Spartan-6datasheetSpartan系列FPGA芯片
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Spartan-6 FPGA Electrical CharacteristicsSpartan®-6 LX and LXT FPGAs are available in various speed grades, with -3 having the highest performance. The DC and AC electrical parameters of the Automotive XA Spartan-6 FPGAs and Defense-grade Spartan-6Q FPGAs devices are equivalent to the commercial specifications except where noted. The timing characteristics of the commercial (XC) -2 speed grade industrial device are the same as for a -2 speed grade commercial device. The -2Q and -3Q speed grades areexclusively for the expanded (Q) temperature range. The timing characteristics are equivalent to those shown for the -2 and -3 speed grades for the Automotive and Defense-grade devices.Spartan-6FPGA DC and AC characteristics are specified for commercial (C), industrial (I), and expanded (Q) temperature ranges. Only selected speed grades and/or devices might be available in the industrial or expanded temperature ranges for Automotive and Defense-grade devices. References to device names refer to all available variations of that part number (for example, LX75 could denote XC6SLX75, XA6SLX75, or XQ6SLX75). The Spartan-6 FPGA -3N speed grade designates devices that do not support MCB functionality.All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications. Available device and package combinations can be found at:DS162 (v3.1.1) January 30, 2015Product Specification找FPGA,上赛灵思半导体(深圳)有限公司V IN and V TS (3)I/O input voltage or voltage applied to 3-state output, relative to GND (4)All user and dedicatedI/OsCommercialDC–0.60 to 4.10V 20% overshoot duration –0.75 to 4.25V 8% overshoot duration (5)–0.75 to 4.40V IndustrialDC–0.60 to 3.95V 20% overshoot duration –0.75 to 4.15V 4% overshoot duration (5)–0.75 to 4.40V Expanded (Q)DC–0.60 to 3.95V 20% overshoot duration–0.75 to 4.15V 4% overshoot duration (5)–0.75 to 4.40V Restricted tomaximum of 100 user I/OsCommercial20% overshoot duration –0.75 to 4.35V 15% overshoot duration (5)–0.75 to 4.40V 10% overshoot duration–0.75 to 4.45V Industrial 20% overshoot duration –0.75 to 4.25V 10% overshoot duration –0.75 to 4.35V 8% overshoot duration (5)–0.75 to 4.40V Expanded (Q)20% overshoot duration–0.75 to 4.25V 10% overshoot duration–0.75 to 4.35V 8% overshoot duration (5)–0.75 to 4.40V T STGStorage temperature (ambient)–65to 150°C T SOLMaximum soldering temperature (6)(TQG144, CPG196, CSG225, CSG324, CSG484, and FTG256)+260°C Maximum soldering temperature (6) (Pb-free packages: FGG484, FGG676, and FGG900)+250°C Maximum soldering temperature (6) (Pb packages: CS484, FT256, FG484, FG676, and FG900)+220°C T jMaximum junction temperature (6)+125°CNotes:1.Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.2.When programming eFUSE, V FS ≤V CCAUX . Requires up to 40mA current. For read mode, V FS can be between GND and3.45V .3.I/O absolute maximum limit applied to DC and AC signals. Overshoot duration is the percentage of a data period that the I/O is stressed beyond 3.45V .4.For I/O operation, refer to UG381: Spartan-6 FPGA SelectIO Resources User Guide .5.Maximum percent overshoot duration to meet 4.40V maximum.6.T SOL is the maximum soldering temperature for component bodies. For soldering guidelines and thermal considerations,see UG385: Spartan-6 FPGA Packaging and Pinout Specification .Table 1:Absolute Maximum Ratings (1) (Cont’d)SymbolDescriptionUnitseFUSE Read EnduranceTable11 lists the minimum guaranteed number of read cycle operations for Device DNA and for the AES eFUSE key. For more information, see UG380: Spartan-6 FPGA Configuration User Guide.Table 11:eFUSE Read EnduranceSymbol DescriptionSpeed Grade Units(Min) -3-3N-2-1LDNA_CYCLES Number of DNA_PORT READ operations or JT AG ISC_DNA read command operations. Unaffected by SHIFT operations.30,000,000ReadCyclesAES_CYCLES Number of JTAG FUSE_KEY or FUSE_CNTL read command operations.Unaffected by SHIFT operations.30,000,000ReadCyclesSymbol Description Typ(1)Max UnitsI MGTAVCC GTP transceiver internal analog