOPS（档数） (24)10.2.F OCUS对焦菜单 (25)10.2.1.MODE（对焦模式） (25)10.2.2.ZONES（对焦框类型） (27)10.2.3.DSMC TI PL接口 (29)10.2.4.佳能EOS接口 (30)10.3.E XPOSURE曝光菜单 (30)10.4.P RESETS预置菜单 (30)10.4.1.Create创建 (30)10.4.2.Import/Export导入/导出 (32)10.4.3.Delete删除 (34)10.5.M EDIA存储介质菜单 (35)10.5.1.选择存储介质 (35)10.5.2.设置存储介质 (35)10.5.3.格式化存储介质 (36)10.5.4.卸载存储介质 (37)10.5.5.工具 (37)10.6.S ETTINGS设置菜单 (38)10.6.1.Display显示 (38)10.6.2.Look (49)10.6.3.Project项目 (51)10.6.4.Audio/Video 音频视频 (53)10.6.5.Setup设置 (58)10.6.6.Maintenance维护 (68)10.6.7.Playback回放 (77)10.7.电源 (84)10.7.1.电源状态 (84)10.7.2.关机 (85)11.附录A：升级固件 (86)11.1.确认当前版本 (86)11.2.升级步骤 (86)11.2.1.多台摄影机 (86)12.附录B：数字文件管理 (86)12.1.存储介质 (87)12.2.格式化 (87)12.3.可用容量 (87)12.4.卸载存储介质 (87)12.4.1.使用遥控器/触摸屏 (87)12.4.2.使用手柄 (87)12.4.3.使用SSD (87)12.5.拷贝文件 (87)12.6.删除文件 (87)12.6.1.Mac OS X系统 (87)12.6.2.Windows系统 (87)13.附录C：充电 (87)13.1.REDVOLT (87)13.1.1.电池LED阵列 (87)13.1.2.电池性能 (87)13.2.RED T RAVELCHARGER (87)13.2.1.操作 (87)13.2.2.充电 (87)14.附录D：输入/输出接口 (87)14.2.主机后方 (88)14.2.1.HD-SDI (88)14.2.2.耳机 (88)14.2.3.SYNC（视频同步 (88)14.2.4.CTRL（RS232控制）） (88)14.2.5.GIG-E（以太网） (88)14.2.6.DC IN（电源输入） (88)14.2.7.HDMI输出 (88)14.3.侧面SSD模块 (88)14.4.RED MOTE遥控器 (88)15.附录E：遥控操作 (88)15.1.控制、接口与显示 (89)15.1.1.控制 (89)15.2.操作 (89)15.2.1.REDmote菜单 (89)15.2.2.充电/电池寿命 (89)15.2.3.连接/移除 (89)15.2.4.无线连接 (89)15.2.5.开机/关机 (89)15.2.6.操作摄影机 (89)15.2.7.录制 (89)15.3.维护 (89)15.3.1.升级遥控器固件 (89)15.4.遥控多台摄影机 (89)16.附录F：3D设置/操作 (89)16.1.概览 (90)16.2.摄影机设置 (90)16.2.1.主摄影机 (90)16.2.2.从摄影机 (90)16.3.命名规则 (90)16.4.连接摄影机 (90)16.4.1.改变设定 (90)16.4.2.录制 (90)16.4.3.关机 (90)17.附录G：曝光-使用FALSE COLOR和ISO (90)17.1.欠曝（大约2档） (90)17.2.过曝（大约2档） (90)17.3.正确曝光 (90)17.4.调整ISO (90)18.附录H：后期 (90)19.附录I：维护 (90)19.1.清洁 (91)19.1.1.摄影机与附件外部 (91)19.1.2.主机 (91)19.1.3.LCD屏（触摸/非触摸） (91)19.1.4.EVF寻像器 (91)19.1.5.遥控器屏幕 (91)19.1.6.镜头 (91)19.1.7.手柄LCD (91)19.2.后焦调整 (91)20.附录J：故障处理 (91)20.1.找不到存储介质 (91)20.2.录制停止：录制错误、关机 (91)20.3.无法应用预置 (91)20.4.无法配对 (91)21.附录K：技术参数 (91)21.1.参数表 (91)22.附录L：菜单结构图 (91)1.声明1.1.版权提示1.2.注册商标声明2.遵循标准2.1.加拿大2.2.FCC2.3.澳大利亚和新西兰2.4.欧盟3.开始之前3.1.安全提示4.操作原理4.1.MYSTERIUM X感光器4.2.图像处理4.3.HDRx4.4.Magic Motion4.5.录音4.6.Mic Level输入4.7.Line Level输入4.8.监看输出4.9.RED LCD / BOOM EVF取景器4.10.REDmote遥控器4.11.Digital Magazine数字弹匣（存储介质）5.摄影机操控部件5.1.主机5.2.SSD固态硬盘5.3.手柄上视图⏹电池仓开启按钮：开启手柄电池仓⏹对焦/录制按钮：半按自动对焦，全按开启/停止录制⏹拨盘：用于调整参数值，功能与转轮相似⏹LCD菜单键：1-ISO 2-光圈3-快门4-白平衡⏹LCD显示屏：显示主要参数⏹LCD背光按钮：开启LCD背光前视图⏹照片/视频切换开关：用于切换照片/视频模式注意：该开关目前尚未启用，默认是在视频模式上后视图⏹+/-按钮：加减自定义键对应的参数值⏹导航组合键：用于菜单选取和参数设置●转轮：选择和调整参数值●方向键：选择菜单，也可用于选择参数●ENTER键：确认键⏹自定义键：用户自定义键A-D（F），默认设置如下：−A：辅助对焦−B：计算白平衡−C：False Color > 1:1放大−D：False Color > 曝光检查⏹系统键：功能由系统固件决定，用户可编程−上：False Color曝光检查−中：未定义−下：卸载当前存储介质5.4.REDmote遥控器5.5.BOOM EVF取景器5.6.LCD触摸屏6.基本操作6.1.供电6.2.图形化用户界面与操作6.3.使用LCD触摸屏操作菜单7.初次使用：设置你的RED SCARLET-X7.1.连接电源7.2.开机7.3.准备录制7.4.连接与格式化存储介质7.5.进行Black Shading校准7.6.调整项目设置7.7.录制7.8.录制指示器7.9.回放8.菜单操作取景器上方显示了一系列参数，包括帧速、ISO、光圈、快门、白平衡、分辨率和画质等等。

