SMBJ6V0CA中文资料

April 2008 Rev 11/13ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Single line low capacitance T ransil™ for ESD protectionFeatures■Single line bi-directional protection ■Breakdown voltage V BR = 6.1 V min.■Very low capacitance (6 pF typ. @ 3 V)■Lead-free packageBenefits■Very low capacitance for optimized data integrity■Very low reverse current < 0.1 µA■Low PCB space consumption: 0.6 mm 2 max ■High reliability offered by monolithic integrationComplies with the following standards:■IEC 61000-4-2 level 4–15 kV (air discharge)–8 kV (contact discharge)■MIL STD 883G - Method 3015-7: class 3 B –Human body modelApplicationsWhere transient overvoltage protection in ESD sensitive equipment is required, such as:■Computers ■Printers■Communication systems■Cellular phone handsets and accessories ■Video equipmentTM: Transil is a trademark of STMicroelectronicsDescriptionThe ESDAVLC6V1-1BM2 andESDAVLC6V1-1BT2 are monolithic application specific devices dedicated to ESD protection of high speed serial interfaces such as USB 2.0, display and camera interface.The devices are ideal for applications where both printed circuit board space and power absorption capability are required.Characteristics ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT22/131 CharacteristicsTable 1.Absolute maximum ratings (T amb = 25° C)Symbol ParameterValue Unit V PP (1)1.For a surge greater than the maximum values, the diode will fail in short-circuit.Peak pulse voltage IEC 61000-4-2 contact dischargeIEC 61000-4-2 air dischargeMIL STD 883G - Method 3015-7: class 3B 151525kV P PP (1)Peak pulse power dissipation (8/20 µs)T j initial = T amb30W IPP Peak pulse current (8/20 µs) 2.5A T j Junction temperature 125°C T stg Storage temperature range- 55 to + 150°C T L Maximum lead temperature for soldering during 10 s 260°C T OPOperating temperature range- 40 to + 125°CESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Characteristics3/13Figure 2.Relative variation of peak pulse power versus initial junctionFigure 3.Peak pulse power versus exponential pulse durationFigure 4.Clamping voltage versus peak pulse current (typical values)Figure 5.Junction capacitance versus reverse voltage applied (typical Figure 6.Relative variation of leakage current versus junctionFigure 7.S21 attenuation measurement resultCharacteristicsESDAVLC6V1-1BM2, ESDAVLC6V1-1BT24/13Figure 8.ESD response to IEC 61000-4-2(+2 kV air discharge)Figure 9.ESD response to IEC 61000-4-2 (-2 kV air discharge)Figure 10.ESD response to IEC 61000-4-2(+8 kV air discharge) Figure 11.ESD response to IEC 61000-4-2(-8 kV air discharge)Figure 12.ESD response to IEC 61000-4-2(+15 kV air discharge)Figure 13.ESD response to IEC 61000-4-2(-15 kV air discharge)ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Characteristics5/13Figure 14.ESD response to IEC 61000-4-2(+2 kV contact discharge)Figure 15.ESD response to IEC 61000-4-2(-2 kV contact discharge)Figure 16.ESD response to IEC 61000-4-2(+8 kV contact discharge) Figure 17.ESD response to IEC 61000-4-2(-8 kV contact discharge)Figure 18.ESD response to IEC 61000-4-2(+15 kV contact discharge)Figure 19.ESD response to IEC 61000-4-2(-15kV contact discharge)Ordering information scheme ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 2 Ordering information scheme6/13ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Package information7/133 Package information●Epoxy meets UL94, V0In order to meet environmental requirements, ST offers these devices in ECOP ACK ®packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDECStandard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOP ACK is an ST trademark. ECOPACK specifications are available at .Note:Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.Package information ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Note:Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin1 mark is to be used for this