supply current40.4Note2mAI MGTAVTTTX GTP transmitter termination supply current27.4mA I MGTAVTTRX GTP receiver termination supply current13.6mA I MGTAVCCPLL GTP transmitter and receiver PLL supply current28.7mA R MGTRREF Precision reference resistor for internal calibration termination50.0 ±1%toleranceΩGTP Transceiver DC Input and Output LevelsTable 16 summarizes the DC output specifications of the GTP transceivers in Spartan-6 FPGAs. Figure 1 shows the single-ended output voltage swing. Figure 2 shows the peak-to-peak differential output voltage.Consult UG386: Spartan-6 FPGA GTP Transceivers User Guide for further details.Table 17 summarizes the DC specifications of the clock input of the GTP transceiver. Consult UG386: Spartan-6 FPGA GTP Transceivers User Guide for further details.Table 16:GTP Transceiver DC SpecificationsSymbol DC ParameterConditionsMin Typ Max Units DV PPIN Differential peak-to-peak input voltageExternal AC coupled 140–2000mV V IN Absolute input voltage DC coupledMGT AVTTRX =1.2V –400–MGTAVTTRXmV V CMIN Common mode input voltageDC coupledMGTAVTTRX =1.2V–3/4MGTAVTTRX–mV DV PPOUT Differential peak-to-peak output voltage (1)T ransmitter output swing is set to maximum setting 1000––mV V SEOUT Single-ended output voltage swing (1)––500mV V CMOUTDCCommon mode output voltage Equation basedMGTAVTTTX –V SEOUT /2mV R IN Differential input resistance 80100130ΩR OUT Differential output resistance 80100130ΩT OSKEW Transmitter output skew––15ps C EXTRecommended external AC coupling capacitor (2)75100200nFNotes:1.The output swing and preemphasis levels are programmable using the attributes discussed in UG386: Spartan-6 FPGA GTP T ransceivers UserGuide and can result in values lower than reported in this table. DV PPOUT is the minimum guaranteed value at the maximum setting. Refer to UG386:Spartan-6 FPGA GTP Transceivers User Guide for nominal values.2.Other values can be used as appropriate to conform to specific protocols and standards.Figure 1:Single-Ended Peak-to-Peak VoltageFigure 2:Differential Peak-to-Peak Voltage。
Spartan6系列之器件引脚功能详述由技术编辑于星期四, 09/25/2014 - 14:48 发表1. Spartan-6系列封装概述Spartan-6系列具有低成本、省空间的封装形式,能使用户引脚密度最大化。
所有Spartan-6 LX器件之间的引脚分配是兼容的,所有Spartan-6 LXT器件之间的引脚分配是兼容的,但是Spartan-6 LX和Spartan-6 LXT器件之间的引脚分配是不兼容的。
表格 1Spartan-6系列FPGA封装2. Spartan-6系列引脚分配及功能详述Spartan-6系列有自己的专用引脚,这些引脚是不能作为Select IO使用的,这些专用引脚包括:专用配置引脚,表格2所示,GTP高速串行收发器引脚,表格3所示表格 2Spartan-6 FPGA专用配置引脚注意:只有LX75, LX75T, LX100, LX100T, LX150, and LX150T器件才有VFS、VBATT、RFUSE引脚。
表格 3Spartan-6器件GTP通道数目注意:LX75T在FG(G)484 和 CS(G)484中封装4个GTP通道,而在FG(G)676中封装了8个GTP通道;LX100T在FG(G)484 和 CS(G)484中封装4个GTP通道,而在FG(G)676 和 FG(G)900中封装了8个GTP通道。
如表4,每一种型号、每一种封装的器件的可用IO引脚数目不尽相同,例如对于LX4 TQG144器件,它总共有引脚144个,其中可作为单端IO引脚使用的IO个数为102个,这102个单端引脚可作为51对差分IO使用,另外的32个引脚为电源或特殊功能如配置引脚。
表格 4Spartan6系列各型号封装可用的IO资源汇总表格 5引脚功能详述3. Spartan-6系列GTP Transceiver引脚如表6所示,对LX25T,LX45T而言,只有一个GTP Transceiver通道,它的位置是X0Y0,所再Bank号为101;其他信号GTP Transceiver的解释类似。
SP601 Hardware User GuideUG518 (v1.7) September 26, 2012© Copyright 2009–2012 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. DISCLAIMERThe information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. 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Xilinx products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in Critical Applications:/warranty.htm#critapps.Revision HistoryThe following table shows the revision history for this document.Date Version Revision07/15/09 1.0Initial Xilinx release.08/19/09 1.1•Added Appendix B, VITA 57.1 FMC LPC Connector Pinout.•Updated Figure1-17.•Updated Table1-4, Table1-19, and Table1-22.•Added introductory paragraph to Appendix C, SP601 Master UCF.•Miscellaneous typographical edits and new user guide template.05/17/10 1.2•Updated Figure1-1, Figure1-2, Figure1-14, Figure1-18, Table1-9, Table1-1,Table1-11, and Table1-16.•Added Figure1-7, Figure1-8, and Table1-13.•Updated 9. VITA 57.1 FMC-LPC Connector, page25, Appendix B, VITA 57.1 FMCLPC Connector Pinout, and Appendix C, SP601 Master UCF.06/16/10 1.3Reversed order of 15. Configuration Options and 16. Power Management. Updated 1.Spartan-6 XC6SLX16-2CSG324 FPGA and 2. 