AMD Family 10 information

Broadcom NetXtreme 10GBase-T Network Adapter Family for System xProduct Guide (withdrawn product)The Broadcom NetXtreme 10 GbE 10GBase-T Network Adapter Family for System x® features robust, standards-based 10GBase-T adapters in either a low-profile PCI Express or mezzanine LOM generation 2 (ML2) form factor. These adapters enable affordable 10-Gigabit Ethernet (10 GbE) network performance with cost-effective RJ-45 connections for distances up to 100 meters. They are compatible with the installed base of GbE switching and cabling infrastructure commonly deployed today.Figure 1 shows the Broadcom NetXtreme 2x10GbE BaseT Adapter.Figure 1. Broadcom NetXtreme 2x10GbE BaseT Adapter for System xDid you know?The Broadcom NetXtreme 10 GbE 10GBase-T Network Adapter family provides an ideal solution for System x servers requiring high-speed data transfer in LAN connectivity for mission-critical applications levering the existing, affordable cabling and switching IT infrastructure. These network adapters provides support for 10 Gb networking with CAT 6/7 copper cable connectivity with two built-in RJ-45 ports.Click here to check for updatesFigure 2. Broadcom NetXtreme II ML2 Dual Port 10GbaseT for System xFigure 3. Broadcom NetXtreme II Dual Port 10GBaseT Adapter for System xSupport for servers with Intel Xeon E5 v3 and E3 v4 processors Table 3. Support for servers with Intel Xeon v3 processorsPart number Description44T1370Broadcom NetXtreme 2x10GbE BaseT Adapter N Y Y Y Y Y Y 00D2026Broadcom NetXtreme II ML2 Dual Port 10GbaseT N N N Y Y Y Y 49Y7910Broadcom NetXtreme II Dual Port 10GBaseT AdapterYYNNNY NSupport for servers with Intel Xeon v2 processors Table 4. Support for servers with Intel Xeon v2 processorsPart numberDescription44T1370Broadcom NetXtreme 2x10GbE BaseTAdapter Y Y Y Y Y Y Y Y Y Y Y Y Y 00D2026Broadcom NetXtreme II ML2 Dual Port10GbaseT N N N N N N N Y Y Y Y N N 49Y7910Broadcom NetXtreme II Dual Port10GBaseT AdapterYYYYYYYYYYYYY See ServerProven for the latest information about the adapters supported by each System x server type:/us/en/serverproven/xseries/lan/matrix.shtmlx 3100 M 5 (5457)x 3250 M 5 (5458)x 3500 M 5 (5464)x 3550 M 5 (5463)x 3650 M 5 (5462)x 3850 X 6/x 3950 X 6 (6241, E 7 v 3)n x 360 M 5 (5465)x 3500 M 4 (7383, E 5-2600 v 2)x 3530 M 4 (7160, E 5-2400 v 2)x 3550 M 4 (7914, E 5-2600 v 2)x 3630 M 4 (7158, E 5-2400 v 2)x 3650 M 4 (7915, E 5-2600 v 2)x 3650 M 4 B D (5466)x 3650 M 4 H D (5460)x 3750 M 4 (8752)x 3750 M 4 (8753)x 3850 X 6/x 3950 X 6 (3837)x 3850 X 6/x 3950 X 6 (6241, E 7 v 2)d x 360 M 4 (E 5-2600 v 2)n x 360 M 4 (5455)Table 6. Operating system support for Broadcom NetXtreme II ML2 Dual Port 10GbaseT, 00D2026Operating systemsMicrosoft Windows Server 2008 R2Y Y Y N N Y Y Y N Microsoft Windows Server 2012Y Y Y Y Y Y Y Y Y Microsoft Windows Server 2012 R2N Y Y Y Y Y Y Y Y Microsoft Windows Server 2016N Y Y Y Y Y Y Y YMicrosoft Windows Server 2019N N N Y N N Y N Y Microsoft Windows Server version 1709N N Y Y N Y Y Y Y Microsoft Windows Server version 1803N N N N N N Y N Y Red Hat Enterprise Linux 6 Server x64 Edition Y Y Y Y Y Y Y Y Y Red Hat Enterprise Linux 7Y Y Y Y Y Y Y Y Y Red Hat Enterprise Linux 8.0N N N Y N N N N N SUSE Linux Enterprise Server 11 for AMD64/EM64TY Y Y Y Y Y Y Y Y SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T Y Y Y Y Y Y Y Y Y SUSE Linux Enterprise Server 12N Y Y Y Y Y Y Y Y SUSE Linux Enterprise Server 12 with Xen N N N N N Y Y Y Y SUSE Linux Enterprise Server 15N N Y Y N N Y N Y SUSE Linux Enterprise Server 15 with Xen N N Y Y N N Y N Y VMware vSphere 5.1 (ESXi)Y Y N N Y Y N Y N VMware vSphere Hypervisor (ESXi) 5.5Y Y Y N Y Y Y Y Y VMware vSphere Hypervisor (ESXi) 6.0N Y Y N Y Y Y Y Y VMware vSphere Hypervisor (ESXi) 6.5Y N Y Y Y Y Y Y Y VMware vSphere Hypervisor (ESXi) 6.7NNNYN N Y N Y[in box driver support only]x 3850/3950 X 6 (3837)x 3850/3950 X 6 (6241, E 7 v 2)x 3850/3950 X 6 (6241, E 7 v 3)x 3850/3950 X 6 (6241, E 7 v 4)n x 360 M 5 (5465)x 3550 M 5 (5463)x 3550 M 5 (8869)x 3650 M 5 (5462)x 3650 M 5 (8871)1111Table 7. Operating system support for Broadcom NetXtreme II Dual Port 10GBaseT Adapter for System x,49Y7910Operating systemsMicrosoft Windows Server 2008 R2Y Y Y Y Microsoft Windows Server 2012Y Y Y Y Microsoft Windows Server 2012 R2Y Y Y Y Red Hat Enterprise Linux 5 Server with Xen x64 Edition N N Y Y Red Hat Enterprise Linux 5 Server x64 Edition N N Y Y Red Hat Enterprise Linux 6 Server Edition N N Y Y Red Hat Enterprise Linux 6 Server x64 Edition Y Y N Y Red Hat Enterprise Linux 7Y Y Y Y SUSE Linux Enterprise Server 11 for AMD64/EM64TY Y N Y SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T Y Y N Y SUSE Linux Enterprise Server 12N Y Y Y SUSE Linux Enterprise Server 12 with Xen N N Y Y VMware vSphere 5.1 (ESXi)Y Y Y Y VMware vSphere Hypervisor (ESXi) 5.5Y Y Y Y VMware vSphere Hypervisor (ESXi) 6.0Y Y N YPhysical specificationsx 3850/3950 X 6 (3837)x 3850/3950 X 6 (6241, E 7 v 2)x 3100 M 5 (5457)x 3250 M 5 (5458)TrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®ServerProven®System x®The following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。

Publication# 21356Rev: B Amendment/+1Issue Date: March 1998Am29LV800B Known Good Die8 Megabit (1 M x 8-Bit/512 K x 16-Bit)CMOS 3.0 Volt-only, Boot Sector Flash Memory—Die Revision 1DISTINCTIVE CHARACTERISTICSs Single power supply operation—2.7 to 3.6 V for read, program, and erase operations —Ideal for battery-powered applications s Manufactured on 0.35 µm process technology s High performance—90 or 120 ns access times Low power consumption (typical values at 5 MHz)—200 nA Automatic Sleep mode current —200 nA standby mode current —7 mA read current—15 mA program/erase current s Flexible sector architecture—One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and fifteen 64 Kbyte sectors (byte mode)—One 8 Kword, two 4 Kword, one 16 Kword, and fifteen 32 Kword sectors (word mode)—Supports full chip erase —Sector Protection features:A hardware method of locking a sector toprevent any program or erase operations within that sectorSectors can be locked in-system or via programming equipmentTemporary Sector Unprotect feature allows code changes in previously locked sectors s Unlock Bypass Program Command—Reduces overall programming time whenissuing multiple program command sequencess Top or bottom boot block configurations available s Embedded Algorithms—Embedded Erase algorithm automaticallypreprograms and erases the entire chip or any combination of designated sectors —Embedded Program algorithm automatically writes and verifies data at specified addresses s Minimum 1,000,000 write cycle guarantee per sector s Compatibility with JEDEC standards —Pinout and software compatible with single-power supply Flash —Superior inadvertent write protection s Data# Polling and toggle bits—Provides a software method of detecting program or erase operation completion s Ready/Busy# pin (RY/BY#)—Provides a hardware method of detecting program or erase cycle completion s Erase Suspend/Erase Resume—Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation s Hardware reset pin (RESET#)—Hardware method to reset the device to reading array data查询Am29LV800BB-120DG5C1供应商GENERAL DESCRIPTIONThe Am29LV800B in Known Good Die (KGD) form is an 8 Mbit, 3.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for func-tionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form.Am29LV800B FeaturesThe Am29LV800B is an 8 Mbit, 3.0 volt-only Flash memory organized as 1,048,576 bytes or 524,288 words. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. No V PP is required for program or erase operations. The device can also be programmed in standard EPROM programmers.The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Com-mands are written to the command register using stan-dard microprocessor write timings. Register contents serve as input to an internal state-machine that con-trols the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that auto-matically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facili-tates faster programming times by requiring only two write cycles to program data instead of four.Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm—an internal algorithm that automati-cally preprograms the array (if it is not already pro-grammed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory.Hardware data protection measures include a low V CC detector that automatically inhibits write opera-tions during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This can be achieved in-system or via pro-gramming equipment.The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved. The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes.AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effective-ness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tun-neling. The data is programmed using hot electron injection.ELECTRICAL SPECIFICATIONSRefer to the Am29LV800B data sheet, publication number 21490, for full electrical specifications on the Am29LV800B in KGD form.2Am29LV800B Known Good DieAm29LV800B Known Good Die 3PRODUCT SELECTOR GUIDEDIE PHOTOGRAPHFamily Part NumberAm29LV800B KGDSpeed Option (VCC= 2.7 – 3.6 V)-90-120Max Access Time, t ACC(ns)90120Max CE# Access, tCE (ns)90120Max OE# Access, t OE (ns)35504Am29LV800B Known Good Die2144434241403938373534131415161718192021222327282930AMD logo location313233101112987654336242526Am29LV800B Known Good Die 5Note:The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.Pad Signal Pad Center (mils)Pad Center (millimeters)X Y X Y 1V CC 0.000.000.00000.00002DQ4–12.740.00–0.32350.00003DQ12–18.960.00–0.48170.00004DQ5–25.110.00–0.63770.00005DQ13–31.330.00–0.79590.00006DQ6–37.480.00–0.95190.00007DQ14–43.710.00–1.11010.00008DQ7–49.850.00–1.26610.00009DQ15/A–1–56.080.00–1.42430.000010V SS –66.01–1.69–1.6767–0.043011BYTE#–66.01–12.30–1.6767–0.312312A16–66.01–22.92–1.6767–0.582213A15–65.65–266.81–1.6674–6.777014A14–59.50–266.81–1.5114–6.777015A13–53.80–266.81–1.3664–6.777016A12–47.65–266.81–1.2104–6.777017A11–41.95–266.81–1.0654–6.777018A10–35.80–266.81–0.9094–6.777019A9–30.09–266.55–0.7644–6.770420A8–23.85–266.81–0.6059–6.777021WE#–18.15–266.81–0.4609–6.777022RESET#–8.06–270.78–0.2047–6.877823RY/BY#10.07–270.780.2558–6.877824A1820.14–266.810.5116–6.777025A1725.85–266.810.6566–6.777026A731.99–266.810.8126–6.777027A637.70–266.810.9576–6.777028A543.84–266.81 1.1136–6.777029A449.55–266.81 1.2586–6.777030A355.69–266.81 1.4146–6.777031A261.40–266.81 1.5596–6.777032A167.54–266.81 1.7156–6.777033A067.91–23.08 1.7249–0.586234CE#67.91–12.45 1.7249–0.316335V SS 67.91–1.91 1.7249–0.048436OE#58.00 2.27 1.47320.057637DQ050.020.00 1.27050.000038DQ843.790.00 1.11230.000039DQ137.650.000.95630.000040DQ931.420.000.79810.000041DQ225.280.000.64210.000042DQ1019.050.000.48390.000043DQ312.910.000.32790.000044DQ116.680.000.16970.00006Am29LV800B Known Good DieORDERING INFORMATION Standard ProductsAMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following:Valid CombinationsValid Combinations list configurations planned to be sup-ported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.Am29LV800BDEVICE NUMBER/DESCRIPTION Am29LV800B Known Good Die8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory—Die Revision 13.0 Volt-only Program and Erase-90DPC1DIE REVISIONThis number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature.TEMPERATURE RANGEC =Commercial (0°C to +70°C)I =Industrial (–40°C to +85°C)DIE THICKNESS 5=500 µmPACKAGE TYPE AND MINIMUM ORDER QUANTITY*DP =Waffle PackDie per 5 tray stack DG =Gel-Pak ® Die Tray Die per 6 tray stack DT =Surftape™ (Tape and Reel)Die per 7-inch reelDW = Gel-Pak ® Wafer Tray (sawn wafer on frame)Call AMD sales office for minimum order quantity * Contact an AMD representative for quantities.SPEED OPTIONSee Product Selector Guide and Valid Combinations BOOT CODE SECTOR ARCHITECTURE T =Top sector B =Bottom sectorT5Valid CombinationsAm29LV800BT-90Am29LV800BB-90DPC 1, DPI 1, DGC 1, DGI 1,DTC 1, DTI 1,DWC 1, DWI 1Am29LV800BT-120Am29LV800BB-120Am29LV800B Known Good Die 7PRODUCT TEST FLOWFigure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29LV800B product qualification database supple-ment for KGD. AMD implements quality assurance pro-cedures throughout the product test flow. In addition,an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in.Figure 1.AMD KGD Product Test FlowWafer Sort 1Bake24 hours at 250°CWafer Sort 2Wafer Sort 3High TemperaturePackaging for ShipmentShipmentDC Parameters Functionality Programmability ErasabilityData RetentionDC Parameters Functionality Programmability ErasabilityDC Parameters Functionality Programmability Erasability SpeedIncoming Inspection Wafer Saw Die Separation100% Visual Inspection Die PackPHYSICAL SPECIFICATIONSDie dimensions . . . . . . . . . . . . . . 147 mils x 293 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 3.74 mm x 7.45 mm Die Thickness . . . . . . . . . . . . . . . . . . . . . . . .~20 mils Bond Pad Size. . . . . . . . . . . . . . 3.94 mils x 3.94 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 µm x 100 µm Pad Area Free of Passivation . . . . . . . . . .15.52 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 µm2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Bond Pad Metalization. . . . . . . . . . . . . . . . . . Al/Cu/Si Die Backside . . . . . . . . . . . . . . . . . . . . . . . .No metal,may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/NitrideDC OPERATING CONDITIONSV CC (Supply Voltage). . . . . . . . . . . . . . .2.7 V to 3.6 V Operating TemperatureCommercial. . . . . . . . . . . . . . . . . . . 0°C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C MANUFACTURING INFORMATION Manufacturing. . . . . . . . . . . . . . . . . . . . . . . . . . .FASL Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC Manufacturing ID (Top Boot). . . . . . . . . . . . .98925AK(Bottom Boot). . . . . . . . .98925ABK Preparation for Shipment . . . . . . . .Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . . . .CS39 Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1SPECIAL HANDLING INSTRUCTIONS ProcessingDo not expose KGD products to ultraviolet light or process them at temperatures greater than 250°C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. StorageStore at a maximum temperature of 30°C in a nitrogen-purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures.8Am29LV800B Known Good DieTERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIEAll transactions relating to AMD Products under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD’s standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling.AMD warrants articles of its manufacture against defective materials or workmanship for a period of ninety (90) days from date of shipment. This warranty does not extend beyond AMD’s customer, and does not extend to die which has been affixed onto a board or substrate of any kind. The liability of AMD under this warranty is limited, at AMD’s option, solely to repair or to replacement with equivalent articles, or to make an appropriate credit adjustment not to exceed the original sales price, for articles returned to AMD, provided that: (a) The Buyer promptly notifies AMD in writing of each and every defect or nonconformity in any article for which Buyer wishes to make a warranty claim against AMD; (b) Buyer obtains authorization from AMD to return the article; (c) the article is returned to AMD, transportation charges paid by AMD, F.O.B. AMD’s fac-tory; and (d) AMD’s examination of such article dis-closes to its satisfaction that such alleged defect or nonconformity actually exists and was not caused by negligence, misuse, improper installation, accident or unauthorized repair or alteration by an entity other than AMD. The aforementioned provisions do not extend the original warranty period of any article which has either been repaired or replaced by AMD. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD’S PART, AND IT NEITHER ASSUMES NOR AUTHO-RIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYERS SOLE AND EXCLU-SIVE REMEDY FOR THE FURNISHING OF DEFEC-TIVE OR NON CONFORMING ARTICLES AND AMD SHALL NOT IN ANY EVENT BE LIABLE FOR DAMAGES BY REASON OF FAILURE OF ANY PRODUCT TO FUNCTION PROPERLY OR FOR ANY SPECIAL, INDIRECT, CONSEQUENTIAL, INCI-DENTAL OR EXEMPLARY DAMAGES, INCLUDING BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS OF USE OR COST OF LABOR BY REASON OF THE FACT THAT SUCH ARTICLES SHALL HAVE BEEN DEFECTIVE OR NON CONFORMING.Buyer agrees that it will make no warranty representa-tions to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD’s warranty. Buyer assumes all responsibility for successful die prep, die attach and wire bonding pro-cesses. Due to the unprotected nature of the AMD Products which are the subject hereof, AMD assumes no responsibility for environmental effects on die. AMD products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reason-ably be expected to result in a personal injury. Buyer’s use of AMD products for use in life support applications is at Buyer’s own risk and Buyer agrees to fully indem-nify AMD for any damages resulting in such use or sale.REVISION SUMMARY FOR AM29LV800B KNOWN GOOD DIERevision BFormatted to match current template. Updated Distinc-tive Characteristics and General Description sections using the current main data sheet. Updated for CS39 process technology.Revision B+1Distinctive CharacteristicsChanged read and program/erase current to match data sheet.Pad DescriptionCorrected signal names for pads 13–44. Replaced values for all pad coordinates.TrademarksCopyright © 1998 Advanced Micro Devices, Inc. All rights reserved.AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.Am29LV800B Known Good Die9。

