UL2108-2009_Low_Voltage_Lighting_Systems简体中文版

DBV5DBV6YEQFEATURESDESCRIPTIONAPPLICATIONSDBV PACKAGE (TOP VIEW)IN GND ENOUTBYPASSFixed Option DBV PACKAGE IN GND ENOUT BYPASSFB Adjustable OptionTPS79328RIPPLE REJECTIONvsFREQUENCYINENOUT BYP GNDYEQ PACKAGE 101001 k10 k104080100 k1 M10 MR i p p l e R e j e c t i o n − d Bf − Frequency − Hz 50203060709010000.050.10.150.20.250.31001 k 10 k 100 kf − Frequency − HzV /H zO u t p u t S p e c t r a l N o i s e D e n s i t y − µTPS79328OUTPUT SPECTRAL NOISE DENSITYvsTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003ULTRALOW-NOISE,HIGH PSRR,FAST RF 200-mA LOW-DROPOUT LINEARREGULATORS IN NANOSTAR™WAFER CHIP SCALE AND SOT23•200-mA RF Low-Dropout Regulator The TPS793xx family of low-dropout (LDO)With Enablelow-power linear voltage regulators features high power supply rejection ratio (PSRR),ultralow noise,•Available in 1.8-V,2.5-V,2.8-V,2.85-V,3-V,fast start-up,and excellent line and load transient 3.3-V,4.75-V,and Adj (1.22V to 5.5V)responses in NanoStar wafer chip scale and SOT23•High PSRR (70dB at 10kHz)packages.NanoStar packaging gives an ultrasmall •Ultralow Noise (32µV)footprint as well as an ultralow profile and package weight,making it ideal for portable applications such •Fast Start-Up Time (50µs)as handsets and PDAs.Each device in the family is •Stable With a 2.2-µF Ceramic Capacitor stable,with a small 2.2-µF ceramic capacitor on the •Excellent Load/Line Transient Response output.The TPS793xx family uses an advanced,proprietary BiCMOS fabrication process to yield ex-•Very Low Dropout Voltage (112mV at Full tremely low dropout voltages (e.g.,112mV at 200Load,TPS79330)mA,TPS79330).Each device achieves fast start-up •5-Pin SOT23(DBV)and NanoStar Wafer Chip times (approximately 50µs with a 0.001-µF bypass Scale (YEQ)Packagescapacitor)while consuming very low quiescent cur-rent (170µA typical).Moreover,when the device is placed in standby mode,the supply current is re-•Cellular and Cordless Telephones duced to less than 1µA.The TPS79328exhibits approximately 32µV RMS of output voltage noise with •Bluetooth™,Wireless LAN a 0.1-µF bypass capacitor.Applications with analog •RF components that are noise sensitive,such as portable •VCOsRF electronics,benefit from the high PSRR and •Handheld Organizers,PDAlow-noise features as well as the fast response time.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Bluetooth is a trademark of Bluetooth Sig,Inc.NANOSTAR is a trademark of Texas Instruments.ABSOLUTE MAXIMUM RATINGSTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003AVAILABLE OPTIONS(1)The DBVR indicates tape and reel of 3000parts.(2)The YEQR indicates tape and reel of 3000parts.YEQT indicates tape and reel of 250parts.(3)Product preview stage of development.over operating temperature range (unless otherwise noted)(1)(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.DISSIPATION RATING TABLE ELECTRICAL CHARACTERISTICSTPS79301,TPS79318 TPS79325,TPS79328,TPS793285 TPS79330,TPS79333,TPS793475 SLVS348F–JULY2001–REVISED SEPTEMBER2003(1)The JEDEC low K(1s)board design used to derive this data was a3-inch x3-inch,two layer board with2ounce copper traces on top ofthe board.(2)The JEDEC high K(2s2p)board design used to derive this data was a3-inch x3-inch,multilayer board with1ounce internal power andground planes and2ounce copper traces on top and bottom of the board.over recommended operating temperature range EN=V I,T J=-40to125°C,V I=V O(typ)+1V,I O=1mA,C o=10µF,C(byp)= 0.01µF(unless otherwise noted)(1)Minimum V(IN)is2.7V or V(OUT)+V(DO),whichever is greater.(2)If V O≤2.5V then V(IN),min=2.7V,V(IN),max=5.5V.FUNCTIONAL BLOCK DIAGRAM-ADJUSTABLE VERSIONV INV INGND ENTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003ELECTRICAL CHARACTERISTICS (continued)over recommended operating temperature range EN =V I,T J =-40to 125°C,V I =V O(typ)+1V,I O =1mA,C o =10µF,C (byp)=0.01µF (unless otherwise noted)(3)V (IN)=V (OUT),typ -100mV.The TPS79325dropout voltage is limited by the input voltage range.Functional Block Diagram-Fixed VersionV V V OUTBypassTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003Functional Block Diagram-Adjustable Version (continued)Terminal FunctionsTYPICAL