I2C1I2C (3)2.1 (4)2.2 (5)3I2C (6)5 (7)6.1 (7)6.2 (8)7 (10)8.1 (10)8.2 (10)8.3 (11)97 (13)10.1 (13)10.1.1 (14)10.1.2 (15)10.1.3 CBUS (16)11 (17)13I/O (26)15.1 (26)15.2 Hs (28)16 (33)17.1 I2C (33)17.2 I2C (34)17.3 (34)17.4 I2C Rp R S (35)17.5 Hs I2C Rp R S (35)18Philips (37)204400kbit/s0~100kbit/s I 2C10241.22.0-1998I 2CHsI 2C2V0.6V 6mAHs13.222672LCDRAMDTMFICPhilips150CMOSI 2CICI 2CI 2CSCL8100kbit/s3.4Mbit/s1I 2CI 2CICICI 2CICIC1 I 2Ca bI 2CP C BI 2CIC SO I 2CICIC ROM3I/OIC4NMOS SDASCLLCD11 I2CI2CA BA BABAAI2C I2C1SCLS DAS C LMICRO -CONTROLLERASTATICRAM OREEPROMLCDDRIVERGATEARRAY ADCMICRO -CONTROLLERB2I2CI2C5I2C100kbit/s3.4Mbit/s13I2C156.1SDA4SCLKN1OUTSCLK INSCLKDATAN1OUT DATA IN DEVICE 1SDA (Serial Data Line)SCL (Serial Clock Line)SCLKN2OUT SCLK INSCLK DATAN2OUT DATA IN DEVICE 2V DDR pR ppull-up resistors3I 2Cdata line stable;data validchange of data allowedSDASCL4 I 2C6.2I 2C S P 5SDASCL15SrSSDA SCLPSTOP conditionSDASCLSSTART condition5公司机密7SCLCBUS10.1.3SDASDA76 I 2C机密7 I2C88C LK1CLK2SCLstart counting8SCL密1014Hs8139DATA1SDADATA 1DATA 2SDASCL9I2C8.3SCL97R/W1PSrA 13A123AAI2C57公司机密12131010.1.110.17LSB1R/W43I2C I2C82142R/W0000 000 00000 000 10000 001 X CBUS0000 010 X0000 011 X0000 1XX X Hs1111 1XX X1111 0XX X 1023I2CB1HSDA SCL0000010000000000117I2C1817S9821Sr7ACKdummy acknowledge (HIGH)start byte 00000001SDASCL18S00000001SDASDASrI 2C80000001XDLEN19CBUSCBUSS P STOP conditionCBUS load pulsen - data bitsCBUS addressSTART conditionR/WbitACK related clock pulseSDASCLDLEN19CBUS100kbit/s7400kbit/sHs10公司机密I 2C100kbit/sHs711210710I 2C710I 2CSDA SCLI 2C13SCL 0~100kbit/sI 2C400kbit/sSDASCLCBUSSDA SCLSDASCLI/OI 2CHsI 2CHsHs13.13.4Mbit/sHsSDAH SCLH1Hs1HsHs1:2Hs1HsF/SSDASCLHsSCLHSDAHHsSDAHSCLHSchmitt20Hs I2CHsI/O>100pFR p HsSCLHMCS(3)SCLH公司机密13.2 HsHsI 2CF/S200001XXXA F/SHs0000 1000AHsAHsSCLHSCLHSCLHSCLH7R/WAAASCLHF/SHs(8-bit DA A/A)= MCS current source pull-up= Rp resistor pull-up22Hs13.3F/S HsF/SI2CS 00001XXX AHsHs SDAH SCLHHsHs SDAH SCLHt H Hst H SCLH1212SDAH SDAHHst1Hs 公司机密13.4Hs23HsF/SF/SHsSDASCLSDA SCL(3)SCL2425HsVDD25VF/SVDD13VVDD1SDAHSDASCLTR1TR1TR2TR1TR2SDASCLVDD2HsSDAHSCLHSDASCLF/S8Hs3.4Mbit/s00001XXX400000XXXF/S公司机密VSSHs-modeSLAVESDAHSCLHVSSHs-modeMASTER/SLAVESDAH SCLHSDASCLRsRsHs-modeSLAVESDAH SCLHV SSR s R sF/S-modeMASTER/SLAVESDASDAHSCLHSDASCLSCLV SSV SSR s R sF/S-modeSLAVESDA SCLV SSR s R sR s R sR sR sV DDV SSHs-modeMASTER/SLAVEV DDV DD1R pR pV DD2R pR p SCLHSDAHMCSMCS(3)(3)(2)(2)(2)(2)(2)(2)(2)(2)(2)(2)(2)(4)(4)(4) (2)(1)(1)BRIDGETR1TR3TR2(1)(2)(4)24Hs F/S3Hs++Hs+Hs++Hs<->Hs 0~3.4Mbit/s 0~3.4Mbit/s 0~3.4Mbit/s -Hs<->0~100kbit/s 0~400kbit/s - -Hs<->0~100kbit/s - 0~100kbit/s - <->0~100kbit/s - - 0~100kbit/s<->0~100kbit/s 0~400kbit/s - 0~100kbit/s<->0~100kbit/s - 0~100kbit/s 0~100kbit/s13.5.1F/S24F/S I2C公司机密25Hs125TR1SDAHSDASCLHSCLTR2SrSCLHSrSCLAASCLHSCLHF/SSCL1祍FSP1SCLHSCLTR3tFSF/S公司机密SDASDAHSDA5t BUFtHSDAHSCLHSDASCL1010107101111XXX7710I2C1111XXX8411111XX I2CS Sr1001081107R/WA1XXXXXXXXA22R/WSr7R/WSr11110XXR/W