COMMISSIONELECTROTECHNIQUEINTERNATIONALECISPR 16-2INTERNATIONALELECTROTECHNICALCOMMISSION 1996AMENDEMENT 1AMENDMENT 11999-06Amendement 1Spécification pour les appareils et méthodesde mesure des perturbations radioélectriqueset de l'immunité –Partie 2:Méthodes de mesure des perturbationset de l'immunitéAmendment 1Specification for radio disturbance andimmunity measuring apparatus and methods –Part 2:Methods of measurement of disturbancesand immunityCommission Electrotechnique InternationaleInternational Electrotechnical Commission Pour prix, voir catalogue en vigueurFor price, see current catalogue© IEC 1999 Droits de reproduction réservés Copyright - all rights reservedInternational Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland Telefax: +41 22 919 0300e-mail: inmail@iec.ch IEC web site http://www.iec.chCODE PRIX PRICE CODE KCOMITÉ INTERNATIONAL SPÉCIAL DES PERTURBATIONS RADIOÉLECTRIQUESINTERNATIONAL SPECIAL COMMITTEE ON RADIO INTERFERENCEFOREWORDThis amendment has been prepared by CISPR subcommittee A: Radio-interference measurements and statistical methods.The text of this amendment is based on the following documents:FDIS Report on votingCISPR/A/241/FDIS CISPR/A/249/RVDFull information on the voting for the approval of this standard can be found in the report on voting indicated in the above table.–––––––––––Page 3CONTENTSAdd the title of annex D as follows:D Decision tree for use of detectors for conducted measurementsPage 212.4 Measurement of disturbances conducted along leads, 9 kHz to 30 MHz2.4.2 Measuring equipment (receivers, etc.)Add the following new subclause 2.4.2.1:2.4.2.1 Use of detectors for conducted disturbance measurementsCISPR 16-1 specifies the characteristics of detectors that are required to perform measurements per product specifications. Several of these product specifications require the use of both quasi-peak and average detectors for conducted disturbance measurements. The time constants of these two detectors are very long and make automated measurements time consuming.A peak detector with shorter time constants may be used to make initial measurements and to determine compliance with a limit. But if the measured disturbance levels are above a limit they shall be followed by measurements with the quasi-peak and average detectors.Annex D provides guidance on how these measurements may be performed efficiently.Page 372.4.4.4 Measurements using voltage probesAdd the following new subclause 2.4.4.4.3:2.4.4.4.3 Artificial mains network as voltage probeWhere the current rating of an EUT exceeds the rating of available AMNs, the AMN can be used as a voltage probe. The EUT port of the AMN is connected to each of the supply lines of the EUT (single or three phase).Prior to connecting an AMN to the mains supply, it must be safely connected to the local physical earth PE.WARNING: Before disconnecting the PE, the AMN should be disconnected from the mains supply. The mains port of the AMN is left open. When the AMN is connected as a voltage probe, the pins on the AMN power input connector/plug will be energized by the supply voltage. The pins on the plug must be made safe with an insulated protective cover or other means.In the frequency range of 150 kHz to 30 MHz, the supply lines of the EUT shall be connected to the mains via an inductance of 30 µH to 50 µH (see figure A.8, configuration 2). The inductance may be realized by a choke, a line of 50 m length or a transformer. In the frequency range of 9 kHz to 150 kHz a greater inductance will normally be required for decoupling from the mains. This guarantees also a reduction of noise from the mains network (see A.5).Since measurements are preferable with AMNs in their standard configuration, the AMN as a voltage probe should only be used for in situ tests and where practical current limitations are exceeded. It shall not be used for testing according to a product standard unless it is referred to in the product standard as an alternative measuring method.Page 51Change the title of 2.6.2 from "Field-strength measurements" to:2.6.2 Field-strength measurements in the frequency range 9 kHz to 1 GHzPage 59Add the following new subclause 2.6.3 and renumber the existing subclauses 2.6.3 to 2.6.5 as 2.6.4 to 2.6.6:2.6.3 Field-strength measurements in the frequency range 1 GHz to 18 GHz2.6.3.1 Quantity to measureThe electric field strength emitted by the EUT at the measuring distance is the quantity to measure. The result shall be expressed in terms of field strength.NOTE – In some standards, emission limits for equipment are expressed in terms of ERP (effective radiated power) in dB(pW) above 1 GHz. Under free space far field conditions, the formula to convert ERP into field strength at a 3 m distance is:E(3m)/dB(µV/m) = ERP/dB(pW) + 7,4For distances d other than 3 m:E d/dB(µV/m) = ERP/dB(pW) + 7,4 +20 log [3/(d/m)]2.6.3.2 Measurement distanceThe field strength emitted by the EUT is measured at a preferred distance of 3 m.Other distances may be used in practical situations:–shorter distances in the case of high ambient noise, or to reduce the effect of unwanted reflections, but care should be taken to ensure the measurement distance is greater than or equal to D2/2 λ(see 15.6 of CISPR 16-1);–greater distances for large EUTs to allow the antenna beam to encompass the EUT.In case of dispute, measurements performed at 3 m shall take precedence.NOTE – Since dominant disturbances of the EUT may be assumed to be incoherent and radiated from a point source, the minimum distance mentioned above (D²/2 λ) is to be applied to the measuring antenna and not to the EUT.2.6.3.3 Set-up of the equipment under test (EUT)As a general guideline, the EUT set-ups used for measurements below 1 GHz should as much as possible also be used above 1 GHz.2.6.3.4 Measurement procedure2.6.3.4.1 Encompassing of the EUT by the measuring antennaRadiated emissions measurements above 1 GHz are made using calibrated linearly polarized antennas, which may have a smaller beam width (major pattern lobe) than the antennas used for frequencies below 1 GHz. The width of the main lobe of the antenna, that is defined as the 3 dB beam width of the antenna (see 15.6 of CISPR 16-1), shall be known for every antenna used so that, when large EUTs are tested, the area of coverage of the EUT can be determined. Moving the measurement antenna over the surfaces of the sides of the EUT or another method of scanning of the EUT is required when the EUT is larger than the beam width of the measuring antenna. When radiated measurements are made at the limit distance and the measurement antenna does not completely encompass a large EUT at that distance, additional measurements at a greater distance may be necessary to demonstrate that emissions were maximum at the limit distance.NOTE – When determining the encompassing of the EUT by the antenna beam width, the surface of the EUT being considered shall include one wavelength (at the lowest frequency, i.e. 1 GHz) of the cables coming out of the EUT.2.6.3.4.2 General measurement procedureFor any EUT, the frequencies of emission should first be detected by a preliminary emission maximization (see 2.6.3.4.3). Then the final emission test takes place (see 2.6.3.4.4). Both of these measurements are to be made preferably at the limit distance. If, for any justified reason, the final measurement is performed at a different distance than the limit distance, a measurement at the limit distance should be made first, to help in interpreting the resulting data in case of dispute.In performing these measurements, the sensitivity of the measurement equipment relative to the limit shall be determined before the test. If the overall measurement sensitivity is inadequate, low noise amplifiers, closer measurement distances or higher gain antennas may be used. If closer measurement distances or higher gain antennas are used, the beam width versus size of the EUT shall be taken into account. Also, measurement system overload levels shall be determined to be adequate when preamplifiers are used.Burn out and saturation protection for the measuring instrumentation is required when low level emissions are to be measured in the presence of a high level signal. A combination of bandpass, bandstop, lowpass and highpass filters may be used. However, the insertion loss of these or any other devices at the frequencies of measurement shall be known and included in any calculations in the report of measurements.NOTE – A simple method of determining whether non-linear effects (overload, saturation, etc.) occur consists of inserting a 10 dB attenuator at the input of the measurement instrument (ahead of any pre-amplifier if one is used) and verifying that the amplitude of all the harmonics of the high amplitude signal (that may cause non-linear effects) is reduced by 10 dB.2.6.3.4.3 Preliminary emission maximizationThe maximum radiated emission for a given mode of operation may be found during a preliminary test, using the following step by step procedure:a)Monitor the frequency range of interest at a fixed antenna height and polarization(horizontal or vertical), and EUT azimuth.b)Note the