SN74LVT16500DLR;SN74LVT16500DGGR;中文规格书,Datasheet资料

TOP-SIDE MARKING LVTH16500 LVTH16500 LL500
−55°C to 125°C CFP − WD Tube SNJ54LVTH16500WD SNJ54LVTH16500WD † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus and UBT are trademarks of Texas Instruments.
D D D D D D D D D
Widebus Family UBT Transceivers Combine D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Support Unregulated Battery Operation Down to 2.7 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Distributed VCC and GND Pins Minimize High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101)

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74F161AD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ADE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ADG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ADR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ADRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ADRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161AN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74F161AN3OBSOLETE PDIP N16TBD Call TI Call TISN74F161ANE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74F161ANSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ANSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74F161ANSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74F161ADR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74F161ANSRSONS162000330.016.48.210.52.512.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74F161ADR SOIC D162500333.2345.928.6SN74F161ANSR SO NS162000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

FEATURES2OECCCC3OESN54LVT16240...WD PACKAGESN74LVT16240...DGG OR DL PACKAGE(TOP VIEW) DESCRIPTION/ORDERING INFORMATIONSN54LVT16240,SN74LVT162403.3-V ABT16-BIT BUFFERS/DRIVERSWITH3-STATE OUTPUTSSCBS717A–APRIL2000–REVISED NOVEMBER2006•Members of the Texas Instruments Widebus™Family•State-of-the-Art Advanced BiCMOSTechnology(ABT)Design for3.3-V Operationand Low Static-Power Dissipation•Support Mixed-Mode Signal Operation(5-VInput and Output Voltages With3.3-V VCC)•Support Unregulated Battery Operation Downto2.7V•Typical V OLP(Output Ground Bounce)<0.8Vat VCC=3.3V,TA=25°C•I off and Power-Up3-State Support HotInsertion•Distributed V CC and GND Pins MinimizeHigh-Speed Switching Noise•Flow-Through Architecture Optimizes PCBLayout•Latch-Up Performance Exceeds100mA PerJESD78,Class II•ESD Protection Exceeds JESD22–2000-V Human-Body Model(A114-A)–200-V Machine Model(A115-A)–1000-V Charged-Device Model(C101)•Package Options Include Plastic ShrinkSmall-Outline(DL)and Thin ShrinkSmall-Outline(DGG)Packages and380-milFine-Pitch Ceramic Flat(WD)Package Using25-mil Center-to-Center SpacingsThe'LVT16240devices are16-bit buffers and line drivers designed specifically for low-voltage(3.3-V)V CC operation,but with the capability to provide a TTL interface to a5-V system environment.These devices are designed specifically to improve both the performance and density of3-state memory address drivers,clock drivers,and bus-oriented receivers and transmitters.The devices can be used as four4-bit buffers,two8-bit buffers,or one16-bit buffer.The devices provide inverting outputs and symmetrical active-low output-enable(OE)inputs.When V CC is between0and1.5V,the devices are in the high-impedance state during power up or power down. However,to ensure the high-impedance state above1.5V,OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.These devices are fully specified for hot-insertion applications using I off and power-up3-state.The I off circuitry disables the outputs,preventing damaging current backflow through the devices when they are powered down. The power-up3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Widebus is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2000–2006,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DESCRIPTION/ORDERING INFORMATION (CONTINUED)1A11A21A31A41Y11Y21Y31Y42A12A22A32A42Y12Y22Y32Y43A13A23A33A43Y13Y23Y33Y44A14A24A34A44Y14Y24Y34Y41OE 2OE 3OE 4OE SN54LVT16240,SN74LVT162403.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCBS717A–APRIL 2000–REVISED NOVEMBER 2006The SN54LVT16240is characterized for operation over the full military temperature range of –55°C to 125°C.The SN74LVT16240is characterized for operation from –40°C to 85°C.ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKINGSN74LVT16240DLR Reel of 1000SN74LVT16240DLRG4SSOP –DLLVT16240SN74LVT16240DL –40°C to 85°CTube of 25SN74LVT16240DLG474LVT16240DGGRE4TSSOP –DGGReel of 2000LVT16240SN74LVT16240DGGR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.FUNCTION TABLE (each 4-bit buffer)INPUTSOUTPUTYOE A L H L L L H HXZLOGIC SYMBOL (1)(1)This symbol is in accordance with ANSI/IEEE Std 91-1984and IEC Publication 617-12.2Submit Documentation Feedback1OE1A1 1A2 1A3 1A41Y1 1Y2 1Y3 1Y42OE2A1 2A2 2A3 2A42Y12Y22Y32Y43OE3A13A23A33A43Y13Y23Y33Y4 4OE4A14A24A34A44Y14Y24Y34Y4Absolute Maximum Ratings(1)SN54LVT16240,SN74LVT162403.3-V ABT16-BIT BUFFERS/DRIVERSWITH3-STATE OUTPUTSSCBS717A–APRIL2000–REVISED NOVEMBER2006 LOGIC DIAGRAM(POSITIVE LOGIC)over operating free-air temperature range(unless otherwise noted)MIN MAX UNITV CC Supply voltage range–0.5 4.6VV I Input voltage range(2)–0.57VV O Voltage range applied to any output in the high-impedance or power-off state(2)–0.57VV O Voltage range applied to any output in the high state(2)–0.5V CC+0.5VSN54LVT1624096I O Current into any output in the low state mASN74LVT16240128SN54LVT1624048I O Current into any output in the high state(3)mASN74LVT1624064I IK Input clamp current V I<0–50mAI OK Output clamp current V O<0–50mADGG package70θJA Package thermal impedance(4)°C/WDL package63T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3)This current flows only when the output is in the high state and V O>V CC.