purpose.8/13ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Package information9/13Recommendation on PCB assembly ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT210/134Recommendation on PCB assembly4.1Stencil opening design1.General recommendation on stencil opening designa) Stencil opening dimensions: L (Length), W (Width), T (Thickness).b) General design ruleStencil thickness (T) = 75 ~ 125 µm2. Reference designa) Stencil opening thickness: 100 µmb) Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.4.2 Solder paste1.Halide-free flux qualification ROL0 according to ANSI/J-STD-004.2. “No clean” solder paste is recommended.3. Offers a high tack force to resist component movement during high speed4.Solder paste with fine particles: powder particle size is 20-45 µm.Aspect Ratio WT----- 1.5≥=Aspect Area L W×2T L W +()---------------------------0.66≥=ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2Recommendation on PCB assembly11/134.3 Placement1.Manual positioning is not recommended.2.It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3.Standard tolerance of ± 0.05 mm is recommended.4. 3.5 N placement force is recommended. Too much placement force can lead tosqueezed out solder paste and cause solder joints to short. Too low placement forcecan lead to insufficient contact between package and solder paste that could causeopen solder joints or badly centered packages.5. To improve the package placement accuracy, a bottom side optical control should beperformed with a high resolution tool.6.For assembly, a perfect supporting of the PCB (all the more on flexible PCB) isrecommended during solder paste printing, pick and place and reflow soldering byusing optimized tools.4.4 PCB design preference1.To control the solder paste amount, the closed via is recommended instead of open vias.2. The position of tracks and open vias in the solder area should be well balanced. Thesymmetrical layout is recommended, in case any tilt phenomena caused byasymmetrical solder paste amount due to the solder flow away.4.5 Reflow profileNote:Minimize air convection currents in the reflow oven to avoid component movement.Ordering information ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT212/135 Ordering information6 Revision historyTable 5.Ordering informationOrder code MarkingPackage Weight Base qty Delivery mode ESDAVLC6V1-1BM2C (1)1.The marking can be rotated by 90° to diferentiate assembly locationSOD8820.92 mg 3000Tape and reel ESDAVLC6V1-1BT2T (1)SOD882Thin 0.76 mg 3000Tape and reel Table 6.Document revision history DateRevision Changes16-Apr-20081Initial release.ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 13/13Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWI SE SET FORTH I N ST’S TERMS AND CONDI TI ONS OF SALE ST DI SCLAI MS ANY EXPRESS OR I MPLI ED WARRANTY W TH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS NCLUD NG W THOUT L M TAT ON MPL ED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.UNLESS EXPRESSLY APPROVED I N WR I T I NG BY AN AUTHOR I ZED ST REPRESENTAT IVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2008 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America。

2-φ5.5 MOUNTING HOLES
16 3
2-φ2.5
17.5 12
N
32 55
12 (SCREWING DEPTH) 7
1
5
9
13
19
14.5 17.5
P
6-M5 NUTS
B
10.75 32.75
U
V
W
23
23
19-s0.5
12 23
13 31
13.5 11.75
22
+ –
1 0.5
Terminal code
Fault Output Supply Voltage
IFO
Fault Output Current
Condition Applied between : VUP1-VUPC
VVP1-VVPC, VWP1-VWPC, VN1-VNC Applied between : UP-VUPC, VP-VVPC
WP-VWPC, UN • VN • WN • Br-VNC Applied between : UFO-VUPC, VFO-VVPC, WFO-VWPC
FO-VNC Sink current at UFO, VFO, WFO, FO terminals
Ratings
Unit
600
V
75
A
150
A
297
PM75RLA060
FLAT-BASE TYPE INSULATED PACKAGE
TOTAL SYSTEM
Symbol VCC(PROT) VCC(surge) TC Tstg Viso
Parameter Supply Voltage Protected by SC Supply Voltage (Surge) Module Case Operating Temperature Storage Temperature Isolation Voltage