amplitude and frequency of the maximum signal met.c)Rotate the EUT 360° to maximize the suspected highest amplitude signal. If the signal oranother at a different frequency is observed to exceed the previously noted highest amplitude signal by 2 dB or more, go back to the azimuth and repeat step b). Otherwise, orient the EUT azimuth to repeat the highest amplitude observation and proceed.NOTE 1 – Alternatively, instead of rotating the turn-table where the EUT stands, it is also possible to rotate the receiving antenna around the EUT.d)Move the antenna over a given range of travel (height search to be defined for each productor product family; in any case, 1 m to 4 m should be the maximum range for this height search) to maximize the suspected highest amplitude signal. If the signal or another at a different frequency is observed to exceed the previously noted highest amplitude signal by2 dB or more, return to step b) with the antenna fixed at this height. Otherwise, move theantenna to the height that repeats the highest amplitude observation and proceed.e)Change the antenna to the other polarization and repeat steps b) through d). Compare theresulting suspected highest amplitude signal with that found for the other polarization.Select and note the higher of the two signals. This signal is termed the highest observed signal with respect to the limit for this EUT operational mode.f)The effects of the various operational modes of the EUT shall be examined. One way to dothis is to vary the operating mode of the equipment as steps b) through e) are being performed.g)After completing steps a) through f), record the final EUT configuration and mode ofoperation (corresponding to the maximum radiated emission) to use for the final radiated emissions test.NOTE 2 – The procedure described in this subclause is proposed in the general case. However, noting that it may be extremely time-consuming to perform, product committees are requested to check and adapt it to their specific case. The following two elements can serve as a basis for simplifying the method:–the EUT shall be rotated horizontally unless it has been determined that for the particular product or product family the emission comes predominantly from one direction or is omni-directional;–the height search of the antenna may be limited to a certain angle or distance above and below the EUT, or even be suppressed (horizontal measurements only) if it can be determined that for the particular product or product family the emission is maximum in or close to the horizontal plane.2.6.3.4.4 Final emission testThe field strength emitted by the EUT at the given measurement distance is measured using the configuration (antenna height, EUT azimuth, etc.) producing the maximum emission, as identified during the preliminary emission maximization (the receiving antenna being aligned with this maximum emission).This final measurement shall be the result of a maximum hold on the spectrum analyzer during a given time proportional to the frequency span used. This given time should be defined for each product or product family, taking into account the duration of the operating modes and the time constants associated with each specific product to be tested.2.6.4 Substitution method of measurement in the frequency range of 30 MHz to 18 GHz Add the following text after the second paragraph of subclause 2.6.4:For future product standards, product committees are invited to use the field-strength measurement method described in 2.6.3.Page 137Add the following new clause A.5:A.5 Connection of the AMN as a voltage probeConducted emission measurements of EUTs with high operational currents may cause difficulties. AMNs for the frequency range 9 kHz to 150 kHz (30 MHz) are available to approximately 25 A nominal current. AMNs for the frequency range 150 kHz to 30 MHz (50 µH parallel to 50 Ω) are available to approximately 200 A.EUTs with higher current rating may be tested using the AMN as a voltage probe. This alternative solution is also helpful for in situ measurement, if referred to in the applicable product standard.Page 143Add the following new figure A.8:Configuration 2: application as a voltage probeConfiguration 1: appropriate application as a V-network≥30 ... 50 µHMainsMainsEMI-receiverEMI-receiverNoteGroundGround50 Ω V AMNas probe 50 Ω V AMN EUT EUT IEC 700/99IEC 701/99NOTE – Exposed pins must be made safe.Figure A.8 – AMN configurations (see A.5)Page 151Add, after annex C, the new annex D as follows:Annex D(informative)Decision tree for use of detectors for conducted measurements(see 2.4.2.1)The following decision tree and notes provide guidance on the pass/fail criteria and the use of detectors for conducted disturbance measurements when the product specification requires measurements with both the quasi-peak and average detectors. For efficiency in performing these measurements, path 1 in figure D.1 showing the use of the peak detector is recommended.NOFailPeak < average limit ?Quasi-peak < average limit ?Quasi-peak < quasi-peak limit ?Average < average limit ?Peak detectorQuasi-peak detectorAverage detectorPass 345678YES YESYES YES NOPeak < quasi-peak limit ?YESNO NO NOPath 1Path 221IEC 702/99Figure D.1 – Decision tree for optimizing speed of conducted disturbance measurements withpeak, quasi-peak and average detectorsNOTE – For the EUT to pass, the measured conducted emission must comply with both the quasi-peak and average limits. The tests may be performed using either path 1 or path 2; however, to optimize the speed of conducted disturbance measurements path 1 is recommended. Path 2, starting with a quasi-peak measurement, is slower in situations where compliance with the quasi-peak limit could already be determined from a peak measurement.1)Start measurement with peak detector for rapid measurement.2)Compare peak emission level to average limit.If emissions are above limit: go to step 3.If emissions are below limit: EUT passes.3)Compare peak emission level with quasi-peak limit.If emissions are above limit: go to step 4.If emissions are below limit: go to step 7.4)Measurement with quasi-peak detector.5)Compare quasi-peak emission level to the average limit.If emissions are above limit: go to step 6.If emissions are below limit: EUT passes.6)Compare quasi-peak emission level to the quasi-peak limit.If emissions are above limit: EUT fails.If emissions are below limit: go to step 7.7)Measurement with average detector.8)Compare average emission level to the average limit.If emissions are above limit: EUT fails.If emissions are below limit: EUT passes.When frequency scanning is used during the peak measurement, the scan rate of the spectrum analyzer or scanning receiver should be adjusted not to exceed the fastest scan rate listed in annex B.–––––––––––––––ISBN 2-8318-4809-1&1+', ;7;3<ICS 33.100.01Typeset and printed by the IEC Central OfficeGENEVA, SWITZERLAND。

®Brocade 16Gb FC Single-port and Dual-port HBAs for System xIBM Redbooks Product GuideThe Brocade 16 Gb Fibre Channel (FC) host bus adapters (HBAs) for IBM® System x® are part of a family of high-performance FC HBA solutions. These HBAs deliver exceptional performance, enabling small and medium businesses to experience unsurpassed robustness and reliability for a wide spectrum of servers, storage, and SANs.Figure 1 shows the single-port adapter (SFP+ is not present).Figure 1. Brocade 16Gb FC Single-port for IBM System x (with 3U bracket attached, SFP+ is not present)Did You Know?Brocade 16Gb FC HBAs enhance availability via a unified driver with integrated firmware and simplified broadcast of driver updates across the fabric, including a proactive driver/firmware check of version levels to ensure synchronization. Fabric boot LUN discovery allows a server to boot-from-SAN, simplifying startup and reducing image management complexity. Fabric Assigned World Wide Name (FA-WWN) auto-assigns the switch port WWN upon install, simplifying server deployment and ongoing management.Diagnostic Ports (D_Ports) are a new port type supported by the Brocade 16Gb HBAs that enables administrators to quickly identify and isolate 16 Gbps optics, port and cable problems, reducing fabric deployment and diagnostic times. If the optical media is found to be the source of the problem, it can be transparently replaced, as 16 Gbps optics are hot-pluggable.Part number informationTable 1. Ordering part numbers and feature codesDescription Part number Feature code Brocade 16Gb FC Single-port HBA for IBM System x81Y1668A2XUBrocade 16Gb FC Dual-port HBA for IBM System x81Y1675A2XVThe part numbers for the Brocade 16Gb FC Single-port and Dual-port HBAs include the following items: FC HBA adapter with one or two short-wave (SWL) 16 Gb (16/8/4 Gb support) SFP+ installed and 3U zbracket attachedQuick install guidezDocumentation CDzLow profile (2U) bracketzWarranty FlyerzImportant Notices FlyerzFigure 2 shows the dual-port adapter (SFP+ is not present).Figure 2. Brocade 16Gb