RED摄影机中英文对照菜单新手必备Menu菜单：Image图像处理Monitoring监视控制Overlays叠加/显示Power电源Playback回放Media媒体Presets预设Settings设置Search搜索Add Shortcuts添加快捷方式Close关闭Back上一页Menu菜单→Image图像处理Image Pipeline色彩管理White Balance色温ISO感光Color色彩Gain增益Curves曲线LGG三种色彩增益3D LUT立体查色表Menu菜单→Image图像处理→Image Pipeline色彩管理Options选项Mode模式Color Space颜色空间Gamma Curve伽马曲线Output Summary输出参数R3D File Metadata R3D文件数据信息3D LUT立体查色表数据Intermediate/Proxy File元数据与代理文件参数Color Space/Gamma Curve元数据参数Codec代理文件参数Menu菜单→Image图像处理→White Balance色温Incandescent白炽灯Tungsten钨丝灯Fluorescent荧光灯Flashi闪光Daylight日光Cloudy多云Shade阴天Auto White Balance自动白平衡Menu菜单→Image图像处理→ISO感光FLUT感光微调Shadow阴影Exposure Adjust曝光微调Use new ISO calibration for HELIUM sensor使用Helium新感光标准校正Menu菜单→Image图像处理→Color色彩Saturation饱和度Contuast对比度Brightness亮度Exp Comp曝光补偿Menu菜单→Image图像处理→Gain增益Color色彩User Matrix用户矩阵RED红色Green绿色Blue蓝色Menu菜单→Image图像处理→Curves曲线Luma亮度Red红色reen绿色Blue蓝色Reset Curve还原初始设置Menu菜单→Image图像处理→LGG三种色彩增益Lift提升Red Lift提升红色Green Lift提升绿色Blue Lift提升蓝色Gamma伽马Red amma红色伽马Green amma绿色伽马Blue amma蓝色伽马Gain增益Red Gain红色增益Green Gain绿色增益Blue Gain蓝色增益Menu菜单→Image图像处理→3D LUT立体查色表Creative3D LUT立体查色表库ImPORT/Export倒入/倒出ALL全部In Camera摄影机上的查色表信息On Media:\luts储存卡上的查色表信息Menu菜单→Monitoring监视控制Monitors监视选项Test Signal测试信号Look Around查看选项Advanced高级选项Menu菜单→Monitoring监视控制→Monitors监视选项LCD Top主触控屏控制EVF Top主取景器控制LCD Left副触控屏控制EVF Left副取景器控制HDMI HDMI控制HD-SDI3G SDI控制Sidekick侧控助手控制Priority优先级Menu菜单→Monitoring监视控制→Monitors监视选项→LCD Top主触控屏控制Mode模式Overlay界面叠加Tools工具Overlay覆盖Standard(RED)标准Framed Overlay框架重叠Frequency频率Auto Hide Menus自动隐藏菜单Display Preset显示预设Flip/Mirror界面翻转/镜像Brightness亮度调整Menu菜单→Monitoring监视控制→Monitors监视选项→EVF Top主取景器控制Mode模式Overlay界面叠加Tools工具Overlay覆盖Standard(RED)标准Framed Overlay框架重叠Frequency频率Auto Hide Menus自动隐藏菜单Display Preset显示预设UI Flip/Mirror用户界面翻转/镜像Brightness亮度调整Menu菜单→Monitoring监视控制→Monitors监视选项→LCD Left副取景器控制LCD/EVF Left/HDMI Select副显示线路选项LCD/EVF Left副显示Tools工具Mode模式Overlay界面叠加Framed Overlay框架重叠Overlay覆盖Standard(RED)标准Auto Hide Menus自动隐藏菜单Frequency频率UI Flip/Mirror用户界面翻转/镜像Brightness亮度调整Menu菜单→Monitoring监视控制→Monitors监视选项→EVF Left副取景器控制Menu菜单→Monitoring监视控制→Monitors监视选项→HDMI控制LCD/EVF Left/HDMI Select副显示线路选项LCD/EVF Left副显示Tools工具Mode模式Overlay界面叠加Framed Overlay框架重叠Resolution分辨率Display Preset显示预设Menu菜单→Monitoring监视控制→Monitors监视选项→HD-SDI控制Mode模式Overlay界面叠加Enble授权Overlay覆盖Standard(RED)标准Tools工具Resolution分辨率Framed Ovelay框架重叠Display Preset显示预设UI Flip/Mirror用户界面翻转/镜像Menu菜单→Monitoring监视控制→Monitors监视选项→Priority优先级Highest priority最高优先级LCD小监EVF取景器LCD Left副触控屏EVF Left副取景器Menu菜单→Monitoring监视控制→Test Signal测试信号Off关闭Chip Chart国际标准色卡SMPTE Bars广播级国际标准色卡Luma亮度区间变换Audio Tone音频提示Menu菜单→Monitoring监视控制→Look Around查看选项Off关On开Menu菜单→Monitoring监视控制→Advanced高级选项Video视频Small Dialogs on9"LCD在9时屏幕上使用小对话框Allow Reduced Judder Preview允许降低抖动预览Global Flip/Mirror旋转屏幕Output Sharpness输出精度Auto Focus Peaking自动聚焦峰值Touch触控选项Look Touchscreen屏幕锁Gestures手势Pinch To Magnify手势放大Double Tap Right To Record双击屏幕右上角25%范围录制/停止Double Tap Left To AF双击屏幕左侧自动对焦Genlock Offset同步偏移0pixels输出信号强度Menu菜单→Overlays叠加/显示Tools工具Status显示模式Guides参考线Custom自定义Menu菜单→Overlays叠加/显示→Tools工具False Color假色Magnify对焦放大RAW灰度曝光预览Horizon摄影机水平Zebras斑马纹Raw Style风格Menu菜单→Overlays叠加/显示→Status显示模式Camera设置摄影机显示参数Exposure曝光方式Shutter Speed以快门方式显示Shutter Angle以开角度方式显示Power电源显示方式Current Batt%电量百分比Total Time电池可用时间VU Meter音频进出显示切换Input录制音频显示Output输出音频显示Histogram直方图显示方式RGB彩色显示Luma亮度显示（单色）Media储存卡显示方式切换Percentage储存卡剩余百分比Time Remaining储存卡剩余录制时间Lens镜头Aperture Increments光圈递增1/4Stop1/4曝光标准1/3Stop1/3曝光标准（默认）Focus Distance焦距Metric公制显示对焦距离Imperial英制显示对焦距离（默认）Rack Show Distance变焦距离显示启用/禁用On屏幕显示跟焦距离Off屏幕不显示跟焦跟离Menu菜单→Overlays叠加/显示→Guides参考线Frame Guide构图参考线Mode模式Scale取景框占屏比例Offset X/Y选框左右上下偏移Apperance取景框设置Solid实线Green绿色Action Guide操作参考线Relative to Frame Guide选框分辨率数值Title Guide字幕参考线General通用Relative To相对应用范围Color颜色Opacity不透明度Center中心十字线Recording Area记录区White白色Grid九宫格Yellow黄色Shading阴影Frame Guide框架Black黑色Menu菜单→Overlays叠加/显示→Custom自定义In Camera摄影机预留参数On Media overlays储存卡中可调用的参数3D Left(RED)3D右机屏显Standard(RED)标准显示Guides(RED)构图框Stills(RED)静态显示None(RED)屏幕无菜单Create创建Clone克隆Edit编辑Delete删除Menu菜单→Power电源Power In电源输入Source源DC-PORTX交流电V-mount电池Power Out电源输出Out输出Amps安培Status现状Reset重置Shutdown关闭摄影机Power Save省电选项Low Power Preview低功率预览Never停用Sleep睡眠Aotu Shutdown自动关机Menu菜单→Playback回放待机状态下与回放状态下点进Menu的界面有所不同Image图像处理Monitoring监视控制Overlays叠加/显示Power电源Record待机Media媒体Presets预设View查看参考框Settings设置Add Shortcuts添加快捷方式Search搜索Menu菜单→Media媒体Device对储存卡进行操作Clips略图预览模式Playlist播放列表Active Media选择储存器Eject Media弹出储存卡Model Number储存器型号Media contains69clips(47%free0:15time remaining)储存器数据显示More info更多信息Format