KH550-KH560-KH570-KH580-KH602-KH792
KH550
中⽂名称： γ-氨丙基三⼄氧基硅烷
中⽂别名： 3-氨基丙基三⼄氧基硅烷; 硅烷偶联剂KH-550; 硅烷偶联剂A-1100; 3-氨丙基三⼄氧基硅烷; γ-氨丙基三⼄氧基硅烷(KH-550); (3-氨丙基)三⼄氧基硅烷; 偶联剂-550; 偶联剂550; γ-
氨基丙基三⼄氧硅烷; 3-氨丙基三⼄氧基硅烷;
英⽂名称： 3-Aminopropyltriethoxysilane
英⽂别名： AMEO; (3-Aminopropyl)triethoxysilane; DYNASYLAN 1211;DYNASYLAN AMEO; 3-Aminopropylmethyldimethoxysilane;
3-Triethoxysilylpropylamine; Silane Coupling Agent KH-550;
Silane Coupling Agent A-1100; γ-Aminopropyltriethoxysilane; Coupling Agent-550; BHCOUP-550;
3-(triethoxysilyl)propan-1-amine;
gamma-aminopropyltriethoxysilane; Aminopropyltrimethoxysilane;
Aminopropyltriethoxysilane
CAS 号： 919-30-2
EINECS 号： 213-048-4
分⼦式： C 9H 23NO 3Si
分⼦量： 221.3693InChI ： InChI=1/C9H23NO3Si/c1-4-11-14(12-5-2,13-6-3)9-7-8-10/h4-10H2,1-3H3
分⼦结构：
密度： 0.939g/cm 3
熔点： -70℃
沸点： 222.1°C at 760 mmHg
闪点： 104.4°C
⽔溶性：REACTS
SP601 Hardware
User Guide
UG518 (v1.7) September 26, 2012SP601 Hardware User
UG518 (v1.7) September 26, 2012© Copyright 2009–2012 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.DISCLAIMERThe information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available “AS IS” and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct any errors contained in the Materials, or to advise you of any corrections or update. You may not reproduce, modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions of the Limited Warranties which can be viewed at /warranty.htm; IP cores may be subject to warranty and support terms contained in a license issued to you by Xilinx. Xilinx products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in Critical Applications: /warranty.htm#critapps.
SuperSOTSOT23 NPN SILICON POWER(SWITCHING) TRANSISTORSISSUE 3 - NOVEMBER 1995FEATURES*625mW POWER DISSIPATION*IC CONT 3A*12A Peak Pulse Current*Excellent HFE Characteristics Up To 12A (pulsed)*Extremely Low Saturation Voltage E.g. 8mV Typ.*Extremely Low Equivalent On Resistance; RCE(sat)DEVICE TYPECOMPLEMENTPARTMARKINGRCE(sat)FMMT617FMMT71761750mΩ at 3AFMMT618FMMT71861850mΩ at 2AFMMT619FMMT72061975mΩ at 2AFMMT624FMMT723624-FMMT625625-ABSOLUTE MAXIMUM RATINGS.PARAMETERSYMBOLFMMT617FMMT618FMMT619FMMT624FMMT625UNITCollector-Base VoltageVCBO152050125150VCollector-Emitter VoltageVCEO152050125150VEmitter-Base VoltageVEBO55555VPeak Pulse Current**ICM126633AContinuous Collector CurrentIC32.5211ABase CurrentIB500mAPower Dissipation at Tamb =25°C*Ptot625mWOperating and Storage TemperatureRangeTj:Tstg-55 to +150°C*Maximum power dissipation is calculated assuming that the device is mounted on a ceramic substrate measuring 15x15x0.6mm**Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2%
ISO9453-2014 软钎料-化学成分和形态
前言
介绍
1范围
2规范性引用
3术语和定义
4化学成分
5交付形式
5.1一般
5.2产品单元
6.采样和分析
7标志、标签和包装
附件A(信息) ISO9453合金编号与IEC61190-1-3合金缩写对照表以及化学成分
附件B(信息)专利合金和专利持有人列表
参考文献
前 言
SO(国际标准化组织)是一个世界性的国家标准组织联盟。ISO通常是由ISO技术委员会来制定国际标准。因某个技术主题而成立的技术委员会中的成员组织有权派代表出席该委员会。与ISO保持联系的国际组织、政府和非政府组织，也参与标准工作。ISO与国际电工委员会(IEC)就电工技术标准化的所有问题紧密合作。
在ISO/IEC指令第1部分中描述了用于开发本文件的程序和用于进一步维护的程序。特别要注意不同类型的ISO文件所需要的不同的审批标准。本文件是按照《ISO/IEC指令》第2部分的编辑规则起草的。/directives
提请注意的是，本文件的某些部分可能涉及到专利权。ISO不负责识别任何或所有此类专利权。在该文件的开发过程中所确定的任何专利权的细节将会呈现在简介和收到的专利声明的ISO列表中。/patents
本文件中使用的任何商业名称都是为方便用户而提供的信息，不构成背书。
关于ISO的具体术语和表达与符合性评估相关的解释，以及ISO在技术性贸易壁垒中遵守WTO原则的信息，请参阅以下网址:前言-补充信息。
负责本文件的委员会是ISO/TC 44，焊接，分委员会SC 12，焊接材料。
第三版取消并取代了第二版(ISO 9453:2006)，该版本已经过技术修改。
若要求对该国际标准的技术方面进行官方解释，应通过用户的国家标准化机构向ISO/TC 44/SC 12“焊接材料”的有关秘书处提出;这些机构的清单可以在找到。
简 介
国际标准化组织(ISO)提请注意这一事实，即遵守本文件可能涉及使用表3所列的软焊剂合金成分的专利。