FC Dual-port for IBM System x (with 3U bracket attached, SFP+ is not present) FeaturesThe Brocade 16Gb FC Single-port and Dual-port HBAs have the following features:16 Gbps Fibre Channelz16 Gb FC enables I/O consolidation of multiple 2/4/8 Gbps Fibre Channel HBAs into a single adapterto dramatically reduce CapEx/OpEx costs. It can also provide 50% server rack space savings by reducing from a 2U to 1U rack-mount server with fewer PCIe adapter slots.Over 500,000 IOPS per portzThe industry’s most powerful FC adapter that achieves the highest transaction performance tomaximize density of VMs per server, performance of 315,000 IOPS for E-mail Exchange, and 205,000 IOPS for SQL Database.16 Gbps and 8 Gbps optical media supportzInvestment protection for existing previous-generation 8 Gbps optics.Fabric Assigned World Wide Name (FA-WWN)zFA-WWN virtualizes host WWNs to simplify server deployment by enabling pre-provisioning prior to initial install and to eliminate time-consuming fabric reconfigurations when replacing adapters and servers.Boot-From-SANzAutomate SAN Boot LUN discovery to simplify boot from SAN and reduce image managementcomplexity and support for Direct Attached Storage (DAS point-to-point topology).Brocade Server Application Optimization (SAO)zQuality of Service (QoS) levels assignable to VM applications and support for N_Port Trunking of 2×16 Gbps links into a single logical 32 Gbps link to improve application performance and availability.Direct I/OzThis enables native (direct) I/O performance by allowing VMs to bypass the hypervisor andcommunicate directly with the adapter.Brocade Network AdvisorzThis simplifies and unifies the management of Brocade adapter, SAN, and LAN resources through a single pane-of-glass.Brocade Diagnostics (D-Port)zThis improves detection and isolation of 16 Gbps optics problems between adapters and switches.LUN MaskingzInitiator-based LUN masking for storage traffic isolation.Target Rate Limiting (TRL)zThis throttles data traffic when accessing slower speed storage targets to avoid back pressureproblems.Technical specificationsThe Brocade 16Gb FC Single-port and Dual-port HBAs have the following specifications: Host interface: PCI Express Gen 2 x8zData rate: 14.025 Gbps (1600 MBps); 8.5 Gbps (800 MBps); 4.25 Gbps (400 MBps); 2.125 Gbps (200 zMBps) autosensing (per port); full duplexPerformance: over 500,000 IOPS per port (1,000,000 IOPS per dual-port adapter)zBoot support: Boot from SAN, Fabric-based Boot LUN DiscoveryzProtocols: SCSI-FCP, FCP-2, FCP-3, FC-SPzTopology: Point-to-point (N_Port), switched fabric (N_Port)zN_Port Trunking of 2×16 Gbps links into a single logical 32 Gbps linkzSupported media: Brocade 16 Gbps and 8 Gbps Fibre Channel LC-style pluggable (SFP+), SWL (850 znm), hot-pluggableDistance support:z15 m at 16 Gbps on 62.5/125 μm (OM1) Multi-Mode Fiber (MMF)z35 m at 16 Gbps on 50/125 μm OM2 MMFz100 m at 16 Gbps on 50/125 μm OM3 MMFz125 m at 16 Gbps on 50/125 μm OM4 MMFzManagement software:zBrocade Host Connectivity Manager (HCM)zBrocade Configuration Utility (BCU) Command Line Interface (CLI)zBrocade Network AdvisorzSupported serversThe Brocade 16Gb FC Single-port and Dual-port HBAs are supported on the IBM System x servers that are listed in the following table.Table 2. Supported System x serversSee the IBM ServerProven® website for the latest information about the System x servers that support each adapter: /servers/eserver/serverproven/compat/us/Supported operating systemsThe Brocade 16Gb FC Single-port and Dual-port HBAs for IBM System x support the following operating systems:Microsoft Windows Server 2008 R2zMicrosoft Windows Server 2008, Datacenter x64 EditionzMicrosoft Windows Server 2008, Datacenter x86 EditionzMicrosoft Windows Server 2008, Enterprise x64 EditionzMicrosoft Windows Server 2008, Enterprise x86 EditionzMicrosoft Windows Server 2008, Standard x64 EditionzMicrosoft Windows Server 2008, Standard x86 EditionzMicrosoft Windows Server 2008, Web x64 EditionzMicrosoft Windows Server 2008, Web x86 EditionzMicrosoft Windows Server 2008 HPC EditionzWindows Small Business Server 2008 Premium EditionzWindows Small Business Server 2008 Standard EditionzRed Hat Enterprise Linux 5 Server EditionzRed Hat Enterprise Linux 5 Server with Xen x64 EditionzRed Hat Enterprise Linux 5 Server x64 EditionzRed Hat Enterprise Linux 6 Server EditionzRed Hat Enterprise Linux 6 Server x64 EditionzSUSE LINUX Enterprise Server 10 for AMD64/EM64TzSUSE LINUX Enterprise Server 10 for x86zSUSE LINUX Enterprise Server 10 with Xen for AMD64/EM64TzSUSE LINUX Enterprise Server 11 for AMD64/EM64TzSUSE LINUX Enterprise Server 11 for x86zSUSE LINUX Enterprise Server 11 with Xen for AMD64/EM64TzVMware ESX 4.1zVMware ESXi 4.1zVMware vSphere 5zSee the IBM ServerProven website for the latest information about the specific versions and service packs supported: /servers/eserver/serverproven/compat/us/. Click System x servers, and then click Shared storage adapters to see the support matrix. Click the check mark associated with the System x server in question to see the operating system support details.Physical specificationsThe Brocade 16Gb FC Single-port and Dual-port HBAs have the following physical specifications. Dimensions and weight (approximate):Height: 69 mm (2.7 in)zWidth: 168 mm (6.6 in)zDepth: 18 mm (0.7 in)zWeight: 127 g (0.28 lb)zShipping dimensions and weight (approximate):Height: 48 mm (1.9 in)zWidth: 217 mm (8.5 in)zDepth: 140 mm (5.5 in)zWeight: 450 g (1.0 lb)zOperating environmentThe adapters are supported in the following environment:Temperature:zOperating: 0 - 55 °C (32 - 131 °F)zStorage: -43 - 73 °C (-40 - 163 °F)zRelative humidity:zOperating: 5 - 93% (relative, non-condensing)zNon-operating: 5 - 95% (relative, non-condensing)zWarrantyOne-year limited warranty. When installed in a System x server, these cards assume the system’s base warranty and any IBM ServicePac® upgrade.Agency approvalsThe adapter conforms to the following standards:United States Bi-Nat UL/CSA 60950-1 2nd Ed; ANSI C63.4; cCSAus; FCC Class BzCanada Bi-Nat UL/CSA 60950-1 2nd Ed; ICES-003 Class B; cCSAuszJapan CISPR22 Class B and JEIDA (Harmonics); VCCI-BzEuropean Union EN60950-1; EN55022 Class B and EN55024; TUVBauart, CE MarkzAustralia, New Zealand EN55022 and CISPR22 Class B or AS/NZS CISPR22; C-TickzRussia IEC60950-1; 51318.22-99 and .24-99; GOST MarkzKorea KN22 and KN24; KC Mark Class BzTaiwan CNS 13438(95) Class A; BSMI MarkzPopular configurationsThis section illustrates how the Brocade 16Gb FC Single-port and Dual-port HBAs can be used in configurations. For a list of IBM-supported configurations that include Brocade 16Gb HBAs, fabric switches, and storage targets, see IBM System Storage® Interoperation Center located at:/systems/support/storage/ssicFigure 3 shows the Brocade 16Gb FC Sigle-port HBAs installed in a supported server. The servers are connected to the IBM System Storage DS3500 via IBM System Storage SAN48B-5 switches.Figure 3. x3650 M3 server connected to an external IBM System Storage DS3500 via SAN switchesThe parts used are listed in Table 3.Table 3. Components used when connecting Brocade 16Gb FC Single-port HBAs to the external disk storage (as shown in Figure 3)Diagram referencePartnumber/machine type DescriptionQuantityVaries x3650 M3 or other supported server 181Y1668Brocade 16Gb FC Single-port HBA 2 per server 2498F48IBM System Storage SAN48B-521746A4DIBM System Storage DS3524 Express Dual Controller Storage System1This configuration also requires cabling between the servers and the SAN switches and between the SAN switches and the storage system. (The cable part numbers are not listed in Table 3.)Related publicationsFor more information, refer to these documents:IBM US Announcement Letter for the Brocade 16Gb FC Single-port and Dual-port HBAsz /common/ssi/cgi-bin/ssialias?infotype=dd&subtype=ca&&htmlfid=897/ENUS112-047 Brocade 16Gb FC Single-port and Dual-port HBAs Installation and User Guide z /systems/supportIBM System x Configuration and Options Guidez/support/docview.wss?uid=psg1SCOD-3ZVQ5WNoticesThis information was developed for products and services offered in the U.S.A.IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or service. IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to:IBM Director of Licensing, IBM Corporation, North Castle Drive, Armonk, NY 10504-1785 U.S.A.The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you. This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. This information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental.Any performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurement may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.COPYRIGHT LICENSE:This information contains sample application programs in source language, which illustrate programming techniques on various operating platforms. You may copy, modify, and distribute these sample programs in any form without payment to IBM, for the purposes of developing, using, marketing or distributing application programs conforming to the application programming interface for the operating platform for which the sample programs are written. These examples have not been thoroughly tested under all conditions. IBM, therefore, cannot guarantee or imply reliability, serviceability, or function of these programs.