Q67040-S4138-A2中文资料
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SIPMOS ® Power Transistor• N channel• Enhancement mode• Avalanche-rated• d v/d t rated• 175°C operating temperatureType V DS I D R DS(on)Package Ordering Code SPD23N0555 V22 A0.06 ΩP-TO252Q67040 - S4138 - A2 SPU23N0555 V22 A0.06 ΩP-TO251Q67040 - S4131 - A2Maximum RatingsParameter Symbol Values UnitContinuous drain current T C = 25 °CT C = 100 °C I D1622APulsed drain current T C = 25 °C I Dpuls88Avalanche energy, single pulseI D = 22 A, V DD = 25 V, R GS = 25 ΩL = 372 µH, T j = 25 °C E AS90mJAvalanche current,limited by T jmax I AR 22A Avalanche energy,periodic limited by T jmax E AR 5.5mJReverse diode d v/d tI S = 22 A, V DS = 40 V, d i F/d t = 200 A/µs T jmax = 175 °C d v/d t6kV/µsGate source voltage V GS± 20VPower dissipation T C = 25 °C P tot55WMaximum RatingsParameter Symbol Values Unit Operating temperature T j -55 ... + 175°C Storage temperature T stg -55 ... + 175 Thermal resistance, junction - case R thJC ≤ 2.7K/W Thermal resistance, junction - ambient (PCB mount)**R thJA≤ 50Thermal resistance, junction - ambient R thJA≤ 100IEC climatic category, DIN IEC 68-1 55 / 175 / 56** when mounted on 1 " square PCB ( FR4 );for recommended footprintElectrical Characteristics, at T j = 25°C, unless otherwise specifiedParameter Symbol Values Unitmin.typ.max.Static CharacteristicsDrain- source breakdown voltageV GS = 0 V, I D = 0.25 mA, T j = 25 °C V(BR)DSS55--VGate threshold voltage V GS=V DS, I D = 40 µA V GS(th)2.1 3 4Zero gate voltage drain currentV DS = 50 V, V GS = 0 V, T j = -40 °C V DS = 50 V, V GS = 0 V, T j = 25 °C V DS = 50 V, V GS = 0 V, T j = 150 °C I DSS----0.1-10010.1µAGate-source leakage current V GS = 20 V, V DS = 0 V I GSS- 10 100nADrain-Source on-resistance V GS = 10 V, I D = 16 A R DS(on)- 0.04 0.06ΩElectrical Characteristics, at T j = 25°C, unless otherwise specifiedParameter Symbol Values Unitmin.typ.max.Dynamic CharacteristicsTransconductanceV DS≥ 2 *I D * R DS(on)max, I D = 16 A g fs7 10-SInput capacitanceV GS = 0 V, V DS = 25 V, f = 1 MHz C iss- 490 615pFOutput capacitanceV GS = 0 V, V DS = 25 V, f = 1 MHz C oss- 170 215Reverse transfer capacitanceV GS = 0 V, V DS = 25 V, f = 1 MHz C rss- 95 120Turn-on delay timeV DD = 30 V, V GS = 10 V, I D = 22 A R G = 20 Ωt d(on)- 15 25nsRise timeV DD = 30 V, V GS = 10 V, I D = 22 A R G = 20 Ωt r- 25 40Turn-off delay timeV DD = 30 V, V GS = 10 V, I D = 22 A R G = 20 Ωt d(off)- 30 45Fall timeV DD = 30 V, V GS = 10 V, I D = 22 A R G = 20 Ωt f- 25 40Gate charge at thresholdV DD = 40 V, I D = 0.1 A, V GS =0 to 1 V Q g(th)- 0.5 0.75nCGate charge at 7.0 VV DD = 40 V, I D = 22 A, V GS =0 to 7 V Q g(7)- 13 20Gate charge totalV DD = 40 V, I D = 22 A, V GS =0 to 10 V Q g(total)- 17 26Gate plateau voltage V DD = 40 V, I D = 22 A V(plateau)- 5.9-VElectrical Characteristics, at T j = 25°C, unless otherwise specifiedParameter Symbol Values Unitmin.typ.max.Reverse DiodeInverse diode continuous forward current T C = 25 °C I S-- 22AInverse diode direct current,pulsed T C = 25 °C I SM-- 88Inverse diode forward voltage V GS = 0 V, I F = 44 A V SD- 1.2 1.8VReverse recovery timeV R = 30 V, I F=l S, d i F/d t = 100 A/µs t rr- 55 85nsReverse recovery chargeV R = 30 V, I F=l S, d i F/d t = 100 A/µs Q rr- 0.12 0.18µCPower dissipation P tot = ƒ(T C )20406080100120140°C180T C0 5 10 15 20 25 30 35 40 45 50W 60 P totDrain current I D = ƒ(T C )parameter: V GS ≥ 10 V20406080100120140°C 180T C0 24 6 8 10 12 14 16 18 20A 24 I DSafe operating area I D = ƒ(V DS )parameter: D = 0.01, T C = 25°C10 110 210 310 AI D100 10110 2V VDSRD S (o n ) = V D S / IDDC 10 ms1 ms100 µst p = 26.0µsTransient thermal impedance Z th JC = ƒ(t p )parameter: D = t p /T10 10 10 10 10 10 Z thJC10101010101010 10s t pTyp. output characteristics I D = ƒ(V DS )parameter: t p = 80 µs , T j = 25 °C0.00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0V 5.0V DSI DTyp. drain-source on-resistance R DS (on) = ƒ(I D )parameter: t p = 80 µs, T j = 25 °C5101520253035A45I DR DS (on)Typ. transfer characteristics I D = f (V GS )parameter: t p = 80 µs V DS ≥2 x I D x R DS(on)max12345678V10VGS0 5 10 15 20 25 30 35 40 45 50A 60 I DDrain-source on-resistance R DS (on) = ƒ(T j )parameter: I D = 16 A, V GS = 10 V-60-202060100°C 180T j0.00 0.02 0.04 0.06 0.08 0.100.12 0.14 0.16Ω0.19R DS (on)typ98%Gate threshold voltageV GS(th)= f (T j )parameter:V GS =V DS , I D =40µA-60-202060100140V200T j0.0 0.40.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4V 5.0 VGS(th)min typ maxTyp. capacitancesC= f (V DS )parameter:V GS = 0V, f = 1MHz51015202530V40110 210 310 410 pFCCissCossCrssForward characteristics of reverse diode I F = ƒ(V SD )parameter: T j , t p = 80 µs10 10 10 10 I F0.00.40.8 1.2 1.6 2.0 2.4V 3.0Typ. gate charge V GS = ƒ(Q Gate )parameter: I D puls = 22 A481216nC24Q Gate2 4681012V16V GSDS maxV 0,8 DS maxV 0,2 Avalanche energy E AS = f (T j )parameter:I D =22A,V DD =25 V R GS =25 Ω , L = 372µH20406080100120140°C180T j0 10 20 3040 50 60 70 80 mJ100 EASDrain-source breakdown voltage V (BR)DSS = ƒ(T j )-60-202060100°C18049 51 5355575961V65V (BR)DSS。