CHARACTERISTICS (SOT23PACKAGE)I O − Output Current − mA − O u t p u t V o l t a g e − VV O 2.7752.782.7852.792.7952.82.805T J − Junction Temperature − °C − O u t p u t V o l t a g e − VV O−40−25−105203550658095110125T J − Junction Temperature − °CG r o u n d C u r r e n t − Aµ00.050.10.150.20.250.31001 k 10 k 100 k f − Frequency − HzV /H zO u t p u t S p e c t r a l N o i s e D e n s i t y −µ00.050.10.150.20.250.31001 k 10 k 100 kV /H zO u t p u t S p e c t r a l N o i s e D e n s i t y − µ f − Frequency − Hz1001 k 10 k 100 kf − Frequency − HzV /H zO u t p u t S p e c t r a l N o i s e D e n s i t y − µTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003TPS79328TPS79328TPS79328OUTPUT VOLTAGEOUTPUT VOLTAGEGROUND CURRENTvsvsvsOUTPUT CURRENTJUNCTION TEMPERATUREJUNCTION TEMPERATUREFigure 1.Figure 2.Figure 3.TPS79328TPS79328TPS79328OUTPUT SPECTRAL NOISEOUTPUT SPECTRAL NOISEOUTPUT SPECTRAL NOISEDENSITYDENSITYDENSITYvsvsvsFREQUENCYFREQUENCYFREQUENCYFigure 4.Figure 5.Figure 6.1001 M101 k f − Frequency − Hz10 k − O u t p u t I m p e d a n c e −Z o Ω100 k10 M−40−25−105203550658095110125T J − Junction Temperature − °C− D r o p o u t V o l t a g e − m VV D O 0.0010.010.1R M S − R o o t M e a n S q u a r e d O u t p u t N o i s e −(R M S )V µC (byp) − Bypass Capacitance − µF0102030405060101001 k10 k104080100 k1 M10 MR i p p l e R e j e c t i o n− d Bf − Frequency − Hz5002030607090100101001 k10 k2060100100 k1 M10 MR i p p l e R e j e c t i o n − d Bf − Frequency − Hz 407090305080100101001 k10 k 2060100100 k 1 M 10 MR i p p l e R e j e c t i o n− d Bf − Frequency − Hz407090305080100TPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003TYPICAL CHARACTERISTICS (SOT23PACKAGE)(continued)ROOT MEAN SQUARE OUTPUTTPS79328NOISE OUTPUT IMPEDANCEDROPOUT VOLTAGEvsvsvsBYPASS CAPACITANCEFREQUENCYJUNCTION TEMPERATUREFigure 7.Figure 8.Figure 9.TPS79328TPS79328TPS79328RIPPLE REJECTIONRIPPLE REJECTIONRIPPLE REJECTIONvsvsvsFREQUENCYFREQUENCYFREQUENCYFigure 10.Figure 11.Figure 12.V Ot − Time − µs− O u t p u t V o l t a g e − V E n a b l e V o l t a g e − Vt − Time − µsV O O u t p u t V o l t a g e − m V∆ − C h a n g e I n − O u t p u t C u r r e n t − m AI OV O t − Time − µs− O u t p u t V o l t a g e − m VV I − I n p u t V o l t a g e − m V500 m V /d i v1s/div10050020406080100120D C D r o p u o y V o l t a g e − m V150200250140160180200I O − Output Current − mA501001502002.533.544.55V I − Input Voltage − V− D r o p o u t V o l t a g e − m VV D O TPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003TYPICAL CHARACTERISTICS (SOT23PACKAGE)(continued)TPS79328OUTPUT VOLTAGE,ENABLE VOLTAGEvsTPD79328TPD79328TIME (START-UP)LINE TRANSIENT RESPONSELOAD TRANSIENT RESPONSEFigure 13.Figure 14.Figure 15.TPS79301DC DROPOUT VOLTAGEDROPOUT VOLTAGEvsvsPOWER UP /POWER DOWNOUTPUT CURRENTINPUT VOLTAGEFigure 16.Figure 17.Figure 18.2341.52.53.523− M i n i m u m R e q u i r e d I n p u t V o l t a g e − VV O − Output Voltage − VV I 1.75 2.25 2.75 3.252.80.020.040.060.080.2I O − Output Current − AE S R − E q u i v a l e n t S e r i e s R e s i s t a n c e −Ω0.020.040.060.080.2I O − Output Current − AE S R − E q u i v a l e n t S e r i e s R e s i s t a n c e −ΩTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003TYPICAL CHARACTERISTICS (SOT23PACKAGE)(continued)TYPICAL REGIONS OF STABILITYTYPICAL REGIONS OF STABILITYMINIMUM REQUIRED INPUT VOLT-EQUIVALENT SERIES EQUIVALENT SERIES AGE RESISTANCE (ESR)RESISTANCE (ESR)vsvsvsOUTPUT VOLTAGEOUTPUT CURRENTOUTPUT CURRENTFigure 19.Figure 20.Figure 21.APPLICATION INFORMATION0.1V ITPS793xxµFExternal Capacitor RequirementsBoard Layout Recommendation to Improve PSRR and Noise PerformanceTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003The TPS793xx family of low-dropout (LDO)regulators has been optimized for use in noise-sensitive battery-operated equipment.The device features extremely low dropout voltages,high PSRR,ultralow output noise,low quiescent current (170µA typically),and enable-input to reduce supply currents to less than 1µA when the regulator is turned off.A typical application circuit is shown in Figure 22.Figure 22.Typical Application CircuitA 0.1-µF or larger ceramic input bypass capacitor,connected between IN and