© Copyright International Business Machines Corporation 2012. All rights reserved.Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted byGSA ADP Schedule Contract with IBM Corp.This document was created or updated on March 29, 2012.Send us your comments in one of the following ways:Use the online Contact us review form found at:z/redbooksSend your comments in an e-mail to:z**************.comMail your comments to:zIBM Corporation, International Technical Support OrganizationDept. HYTD Mail Station P0992455 South RoadPoughkeepsie, NY 12601-5400 U.S.A.This document is available online at /redbooks/abstracts/tips0882.html . TrademarksIBM, the IBM logo, and are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. 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目录组件标识 (8)前面板组件 (8)前面板 LED 指示灯和按钮 (10)UID 按钮功能 (13)前面板 LED 指示灯电源故障代码 (13)Systems Insight 显示屏 LED 指示灯 (14)Systems Insight 显示屏组合 LED 指示灯说明 (15)后面板组件 (17)后面板 LED 指示灯 (17)主板组件 (19)系统维护开关说明 (20)DIMM 标签识别 (21)DIMM 插槽位置 (22)NVDIMM 识别 (22)NVDIMM 二维码 (23)识别 NVDIMM LED 指示灯 (24)NVDIMM-N LED 指示灯组合 (24)NVDIMM 功能 LED 指示灯运行模式 (24)处理器、散热片和插槽组件 (25)驱动器 (25)SAS/SATA 驱动器组件和 LED 指示灯 (26)NVMe SSD LED 指示灯定义 (26)uFF 驱动器组件和 LED 指示灯 (28)风扇托架编号 (29)驱动器盒识别 (29)驱动器托架编号 (31)驱动器托架编号：Smart Array 控制器 (31)驱动器托架编号：SAS 扩展卡 (33)驱动器托架编号：NVMe 驱动器 (35)uFF 驱动器托架编号 (36)转接卡组件 (37)带集成备用电池装置组件和 LED 指示灯的 HPE Flex 插槽电源 (41)检查备用电池电量 (41)HPE 12G SAS 扩展卡端口编号 (42)HPE Smart Array P824i-p MR Gen10 控制器 (42)操作 (44)打开服务器电源 (44)关闭服务器电源 (44)从机架中拉出服务器 (44)从机架中卸下服务器 (45)使用理线臂固定电缆 (45)卸下检修面板 (46)安装检修面板 (47)卸下风扇笼 (47)安装风扇笼 (48)卸下隔气罩或中板驱动器笼 (48)安装隔气罩 (50)卸下转接卡笼 (51)3卸下转接卡插槽空闲挡板 (52)卸下硬盘驱动器空闲挡板 (53)松开理线臂 (53)找到 Systems Insight 显示屏 (53)设置 (55)HPE 支持服务 (55)设置服务器 (55)运行要求 (58)空间要求与通风要求 (58)温度要求 (59)电源要求 (59)电气接地要求 (59)将直流电源线连接到直流电源 (59)服务器警告和注意事项 (60)机架警告 (61)静电释放 (61)服务器包装箱内物品 (62)安装硬件选件 (62)POST 屏幕选项 (62)安装或部署操作系统 (62)注册服务器 (62)硬件选件安装 (63)产品规格说明简介 (63)简介 (63)在安全挡板中安装风扇过滤器 (63)安装挡板和挡板锁 (64)电源供电选件 (64)热插拔电源计算 (64)安装冗余热插拔电源 (64)驱动器选件 (65)驱动器准则 (65)支持的驱动器托架 (66)安装热插拔 SAS 或 SATA 驱动器 (66)安装 NVMe 驱动器 (67)安装 uFF 驱动器和 SCM 驱动器托盘 (68)安装 M.2 驱动器 (69)风扇选件 (70)安装高性能风扇 (71)内存选件 (72)DIMM 和 NVDIMM 安装信息 (72)HPE SmartMemory 速度信息 (73)安装 DIMM (73)HPE 16GB NVDIMM 选件 (74)NVDIMM 支持的服务器要求 (74)安装 NVDIMM (74)为 NVDIMM 配置服务器 (76)NVDIMM 清理 (76)NVDIMM 移动准则 (77)HPE 可扩展持久性内存（仅限 CTO） (77)控制器选件 (78)安装存储控制器 (78)在配置的服务器中安装 HPE Smart Array P824i-p MR Gen10 控制器 (79)4阵列和控制器配置 (80)安装通用介质托架 (81)驱动器笼选件 (83)安装前 8NVMe SSD Express 托架驱动器笼 (83)安装前 6SFF SAS/SATA + 2NVMe Premium 驱动器笼 (85)安装通风标签 (87)在盒 1 中安装前 8SFF SAS/SATA 驱动器笼 (88)在盒 2 中安装前 8SFF SAS/SATA 驱动器笼 (90)安装前 2SFF NVMe/SAS/SATA Premium 驱动器笼 (92)安装中板 4LFF SAS/SATA 驱动器笼 (95)在主转接卡或辅助转接卡中安装后 2SFF SAS/SATA 驱动器笼 (98)在电源上方安装后 2SFF SAS/SATA 驱动器笼 (100)安装后 3LFF SAS/SATA 驱动器笼 (103)转接卡和转接卡笼选件 (104)安装主转接卡和辅助转接卡 (105)安装第三转接卡 (106)安装辅助转接卡笼 (107)安装第三转接卡笼 (108)安装 2NVMe slimSAS 转接卡选件 (111)安装 8NVMe slimSAS 转接卡选件 (112)扩展槽 (113)支持的 PCIe 外形尺寸 (113)安装扩展卡 (114)安装 12G SAS 扩展卡 (116)安装加速器或 GPU (118)安装入侵检测开关 (122)安装 Smart Storage 电池 (123)安装后串行端口接口 (125)安装 Systems Insight 显示屏 (127)安装 FlexibleLOM 适配器 (129)安装 1U 或高性能散热片 (131)安装处理器 (133)HPE Trusted Platform Module 2.0 Gen10 选件 (136)概述 (136)HPE Trusted Platform Module 2.0 准则 (136)安装并启用 HPE TPM 2.0 Gen10 套件 (136)安装 Trusted Platform Module 卡 (137)启用 Trusted Platform Module (139)保留恢复密钥/密码 (140)布线 (141)HPE ProLiant Gen10 DL 服务器存储布线准则 (141)布线图 (141)电缆布线：适用于 SFF 的前 2SFF 驱动器选件 (143)电缆布线：适用于 LFF 的前 2SFF 驱动器选件 (144)电缆布线：前 2SFF 驱动器选件（3 位置电缆） (145)电缆布线：前 8SFF 驱动器选件 (146)电缆布线：前 8SFF NVMe/SAS premium 驱动器选件 (148)电缆布线：前 8SFF NVMe 驱动器选件 (148)电缆布线：适用于 SFF 的前 2SFF NVMe 驱动器选件 (150)电缆布线：适用于 LFF 的前 2SFF NVMe 驱动器选件 (151)电缆布线：中间板 4LFF 驱动器选件 (151)电缆布线：后 3LFF 驱动器选件 (152)电缆布线：后 2SFF 驱动器选件 (152)电缆布线：HPE 12G SAS 扩展卡到控制器 (153)5电缆布线：Smart Array P824i-P 控制器 (154)电缆布线：Systems Insight 显示屏 (156)软件和配置实用程序 (158)服务器模式 (158)产品规格说明简介 (158)Active Health System Viewer (158)Active Health System (159)Active Health System 数据收集 (159)Active Health System 日志 (159)HPE iLO 5 (159)iLO 联合 (160)iLO服务端口 (160)iLO RESTful API (161)RESTful Interface Tool (161)iLO Amplifier Pack (161)Integrated Management Log (161)Intelligent Provisioning (161)Intelligent Provisioning 操作 (162)管理安全性 (162)适用于 Windows 和 Linux 的 Scripting Toolkit (163)UEFI System Utilities (163)选择引导模式 (163)安全引导 (164)启动嵌入式 UEFI Shell (164)HPE Smart Storage Administrator (165)HPE MR Storage Administrator (165)StorCLI (166)USB 支持 (166)外置 USB 功能 (166)支持冗余 ROM (166)安全性和安全优势 (166)使系统保持最新状态 (166)更新固件或系统 ROM (166)Service Pack for ProLiant (167)更新 System Utilities 中的固件 (168)从 UEFI 嵌入式 Shell 中更新固件 (168)联机刷新组件 (169)驱动程序 (169)软件和固件 (169)支持的操作系统版本 (169)HPE Pointnext 产品 (169)主动通知 (170)故障排除 (171)NMI 功能 (171)故障排除资源 (171)更换电池 (172)安全、保修和法规信息 (173)安全和管制标准 (173)6保修信息 (173)法规信息 (173)白俄罗斯、哈萨克斯坦、俄罗斯标记 (173)土耳其 RoHS 材料内容声明 (174)乌克兰 RoHS 材料内容声明 (174)规格 (175)环境规格 (175)机械规格 (175)电源规格 (176)HPE 500 瓦 Flex 插槽铂金级热插拔低卤电源 (177)HPE 800 瓦 Flex 插槽白金级热插拔低卤电源 (177)HPE 800 瓦 Flex 插槽超钛金级热插拔低卤电源 (178)HPE 800 瓦 Flex 插槽通用热插拔低卤电源 (179)HPE 800 瓦 Flex 插槽 -48 伏直流热插拔低卤电源 (180)HPE 800 瓦 Flex 插槽可扩展持久型内存电源 (181)HPE 1600 瓦 Flex 插槽白金级热插拔低卤电源 (181)支持信息和其他资源 (183)获取 Hewlett Packard Enterprise 支持 (183)获取更新 (183)客户自行维修 (184)远程支持 (184)保修信息 (184)法规信息 (184)文档反馈 (185)7组件标识前面板组件SFF 前面板组件编号说明1盒 1（可选驱动器或通用介质托架）2盒 2（可选驱动器）3盒 3 驱动器 1-84序列号标签拉片或可选Systems Insight 显示屏5iLO 服务端口6USB 3.0 端口通用介质托架组件编号说明1USB 2.0 端口2视频显示端口3光驱（可选）4驱动器（可选）8组件标识12 驱动器 LFF 前面板组件编号说明1驱动器托架8 驱动器 LFF 机型前面板组件编号说明1驱动器（可选）2LFF 电源开关模块3驱动器托架LFF 电源开关模块组件组件标识9编号说明1光驱2序列号标签拉片3USB 3.0 端口4iLO 服务端口5视频显示端口前面板 LED 指示灯和按钮SFF 前面板 LED 指示灯和按钮编号说明状态1开机/待机按钮和系统电源 LED 指示灯*绿色常亮 = 系统已启动绿色闪烁（1 Hz/周每秒）= 正在执行开机过程琥珀色常亮 = 系统处于待机状态熄灭 = 未通电†2运行状况 LED 指示灯*绿色常亮 = 正常绿色闪烁（1 赫兹/周每秒）= 正在重新引导 iLO 琥珀色闪烁 = 系统性能下降红色闪烁（1 Hz/周每秒）= 系统出现严重问题**续10组件标识3网卡状态 LED 指示灯*绿色常亮 = 链接到网络上绿色闪烁（1 Hz/周每秒）= 具有网络活动熄灭 = 没有网络活动4UID 按钮/LED 指示灯*蓝色常亮 = 已激活闪烁蓝色：• 1 Hz/周每秒 = 正在进行远程管理或固件升级• 4 Hz/周每秒 = 已启动 iLO 手动重新引导序列•8 Hz/周每秒 = 正在进行 iLO 手动重新引导序列熄灭 = 已停用*当此表中所述的 4 个 LED 指示灯同时闪烁时，表示发生电源故障。

NVIDIA Data Center GPU Driver version 450.142.00 (Linux) / 453.10 (Windows)Release NotesTable of Contents Chapter 1. Version Highlights (1)1.1. Software Versions (1)1.2. Fixed Issues (2)1.3. Known Issues (2)Chapter 2. Virtualization (4)Chapter 3. Hardware and Software Support (6)Chapter 1.Version HighlightsThis section provides highlights of the NVIDIA Data Center GPU 450 Driver (version 450.142.00 Linux and 453.10 Windows).For changes related to the 450 release of the NVIDIA display driver, review the file "NVIDIA_Changelog" available in the .run installer packages.‣Linux driver release date: 07/20/2021‣Windows driver release date: 07/20/20211.1. Software VersionsFor this release, the software versions are listed below.‣CUDA Toolkit 11: 11.0.3Note that starting with CUDA 11, individual components of the toolkit are versionedindependently. For a full list of the individual versioned components (e.g. nvcc, CUDA libraries etc.), see the CUDA Toolkit Release Notes‣NVIDIA Data Center GPU Driver: 450.142.00 (Linux) / 453.10 (Windows)‣Fabric Manager: 450.142.00 (Use nv-fabricmanager -v)‣GPU VBIOS:‣92.00.19.00.01 (NVIDIA A100 SKU200 with heatsink for HGX A100 8-way and 4-way)‣92.00.19.00.02 (NVIDIA A100 SKU202 w/o heatsink for HGX A100 4-way)‣NVSwitch VBIOS: 92.10.14.00.01‣NVFlash: 5.641Due to a revision lock between the VBIOS and driver, VBIOS versions >= 92.00.18.00.00 must use corresponding drivers >= 450.36.01. Older VBIOS versions will work with newer drivers. For more information on getting started with the NVIDIA Fabric Manager on NVSwitch-based systems (for example, HGX A100), refer to the Fabric Manager User Guide.1.2. Fixed Issues‣Various security issues were addressed. For additional details on the med-high severity issues, review the NVIDIA Security Bulletin 5211 .‣Fixed an issue with installing the Linux driver where installing the driver interferes with the ipmitool.1.3. Known IssuesGeneral‣By default, Fabric Manager runs as a systemd service. If using DAEMONIZE=0 in the Fabric Manager configuration file, then the following steps may be required.1.Disable FM service from auto starting. (systemctl disable nvidia-fabricmanager)2.Once the system is booted, manually start FM process. (/usr/bin/nv-fabricmanager-c /usr/share/nvidia/nvswitch/fabricmanager.cfg). Note, since the processis not a daemon, the SSH/Shell prompt will not be returned (use another SSH shell for other activities or run FM as a background task).