ConsumerDRAM_code

SRAM
Part Number
Density Process
Org.
Pkg-Pins Vdd Status *1
TC55NEM208AFPN 4Mbit 0.15µm
TC51WHM616AXBN 64Mbit 0.175µm 4Mx16 2.7 BGA(8x11) MP
TC51WKM616AXBN 64Mbit 0.175µm 4Mx16 1.8 BGA(8x11) MP
TC51WHM716AXBN 128Mbit 0.175µm 8Mx16 2.7 BGA(9x12) MP
128MB
MP
SLC
Premium, I temp., lead-free
THNCF256MMG
256MB
MP
MLC
Standard, lead-free
THNCF256MDG
256MB
MP
SLC
Premium, lead-free
THNCF256MDGI
256MB
MP
SLC
Premium, I temp., lead-free
High Performance DRAM (High Speed)
DRAMΒιβλιοθήκη FCRAMXDRSeptember 2004 Toshiba America Electronic Components
TOSHIBA
File Memory Products
NAND flash is highest density non-volatile memory available today. Typically used in mass storage applications such as memory cards, USB drives, and solid-state storage systems. Low voltage NAND and BGA packages are also available.

1.QC : quality control 品质管制2.IQC : ining quality control 进料品质管制3.OQC : output quality control 出货品质管制4.PQC : process quality control 制程品质管制也称IPQC : in process quality control .5 AQL : acceptable quality level 允收标准6.CQA: customer quality assurance 客户品质保证7.MD : major defeat 主要缺点8. MI : minor defeat 次要缺点9. CR :critical defeat 关踺缺点10. SMT : surface mounting technology 外表粘贴技术11 . SMD : surface mounting device SMC : surface mounting ponent 外表粘贴元件12 . E : engineering change notice 工程变更通知13 . D : design change notice 设计变更通知14 . PCB : printed circuit board 印刷电路板15 . PCBA : printed circuit board assembly装配印刷电路板16 . BOM : bill of material 材料清单17. BIOS : basically input and output system 根本输入输出系统18. MIL-STD-105E : 美国陆军标准,也称单次抽样计划.19 . ISO : international standard organization 国际标准化组织20 . DRAM: 内存条21 . Polarity : 极性22 . Icicles : 锡尖23 . Non-wetting : 空焊24 . Short circuit : 短路25 . Missing ponent : 缺件26 . Wrong ponent : 错件27 . Excess ponent : 多件28 . Insufficient solder : 锡少29 . Excessive solder : 锡多30 . Solder residue : 锡渣31 . Solder ball : 锡球32 . Tombstone : 墓碑33 . Sideward : 侧立34 . ponent damage : 零件破损35 . Gold finger : 金手指36 . SOP : standard operation process 标准操作流程37 . SIP : standard inspection process 标准检验流程38 . The good and not good segregation :良品和不良品区分39 . OBW : on board writer 熸录BIOS40 . Simple random sampling : 简单随机抽样41 . Histogram : 直方图42 . Standard deviation : 标准差43 . CIP : Continuous improvement program44 . SPC : Statistical process control45 . Sub-contractors : 分包商46 . SQE : Supplier quality engineering47 . Sampling sample :抽样计划48 . Loader : 治具49 . QTS: Quality tracking system 品质追查系统50 . Debug : 调试51 . Spare parts :备用品52 . Inventory report for : 库存表53 . Manpower/Tact estimation 工时预算54 . Calibration : 校验55 . S/N :serial number 序号56 . Corrugated pad : 波纹垫57 .Takeout tray : 内包装盒58 . Outerbox : 外包装箱59 . Vericode : 检验码60 . Sum of square : 平方和61 . Range : 全距62 . Conductive bag : 保护袋63 . Preventive maintenance :预防性维护64 . Base unit : 基体65 . Fixture : 制具66 . Probe : 探针67 . Host probe : 主探针68 . Golden card : 样本卡69 . Diagnostics program : 诊断程序70 . Frame : 屏面71 . Lint-free gloves : 静电手套72 .Wrist wrap : 静电手环73 . Target value : 目标值74. Related department : 相关部门75. lifted solder 浮焊76.plug hole孔塞77. Wrong direction 极性反78.ponent damage or broken 零件破损79.Unmeleted solder熔锡不良80.flux residue松香未拭81.wrong label or upside down label贴反82.mixed parts机种混装83. poor solder mask绿漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor课长88. Forman组长89. WI=work instruction作业指导90. B.P.V:非擦除状态91. Internal notification:内部联络单92. QP :Quality policy品质政策93.QT: Quality target 品质目标94. Trend:推移图95.Pareto:柏拉图96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心线99.R.T.Y: Rolled throughout yield直通率100. PPM: Parts per million 不良率101.DPU: Defects per unit 单位不良率102.Resistor: 电阻 103.Capacitor:电容104. Resistor array : 排阻105. Capacitor array: 排容106. DIODE: 二极管107.SOT: 三极管108. Crystal:震荡器109. Fuse:保险丝110.Bead: 电感111.Connector:联结器112.ADM: Administration Department行政单位113. CE: ponent Engineering零件工程114. CSD :Customer Service Department客户服务部115. ID: Industrial Design工业设计116.IE: Industrial Engineering工业工程117. IR: Industrial Relationship工业关系118. ME: Mechanical Engineering机构工程119. MIS :Management Information System资讯部120. MM: Material Management资材121. PCC: Project Coordination/Control专案协调控制122. PD: Production Department生产部123. PE: Product Engineering产品工程124. PM: Product Manager产品经理125. PMC: Production Material Control生产物料管理126. PSC: Project Support & Control产品协调127.Magnesium Alloy:镁合金128. Metal Shearing:裁剪129.C Contract Electronics Manufacturing 又称电子制造服务企业EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procurement , production ,Logistics and sales采购,生产,后勤管理与市场行销的融合EAI: Enterprise application Intergration 