One_glass_Solution_Process_Introduction

1. 2 Steps

OverviewSteps/StagesNotes

1.1R:H2SO4, S:AcOH, 50-60°C; 2 h, 55-60°C

2.1R:NaOH, S:H2O, S:Me2CHOH, 4 h, 80°C1) alternative reaction condition gave loweryield, 2) alternative reaction condition gavelower yield, Reactants: 2, Reagents: 2,Solvents: 3, Steps: 2, Stages: 2, Most stagesin any one step: 1

ReferencesMethod for preparing high-purity MemantinehydrochlorideBy Wu, Biao et alFrom Faming Zhuanli Shenqing, 103524353,22 Jan 2014CASREACT ®: Copyright © 2015 American Chemical Society. All Rights Reserved. CASREACT contains reactionsfrom CAS and from: ZIC/VINITI database (1974-1999) provided by InfoChem; INPI data prior to 1986; Biotransformationsdatabase compiled under the direction of Professor Dr. Klaus Kieslich; organic reactions, portions copyright 1996-2006John Wiley & Sons, Ltd., John Wiley and Sons, Inc., Organic Reactions Inc., and Organic Syntheses Inc. Reproducedunder license. All Rights Reserved.2. Single Step

ChemicalEngineeringScience62(2007)1948–

/locate/ces

Structureandrateofgrowthofwheyproteindepositfrominsituelectrical

conductivityduringfoulinginaplateheatexchanger

RomualdGuérin,GillesRonse,LaurentBouvier,PascalDebreyne,GuillaumeDelaplace∗

UR638,GéniedesProcédésetTechnologieAlimentaires,INRA,F-59651,Villenueved’Ascq,France

Received7August2006;receivedinrevisedform13December2006;accepted15December2006Availableonline30December2006

ThispaperisdedicatedtothememoryofDrJean-ClaudeLeuliet

Abstract

Theinfluencesofcalciumconcentrations(70.88mg/l),Reynoldsnumber(2000–5000)andtemperature(60.96◦C)uponthedepositstructureandtherateofgrowthdepositionhavebeeninvestigatedinaplateheatexchanger.Thiswasdonefrominsitumeasurementsofthedepositelectricalconductivityviaimplementationofstainlesssteelelectrodesinchannelscombinedwithassessmentsofdepositthickness.Calciumionsaffectstructuresofdepositsandincreasetherateofdepositgrowthuponheatedsurfaces.Thiswasattributedtotheformationofweakersizeaggregatesathighercalciumconcentrationsandahighernumberofcalciumbindings,whichreinforceadhesionforcesbetweenproteinaggregates.Structuresandappearancesofdepositsalsowereaffectedbyflowrateswhateverthecalciumconcentrations.DepositgrowthratewasenhancedbyincreasingflowratebelowacriticalReynoldsnumbercomprisedbetween3200and5000.Onthecontrary,abovethecriticalReynoldsnumber,alimitationofthedepositand/oranescapeofthedepositfromthefouledlayerintothecorefluidoccurred,causedbythepredominanceofparticlebreakageonthedepositformation.Foulingtendedtobereducedathigherflowrate.Itwasnoteworthythatratesofgrowthdecreaseduringfoulingexperimentswhichmaybeexplainedbyanincreaseinlocalshearstressesleadingtoparticlebreakage.᭧2007ElsevierLtd.Allrightsreserved.

CVD

晶圆制造厂非常昂贵的原因之一，是需要一个无尘室，为何需要无尘室

答：由于微小的粒子就能引起电子组件与电路的缺陷

何谓半导体?

答：半导体材料的电传特性介于良导体如金属(铜、铝，以及钨等)和绝缘和橡胶、塑料与干木头之间。最常用的半导体材料是硅及锗。半导体最重要的性质之一就是能够藉由一种叫做掺杂的步骤刻意加入某种杂质并应用电场来控制其之导电性。

常用的半导体材料为何

答：硅(Si)、锗(Ge)和砷化家(AsGa)

何谓VLSI

答：VLSI(Very Large Scale Integration)超大规模集成电路

在半导体工业中，作为绝缘层材料通常称什幺

答：介电质(Dielectric)

薄膜区机台主要的功能为何

答：沉积介电质层及金属层

何谓CVD(Chemical Vapor Dep.)

答：CVD是一种利用气态的化学源材料在晶圆表面产生化学沉积的制程

CVD分那几种?

答：PE-CVD(电浆增强型)及Thermal-CVD(热耦式)

为什幺要用铝铜(AlCu)合金作导线?

答：良好的导体仅次于铜

介电材料的作用为何?

答：做为金属层之间的隔离

何谓PMD(Pre-Metal Dielectric)

答：称为金属沉积前的介电质层，其界于多晶硅与第一个金属层的介电质

何谓IMD(Inter-Metal Dielectric)

答：金属层间介电质层。

何谓USG?

答：未掺杂的硅玻璃(Undoped Silicate Glass) 何谓FSG?

答：掺杂氟的硅玻璃(Fluorinated Silicate Glass)

何谓BPSG?

答：掺杂硼磷的硅玻璃(Borophosphosilicate glass)

何谓TEOS?

答：Tetraethoxysilane用途为沉积二氧化硅

MAGMA操作教程

一、基本操作流程

建构实体模型 CAD ModelCAD Model

模流前处理 PreprocessorPreprocessor

实体切网格 MeshingMeshing

参数设定 ParametersParameters

模流后处理

PostprocessorPostprocessor

结 果 分 析

AnalysisAnalysis

相 应 对 策

DecisionDecision

图,1_1,

建构正确的实体模型是进行分析工作的关键。把实体分为不同的组～转换为.stl档～为MAGMA分析做好准备。如图,1_1,所示:黑色字体是使用MAGMA的操作步骤,红色字体是分析的前期工作和后期对策。

二、,,,,,的操作

,、创建专案

图,2_1, 图,2_2,

1

图,2_3, 图,2_4,

专案名称

.stl档

图,2_5,

说明:

图,2_1,打开桌面图标 project菜单 create project 出现新对话框

图,2_2,选择Iron casting铸铁模组 选择结果存放路径,MAGMAsoft下,

取解析方案名称 回车键 OK 出现新对话框

图,2_3,默认系统选择直接按红框所标的键～直到图,2_4,,按OK键结束创建

专案操作。如图,2_5,的路径～把建立好的.stl档存在CMD文件夹下。 ,、前处理

2,1 、材质群组介绍

2

,、 砂模(sandm)

Z轴正向 ,、 灌口(inlet) Inlet

,、 浇道(gating)

,、 浇道(gating)

Gating ,、 冒口(feeder) Gating ,、 冒口(feeder)

,、 入水口(ingate)

,、 入水口(ingate)

,、 砂芯(core)

,,、 冷铁(chill)

,,、 铸件(cast) Feeder