半导体WB制程 SSB线弧

Stand-off Stitch Bondturbo Software Part Number 01488-8019-801-## plus Software Part Number 01488-8104-801-##The information in this document is the property of Kulicke & Soffa Industries, Inc. Any reproduction, publication or distribution to a third party is strictly forbidden unless written permission is given by an authorized agent of Kulicke & Soffa.Pre m ium Proc e ssGold Ball BonderPREMIUM PROCESS USER'S GUIDETable of Contents Stand-off Stitch Bond Process P REMIUM P ROCESS (3)x D EMONSTRATION D ISKETTEI NTRODUCTION (4)x F EATURES AND B ENEFITSx P ROCESS S EQUENCEStandoff-Stitch Bond process Sequence (4)P ARAMETERS AND MENU’S (6)G ETTING S TARTED (8)S AMPLE A PPLICATION (9)F EATURES S UPPORTED (10)Premium Process Stand-off Stitch BondWhat is a Premium Process?In an effort to meet your complex and dynamic bonding requirements, K & S offers a number of Premium Processes. In most cases, these processes are available as convenient software only enhancements that add significant capability to your existing and new wire bonders without hardware change-over expense or downtime.Many of these Premium Processes for the 1488turbo and 1488plus, require a Site License and activation at our factory. Please contact your K & S representative for literature, Demonstration Software, or Site License pricing for Stand-off Stitch Bond (SSB) or any of these other Premium Process:N BGA 1N BGA2AN Fine Pitch VLLN Gold Ball BumpingN Heavy Wire (hardware & software)N J-WireN LDLP Loop (Low Downset/Long-wire)N SR Loop (Strain-Relief)Demonstration DisketteA free Demonstration diskette (Demo Disk) of this Premium Process is available for temporary use from the floppy drive. It is fully functional operating software, except that it must be operated from A: (floppy) Drive and cannot be copied to the bonder's C: (hard) Drive. Please contact your local K&S representative for details.Introduction Stand-off Stitch BondThe Stand-off Stitch Bond (SSB) Software Premium Process Option provides a new looping process to 7-xx-9-04b or newer 1488-series Operating Software specifically designed for die to die wire bonding applications. This new process adds a bump bond to the wire cycle under the loop second bond crescent on the bond pad. See process sequence following.Features and Benefitsx Increased Process CapabilityNew SSB looping process provides reliable die to die wire bonding capability formultiple die packages.x Higher YieldsNew SSB looping process provides solutions to the problems associated with wire bonding die to die. The capillary does not contact the bond padeliminating possible bond pad damage and the wire is elevated above the diesurface eliminating possible wire shorts to the die.Kulicke and Soffa Industries Inc.Standoff - Stitch Bond Process Sequence1.Bond padDevice 1Device 22.Device 1Device 2Capillary descends and bonds the ball tothe die pad of Device 2.Capillary raises to clear ball, then shifts to +/-programmed capillary offset and makes a correction forthe “wire approach angle”.3.Device 1Device 2(-) Capillary Offset4.Device 1Device 2Capillary descends and forms stitch bond ontop of the ball. The diagram displays anapprox. 2 mil negative Capillary OffsetCapillary raises and tears the wire at the tailbond. Standoff Ball formation is complete.EFO fires and forms ball.Introduction Stand-off Stitch BondStandoff - Stitch Bond Process SequencecontinuedKulicke and Soffa Industries Inc.8.Device 1Device 27.Device 1Device 2Capillary descends and forms stitch bond on top of the Standoff Ball.Capillary raises and tears the wire at the tailbond. EFO firs and forms ball. Cycle repeats until all die to die wire bonds are placed.5.Device 1Device 26. Device 1Device 2(+) Capillary OffsetCapillary descends and bonds the ball to the bond pad of Device 1.Capillary raises and moves to the Standoff Ball position.The second bond position is controlled by the +/- programmable offset. The diagram displays an approx. 