下载文档原格式
0引言随着社会的发展，下一代通信设备对传输容量需求越来越大，并需要对语音、数据、图像和视频的传输和处理，因此对宽带平台的信号带宽和通道数提出了很高的要求。
现阶段的通信平台一般采用超外差和零中频两种架构实现，超外差架构存在不可在线编程、扩展性差、体积大、功耗高等缺陷[1]，零中频架构一般采用最新的捷变频收发器芯片AD3961实现，但是AD9361带宽最高支持56MHz 信号带宽，也不满足宽带通信平台的要求。
综上所述，新一代宽带通信平台必须具备具有多通道、宽频段、高动态范围、轻量化、通用化、硬件可配置、软件即插即用等技术特征。
本文提出一种基于集成射频芯片AD9371和Zynq UltraScale+MPSOC 的下一代多通道宽带通信平台设计方案，可满足新一代宽带通信设备的应用需求，在军民用无线通信领域具有广阔的应用前景。
1硬件架构1.1集成射频处理芯片结构AD9371是一款高集成度的宽带RF 收发器，提供双通道的发射器和接收器、集成式频率合成器、测试和信号处理功能。
AD9371提供FDD 和TDD 应用中的3G/4G 微基站和宏基站设备所需的灵活性能和低功耗组合。
该器件的工作频率为300MHz~6000MHz，AD9371作者简介:苏兆忠(1984-)，男，山东菏泽人，硕士研究生，工程师，从事机载通信电子设备的硬件研发工作，主要研究方向为高速总线传输、嵌入式系统、数模混合电路设计。
基于AD9371和Zynq UltraScale+MPSOC 的多通道宽带通信平台The Multi-Channel Broadband Communication Platform Based on AD9371and Zynq UltraScale+MPSOC苏兆忠(中国西南电子技术研究所,四川成都610036)Su Zhao-zhong (Southwest China Institute of Electronic Technology,Sichun Chengdu 610036)摘要：该文分析了多通道宽带通信平台需求和技术特征，提出了一种基于集成射频芯片AD9371和Zynq UltraScale+MPSOC 的多通道宽带通信平台解决方案，详细介绍了集成射频芯片AD9371和Zynq UltraScale+MPSOC 内部组成原理，并且基于该平台进行了QPSK 算法验证，结果表明该平台性能优越，满足下一代宽带通信平台需求。
Chelsio 10GbE Adapters for IBM System Cluster 1350 and IBM iDataPlexProduct Guide (withdrawn product)Chelsio single-port and dual-port adapters for IBM System Cluster 1350 and IBM iDataPlex are 10 Gigabit Ethernet adapters with PCI Express host bus interface optimized for virtualization, high performance computing, and storage applications. The third generation technology from Chelsio provides the highest10GbE performance that is available and dramatically lowers host system CPU communications overhead. With on-board hardware that off-loads TCP/IP, iSCSI, and iWARP RDMA processing from its host system, these adapters free up host CPU cycles for business applications and result in increased bandwidth, lower latency, and lower power. This combination makes it practical to converge other networks that traditionally used niche technologies onto 10GbE. High bandwidth and extremely low latency make 10GbE with protocol offload the best technology for high-performance cluster computing (HPCC) fabrics.Figure 1. Chelsio dual-port 10GbE adapters: The S320E (left) and the 10GbE Expansion Card (CFFh) for BladeCenter (right)Did you know?These Chelsio adapters enable the concept of unified wire, the convergence of server networking, storage networking, and cluster computing interconnects onto a single platform and a single fabric.These Chelsio adapters are part of the IBM System Cluster 1350 solution. The Cluster 1350 is your key to a fully integrated HPC solution. IBM clustering solutions include servers, storage, and industry-leading interconnects that are factory-integrated, fully tested, and delivered to your door, ready to plug into your data center, all with a single point of contact for support.Click here to check for updatesFigure 2. Chelsio S310E Single-port 10GbE PCIe x8 Adapter, 59Y1952FeaturesThese Chelsio single-port and dual-port adapters for IBM System 1350 and iDataPlex have following features:Unified Wire interconnect solution for server networking, storage networking, and clustering on a single platformVery low latency EthernetReduces host CPU utilization by up to 90% compared to NICs without full offload capabilitiesFigure 3. Chelsio S310E Single-port 10GbE PCIe x8 Adapter (CX4 connector), 46M1813 SpecificationsThe Chelsio single-port and dual-port adapters for Cluster 1350 and iDataPlex have the following features: Network Interfaces:10GBASE-SR short-reach optics (850nm)10GBASE-LR long-reach optics (1310nm)Figure 4. Chelsio S310E Single-port 10GbE PCIe x8 Adapter (SFP+ connector), 46M1809 Operating environmentThis adapter is supported in the following environment:Temperature (operating): 0° to 55° C (32° to 131° F)Humidity (operating): 5 to 95%, non-condensingAirflow: 200 lf/mTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®BladeCenter®iDataPlex®The following terms are trademarks of other companies:Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。
网络化MPSoC高能效设计技术研究的开题报告中文标题：网络化MPSoC高能效设计技术研究英文标题：Research on High-Efficiency Design Technology for Networked MPSoC一、研究背景和意义随着计算机科学和物联网技术的飞速发展，多核处理器系统（MPSoC）作为一种具有高性能和可扩展性的系统架构逐渐逐渐成为研究的热点和关注焦点。
而网络化MPSoC则是在MPSoC上加入网络通信功能，将多个处理器和通信模块组成分布式系统，以进一步提升系统性能和可靠性。
目前，大量的科研工作已经针对网络化MPSoC的体系结构、调度算法、通信协议等问题进行了深入研究，并取得了一定的成果。
但是，由于高能效、低功耗的设计需求越来越迫切，如何在研究网络化MPSoC性能优化的同时实现高能效、低功耗的设计仍然面临很多挑战。
因此，本研究旨在探究网络化MPSoC高能效设计技术，研究面向网络化MPSoC的功耗优化、负载均衡、任务划分和通信优化等关键技术，以提高系统的能效和性能。
二、研究内容1、网络化MPSoC架构设计：通过研究网络化MPSoC系统中的处理器结构、通信模块设计、总线结构等问题，设计出适合高能效设计的网络化MPSoC架构。
2、功耗优化技术研究：深入挖掘网络化MPSoC功耗优化的潜力，设计出针对网络化MPSoC的高能效功耗优化技术，如在设计中采用节能的电路设计技术等。
3、负载均衡和任务划分技术研究：研究适用于网络化MPSoC的负载均衡和任务划分算法，通过优化任务分配和负荷平衡，来提高系统性能和能效。
4、通信优化技术研究：研究适用于网络化MPSoC的通信优化技术，包括采用低功耗，高性能通信协议等方案，以提高系统通信的可靠性和效率。
三、研究计划第一年：1、调研网络化MPSoC的研究现状和发展趋势；2、研究网络MPSoC架构设计和功耗优化技术；3、完成一篇关于网络化MPSoC高能效设计的学术论文；第二年：1、完成网络化MPSoC的负载均衡和任务划分技术研究；2、完成研究成果的验证和实验；3、撰写一篇高水平论文；第三年：1、继续开展通信优化技术和其他优化技术的研究；2、继续进行实验验证；3、完成论文的投稿和答辩。
MPSoC互连网络功耗模型及其应用的开题报告题目：MPSoC互连网络功耗模型及其应用一、选题背景及意义随着嵌入式系统的广泛应用，多处理器系统（MPSoC）已成为嵌入式系统的主流设计形式，而MPSoC中的互连网络是整个系统中重要的组成部分。
互连网络的性能和功耗对于整个系统的可靠性和效率都有非常大的影响。
因此，MPSoC中的互连网络功耗模型研究具有重要的理论和实际意义。
目前，MPSoC中的互连网络功耗模型研究并不充分，主要原因在于MPSoC的复杂性和异构性，传统的功耗模型难以适应MPSoC的需求。
因此，本研究旨在提出一种适合MPSoC的互连网络功耗模型，以实现优化MPSoC互连网络的功耗和性能。
二、研究内容和方法1. MPSoC互连网络功耗模型的建立在本研究中，将首先分析MPSoC中互连网络的性质和特点，并结合线性回归和人工神经网络等机器学习算法，建立MPSoC互连网络的功耗模型。
2. 互连网络功耗优化方法的研究针对建立的MPSoC互连网络功耗模型，本研究将提出一种优化方法，以减少互连网络的功耗。
优化方法将分为两部分，第一部分是对互连网络传输的数据分布进行优化，第二部分是对互连网络的拓扑结构进行优化。
3. 给MPSoC应用程序提供优化建议在研究过程中，将设计一个系统，该系统将对MPSoC应用程序进行性能和功耗评估，并向用户提供优化建议，以提高系统效率。
该系统将针对不同的应用场景进行优化。
4. 实验验证和分析将在FPGA上搭建实验平台，用于验证MPSoC互连网络功耗模型的准确性和优化方法的可行性，并通过实验结果分析，验证本研究所提出的方法的实用价值与优越性。
三、研究进度安排1. 第1-2周：阅读相关文献，了解MPSoC互连网络功耗模型的研究现状和发展趋势。
2. 第3-6周：选定适合MPSoC的互连网络功耗模型，对模型进行测试，提出优化方法。
