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1286;5405;中文规格书,Datasheet资料

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Pomona®

All dimensions are in inches. Tolerances (except noted): .xx = ±.02” (,51 mm), .xxx = ± .005” (,127 mm).All specifications are to the latest revisions. Specifications are subject to change without notice.Registered trademarks are the property of their respective companies. Made in USA6/9/99PomonaACCESS 90500 (800) 444-6785 or (949) 253-3858SY/EH/LSMore drawings available at www.pomonaelectronics.comR:\Release\DataSheet\1_Market_00\D1286_5405_1_01.docPage 1 of 1Model 1286 & 5405Double Banana Plug WithBinding Posts

Sales: 909-469-2900 Fax: 909-629-3317Technical Assistance: 800-241-2060FEATURES:• Converts Double Banana Jack Test Instruments to Binding Posts for test versatility.• Banana Plugs can be stacked vertically or horizontally.• Wires, spade lugs and pin tip plugs can be attached by means of the insulated knurl thumb • Insulated knurl thumb knob is captive to prevent misplacement.• Banana Plugs feature Nickel/Gold Plated, Beryllium Copper for tarnish resistance & long insMATERIALS:Binding Post: Body – Brass, Nickel Plated (Model 1286), Brass, Gold Plated (Model 5405) Insulator Knurl Thumb Knob: Polycarbonate, Color: Black, RedInsulator: ABS, Molded to the binding Post and Banana Body Marking: “1286 POMONA ELECTRONICS” or “5405 POMONA ELECTRONICS”Banana Plug: Body: Brass, Nickel Plated (Model 1286), Brass, Gold Plated (Model 5405) Spring: Beryllium Copper, Nickel Plated (Model 1286) Beryllium Copper, Gold Plated (Model 5405)RATINGS:Operating Voltage: 2500 VDCOperating Temperature: +50°C (+122°F).Current: 15 Amperes Max.ORDERING INFORMATION: Model 1286 & 5405http://oneic.com/ 分销商库存信息:POMONA12865405

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MMBT5401-TP;中文规格书,Datasheet资料

MMBT5401-TP;中文规格书,Datasheet资料

MMBT5401

PNPPlastic

Encapsulate

TransistorSOT-23

Suggested Solder

Pad LayoutFeatures

• Collector Current:ICM=0.6A• Collector-Base Voltage:V(BR)CBO=160V• Operating And Storage Temperatures –55OC to 150OC• Capable of 0.3Watts of Power Dissipation• Marking:2L

DIMENSIONS

INCHES MM

DIMMINMAXMINMAXNOTEA.110.1202.803.04 B .083 .104 2.10 2.64 C.047.0551.201.40 D.035.041.891.03 E.070.0811.782.05 F.018.024.45.60 G.0005.0039.013.100 H.035.044.891.12 J.003.007.085.180 K.015.020.37.51 Electrical Characteristics @ 25OC Unless Otherwise Specified

SymbolParameterMinMaxUnitsOFF CHARACTERISTICS V(BR)CEOCollector-Emitter Breakdown Voltage (IC=1.0mAdc,IB=0)150--- Vdc

V(BR)CBOCollector-Base Breakdown Voltage (IC=100uAdc,IE=0)160--- Vdc

V(BR)EBOEmitter-Base Breakdown Voltage (IE=10uAdc,IC=0)5.0--- Vdc

ICBOCollector Cutoff Current (VCB=120Vdc,IE=0)---0.1uAdc

7440650015;中文规格书,Datasheet资料

7440650015;中文规格书,Datasheet资料

Bezeichnung :description :AmmBmmCmmDmmEmm = Start of windingMarking = Inductance codeEigenschaften / propertiesWert / valueEinheit / unittol.Induktivität /inductanceDC-Widerstand /DC-resistanceDC-Widerstand /DC-resistanceNennstrom /rated currentSättigungsstrom / saturation currentEigenres.-Frequenz /self-res.-fequency33% Umgebungstemperatur / temperature:+20°CFerrit / ferriteME08-11-24MST08-04-11ME04-10-11NameDatum / dateVersion 2Version 310 ± 0,310 ± 0,32,8 ± 0,34,2 ref.Typ XL7,4 ref.Kunde / customer :

..................................................................................Class HSn/Ag/Cu - 96.5/3.0/0.5%Geprüft / checked...............................................................................................Änderung / modificationVersion 1Freigabe erteilt / general release:Kunde / customer F Werkstoffe & Zulassungen / material & approvals : G Eigenschaften / general specifications :It is recommended that the temperature of the part doesnot exceed 125°C under worst case operating conditions.Endoberfläche / finishing electrode:Basismaterial / base material:Würth Elektronik http://www.we-online.deWürth Elektronik eiSos GmbH & Co. KGD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Kontrolliert / approvedMHzm|∆L/L|<35%ASRFIsat7,5080,0 @ 20°CDraht / wire: D Prüfgeräte / test equipment :

SGA-3286Z;SGA-3286;中文规格书,Datasheet资料

SGA-3286Z;SGA-3286;中文规格书,Datasheet资料

Features

1 of 6

Optimum Technology Matching® Applied

GaAs HBT

InGaP HBTGaAs MESFET

SiGe BiCMOS

Si BiCMOS

SiGe HBT

GaAs pHEMT

Si CMOS

Si BJT

GaN HEMT

RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.Product Description

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@.RF MEMSSGA-3286(Z)

DC to 5000MHz, CASCADABLE SiGe HBT

MMIC AMPLIFIER

The SGA-3286 is a high performance SiGe HBT MMIC Amplifier. A Darlington config-

W25Q128BVEIG;中文规格书,Datasheet资料

W25Q128BVEIG;中文规格书,Datasheet资料

W25Q128BV

Publication Release Date: April 18, 2012 - 1 - Revision G 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

/W25Q128BV

- 2 - Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI OPERATIONS ............................................................................................................. 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 Hold Function ....................................................................................................................... 11 6.2 WRITE PROTECTION ....................................................................................................... 12 6.2.1 Write Protect Features ......................................................................................................... 12 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 13 7.1 STATUS REGISTERS ........................................................................................................ 13 7.1.1 BUSY Status (BUSY) ............................................................................................................ 13 7.1.2 Write Enable Latch Status (WEL) ........................................................................................ 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 13 7.1.4 Top/Bottom Block Protect Bit (TB) ........................................................................................ 13 7.1.5 Sector/Block Protect Bit (SEC) ............................................................................................. 13 7.1.6 Complement Protect Bit (CMP) ............................................................................................ 14 7.1.7 Status Register Protect Bits (SRP1, SRP0) .......................................................................... 14 7.1.8 Erase/Program Suspend Status (SUS) ................................................................................ 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 14 7.1.10 Quad Enable Bit (QE) ......................................................................................................... 15 7.1.11 Status Register Memory Protection (CMP = 0) ................................................................... 16