Media格式化储存卡Utilities高级工具Load加载（播放）Media ClIP list媒体缩略图列表Play播放Clear取消Clear All全部取消Menu菜单→Presets预设Camera Presets摄影机预设In Camera摄影机中的数据On Media presets自动预设Apply加载数据Create创建Update更新Clone克隆Delete删除Looks视觉效果Auto Presets自动预设Preset预设Startup启动NONE关闭Motion运动Stills静止Playback播放Menu菜单→Settings设置Menu菜单→Settings设置→Project项目Frame Rate帧数（格数）Recording Frame Rate录制帧率（格数）Project Time Base基准帧率（格数）Exposure曝光Timecode时间码控制Timecode Display Mode时码显示模式TOD时码持续Edge录制时走码Source源External外部提供Slate场记板Scene场景Scene场数Shot镜号Take次数Copyright版权方Location场地位置Camera摄影机Slate Camera ID机位名称Slate Cam Pos摄影机属性Center中间Camera Operator撑机Project项目Production片名Director导演DoP摄影指导Unit摄影组别Auto Slate自动场记板Auto Head Frames同步第一帧Auto Tail Frames同步末尾帧Format分辨率设置Format格式Resolution分辨率Aspect Ratio画幅比Anamorphic变形Dimensions分辨率数值显示Set Format设置格式Anamorphic变形宽荧幕Filter转换Sensor感光器(倒置)Flip/Mirror Scan Direction切换镜像录制模式Note:this is not a monitor flip/mirror.This will flip/mirror the sensor data-even in the recorded R3D file.注意：这不仅仅是在监视器上的镜像，而是将视频素材录制为镜像（适用于3D拍摄）Menu菜单→Settings设置→Recording录制选项Mode模式Storage机内、外录制Local机内录制External外部录制Continuous Record连续录制Continuous Record连续录制Internal Timelapse Timer延时（逐格）录制Frame Trigger帧触发器Speed Ramp Mode变速拍摄模式REDCODE Burst快速连拍Multi-Shot静态照片拍摄LiMIT Enable指定录制帧数Motion+Stills按机体右侧录制键录制后，按前置录制建标记关键帧Codec编解码器Record File Format记录文件格式R3D+Apple ProRes RED格式加苹果格式REDCODE压缩比Resolution分辨率Video Codec记录文件解码Dimension苹果格式文件的分辨率Frame Processing帧处理No Frame Processing无帧处理Number of Frames帧数Pre-Recoad预录Duration预录时间（秒）Always Trigger选择持续使用预录功能Tigger Pre-Record Now触发预记录Indicator提示Enable Sounds启用时间Record Start录制开始Record Stop录制停止Tag Still Frame静止帧标签EVF Tally Light目镜指示灯SSD Tally Light储存卡指示灯Menu菜单→Settings设置→HDRx高动态模式Mode模式Off关闭HDRx开启Factor档位Monitor Track效果预览A Track查看A档X Track查看X档Menu菜单→Settings设置→Audio音频Control音频控制channel1/2通道1/2Source音频源Camera internal机内录音Name音轨名称Pre-Amp Gain前置音频增益CAM Internal摄影机内部Headphone Volume耳机音量Left左声道Right右声道Mute静音Mix混音器Headphone Mix耳机混音设置Monitor Mix监视器混音设置Camera Interral机身内置调整Rear Anglog外接调整Menu菜单→Settings设置→Focus对焦功能Mode模式Confirm确认（启用）Zone区域Spot点Size大小Small小的Confirm Style确认方式Circle圈Rack焦点设置Rack Speed变焦速度Rack Poits焦点位置Re-Autofocus重新对焦Menu菜单→Settings设置→Exposure Assist曝光辅助Mode模式Off关闭Single Shot单次触发Continuous in Preview连续预览Continuous in Preview/Record连续预览/录制Exposure Priority曝光优先选择Manual手动Auto自动Av光圈优先TV快门优先Exp Comp曝光补偿Meteting Mode测光模式Speed速度Selection Mode选择模式Closest Value Selection from List从列表中选择最接近的值Menu菜单→Settings设置→Setup设置Menu菜单→Settings设置→Setup设置→Keys按键设置Key Mapping按键映射Press a user key to remap按用户需求设定Options选项Show key action notifications显示关键动作通知Lock Side Module Keys锁侧手柄模块Record key remains active when locked锁定时，录制键保持激活Navigation keys remain active when locked锁的导航键（小转盘）保持激活Soft Keys软键Key Disabled热键禁用Search在此搜索想要的功能Enable Soft Keys on touchscreen启用屏幕按键Show key action as labels在软键上显示快捷名称Advanced高级Key Source按键源BRAIN主机User Key自定义按键Key Action按键操作Sound:other声音：其它Menu菜单→Settings设置→Setup设置→Date/Time日期/时间Date日期April四月Local Time当地时间Time Zone时区Menu菜单→Settings设置→Setup设置→Communication通讯/连接设置Camera摄影机Camera ID摄影机名称DEFAULT默认（可自定义）Target主从机设置All控制全部None被控制Custom指定控制目标Target ID目标名称Serial串行Ctrl Protocol控制协议None关闭Serial Protocol串行协议Ethernet以太网HDCP服务器IP Address IP地址Netmask子网掩码Gateway网关地址Camera to Camera摄影机到摄影机External Control外部控制WiFi无线Mode模式Disabled停止无线通讯Disabled状态关闭Ad-HOC内置无线Infrastructure基础设备RCP控制面板Remote Control Panel:Enable遥控面板启用Remote Addrese远程地址Menu菜单→Settings设置→Setup设置→GPIO/Sync通用输入输出/同步Sync同步Sensor Sync Mode传感器同步模式Off关闭BRAIN GPIO机身输入输出SW In High信号办理入最高Key Disabled禁用SW In Low信号输入最低Record Toggle录制触发GPO Function信号输出选项Recording Indicator Out记录表Menu菜单→Settings设置→Setup设置→Fan Control风扇控制Adaptive机器适应温度Maximum Record Speed录制时最高转速Maximum Preview Speed待机时最高转速Target Temperature目标温度Post Record Delay记录延时Adaptive Preview Quiet Record录制时风扇进入安静模式Quiet安静Manual手动None关闭Menu菜单→Settings设置→Setup设置→Lens镜头设置Lens镜头Enable Power to Lens镜头参数显示于监视器Auto-detect PL Lenses更换带有触点通讯的镜头后，自动检测Detect Lens检测镜头Info信息Metadata镜头信息Menu菜单→Settings设置→Maintenance系统维护Menu菜单→Settings设置→Maintenance系统维护→Save Log保存系统状态文件至卡Menu菜单→Settings设置→Maintenance系统维护→Upgrade升级Camera升级摄影机Media升级存储卡Menu菜单→Settings设置→Maintenance系统维护→Calibrate校准Sensor感光器Current Calibration Map摄影机现在使用的黑平衡参数In Camera摄影机中的数据On Media/calibation储存卡中的数据Factory工厂模式Apply加载数据Create创建Delete删除Rename重命名Done完成Gyro/Acc陀螺仪/加速度计gro/accelerometer陀螺仪和加速度计校准Low Temperature Calibration低温校准High Temperature Calibration高温校准Place camera on leveled surface and don’t move durng calibrtion.Perform low temperature calibrtion directly after starup and high temperature calibration after camera reaches operating temperature.开启机身并将其放在水平表面上。