3. 第7-8周：加强对MPSoC应用程序的分析，设计实验系统并进行实验，收集实验数据。
EE382V:System-on-a-Chip (SoC) DesignLecture 10 –Task PartitioningSources:Prof. Margarida Jacome, UT AustinProf. Lothar Thiele, ETH ZürichAndreas GerstlauerElectrical and Computer EngineeringUniversity of Texas at Austin*****************.eduLecture 10: Outline•Accelerated system design•When to use accelerators•Performance analysis•Partitioning•Decomposition•Partitioning heuristics•System-level design•MPSoC trendsEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer2EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 3Hardware vs. Software Modules•Hardware•Functionality implemented via a custom architecture(e.g. datapath + FSM)•Software•Functionality implemented on a programmable processor(datapath + programmable control)Key differences•Concurrency–Processors usually have one “thread of control”–Dedicated hardware often has concurrent datapathsMultiplexing–Software modules multiplexed with others on a processor (e.g. OS)–Hardware modules are typically mapped individually on dedicatedhardware blocks © Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 4Accelerated System ArchitectureCPUAcceleratorMemoryI/Orequest dataresult© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 5Accelerators•Accelerator vs. co-processor• A co-processor executes instructions.–Instructions are dispatched by the CPU•An accelerator appears as a device on the bus.–The accelerator is controlled via registers•Accelerator implementations•Application-specific integrated circuit (ASIC)•Field-programmable gate array (FPGA).•Standard component.–Example: graphics processor.•SoCs enable multiple accelerators, peripherals, and some memory to be placed with a CPU on a single chip© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 6Why Accelerators?•Better cost/performance•Custom logic may be able to perform operation faster or atlower power than a CPU of equivalent cost–Better at real-time, I/O, streaming, parallelism•CPU cost is a non-linear function of performance–May not be able to do the work on even the largest CPUcostperformance© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 7Why Accelerators? (cont’d)•Better real-time performance•Put time-critical functions on less-loaded processingelements•Scheduling utilization is ‘limited’---extra CPU cycles mustbe reserved to meet deadlines. (see previous lecture )costperformancedeadline deadline w/scheduling overhead© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 8Performance Analysis•Critical parameter is speedup•How much faster is the system with the accelerator?•Must take into account•Accelerator execution time•Data transfer time•Synchronization with the master CPU•Total accelerator execution time•t accel = t in + t x + t outData input Accelerated computationData output© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 9Accelerator Speedup•Assume loop is executed n times.•Compare accelerated system to non-accelerated system:•Saved Time = n (t CPU -t accel )•= n [t CPU -(t in + t x + t out )]•Speed-Up = Original Ex. Time / Accelerated Ex. Time•Speed-Up = t CPU / t accel•Data input/output times include•flushing register/cache values to main memory;•time required for CPU to set up transaction;•data transfer overhead for bus packets, handshaking, etc.Execution time of equivalentfunction on CPU© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 10Accelerator/CPU Interface•Data transfers•Accelerator registers provide control registers for CPU•Shared memory region for data exchange–Data registers can be used for small data objects•Accelerator may include special-purpose read/write logic(bus mastering DMA hardware)–Especially valuable for large data transfers•Caching problems•CPU might not see memory writes by the acceleratorInvalidate cache lines or disable caching of shared regions•Synchronization•Concurrent accesses to shared variablesSemaphores using atomic test & set bus operations© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 11Single-vs. Multi-Threaded•One critical factor is available parallelism•Single-threaded/blocking–CPU waits for accelerator•Multithreaded/non-blocking–CPU continues to execute along with accelerator•To multithread, CPU must have useful work to do•But software must also support multithreadingSources of parallelism•Overlap I/O and accelerator computation–Perform operations in batches, read in second batch of data whilecomputing on first batch.•Find other work to do on the CPU–May reschedule operations to move work after accelerator initiation.© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 12Execution Time Analysis•Single-threaded:•Count execution time of all component processes.•Multi-threaded:•Find longest path throughexecution.P2P1A1P3P4P2P1A1P3P4© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 13Lecture 10: Outline✓Accelerated system design✓When to use accelerators✓Performance analysis•HW/SW partitioning•Decomposition•Partitioning heuristics•System-level design•MPSoC trends EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 14Decomposition•Divide functional specification into modules•Map units onto PEs•Units may become processes•Determine proper level of parallelismf3(f1(),f2())f1()f2()f3()vs.© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 15Decomposition Example•Divide program into Control-Data Flow Graph (CDFG)•Hierarchically decompose CDFG to identify partitionsBlock 1Block 2Block 3cond 1cond 2P1P2P3P4P5© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 16Partitioning Methods•Random mapping•Each object is assigned to a block randomly•Hierarchical clustering•Stepwise grouping of objects•Closeness function determines how desirable it is to grouptwo objectsConstructive methods•Often used to generate a starting partition for iterativemethods•Show the difficulty of finding proper closeness functions© Lothar Thiele, ETH ZürichEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 17Hierarchical Clustering -Example (1)201010846v 1v 3v 2v 4v 5 = v 1⋃v 31074v 4v 5v 2Closeness function: arithmetic mean of weights© Lothar Thiele, ETH Zürich EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 18Hierarchical Clustering -Example (2)v 6 = v 2⋃v 55.5v 4v 61074v 4v 5v 2© Lothar Thiele, ETH ZürichEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 19Hierarchical Clustering -Example (3)v 7 = v 6⋃v 4v 75.5v 4v 6© Lothar Thiele, ETH Zürich EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 20Hierarchical Clustering -Example (4)v 7 = v 6⋃v 4v 4v 6 = v 2⋃v 5v 5 = v 1⋃v 3v 1v 2v 3Step 1:Step 2:Step 3:Cut lines(partitions)© Lothar Thiele, ETH ZürichEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 21Iterative Methods•Simple greedy heuristic•Until there is no improvement in cost: re-group a pair ofobjects which leads to the largest gain in costv 9v 2v 4v 5v 7v 1v 3v 6v 8Example: Cost = number of edges crossing the partitionsBefore re-group: 5 ; after re-group: 4 ; gain = 1© Lothar Thiele, ETH Zürich EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 22Kernighan-Lin•Problem•Simple greedy heuristic can get stuck in a localminimum•Kernighan-Lin algorithm:•As long as a better partition is found–From all possible pairs of objects, virtually re-group the “best” (lowestcost of the resulting partition); then from the remaining not yettouched objects virtually re-group the “best” pair, etc., until all objectshave been re-grouped–From these n/2 partitions take the one with smallest cost and actuallyperform the corresponding re-group operations–O(n 2log n ) complexity•Still can get stuck in local minimum–Among sequences of moves© Lothar Thiele, ETH ZürichEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 23Lecture 10: Outline✓Accelerated system design✓When to use accelerators✓Performance analysis✓HW/SW partitioning✓Decomposition✓Partitioning heuristics•System-level design•MPSoC trends EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 24Many More Implementation Choices•Microprocessors •Microcontrollers•Domain-specific processors•DSP•Graphics/networkprocessors•ASIPs•Reconfigurable SoC•FPGA•Gatearray•ASIC Speed Power CostHigh LowVolume© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 25Heterogeneous Processors•Many types of programmable processors•Past/now: micro-processor/-controller, DSP•Now/future: graphics, network, crypto, game, … processor•Application-specific instruction-set processor (ASIP)•Processors with instruction-sets tailored to specificapplications or application domains–Instruction-set generation as part of synthesis– e.g. Tensilica•Pluses:–Customization yields lower area, power etc.•Minuses:–Higher h/w & s/w development overhead–Design, compilers, debuggers© Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 26DSP core 1Modem DSP core 2Sound codec ASIP core 1Master control ASIP core 2Mem. controller ASIP core 3Bit manip.VLIW DSP Programmable video operations, std. extensions A/D&D/A Hardware Accelerators Video operators for DCT,inv. DCT, motion estim.Memory(RAM)Glue Logic I/O: S interfaceI/O: Host interfaceEmbeddedSoftwareHardware:Std. cell andMemoryDesigned by theR&D group at SGSThompsonMPSoC: Video Telephone© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 27IP-Based DesignSource: A. Sangiovanni-Vincentelli, UC Berkeley © Margarida Jacome, UT Austin EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 28Platform MappingSource: A. Sangiovanni-Vincentelli, UC Berkeley© Margarida Jacome, UT AustinEE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 29Design Space Exploration•Iterative process•Determine mapping•Evaluate solutionsApplication Architecture MappingEstimation© Lothar Thiele, ETH Zürich EE382V: SoC Design, Lecture 10© 2014 A. Gerstlauer 30MPSoC Synthesis Approaches•Design space exploration•Multi-objective•Pareto optimalityTraditional HW/SW co-design approaches not sufficientEE382V: Embedded System Design & ModelingBelow is given annual work summary, do not need friends can download after editor deleted Welcome to visit againXXXX annual work summaryDear every leader, colleagues:Look back end of XXXX, XXXX years of work, have the joy of success in your work, have a collaboration with colleagues, working hard, also have disappointed when encountered difficulties and setbacks. Imperceptible in tense and orderly to be over a year, a year, under the loving care and guidance of the leadership of the company, under the support and help of colleagues, through their own efforts, various aspects have made certain progress, better to complete the job. For better work, sum up experience and lessons, will now work a brief summary.To continuously strengthen learning, improve their comprehensive quality. With good comprehensive quality is the precondition of completes the labor of duty and conditions. A year always put learning in the important position, trying to improve their comprehensive quality. Continuous learning professional skills, learn from surrounding colleagues with rich work experience, equip themselves with knowledge, the expanded aspect of knowledge, efforts to improve their comprehensive quality.The second Do best, strictly perform their responsibilities. Set up the company, to maximize the customer to the satisfaction of the company's products, do a good job in technical services and product promotion to the company. And collected on the properties of the products of the company, in order to make improvement in time, make