GND and located close to the TPS793xx,is required for stability and improves transient response,noise rejection,and ripple rejection.A higher-value electrolytic input capacitor may be necessary if large,fast-rise-time load transients are anticipated and the device is located several inches from the power source.Like all low dropout regulators,the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop.The minimum recommended capacitance is 2.2µF.Any 2.2µF or larger ceramic capacitor is suitable,provided the capacitance does not vary significantly over temperature.The internal voltage reference is a key source of noise in an LDO regulator.The TPS793xx has a BYPASS pin which is connected to the voltage reference through a 250-k Ωinternal resistor.The 250-k Ωinternal resistor,in conjunction with an external bypass capacitor connected to the BYPASS pin,creates a low pass filter to reduce the voltage reference noise and,therefore,the noise at the regulator output.In order for the regulator to operate properly,the current flow out of the BYPASS pin must be at a minimum,because any leakage current creates an IR drop across the internal resistor thus creating an output error.Therefore,the bypass capacitor must have minimal leakage current.For example,the TPS79328exhibits only 32µV RMS of output voltage noise using a 0.1-µF ceramic bypass capacitor and a 2.2-µF ceramic output capacitor.Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the BYPASS pin that is created by the internal 250-k Ωresistor and external capacitor.To improve ac measurements like PSRR,output noise,and transient response,it is recommended that the board be designed with separate ground planes for V IN and V OUT ,with each ground plane connected only at the GND pin of the device.In addition,the ground connection for the bypass capacitor should connect directly to the GND pin of the device.Power Dissipation and Junction TemperatureP D(max)+T J max*T ARθJAWhere:T J max is the maximum allowable junction temperature.RθJA is the thermal resistance junction-to-ambient for the package, see the dissipation rating table.T A is the ambient temperature.(1)P D+ǒV I*V OǓI O(2) Programming the TPS79301Adjustable LDO RegulatorV O+V refǒ1)R1R2Ǔ(3) Where:V ref = 1.2246 V typ (the internal reference voltage)R1+ǒV O V ref*1ǓR2(4)C1+(3x10–7)x(R1)R2)(R1x R2)(5)TPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY2001–REVISED SEPTEMBER2003APPLICATION INFORMATION(continued)Specified regulator operation is assured to a junction temperature of125°C;the maximum junction temperature should be restricted to125°C under normal operating conditions.This restriction limits the power dissipation the regulator can handle in any given application.To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation,P D(max),and the actual dissipation,P D,which must be less than or equal to P D(max).The maximum-power-dissipation limit is determined using the following equation:The regulator dissipation is calculated using:Power dissipation resulting from quiescent current is negligible.Excessive power dissipation triggers the thermal protection circuit.The output voltage of the TPS79301adjustable regulator is programmed using an external resistor divider as shown in Figure23.The output voltage is calculated using:Resistors R1and R2should be chosen for approximately50-µA divider current.Lower value resistors can be used for improved noise performance,but the solution consumes more power.Higher resistor values should be avoided as leakage current into/out of FB across R1/R2creates an offset voltage that artificially in-creases/decreases the feedback voltage and thus erroneously decreases/increases V O.The recommended design procedure is to choose R2=30.1kΩto set the divider current at50µA,C1=15pF for stability,and then calculate R1using:In order to improve the stability of the adjustable version,it is suggested that a small compensation capacitor be placed between OUT and FB.For voltages<1.8V,the value of this capacitor should be100pF.For voltages >1.8V,the approximate value of this capacitor can be calculated as:The suggested value of this capacitor for several resistor ratios is shown in the table below.If this