128 MB DDR2 Component Memory. AddedTable1-26. Added UG394, Spartan-6 FPGA Power Management User Guide to Appendix D,References.09/24/10 1.4Added Power System Test Points, including Table1-25.02/16/11 1.5Added note and revised header description to indicate the I/Os support LVCMOS25signaling on page34. Revised oscillator manufacturer information from Epson to SiTimeon page page23 and page51.07/18/11 1.6Corrected wording from “PPM frequency jitter” to “PPM frequency stability” in sectionOscillator (Differential), page23. Added Table1-15, page27.09/26/12 1.7Added Regulatory and Compliance Information, page53.SP601 Hardware User Guide UG518 (v1.7) September 26, 2012SP601 Hardware User Guide 3UG518 (v1.7) September 26, 2012Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Preface: About This GuideGuide Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Additional Support Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Chapter 1: SP601 Evaluation BoardOverview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Additional Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Related Xilinx Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101. Spartan-6 XC6SLX16-2CSG324 FPGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11I/O Voltage Rails . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122. 128 MB DDR2 Component Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123. SPI x4 Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154. Linear Flash BPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175. 10/100/1000 Tri-Speed Ethernet PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196. USB-to-UART Bridge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217. IIC Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228-Kb NV Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Oscillator (Differential). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Oscillator Socket (Single-Ended, 2.5V or 3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24SMA Connectors (Differential). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249. VITA 57.1 FMC-LPC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2510. Status LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2811. FPGA Awake LED and Suspend Jumper. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2912. FPGA INIT and DONE LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3013. User I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3114. FPGA_PROG_B Pushbutton Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3515. Configuration Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36JTAG Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3616. Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37AC Adapter and 5V Input Power Jack/Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Onboard Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Power System Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Table of ContentsAppendix A: Default Jumper and Switch SettingsAppendix B: VITA 57.1 FMC LPC Connector PinoutAppendix C: SP601 Master UCFAppendix D: ReferencesAppendix E: Regulatory and Compliance InformationDirectives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Standards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Electromagnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 SP601 Hardware User GuideUG518 (v1.7) September 26, 2012SP601 Hardware User Guide 5UG518 (v1.7) September 26, 2012PrefaceAbout This GuideThis manual accompanies the Spartan®-6 FPGA SP601 Evaluation Board and contains information about the SP601 hardware and software tools.Guide ContentsThis manual contains the following chapters:•Chapter 1, SP601 Evaluation Board , provides an overview of the SP601 evaluation board and details the components and features of the SP601 board.•Appendix A, Default Jumper and Switch Settings .•Appendix B, VITA 57.1 FMC LPC Connector Pinout .•Appendix C, SP601 Master UCF .