(4)The package thermal impedance is calculated in accordance with JESD51.3Submit Documentation FeedbackRecommended Operating Conditions (1)SN54LVT16240,SN74LVT162403.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCBS717A–APRIL 2000–REVISED NOVEMBER 2006SN54LVT16240SN74LVT16240UNIT MINMAX MIN MAX V CC Supply voltage 2.7 3.62.73.6V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V I Input voltage5.5 5.5V I OH High-level output current –24–32mA I OL Low-level output current 4864mA ∆t/∆v Input transition rise or fall rate Outputs enabled1010ns/V ∆t/∆V CC Power-up ramp rate200200µs/V T A Operating free-air temperature–55125–4085°C(1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.4Submit Documentation FeedbackElectrical CharacteristicsSN54LVT16240,SN74LVT16240 3.3-V ABT16-BIT BUFFERS/DRIVERSWITH3-STATE OUTPUTS SCBS717A–APRIL2000–REVISED NOVEMBER2006over recommended operating free-air temperature range(unless otherwise noted)SN54LVT16240SN74LVT16240 PARAMETER TEST CONDITIONS UNITMIN TYP(1)MAX MIN TYP(1)MAXV IK V CC=2.7V,I I=–18mA–1.2–1.2V V CC=2.7V to3.6V,I OH=–100µA V CC–0.2V CC–0.2V CC=2.7V,I OH=–8mA 2.4 2.4V OH VI OH=–24mA2V CC=3VI OH=–32mA2I OL=100µA0.20.2V CC=2.7VI OL=24mA0.50.5I OL=16mA0.40.4V OL VI OL=32mA0.50.5V CC=3VI OL=48mA0.55I OL=64mA0.55V CC=0or3.6V,V I=5.5V1010Control inputs V CC=3.6V,V I=V CC or GND±1±1I IµAV I=V CC11 Data inputs V CC=3.6VV I=0–5–5I off V CC=0,V I or V O=0to4.5V±100µAI OZH V CC=3.6V,V O=3V55µAI OZL V CC=3.6V,V O=0.5V–5–5µAV CC=0to1.5V,V O=0.5V to3V,I OZPU±100(2)±100µAOE=don't careV CC=1.5V to0,V O=0.5V to3V,I OZPD±100(2)±100µAOE=don't careOutputs high0.190.19 V CC=3.6V,I CC I O=0,Outputs low55mAV I=V CC or GND Outputs disabled0.190.19V CC=3V to3.6V,∆I CC(3)One input at V CC–0.6V,0.20.2mA Other inputs at V CC or GNDC i V I=3V or044pFC o V O=3V or099pF(1)All typical values are at V CC=3.3V,T A=25°C.(2)On products compliant to MIL-PRF-38535,this parameter is not production tested.(3)This is the increase in supply current for each input that is at the specified TTL voltage level,rather than V CC or GND.5Submit Documentation FeedbackSwitching CharacteristicsSN54LVT16240,SN74LVT162403.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCBS717A–APRIL 2000–REVISED NOVEMBER 2006over recommended operating free-air temperature range,C L =50pF (unless otherwise noted)(see Figure 1SN54LVT16240SN74LVT16240FROM TO V CC =3.3V V CC =3.3V PARAMETERV CC =2.7V V CC =2.7V UNIT(INPUT)(OUTPUT)±0.3V ±0.3V MINMAX MINMAX MIN TYP (1)MAX MINMAXt PLH 1 3.6 4.11 2.2 3.54A Y ns t PHL 1 3.6 4.11 2.7 3.54t PZH 1 4.2 5.11 2.64 4.9OE Y ns t PZL 1.1 4.6 4.8 1.2 2.6 4.4 4.6t PHZ 1.9 4.7 5.22 3.4 4.55OEYns t PLZ 1.94.44.523.24.2 4.2t sk(LH)0.50.5ns t sk(HL)0.50.5(1)All typical values are at V CC =3.3V,T A =25°C.6Submit Documentation FeedbackPARAMETER MEASUREMENT INFORMATIONFrom Output Under TestC L LOAD CIRCUITOpen Data InputTiming Input2.7 V0 V2.7 V0 V2.7 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OL2.7 V0 V InputOutput Control Output Waveform 1S1 at 6 V (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH 3 V0 V≈ 0 V2.7 VVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PHL /t PLH t PLZ /t PZL t PHZ /t PZHOpen 6 V GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time with one transition per measurement.SN54LVT16240,SN74LVT162403.3-V ABT 16-BIT BUFFERS/DRIVERSWITH 3-STATE OUTPUTSSCBS717A–APRIL 2000–REVISED NOVEMBER 2006Figure 1.Load Circuit and Voltage Waveforms7Submit Documentation FeedbackPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74LVT16240DGGRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVT16240DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT16240DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT16240DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT16240DLG4ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT16240DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT16240DLRG4ACTIVESSOPDL481000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and freeof Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVT16240DGGR TSSOP DGG 482000330.024.48.615.8 1.812.024.0Q1SN74LVT16240DLRSSOPDL481000330.032.411.3516.23.116.032.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVT16240DGGR TSSOP DGG482000346.0346.041.0 SN74LVT16240DLR SSOP DL481000346.0346.049.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVT125D NRND SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74LVT125DBR NRND SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125DBRG4NRND SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125DG4NRND SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125DR NRND SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125DRG4NRND SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125NSR NRND SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125PW NRND TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125PWG4NRND TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT125PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74LVT125PWR NRND TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVT125PWRG4NRND TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.12-Sep-2006In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.12-Sep-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。