丹佛斯热量表2

参数表静态平衡阀MSV-F2, PN 16/25, DN 15 - 400描述MSV-F2 为静态平衡阀。

它用在供热和制冷定流量水系统中平衡流量。

这种阀门标配阀位指示和行程限制。

阀杆罩与行程限制集成为一体。

阀门设定值可被锁定。

在测量仪器PFM3000/4000中建有该阀门流量特性数据。

阀门不含石棉。

具有关断功能主要数据：• DN 15- 400• PN 16: - 水流温度: –10 °C … 130 °C • PN 25:- 水流温度: –10 °C … 150 °C• 阀门可安装与供水管或回水管上。

MSV-F2 DN 15-150应用MSV-F2 DN 200-400在定流量系统中，MSV 阀门可保持恒定的压降。

根据预设定值，阀门可设定多种压降。

订货附件型号产品编号Rectus型快速测量接头003Z0108针式测量接头，2 件003Z0104加长型针式测量接头45 mm，2 件003Z0103针式测量接头连接件，2 件003Z0107 PFM4000测量仪器参见相关参数表型号产品编号手轮DN 15- 50003Z0179DN 65- 150003Z0180DN 200003Z0181DN 250- 300003Z0182DN 350- 400003Z0183MSV-F2 阀门 - PN 16公称直径DN 1520253240506580100125150200250300350400k vs （m 3/h ） 3.16.39.015.532.353.893.4122.3200.0304.4400.8685.6952.31380.22046.12584.6公称压力(Bar)16最大压降(Bar)1.5泄漏率 A 级：依照 ISO5208，表 5（无可见渗漏）流体介质水以及水与辅助冷却剂（如乙二醇）的混合物* ，用于闭式供暖和制冷系统流体最高温度(°C) 130连接符合 EN 1092-2 标准的法兰重量(闭式) 2.32.93.85.67.29.41721324356231354497747890阀体材料铸铁 EN-GJL 250 (GG 25)阀座密封EPDM圆锥材料CW602NCuSn5Zn5Pb5铸造不锈钢* 请向供应商确认材料与辅助冷却剂的相容性。

参数表RTD Inova TM型恒温阀传感器　E N 215 -1应用订货及参数RTD Inova TM3130RTD Inova TM3132RTD伊诺系列是散热器恒温阀的系列产品，适用于各种中央及独立的热水供暖系统。

RTD是气体填充的具有小型比例带的自力式比例调节型控制器。

可以保证室内温度恒定，提供一个高舒适性的环境，并可以有效地节能。

RTD伊诺系列恒温传感器包括：・　RTD Inova TM 3130：内置式传感 器并具有防冻功能，温度调节范围 ６－２６℃，可限制和锁定温度设定 值。

・ RTD Inova TM 3132：远程式传感 器并具有防冻功能，温度调节范围 ６－２６℃，可限制和锁定温度设定　 值。

RTD伊诺系列恒温传感器都可与RTD系列恒温阀阀体进行组合。

传感器和阀体的连接使用既简单又坚固的镀镍结合螺帽。

防盗配件可防止私自拆卸传感器。

RTD阀体和RTD　伊诺恒温传感器连接的技术数据符合欧洲标准EN215-1。

RTD伊诺恒温传感器类型订货编号特性毛细管长度　温度范围２）RTD Inova TM 3130013L3130内置式传感器－6-26℃RTD Inova TM 3132013L3132远程式传感器0-2m1)6-26℃1）出厂时，远程式传感器的所有毛细管盘绕在传感器内，安装时只拉出所需长度的毛细管即可。

2）Xp=2K的描述是，当室温高出设定室温２℃时，阀门即关闭。

参数表RTD Inova TM型恒温阀传感器传感器选择原则内置式传感器远程式传感器传感器必须安装在能时刻正确感受室内环境温度的位置：・　传感器不能被遮盖，如窗帘；・　传感器不能受气流影响；・　传感器应该水平安装。