企业应用系统整合CRM: Customer Relationship Planning 客户服务规划 SCM : Supply chain management 供给链管理131. OJT: On job training 在职培训 132.Access Time: 光碟搜寻时间133. B2CEC:Business to consumer electronic merce 企业对消费者的电子商务B2BEC:Business to business electronic merce 企业间的电子商务L:Copper Clad Laminate 铜箔基板 135. Intranet: 企业内部通讯网路136. ISP: Internet Service Provider网络服务提供者 ICP: Internet Content Provider网络内容提供者137. GSM: Global System for Mobile munication 泛欧数位式行动系统 GPS: 全球卫星定位系统138. Home Page: 网路首页139.Video Clip:影像档140.HTML:超文标记语言141.Domainname: 网域名称142.IP: 网络网域通讯协定地址143.Notebook:笔记型电脑144.VR:Virtual Reality虚拟实境145.WAP:Wireless Application Protocol 无线应用软体协定146. LAN : Local area network区域网路 : World Wide Web世域网 WAN: Wide Area Network 广域网路147.3C: puter, munication , Consumer electronic 电脑, 通讯, 消费性电子三大产品的整合rmation Supplier Highway:信息高速公路149.UPS:Uninterrupted power system不断电系统150.Processed material: 流程性材料151.Entity/It实体152.Quality loop:质量环153.Quality losses: 质量损失154.Corrective action:纠正措施155. Preventive action:预防措施156.PDCA:Plan/Do/Check/Action计划/实施/检查/处理157. Integrated circuits(IC):集成电路158.Application program:应用程序159.Utilities:实用程序160.Auxiliary storage/Second storage:;辅助存储器161.Silicon chip:硅片162Diskette drive:软驱163.Display screen/Monitor:显示器164.Foreground:前面165.Montherboard:母板166.Mermory board:内存板167.Slot:插槽168.Bus:Data-bus/address-bus/Control bus:总线/数据总线/地址总线/控制总线169.Plotter:绘图170.MPC:Multimedia personal puter多媒体171.Oscillator:振荡器172.Automatic teller terminal:自动终端(出纳)机173.Joystick port:控制端口174.VGA: Video Graphics Array显示卡175.Resolution:分辨率176.Register:存放器177.ISA: Industry Standard Architecture:工业标准结构178.EISA:Extended Industry Architecture179.Adapter: 适配器180.Peripheral:外部设备 181.Faxmod调制解调器181.NIC:Network interface card网络接口卡182.SCSI:Small puter system interface183.VESA:Video Electronic Standards Association184.SIMM:Single in-line memory module单排座存储器模块(内存条)185.Casing:外箱 186.Aluminum:铝质187.Ceramic: 陶瓷的188.Platter:圆盘片189.Actuator:调节器 190.Spindle:轴心191.Actuation arm: 存取臂192.Default code: 缺省代码193.Auxiliary port:辅助端口194. Carriage return : 回车195.Linefeed:换行196.ASCII:American Standard Code for Information Interchange197.Video analog: 视频模拟198.TTL:Transistor- Transistor logic晶体管-晶体管逻辑电路 199.Three-prong plug:三芯电插头200.Female connector:连接插座201.Floppy disk:软盘202.Output level:输出电平203.Vertical/Horizontal synchronization:场/行同步204.H(Horizontal)-Phase:行相位205.patible:兼容机206.Hardware Expansion Card: 硬件扩大卡207.Buffer:缓冲208.CRM:Customer relationship Management 客户关系管理209.WIP: Work in process半成品 210.Waiver:特别采用211.CXO系列—CEO: Chief Executive Office首 COO :Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer212.NASDAQ: 纳斯达克证券市场NASDAQ Automated Quotation system 213.VC:Venture Capital 风险投资214.PDA:Personal Date Assistant个人数字助理 PLA: Personal Information Assistant个人信息助理215.PPAP:Advanced Product Quality Planning and Control Plan 生产性零组件核准程序216.FMEA:Protentical Failure Mode and Effects Analysis失效模式与效应分析217.MSA: Measurement Systems Analysis 量测系统分析218.QAS:Quality System Assessment 品质系统评鉴 219.Cusum: 累计总合图220.Overall Equipment Effectiveness: 设备移动率221.Benchmarking: 竞争标竿 Analysis of motion/Ergonomics:动作分析/人体工程学222.Roka Yoke : 防错法 MCR: machine capability ratio 机器利用率223.Mistake Proofing 防呆法 Taguchi methods: 田口式方法224.Vertical integration: 垂直整合 Surveillance: 定期追踪审查225.EMS: Electronics Manufacturing Supply-chain226.Cause&Effects charts: 特性要因图227.Scattle: 散布图 Fool-Proof Syst 防呆系统228.VE:value Engineering: 价值工程 QFP:Quality Function Development: 品质机能展开229.Arrow Chart : 箭头图法 Affiliate Chart: 亲和图法230.PDPC:Process Decision Program Chart System Chart: 系统图法231.Relation Chart : 关边图法 Matrix Chart: 矩阵图法232.Matrix Data Analysis: 矩阵数据分析法234.Brain-storm :脑风暴法 JIT: Just In Time: 与时性生产模拟235.Deming Prize: 戴明奖 Prototype: 技术试作236 BPM:Business Process Management :.业务流程管理 MBO: 目标管理237. MBP: 方针管理 FTA: 故障树分析 QSCV: 服务品质238.IPPB:Information 情况 Planning: 策划 Programming: 规划 Budget: 预算239.EQ:Emotion Quotient: 情商 IQ: Intelligence Quotient:智商240.Implied Needs: 隐含要求 Specified Requirement: 规定要求241.Probation: 观察期 Ining Product released for urgent production 紧急放行242.Advanced quality planning : 先进的质量策划243. AOQ: Average Outgoing Quality 平均检出质量 AOQL: Average Outgoing Quality Limit 平均检出质量界限244.Approved Supplier List : 经核准认可的供给商245.Attribute date: 特征 Benchmarking: 基准点 Calibration: 校准246.Capable process: 工序能力 Capability Index: 工序能力指数 Capability ratio : 工序能力率247.CHANGE CYCLE TIME : 修改的时间周期 Continuous improvement 持续改良248. Control plans : 控制策划 Cost of quality 质量本钱249. Cycle time reduction: 减少周期时间250. Design of experiments: 实验设计 Deviation / Substitution : 偏差 / 置换251. ESD: Electrostatic discharge 静电释放252. EH&S: Environmental, Health, and Safely 环境,健康.