DC bus voltageDC bus voltage (Surge)DC bus voltage (Short operating)Collector-Emitter voltage Collector currentDC 1msDuty=56.6%Collector power dissipation One transistorJunction temperatureInput voltage of power supply for pre-driver Input signal voltage Input singal current Alarm signal voltage Alarm signal current Storage temperatureOperating case temperatureIsolating voltage (T erminal to base, 50/60Hz sine wave 1min.)Screw torque136MBP30RH060IGBT ModulesIGBT -IPM R series600V / 30A / 6 in one-packageq Absolute maximum ratings (Tc=25˚C unless otherwise specified)s Features• Low power loss and soft switching• High performance and high reliability IGBT with overheating protection• Higher reliability because of a big decrease in number of parts in built-in control circuits Applications• Inverter for motor drive• AC and DC servo drive amplifier • UPS (Uninterruptible power supply)s Maximum ratings and characteristicsItemSymbol Rating Unit V DCV DC (surge)V SC V CES I C I CP –I C P C T j V CC V in I in V ALM I ALM T stg T cop V isoMounting (M4)45050040060030603085150–0.3 to 20Vz 1Vcc 15–40 to 125–20 to 100AC 2500 2.0V V V V A A A W ˚C V V mA V mA ˚C ˚C V N • mq Electrical characteristics of power circuit (Tc=Tj=25˚C, Vcc=15V)Symbol I CESV CE (sat)V FConditionV CE =600V, Vin open Ic=30A –Ic=30AMin.–––Max.1.02.73.5Unit mA V VTyp.–––ItemCollector current at off signal input Collector-Emitter saturation voltage Forward voltage of FWD元器件交易网Min.0.5––Symbol t on t off t rrUnit µs µs µs14q Switching characteristics (Tc=Tj=25˚C, Vcc=15V)ItemConditionIc=30A, V DC =300V Inductive-LoadMax.–3.50.5Typ.–––Switching time (IGBT) See Fig. 3Switching time (FWD)Fig.1 Definition of OC delay timeFig.2 Definition of tscFig.3 Definition of switching timeDC bus voltageOperating power supply voltage range of pre-drive Switching frequency Flatness of heat sinkMounting screw torque (M4)Junction to case thermal resistanceCase to fin thermal resistance with compound ItemSymbol Rth (j-c)Rth (j-c)Rth (c-f)Max.1.472.1–Unit ˚C/W ˚C/W ˚C/WTyp.––0.05q Thermal characteristics (Tc=Tj=25˚C, Vcc=15V)IGBT FWDSymbol V DC V CC f sw ––ItemUnit V V kHz µm N • mTyp.–15–––Min. 200 13.5 1–100 1.3Max.40016.5201001.7q Recommendable valueMin.–––q Electrical characteristics of control circuit (Tc=Tj=25˚C, Vcc=15V)Shows theory dimensions15s Block diagrams Outline drawings, mmPre-driver 1 includes following functions. (P-side)• Amplifier for drive• Power supply undervoltage protection • IGBT chip overheating protectionPre-driver 2 includes following functions. (N-side)• Amplifier for drive• Power supply undervoltage protection • IGBT chip overheating protection • Overcurrent protection • Alarm signal outputMass : 50gs Characteristics (Representative)Collector current vs. Collector-emitter voltage Collector current vs. Collector-emitter voltage Switching losses vs. Collector current Switching losses vs. Collector currentSwitching time vs. Collector current Switching time vs. Collector current1617Forward voltage vs. Forward current Forward voltage vs. Forward currentTransient thermal resistance Power supply current vs. Switching frequencyOvercurrent protection vs. Case temperature。

1 U 22 V 23 W
G
F
S - DIA. (2 TYP.)
P
L M M E B 2.0 X 0.5 MM TAB (5 TYP.) 0.6 X 0.4 MM TAB (18 TYP.) K M M
T P
VWPC WP WFO VWPI V NC
U
VUPC UP UFO VUPI VVPC VP VFO VVPI
P
V N1
WN
FO
VN
UN
GND GND IN SI FO OUT V CC
GND GND IN SI FO OUT V CC
TB
GND
GND GND IN SI FO OUT V CC
GND
V CC
WN
VN
S WN
O WN
S UN
UN
FO
TC
O UN
S VN
O VN
N
W
V
U
Outline Drawing and Circuit Diagram Dimensions A B C D E F G H J K Inches 3.72±0.04 3.33±0.02 2.99 2.300±0.02 2.20±0.02 1.73±0.04 1.32±0.03 1.01 0.75 0.71±0.04 Millimeters 94.5±1.0 84.5±0.5 76.0 58.42±0.5 56.0±0.5 44.0±1.0 33.6±0.8 25.7 19.0 18.0±1.0 Dimensions L M N P Q R S T U V Inches 0.561 0.55±0.01 0.513 0.31±0.02 0.300 0.20 Rad. 0.18 Dia. 0.14 0.13±0.02 0.100±0.01 Millimeters 14.25 14.0±0.25 13.04 8.0±0.5 7.62 Rad. 5.0 Dia. 4.5 3.5 3.2±0.5 2.54±0.25