如果竖直安装， 传感器将受到阀体和管道表面的散热 影响，导致错误动作。

・　传感器温度调节部分应容易触及。

远程式传感器应用在内置式传感器无法正确感受环境温度的地方：・　传感器不能被遮盖，如窗帘；・　传感器不能受气流影响；・　传感器应该水平安装；・　传感器温度调节部分应容易触及。

几种常用热量表对比———李伟、陈文利、刘瑞峰全国的供热计量改革正在逐步开展，特别是在近年来能源短缺，国家提倡节能减排，各地非常重视，供热改革也在同时进行，对供热改革中分户计量的热量表的需求也正在扩大，同时对热量表的性能、质量的要求也越来越高。

热量表是实现供热分户计量的根本终端，它能最终显示终端用户所用热能，通常以“kW•h”或“MJ”的形式出现，它的计量准确性直接关系到供热企业和用户之间的利益关系。

就国内热量表而言，可以说是质量参差不齐，性能鱼目混珠的现象十分普遍，这就是一些低价位的“有磁热量表”。

所谓“有磁”热量表就是在流量信号采集上采用的磁性（磁铁）传感器，如“韦根”，“霍尔”，“干簧管”等。

现在“霍尔、干簧管“采集信号已经被市场淘汰，而在热量表技术最成熟的西欧、北欧国家，根本就不允许使用“有磁”热量表。

另外一种热量表就是国际上应用十分广泛的“无磁”热量表，所谓“无磁”就是热量表在流量信号采集上利用电感振荡原理取得的，没有任何磁铁及磁性物质，它在西欧、北欧供热计量最成熟的地区占到90%的市场份额。

我们就“韦根”热量表即“有磁”热量表和“无磁”热量表做一下分析：一、“有磁”韦根热量表：缺点：1、韦根发讯的“有磁”热量表，在采集流量信号时，利用基表叶轮上的磁铁和韦根线圈相偶合，产生脉冲取得的，而叶轮上的磁铁是靠水流推动的，它在和韦根线圈偶合时消耗了水流的能量，产生的磁阻力会降低基表叶轮的转速和灵敏性，长期会影响准确计量。

2、韦根线圈抗干扰能力差，当外界放置磁铁时，韦根线圈势必受到干扰，会影响计量的准确性，在在一定角度放置磁铁时甚至会引起不计量现象，这样对热量的损失就大了。

3、韦根发讯中的磁铁会吸附水中的铁屑，这是磁铁的性质决定的。

磁铁吸附铁质后，会增加磁铁面积，降低单位磁通量，影响计理的准确性，随着磁铁吸附铁质的增加而增大，能引起不计量，甚至基表不转动。

4、韦根发讯中的磁铁，在供热环境中长期浸泡在热水中，而磁铁淬火就失去磁性，在热水中，磁铁也会产生褪磁现象，当磁铁褪磁后，热量表自然也就不计量了。

2011年热量表产品质量国家监督抽查结果本次共抽查了北京、天津、河北、山西、内蒙古、辽宁、黑龙江、江苏、浙江、安徽、福建、山东、河南、湖南、陕西、新疆等16个省、自治区、直辖市55家企业生产的55种热量表产品。

本次抽查依据《热量表》CJ128-2007标准的要求，对热量表产品的显示（显示内容、热量显示值）、强度和密封性、准确度、压力损失、重复性、安全要求（断电保护、电器绝缘性、封印）、运输、电气环境（干热、低温储存、电源电压变化、电快速瞬变、电磁场、电浪涌、工频磁场、静电放电）等8类18个项目进行了检验。