安全253. ESS: Environmental Stress Screening 环境应力筛选254. FMEA: Failure Mode Effect Analysis 失误模式效应分析255. First Article approval : 产品的首次论证 First pass yield 一次性通过的成品率256. First sample inspection: 第一次样品检验257. FMECA: Failure mode effect and critically analysis 失误模式,效应与後果分析258. Gauge control: 测量仪器控制 GR&R: Gauge repeatability and reproducibility 测量仪器重复性和再现性259. HALT: Highly Accelerated Life Test 高加速寿命试验HAST: Highly Accelerated Stress Test 高加速应力试验260. IN-CONTROL PROCESS 受控制工序261. INDUSTRIAL AVERAGE 工业平均数262. JIT (just in time) manufacturing (即时)制程263. Key characteristic 关健特征 Key ponent 关健构件264. Life Testing 寿命试验 Lot traceability 批量可追溯性265. Material review board 原材料审查部门 MCR: machine capability ratio 机械能力率266. NONCONFORMANCE 不符合267. OUT-OF-CONTROL PROCESS 失控工序268. Pilot Application 试产(试用)269. PPM: Parts per million 百万分之一270. Preventive vs detection 预防与探测 Preventive maintenance 预防维护271. Process capability index 工序能力指数272. Process control 工序控制 Process improvement 工序改良 Process simplification 过程简化273. Quality Clinic Process Chart (QCPC) 质量诊断过程图274. Quality information system 质量资料体系275. Quality manual 质量手册 Quality plan 质量计划 Quality planning 质量策划276. Quality policy 质量方针 Quality system 质量体系277. Reliability 可靠性 RUN Chart 趋势表 Skill Matrix 技能表278. Statistical quality control (SQC) 统计质量控制279. Teamwork 团队工作280. Total quality management 全面质量管理281. Variable data 变量数据 Variation 影响变量282. value Analysis 价值分析 Visual Factory 形象化工厂283. Survey Instructions 调查指引284. Profile 概况285. Improvement Plan 改良计划286. Evaluation 评估 Implementation 实施 pliance 符合287. Supplier Audit Report 供方审核报告 Site Audit 现场审核 Typical agenda 典型的议事日程Internal and external failure costs 内部和外部的失误本钱 Failure rate percentage 失误百分率288. Productivity (output / input) 生产率(产出/投入) Customer plaints 客户投诉 Customer satisfaction indices 客户满意度指数 Root cause analysis of failures 失误根原分析289. SFCS:Shop floor control system Nominal:名目的 Enumeration: 列举 Screening stage: 筛选阶段290. Screening materials: 屏蔽材料 Nonparametric parative experimental: 非参数实验 Pitfall: 缺陷291. Fractional factorial experiments: 部份随机实验 Management by munication: 沟通管理技术292. Management by objective: 目标管理技术 Management by result: 绩效管理技术293. Human relationship skill: 人际技术 Conceptial skill: 理念性技术 Safety stock: 安全库存294. lead time: 订购前置时间 EOQ: Economic order Quantity 经济订购量 Run at rate: 节拍生产295. Early production containment : 早期生产管制程序 Accreditation Body: 认可机构 Active part : 在用零件296. Aftermarket part: 售后零件 Analysis of Motion/Ergonomics: 运动/人机工程学分析297. Finite Element analysis: 有限元分析 Geometric Dimensioning & Tolerancing: 几何尺寸与公差298. Match check: 匹配检查 Last off part parison: 末件比拟 Simulation Techniques: 仿真技术299. Solid Modeling: 实体造型 Layout Inspection: 全尺寸检验 Service Parts: 维修零件300. Remote location: 外部场所 Overall Equipment effectiveness: 设备总效率301. PPAP: production part approval process: 生产件批准程序Bulk material: 散装材料Perishable Tools: 易损工装302. Growth Projections: 企业营运成长企划 Projected Sales figures: 行销企划蓝图303. Human resource development: 人力资源开发 Feasibility Reviews: 可行性审查 Pre-launch: 量产前304. Unscheduled machine downtime: 非计划排定的停机时间 Excessive cycle time: 作业周期时间过多305. Non value-added use of floor space: 工厂内的无附加价值事项306. New Target values to Optimized customer process: 将顾客作业程序管理到最好的新目标值Misshipments: 耽误出货307. Inplete orders: 交货不足 Inventory turns over time: 存货周转时间 Stock rotation : 存货周转 Inventory levels: 最低库存量308. Order-drive: 订单导向 Interim action: 临时措施 Permanent action: 永久措施 Integrators: 组合体。

计算机专业英语缩写表AAAT(Average Access Time) 平均存取时间ACL(Access Control Lists)访问控制表ACK(acknowledgement character )确认字符ACPI (Advanced Configuration and Power Interface)高级配置和电源接口ADC(Analog to Digital Converter) 模数转换器ADSL(Asymmetric Digital Subscriber Line)非对称用户数字线路ADT(Abstract Data Type) 抽象数据类型AGP(Accelerated Graphics Port)图形加速端口AI( Artif icial Intelligence)人工智能AIFF(Audio Image File Format)声音图像文件格式ALU(Arithmetic Logical Unit) 算术逻辑单元AM(Amplitude Modulation)调幅ANN(Artificial Neural Network) 人工神经网络ANSI( American National Standard Institute)美国国家标准协会API(Application Programming Interface)应用程序设计接口APPN(Advanced Peer-to-Peer Network)高级对等网络ARP(Address Resolution Protocol )地址分辨/ 转换协议ARPG(Action Role Playing Game)动作角色扮演游戏ASCII (American Standard Code for Information Interchange)美国信息交换标准代码ASP(Active Server Page)活动服务器网页ASP( Application Service Provider)应用服务提供商AST( Average Seek Time)平均访问时间异步传输模式ATM(asynchronous transfer mode)．