•Appendix D, References .Additional DocumentationThe following documents are available for download at /products/spartan6.•Spartan-6 Family OverviewThis overview outlines the features and product selection of the Spartan-6 family.•Spartan-6 FPGA Data Sheet: DC and Switching CharacteristicsThis data sheet contains the DC and switching characteristic specifications for the Spartan-6 family.•Spartan-6 FPGA Packaging and Pinout SpecificationsThis specification includes the tables for device/package combinations and maximum I/Os, pin definitions, pinout tables, pinout diagrams, mechanical drawings, and thermal specifications.•Spartan-6 FPGA Configuration User GuideThis all-encompassing configuration guide includes chapters on configuration interfaces (serial and parallel), multi-bitstream management, bitstream encryption, boundary-scan and JTAG configuration, and reconfiguration techniques.•Spartan-6 FPGA SelectIO Resources User GuideThis guide describes the SelectIO™ resources available in all Spartan-6 devices.•Spartan-6 FPG A Clocking Resources User GuidePreface:About This GuideThis guide describes the clocking resources available in all Spartan-6 devices,including the DCMs and PLLs.•Spartan-6 FPGA Block RAM Resources User GuideThis guide describes the Spartan-6 device block RAM capabilities.•Spartan-6 FPGA DSP48A1 Slice User GuideThis guide describes the architecture of the DSP48A1 slice in Spartan-6FPGAs andprovides configuration examples.•Spartan-6 FPGA Memory Controller User GuideThis guide describes the Spartan-6 FPGA memory controller block, a dedicatedembedded multi-port memory controller that greatly simplifies interfacingSpartan-6FPGAs to the most popular memory standards.•Spartan-6 FPGA PCB Designer’s GuideThis guide provides information on PCB design for Spartan-6 devices, with a focus onstrategies for making design decisions at the PCB and interface level.Additional Support ResourcesTo search the database of silicon and software questions and answers or to create atechnical support case in WebCase, see the Xilinx website at:/support. SP601 Hardware User GuideUG518 (v1.7) September 26, 2012Chapter1 SP601 Evaluation BoardOverviewThe SP601 board enables hardware and software developers to create or evaluate designstargeting the Spartan®-6 XC6SLX16-2CSG324 FPGA.The SP601 provides board features for evaluating the Spartan-6 family that are common tomost entry-level development environments. Some commonly used features include aDDR2 memory controller, a parallel linear flash, a tri-mode Ethernet PHY, general-purposeI/O (GPIO), and a UART. Additional functionality can be added through the VITA 57.1.1expansion connector. Features, page8 provides a general listing of the board features withdetails provided in Detailed Description, page10.Additional InformationAdditional information and support material is located at:•/sp601This information includes:•Current version of this user guide in PDF format•Example design files for demonstration of Spartan-6 FPGA features and technology•Demonstration hardware and software configuration files for the SP601 linear and SPImemory devices•Reference Design Files•Schematics in PDF format and DxDesigner schematic format•Bill of materials (BOM)•Printed-circuit board (PCB) layout in Allegro PCB format•Gerber files for the PCB (Many free or shareware Gerber file viewers are available onthe internet for viewing and printing these files.)•Additional documentation, errata, frequently asked questions, and the latest newsFor information about the Spartan-6 family of FPGA devices, including product highlights,data sheets, user guides, and application notes, see the Spartan-6 FPGA website at/support/documentation/spartan-6.htm.SP601 Hardware User Guide 7 UG518 (v1.7) September 26, 2012Chapter 1:SP601 Evaluation BoardFeaturesThe SP601 board provides the following features (see Figure1-2 and Table1-1):• 1. Spartan-6 XC6SLX16-2CSG324 FPGA• 2. 128 MB DDR2 Component Memory• 3. SPI x4 Flash• 4. Linear Flash BPI• 5. 