抽查发现有6种产品不符合标准的规定，涉及到准确度、重复性、运输、电快速瞬变、压力损失项目。

具体抽查结果见附件。

热量表产品质量国家监督抽查产品及其企业名单序号企业名称所在地产品名称商标规格型号产品等级生产日期（批号）抽查结果主要不合格项目承检机构1 北京添瑞祥仪器仪表有限公司北京市热量表 -- TRX,DN20 2级 2010-10合格天津市计量监督检测科学研究院2 北京德宝豪特能源科技有限公司北京市超声波热量表--HM-20-U/100,DN202级 2011-03合格天津市计量监督检测科学研究院3 北京嘉洁能科技有限公司北京市热量表 --JJNH-25/10S,DN252级 2011-03合格天津市计量监督检测科学研究院4 北京海林自控设备有限公司北京市超声波热能表HaiLin HU,DN25 2级 2011-04合格天津市计量监督检测科学研究院5 北京京源水仪器仪北京市机械热量表京源JYRL-20,DN20 3级 2011-07合格天津市计量监督检表有限公司测科学研究院6 天津市中天电子发展有限公司天津市智能热量表-- ZTH,DN20 2级2011-02-28/2011.3.3合格北京市计量检测科学研究院7 天津市国昂新技术发展有限公司天津市超声波热能量表国昂GHR-H,DN20 2级 2011-03-28合格北京市计量检测科学研究院8 天津市新岭电子技术有限公司天津市热量表 CETCDN25XL-C,DN253级2011-03-25/合格证4.6合格北京市计量检测科学研究院9 天津市光大伟业计量仪表技术有限公司天津市超声热量表光大伟业RL-2,DN25 2级 2011-04-01合格北京市计量检测科学研究院10 丹佛斯（天津）有限公司天津市超声波热表（图形）UHM-100,DN202级15.11(2011年第15周)合格北京市计量检测科学研究院11 承德泰宇热控工程技术有限公司河北省超声热量表泰宇热控TY-CRL,DN253级 2010-11-02合格北京市计量检测科学研究院12 唐山汇中仪表股份有限公司河北省户用超声热量表汇中CRL-H-20,DN22级 2011-04合格北京市计量检测科学研究院13 山西汾西电子科技有限公司山西省超声波式热量表皆利FCRL,DN20 2级 2011合格天津市计量监督检测科学研究院14 包头鸣翔仪器仪表有限责任公司内蒙古自治区机械式热量表鸣翔MXRB-20,DN23级 2011合格天津市计量监督检测科学研究院15 沈阳航发热计量技术有限公司辽宁省热量表 606 HFRB,DN20 3级 2011-03合格北京市计量检测科学研究院16 沈阳市航宇星仪表有限责任公司辽宁省热能表航宇星HYX-RN20,DN203级 2011-04合格北京市计量检测科学研究院17 大连世达科技有限公司辽宁省超声波热量表世达SD-H,DN20 3级 2011-04-20合格北京市计量检测科学研究院18 沈阳佳德联益能源科技有限公司辽宁省热量表佳德联益JDL Y,DN25 3级 2011-03合格北京市计量检测科学研究院19 哈尔滨荣耀科技开发有限公司黑龙江省热能表欧凯龙RY-H DN25 3级 2011-05-04合格北京市计量检测科学研究院20 江苏迈拓智能仪表有限公司江苏省热量表迈拓MTH-6/DN25KB, DN253级 2011-03-24合格北京市计量检测科学研究院21 常州剑湖智能仪表有限公司江苏省JHM热量表剑湖JHM-25,DN25 3级 2011-03-08合格北京市计量检测科学研究院22 连云港腾越电子科技有限公司江苏省TYR热量表（图形）TYR-DN20,DN203级 2011-06-23合格北京市计量检测科学研究院23 徐州丙辰电子有限公司江苏省热量表（图形）BCLR-20,DN23级 2011-04-03合格北京市计量检测科学研究院24 徐州润物科技发展有限公司江苏省热量表雨润RWKJ-20,DN23级 2011-04-14合格北京市计量检测科学研究院25 宁波东海热计量技术有限公司浙江省热量表东海（DongHai）LRS-20,DN20 3级 2011-03-07合格天津市计量监督检测科学研究院26 宁波百立康智能仪表有限公司浙江省热量表百立康BLKR-J,DN25 3级 2010-10-08合格天津市计量监督检测科学研究院27 浙江华仪电子工业有限公司浙江省超声波热量表乐业节能L YRB-US,DN252级 