ATR (Automatic Target Recognition) 自动目标识别A VI (Audio Video Interleaved)声音视频接口BB2B(Busines s to Business)商业机构对商业机构的电子商务B2C(Business to Consumer)商业机构对消费者的电子商务BBS(bulletin board system)电子公告牌系统BER(Bit Error Rate)误码率BFS (Breadth First Search) 广度优先搜索BGP(Border Gateway Protocol )边缘网关协议BIOS(basic input / output system)基本输入输出系统BISDN(Broadband- Integrated Services Digital Network)宽带综合业务数字网BLU(Basic Link Unit)基本链路单元BOF(Beginning Of File)文件开头BPS(Bits Per Second)每秒比特数BRI(Basic Rate Interface)基本速率接口BSP(Byte Stream Protocol )字节流协议BSS(Broadband Switching System)宽带交换系统CCAD(Computer Aided Design)计算机辅助设计CAE(Computer-Aided Engineering)计算机辅助工程CAI(Computer Aided Instruction)计算机辅助教学CAM(Computer Aided Manufacturing)计算机辅助管理CASE(Computer Assisted Software Engineering)计算机辅助软件工程CAT(Computer Aided Test)计算机辅助测试有线电视CATV(Community Antenna Television)．CB( control bus)控制总线CCP(Communication Control Procrssor)通信控制处理机CD（Compact Disc）压缩光盘，只读光盘CD-R（Compact Disc-Recordable）可录光盘，只写一次的光盘CDFS(Compact Disk File System)密集磁盘文件系统CDMA（Code Division Multiple Access）码分多路访问CD-MO(Compact Disc-Magneto Optical )磁光式光盘CD-ROM( compact disc read-only memory)只读光盘CD-RW( compact disc rewritable)可读写光盘CGA(Color Graphics Adapter )彩色显示器CGI( common gateway interface)公共网关接口CI(Computational Intelligence)计算智能CISC (Complex Instruction Set Computer) 复杂指令集计算机CMOS（Complementary Metal Oxide Semiconductor）互补金属氧化物半导体存储器COM(Component object model)组件对象模型CORBA(Common Object Request Broker Architecture)公共对象请求代理结构CPU( central proces sing unit)中央处理单元CRC( cyclical redundancy check)循环冗余校验码CRM(Client Relation Management)客户关系管理CRT(Cathode-Ray Tube)阴极射线管,显示器CSMA (Carrier Sense Multi -Access)载波侦听多路访问CSU（Channel Service Unit）信道服务单元CU（Control Unit）控制单元D数模转换器DAC(Digital to Analogue Converter)．DAO(Data Access Object)数据访问对象DAP(Directory Acces s Protocol )目录访问协议DBMS(Database Management System)数据库管理系统DCE(data communication equipment)数据通信设备DCE(Distributed Computing Environment)分布式计算环境DCOM( Distributed COM)分布式组件对象模型DDB(Distributed DataBase)分布式数据库DDE(Dynamic Data Exchange)动态数据交换DDI( Device Driver Interface)设备驱动程序接口DDK(Driver Development Kit)驱动程序开发工具包DDN(Data Digital Network)数据数字网DEC(Digital Equipment Corporation)数字设备公司DES( Data Encryption Standard)数据加密标准DFS(Depth First Search) 深度优先搜索DFS(Distributed File System(Windows 2000) )分布式文件系统DHCP( Dynamic Host Configuration Protocol )动态主机配置协议DIB(Dual Independent Bus)双独立总线DIC(Digital Image Control)数字图像控制DLC（Data Link Control）数据链路控制DLL(Dynamic Link Library)动态链接库DLT（Data Link Terminal）数据链路终端DMA(Direct Memory Acces s)直接内存访问DMSP(Distributed Mail System Protocol )分布式电子邮件系统协议DNS(Domain Name System)域名系统文档对象模型DOM(Document Object Mode)．DOS( Disk Operation System)磁盘操作系统DQDB (Distributed Queue Dual Bus) 分布式队列双总线DRAM（Dynamic Random Access Memory）动态随机存取存储器DSD（Direct Stream Digital）直接数字信号流DSL(Digital Subscriber Line)数字用户线路DSM(Distributed Shared Memory)分布式共享内存DSP( Digital Signal Processing)数字信号处理DTE( Data Terminal Equipment)数据终端设备DVD( Digital Versatile Disc )数字多功能盘DVD-ROM（DVD-Read Only Memory）计算机用只读光盘DVI (Digital Video Interactive)数字视频交互EEC（Embedded Controller）嵌入式控制器EDIF (Electronic Data Interchange Format) 电子数据交换格式EEPROM(Erasable and Electrically Programmable ROM)电擦除可编程只读存储器EGA(Enhanced Graphics Adapter)彩色显示器,分辨率为640×350 ,可以显示16 种颜色EGP(External Gateway Protocol)外部网关协议EISA(Extended Industry Standard Architecture)增强工业标准结构EMS(Expanded Memory Specification)扩充存储器规范EPH(Electronic payment Handler )电子支付处理系统EPROM(Erasable Programmable ROM)可擦除可编程只读存储器ERP(Enterprise Resource Planning)企业资源计划ETM(ExTended Memory)扩展存储器F文件分配表FAT(File Allocation Table)．FCB(File Control Block)文件控制块FCFS(First Come First Service)先到先服务FCS(Frame Check Sequence)帧校验序列FDD(Floppy Disk Device)软盘驱动器FDDI(Fiber-optic Data Distribution Inter face)光纤数据分布接口FDM(Frequency-Division Multiplexing)频分多路FDMA(Frequency Division Multiple Address)频分多址FEC (Forward Error Correction) 前向纠错FEK(File Encryption Key)文件密钥FEP(Front Ef fect Processor )前端处理机FET（Field Effect Transistor）场效应晶体管FIFO(First In First Out)先进先出FM（Frequency Modulation）频率调制FPU（Float Point Unit）浮点部件FRC(Frame Rate Control )帧频控制FTAM(File Transfer Access and Management)文件传输访问和管理FTP(File Transfer Protocol)文件传输协议GGAL(General Array Logic)通用逻辑阵列GCR（Group-Coded Recording）成组编码记录GDI( Graphics Device Interface)图形设备接口GIF(Graphics Interchange Format)一种图片文件格式,图形转换格式GIS( Geographic Information System)地理信息系统GPI( Graphical Programming Interface)图形编程接口通用接口总线GPIB(General Purpose Interface Bus)．