10/100/1000 Tri-Speed Ethernet PHY•7. IIC Bus•8Kb NV memory•External access 2-pin header•VITA 57.1 FMC-LPC connector•8. Clock Generation•Oscillator (Differential)•Oscillator Socket (Single-Ended, 2.5V or 3.3V)•SMA Connectors (Differential)•9. VITA 57.1 FMC-LPC Connector•10. Status LEDs•FPGA_AWAKE•INIT•DONE•13. User I/O•User LEDs•User DIP switch•User pushbuttons•GPIO male pin header•14. FPGA_PROG_B Pushbutton Switch•15. Configuration Options• 3. SPI x4 Flash (both onboard and off-board)• 4. Linear Flash BPI•JTAG Configuration•16. Power Management•AC Adapter and 5V Input Power Jack/Switch•Onboard Power Supplies SP601 Hardware User GuideUG518 (v1.7) September 26, 2012Related Xilinx DocumentsBlock DiagramFigure1-1 shows a high-level block diagram of the SP601 and its peripherals.Figure 1-1:SP601 Features and BankingRelated Xilinx DocumentsPrior to using the SP601 Evaluation Board, users should be familiar with Xilinx resources.See the following locations for additional documentation on Xilinx tools and solutions:•ISE: /ise•Answer Browser: /support•Intellectual Property: /ipcenterSP601 Hardware User Guide 9 UG518 (v1.7) September 26, 2012SP601 Hardware User GuideUG518 (v1.7) September 26, 2012Chapter 1:SP601 Evaluation BoardDetailed DescriptionFigure 1-2 shows a board photo with numbered features corresponding to Table 1-1 and the section headings in this document.The numbered features in Figure 1-2 correlate to the features and notes listed in Table 1-1.Figure 1-2:SP601 Board PhotoUG518_02_09100912843126137115109141581316Table 1-1:SP601 FeaturesNumberFeatureNotesSchematic Page1 Spartan-6 FP G A XC6SLX16-2CS G 3242DDR2 Component Elpida EDE1116ACBG 1Gb DDR2SDRAM53SPI x4 Flash and Headers SPI select and External Headers 84Linear Flash BPIStrataFlash 8-bit (J3 device), 3 pins shared w/ SPI x481. Spartan-6 XC6SLX16-2CSG 324 FPGAA Xilinx Spartan-6 XC6SLX16-2CSG324 FPGA is installed on the SP601 Evaluation Board.ReferencesSee the Spartan-6 FPGA Data Sheet . [Ref 1]ConfigurationThe SP601 supports configuration in the following modes:•Master SPI x4•Master SPI x4 with off-board device •BPI•JTAG (using the included USB-A to Mini-B cable)For details on configuring the FPGA, see 15. Configuration Options .The Mode DIP switch SW2 is set to M[1:0] = 01 Master SPI default.ReferencesSee the Spartan-6 FPGA Configuration User Guide for more information. [Ref 2]510/100/1000 Ethernet PHY GMII Marvell Alaska PHY76RS232 UART (USB Bridge)Uses CP2103 Serial-to-USB connection 107IICGoes to Header and VITA 57.1 FMC 108Clock, socket, SMA Differential, Single-Ended, Differential 99VITA 57.1 FMC-LPC connector LVDS signals, clocks, PRSNT 610LEDs Ethernet PHY Status711LED, Header FPGA Awake LED, Suspend Header 812LEDs FPGA INIT, DONE 913LED User I/O (active-High)9DIP SwitchUser I/O (active-High)9PushbuttonUser I/O, CPU_RESET (active-High)912-pin (8 I/O) Header6 pins x 2 male header with 8 I/Os (active-High)1014Pushbutton FPGA_PROG_B915USB JTAG Cypress USB to JTAG download cable logic14, 1516Onboard PowerPower Management11,12,13Table 1-1:SP601 Features (Cont’d)NumberFeatureNotesSchematic PageSP601 Hardware User Guide I/O Voltage RailsThere are four available banks on the LX16-CSG324 device. Banks 0, 1, and 2 are connected for 2.5V I/O. Bank 3 is used for the 1.8V DDR2 component memory interface of Spartan-6 FPGA’s hard memory controller. The voltage applied to the FPGA I/O banks used by the SP601 board is summarized in Table 1-2.ReferencesSee the Spartan-6 FPGA documentation for more information at /support/documentation/spartan-6.htm .2. 