2011-03合格天津市计量监督检测科学研究院28 宁波甬港仪表有限公司浙江省超声波热能表甬港YG-RLM(C)-20,DN203级 2011-06-30合格天津市计量监督检测科学研究院29 宁波市精诚仪表有限公司浙江省超声波热量表精诚JCR,DN20 3级 2011合格天津市计量监督检测科学研究院30 宁波水表股份有限公司浙江省射流热能表宁波LRP-20,DN20 2级 2011-07合格天津市计量监督检测科学研究院31 浙江博凯仪表有限公司浙江省超声波热量表-- BKCR-P,DN25 2级 2011-03-30合格天津市计量监督检测科学研究院32 合肥瑞纳表计有限公司安徽省超声波热量表RUNA RC20,DN20 3级 2011-04-01合格天津市计量监督检测科学研究院33 泉州七洋机电有限公司福建省热量表七洋RL-1B-20,DN23级 2011.4(2011.3)合格北京市计量检测科学研究院34 济宁金水科技有限公司山东省热能表金衡JSHM-20 3级 2011-01合格天津市计量监督检测科学研究院35 威海震宇智能科技有限公司山东省热能表ZHENYUZY-20,DN20 3级 2011-04-02合格天津市计量监督检测科学研究院36 山东省德鲁计量科技有限公司山东省热能量 SDME-UWZ-5,DN22级 2011-04-09合格天津市计量监督检测科学研究院37 山东智方仪表科技有限公司山东省热能表智方ZFHM-20,DN23级 2011-04合格天津市计量监督检测科学研究院38 山东力创科技有限公司山东省热能表力创科技LCR-U20,DN23级 2011-04-09合格天津市计量监督检测科学研究院39 威海三实电器仪表有限公司山东省超声波热量表Sunts SM,DN20 3级 2011-04-12合格天津市计量监督检测科学研究院40 山东三龙智能技术有限公司山东省超声波热能表SARON SRL-C,DN20 2级 2011-04-07合格天津市计量监督检测科学研究院41 临沂沂光山东热能表沂光YGM,DN20 3级 2010-12 合天津市计热计量技术有限公司省格量监督检测科学研究院42 山东荷德鲁美特表计有限公司山东省超声波热量表HYDROMETERSHARKY773,DN202级 2011-04合格天津市计量监督检测科学研究院43 青岛海纳电气自动化系统有限公司山东省热能表 Hiwits SST,DN25 2级 2010-12合格天津市计量监督检测科学研究院44 威海市天罡仪表有限公司山东省超声波热量表普劳RC,DN25 3级 2011-04-07合格天津市计量监督检测科学研究院45 济南邦硕科技发展有限公司山东省热能表济南邦硕BS-2000,DN20 3级 2011-03合格天津市计量监督检测科学研究院46 河南新天科技股份有限公司河南省热量表新天RLB,DN20 3级 2011-04合格天津市计量监督检测科学研究院47 湖南威铭能源科技有限公司湖南省热量表威铭WMLR,DN20 2级 2011-04合格天津市计量监督检测科学研究院48 西安精准智能仪器有限责任公司陕西省热能表 JZH4NTZ-QMI-20H,DN203级 2011-04-20合格北京市计量检测科学研究院49 新疆驰达电气发展有限公司新疆自治区热量表驰达CDR,DN25 3级 2010合格天津市计量监督检测科学研究院50 欧福数控技术（大连）有限公司辽宁省IC卡热表（图形）OF-RNB25,DN253级 2010-10-21不合格准确度、重复性、运输、电快速瞬变北京市计量检测科学研究院51 沈阳太宇机电设备有限公司辽宁省热量表（图形）TN-A(B),DN203级 2011-04-14不合格电快速瞬变北京市计量检测科学研究院52 日照开元电子有限公司山东省超声波热能表-- DN20 2级 2010-12不合格准确度、压力损失、运输天津市计量监督检测科学研究院53 泰安三信电子有限公司山东省超声波热能表-- RC,DN20 2级 2010-12不合格准确度、重复性天津市计量监督检测科学研究院54 胜利油田裕丰昌晖自动化仪表有限公司山东省热能表 YFCH YFCH,DN20 2级 2011-03不合格准确度、压力损失、运输天津市计量监督检测科学研究院55 西安北斗星数码信息股份有限公司陕西省热量表北斗星云BDXHM-20,DN203级 2010-11-12不合格。