capacitor is not used(such as in a unity-gain configuration)or if an output voltage<1.8V is chosen,then the minimum recommended output capacitor is4.7µF instead of2.2µF.22 pF 15 pF 15 pFOUTPUT VOL T AGE PROGRAMMING GUIDEOUTPUT VOLTAGER1R22.5 V 3.3 V3.6 VC131.6 k Ω51 k Ω59 k Ω30.1 k Ω30.1 k Ω30.1 k ΩV OV I30.7 V1µF0 pF 1.22 V shortopenRegulator ProtectionTPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003APPLICATION INFORMATION (continued)Figure 23.TPS79301Adjustable LDO Regulator ProgrammingThe TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (e.g.,during power down).Current is conducted from the output to the input and is not internally limited.If extended reverse voltage operation is anticipated,external limiting might be appropriate.The TPS793xx features internal current limiting and thermal protection.During normal operation,the TPS793xx limits output current to approximately 400mA.When current limiting engages,the output voltage scales back linearly until the overcurrent condition ends.While current limiting is designed to prevent gross device failure,care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device.If the temperature of the device exceeds approximately 165°C,thermal-protection circuitry shuts it down.Once the device has cooled down to below approximately 140°C,regulator operation resumes.TPS793xxYEQ NanoStar™Wafer Chip Scale InformationNOTES:A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. NanoStar ™ package configuration.D. This package is tin-lead (SnPb), consult the factory for availability of lead-free material.NanoStar is a trademark of T exas Instruments.TPS79301,TPS79318TPS79325,TPS79328,TPS793285TPS79330,TPS79333,TPS793475SLVS348F–JULY 2001–REVISED SEPTEMBER 2003APPLICATION INFORMATION (continued)Figure 24.NanoStar™Wafer Chip Scale PackageNOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion.D.Falls within JEDEC MO-178NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion.D.Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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Electronic Materials for LED Applications Selector GuideParker LORD specializes in developing world-class adhesives and thermal management materials including gels, greases and encapsulants for demanding LED applications. Our experience in electronic materials spans more than 40 years. We incorporate this vast experience in developing solutions for new applications to help ensure our customers’ success. Typical Applications2Thermally Conductive GelUR-388 Thermally Conductive EncapsulantsOptics Bonding LORD 7550 Urethane AdhesiveCases andDiffusers BondingLORD 7550 Urethane AdhesiveLED Dies BondingLORD 6148S Silver ConductorCoolTherm MD-161 Conductive AdhesiveThermally ConductiveGreases & AdhesivesCoolTherm TC-404 Thermally Conductive GreaseEncapsulants forCable ConnectorsLORD 7550 Urethane AdhesivePotting andEncapsulants for DriversCoolTherm UR-388 Thermally Conductive EncapsulantCoolTherm SC-309 Thermally Conductive EncapsulantCase and Luminaire Sealing LORD 7550 Urethane AdhesiveAdhesivesParker LORD adhesives have been specified for challenging LED applications requiring superior strength over a wide range of temperatures. Our technology allows us to achieve superior performance at competitive costs by minimizing the amount of costly raw material components.Data is typical and not to be used for specification purposes.Data is typical and not to be used for specification purposes.Thermal Management MaterialsParker LORD thermally conductive materials are easily applied and have high thermal conductivity/low thermal resistance to improve device reliability.Data is typical and not to be used for specification purposes.3OD SG1013 05/21 Rev.9©2021 Parker HannifinInformation and specifications subject to change without notice and without liability therefore. Trademarks used herein are the property of their respective owners.Parker LORDEngineered Materials Group 111 LORD DriveCary, NC 27511-7923USAphone +1 877 ASK LORD (275 5673)Values stated in this technical data sheet represent typical values as not all tests are run on each lot of material produced. For formalized product specifications for specific product