128 MB DDR2 Component MemoryThere are 128MB of DDR2 memory available on the SP601 board. A 1-Gb ElpidaEDE1116ACBG (84-ball) DDR2 memory component is accessible through Bank 3 of the LX16 device. The Spartan-6 FPGA hard memory controller is used for data transfer across the DDR2 memory interface’s 16-bit data path using SSTL18 signaling. The SP601 board supports the “standard” VCCINT setting of 1.20V ± 5%. This setting provides the standard memory controller block (MCB) performance of 625Mb/s for DDR2 memory in a -2 speed grade device. Signal integrity is maintained through DDR2 resistor terminations and memory on-die terminations (ODT), as shown in Table 1-3 and Table 1-4.Table 1-2:I/O Voltage Rail of FPGA BanksFPGA BankI/O Voltage Rail0 2.5V 1 2.5V 2 2.5V 31.8VTable 1-3:Termination Resistor RequirementsSignal NameBoard TerminationOn-Die TerminationDDR2_A[14:0]49.9Ω to V TT DDR2_BA[2:0]49.9Ω to V TT DDR2_RAS_N 49.9Ω to V TT DDR2_CAS_N 49.9Ω to V TT DDR2_WE_N 49.9Ω to V TT DDR2_CS_N 100Ω to GND DDR2_CKE 4.7K Ω to GND DDR2_ODT 4.7K Ω to GNDDDR2_DQ[15:0]ODT DDR2_UDQS[P ,N], DDR2_LDQS[P ,N]ODT DDR2_UDM, DDR2_LDMODTTable 1-5 shows the connections and pin numbers for the DDR2 Component Memory.DDR2_CK[P ,N]100Ω differential at memorycomponentNotes:1.Nominal value of V TT for DDR2 interface is 0.9V .Table 1-4:FPGA On-Chip (OCT) Termination External Resistor Requirements FPGA U1 PinFPGA Pin NumberBoard Connection for OCTZIO L6No Connect RZQC2100Ω to GROUNDTable 1-5:DDR2 Component Memory ConnectionsFPGA U1 PinSchematic Net Name Memory U2Pin NumberPin NameJ7DDR2_A0M8A0J6DDR2_A1M3A1H5DDR2_A2M7A2L7DDR2_A3N2A3F3DDR2_A4N8A4H4DDR2_A5N3A5H3DDR2_A6N7A6H6DDR2_A7P2A7D2DDR2_A8P8A8D1DDR2_A9P3A9F4DDR2_A10M2A10D3DDR2_A11P7A11G6DDR2_A12R2A12L2DDR2_DQ0G8DQ0L1DDR2_DQ1G2DQ1K2DDR2_DQ2H7DQ2K1DDR2_DQ3H3DQ3H2DDR2_DQ4H1DQ4H1DDR2_DQ5H9DQ5J3DDR2_DQ6F1DQ6Table 1-3:Termination Resistor Requirements (Cont’d)Signal NameBoard Termination On-Die TerminationSP601 Hardware User Guide ReferencesSee the Elpida DDR2 SDRAM Specifications for more information. [Ref 11]Also, see the Spartan-6 FPGA Memory Controller User Guide . [Ref 3]J1DDR2_DQ7F9DQ7M3DDR2_DQ8C8DQ8M1DDR2_DQ9C2DQ9N2DDR2_DQ10D7DQ10N1DDR2_DQ11D3DQ11T2DDR2_DQ12D1DQ12T1DDR2_DQ13D9DQ13U2DDR2_DQ14B1DQ14U1DDR2_DQ15B9DQ15F2DDR2_BA0L2BA0F1DDR2_BA1L3BA1E1DDR2_BA2L1BA2E3DDR2_WE_B K3WE L5DDR2_RAS_B K7RAS K5DDR2_CAS_B L7CAS K6DDR2_ODT K9ODT G3DDR2_CLK_P J8CK G1DDR2_CLK_N K8CK H7DDR2_CKE K2CKE L4DDR2_LDQS_P F7LDQS L3DDR2_LDQS_N E8LDQS P2DDR2_UDQS_P B7UDQS P1DDR2_UDQS_N A8UDQS K3DDR2_LDM F3LDM K4DDR2_UDMB3UDMTable 1-5:DDR2 Component Memory Connections (Cont’d)FPGA U1 PinSchematic Net Name Memory U2Pin NumberPin Name3. SPI x4 FlashThe Xilinx Spartan-6 FPGA hosts a SPI interface which is accessible to the Xilinx iMPACTconfiguration tool. The SPI memory device operates at 3.0V; the Spartan-6 FPGA I/Os are3.3V tolerant and provide electrically compatible logic levels to directly access the SPI flashthrough a 2.5V bank. The XC6SLX16-2CSG324 is a master device when accessing anexternal SPI flash memory device.The SP601 SPI interface has two parallel connected configuration options (see Figure1-4):an SPI X4 (Winbond W25Q64VSFIG) 64-Mb flash memory device and a flashprogramming header (J12). J12 supports a user-defined SPI mezzanine board. The SPIconfiguration source is selected via SPI select jumper J15. For details on configuring theFPGA, see 15. Configuration Options.Figure 1-3:J12 SPI Flash Programming HeaderSP601 Hardware User Guide ReferencesSee the Winbond Serial Flash Memory Data Sheet for more information. [Ref 12]See the XPS Serial Peripheral Interface Data Sheet for more information. [Ref 4]Figure 1-4:SPI Flash Interface TopologyTable 1-6:SPI x4 Memory ConnectionsFPGA U1 PinSchematic Net Name SPI MEM U17SPI HDR J12Pin #Pin NamePinNumberPin NameV2FPGA_PROG_B 1V14FPGA_D2_MISO31IO3_HOLD_B 2T14FPGA_D1_MISO2_R 9IO2_WP_B3V3SPI_CS_B4TMS T13FPGA_MOSI_CSI_B_MISO015DIN 5TDI R13FPGA_D0_DIN_MISO_MISO18IO1_DOUT6TDO R15FPGA_CCLK16CLK7TCK 8GND 9VCC3V3J15.2SPIX4_CS_B 7CS_B4. Linear Flash BPIAn 8-bit (16MB) Numonyx linear flash memory (TE28F128J3D-75) (J3D type) is used toprovide non-volatile bitstream, code, and data storage. The J3D devices operate at 3.0V; theSpartan-6 FPGA I/Os are 3.3V tolerant and provide electrically compatible logic levels todirectly access the linear flash BPI through a 2.5V bank. For details on configuring theFPGA, see 15. Configuration Options.Figure 1-5:Linear Flash BPI InterfaceTable 1-7:BPI Memory ConnectionsFPGA U1 Pin Schematic Net Name BPI Memory U10Pin Number Pin Name