GPS(Global Positioning System)全球定位系统GSX( Graphics System Extension)图形系统扩展GUI(Graphical User Interface)图形用户接口HHDC(Hard Disk Control )硬盘控制器HDD(Hard Disk Drive)硬盘驱动器HDLC(High-level Data Link Control )高级数据链路控制HDTV（High-Defination Television）高清晰度电视HEX(HEXadecimal )十六进制HPFS（High Performance File System）高性能文件系统HPSB (High Performance Serial Bus) 高性能串行总线HTML(Hyper Text Markup Language)超文本标记语言HTTP(Hyper Text Transport Protocol)超文本传输协议IIAC(Inter-Application Communications)应用间通信IC（Integrated Circuit）集成电路ICMP( Internet Control Mes sage Protocol)因特网控制消息协议ICP( Internet Content Provider)因特网内容服务提供商,是ISP中提供信息服务的一种机构IDC( International Development Center)国际开发中心IDE( Integrated Development Environment)集成开发环境IDL( Interface Def inition Language)接口定义语言IEEE( Institute of Electrical and Electronics Engineering)电子电器工程师协会IGP (Interior Gateway Protocol) 内部网关协议IIS( Internet Information Service)因特网信息服务因特网协议IP( Internet Protocol)．IPC( Inter-Proces s Communication)进程间通信IPSE( Integrated Project Support Environments)集成工程支持环境IPX(Internet Packer Exchitecture)互联网报文分组交换ISA( Industry Standard Architecture)工业标准结构,是IBM PC/ XT总线标准ISDN( Integrated Service Digital Network)综合业务数字网ISO ( International Standard Organization)国际标准化组织ISP( Internet Service Provider )因特网服务提供者IT (Information Technology) 信息技术ITU( International Telecom Union)国际电信联盟JJDBC(Java Database Connectivity) J ava数据库互联JPEG(Joint Photographic Experts Group)联合图片专家组JSP(Java Server Page) J ava 服务器页面技术JVM(J ava Virtual Machine)J ava虚拟机KKB(Kilobyte)千字节KBPS(Kilobits Per Second)每秒千比特KMS( Knowledge Management System)知识管理系统LLAN(Local Area Network)局域网LBA（Logical Block Addressing）逻辑块寻址LCD(Liquid Crystal Display)液晶显示器LDT（Logic Design Translator）逻辑设计翻译程序LED(Light Emitting Diode)发光二极管）后进先出Last In First Out（LIFO．LP（Linear Programming）线性规划LPC(Local Procedure Call)局部过程调用LSIC(Large Scale Integration Circuit)大规模集成电路MMAC(Medium Access Control )介质访问控制MAN(Metropolitan Area Network)城域网MBR（Master Boot Record）主引导记录MC(Memory Card)存储卡片MCA(Micro Channel Architecture)微通道结构MDA（Monochrome Display Adapter）单色显示适配卡MFM（Modified Frequency Modulation）改进调频制MIB(Management Information Bass)管理信息库MIDI (Musical Instrument Digital Interface) 乐器数字接口MIMD(Multiple Instruction Stream,Multiple Data Stream)多指令流,多数据流MIPS（Million Instructions Per Second）每秒百万条指令MIS(Management Information System)管理信息系统MISD(Multiple Instruction Stream,Single Data Stream)多指令流,单数据流MMDS(Multi-channel Multipoint Distribution Service)多波段多点分发服务器MMU(Memory Management Unit)内存管理单元MMXMPC(Multimedia PC)多媒体计算机MPEG(Moving Picture Expert Group) 一种视频和音频的国际标准格式MPLS(Multi-Protocol Label Switching)多协议标记交换MPS（Micro Processor System）微处理器系列）平均故障间隔时间Mean Time Between Failures（MTBF．MUD(Multiple User Dimension)多用户空间NNAOC(No-Account Over Clock)无效超频NAT (Network Address Translation) 网络地址转换NC(Network Computer)网络计算机NDIS(Network Device Interface Speci fication)网络设备接口规范NCM(Neural Cognitive Maps)神经元认知图NFS(Network File System)网络文件系统NIS(Network Information Services)网络信息服务NNTP（Network News Transfer Protocol）网络新闻传输协议NOC (Network Operations Center) 网络操作中心NSP(Name Server Protocol )名字服务器协议NTP(Network Time Protocol)网络时间协议NUI（network user identification）网络用户标识OOA(Of f ice Automation)办公自动化OCR（Optical Character Recognition）光学字符识别ODBC(Open Database Connectivity)开放式数据库互联ODI(Open Data- link Interface)开放式数据链路接口OEM( Original Equipment Manufactures)原始设备制造厂家OLE(Object Linking and Embedding)对象链接与嵌入OMG(Object Management Group)对象管理组织OMR(Optical-Mark Recognition)光标阅读器OOM(Object Oriented Method)面向对象方法面向对象程序设计OOP( Object Oriented Programming)．ORB(Object Request Broker)对象请求代理OS(Operating System)操作系统OSI (Open System Interconnect Reference Model)开放式系统互联参考模型OSPF(Open Shortest Path First)开发最短路径优先PPBX(Private Branch Exchange)用户级交换机PCB(Process Control Block)进程控制块PCI(Peripheral Component Interconnect)外部连接互联,是一种局部总线PCM(Pulse Code Modulation)脉冲编码调制PCS (Personal Communications Service) 个人通信业务PDA(Personal Digital As sistant)个人数字助理PDF(Portable Document Format)便携式文档格式PDN(Public Data Network)公共数据网PHP（Personal Home Page）个人网页PIB(Programmable Input Buffer)可编程输入缓冲区PMMU (Paged Memory Management Unit)页面存储管理单元POP(Post Of f ice Protocol )邮局协议POST(Power-On Self -Test)加电自检PPP(Peer-Peer Protocol)端对端协议PPP(Point to Point Protocol)点到点协议PPSN(Public Packed-Switched Network)公用分组交换网PR(Performance Rate)性能比率PROM(Programmable ROM)可编程只读存储器PSN(Processor Serial Number)处理器序列号QQC(Quality Control )质量控制QLP( Query Language Proces sor)查询语言处理器QoS( Quality of Service)服务质量RRAD(Rapid Application Development)快速应用开发RAI(Remote Application Interface)远程应用程序界面RAID(Redundant Array Independent Disk) 冗余列阵磁盘机RARP（Reverse Address Resolution Protocol）反向地址解析协议RAM(Random Acces s Memory)随机存储器RAM(Real Address Mode)实地址模式RAID(Redundant Arrays of Inexpensive Disks)冗余磁盘阵列技术RAS（Remote Access Service）远程访问服务RCP(Remote CoPy)远程复制RDA(Remote Data Access)远程数据访问RDO (Remote Data Objects) 远程数据对象RF (Radio Frequency) 射频，无线电频率RIP(Raster Image Protocol)光栅图像处理器RIP(Routing Information Protocol )路由选择信息协议RISC(Reduced