end uses, contact the Customer Support Center.Information provided herein is based upon tests believed to be reliable. In as much as Parker LORD has no control over the manner in which others may use this information, it does not guarantee the results to be obtained. In addition, Parker LORD does not guarantee the performance of the product or the results obtained from the use of the product or this information where the product has been repackaged by any third party, including but not limited to any product end-user. Nor does the company make any express or implied warranty of merchantability or fitness for a particular purpose concerning the effects or results of such use.WARNING — USER RESPONSIBILITY . FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise.The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems.。

Features• Characterized by radiometric intensity • High optical power output • Extremely long useful life • Low power consumption• Well de ned spatial radiation patterns • 639 nm PEAK red color • 30° viewing angle• High operating temperature: T jLED = +130°C • Superior resistance to moisture • Suitable for outdoor useApplications• Photo sensor stimulus • Infrared emitter replacement • Solid state optical mouse sensors • Surface imaging sensors• Optical position and motion sensors • Human interface devices• Computer printer dot quality control • Battery powered systemsBene ts• Radiometric LED characterization decreases system variability• Improved system reliability • Visual styling• Visible color for improved application safety • On/o indication• Suitable for a variety of sensor-based applicationsDescriptionRadiometrically Tested Precision Optical Performance AlInGaP II (aluminum indium gallium phosphide) LEDs o er increased sensor-based application design exibility. High-resolution radiometric intensity bins (mW/sr) enable customers to precisely match LED lamp performance with sensor functionality.Visible LEDs o er new styling alternatives — light can be leveraged to develop more attractive products. In com-parison to invisible infrared sources, safety concerns are signi cantly improved by the human autonomic pupil response and re exive movement away from bright light. Visible LEDs further indidcate system on/o status.The AlInGaP II technology provides extremely stable light output over very long periods of time, with low power consumption.These lamps are made with an advanced optical grade epoxy system o ering superior high temperature and moisture resistance performance in outdoor systems. The epoxy contains both uv-a and uv-b inhibitors to reduce the e ects of long term exposure to direct sunlight.Please contact your Avago Technologies Representative for more information and design for manufacture advice. Application Brief I-024 Pulsed Operating Ranges for AlInGaP LEDs vs. Projected Long Term Light Output Performance and other application information is available at: /go/led_lamps.HLMP-ED80Radiometrically Tested AlInGaP II LED Lamps for Sensor-Based ApplicationsData SheetMinimum Radiometric Intensity Maximum Forward Voltage Part Number (mW/Sr) at 20 mA (V) at 20 mA HLMP-ED80-K0T00 7.2 2.6HLMP-ED80-K00007.22.4Device Selection GuidePackage DimensionsNOTE:ALL DIMENSIONS ARE IN mm (INCHES).(0.039)CATHODEFLATPart Numbering SystemH L M P-x x x x-x x x x xMechanical Option00: BulkV F Bin Selections0: Maximum V F 2.4 VT: Maximum V F 2.6 VMaximum Intensity Bin0: No maximum Iv bin limitMinimum Intensity BinRefer to device selection guideColorD: 630 nm redPackageE: T-1 3/4 (5 mm) round lamp Note: Please refer to AB 5337 for complete information on part numbering system.Absolute Maximum Ratings at T A = 25°CDC Forward Current [1,2,3].....................................................................................................50 mA Peak Pulsed Forward Current [2,3].......................................................................................100 mA Average Forward Current .......................................................................................................30 mA Reverse Voltage (I R = 100 µA) .........................................................................................................5 V LED Junction Temperature ........................................................................................................130°C Operating Temperature .........................................................................................