© by SEMIKRONRev. 1.0–24.04.20201®E1IGBT moduleSK25GD12T4ETE1Features*•Low inductive design•Press-Fit contact technology•Rugged mounting due to integrated mounting clamps•Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC)•Trench4 IGBT technology•Robust and soft switching CAL4F diode technology•Integrated NTC temperature sensor •UL recognized file no. E 63 532Typical Applications•Motor drives •Servo drives •Air conditioning •Auxiliary Inverters •UPSAbsolute Maximum Ratings SymbolConditions Values UnitIGBT 1V CES T j =25°C1200V I C λpaste =0.8 W/(mK)T j =175°C T s =25°C 38A T s =70°C 31A I Cλpaste =2.5 W/(mK)T j =175°C T s =25°C 45A T s =70°C 37A I Cnom 25A I CRM I CRM = 3 x I Cnom 75A V GES -20 (20)V t psc V CC =800V V GE ≤ 15V V CES ≤ 1200VT j =150°C10µs T j-40 (175)°CAbsolute Maximum Ratings SymbolConditions Values UnitDiode 1V RRM T j =25°C1200V I F λpaste =0.8 W/(mK)T j =175°C T s =25°C 30A T s =70°C 24A I F λpaste =2.5 W/(mK)T j =175°C T s =25°C 35A T s =70°C28A I Fnom 25A I FRM I FRM = 2 x I Fnom 50A I FSM 10ms sin 180°T j =25°C 100A T j =150°C100A T j-40 (175)°CAbsolute Maximum Ratings SymbolConditions Values UnitModule I t(RMS)∆T terminal at PCB joint = 30 K, per pin30A T stg -40...125°C V isolAC, sinusoidal, t =1min2500V2Rev. 1.0–24.04.2020© by SEMIKRON®E1IGBT moduleSK25GD12T4ETE1Features*•Low inductive design•Press-Fit contact technology•Rugged mounting due to integrated mounting clamps•Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC)•Trench4 IGBT technology•Robust and soft switching CAL4F diode technology•Integrated NTC temperature sensor •UL recognized file no. E 63 532Typical Applications•Motor drives •Servo drives •Air conditioning •Auxiliary Inverters •UPSIGBT 1V CE(sat)I C =25A V GE =15V chiplevel T j =25°C 1.85 2.10V T j =150°C 2.25 2.45V V CE0chiplevel T j =25°C 0.800.90V T j =150°C 0.700.80V r CEV GE =15V chiplevelT j =25°C 4248m ΩT j =150°C6266m ΩV GE(th)V GE = V CE , I C =0.85mA5 5.8 6.5V I CES V GE =0V,V CE =1200V, T j =25°C 1mA C ies V CE =25V V GE =0Vf =1MHz 1.43nF C oes f =1MHz 0.115nF C res f =1MHz0.085nF Q G V GE =-15V ... +15V 184nC R Gint T j =25°C 0Ωt d(on)V CC =600V I C =25AV GE =+15/-15V R G on =12ΩR G off =12Ωdi/dt on =535A/µs di/dt off =313A/µs dv/dt =4865V/µsT j =150°C 34ns t r T j =150°C 28ns E on T j =150°C 1.94mJ t d(off)T j =150°C 214ns t f T j =150°C 72ns E off T j =150°C 1.87mJ R th(j-s)per IGBT, λpaste =0.8 W/(mK) 1.16K/W R th(j-s)per IGBT, λpaste =2.5 W/(mK)0.84K/WCharacteristics SymbolConditionsmin.typ.max.UnitDiode 1V F I F =25A chiplevel T j =25°C 2.41 2.74V T j =150°C 2.45 2.79V V F0chiplevel T j =25°C 1.30 1.50V T j =150°C 0.90 1.10V r F chiplevelT j =25°C 4450m ΩT j =150°C6268m ΩI RRM I F =25A di/dt off =535A/µs V GE =-15VV CC =600VT j =150°C 15A Q rr T j=150°C3.8µC E rr T j =150°C 1.48mJ R th(j-s)per Diode, λpaste =0.8 W/(mK) 1.67K/W R th(j-s)per Diode, λpaste =2.5 W/(mK)1.3K/W© by SEMIKRONRev. 1.0–24.04.20203®E1IGBT moduleSK25GD12T4ETE1Features*•Low inductive design•Press-Fit contact technology•Rugged mounting due to integrated mounting clamps•Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC)•Trench4 IGBT technology•Robust and soft switching CAL4F diode technology•Integrated NTC temperature sensor •UL recognized file no. E 63 532Typical Applications•Motor drives •Servo drives •Air conditioning •Auxiliary Inverters •UPSModule M s to heatsink 1.62.3Nm wweight25gCharacteristics SymbolConditionsmin.typ.max.UnitTemperature Sensor R 100T r =100°C493 ± 5%ΩB 100/125R (T)=R 100exp[B 100/125(1/T-1/T 100)]; T[K];3550 ±2%K4Rev. 1.0–24.04.2020© by SEMIKRON© by SEMIKRON Rev. 1.0–24.04.202056Rev. 1.0–24.04.2020© by SEMIKRON© by SEMIKRON Rev. 1.0–24.04.20207This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.8。