R/W=111110XX公司机密R/W2930SSr30710114101010公司机密30714.310I2C10H10.1.11000000001H0171010.1.2I/O15.1F/S I2CI/O I2C31I2C100kbit/sI2C8SCLV DDV IL-0.5-0.51.50.3V DDn/a-0.5n/a0.3V DD(1)VV VDD>2VV DD<2VV hysn/an/an/an/a0.05V DD0.1V DD--VV 3mA0.1V DD ~0.9VDDmaxI i -10 10 -10(5)10(5)礎I/OC i-10-10pFI 2C23pF5SDASCLt ft ofR S365I/O SDA SCL5F/SI 2CSDASCL(1)SCL fSCL 0 100 0 400kHzCBUS(10.1.3)I2Ct HD;DAT5.00(2)-3.45(3)-0(2)-0.9(3)祍 祍t SU;DAT 250 - 100(4)-ns SDA SCL t r - 1000 20+0.1C b(5)300 ns SDASCLt f-300 20+0.1C b(5)300 nst SU;STO 4.0 - 0.6 - 祍t BUF 4.7 - 1.3 - 祍C b - 400 - 400 pF V nL 0.1V DD - 0.1V DD - V V nH0.2V DD-0.2V DD-V4SCLV IHmin3SCL4I 2CI 2C 250nsSCL SCLSDAtrmax +t SU;DAT =1000+250=1250nsCb =Hsn/a=31 I 2CF/S15.2 HsHsI 2CI/OHsF/SI 2CSHsR/WSCLHHs7SCLH200ns 100nsSCLH3.4Mbit/s100pF1.7Mbit/sSCLHSDA SCLH 3mA3mASDASDAHSCLSCLHRonH (2)50 - kSCLH(3)400pF SCLH t2C23HsVDDHs SDAH SCLHSCLHVnH0.2V DD- 0.2V DD- V6Cb100~400pF3SCLH1I2CI2C155V10%34510%35300RSSDASCLR p NMOSV DD1R p BiCMOSV DD2CMOSV DD3BIPOLARV DD4= 5 V 10 %DD2 - 4V are device dependent (e.g. 12 V)33I2CSDASCLR p R p CMOS CMOS CMOS CMOSV DD= e.g. 3 V34I2CSDASCLR p CMOSR p CMOS NMOSBIPOLAR5 V 10 %VDD1=V DD2VDD3V DD2,3are device dependent (e.g. 12 V) 35V DD I2CSDASCLR p R pDEVICEV DDI C2R s R sDEVICEV DDI C2R s R s3616.1I2C R p R SI2C33Rp370.1VDD RS RSmax RpRpRp40RpmaxRS040080016001081200642maximum value R()s15 V10 VR p(k )V = 2.5 VDD 5 V38 R S R p010*******20163001284bus capacitance (pF)maximum value R (k )p max. R @ VDD = 5 VSR = 0S39 R pI 2C200204812164080120160total high level input current(A)maximumvalue R p(k )5 V V = 15 V DD2.5 V10 V40R p17.1I 2CI 2C15Miller4tofC bR p5R 120kto input circuit5 pFC1I/ORpC bVDDVSSV pGND T1T2SDA or SCL bus line4217.2I 2CR p3mAV DD =5V10%R pmin =/0.003=1.7k Rp200pFt r300ns43/R p2t rI 2CR SR p2V DDV SSSDA _______________________ V DD _______________________ V SS _______________________ SCL _______________________公司机密VSSSDA _______________________V SS_______________________SCL_______________________SDASCL VDDSCL VSSVDD VSSSDASCL3840tr3944I2C Rp18I/OMOS-FET 1US 5,689,196公司机密I2CHsI2C3.3V5VSDATR1SCL TR2g sdMOS-FET1Rp 3.3VVGSR p5V3.3V 3.3VMOS-FET MOS-FET3.3V3MOS-FETVGS MOS-FET5V13.3V V DD15V V DD22V V DD110V V DD2V DD2VDD119LEDSRAMAD/DAOM4160/490CE201Microcore-411I 2COM1022PC I 2CIBMPCPF8681 I 2C12IC01: Semiconductors for Radio, Audio and CD/DVD Systems 9397 750 02453 IC02: Semiconductors for Television and Video Systems 9397 750 01989 IC03: Semiconductors for Wired Telecom Systems (parts a & b) 9397 750 00839, 9397 750 00811 IC12: I 2C Peripherals9397 750 01647 IC14: 8048-based 8-bit microcontrollers9398 652 40011 IC17: Semiconductors for wireless communications 9397 750 01002 IC18: Semiconductors for in-car electronics 9397 750 00418 IC19: ICs for data communications 9397 750 00138 IC20: 80C51-based 8-bit microcontrollers + Application notes and Development tools9397 750 00963IC22: Multimedia ICs9397 750 02183公司机密13///Can