–40°C to +100°C Storage Temperature ..............................................................................................–40°C to +100°C Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currents between10 mA and 30 mA are recommended. For more information on recommended drive condi-tions, please refer to HP Application Brief I-024 (5966-3087E).3. Please contact your Avago sales representative about operating currents below 10 mA.Electrical/Optical Characteristics at T A = 25°CParameterSymbolMin.Typ.Max.UnitsTest ConditionsForward Voltage ED80-xx0xx V F 2.00 2.40 V I F = 20 mAED80-xxTxx 2.35 2.60Reverse Voltage V R 5 20 V I R = 100 µAPeak Wavelength λPEAK 639 nm Peak of Wavelength of SpectralDistribution at I F = 20 mA Dominant Wavelength [1] λd 630 nmSpectral Halfwidth ∆λ1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point atI F = 20 mASpeed of Response τs 20 ns Exponential Time Constant, e -t/τs Capacitance C 40 pF V F = 0, f = 1 MHzThermal Resistance R ΘJ-PIN240 °C/W LED Junction-to-Cathode Lead Luminous E cacy [5] ηv155 lm/W Emitted Luminous Power/EmittedRadiant Power at I F = 20 mAViewing Angle [2] 2 θ1/2 30 Deg.Radiometric Intensity [3,4]I e7.2350.50mW/srEmitted Radiant Power at I F = 20 mANotes:1. Dominant wavelength, l d , is derived from the CIE Chromaticity Diagram referenced to Illuminant E.2. θ1/2 is the o -axis angle where the luminous intensity is one half the on-axis intensity.3. The radiometric intensity is measured on the mechanical axis of the lamp package.4. The optical axis is closely aligned with the package mechanical axis.5. The luminous intensity, I v , in candelas, may be found from the equation I v = I e ηv , where I e is the radiometric intensity in watts per steradian and ηv is the luminous e cacy in lumens/watt.6. For option -xxTxx, max. forward votage (Vf) is 2.6 V. Refer to Vf bin table.Figure 1. Relative Intensity vs. Peak Wavelength.Figure 2a. Forward Current vs. Forward Voltage for Option -xx0xx.WAVELENGTH – nmR E L A T I V E I N T E N S I T YC U R R E N T – m A1.00V F – FORWARD VOLTAGE – V2.51004030 1.5 2.0603.0102050RED708090Figure 2b. Forward Current vs. Forward Voltage for Option -xxTxx.Figure 3. Relative Luminous Intensity vs. Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on T JMAX = 130°C.Figure 5. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.Radiometric Intensity Bin Limits (mW/sr at 20 mA)Bin IDMin.Max.K 8.5 10.2L 10.2 12.2M 12.2 14.7N 14.7 17.6P 17.6 21.2Q 21.2 25.4R 25.4 30.5S 30.5 36.5T 36.543.9Notes:1. Tolerance for each bin will be ± 15%.2. Bin categories are established for classi ca-tion of products. Products may not be avail-able in all bin categories.3. VF bin table only available for those num-ber with options -xxTxx.Vf Bin Table [3]Bin IDMin.Max.VA2.0 2.2VB 2.2 2.4VC2.42.6Tolerance for each bin limit is ±0.05 V.F O R W A R D C U R R E N T00FORWARD VOLTAGE – V2.55040301.52.03.010201.00.5R E L A T I V E R A D I O M E T R I C I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00I F – DC FORWARD CURRENT – mA 402.01.51.00.520502.51030I F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – CN O R M A L I Z E D R A D I O M E T R I C I N T E NS I T YANGULAR DISPLACEMENT – DEGREES0.1110-40-2020406080100T J - JUNCTION TEMPERATURE - ˚CR E L A T I V E L I G H T O U T P U T (N O R M A L I Z E D A T T J = 25˚CFigure 6. Relative Light Output vs Junction TemperaturePrecautions:Lead Forming:•The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.•For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.•If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling:•Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. •LED component may be e ectively hand soldered to PCB. However, it is only recommended under unavoid-able circumstances such as rework. The closest manual soldering distance of the soldering heat source (sol-dering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED.Note:1. PCB with di erent size and design (component density) will havedi erent heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering pro le again before loading a new type of PCB.Avago Technologies LED con gurationNote: Electrical connection between bottom surface of LED die andthe lead frame is achieved through conductive paste.