Instruction Set Computer)精简指令集计算机ROM( Read Only Memory)只读存储器RPC(Remote Procedure Call )远程过程调用RPG（Role Play Games）角色扮演游戏RPM（Revolutions Per Minute）转/分RTS( Request To Send)请求发送实时流协议RTSP (Real Time Streaming Protocol)SSACL (System Access Control List) 系统访问控制列表SAF(Store And Forward)存储转发SAP(Service Acces s Point)服务访问点SCSI(Small Computer System Interface)小型计算机系统接口SDLC(Synchronous Data Link Control )同步数据链路控制SDK(Software Development Kit)软件开发工具箱SGML(Standard Generalized Markup Language)标准通用标记语言SHTTP(Secure Hype Text Transfer Protocol )安全超文本传递协议SIMD(Single Instruction Stream,Multiple Data Stream)单指令流,多数据流SISD(Single Instruction Stream,Single Data Stream)单指令流,单数据流SLIP（Serial Line Interface Protocol）串行线路接口协议SMDS(Switch Multi-megabit Data Services)交换多兆位数据服务SMP(Symmetric Multi-Processor)对称式多处理器SMTP(Simple Mail Transport Protocol)简单邮件传输协议SNA(System Network Architecture)系统网络结构SNMP(Simple Network Management Protocol )简单网络管理协议SNR（Signal Noise Ratio）信噪比SNTP(Simple Network Time Protocol )简单网络时间协议SONC(System On a Chip)系统集成芯片SONET(Synchronous Optic Network)同步光纤网SPC(Stored-Program Control)存储程序控制SQL(Structured Query Language)结构化查询语言SRAM（Static Random Access Memory）静态随机存储器战略角色扮演游戏SRPG (Strategies Role Play Games)SSL (Secure Sockets Layer) 安全套接层STDM(Synchronous Time Division Multiplexing)同步时分复用STG(Shoot Game)射击类游戏STP(Shielded Twisted-Pair )屏蔽双绞线SVGA (Super Video Graphics Array) 超级视频图形阵列TTCB(Transmission Control Block)传输控制块TCP(Transmis sion Control Protocol )传输控制协议TCP/ IP(Transmission Control Protocol / Internet Protocol )传输控制协议/ 网间协议TDM(Time Division Multiplexing)时分多路复用TDMA(Time Division Multiplexing Addres s)时分多址技术TDR(Time-Domain Reflectometer)时间域反射测试仪TFT(Thin Film Transistor Monitor)薄膜晶体管显示器TFTP(Trivial File Transfer Protocol)简单文件传送协议TIFF(Tag Image File Format)标记图形文件格式TIG(Task Interaction Graph)任务交互图TLI(Transport Layer Interface)传输层接口TM(Traffic Management)业务量管理，流量管理TPS(Transactions Per Second)（系统）每秒可处理的交易数TSR(Terminate and Stay Resident)终止并驻留TTL(Transistor-Transistor Logic)晶体管—晶体管逻辑电路TWX(Teletypewriter Exchange)电传电报交换机UUART(Universal Asynchronous Receiver Transmitter )通用异步收发器通用磁盘格式UDF(Universal Disk Format)．UDP(User Datagram Protocol )用户数据报协议UHF(Ultra High Frequency)超高频UI(User Interface)用户界面，用户接口UIMS(User Interface Management System)用户接口管理程序UNI (User Network Interface)用户网络接口UPA(Ultra Port Architecture)超级端口结构UPS(Uninterruptible Power Supply)不间断电源URI (Uniform Resource Identi fier )环球资源标识符URL(Uniform Resource Locator)统一资源定位器USB(Universal Serial Bus)通用串行总线UTP(Unshielded Twisted-Pair )非屏蔽双绞线UXGA(Ultra Extended Graphics Array)超强图形阵列VV AD( Virtual Addres s Descriptors)虚拟地址描述符V AGP (Variable Aperature Grille Pitch) 可变间距光栅V AN( Value Added Network)增值网络V AP( Value-Added Process)增值处理V AS(Value-Added Server)增值服务V AX(Virtual Address eXtension)虚拟地址扩充VBR(Variable Bit Rate)可变比特率VC(Virtual Circuit)虚拟线路VCPI( Virtual Control Program Interface)虚拟控制程序接口VDD( Virtual Device Driver s)虚拟设备驱动程序VDR( Video Disc Recorder )光盘录像机视频显示终端VDT( Video Display Terminals)．VDU（Visual Display Unit）视频显示单元VFS( Virtual File System)虚拟文件系统VGA( Video Graphics Adapter )视频图形适配器VHF（Very High Frequency）甚高频VIS( Video Information System)视频信息系统VLAN(Virtual LAN)虚拟局域网VLIW（Very Long Instruction Word）超长指令字VLSI (Very Large Scale Integration)超大规模集成VMS(Virtual Memory System)虚拟存储系统VOD( Video On Demand)视频点播系统VON( V oice On Net)网上通话VPN( Virtual Private Network)虚拟专用网VR( Virtual Reality)虚拟现实VRML(Virtual Reality Modeling Language)虚拟现实建模语言VRR(Vertical Refresh Rate)垂直刷新率VTP(Virtual Terminal Protocol )虚拟终端协议WW AN(Wide Area Network)广域网W AE(Wireles s Application Environment)无线应用环境W AIS(Wide Area Information Service)广义信息服务,数据库检索工具W AP(Wireles s Application Protocol)无线应用协议W A V(Wave Audio Format)非压缩的音频格式文件WDM(Wavelength Division Multiplexing)波分多路复用WDP(Wireless Datagram Protocol )无线数据包协议工作组窗口WFW(Windows for Workgroups)．WML(Wireles s Markup Language)无线标记语言WMP(Windows Media Player)Windows媒体播放器WORM(Write Once, Read Many time)写一次读多次光盘WWW(World Wide Web)万维网WYSIWYG(What You See Is What You Get)所见即所得XXGA( eXtended Graphics Array)扩展图形阵列XML(eXtensible Markup Language)可扩展标记语言XMS(eXtended Memory Speci fication)扩展存储器规范XQL(eXtensible Query Language)可扩展查询语言XSL(eXtensible Stylesheet Language) 可扩展样式表语言ZZA( Zero and Add)清零与加指令零位记录制ZBR( Zone Bit Recording)．。