the products better meet the using demand of the scene.Three to learn to be good at communication, coordinating assistance. On‐site technical service personnel should not only have strong professional technology, should also have good communication ability, a lot of a product due to improper operation to appear problem, but often not customers reflect the quality of no, so this time we need to find out the crux, and customer communication, standardized operation, to avoid customer's mistrust of the products and even the damage of the company's image. Some experiences in the past work, mentality is very important in the work, work to have passion, keep the smile of sunshine, can close the distance between people, easy to communicate with the customer. Do better in the daily work to communicate with customers and achieve customer satisfaction, excellent technical service every time, on behalf of the customer on our products much a understanding and trust.Fourth, we need to continue to learn professional knowledge, do practical grasp skilled operation. Over the past year, through continuous learning and fumble, studied the gas generation, collection and methods, gradually familiar with and master the company introduced the working principle, operation method of gas machine. With the help of the department leaders and colleagues, familiar with and master the launch of the division principle, debugging method of the control system, and to wuhan Chen Guchong garbage power plant of gas machine control system transformation, learn to debug, accumulated some experience. All in all, over the past year, did some work, have also made some achievements, but the results can only represent the past, there are some problems to work, can't meet the higher requirements. In the future work, I must develop the oneself advantage, lack of correct, foster strengths and circumvent weaknesses, for greater achievements. Looking forward to XXXX years of work, I'll be more efforts, constant progress in their jobs, make greater achievements. Every year I have progress, the growth of believe will get greater returns, I will my biggest contribution to the development of the company, believe inyourself do better next year!I wish you all work study progress in the year to come.。
F+EPC的资源分配一、背景介绍在F+EPC（Flexible Evolved Packet Core）网络中，资源分配是一项至关重要的任务。
F+EPC是一种灵活的移动通信核心网架构，能够满足不同移动网络场景下的需求。
资源分配的目标是合理分配网络中的带宽、频谱、计算资源等，以确保网络的高性能和高效能。
二、资源分配原则1. 带宽分配原则在F+EPC网络中，带宽是一项宝贵的资源，需要根据不同业务的需求进行分配。
带宽分配原则如下：- 高效利用带宽资源，避免带宽闲置。
- 根据业务的实时性和重要性，优先保障关键业务的带宽需求。
- 根据用户数量和业务负载，动态调整带宽分配策略，以满足网络中不同用户和业务的需求。
2. 频谱分配原则频谱是无线通信领域中最稀缺的资源之一。
在F+EPC网络中，频谱分配是实现高速、稳定通信的关键。
频谱分配原则如下：- 优先考虑业务和用户的需求，合理分配频谱资源。
- 根据不同业务和用户的业务需求，动态调整频谱分配策略。
- 通过频谱的动态共享，提高频谱利用率，避免频谱浪费。
3. 计算资源分配原则在F+EPC网络中，计算资源是支撑网络运行和业务处理的关键资源。
计算资源分配原则如下：- 根据业务的需求和优先级，合理分配计算资源。
- 根据用户数量和业务负载，动态调整计算资源分配策略。
- 提高计算资源利用率，避免资源闲置。
三、资源分配策略1. 带宽分配策略带宽分配策略是根据网络中的业务需求和带宽资源情况确定的。
常见的带宽分配策略包括：- 固定带宽分配：为关键业务和高优先级业务分配固定的带宽资源，以保障其通信质量和服务水平。
- 弹性带宽分配：根据网络中不同业务的实时需求，动态调整带宽分配，以适应业务负载的变化。
2. 频谱分配策略频谱分配策略是根据网络中的业务需求和频谱资源情况确定的。
常见的频谱分配策略包括：- 静态频谱分配：为不同业务分配固定的频谱资源，以满足其通信需求。
- 动态频谱分配：根据不同业务的实时需求，动态调整频谱分配，以提高频谱利用效率。
General DescriptionThe Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This family of products integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex™-A53 and dual-core Arm Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device. Also included are on-chip memory, multiport external memory interfaces, and a rich set of peripheral connectivity interfaces.Processing System (PS)Arm Cortex-A53 Based Application Processing Unit (APU)•Quad-core or dual-core•CPU frequency: Up to 1.5GHz •Extendable cache coherency •Armv8-A Architecture o 64-bit or 32-bit operating modes o TrustZone security o A64 instruction set in 64-bit mode,A32/T32 instruction set in 32-bit mode•NEON Advanced SIMD media-processing engine •Single/double precision Floating Point Unit (FPU)•CoreSight™and Embedded Trace Macrocell (ETM)•Accelerator Coherency Port (ACP)•AXI Coherency Extension (ACE)•Power island gating for each processor core •Timer and Interrupts o Arm Generic timers support o Two system level triple-timer counters o One watchdog timer o One global system timer •Caches o 32KB Level 1, 2-way set-associativeinstruction cache with parity (independent for each CPU)o 32KB Level 1, 4-way set-associative datacache with ECC (independent for each CPU)o 1MB 16-way set-associative Level 2 cachewith ECC (shared between the CPUs)Dual-core Arm Cortex-R5 Based Real-Time Processing Unit (RPU)•CPU frequency: Up to 600MHz •Armv7-R Architecture o A32/T32 instruction set•Single/double precision Floating Point Unit (FPU)•CoreSight™ and Embedded Trace Macrocell (ETM)•Lock-step or independent operation •Timer and Interrupts:o One watchdog timer o Two triple-timer counters•Caches and Tightly Coupled Memories (TCMs)o 32KB Level 1, 4-way set-associativeinstruction and data cache with ECC (independent for each CPU)o 128KB TCM with ECC (independent for eachCPU) that can be combined to become 256KB in lockstep modeOn-Chip Memory•256KB on-chip RAM (OCM) in PS with ECC•Up to 36Mb on-chip RAM (UltraRAM) with ECC in PL•Up to 35Mb on-chip RAM (block RAM) with ECC in PL•Up to 11Mb on-chip RAM (distributed RAM) in PLDS891 (v1.8) October 2, 2019Product Specification找FPGA 和CPLD 可编程逻辑器件，上深圳宇航军工半导体有限公司Zynq UltraScale+ MPSoC Data Sheet: OverviewArm Mali-400 Based GPU•Supports OpenGL ES 1.1 and 2.0•Supports OpenVG 1.1•GPU frequency: Up to 667MHz•Single Geometry Processor, Two Pixel Processors •Pixel Fill Rate: 2 Mpixels/sec/MHz•Triangle Rate: 0.11 Mtriangles/sec/MHz•64KB L2 Cache•Power island gatingExternal Memory Interfaces•Multi-protocol dynamic memory