Semiconductor manufacturing process
１．Cleaning (洗净)
Silicon wafer ２．Deposition (成膜)
(CVD法/熱酸化法
３．Photoresist Coating(涂怖光阻
(Spin coater)
光光Photo mask ４．Expouse (暴光)光掩膜
(Stepper)
５．Developing (显影)
(Developer)
６．Etching (蚀刻)
７．不純物注入
(离子(ion)注入法、拡散法)
８．Resist stripping (剥离)
(Stripper)
以上１～(７)、８を繰返し、回路Patternを形成する。
反复操作以上1到(7)，8程序，形成回路Pattern。
１．Cleaning (洗净) machine
WET bench ２．Deposition (成膜)
(CVD 法/熱酸化法等)
３．Photoresist Coating (涂怖光阻)
(Spin coater)
４．Expouse (暴光)
(Stepper)
５．Developing ( (Developer)
６．Etching (蚀刻)
WET bench
７．不純物注入
(离子(ion)注入法、拡散法)
８．Resist stripping (剥离)
(Stripper)