•ESD precaution must be properly applied on the sol-dering station and personnel to prevent ESD damageto the LED component that is ESD sensitive. Do refer toAvago application note AN 1142 for details. The solder-ing iron used should have grounded tip to ensure elec-trostatic charge is properly grounded.•Recommended soldering condition:Wave Soldering [1, 2]Manual Solder DippingPre-heat temperature105 °C Max.-Preheat time60 sec Max-Peak temperature250 °C Max.260 °C Max.Dwell time 3 sec Max. 5 sec Max Note:1. Above conditions refers to measurement with thermocouplemounted at the bottom of PCB.2. It is recommended to use only bottom preheaters in order to reducethermal stress experienced by LED.•Wave soldering parameters must be set and main-tained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering pro le to ensure that it is always conforming to recommended soldering conditions.•Any alignment xture that is being applied during wave soldering should be loosely tted and should not apply weight or force on LED. Non metal material is rec-ommended as it will absorb less heat during wave sol-dering process.•At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which in-cludes removal of alignment xture or pallet.•If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using re ow soldering prior to insertion the TH LED.•Recommended PC board plated through holes (PTH) size for LED component leads.LED componentlead size DiagonalPlated throughhole diameter0.45 x 0.45 mm(0.018x 0.018 inch)0.636 mm(0.025 inch)0.98 to 1.08 mm(0.039 to 0.043 inch)0.50 x 0.50 mm(0.020x 0.020 inch)0.707 mm(0.028 inch)1.05 to 1.15 mm(0.041 to 0.045 inch)•Over-sizing the PTH can lead to twisted LED after clinch-ing. On the other hand under sizing the PTH can cause di culty inserting the TH LED.Refer to Application Note 5334 for more information about soldering and handling of high brightness TH LED lamps.AlInGaP DeviceExample of Wave Soldering Temperature Pro le for TH LEDAmmo Packs DrawingALL DIMENSIONS IN MILLIMETERS (INCHES).NOTE:THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD &-ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.4025020015010050TIME (MINUTES)Recommended solder:Sn63(Leaded solder alloy)SAC305(Lead free solder alloy)Flux:Rosin fluxSolder bath temperature:245°C±5°C (maximum peak temperature =250°C)Dwell time:1.5sec -3.0sec (maximum =3sec)Note:Allow for board to be sufficiently cooled to room temperature before exerting T E M P E R A T U R E (°C )10mechanical force.Packaging Box for Ammo PacksPackaging Label(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)FROM LEFT ADHESIVE FACING NOTE:THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.ONFor product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4366EN AV02-1523EN - January 20, 2009DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR A UTHORIZED F OR S ALE A S P ARTS, C OMPONENTS O R A SSEMBLIES F OR T HE P LANNING, C ONSTRUCTION, MAINTENANCE O R D IRECT O PERATION O F A N UCLEAR F ACILITY O R F OR U SE I N M EDICAL D EVICES O R A PPLI-CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.Acronyms and De nition:BIN:(i) Color bin only or VF bin only(Applicable for part number with color bins but withoutVF bin OR part number with VF bins and no color bin)OR(ii) Color bin incorporated with VF Bin(Applicable for part number that have both color bin and VF bin)(ii) Avago Baby Label (Only available on bulk packaging)Example:(i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only)(ii) Color bin incorporate with VF Bin VB: VF bin “VB”2: Color bin 2 only。