controller •32-bit or 64-bit interfaces to DDR4, DDR3, DDR3L, or LPDDR3 memories, and 32-bitinterface to LPDDR4 memory•ECC support in 64-bit and 32-bit modes•Up to 32GB of address space using single or dual rank of 8-, 16-, or 32-bit-wide memories •Static memory interfaceso eMMC4.51 Managed NAND flash supporto ONFI3.1 NAND flash with 24-bit ECCo1-bit SPI, 2-bit SPI, 4-bit SPI (Quad-SPI), or two Quad-SPI (8-bit) serial NOR flash8-Channel DMA Controller•Two DMA controllers of 8-channels each •Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and scatter-gathertransaction supportSerial Transceivers•Four dedicated PS-GTR receivers andtransmitters supports up to 6.0Gb/s data rateso Supports SGMII tri-speed Ethernet, PCIExpress® Gen2, Serial-ATA (SATA), USB3.0,and DisplayPortDedicated I/O Peripherals and Interfaces•PCI Express — Compliant with PCIe® 2.1 base specificationo Root complex and End Point configurationso x1, x2, and x4 at Gen1 or Gen2 rates •SATA Hosto 1.5, 3.0, and 6.0Gb/s data rates as defined by SATA Specification, revision 3.1o Supports up to two channels •DisplayPort Controllero Up to 5.4Gb/s rateo Up to two TX lanes (no RX support)•Four 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 supporto Scatter-gather DMA capabilityo Recognition of IEEE Std 1588 rev.2 PTP frames o GMII, RGMII, and SGMII interfaceso Jumbo frames•Two USB 3.0/2.0 Device, Host, or OTG peripherals, each supporting up to 12 endpointso USB 3.0/2.0 compliant device IP coreo Super-speed, high- speed, full-speed, and low-speed modeso Intel XHCI- compliant USB host•Two full CAN 2.0B-compliant CAN bus interfaces o CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard compliant•Two SD/SDIO 2.0/eMMC4.51 compliantcontrollers•Two full-duplex SPI ports with three peripheral chip selects•Two high-speed UARTs (up to 1Mb/s)•Two master and slave I2C interfaces•Up to 78 flexible multiplexed I/O (MIO) (up to three banks of 26 I/Os) for peripheral pinassignment•Up to 96 EMIOs (up to three banks of 32 I/Os) connected to the PLInterconnect•High-bandwidth connectivity within PSand between PS and PL•Arm AMBA® AXI4-based•QoS support for latency and bandwidth control •Cache Coherent Interconnect (CCI)System Memory Management •System Memory Management Unit (SMMU)•Xilinx Memory Protection Unit (XMPU) Platform Management Unit•Power gates PS peripherals, power islands, and power domains•Clock gates PS peripheral user firmware option Configuration and Security Unit •Boots PS and configures PL•Supports secure and non-secure boot modes System Monitor in PS•On-chip voltage and temperature sensingTable 6:Zynq UltraScale+MPSoC: EV Device-Package Combinations and Maximum I/OsPackage(1)(2)(3)(4)Package Dimensions(mm)ZU4EV ZU5EV ZU7EV HD, HP GTH, GTY HD, HP GTH, GTY HD, HP GTH, GTYSFVC784(5)23x2396, 1564, 096, 1564, 0FBVB90031x3148, 15616, 048, 15616, 048, 15616, 0FFVC115635x3548, 31220, 0FFVF151740x4048, 41624, 0Zynq UltraScale+ MPSoCsA comprehensive device family, Zynq UltraScale+ MPSoCs offer single-chip, all programmable,heterogeneous multiprocessors that provide designers with software, hardware, interconnect, power, security, and I/O programmability. The range of devices in the Zynq UltraScale+MPSoC family allows designers to target cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each Zynq UltraScale+MPSoC contains the same PS, the PL, Video hard blocks, and I/O resources vary between the devices.The Zynq UltraScale+ MPSoCs are able to serve a wide range of applications including:•Automotive: Driver assistance, driver information, and infotainment•Wireless Communications: Support for multiple spectral bands and smart antennas•Wired Communications: Multiple wired communications standards and context-aware network services •Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics •Smarter Vision: Evolving video-processing algorithms, object detection, and analytics•Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safetyThe UltraScale MPSoC architecture provides processor scalability from 32 to 64 bits with support for virtualization, the combination of soft and hard engines for real-time control, graphics/video processing, waveform and packet processing, next-generation interconnect and memory, advanced powermanagement, and technology enhancements that deliver multi-level security, safety, and reliability. Xilinx offers a large number of soft IP for the Zynq UltraScale+MPSoC family. Stand-alone and Linux device drivers are available for the peripherals in the PS and the PL. Xilinx’s Vivado® Design Suite, SDK™, and PetaLinux development environments enable rapid product development for software, hardware, and systems engineers. The Arm-based PS also brings a broad range of third-party tools and IP providers in combination with Xilinx's existing PL ecosystem.The Zynq UltraScale+MPSoC family delivers unprecedented processing, I/O, and memory bandwidth in the form of an optimized mix of heterogeneous processing engines embedded in a next-generation, high-performance, on-chip interconnect with appropriate on-chip memory subsystems. Theheterogeneous processing and programmable engines, which are optimized for different application tasks, enable the Zynq UltraScale+ MPSoCs to deliver the extensive performance and efficiency required to address next-generation smarter systems while retaining backwards compatibility with the original Zynq-7000 All Programmable SoC family. The UltraScale MPSoC architecture also incorporates multiple levels of security, increased safety, and advanced power management, which are critical requirements of next-generation smarter systems. Xilinx’s embedded UltraFast™ design methodology fully exploits theTable 7:Zynq UltraScale+ MPSoC Device FeaturesCG DevicesEG DevicesEV DevicesAPU Dual-core Arm Cortex-A53Quad-core Arm Cortex-A53Quad-core Arm Cortex-A53RPU Dual-core Arm Cortex-R5Dual-core Arm Cortex-R5Dual-core Arm Cortex-R5GPU –Mali-400MP2Mali-400MP2VCU––H.264/H.265。