you make the distance... with I 2C-bus (information about the P82B715 I 2C-bus extender IC)9397 750 00008 I 2C-bus multi-master & single-master controller kits 9397 750 00953 Desktop video (CD-ROM)9397 750 00644 80C51 core instructions quick reference 9398 510 76011 80C51 microcontroller selection guide9397 750 01587 OM5027 I 2C-bus evaluation board for low-voltage, low-power ICs & software 9398 706 98011 P90CL301 I 2C driver routinesAN94078 User manual of Microsoft Pascal I 2C-bus driver (MICDRV4.OBJ) ETV/IR8833 C routines for the PCF8584 AN95068Using the PCF8584 with non-specified timings and other frequently asked questionsAN96040User's guide to I 2C-bus control programsETV8835 The I 2C-bus from theory to practice (book and disk)Author: D. Paret Publisher: Wiley ISBN:0-471-96268-6Bi-directional level shifter for I 2C-bus and other systemsAN97055OM5500 demo kit for the PCF2166 LCD driver and PCD3756A telecom microcontroller9397 750 00954 公司机密。
Contactforinformation:Mr.Kinn·Tel.:+49(0)7452-6007-21·e-mail:******************line of GD32 MCU Family. It is a new 32-bit generalpurpose microcontroller based on the ARM ® Cortex ®-M4 RISC core with best cost-performance ratio in terms of enhanced processing capacity, reduced power consumption and peripheral set. The Cortex ®-M4 core features a Floating Point Unit (FPU) that accelerates single precision floating point math operations and supports all ARM ® single precision instructions and data types.The GD32F4 device incorporates the ARM ® Cortex ®-M4 32-bit processor core operating at up to 200 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 3072 KB on-chip Flash memory and 512 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to three 12-bit 16-bit timers, two 16-bit PWM advanced-control timers, two 32-bit general-purpose timers, and two 16-bit basic timers, as well as standard and advanced communication interfaces: up to six SPIs, three I2Cs, four USARTs and four UARTs, two I2Ss, two CANs, a SDIO, USB device/host/OTG FS and HS, and an Ethernet MAC. Additional peripherals as Digital camera interface (DCI), EXMC interface with SDRAM extension support, TFT-LCD Interface (TLI) and Image Processing Accelerator (IPA) are included.The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C temperature range. Three power saving modes provide the flexibility for maximum optimization of power consumption, an especially important consideration in low power applications.• Cortex ®-M4 Core @ 200 MHz• Support H/W DSP instructions + FPU• Zero-wait state execution from Flash memory • Flash from 512 KB to 3072 KB • SRAM from 192 KB to 512 KB• EXMC interface support external SDRAM & SRAM • Up to 8 x UART (9 Mbit/s)• Up to 6 x SPI (30 Mbit/s)• Up to 3 x I2C (400 Kbit/s)HIGH PERFORMANCE OF GD32F4• Up to 2 x CAN2.0B • Up to 2 x I2S• Support SDIO, Ethernet MAC • Support USB OTG FS + HS • 8-14 bit Camera Interface• LCD-TFT controller up to XGA resolution + IPA • Up to 3 x 12 bit, 2.6M SPS ADCs (up to 24 chs)• Up to 2 DACs• Standby Current @ 2 uABGA176 (10*10 mm)BGA100 (7*7 mm)LQFP144 (20*20 mm)LQFP100 (14*14 mm)LQFP64 (10*10 mm)• Industrial automation• Motor frequency conversion • Security and alarm systems • Graphic display• Sensor network and nodes• Consumer and handheld equipment • High-end drone • Intelligent robot • IoT relatedTARGET APPLICATIONSContactforinformation:Mr.Kinn·Tel.:+49(0)7452-6007-21·e-mail:******************。
TI TMS320F280025C实时微控制器(MCU)开发方案TI公司的TMS320F280025C(F28002x)是C2000™实时微控制器系列,具有可升级超低延迟器件,设计用在高效的功率电子学包括但不限于高功率密度高开关频率,支持使用GaN和SiC技术.实时控制子系统是基于32位C28x DSP核,提供浮点或定点核的100MHz 信号处理性能,运营片上闪存回SRAM.C28xCPU核还可从三角数学单元(TMU)和循环冗余校验(VCRC)扩展指令集进行引导,从而加速实时控制系统的共通算法.F28002x实时微控制器(MCU)还集成了高性能模拟区块,和处理和PWM单元密切配合,以提供最佳实时信号链信能.十四个PWM通路,都支持独立与频率的分辨率模式,使得控制3相逆变器的各个功率级,以达到先进的多级功率拓扑.主要应用在工业马达驱动,马达控制,太阳能逆变器,数字功率,电动汽车和交通,检测和信号处理.本文介绍了TMS320F280025C主要特性,功能框图和时钟系统图,模拟子系统框图,ADC模块框图以及开发板LAUNCHXL-F280025C主要特性,框图,电路图,材料清单和PCB设计图.The TMS320F28002x (F28002x) is a member of the C2000™ real-time microcontroller family of scalable, ultralowlatency devices designed for efficiency in power electronics, including but not limited to: high power density,high switching frequencies, and supporting the use of GaN and SiC technologies.These include such applications as:• Industrial motor drives• Motor control• Solar inverters• Digital power• Electrical vehicles and transportat ion• Sensing and signal processingThe real-time control subsystem is based on TIs 32-bit C28x DSP core, which provides 100 MHz of signalprocessingperformance for floating- or fixed-point code running from either on-chip flash or SRAM. The C28xCPU is further boosted by the Trigonometric Math Unit (TMU) and VCRC (Cyclical Redundancy Check)extended instruction sets, speeding up common algorithms key to real-time control systems. High-performance analog blocks are integrated on the F28002x real-time microcontroller (MCU) and are closelycoupled with the processing and PWM units to provide optimal real-time signal chain performance. FourteenPWM channels, all supporting frequency-independent resolution modes, enable control of various power stagesfrom a 3-phase inverter to advanced multi-level power topologies.The inclusion of the Configurable Logic Block (CLB) allows the user to add custom logic and potentially integrateFPGA-like functions into the C2000 real-time MCU.Interfacing is supported through various industry-standard communication ports (such as SPI, SCI, I2C, PMBus,LIN, and CAN) and offers multiple pin-muxing options for optimal signal placement. The Fast Serial Interface(FSI) enables up to 200 Mbps of robust communications across an isolation boundary. New to the C2000 platform is the Host Interface Controller (HIC), a high-throughput interface that allows anexternal host to access the resources of the TMS320F28002x directly.TMS320F280025C主要特性:• TMS320C28x 32-bit DSP core at 100 MHz– IEEE 754 