SY8-230MFTMFT/programmable, Non fail-safe, 230 VTechnical dataElectrical data Nominal voltage AC 230 VNominal voltage frequency50/60 HzNominal voltage range AC 207...253 VTransformer sizing368 VACurrent consumption 1.6 AAuxiliary switch2x SPDT, 1 mA...5 A (3 A inductive), DC 5 V...AC250 V, 1 x 3° / 1 x 87°Switching capacity auxiliary switch 1 mA...5 A (3 A inductive), DC 5 V...AC 250 VElectrical Connection Terminal blocksOverload Protection thermally protected 135°C cut-outInternal Humidty Control resistive heating elementFunctional data Torque motor1500 NmOperating range Y 2...10 VInput impedance100 kΩPosition feedback U 2...10 VPosition feedback U note Max. 0.5 mAPosition feedback U variable VDC variableDirection of motion motor selectable with switch 0/1Manual override hand wheelAngle of rotation90°Running Time (Motor)79 sDuty cycle value75%Noise level, motor45 dB(A)Position indication top mounted domed indicatorSafety data Degree of protection IEC/EN IP66/67Degree of protection NEMA/UL NEMA 4XEnclosure UL Enclosure Type 4XAgency Listing ISO, CE, cCSAusQuality Standard ISO 9001Ambient humidity Max. 100% RHAmbient temperature-22...149°F [-30...65°C]Storage temperature-40...176°F [-40...80°C]Servicing maintenance-freeWeight Weight77 lb [35 kg]SY8-230MFTMaterialsHousing material die cast aluminiumGear train high alloy steel gear sets, self lockingTechnical dataApplicationProduct featuresSY Series actuators are fractional horsepower devices, and utilize full-wave power supplies. Observe wire sizing and transformer sizing requirements. Proportional models CANNOT be connected to Belimo direct coupled (AF, AM, GM…etc) actuator power supplies or any type of half-wave device. You MUST use a separate, dedicated transformer or power supply to power the SY actuator. Please do not connect other automation equipment to the dedicated SY supply source. You MUST use four wires (plus a ground) to control a proportional control SY actuator (See SY Wiring Section).AccessoriesGatewaysDescriptionType Gateway MP to BACnet MS/TP UK24BAC Gateway MP to Modbus RTU UK24MOD Gateway MP to LonWorksUK24LON Electrical accessoriesDescriptionTypeLocal electric disconnect for SY4...12 series actuator, AC 120 V, MFT HOA-120VMFT Service tool, with ZIP-USB function, for programmable andcommunicative Belimo actuators, VAV controller and HVAC performance devicesZTH USBattery backup system for SY7...12 series actuator, AC 120 V, on/offEXT-NSV-B05-120ToolsDescriptionTypeConnecting cable 10 ft [3 m], A: RJ11 6/4 ZTH EU, B: 3-pin Weidmüller and supply connectionZK4-GEN Service tool, with ZIP-USB function, for programmable and communicative Belimo actuators, VAV controller and HVAC performance devicesZTH USElectrical installationINSTALLATION NOTESDo not change sensitivity or dip switch setting with power applied.Power supply Common/Neutral and Control Signal "-"wiring to a common is prohibited.Terminals 4 and 6 need to be wired separately.Isolation relays must be used in parallel connection of multiple actuators using a commoncontrol signal inputs. The relays should be DPDT.Isolation relays are required in parallel applications. The reason parallel applications needisolation relays is that the motor uses two sets of windings, one for each direction. When one is energized to turn the actuator in a specific direction a voltage is generated in the other due to the magnetic field created from the first. It’s called back EMF. This is not an issue with one actuator because the voltage generated in the second winding isn’t connected to anything so there is no flow. On parallel applications without isolation, this EMF voltage energizes the winding it is connected to on the other actuators in the system, the actuators are tying to turn in both directions at once. The EMF voltage is always less than the supply voltage due to the resistance of the windings, so while the actuator still turns in the commanded direction, thedrag from the other reduces the torque output and causes overheating.Warning! Live electrical components!During installation, testing, servicing and troubleshooting of this product, it may be necessary to work with live electrical components. Have a qualified licensed electrician or other individual who has been properly trained in handling live electrical components perform these tasks.SY8-230MFTFailure to follow all electrical safety precautions when exposed to live electrical components could result in death or serious injury.Wiring diagramsElectrical installation。