Network Interface Generation for MPSOC: from Communication Service Requirements to RTL ImplementationArnaud Grasset, Frédéric Rousseau, Ahmed A. JerrayaSLS Group, TIMA Laboratory46 avenue Félix Viallet, 38031 Grenoble Cedex, France{Arnaud.Grasset, Frederic.Rousseau, Ahmed.Jerraya}@imag.frAbstractTo deal with the increasing complexity of electronic products, multiprocessor SoCs are more and more used.These systems are designed by composition of components communicating through a communication network, which means that some network interfaces should be inserted to adapt computation components with the communication network. This paper deals with the automatic generation of network interfaces by composition of hardware components. The goal of our methodology is to ease the HW/SW integration. This methodology starts from a description of the communication services the network interface has to provide. This model is then refined to an abstract model of the interface used to generate the architecture. An RTL model is then implemented.1.IntroductionSubmicronic technology allows the integration on the same chip of µPs, IP, memories, shared bus ... Such a system is called Multiprocessor System-on-chip (MPSoC). To fulfill the integration of an increasingly large number of components on the same chip, design methods allowing the decoupling of communication and computations have been proposed [1][2]. The design of such a system is done by assembling reusable components, usually described at RT level.As the decisions taken early in the design process are of primary importance for the quality of the system, it is thus necessary to be able to quickly evaluate in an effective way the architectural decisions thanks to prototyping. The automatic architecture generation from a high-level system description frees the designer from the interface details required for the architecture design to focus on more valuable decisions (components allocation, communication synthesis). To connect all these components with the communication network, network interfaces are needed. As the communication becomes more and more complex [3], the design of network interfaces is more and more difficult and has to be studied thoroughly. Moreover, their design is error-prone and time consuming. Their automatic generation is a challenge and would allow a better architecture exploration by reducing the time ofa design/evaluation cycle.We propose a new methodology for the automatic generation of network interfaces from a communication service specification. Our flow is based on a flexible assembly of basic components thanks to the use of an abstract model of the network interface (NI). The goal of this work is to define the basic concepts and the different steps of a network interface generation tool. This tool is being developed.The paper is organized as follows. The second section presents the difficulties of the network interface design. The third section presents the NI specification. Then we propose our flow in the section 4.2. Design of Network Interfaces2.1 The problemMPSoC is composed by heterogeneous componentsin terms of:o implementation: HW or SWo type: computation or communicationo protocolso physical interface: bus width, bandwidth, ctrl signalso clock domains: Globally Asynchronous, Locally Synchronous (GALS)The main design problem comes from their assembly. Network Interface design requires much designer knowledge (HW and SW implementation, HW/SW integration, protocols) involved in the system. As the communication should be adapted to the application, the NI has to be redesigned according to the application requirements (message-passing/shared-memory communication model, high-bandwidth, low-latency). So their automatic generation is of a particular interest.2.2 Related workThe automatic generation of NI has already been studied and we can see two different approaches: by synthesis or by composition. The synthesis approach [4][5][6][7] uses a formal description of the interface (graph based or grammatical) and extracts from it a kind of FSM that could be synthesized after a translation in a HDL. These methods offer higher level of abstraction for the design of NI but they are either still manual, or they limit the interface generated to a point-to-point adaptation. We think that these methods are badly adapted to the GALS approach and to the realization of complex NI.The composition approach [8][9][10] uses component library and a composition tool. These methods take as input the system architecture. They are based on the selection, configuration and assembly of library components. The main drawbacks of this kind of methods are their need of huge libraries and their use of only one assembly model that constrains the design.In the computer network community, the ISO-OSI reference model [11] is the reference model for the communication description. [12] suggests a function-based model to describe the communication with more flexibility and gives a methodology for its SW implementation. The automatic refinement of such models of communication services into an efficient hardware implementation of NI has never been treated to our knowledge.We think that the previous works are not sufficient to solve all the problems of their automatic generation, more especially as communication becomes more and more complex. In our opinion, the important problems are now: the HW/SW integration, the lack of flexibility in existing methods, the need of more efficient methods to support advanced communication services. 