世界各国的Linux版本大全Linux的发行版本可以大体分为两类，一类是商业公司维护的发行版本，一类是社区组织维护的发行版本，前者以著名的Redhat（RHEL）为代表，后者以Debian为代表。

下面介绍一下各个发行版本的特点：Redhat，应该称为Redhat系列，包括RHEL(Redhat Enterprise Linux，也就是所谓的Redhat Advance Server，收费版本)、FedoraCore(由原来的Redhat桌面版本发展而来，免费版本)、CentOS(RHEL的社区克隆版本，免费)。

Redhat应该说是在国内使用人群最多的Linux版本，甚至有人将Redhat等同于Linux，而有些老鸟更是只用这一个版本的Linux。

所以这个版本的特点就是使用人群数量大，资料非常多，言下之意就是如果你有什么不明白的地方，很容易找到人来问，而且网上的一般Linux教程都是以Redhat为例来讲解的。

Redhat系列的包管理方式采用的是基于RPM包的YUM包管理方式，包分发方式是编译好的二进制文件。

稳定性方面RHEL和CentOS的稳定性非常好，适合于服务器使用。

但是Fedora Core的稳定性较差，最好只用于桌面应用。

Debian，或者称Debian系列，包括Debian和Ubuntu等。

Debian是社区类Linux的典范，是迄今为止最遵循GNU规范的Linux系统。

Debian最早由Ian Murdock于1993年创建，分为三个版本分支（branch）：stable, testing和unstable。

其中，unstable为最新的测试版本，其中包括最新的软件包，但是也有相对较多的bug，适合桌面用户。

testing的版本都经过unstable中的测试，相对较为稳定，也支持了不少新技术（比如SMP等）。

而stable一般只用于服务器，上面的软件包大部分都比较过时，但是稳定和安全性都非常的高。

TexasRed-X,琥珀酰亚胺酯（混合异构体）CAS216972-99-5
Texas Red-X,琥珀酰亚胺酯（胺反应性德克萨斯红®-X，琥珀酰亚胺酯）是T exas Red的优良替代品。

