HD74HC125P中文资料

To all our customersRegarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself.Renesas Technology Home Page: Renesas Technology Corp.Customer Support Dept.April 1, 2003CautionsKeep safety first in your circuit designs!1. Renesas Technology Corporation puts the maximum effort into making semiconductor products betterand more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.Notes regarding these materials1. These materials are intended as a reference to assist our customers in the selection of the RenesasTechnology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party.2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of anythird-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.3. All information contained in these materials, including product data, diagrams, charts, programs andalgorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors.Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page().4. When using any or all of the information contained in these materials, including product data, diagrams,charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from theinformation contained herein.5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a deviceor system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce inwhole or in part these materials.7. If these products or technologies are subject to the Japanese export control restrictions, they must beexported under a license from the Japanese government and cannot be imported into a country other than the approved destination.Any diversion or reexport contrary to the export control laws and regulations of Japan and/or thecountry of destination is prohibited.8. Please contact Renesas Technology Corporation for further details on these materials or the productscontained therein.HD74HCT1383-to-8-line Decoder/DemultiplexerADE-205-547 (Z)1st. EditionSep. 2000 DescriptionThe HD74HCT138 has 3 binary select inputs (A, B, and C). If the device is enabled these inputs determine which one of the eight normally high outputs will go low. Two active low and one active high enables (G1,G2A and G2B) are provided to ease the cascading of decoders.Features• LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility • High Speed Operation: t pd (A, B, C to Y) = 18.5 ns typ (C L = 50 pF)• High Output Current: Fanout of 10 LSTTL Loads• Wide Operating Voltage: V CC = 4.5 to 5.5 V• Low Input Current: 1 µA max• Low Quiescent Supply Current: I CC (static) = 4 µA max (Ta = 25°C)HD74HCT1382Function TableInputs Enable Select Outputs G 1G 2A G 2B C B A Y 0Y 1Y 2Y 3Y 4Y 5Y 6Y 7X X H X X X H H H H H H H H X H X X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H HLLHHHHHHHHHHLPin ArrangementHD74HCT1383DC CharacteristicsTa = 25°CTa = –40 to +85°CTest Conditions Item Symbol Min Typ Max MinMax Unit V CC (V)Input voltageV IH 2.0——2.0—V 4.5 to 5.5V IL——0.8—0.8V 4.5 to 5.5Output voltageV OH 4.4—— 4.4—V4.5Vin = V IH or V IL I OH = –20 µA4.18——4.13— 4.5I OH = –4 mAV OL——0.1—0.1V 4.5Vin = V IH or V IL I OL = 20 µA——0.26—0.33 4.5I OL = 4 mAInput current Iin ——±0.1—±1.0µA 5.5Vin = V CC or GNDQuiescent supply currentI CC——4.0—40µA 5.5Vin = V CC or GND, Iout = 0 µAAC Characteristics (C L = 50 pF, Input t r = t f = 6 ns)Ta = 25°CTa = –40 to +85°CTest Conditions Item Symbol Min Typ Max MinMax Unit V CC (V)Propagation delay t PHL—1835—44ns 4.5A, B or C to outputtimet PLH —1930—38ns 4.5t PHL —1730—38ns 4.5G 1 to output t PLH —1730—38ns 4.5t PHL —1735—44ns 4.5G 2A or G 2B to output t PLH—1730—38ns 4.5Output rise/fall timet TLH t THL —515—19ns 4.5Input capacitanceCin—510—10pF—HD74HCT138 Package Dimensions4HD74HCT1385HD74HCT1386Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright © Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.Hitachi Asia Ltd. Hitachi Tower16 Collyer Quay #20-00, Singapore 049318Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877URL : .sg URLNorthAmerica : /Europe : /hel/ecg Asia : Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.(Taipei Branch Office)4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TPURL : Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre,Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong KongTel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281URL : Hitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 585160Hitachi Europe GmbHElectronic Components Group Dornacher Stra βe 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:Colophon 2.0。