2013年丹佛斯Performer-M系列冷冻涡旋压缩机参数对照表
注：每台压缩机均带安装附件（包括4个橡胶垫圈和4个钢制安装套管）。

美国产压缩机为黑色，中国产压缩机为蓝色。

第 1 页
注：每台压缩机均带安装附件（包括4个橡胶垫圈和4个钢制安装套管）。

美国产压缩机为黑色，中国产压缩机为蓝色。

第 2 页
注：每台压缩机均带安装附件（包括4个橡胶垫圈和4个钢制安装套管）。

美国产压缩机为黑色，中国产压缩机为蓝色。

第 3 页
第 4 页
注：每台压缩机均带安装附件（包括4个橡胶垫圈和4个钢制安装套管）。

美国产压缩机为黑色，中国产压缩机为蓝色。

希望以上资料对你有所帮助，附励志名言3条：：
1、世事忙忙如水流，休将名利挂心头。

粗茶淡饭随缘过，富贵荣华莫强求。

2、“我欲”是贫穷的标志。

事能常足，心常惬，人到无求品自高。

3、人生至恶是善谈人过；人生至愚恶闻己过。

第 5 页。

附件：
山东省供热计量产品推荐目录（第一批）
一、国产热量表
1、威海震宇智能科技有限公司
ZY型智能机械式热量表（带远传功能）
2、威海市天罡仪表有限公司
RC型超声波热量表（带远传功能）
3、青岛海纳电气自动化系统有限公司
海威茨SST型机械式热能表（带远传功能）
4、山东力创科技有限公司
LCR型机械式热量表（带远传功能）
5、天津市光大伟业计量仪表技术有限公司
RL型超声波热量表（带远传功能）
二、进口热量表
1、山东荷德鲁美特表计有限公司
SHARKY型超声波热量表（带远传功能）
2、兰吉尔仪表系统（珠海）有限公司
2WR6型、UH50型超声波热量表（带远传功能）
三、流温法
山东联强节能科技有限公司
QEM热量分摊系统（准恒流焓差法热量分配分摊系统）
四、温度法
北京晟龙世纪科技发展有限责任公司
WDRB型温度法热计量分配系统
五、温控装置
1、欧文托普阀门系统（北京）有限公司
AZ型散热器恒温阀
2、烟台好享水暖仪表有限责任公司
HX型散热器恒温阀
3、丹佛斯（上海）自动控制有限公司
RA型散热器恒温阀。