2.3 A composition approachWe narrow our contribution to the network interface problem between processor and communication network. We choose a composition approach as we think that such an approach is better suited for the design of complex NI. The goals of our methodology are to:o target the NI to the requirements of the applicationo decrease the time for the realization of the librarieso decrease the time for the introduction of new componentso support advanced communication services (MPI, …) o ease the HW/SW integrationOur interface specification is a communication model which could also be used for the SW communication driver generation. The whole communication system could be described with this model. To adapt to the application requirements, the critical point is the flexibility in the assembly of the components. The purpose of our work is the definitionof a methodology for the selection and composition of library components in accordance with service requirements. Our method allows the use of different types of components and different assembly schemes. 3. Network Interface Specification3.1 System specificationIn our methodology, the system is represented by a virtual architecture [1]. This model represents an abstract architecture which is composed of a set of virtual modules interconnected through a communication network (figure 1.a). Each virtual module consists of a module and its wrapper. From the module point of view, the wrapper represents an abstraction of the communications. The wrapper is composed of virtual ports. In our case, the module is a SW component which has to be connected to a RTL communication network. So a virtual port abstracts the communication drivers, the processor and the NI.Drivertasksb)Drivertasksa)Communication NetworkvirtualarchitectureRTLarchitectureFigure 1: adopted design flow3.2 Refinement principleFigure 1.b shows the system refined at the RT level. The SW components are refined in a set of application tasks running on a processor. The wrapper is refined ina SW part and in a HW part. The SW part correspondsto the Operating System and communication drivers. The HW part is the network interface. The objective of the NI refinement is to produce a synthesizable modelat the RT level.3.3 Network interface specificationThe virtual ports are specified with a communication model as described in [12]. The virtual ports have to offer the services required by the application dealing with the available services of thenetwork. The specification of the virtual ports is composed of protocol functions (figure 2). Each protocol function requires and provides services. A service is a set of functionalities provided by a protocol function to another protocol function. A protocol function is a functional component. It can be implemented in HW or in SW.medium accessmedium accessFigure 2: virtual port specificationThe protocol functions realize a set of operations defining the communication protocol. The protocol is aset of rules for the transfer operations and the exchanged data format. A service indicates what a protocol function could do for another protocol function (e.g. transfer a message). The protocol function defines how it is done (synchronization, data format …). The objective of each protocol function is to offer services to other protocol function without they know how they are realized. So the service and the implementation are completely decoupled. Our motivation for the use of such a model is to ease the system design by allowing a clear decoupling between the computation and the communication, and between the HW and the SW. The virtual port VP2 on the figure 2 is an example of a specification for a point-to-point communication by the intermediary of a FIFO. The ASFIFO out protocol function indicates that we use the ASFIFO protocol. This protocol function uses a FIFO which enables the sender/receiver synchronization. The medium access protocol function is responsible of the physical data transfer on the communication network. The specification of the virtual ports contains the list of the operations that the virtual ports have to do to fulfill the communication service requirements. These virtual ports are implemented both in SW (communication drivers) and in HW (NI). For the moment, the designer has to decide the set of the protocol functions that are implemented in SW and in HW. The set of the protocol functions implemented in HW represents the NI specification. This specification does not make any assumptions on the design of the NI. As we use a composition approach, some library components are selected and assembled to generate the NI from the NI specification. It is detailed in the nextsection.4. Network Interface Generation Flow4.1 Our design flowOur goal is the design automation of the NI. Our flow is based on four models and three steps (figure 3). The first refinement called functional analysis transforms the NI specification into an abstract network interface. To enable a better selection and a better assembly of the components, the abstract network interface is more appropriate than the NI specification. The second step generates the architecture of the system. The goal of this step is to explore the design space. It enables the method to generate several architectures. The implementation step selects and configures the RTL components taken from a library. By using libraries, we can generate NI with different architectures. The architecture is mainly limited by the functional analysis step (which keeps the same structure