Floating-Point Unit (FPU)• Support for Fast Integer Division (FINTDIV)– Trigonometric Math Unit (TMU)• Support for Nonlinear Proportional IntegralDerivative (NLPID) control– CRC Engine and Instructions (VCRC)– Ten hardware breakpoints (with ERAD)• On-chip memory– 128KB (64KW) of flash (ECC-protected)– 24KB (12KW) of RAM (ECC or parity-protected)– Dual-zone security• Clock and system control– Two internal zero-pin 10-MHz oscillators– On-chip crystal oscillator or external clock input– Windowed watchdog timer module– Missing clock detection circuitry– Dual-clock Comparator (DCC)• Single 3.3-V supply– Internal VREG generation– Brownout reset (BOR) circuit• System peripherals– 6-channel Direct Memory Access (DMA)controller– 39 individually programmable multiplexedGeneral-Purpose Input/Output (GPIO) pins – 16 digital inputs on analog pins– Enhanced Peripheral Interrupt Expansion(ePIE)– Multiple low-power mode (LPM) support– Embedded Real-time Analysis and Diagnostic(ERAD)– Unique Identification (UID) number• Communications peripherals– One Power-Management Bus (PMBus)interface– Two Inter-integrated Circuit (I2C) interfaces– One Controller Area Network (CAN) bus port– Two Serial Peripheral Interface (SPI) ports– One UART-compatible Serial CommunicationInterface (SCI)– Two UART-compatible Local InterconnectNetwork (LIN) interfaces– Fast Serial Interface (FSI) with one transmitterand one receiver (up to 200Mbps)• Analog system– Two 3.45-MSPS, 12-bit Analog-to-DigitalConverters (ADCs)• Up to 16 external channels• Four integrated Post-Processing Blocks(PPB) per ADC– Four windowed comparators (CMPSS) with12-bit reference Digital-to-Analog Converters(DACs) • Digital glitch filters• Enhanced control peripherals– 14 ePWM channels with eight channels thathave high-resolution capability (150-ps resolution)• Integrated dead-band support• Integrated hardware trip zones (TZs)– Three Enhanced Capture (eCAP) modules• High-resolution Capture (HRCAP) availableon one of the three eCAP modules– Two Enhanced Quadrature Encoder Pulse(eQEP) modules with support for CW/CCW operation modes• Configurable Logic Block (CLB)– Augments existing peripheral capability– Supports position manager solutions• Host Interface Controller (HIC)– Access to internal memory from an externalhost• Background CRC (BGCRC)– One cycle CRC computation on 32 bits of data• Diagnostic features– Memory Power OnSelf Test (MPOST)– Hardware Built-in Self Test (HWBIST)• Package options:– 80-pin Low-profile Quad Flatpack (LQFP)[PN suffix]– 64-pin LQFP [PM suffix]– 48-pin LQFP [PT suffix]• Temperature options:– S: –40C to 125C junction– Q: –40C to 125C free-air(AEC Q100 qualification for automotiveapplications)TMS320F280025C应用:• Appliances– Air conditioner outdoor unit• Building automation– Door operator drive control• Industrial machine & machine tools– Automated sorting equipment– Textile machine• EV charging infrastructure– AC charging (pile) station– DC charging (pile) station– EV charging station power module– Wireless EV charging station• Renewable energy storage– Energy storage power conversion system(PCS) • Solar energy– Central inverter– Micro inverter– Solar power optimizer– Solar arc protection– Rapid shutdown– Electricity meter– String inverter• Hybrids, electric & powertrain systems– DC/DC converter– Inverter & motor control– On-board (OBC) & wireless charger• Body electronics & lighting– Automotive HVAC compressor module– DC/AC inverter– Headlight• AC inverter & V F drives– AC drive control module– AC drive position feedback– AC drive power stage module• Linear motor transport systems– Linear motor power stage• Single & multi axis servo drives– Servo drive position feedback– Servo drive power stage module• Speed controlled BLDC drives– AC-input BLDC motor drive– DC-input BLDC motor drive • Industrial power– Industrial AC-DC• UPS– Three phase UPS– Single phase online UPS• Telecom & server power– Merchant DC/DC– Merchant network & server PSU – Merchant telecom rectifiers图1.TMS320F280025C功能框图图2.TMS320F280025C时钟系统图图3.TMS320F280025C模拟子系统框图(80引脚PN和64引脚PM LQFP)图4.TMS320F280025C模拟子系统框图(48引脚PT LQFP)图5.TMS320F280025C ADC模块框图开发板LAUNCHXL-F280025CThe LAUNCHXL-F280025C is a low-cost development bo ard for the Texas Instruments C2000™ Real-TimeMicrocontroller series of F28002x devices. It is designed around the TMS320F280025C real-time MCU andhighlights the control, analog, and communications peripherals, as well as the integrated nonvolatile memory.The LaunchPad also features two independent BoosterPack XL expansion connectors (80-pins),on-boardController Area Network (CAN) transceiver, two 5 V encoder interface (eQEP) connectors, FSI connector, and anon-board XDS110 debug probe.图6.开发板LAUNCHXL-F280025C外形图开发板LAUNCHXL-F280025C主要特性:The F28002x LaunchPad has these features:• C2000 Series F280025CPNS (80-pin) microcontroller:– With Configurable Logic Block (CLB) capability• On-board XDS110 debug probe• Two user-controlled LEDs• One mi crocontroller reset switch• Selectable power domains:– USB (isolated)– BoosterPack– External power supply• CAN connector with on-board CAN transceiver• Two independent Enhanced Quadrature Encoder Pulse (QEP)-based encoder connectors• FSI peripheral connector• Two independent BoosterPack XL standard connectors (80-pins) featuring stackable headers to maximizeexpansion through the BoosterPack ecosystem开发板LAUNCHXL-F280025C包括:The F28002x Series LaunchPad Development Kit contains these items:• C2000 F28002x Series LaunchPad development board (LAUNCHXL-F280025C)• USB micro-B plug to USB-A plug cable• Quick Start Guide图7.开发板LAUNCHXL-F280025C框图图8.开发板LAUNCHXL-F280025C电路图(1)图9.开发板LAUNCHXL-F280025C电路图(2)图10.开发板LAUNCHXL-F280025C电路图(3)图11.开发板LAUNCHXL-F280025C电路图(4)图12.开发板LAUNCHXL-F280025C电路图(5)图13.开发板LAUNCHXL-F280025C PCB设计图(1):信号,层1图14.开发板LAUNCHXL-F280025C电路图(2):GND,层2图15.开发板LAUNCHXL-F280025C电路图(3):PWR,层3图16.开发板LAUNCHXL-F280025C电路图(4):底层信号,层4。