‣There is a known issue with cross-socket GPU to GPU memory consistency that is currently under investigation‣On NVSwitch systems with Windows Server 2019 in shared NVSwitch virtualization mode, the host may hang or crash when a GPU is disabled in the guest VM. This issue is under investigation.GPU Performance CountersThe use of developer tools from NVIDIA that access various performance countersrequires administrator privileges. See this note for more details. For example, reading NVLink utilization metrics from nvidia-smi (nvidia-smi nvlink -g 0) would require administrator privileges.NoScanout ModeNoScanout mode is no longer supported on NVIDIA Data Center GPU products. If NoScanout mode was previously used, then the following line in the “screen” section of /etc/X11/xorg.conf should be removed to ensure that X server starts on data center products:Option "UseDisplayDevice" "None"NVIDIA Data Center GPU products now support one display of up to 4K resolution.Unified Memory SupportSome Unified Memory APIs (for example, CPU page faults) are not supported on Windows in this version of the driver. Review the CUDA Programming Guide on the system requirements for Unified MemoryCUDA and unified memory is not supported when used with Linux power management states S3/S4.IMPU FRU for Volta GPUsThe driver does not support the IPMI FRU multi-record information structure for NVLink. See the Design Guide for Tesla P100 and Tesla V100-SXM2 for more information. Experimental OpenCL FeaturesSelect features in OpenCL 2.0 are available in the driver for evaluation purposes only.The following are the features as well as a description of known issues with these features in the driver:Device side enqueue‣The current implementation is limited to 64-bit platforms only.‣OpenCL 2.0 allows kernels to be enqueued with global_work_size larger than the compute capability of the NVIDIA GPU. The current implementation supports only combinations of global_work_size and local_work_size that are within the compute capability of the NVIDIA GPU. The maximum supported CUDA grid and block size of NVIDIA GPUs is available at /cuda/cuda-c-programming-guide/index.html#computecapabilities.For a given grid dimension, the global_work_size can be determined by CUDA grid size x CUDA block size.‣For executing kernels (whether from the host or the device), OpenCL 2.0 supports non-uniform ND-ranges where global_work_size does not need to be divisible by thelocal_work_size. This capability is not yet supported in the NVIDIA driver, and therefore not supported for device side kernel enqueues.Shared virtual memory‣The current implementation of shared virtual memory is limited to 64-bit platforms only.Chapter 2.VirtualizationTo make use of GPU passthrough with virtual machines running Windows and Linux, the hardware platform must support the following features:‣ A CPU with hardware-assisted instruction set virtualization: Intel VT-x or AMD-V.‣Platform support for I/O DMA remapping.‣On Intel platforms the DMA remapper technology is called Intel VT-d.‣On AMD platforms it is called AMD IOMMU.Support for these features varies by processor family, product, and system, and should be verified at the manufacturer's website.Supported HypervisorsThe following hypervisors are supported:Tesla products now support one display of up to 4K resolution.Supported Graphics CardsThe following GPUs are supported for device passthrough:VirtualizationChapter 3.Hardware and SoftwareSupportSupport for these features varies by processor family, product, and system, and should be verified at the manufacturer's website.Supported Operating Systems for NVIDIA Data Center GPUsThe Release 450 driver is supported on the following operating systems:‣Windows x86_64 operating systems:‣Microsoft Windows® Server 2019‣Microsoft Windows® Server 2016‣Microsoft Windows® 10‣The table below summarizes the supported Linux 64-bit distributions. For a complete list of distributions, kernel versions supported, see the CUDA Linux System Requirements documentation.Note that SUSE Linux Enterprise Server (SLES) 15.3 is provided as a preview for Arm64 server since there are known issues when running some CUDA applications related to dependencies on glibc 2.27.Supported Operating Systems and CPU Configurations for HGX A100The Release 450 driver is validated with HGX A100 on the following operating systems and CPU configurations:‣Linux 64-bit distributions:‣Red Hat Enterprise Linux 8.4 (in 4/8/16-GPU configurations)‣CentOS Linux 7.9 (in 4/8/16-GPU configurations)‣Ubuntu 18.04.5 LTS (in 4/8/16-GPU configurations)‣SUSE SLES 15.3 (in 4/8/16-GPU configurations)‣Windows 64-bit distributions:‣Windows Server 2019 (in 1/2/4/8-GPU configurations; 16-GPU configurationa are currently not supported)Windows is supported only in shared NVSwitch virtualization configurations.‣CPU Configurations:‣AMD Rome in PCIe Gen4 mode‣Intel Skylake/Cascade Lake (4-socket) in PCIe Gen3 modeSupported Virtualization ConfigurationsThe Release 450 driver is validated with HGX A100 on the following configurations:‣Passthrough (full visibility of GPUs and NVSwitches to guest VMs):‣8-GPU configurations with Ubuntu 18.04.5 LTS‣Shared NVSwitch (guest VMs only have visibility of GPUs and full NVLink bandwidth between GPUs in the same guest VM):‣1/2/4/8/16-GPU configurations with Ubuntu 18.04.5 LTS‣1/2/4/8-GPU configurations with Windows Server 2019API SupportThis release supports the following APIs:‣NVIDIA® CUDA® 11.0 for NVIDIA® Kepler TM, Maxwell TM, Pascal TM, Volta TM, Turing TM and NVIDIA Ampere architecture GPUs‣OpenGL® 4.5‣Vulkan® 1.1‣DirectX 11‣DirectX 12 (Windows 10)‣Open Computing Language (OpenCL TM software) 1.2Note that for using graphics APIs on Windows (i.e. OpenGL, Vulkan, DirectX 11 and DirectX 12) or any WDDM 2.0+ based functionality on Tesla GPUs, vGPU is required. See the vGPU documentation for more information.Supported NVIDIA Data Center GPUsThe NVIDIA Data Center GPU driver package is designed for systems that have one or more Tesla products installed. This release of the driver supports CUDA C/C++ applications and libraries that rely on the CUDA C Runtime and/or CUDA Driver API.Hardware and Software SupportNVIDIA Data Center GPU Driver version 450.142.00 (Linux) / 453.10 (Windows)RN-08625-450 _v5.0 | 9NoticeThis document is provided for information purposes only and shall not be regarded as a warranty of a certain functionality, condition, or quality of a product. NVIDIA Corporation (“NVIDIA”) makes no representations or warranties, expressed or implied, as to the accuracy or completeness of the information contained in this document and assumes no responsibility for any errors contained herein. 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Lifecycle Controller Operating System Driver PackVersion 21.03.08 Reference Guide for 15th Generation of PowerEdge ServerNotes, cautions, and warningsA NOTE indicates important information that helps you make better use of your product.A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoidA WARNING indicates a potential for property damage, personal injury, or death.© 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.Chapter 1: Overview (4)Chapter 2: PowerEdge R7515 (5)Chapter 3: PowerEdge R6525 (7)Chapter 4: PowerEdge R6515 (9)Chapter 5: PowerEdge C6525 (11)Contents3Overview The Lifecycle Controller OS Driver Pack Reference Guide provides information about the operating systems (Windows and Linux) that are compatible with the driver pack for a specific 15th generation Dell PowerEdge server. The driver pack contains the drivers needed for OS deployment using Lifecycle Controller. For information on OS deployment, see the Lifecycle Controller User’s Guide available at /esmmanuals.4OverviewPowerEdge R7515 Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Chipset AMD SP3 MILAN Series Chipsetdriver2.10.09.156Windows Server 2019 64-bit Windows Server 2016 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Drivers andSoftware Application10.3.6Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Linux Drivers10.3.6Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.80.3Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet adapters21.80.16.60Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network Intel NIC Family Version 20.0.0Drivers20.0.0Windows Server 2019 64-bit Windows Server 2016 64-bit Network MELLANOX TECHNOLOGIESINC:Mellanox ConnectX-4 Lx,ConnectX-4, ConnectX-5 andConnectX-6 Ethernet adapters02.050.02Windows Server 2019 64-bit Windows Server 2016 64-bit Network Marvell FastLinQ 41000 seriesEthernet adapters and MarvellQLogic Fibre Channel Adapters35.20.14Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare Linux Base Drivers- Binary RPM InstallA00PowerEdge R75155Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare X2522-25G andX2562 Drivers1.9.1Windows Server 2019 64-bitWindows Server 2019 64-bitSAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.02 Windows Server 2016 64-bit SAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.01 Red Hat Enterprise Linux 8.3 64-bitRed Hat Enterprise Linux 7.9 64-bitSUSE Linux Enterprise Server 15.2 64-bitSAS Non-RAID HBA Controllers34.15.04.