between NI specification and abstract NI) and by the availability of components in the library and their compatibility. So the NI is constrained by the specification, and we can only explore a limited range of possibilities. Another limitation is due to the link between the three libraries. Indeed, one protocol function may correspond to several generic components, and a generic component has at least one RTL implementation. This makes their design difficult as we are supposed to know the content of all libraries.Figure 3: our generation flow4.2 The different stepsThe NI specification describes the communication requirements without assumptions on its HW design. The functional analysis refines it in an abstract network interface. The abstract NI defines the basic operations (address translation, error detection, arbitration…) required to realize in HW the protocol functions, and the link between basic operations. Each elementary operation is described as an abstract component. Itsbehavior is known. As the resource allocation has not been done yet, these basic operations are named abstract components. The communication between abstract components is decided. The functional analysis lists the abstract components in order to respect the NI specification. The functional analysis has to be done accordingly to the quality of service required. The abstract interface model is useful for an efficient selection and composition of the HW library components.The architecture generation maps the different abstract components of the abstract NI on an architecture. To do this we need to assign the abstract components to generic components and to generate the interconnect topology between generic components. The protocol, the clock and reset signal are still abstracted. A generic component is a component which the behavior and the ports are fixed but not yet implemented. This step does architecture exploration.The third step of the flow is the implementation which generates a synthesizable RTL model of the network interface. For each generic component, a RTL component is selected in a library of RTL components and then configured accordingly to the application (bus size, FIFO size …). These components are then assembled. The selection must be made in order to have compatible components in terms of protocol, physical ports and of clock domains. With our methodology, a tool should select automatically RTL components to obtain the best trade off between the cost (area) and the performance (critical path). As a result, the designer does not need to know all the implementations available.4.3 Library needsThe presented methodology uses three libraries but we hope that the time for the realization of these libraries will be acceptable. By enabling more flexibility in the selection and assembly of components, the method enables to use smaller components which can be easily reused. As components are smaller, the time to add a component is shorter. By improving the library component reuse, the size of libraries may be fair. As the interface is composed of many different components, the realization of compatible components is an important point which is difficult. The clear breaking down of the flow in three steps eases the design of libraries. Indeed, one can design some generic components even if one does not know which protocol it is used for. It is also possible to model protocol function without to know the RTL components available. 4.4 Status of the workWe are working to develop a tool to automatically generate the NI starting from the NI specification. The architecture generation and the implementation couldbe largely automated but the functional analysis may require more decisions from the designer.5. ConclusionIn this paper, we presented a methodology for the generation of network interfaces. Our contributions arethe use of a communication model as specification anda design flow which separates the most important steps. The methodology and the use of library components give a huge flexibility in both the NI architecture and RTL implementation. This method seems promising with advanced communication schemes.6. References[1]W. Cesário and all, “Component-Based DesignApproach for Multicore SoCs”, DAC’02, USA.[2]J. A. Rowson, A. S.-Vincentelli, “Interface-BasedDesign”, DAC’97, USA.[3]L. Benini, G. De Micheli, “Networks on Chips: A NewSoC Paradigm”,IEEE Computer, vol. 35, January 2002. [4]J. Öberg, and all, “Grammar-based design of embeddedsystems”,Journal of Systems Architecture, Elsevier, vol.47, n° 3-4, April 2001.[5] A. Seawright and all, “A System for Compiling andDebugging Structured Data Processing Controllers”,Euro-DAC, Geneva, Switzerland, 1996.[6]R. Passerone, J. A. Rowson, A. S.-Vincentelli,“Automatic Synthesis of Interfaces betweenIncompatible Protocols”, DAC’98, USA.[7] B. Lin, S. Vercauteren, “Synthesis of ConcurrentSystem Interface Modules with Automatic ProtocolConversion Generation”,ICCAD, San Jose, USA, 1994. [8] D. Lyonnard, S. Yoo, A. Baghdadi, A. A. Jerraya:“Automatic Generation of Application-SpecificArchitectures for Heterogeneous MultiprocessorSystem–on-Chip”, DAC’01, USA.[9] D. Hommais, F. Pétrot, I. Augé, “A Practical Toolboxfor System Level Communication Synthesis”, RSP,Copenhagen, Denmark, 2001.[10]S. Vercauteren, B. Lin, H. De Man, “ConstructingApplication-Specific Heterogeneous Embedded Architectures from Custom HW/SW Applications”,DAC’96, USA.[11]A. S. Tanenbaum, Computer Networks, Prentice Hall,1996.[12]M. Zitterbart, B. Stiller, A. N. Tantawy, “A Model forFlexible High-Performance Communication Subsystems”, IEEE Journal on Selected Areas inCommunications, vol. 11, n°4, May 1993.。