To Be a World ClassTo Be a World Class Memory Solution ProviderSolution Provider MemoryMemory Solution Provider ATO Solution Co., LtdSolution Co., Ltd ATOJan 2013Jan2013About ATO Solution¾Efficient MCP Memory Solution ProviderSince established in 2007, ATO Solution has been growing as amemory MCP solution provider focusing on Digital Still Camera(DSC) application.ATO Solution has been recognized as one of the most reliable MCP memory f tTo Be The Best Partner For Your Memory Solutionmanufacturer.The 1Fab-less in NAND Flash memory industryFor Your Memory Solution ¾The 1st Fab-less in NAND Flash memory industry In 2012, ATO Solution successfully launched and started mass production for 256Mb, 512Mb SLC NAND Flash memory products, which were developed by its own design technology.ATO Solution expands SLC NAND product line-up by launching 1Gb SLC Flash memory within the Q1’2013.Corporate Core TechnologyThe effective NAND Flash Memory DesignP id d ffi i t M S l ti f t dOptimized NAND Flash Design &SPI Provided efficient Memory Solutions for customer needs Optimized NAND Flash Design & SPITo Be the Best Partner for Memory Solution To Be the Best Partner for Memory SolutionNAND/DRAM MCPNAND SPI(patented)Low Density NANDCompany OutlineOrganizationCEO Chris Park EstablishedOctober 31, 2007CEOHeadquarter705 Loadland EZ Tower, 153 Gumi-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea AdvisorV. Presidenty gg ,Product NAND FlashMCP (NAND+DRAM)13M USD R&D ProductionSupport Sales & Marketing Financial Account QualityCapital 1.3M USD Employees 41peoples Design Prod. Eng’rQuality Management Production Management PurchasingKorea Taiwan ChinaHR IRRevenue 24.3M USD (2012)Web Site2013Mass production start for own 1Gb SLC NAND Flash in Q1Mass production start for own 256Mb/512Mb SLC NAND Flash2012Started consumer MCP delivery for Altek /PentaxStarted own SLC NAND Flash delivery for Ability / Fuji-film 2009~2011Start consumer MCP delivery for SDIC (Samsung Digital Imaging Co.) Mobile MCP registered on Spreadtrum 2G/3G platforms New business started with Asia Optical Flextronics Selected as “Company with Good technology”by Korean Government New business started with Asia Optical Flextronics Development start for SLC NAND Flash (256Mb/512Mb)2008 Company EstablishedSelected as Company with Good technology by Korean Government Acquired ISO9001:2000, ISO14001:20042007Biz start with Foxconn , MCP for Digital Still CameraBusiness Milestone1.Early Positioning with Consumer MCP 2The 1Fab less for NAND Flash Memory2.The 1st Fab-less for NAND Flash Memory3.New innovative solution ; SPI NAND Flash MemoryPhase II ; Low Density NandPhase III ; Nand based SPIProvide NAND-cell based Phase I ; Market Solution Provided Memory Solution Low Density NAND Flash Memory Development & Marketing for Consumer & SPI Flash for PC, Mobile, and Consumer MarketProvided Memory Solution ; MCP for Consumer Marketg Mobile Market`2007`2008`2009`2010`2011`2012`2013`2014`2015Phase I ; MCP Solution for ConsumerPartners CustomersMARKETING /QUALITY SERVICETAM : ~150M set / yearPhase II ; Low Density NAND Flash9IDMs are focusing on high density NAND Flash Memory-Capacity and Technology drivenMarket still needs continuous high reliable product and serviceHigh Competition ply9Market still needs continuous high reliable product and serviceamong MajorSuppliers and/SupDemUnstable supply& Continuous demandSupplyATO Solution’sTarget Marketpp yDemandSuppliers Move256Mb512Mb1Gb2Gb4Gb Density8Gb16GbEdge in design competiveness¾Die Size Comparison TableP d tCDi Si (2)W/FR ti Product Company Die Size (mm2)Tech(nm)W/F Size Ratio 256Mb H35.82908” 2.7435828”274(1.8V/3.3V)M 35.82908 2.74S(EOL)37.449012” 2.86ATO Solution13.07578”1512Mb (1.8V/3.3V)H33.11578” 1.58S 38.476312” 1.85T 29.634312” 1.42ATO Solution20.85578”11Gb (33V)H 30.994812” 1.093090109(3.3V)For 1bit ECCP 30.975012” 1.09ATO Solution28.22578”1Market Outlook _ WW SLC NAND Flash FCST (Consumer)K unit500,000 600,000 128Mb256Mb 512Mb 1Gb 2Gb 4Gb 8Gb200,000 300,000 400,000 Source : Forward Insight (2012. Sep)-100,00020112012201320142015 2016Total Consumer Demand byDensity (kUnits)2011 2012 2013 2014 2015 2016 CAGR<128Mb ------128Mb 6,119 5,074 4,089 2,144 --44145315301900152591925256Mb 44,145 31,530 19,001 5,259 1,925 -512Mb 114,519 96,382 75,177 59,212 47,661 30,157 -23.4%1Gb 147,898 154,362 161,864 167,566 179,001 187,513 4.9%2Gb 109,268 104,836 107,999 112,413 119,733 130,192 3.6%4Gb 54,644 54,906 61,917 73,858 85,309 95,797 11.9%757910037145912164430677411528Gb7,579 10,037 14,591 21,644 30,677 41,152Total (128Mb-8Gb)484,173 457,127 444,637 442,096 464,306 484,812 0.0%¾Global SLC NAND FCST in digital consumer market is estimated as a quite flat.Market Outlook _ WW Mobile Phone FCST2500Smartphone Mid-End Feature Phone Low-End Feature Phone206%1500200025.9%22.3%15.2%23.3%10.2%21.9% 6.7%20.6%358%24.7%26.1%0500100051.7%61.5%67.9%72.7%39.5%35.8%29.5%44.4%2011 2012 2013 2014 2015 2016Source : Forward Insight (2012. Sep)Mobile phone unit forecast (M Units)2,0 11 2,012 2,013 2,014 2,015 2,016 CAGRS t h 471658901112713551566272%Smartphone 471 658 901 1,127 1,355 1,566 27.2%Mid-End Feature Phone 710 596 452 278 203 144 -27.3%Low-End Feature Phone 418 411 389 427 437 444 1.2%¾Global total mobile phone unit shipments will reach to 1.7 billion units in 2013.