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

HD74LS04 / HD74LS05Hex Inverters / Hex Inverters (with Open Collector Outputs)REJ03D0391–0300Rev.3.00Jul.13.2005 Features• Ordering Information• HD74LS04Part Name Package Type Package Code(Previous Code)PackageAbbreviationTaping Abbreviation(Quantity)HD74LS04P DILP-14pin PRDP0014AB-B(DP-14AV)P —HD74LS04FPEL SOP-14 pin (JEITA) PRSP0014DF-B(FP-14DAV)FP EL (2,000 pcs/reel)HD74LS04RPEL SOP-14 pin (JEDEC) PRSP0014DE-A(FP-14DNV)RP EL (2,500 pcs/reel)• HD74LS05Part Name Package Type Package Code(Previous Code)PackageAbbreviationTaping Abbreviation(Quantity)HD74LS05P DILP-14pin PRDP0014AB-B(DP-14AV)P —HD74LS05FPEL SOP-14 pin (JEITA) PRSP0014DF-B(FP-14DAV)FP EL (2,000 pcs/reel)HD74LS05RPEL SOP-14 pin (JEDEC) PRSP0014DE-A(FP-14DNV)RP EL (2,500 pcs/reel)Note: Please consult the sales office for the above package availability. Pin ArrangementCircuit Schematic (1/6)Absolute Maximum RatingsUnitRatingsItem SymbolSupply voltage V CC Note 7 VInput voltage V IN 7 V Power dissipation P T 400 mW Storage temperature Tstg –65 to +150 °CNote: Voltage value, unless otherwise noted, are with respect to network ground terminal.Recommended Operating Conditions• HD74LS04MaxUnitMinTypItem SymbolSupply voltage V CC 4.75 5.00 5.25 VI OH — — –400 µAOutput currentI OL — — 8 mA°C2575Operating temperature Topr–20• HD74LS05MaxUnitTypMinItem SymbolSupply voltage V CC 4.75 5.00 5.25 VOutput voltage V OH — — 5.5 VOutput current I OL — — 8 mA°C7525–20Operating temperature ToprElectrical Characteristics• HD74LS04(Ta = –20 to +75 °C)ItemSymbol min. typ.* max. Unit Condition V IH 2.0 — — V Input voltageV IL — — 0.8 V V OH 2.7 — — V V CC = 4.75 V, V IL = 0.8 V, I OH = –400 µA— — 0.5 I OL = 8 mAOutput voltageV OL— — 0.4 V I OL = 4 mAV CC = 4.75 V, V IH = 2 V I IH — — 20 µA V CC = 5.25 V, V I = 2.7 V I IL — — –0.4 mA V CC = 5.25 V, V I = 0.4 VInput current I I — — 0.1 mA V CC = 5.25 V, V I = 7 V Short-circuit outputcurrent I OS –20— –100 mA V CC = 5.25 V I CCH — 1.2 2.4 mA V CC = 5.25 VSupply currentI CCL — 3.6 6.6 mA V CC = 5.25 VInput clamp voltage V IK — — –1.5 V V CC = 4.75 V, I IN = –18 mA Note: * V CC = 5 V, Ta = 25°C• HD74LS05(Ta = –20 to +75 °C)ItemSymbol min. typ.* max. Unit Condition V IH 2.0 — — VInput voltageV IL — — 0.8 V— — 0.5 I OL = 8 mAOutput voltage V OL — — 0.4 V I OL = 4 mAV CC = 4.75 V, V IH = 2 VOutput current I OH — — 100 µA V CC = 4.75 V, V IL = 0.8 V, V OA = 5.5 VI IH — — 20 µA V CC = 5.25 V, V I = 2.7 VI IL — — –0.4 mA V CC = 5.25 V, V I = 0.4 VInput current I I —— 0.1 mA V CC = 5.25 V, V I = 7 V I CCH — 1.2 2.4 mA V CC = 5.25 VSupply currentI CCL —3.6 6.6 mA V CC = 5.25 V Input clamp voltage V IK — — –1.5 V V CC =4.75 V, I IN = –18 mA Note: * V CC = 5 V, Ta = 25°CSwitching Characteristics• HD74LS04(V CC = 5 V, Ta = 25°C)Item Symbol min. typ. max. Unit Conditiont PLH — 9 15 nsPropagation delay timet PHL — 10 15 ns C L = 15 pF, R L = 2 k Ω• HD74LS05(V CC = 5 V, Ta = 25°C)Item Symbol min. typ. max. Unit Conditiont PLH — 17 32 nsPropagation delay time t PHL — 15 28 nsC L = 15 pF, R L = 2 k ΩNote: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-0100)".Package Dimensions RENESAS SALES OFFICESRefer to "/en/network" for the latest and detailed information.Renesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.ATel: <1> (408) 382-7500, Fax: <1> (408) 382-7501Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900Renesas Technology Hong Kong Ltd.7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong KongTel: <852> 2265-6688, Fax: <852> 2730-6071Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, TaiwanTel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999Renesas Technology (Shanghai) Co., Ltd.Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, ChinaTel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632Tel: <65> 6213-0200, Fax: <65> 6278-8001Renesas Technology Korea Co., Ltd.Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, KoreaTel: <82> 2-796-3115, Fax: <82> 2-796-2145Renesas Technology Malaysia Sdn. Bhd.Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, MalaysiaTel: <603> 7955-9390, Fax: <603> 7955-9510。

2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
8.65
9.05 Max
14
8
1
7
3.95 1.75 Max
0.635 Max
0.11 0.04
1.27 *0.40 ± 0.06
0.14
+ –
0.15 0.25 M
*Pd plating
*0.20 ± 0.05
Unit: mm
6.10
+ –
0.10 0.30
1.08
0.60
+ –
0.67 0.20
Vin = VIH or VIL IOH = –20 µA
IOH = –4 mA IOH = –5.2 mA Vin = VIH or VIL IOL = 20 µA
IOL = 4 mA IOL = 5.2 mA Vin = VCC or GND Vin = VCC or GND, Iout = 0 µA
HD74HC04
Hex Inverters
Features
• High Speed Operation: tpd = 7.5 ns typ (CL = 50 pF) • High Output Current: Fanout of 10 LSTTL Loads • Wide Operating Voltage: VCC = 2 to 6 V • Low Input Current: 1 µA max • Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C)