2 mil positive Capillary OffsetParameters & Screens Stand-off Stitch BondNew Parametersx Auto Stand-off Stitch - ON/OFFx Enables or Disables SSB routinex Capillary offset - tenth mils ( -50 -100 )x Sets positions of “Offset” for bonds 2 & 4 (refer to Bond Process Sequence).x Negative value moves towards 1st device.x Positive value moves away from 1st device.x Bonds per Wirex Sets the number of bonds per wire. For SSB, 4 bonds are required. Note that this parameter will automatically be set to 4 when SSB is enabled.Stand-off Stitch Bond ScreensEDIT AUTO TEACH SELECTIONS NO PPPress ACCEPT to continue when doneAuto stand-off stitch ----- ON/OFF ---------------------------------->D>Auto Flat Length Calc ------ ON/OFF ---------------------------------->E>EDIT WIRE GROUP FUNCTIONS NO PPStart new wire group ------------------------------------------------------>B>Start new VLL scan here ----------------------------------------------- ->C>Change Bonds per Wire ----------------- 4 --------------------------->D>(starts new wire group)x Note when SSB process is enabled, bonds per wire will automatically be set to 4, no need to enter manually.Parameters & Screens Stand-off Stitch Bond x When teaching bond positions with stand-off stitch enabled, the screen will look as follows:EDIT TEACH BOND 3 OF 4 WIRE # 1NOPPof Stand-off StitchSite: 1Pad Find: OFFPKG #1GRP #1X = 1123FRM DIE Y = 1856TO DIE>DIE>DIE z = -533GRP GC WBMSx The display indicates teaching bond 3 of 4 of stand - off Stitch.x The display indicates teaching from DIE to DIE to DIE to DIE.Impact ParametersEDIT PK: 1 GP: 1 WR: 1 BN: 2 PARMS NO PPLOOP; LF2 Standard BOND: DefaultSCAN: Prev Next To ChangeIMPACT PROFILE --------------350------------------------------------------>A>grams(50-750)IMPACT TIME -----------------------0------------------------------------------>B>no units(0-250)CAPILLARY OFFSET ---------- -15 -------------------------------------- >D>tenth-mils(-50-100)Getting Started Stand-off Stitch BondThe Stand-off Stitch Bond process can be programmed on an individual wire, group of wires or all wires basis. For each SSB wire there are 4 bonds, however only two wire bonding or loop bond locations are taught, bonds 3 and 4.Bump Bonds 1 & 2x Bond 1 is the 1st bond of the bump and is automatically referenced to the taught position of bond 4.x Bond 2 is placed on top of bond 1 in order to flatten bumpx Bond 2 position is shifted from bond 1 position by bond 2 capillary offset value Loop Bonds 3 & 4x Bond 3 is the 1st bond of the loopx Bond 4 is the 2nd bond of the loop and is placed on top of the flattened bump x Bond 4 position controlled by the capillary offset valueBall Size Ratiox BSR at 1st bond sets the ball size for the loopx BSR at 3rd bond sets the ball size for the bump bondTo Teach /Enable SSB Wires1. In Edit/Teach “AUTO TEACH SELECTIONS” set “AUTO STAND OFF STITCH” ON.2. Teach loop bond locations of SSB wires as normal.x These wires are taught as bonds 3 & 4x Enter looping parameters at bond 3x To modify bump bond parameters (1 & 2) you must complete teaching bond program, end wire entry then enter EDIT ” Inspect/modify bond program”.3. End wire entry or start new wire group.4. To include wires without SSB start a new wire group and turn “AUTO STAND-OFFSTITCH” OFF. The operator will now enter bonds 1 & 2 for the non SSB wires and “BONDS PER WIRE” parameter will automatically be set to 2.Sample Application Stand-off Stitch Bond Description: Dual die packageLoop type: LF2 StandardWire type: AFW, AW-14, 1 MILCapillary: Micro Swiss 414FA-0510-335Machine: 1488 PLUSSoftware Version: 7-11-9-04BONDING PARAMETERS:BOND 1BOND 2BOND 3BOND 4 TIP OFFSET 70 60 70 50 BOND VELOCITY 40 60 60 60 BOND TIME 20 10 20 15 BOND POWER 40 40 40 55 BOND FORCE 20 45 25 50 LOOPING PARAMETERS:BOND 1BOND 2BOND 3BOND 4 LOOP TYPE 1 N/A 1 N/A LOOP HEIGHT 100N/A 75 N/A DELTA LOOP 0N/A 0N/A KINK HEIGHT 82N/A 64 N/A REVERSE LOOP 0N/A 55 N/A LOOP FACTOR 100 N/A 121N/A LOOP FACTOR 2 10N/A 10 N/A LOOP FACTOR 4 75N/A 75 N/A CAPILLARY OFFSET N/A -15 N/A 15 BALL SIZE PARAMETERS:BOND 1BOND 3BALL SIZE RATIO 1.75 2.20TAIL LENGTH EXT 100 100CONTACT THRESHOLD 25 25EFO GAP 15 15USG BLEED 0 0Features Supported Stand-off Stitch Bond Standoff Stitch Bond Process is a part of Integrated Operating Software which Supports most Standard 7-03 and 7-11 Features, including:N Material Handling System (MHS)2803-Smart Card Indexer2810-Lead Frame MHS2920-Programmable MHS2881-Singulated Boat Style MHS 2884-SIP Style MHS 2992-SnapcureN The latest hardware options(i.e.; MTC, jam sensor, BGA Optics, low-pressure and low-vacuum detection, Flex-Line)N Enhanced processes(i.e.; Kinetic 2nd Bond, Step & Repeat,)N The latest software options(i.e.; Configurable Lockouts and alarms, 20 character names)N Auto VLL TeachN 1.53, 1.54, 1.55 1488/turbo PRS software support1.65 1488plus PRS software supportN Fine Pitch VLL (software option)N AIM (inspection hardware/software option) (only on the turbo)Note: Refer to the appropriate "Software Change Summary ", for a current list of options available on your particular revision of operating software.。