¾Feature phone have the larger share in 2012 mobile market but its trend is expected to change after 2013Mobile Phones Units 1,599 1,665 1,742 1,832 1,995 2,154 6.1%when smart-phone will take over it.Brief Specification _ 256Mb / 512Mb / 1GbFEATURES DESCRIPTIONDensity 256Mb 512Mb 1GbArchitecture Single-Level CellPower Supply 1.8V: 1.7V ~ 1.95V / 3.3V: 2.7V ~ 3.6V 3.3V: 2.7V ~ 3.6VMemory Cell Array x8 : (32M + 1024K) x 8bits x16 : (16M + 512K) x 16bits x8 : (64M + 2M) x 8bitsX16 : (32M + 1M) x 16bits x8 : (128M + 4M) x 8bitsPage Size x8:(512 + 16)Bytes / x16:(256 + 8)Words x8:(2K + 64)BytesRandom Access 15us(1.8V) / 12us(3.3V)25usSerial Page Access 50ns(1.8V) / 30ns(3.3V)25nsProgram / Block EraseTime 200us(Typ) / 2ms(Typ)Copy Back ProgramOperation Fast Page copy without external bufferingOTP area 16Kbytes/8K words(32 pages)16Kbytes(8 pages)Hardware Data Protection Program / Erase locked during Power transitionsEndurance /Data100K P /E C l ith 1bit ECC /10Endurance / Data Retention 100K Program / Erase Cycles with 1bit ECC / 10years Temperature Range 0℃to +70℃/ -40℃to +85℃P k I f ti 48P TSOP (1220)/48B fBGA (99)48P TSOP (12x20mm)fBGA (9x9mm)Package Information 48P TSOP (12x20mm)/ 48B fBGA (9x9mm)48B fBGA (9x9mm)48B fBGA (6.5x8mm)Phase III ; SPI NAND Flash1Gb (SPI, Quad IO), 3.3V, 104Mhz(133Mhz@15pF), 8x6 WSON -Very high reliability,competitive cost,simpler package form factorHigh VoltageHOLD#Very high reliability, competitive cost, simpler package form factorControl Logic GeneratorI/O Shift RegisterW#CS#SCLKSISOECCGeneratorSPI InterfaceAddress Registerand Counter2K Bytes Data Buffer StatusRegister7FFFFFFh7FE0000hEmbedded ECCX DecoderEmbedded ECCY Decoder0000000h001FFFFhNAND Cell ArraySLC NAND Flash Product Roadmap 20132014ES CS MP Q1Q2Q3Q4Q1Q2Q3Q41.8V/3.3V256Mb 32Mx8 / 16Mx16Small Block TSOP/BGA/MCP1.8V / 3.3V512Mb 1.8V/3.3V64Mx8 / 32Mx16Small Block TSOP/BGA/MCP1.8V / 3.3V1Gb 3.3V128Mx8Large Block 3.3VTSOP/BGA/MCPNOTE) Endurance(256Mb/512Mb/1Gb) : 100K Program/Erase Cycles (with 1bit/528byte ECC)SLC NAND Flash Product Roadmap –cont’20132014ES CS MPQ1Q2Q3Q4Q1Q2Q3Q42Gb 1.8V/3.3V 256Mx8 / 128Mx16Large Block TBDLarge Block4Gb 1.8V/3.3V 512Mx8 / 256Mx16Large Block TBDNOTE) Endurance(2Gb/4Gb) : 100K Program/Erase Cycles (with 4bit/528byte ECC)Serial NAND Flash Product Roadmap20132014 ES CS MPQ1Q2Q3Q4Q1Q2Q3Q4 33V1Gb3.3V(128M+4M)x Bytes104MHzInternal ECC codeti3.3VgenerationWSON/SOP104MHzInternal ECC code2Gb/4GbgenerationTBD NOTE) Endurance : 100K Program/Erase CyclesCertificationsISO9001 : 2008• Oct 02, 2008 Acquired ISO9001ISO14001 : 2004• Oct 02, 2008 Acquired ISO14001Eco-Partner• Feb 09, 2009 Acquired Eco-Partner Di i i C tifi t N R i t ti D t E i d D t SDivision Certificate No.Registration Date Expired Date Sponsor ISO9001: 2008QI8221/082008.102013.11ICRISO14001:2004EI3363/082008.102013.11ICREco-Partner EPC-52452009.02-SAMSUNGco a t e C55009.0S SU GSummary ; Core Competencies Leading edge NAND Memory technology •High level of NAND Flash design experience and capability for optimized architecture D i d D l t C bilit fk ith li bl lit•Design and Development Capability of new packages with reliable quality •Market leading test technology, which is core factor of MCP quality•Stable quality control through field-proven management systemS l ti h ld i t d d li d IP f d Strategic relationship with Supply-ChainStable support with Strategic relationshipATO Solution holds 6registered and 6applied IPs for NAND and NAND SPI •Stable support with Strategic relationship Optimized operation and organization focusing on customer service•Simplified and optimized operation and logistics, which are result in reasonable lead time and customer service Memory specialized human resources•Key Engineering Resources are all from Major Memory Companies with 11+ years experience-Memory : Hynix, Samsung, STMicroelectronics(Numonyx), SMIC-Packaging : Stats ChipPAC, Amkor, Winpac-Test : iTEST, HisemFlexible and dynamic customer service•Customer Specific design and technical solutionThank you for your attention. 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