它具有与Texas Red相同的光谱特性，但它更容易与生物膜结合，具有更高的共轭产率。

它可用于产生具有激发/发射最大值~595 / 615nm的亮红色荧光生物共轭物。

与TexasRed®相比，该活性染料在荧光团和琥珀酰亚胺酯基团之间含有另外的七个原子氨基己酰基间隔基（“X”）。

该间隔基有助于将荧光团与其连接点分离，潜在地减少荧光团与其缀合的生物分子的相互作用。

产品名称：T exas Red-X,琥珀酰亚胺酯(混合异构体)
英文名称：T exas Red-X,SE;Texas Red-X,NHS ester
CAS:216972-99-5
外观：固体/粉末
分子量：816.94
Ex(nm):585
Em(nm):602
规格：mg
质量纯度：95%+
Texas Red-X,琥珀酰亚胺酯 CAS 199745-67-0
Texas Red-X,琥珀酰亚胺酯（混合异构体） CAS 216972-99-5 磺基罗丹明101磺酰氯
Texas Red 酰肼
Texas Red 尸胺
Texas Red 马来酰亚胺
Texas Red 叠氮化物
Texas Red 炔烃
Buccutite PE-Texas Red抗体标记试剂盒
Tide Fluor 4酸
Tide Fluor 4胺
以上资料来自小编西安瑞禧生物,更多欢迎讨论（YQ2021.1）。

RED EPICV.3.0中文操作指南操作原理RED EPIC数字摄影机可以在换帧率很大的范围内和光学模式下，拍摄高质量的数字画面，成像面积包含了S35mm，35mm，S16mm胶片尺寸。

摄影机提供支持标准的PL镜头接口，也可以通过19mm的金属架杆来调整大多数的电影镜头，遮光罩，跟焦系统。

15mm的适配器和轻量的15mm架杆也可配合使用。

除了可以使用现有的PL接口的镜头外，RED公司还提供S35mm（单反）PL 接口的定焦镜头组和变焦镜头。

其他的镜头接口，包括佳能的EF接口。

RED EPIC允许佳能和尼康的静态照相镜头配合使用。

如果使用合适的镜头，镜头接口可以报告镜头的光圈，焦距，物距参数。

此外，需从机器中调整佳能镜头的光圈。

当使用小成像圈镜头拍摄广角时，会限制传感器成像面积。

镜头接口可以转换，为避免灰尘落到感光器上，换镜头接口时必须在无尘环境下进行。

RED EPIC机身上同样可以使用一个PL转B4接口的适配器装上2/3英寸的高清镜头。

成像大小等同于S16mm胶片的尺寸。

因此使用这种镜头采用逐行扫描方式记录的最大分辨率为2K RAW(2048*1152像素)。

MYSTERIUM X 感光器感光器是专门为RED EPIC摄影机所设计的，提供了可变换的换帧率，2K模式下可变换1-300fpc/s, 4K和5k模式下可变换1-120fps/s, HDRx模式下减半.感光器的基础色温是5000K，也可在1700-10000K的动态范围内电子补偿。

预设白平衡包括Tungsten钨丝灯（3200K）和Daylight日光灯（5600K）.同样，机器可以根据需要，拍摄标准白或18%灰卡片，计算出一个色彩中性白平衡值。