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitSAS Non-RAID HBA10-11 Controllers 2.61.14.00Windows Server 2019 64-bit Windows Server 2016 64-bit SAS RAID BOSS-S1 AdapterBOSS-S1 AdapterBOSS-S1 ModularBOSS-S1 Modular1.2.0.1051Windows Server 2016 64-bit SAS RAID INVENTEC: PERC Controllers7.714.6.0 Windows Server 2019 64-bit SAS RAID INVENTEC:PERC Controllers7.714.6.0 Windows Server 2016 64-bit SAS RAID INVENTEC:PERC H330/H730/H730P/H830/H730P MX/FD33xD/FD33xS Controllers6.604.06.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitWindows Server 2016 64-bitSAS RAID PERC S150 Controller 6.1.0.0009Red Hat Enterprise Linux 7.9 64-bit System Utilities RHEL 7.9 64 bit UPDATE0Red Hat Enterprise Linux 8.3 64-bit System Utilities RHEL 8.3 64 bit UPDATE0SUSE Linux Enterprise Server 15.2 64-bitSystem Utilities SLES UPDATE0Windows Server 2019 64-bitWindows Server 2016 64-bitVideo Matrox Video Driver 4.4.3.16PowerEdge R7515PowerEdge R6525 Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Chipset AMD SP3 MILAN Series Chipsetdriver2.10.09.156Windows Server 2019 64-bit Windows Server 2016 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Drivers andSoftware Application10.3.6Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Linux Drivers10.3.6Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.80.3Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet adapters21.80.16.60Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network Intel NIC Family Version 20.0.0Drivers20.0.0Windows Server 2019 64-bit Windows Server 2016 64-bit Network MELLANOX TECHNOLOGIESINC:Mellanox ConnectX-4 Lx,ConnectX-4, ConnectX-5 andConnectX-6 Ethernet adapters02.050.02Windows Server 2019 64-bit Windows Server 2016 64-bit Network Marvell FastLinQ 41000 seriesEthernet adapters and MarvellQLogic Fibre Channel Adapters35.20.14Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare Linux Base Drivers- Binary RPM InstallA003PowerEdge R65257Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare X2522-25G andX2562 Drivers1.9.1Windows Server 2019 64-bitWindows Server 2019 64-bitSAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.02 Windows Server 2016 64-bit SAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.01 Red Hat Enterprise Linux 8.3 64-bitRed Hat Enterprise Linux 7.9 64-bitSUSE Linux Enterprise Server 15.2 64-bitSAS Non-RAID HBA Controllers34.15.04.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitSAS Non-RAID HBA10-11 Controllers 2.61.14.00Windows Server 2019 64-bit Windows Server 2016 64-bit SAS RAID BOSS-S1 AdapterBOSS-S1 AdapterBOSS-S1 ModularBOSS-S1 Modular1.2.0.1051Windows Server 2016 64-bit SAS RAID INVENTEC: PERC Controllers7.714.6.0 Windows Server 2019 64-bit SAS RAID INVENTEC:PERC Controllers7.714.6.0 Windows Server 2016 64-bit SAS RAID INVENTEC:PERC H330/H730/H730P/H830/H730P MX/FD33xD/FD33xS Controllers6.604.06.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitWindows Server 2016 64-bitSAS RAID PERC S150 Controller 6.1.0.0009Red Hat Enterprise Linux 7.9 64-bit System Utilities RHEL 7.9 64 bit UPDATE0Red Hat Enterprise Linux 8.3 64-bit System Utilities RHEL 8.3 64 bit UPDATE0SUSE Linux Enterprise Server 15.2 64-bitSystem Utilities SLES UPDATE0Windows Server 2019 64-bitWindows Server 2016 64-bitVideo Matrox Video Driver 4.4.3.18PowerEdge R6525PowerEdge R6515 Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Chipset AMD SP3 MILAN Series Chipsetdriver2.10.09.156Windows Server 2019 64-bit Windows Server 2016 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Drivers andSoftware Application10.3.6Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Linux Drivers10.3.6Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.80.3Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet adapters21.80.16.60Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network Intel NIC Family Version 20.0.0Drivers20.0.0Windows Server 2019 64-bit Windows Server 2016 64-bit Network MELLANOX TECHNOLOGIESINC:Mellanox ConnectX-4 Lx,ConnectX-4, ConnectX-5 andConnectX-6 Ethernet adapters02.050.02Windows Server 2019 64-bit Windows Server 2016 64-bit Network Marvell FastLinQ 41000 seriesEthernet adapters and MarvellQLogic Fibre Channel Adapters35.20.14Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare Linux Base Drivers- Binary RPM InstallA004PowerEdge R65159Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare X2522-25G andX2562 Drivers1.9.1Windows Server 2019 64-bitWindows Server 2019 64-bitSAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.02 Windows Server 2016 64-bit SAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.01 Red Hat Enterprise Linux 8.3 64-bitRed Hat Enterprise Linux 7.9 64-bitSUSE Linux Enterprise Server 15.2 64-bitSAS Non-RAID HBA Controllers34.15.04.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitSAS Non-RAID HBA10-11 Controllers 2.61.14.00Windows Server 2019 64-bit Windows Server 2016 64-bit SAS RAID BOSS-S1 AdapterBOSS-S1 AdapterBOSS-S1 ModularBOSS-S1 Modular1.2.0.1051Windows Server 2016 64-bit SAS RAID INVENTEC: PERC Controllers7.714.6.0 Windows Server 2019 64-bit SAS RAID INVENTEC:PERC Controllers7.714.6.0 Windows Server 2016 64-bit SAS RAID INVENTEC:PERC H330/H730/H730P/H830/H730P MX/FD33xD/FD33xS Controllers6.604.06.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitWindows Server 2016 64-bitSAS RAID PERC S150 Controller 6.1.0.0009Red Hat Enterprise Linux 7.9 64-bit System Utilities RHEL 7.9 64 bit UPDATE0Red Hat Enterprise Linux 8.3 64-bit System Utilities RHEL 8.3 64 bit UPDATE0SUSE Linux Enterprise Server 15.2 64-bitSystem Utilities SLES UPDATE0Windows Server 2019 64-bitWindows Server 2016 64-bitVideo Matrox Video Driver 4.4.3.110PowerEdge R6515PowerEdge C6525 Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Chipset AMD SP3 MILAN Series Chipsetdriver2.10.09.156Windows Server 2019 64-bit Windows Server 2016 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Drivers andSoftware Application10.3.6Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Fibre Channel BROADCOMCORPORATION:Emulex FibreChannel Adapter Linux Drivers10.3.6Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.80.3Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtremeEthernet adapters21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet adapters21.80.16.60Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network BROADCOMCORPORATION:NetXtreme-EEthernet21.8Windows Server 2019 64-bit Windows Server 2016 64-bit Network Intel NIC Family Version 20.0.0Drivers20.0.0Windows Server 2019 64-bit Windows Server 2016 64-bit Network MELLANOX TECHNOLOGIESINC:Mellanox ConnectX-4 Lx,ConnectX-4, ConnectX-5 andConnectX-6 Ethernet adapters02.050.02Windows Server 2019 64-bit Windows Server 2016 64-bit Network Marvell FastLinQ 41000 seriesEthernet adapters and MarvellQLogic Fibre Channel Adapters35.20.14Red Hat Enterprise Linux 7.9 64-bit Red Hat Enterprise Linux 8.3 64-bit SUSE Linux Enterprise Server 15.2 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare Linux Base Drivers- Binary RPM InstallA005PowerEdge C652511Operating System Component Device Name Vendor RevisionWindows Server 2019 64-bit Windows Server 2016 64-bit Network SOLARFLARECOMMUNICATIONSINC:Solarflare X2522-25G andX2562 Drivers1.9.1Windows Server 2019 64-bitWindows Server 2019 64-bitSAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.02 Windows Server 2016 64-bit SAS Non-RAID Dell 12Gbps HBA and HBA330 2.51.25.01 Red Hat Enterprise Linux 8.3 64-bitRed Hat Enterprise Linux 7.9 64-bitSUSE Linux Enterprise Server 15.2 64-bitSAS Non-RAID HBA Controllers34.15.04.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitSAS Non-RAID HBA10-11 Controllers 2.61.14.00Windows Server 2019 64-bit Windows Server 2016 64-bit SAS RAID BOSS-S1 AdapterBOSS-S1 AdapterBOSS-S1 ModularBOSS-S1 Modular1.2.0.1051Windows Server 2016 64-bit SAS RAID INVENTEC: PERC Controllers7.714.6.0 Windows Server 2019 64-bit SAS RAID INVENTEC:PERC Controllers7.714.6.0 Windows Server 2016 64-bit SAS RAID INVENTEC:PERC H330/H730/H730P/H830/H730P MX/FD33xD/FD33xS Controllers6.604.06.00Windows Server 2019 64-bitWindows Server 2019 64-bitWindows Server 2016 64-bitWindows Server 2016 64-bitSAS RAID PERC S150 Controller 6.1.0.0009Red Hat Enterprise Linux 7.9 64-bit System Utilities RHEL 7.9 64 bit UPDATE0Red Hat Enterprise Linux 8.3 64-bit System Utilities RHEL 8.3 64 bit UPDATE0SUSE Linux Enterprise Server 15.2 64-bitSystem Utilities SLES UPDATE0Windows Server 2019 64-bitWindows Server 2016 64-bitVideo Matrox Video Driver 4.4.3.112PowerEdge C6525。

AMD羿龙II X6 1065T CPU性能如何
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线程撕裂者2990WX性能如何天梯图排行榜热度：如何让CPU 能发挥系统最大性能热度：如何判断cpu性能高低热度：如何更换CPU涂硅胶热度： cpu制造工艺如何性能热度：
现在市场上CPU品牌型号繁多，让不少朋友觉得眼花缭乱，那么哪个CPU才适合自己呢?店铺在这里就给大家介绍AMD 羿龙II X6 1065TCPU，让大家了解认识。

基本参数
适用类型台式机
CPU系列羿龙II
CPU频率
CPU主频2.9GHz
外频200MHz
倍频14.5倍
CPU插槽
插槽类型Socket AM3
针脚数目938pin
CPU内核
核心代号Thuban
CPU架构K10.5
核心数量六核心
制作工艺45纳米
热设计功耗(TDP)95W
内核电压1.25V
CPU缓存
一级缓存6×128KB
二级缓存6*512KB
三级缓存6MB
技术参数
虚拟化技术AMD VT
64位处理器是
Turbo Boost技术不支持
病毒防护技术不支持
显卡参数
集成显卡否
其他参数
工作温度62℃
AMD羿龙II X6 1065T CPU性能如何将本文的Word文档下载到电脑，方便收藏和打印推荐度：点击下载文档文档为doc格式。