K18FLASH_A032A0K17FLASH_A128A1J18FLASH_A227A2J16FLASH_A326A3G18FLASH_A425A4G16FLASH_A524A5H16FLASH_A623A6H15FLASH_A722A7H14FLASH_A820A8H13FLASH_A919A9F18FLASH_A1018A10F17FLASH_A1117A11K13FLASH_A1213A12K12FLASH_A1312A13E18FLASH_A1411A14E16FLASH_A1510A15G13FLASH_A168A16SP601 Hardware User Guide Note:Memory U10 pin 56 address A24 is not connected on the 16 MB device. It is made availablefor larger density devices.ReferencesSee the Numonyx Embedded Flash Memory Data Sheet for more information. [Ref 13]In addition, see the Spartan-6 FPGA Configuration User Guide for more information. [Ref 2]H12FLASH_A177A17D18FLASH_A186A18D17FLASH_A195A19G14FLASH_A204A20F14FLASH_A213A21C18FLASH_A221A22C17FLASH_A2330A23F16FLASH_A2456A24R13FPGA_D0_DIN_MISO_MISO133DQ0T14FPGA_D1_MISO235DQ1V14FPGA_D2_MISO338DQ2U5FLASH_D340DQ3V5FLASH_D444DQ4R3FLASH_D546DQ5T3FLASH_D649DQ6R5FLASH_D751DQ7M16FLASH_WE_B 55WE_B L18FLASH_OE_B 54OE_B L17FLASH_CE_B14CE0B3FMC_PWR_GOOD_FLASH_RST_B16RP_BTable 1-7:BPI Memory Connections (Cont’d)FPGA U1 PinSchematic Net NameBPI Memory U10Pin NumberPin Name5. 10/100/1000 T ri-Speed Ethernet PHYThe SP601 uses the onboard Marvell Alaska PHY device (88E1111) for Ethernetcommunications at 10, 100, or 1000 Mb/s. The board supports a GMII/MII interface fromthe FPGA to the PHY. The PHY connection to a user-provided Ethernet cable is through aHalo HFJ11-1G01E RJ-45 connector with built-in magnetics.On power-up, or on reset, the PHY is configured to operate in GMII mode with PHYaddress 0b00111 using the settings shown in Table1-8. These settings can be overwrittenvia software commands passed over the MDIO interface.Table 1-8:PHY Configuration PinsPin Connection onBoardBit[2]Definition and ValueBit[1]Definition and ValueBit[0]Definition and ValueCFG0V CC 2.5V PHYADR[2] = 1PHYADR[1] = 1PHYADR[0] = 1 CFG1Ground ENA_PAUSE = 0PHYADR[4] = 0PHYADR[3] = 0 CFG2V CC 2.5V ANEG[3] = 1ANEG[2] = 1ANEG[1] = 1 CFG3V CC 2.5V ANEG[0] = 1ENA_XC = 1DIS_125 = 1 CFG4V CC 2.5V HWCFG_MD[2] = 1HWCFG_MD[1] = 1HWCFG_MD[0] = 1 CFG5V CC 2.5V DIS_FC = 1DIS_SLEEP = 1HWCFG_MD[3] = 1 CFG6PHY_LED_RX SEL_BDT = 0INT_POL = 175/50Ω = 0 Table 1-9:Ethernet PHY ConnectionsFPGA U1 Pin Schematic Net NameU3 M88E111Pin Number Pin NameP16PHY_MDIO33MDIO N14PHY_MDC35MDC J13PHY_INT32INT_B L13PHY_RESET36RESET_B M13PHY_CRS115CRS L14PHY_COL114COL L16PHY_RXCLK7RXCLK P17PHY_RXER8RXER N18PHY_RXCTL_RXDV4RXDV M14PHY_RXD03RXD0 U18PHY_RXD1128RXD1 U17PHY_RXD2126RXD2 T18PHY_RXD3125RXD3 T17PHY_RXD4124RXD4 N16PHY_RXD5123RXD5SP601 Hardware User GuideReferencesSee the Marvell Alaska Gigabit Ethernet Transceivers product page for more information.[Ref 16]Also, see the LogiCORE™ IP Tri-Mode Ethernet MAC User Guide . [Ref 5]N15PHY_RXD6121RXD6P18PHY_RXD7120RXD7A9 PHY_TXC_G TPCLK 14G TXCLKB9 PHY_TXCLK 10TXCLK A8 PHY_TXER 13TXER B8 PHY_TXCTL_TXEN 16TXEN F8 PHY_TXD018TXD0G 8 PHY_TXD119TXD1A6 PHY_TXD220TXD2B6 PHY_TXD324TXD3E6 PHY_TXD425TXD4F7 PHY_TXD526TXD5A5 PHY_TXD628TXD6C5 PHY_TXD729TXD7Table 1-9:Ethernet PHY Connections (Cont’d)FPGA U1 PinSchematic Net NameU3 M88E111Pin NumberPin Name6. USB-to-UART BridgeThe SP601 contains a Silicon Labs CP2103GM USB-to-UART bridge device (U4) which allows connection to a host computer with a USB cable. The USB cable is supplied in this evaluation kit (Type A end to host computer, Type Mini-B end to SP601 connector J9). Table 1-10 details the SP601 J9 pinout.Xilinx UART IP is expected to be implemented in the FPGA fabric. The FPGA supports the USB-to-UART bridge using four signal pins, transmit (TX), receive (RX), Request to Send (RTS), and Clear to Send (CTS).Silicon Labs provides royalty-free Virtual COM Port (VCP) drivers which permit the CP2103GM USB-to-UART bridge to appear as a COM port to host computercommunications application software (for example, HyperTerm or TeraTerm). The VCP device driver must be installed on the host PC prior to establishing communications with the SP601. Refer to the SP601 Getting Started Guide for driver installation instructions.ReferencesRefer to the Silicon Labs website for technical information on the