感光器可进行高精度的模数转换，在日光环境下，感光度在320-800范围内操作，能够达到13.5档的动态范围。

图像处理从感光器上接收到的数据是格式化为像素经过校正（色彩未经加工）的每像素12位，14位或16位的RAW数据。

HDSP-210x Series, HDSP-211x Series, HDSP-250x SeriesFeatures• X stackable (HDSP-21xx)• XY stackable (HDSP-250x)• 128 sharacter ASCII decoder • Programmable functions • 16 user definable characters• Multi-level dimming and blanking • TTL compatible CMOS IC • Wave solderableApplications• Computer peripherals • Industrial instrumentation • Medical equipment• Portable data entry devices • Cellular phones• Telecommunications equipment • Test equipmentDescriptionThe HDSP-210x/-211x/-250x series of products is ideal for applications where displaying eight or more characters of dot matrix information in an aes-thetically pleasing manner is required. These devices are 8-digit, 5 x 7 dot matrix, alphanumeric displays and are all packaged in a standard 15.24 mm (0.6 inch) 28 pin DIP . The on-board CMOS IC has the ability to decode 128 ASCII characters which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in on- board ROM, allowing considerable flexibility for dis-playing additional symbols and icons. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-210x/-211x/-250x products are designed for standard microprocessor interface techniques. The display and special features are accessed through a bidirectional 8-bit data bus.Device Selection Guide AlGaAs High EfficiencyFont Height RedRedOrangeYellowGreen0.2 inches HDSP-2107 HDSP-2112 HDSP-2110 HDSP-2111 HDSP-21130.27 inchesHDSP-2504HDSP-2502HDSP-2500HDSP-2501HDSP-2503HDSP-210x SeriesEight Character 5 mm and 7 mm Smart Alphanumeric DisplaysData SheetESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED TO AVOID STATIC DISCHARGE.Absolute Maximum RatingsSupply Voltage, V DD to Ground [1] -0.3 to 7.0 V Operating Voltage, V DD to Ground [2] 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 V Free Air Operating Temperature Range, T A [3] -45°C to +85°C Storage Temperature Range, T S -55°C to +100°C Relative Humidity (non-condensing) 85%Soldering Temperature[1.59 mm (0.063 in.) Below Body] Solder Dipping 260°C for 5 secs Wave Soldering250°C for 3 secs ESD Protection @ 1.5 kΩ, 100 pFV Z = 4 kV (each pin)Notes:1. Maximum Voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.3. Maximum supply voltage is 5.25 V for operation above 70°C.PIN FUNCTION ASSIGNMENT TABLENOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.NOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.ASCII Character Set HDSP-210X, HDSP-211X, HDSP-250X SeriesRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum Units Supply Voltage V DD 4.5 5.0 5.5 VElectrical Characteristics Over Operating Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedT A = 25°C -45°C < T A < + 85°CV DD = 5.0 4.5 V < V DD < 5.5 VParameter Symbol Typ. Max. Min. Max. Units Test Conditions Input Leakage I IH 1.0 µA V IN = 0 to V DD, (Input without pullup) I IL-1.0 pins CLK, D0-DA0-A4Input Current I IPL-11 -18 -30 µA V IN = 0 to V DD, (Input with pullup) pins CLS, RST,WR, RD, CE, FL I DD Blank I DD (BLK) 0.5 3.0 4.0 mA V IN = V DDI DD 8 digits I DD(V) 200 255 330 mA “V” on in all 812 dots/character[1,2]locationsI DD 8 digits I DD(#) 300 370 430 mA “#” on in al20 dots/character[1,2,3,4] locations Input Voltage High V IH 2.0 V DD V+0.3Input Voltage Low V IL GND 0.8 V-0.3 VOutput Voltage High V OH 2.4 V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4 V V DD = 4.5 V, D0-D7 I OL = 1.6 mA Output Voltage Low V OL0.4 V V DD = 4.5 V, CLK I OL = 40 µA High Level Output I OH-60 mA V DD = 5.0 V CurrentLow Level Output I OL50 mA V DD = 5.0 V CurrentThermal Resistance R q J-C15 °C/WIC Junction-to-CaseNotes:1. Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x I DD (#).2. Maximum I DD occurs at -55°C.3. Maximum I DD(#) = 355 mA at V DD = 5.25 V and IC T J = 150°C.4. Maximum I DD(#) = 375 mA at V DD =5.5 V and IC T J = 150°C.Optical Characteristics at 25°C[1]V DD = 5.0 V at Full BrightnessLuminous Intensity Peak DominantCharacter Average (#) Wavelength Wavelength Part Iv (mcd) l Peak l d Description Number Min. Typ. (nm) (nm) AlGaAs HDSP-2107 8.0 15.0 645 637-2504HER HDSP-2112 2.5 7.5 635 626-2502Orange HDSP-2110 2.5 7.5 600 602-2500Yellow HDSP-2111 2.5 7.5 583 585-2501High Performance HDSP-2113 2.5 7.5 568 574 Green -2503Note:1. Refers to the initial case temperature of the device immediately prior to measurement.AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedReferenceNumber Symbol Description Min.[1]Units1 t ACC Display Access TimeWrite 210Read 230 ns2 t ACS Address Setup Time to Chip Enable 10 ns3 t CE Chip Enable Active TimeWrite 140Read 160 ns4 t ACH Address Hold Time to Chip Enable 20 ns5 t CER Chip Enable Recovery Time 60 ns6 t CES Chip Enable Active Prior to Rising Edge ofWrite 140Read 160 ns7 t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0 ns8 t W Write Active Time 100 ns9 t WSU Data Write Setup Time 50 ns10 t WH Data Write Hold Time 20 ns11 t R Chip Enable Active Prior to Valid Data 160 ns12 t RD Read Active Prior to Valid Data 75 ns13 t DF Read Data Float Delay 10 nst RC Reset Active Time300 ns Notes:1. Worst case values occur at an IC junction temperature of 150°C.2. For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied to-gether.3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the logic levels of the WR and RD lines.4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.Write Cycle Timing DiagramAC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD < 5.5 V, unless otherwise specified Symbol Description 25°C Typ. Min.[1]UnitsF OSC Oscillator Frequency 57 28 kHz F RF [2] Display Refresh Rate 256 128 Hz F FL [3] Character Flash Rate 2 1 Hz t ST [4]Self Test Cycle Time4.69.2secNotes:1. Worst case values occur at an IC junction temperature of 150°C.2. F RF = F OSC /224.3. F FL = F OSC /28,672.4. t ST = 262,144/F OSC .INPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFR E L A T I V E L U M I N O U S I N T E NS I T Y (N O R M A L I Z E D T O 1 A T 25°C )T A – AMBIENT TEMPERATURE – °C3.53.02.51.51.00.52.0Electrical DescriptionPin Function DescriptionRESET (RST, pin 1) Initializes the display.FLASH (FL, pin 2) FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2) (A0-A4, pins 3-6, 10) select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4are usedto select which section of memory is accessed. Table 1 shows thelogic levels needed to access each section of memory.Table 1. Logic Levels to Access MemorySection of Memory FL A4 A3A2 A1 A0Flash RAM 0 X X Char. AddressUDC Address Register 1 0 0 Don’t CareUDC RAM 1 0 1 Row AddressControl Word Register 1 1 0 Don’t CareCharacter RAM 1 1 1 Character AddressCLOCK SELECT Used to select either an internal (CLS = 1) or external (CLS = 0) clock source. (CLS, pin 11)CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave displays. (CLK, pin 12)WRITE (WR, pin 13) Data is written into the display when the WR input is low and the CE input is low. CHIP ENABLE (CE, pin 17) Must be at a logic low to read or write data to the display and must go high betweeneach read and write cycle.READ (RD, pin 18) Data is read from the display when the RD input is low and the CE input is low. DATA Bus (D0-D7, Used to read from or write to the display.pins 19, 20, 23-28)GND (SUPPLY) (pin 15) Analog ground for the LED drivers.GND (LOGIC) (pin 16) Digital ground for internal logic.V DD (POWER) (pin 14) Positive power supply input.F i g u r e 1. H D S P -210X /-211X /-212X /-250X i n t e r n a l b l o c k d i a g r a m .Character RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is Address Registerwriting or reading a custom character.(UDC Address Register)Control Word Register This register allows the user to adjust the display brightness, flash individualcharacters, blink, self test, or clear the display.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-210X/-211X/-250X displays. The CMOS IC consists of an 8 byte Character RAM, an 8 bit Flash RAM, a 128 character ASCII decoder, a 16 character UDC RAM, a UDC AddressRegister, a Control Word Register, and refresh circuitry necessary to synchronize the decoding and driving of eight 5 x 7 dot matrix characters. The major user-acces-sible portions of the display are listed below:Character RAMFigure 2 shows the logic levels needed to access the HDSP-210X/-211X/-250X Character RAM. During a normal access, the CE = “0” and either RD = “0” or WR = “0.” However, erroneous data may be written into the Character RAM if the address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines. Address lines A 0-A 2 are used to select the location in the Character RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between the ASCII character and a UDC RAM address. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address RegisterFigure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D 0-D 3) are used to select one of the 16 UDC locations. The upper four bits (D 4-D 7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character, eight write cycles are required. One cycle is used to store the UDC RAM address in the UDC Address Register and seven cycles are used to store dot data in the UDC RAM. Data is entered by rows and one cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A 0-A 2 are used to select the row to be accessed and D 0-D 4 are used to transmit the row dot data. The upper three bits (D 5-D 7) are ignored. D 0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D 4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM while address lines A 3-A 4 are ignored. Address lines A 0-A 2 are used to select the location in the Flash RAM to store the attribute. D 0 is used to store or remove the flash attribute. D 0 = “1” stores the attribute and D 0 = “0” removes the attribute.When the attribute is enabled through bit 3 of the Control Word and a “1” is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock the flash rate can be calculated by dividing the clock frequency by 28,672.Figure 4. Data to load “”F’’ into the UDC RAM.Figure 3. Logic levels to access a UDC character.CE FL A 4A 3A 2A 1A 0RST WR RD 010001101XXX011UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = ROW 1110 = ROW 7D 7D 6D 5D 4D 3D 2D 1D 0XUDC CODEXXXFL A 4A 3A 2A 1A 011ROW SELECTUDC RAM ADDRESSUDC RAM C C DATA FORMATO O L L 150 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED 7D 6D 5D 4D 3D 2D 1D 0XDOT DATAXXCE RST WR RD 0100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDC C C C C O O O O O L L L L L 1 2 3 4 5D 4D 3D 2D 1D 0UDC CHARACTER HEX CODE 1 1 1 1 1 ROW 1 • • • • • 1F 1 0 0 0 0 ROW 2 • 101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 • • • • 1D 1 0 0 0 0 ROW 5 • 101 0 0 0 0 ROW 6 • 101 0 0 0 0 ROW 7• 10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LEDFigure 5. Logic levels to access the flash RAM.Table 2. Current Requirements at Different Brightness Levels V DD = 5.0 V % Current at 25°C Symbol D 2 D 1 D 0 Brightness Typ.UnitsI DD (V) 0 0 0 100 200 mA 0 0 1 80 160 mA 0 1 0 53 106 mA 0 1 1 40 80 mA 1 0 0 27 54 mA 1 0 1 20 40 mA111326mAFigure 6. Logic levels to access the control word registerControl Word RegisterFigure 6 shows how to access the Control Word Register. This 8-bit register performs five functions: Brightness control, Flash RAM control, Blinking, Self Test, and Clear. Each function is independent of the others; however, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any brightness level by multiplying the percent brightness level by the value of I DD at the 100% brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a“1,” the output of the Flash RAM is checked. If the content of a location in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For an external clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems, see the Display Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. This function will override the Flash function when it is active. To use this function with multiple display systems, see the Display Reset section.CE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTCE FL A 4A 3A 2A 1A 0RST WR RD 01000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASHBRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01140%10027%10120%11013%1110%BBFigure 7. Logic levels to reset the display.CE RST WR RD 0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE NOTE:IF RST, CE, AND WR ARE LOW, UNKNOWN DATA MAY BE WRITTEN INTO THE DISPLAY.FL 01XXXXXA 4 -A 0D 7 -D 0Self Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0” indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercise major portions of the IC and illuminate all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approximately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, the Flash RAM is cleared, and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a “1” will start the clear function. Three clock cycles (110 ms minimum using the internal refresh clock) are required to complete the clear function. The display must not be accessed while the display is being cleared. When the clear function has been completed, bit 7 will be reset to a “0.” The ASCII character code for a space (20H) will be loaded into the Character RAM to blank the display and the Flash RAM will be loaded with “0”s. The UDC RAM, UDC Address Register, and the remainder of the Control Word are unaffected.Display ResetFigure 7 shows the logic levels needed to Reset the display. The display should be Reset on Power-up. The external Reset clears the Character RAM, Flash RAM, Control Word and resets the internal counters. After the rising edge of the Reset signal, three clock cycles (110 µs minimum using the internal refresh clock) are required to complete the reset sequence. The display must not be accessed while the display is being reset. The ASCII Character code for a space (20H) will be loaded into the Character RAM to blank the display. The Flash RAM and Control Word Register are loaded with all “0”s. The UDC RAM and UDC Address Register are unaffected. All displays which operate with the same clock source must be simultaneously reset to synchronize the Flashing and Blinking functions.Mechanical and Electrical ConsiderationsThe HDSP-210X/-211X/-250X are 28 pin dual-in-line packages with 26 external pins. The devices can be stacked horizontally and vertically to create arrays of any size. The HDSP-210X/-211X/-250X are designed to operate continuously from -45°C to +85°C with a maximum of 20 dots on per character at 5.25 V. Illuminating all thirty-five dots at full brightness is not recommended.The HDSP-210X/-211X/-250X are assembled by die attaching and wire bonding 280 LED chips and a CMOS IC to a thermally conductive printed circuit board. A poly-carbonate lens is placed over the PC board creating an air gap over the LED wire bonds. A protective cap creates an air gap over the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction makes the display highly tolerant to temperature cycling and allows wave soldering.The inputs to the IC are protected against static discharge and input current latchup. However, for best results standard CMOS handling precautions should be used. Prior to use, the HDSP-210X/-211X/-250X should be stored in antistatic tubes or in conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be connected either to ground or to V DD . Voltages should not be applied to the inputs until V DD has been applied to the display.Thermal ConsiderationsThe HDSP-210X/-211X/-212X/250X have been designed to provide a low thermal resistance path for the CMOS IC to the 26 package pins. Heat is typically conducted through the traces of the printed circuit board to free air. For most applications no additional heatsinking is required.Measurements were made on a 32 character display string to determine the thermal resistance of the display assembly. Several display boards were constructed using 0.062 in. thick printed circuit material, and one ounce copper 0.020 in. traces. Some of the device pins were connected to a heatsink formed by etching a copper area on the printed circuit board surrounding the display. A maximally metallized printed circuit board was also evaluated. The junction temperature was measured for displays soldered directly to these PC boards, displays installed in sockets, and finally displays installed in sockets with a filter over the display to restrict airflow. The results of these thermal resistance measurements, Rq J-A are shown in Table 3 and include the effects of Rq J-C .Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers separately from the logic ground until an appropriate ground plane is available. On long interconnections between the display and the host system, the designer can keep voltage drops on the analog ground from affecting the display logic levels by isolating the two grounds.The logic ground should be connected to the same ground potential as the logic interface circuitry. The analog ground and the logic ground should be connected at a common ground which can withstand the current introduced by the switching LED drivers. When separate ground connections are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground. Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3 V can cause dimming and dot mismatch.Table 3. Thermal Resistance, q JA , Using Various Amounts of Heatsinking Material Heatsinking Metal W/Sockets W/O Sockets W/Sockets per Device W/O Filter W/O Filter W/Filter sq. in. (Avg.) (Avg.)(Avg.)Units0 31 30 35 °C/W 1 31 28 33 °C/W 330 26 33 °C/W Max. Metal 29 25 32 °C/W 4 Board Avg302733°C/WSoldering and Post SolderCleaning Instructions for the HDSP-210X/-211X/-250XThe HDSP-210X/-211X/-250X may be hand soldered or wave soldered with SN63 solder. When hand soldering, it is recommended that an electronically temperature controlled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and the dwell in the wave should be set between 11 /2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.For additional information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Com-ponents .Contrast EnhancementThe objective of contrast enhancement is to provide good readability in a variety of ambient lighting condi-tions. For information on contrast enhancement see Application Note 1015, Contrast Enhancement Techniques for LED Displays .Color Bin LimitsColor Range (nm)Color BinMin. Max.Yellow 3 581.5 585.0 4 584.0 587.5 5 586.5 590.0 6 589.0 592.5 7 591.5 595.0Green 1 576.0 580.0 2 573.0 577.0 3 570.0 574.04567.0571.5Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-2107 Intensity Range (mcd)Bin Min. Max.I 5.12 9.01J 7.68 13.52K 11.52 20.28L 17.27 30.42M25.3945.63Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-211x and HDSP-250x (Except HDSP-2504) Intensity Range (mcd)Bin Min. Max.G 2.50 4.00H 3.41 6.01I 5.12 9.01J 7.68 13.52K11.5220.28Note:Test conditions as specified in Optical Char-acteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3183EN AV02-0629EN - May 9, 2008Intensity Bin Limit for HDSP-2504BinIntensity Range (mcd)Min.MaxJ 7.6813.52K 11.5220.28L 17.2730.42M 25.9145.63Note:Test conditions as specified in Optical Charac-teristic table.。