CP2103GM and the VCP drivers.In addition, see some of the Xilinx UART IP specifications at:•/support/documentation/ip_documentation/xps_uartlite.pdf •/support/documentation/ip_documentation/xps_uart16550.pdfTable 1-10:USB Type B Pin Assignments and Signal DefinitionsUSB ConnectorPinSignal NameDescription1VBUS +5V from host system (not used)2USB_DATA_N Bidirectional differential serial data (N-side)3USB_DATA_P Bidirectional differential serial data (P-side)4GROUNDSignal groundTable 1-11:CP2103GM ConnectionsFPGA U1 PinUART Functionin FPGA Schematic Net Name U4 CP2103GMPinUART Function in CP2103GM U10RTS, output USB_1_CTS 22CTS, input T5CTS, input USB_1_RTS 23RTS, output L12TX, data out USB_1_RX 24RXD, data in K14RX, data inUSB_1_TX25TXD, data out。
Ompal138+Spartan-6FPGA核心板规格软硬件资料数据手册核心板简介创龙科技SOM-TL138F是一款基于TI OMAP-L138(定点/浮点DSP C674x + ARM9) + 紫光同创Logos/Xilinx Spartan-6低功耗FPGA处理器设计的工业级核心板。
核心板内部OMAP-L138与Logos/Spartan-6通过uPP、EMIFA、I2C通信总线连接,并通过工业级B2B连接器引出网口、EMIFA、SATA、USB、LCD等接口。
核心板经过专业的PCB Layout和高低温测试验证,稳定可靠,可满足各种工业应用环境。
用户使用核心板进行二次开发时,仅需专注上层运用,降低了开发难度和时间成本,可快速进行产品方案评估与技术预研。
图 1 核心板正面图图 2 核心板背面图图 3 核心板斜视图图 4 核心板侧视图典型应用领域•运动控制•电力设备•仪器仪表•医疗设备•通信探测•惯性导航软硬件参数硬件框图图 5 核心板硬件框图图 6 OMAP-L138资源框图图 7 Logos特性图 8 Spartan-6特性硬件参数表 1 OMAP-L138端硬件参数CPU CPU型号:TI OMAP-L1381x ARM9,主频456MHz1x DSP C674x,主频456MHz,支持浮点运算1x PRU-ICSS,含2个PRU(Programmable Real-time Unit)核心ROM512MByte NAND FLASH RAM128/256MByte DDR2LED 1x 电源指示灯2x 用户可编程指示灯B2B Connector 2x 80pin公座B2B连接器,2x 80pin母座B2B连接器,间距0.5mm,共320pin硬件资源1x VPIF Video OUT(支持SDTV和HDTV),ITU-BT.656 Format,ITU-BT.1120 and SMTPE296 Formats1x VPIF Video IN(支持SDTV,HDTV和Raw Capture Mode),ITU-BT.656 Format,ITU-BT.1120 and SMTPE296 Formats1x LCD Controller1x USB 1.1 HOST1x USB 2.0 OTG1x 10/100M Ethernet1x SATA2x MMC/SD/SDIO3x UART2x eHRPWM1x EMIFA,在核心板内部与FPGA通过普通IO连接3x eCAP2x I2C1x HPI1x uPP,在核心板内部与FPGA通过普通IO连接,可配置为1x 16bit或2x 8bit2x McBSP1x McASP2x SPI备注:B2B、电源、指示灯等部分硬件资源,OMAP-L138与FPGA共用。
XilinxFPGA引脚功能详细介绍注:技术交流用,希望对大家有所帮助。
IO_LXXY_# 用户IO引脚XX代表某个Bank内唯一的一对引脚,Y=[P|N]代表对上升沿还是下降沿敏感,#代表bank 号2.IO_LXXY_ZZZ_# 多功能引脚ZZZ代表在用户IO的基本上添加一个或多个以下功能。
Dn:I/O(在readback期间),在selectMAP或者BPI模式下,D[15:0]配置为数据口。
在从SelectMAP读反馈期间,如果RDWR_B=1,则这些引脚变成输出口。
配置完成后,这些引脚又作为普通用户引脚。
D0_DIN_MISO_MISO1:I,在并口模式(SelectMAP/BPI)下,D0是数据的最低位,在Bit-serial模式下,DIN是信号数据的输入;在SPI模式下,MISO是主输入或者从输出;在SPI*2或者SPI*4模式下,MISO1是SPI总线的第二位。
D1_MISO2,D2_MISO3:I,在并口模式下,D1和D2是数据总线的低位;在SPI*4模式下,MISO2和MISO3是SPI总线的MSBs。
An:O,A[25:0]为BPI模式的地址位。
配置完成后,变为用户I/O口。
AWAKE:O,电源保存挂起模式的状态输出引脚。
SUSPEND是一个专用引脚,AWAKE是一个多功能引脚。
除非SUSPEND模式被使能,AWAKE被用作用户I/O。
MOSI_CSI_B_MISO0:I/O,在SPI模式下,主输出或者从输入;在SelectMAP模式下,CSI_B是一个低电平有效的片选信号;在SPI*2或者SPI*4的模式下,MISO0是SPI总线的第一位数据。
FCS_B:O,BPI flash 的片选信号。
FOE_B:O,BPI flash的输出使能信号FWE_B:O,BPI flash 的写使用信号LDC:O,BPI模式配置期间为低电平HDC:O,BPI模式配置期间为高电平CSO_B:O,在并口模式下,工具链片选信号。
说明:I =Input, O=Output,I/O =Bidirec
设计注意提示
1.CPU外部晶振频率为24MHz。
2.核心板的I2C总线已用2.2K电阻上拉至
3.3V。
3.利用核心板进行设计底板时,请认真核对自己底板的核心板B2B连接器的信号引脚线序是否正确,连接样的B2B物料,可以联系我司采购。
4.有关信号详细功能,请查看芯片datasheet。
5.FPGA端管脚名中带前缀“n”的,在LX9/LX25/LX45中可能悬空
SOM-TLS6-A1核心板B2
directional,Z=Highimpedance, PWR=Supply voltage,GND=Ground
自己底板的核心板B2B连接器的信号引脚线序是否正确,连接器的摆放位置是否正确,请务必参考我司提供的底板PC 能悬空;具体请参考Xilinx用户指导文档:UG385
心板B2B信号列表
,请务必参考我司提供的底板PCB图进行核对。
核心板同
SOM-TLS6-A1核心板B2B信
B2B信号列表。
Spartan-6时钟管理模块的介绍与使用同步时序电路设计中最关键的是时钟设计,随着电路规模与速度的提高,对时钟的周期、占空比、延时和抖动等方面的要求也越来越高。
为了顺应这需求,Spartan-6系统器件在原有的DCM模块基础引入了模拟PLL模块构成了功能强大、控制灵活的时钟管理模块(CMT)。
每个CMT模块包含两个DCM模块和一个PLL模块。
Spartan-6系统器件有多至六个CMT模块。
一、器件组成与特性1.DCM模块主要有以下功能模块组成:a.DLL模块, 主要由延时线和控制逻辑组成。
b.数字频率合成器,为系统产生丰富的频率合成信号输出到CLKFX和CLKFX180。
可以提供2~32的倍乘与1~32的分频系数。
c.数字移相器, 可提供粗调的0,90,180,270度移相和具有动态调节能力的相位细调。
d.数字频谱合成器,产生扩频时钟减少电磁干扰(EMI)。
Spartan-6 DCM模块提供给用户的设计原语有DCM_SP和DCM_CLKGEN,DCM_SP在Spartan-3E FPGA器件中也有,而DCM_CLKGEN是Spartan-6新增的,可以用产生动态的频率合成信号和扩频时钟。
2.PLL模块,有一400MHz~1000 MHz压控振荡器(VCO),可提供8种移相(0°, 45°, 90°, 135°, 180°, 225°, 270°, 315°)和6个可独立编程倍乘与分频系数的输出信号。
提供给用户的设计原语有PLL_BASE和PLL_ADV,PLL_BASE是单独使用PLL模块最常调用的原语,允许使用PLL的最常用特性,PLL_ADV包括PLL_BASE所有的特性之外,还提供时钟切换及与DCM的连接。
可用于以下工作模式:a. 时钟网络去歪斜b. 频率合成c. 抖动滤波d. 零延时的缓冲f. PLL与PLL、DCM的级联二、使用指南1.注意时钟的输入与输出范围,所有应用不能超过范围.。