《红Red》讲解三岛有纪子带着其野心勃勃的新作《红》（Red）再度回归大众视野，形式上打响了新世纪20年代日本女性电影人的第一枪。

在今年新冠疫情全球蔓延、导致各国电影工业停摆的消极形势下，这部囊括了优秀的原作、导演、编剧和演员们的官能映画《红》对影迷们多少也算是一种心理安慰了。

影片《红》改编自2018年的直木奖得主岛本理生的同名官能小说，由日本现役当红演员夏帆、妻夫木聪和柄本佑出演。

该片讲述家庭主妇村主塔子与阔别十年之久的前任鞍田秋彦旧情复燃，而不得不在家庭责任与爱情之间做出个人抉择的故事。

和传统的日本已婚女性一样，村主塔子过着的是一种单调乏味的婚姻生活，她每天要照顾丈夫和女儿的起居，收拾家务，剩下来的时间也不知道可以用来做什么。

丈夫和村主塔子的相处模式也很无趣，性生活上已经无激情可言；女儿尚且年幼，又需要母亲亲力亲为的悉心照料。

在陪同丈夫出席的一场商业聚会上，村主塔子恍惚看到了十年未见的前任鞍田秋彦，她四处寻觅着鞍田的踪迹，最终在隐蔽的阁楼里发现了鞍田。

鞍田实际上早已经注意到了村主，他在这里伺机等待着村主的出没，俩人刚一相见即热烈拥吻，旧情瞬间复燃。

在随后的聊天中，村主了解到了鞍田的现状，原来鞍田早前创立的建筑设计公司已经倒闭，现在的鞍田在朋友的公司里上班。

在意外闯入村主生活的鞍田的影响下，村主开始萌生上班工作的念头，她过去多年的时光全都耗在了做妻子、做母亲的繁琐日常中，而现在她只想做自己。

村主将想要上班的请求告诉了丈夫，一开始丈夫连连委婉推脱，以大男子主义的话术规劝村主老实地做相夫教子的家庭主妇。

但最后拗不过村主的坚决态度，松口还是同意让村主去尝试做职业女性的滋味。

做惯家庭主妇的村主，在自己热爱的建筑设计行当中找到了前所未有的自由和快乐，也与同在一间公司上班的鞍田彼此越走越近。

俩人常常以工作为由去幽会，无论是身体上还是情感上，村主都对鞍田愈发地依赖。

工作和婚外恋的投入使得村主分身乏术，因为一次迟到，幼儿园等待村主接送的女儿从玩耍器材的高处坠落，受了一些皮外伤。

RED最新发布两款配有全域视界的摄影机
佚名
【期刊名称】《影视制作》
【年(卷),期】2024(30)2
【摘要】RED日前最新发布了配有全域视界(GLOBAL VISION)的V-RAPTORTM[X]8K VV和V-RAPTOR XL[X]8K VV摄影机。

V-RAPTOR[X]引入RED全域视界,配备全新的8K VV全域快门传感器,实现了高光扩展(Highlight Extension)和幻影双录(Phantom Track)等创新功能。

【总页数】1页(P112-112)
【正文语种】中文
【中图分类】F59
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