© by SEMIKRONRev. 1.1–02.02.20221SEMITOP ®4IGBT moduleEngineering Sample SK 80 GD 12F4 T Target Data Features*•One screw mounting module•Fully compatible with SEMITOP ® 1,2,3•Improved thermal performances by aluminium oxide substrate •Trench4 Fast IGBT technology •CAL4F technology FWD•Integrated NTC temperature sensor •UL recognized, file no. E 63 532Typical Applications•InverterAbsolute Maximum Ratings SymbolConditions Values UnitIGBT 1V CES T j =25°C 1200V I C T j =150°C T s =25°C 82A T s =70°C 63A I CT j =175°CT s =25°C 91A T s =70°C74A I Cnom 80A I CRM 160A V GES -20 (20)V t psc V CC =800V V GE ≤ 15V V CES ≤ 1200VT j =150°C10µs T j-40 (175)°CAbsolute Maximum Ratings SymbolConditions Values UnitDiode 1V RRM T j =25°C 1200V I F T j =150°C T s =25°C 90A T s =70°C 67A I F T j =175°CT s =25°C 101A T s =70°C80A I FRM 200A I FSM 10ms, sin 180°, T j =150°C 550A T j-40 (175)°CAbsolute Maximum Ratings SymbolConditions Values UnitModule I t(RMS)∆T terminal at PCB joint = 30 K, per pin60A T stg -40...125°C V isolAC, sinusoidal, t =1min2500V2Rev. 1.1–02.02.2022© by SEMIKRONSEMITOP ®4IGBT moduleEngineering Sample SK 80 GD 12F4 T Target Data Features*•One screw mounting module•Fully compatible with SEMITOP ® 1,2,3•Improved thermal performances by aluminium oxide substrate •Trench4 Fast IGBT technology •CAL4F technology FWD•Integrated NTC temperature sensor •UL recognized, file no. E 63 532Typical Applications•InverterIGBT 1V CE(sat)I C =80A V GE =15V chiplevel T j =25°C 2.05 2.40V T j =150°C 2.59 2.85V V CE0chiplevel T j =25°C 0.800.90V T j =150°C 0.700.80V r CEV GE =15V chiplevel T j =25°C 1619m ΩT j =150°C2426m ΩV GE(th)V GE = V CE , I C =3mA5.2 5.86.4V I CES V GE =0V V CE =1200V T j =25°C1.36mA -mA C ies V CE =25V V GE =0V f =1MHz 4.60nF C oes f =1MHz 0.37nF C res f =1MHz0.27nF Q G V GE =-15V...+15V 275nC R Gint T j =25°C 2.4Ωt d(on)V CC =600V I C =80AV GE neg =-15V V GE pos =15V R G on =3.3ΩR G off =3.3Ωdi/dt on =2300A/µs di/dt off =2200A/µsT j =150°C 155ns t r T j =150°C 51ns E on T j =150°C 5.8mJ t d(off)T j =150°C 345ns t f T j =150°C 42ns E off T j =150°C 5mJ R th(j-s)per IGBT, λpaste =0.8 W/(mK)0.51K/WCharacteristics SymbolConditionsmin.typ.max.UnitDiode 1V F I F =100A chiplevel T j =25°C 2.20 2.52V T j =150°C 2.15 2.47V V F0chiplevel T j =25°C 1.30 1.50V T j =150°C 0.90 1.10V r F chiplevelT j =25°C 9.010m ΩT j =150°C1314m ΩI RRM I F =80A di/dt off =2300A/µs V GE =-15VV CC =600VT j =150°C 41A Q rr T j=150°C11µC E rr T j =150°C 6.5mJ R th(j-s)per Diode, λpaste =0.8 W/(mK)0.65K/W© by SEMIKRONRev. 1.1–02.02.20223SEMITOP ®4IGBT moduleEngineering Sample SK 80 GD 12F4 T Target Data Features*•One screw mounting module•Fully compatible with SEMITOP ® 1,2,3•Improved thermal performances by aluminium oxide substrate •Trench4 Fast IGBT technology •CAL4F technology FWD•Integrated NTC temperature sensor •UL recognized, file no. E 63 532Typical Applications•InverterModule M s to heatsink 2.52.75Nm wweight60gCharacteristics SymbolConditionsmin.typ.max.UnitTemperature Sensor R 100T r =100°C493 ± 5%ΩB 100/125R (T)=R 100exp[B 100/125(1/T-1/T 100)]; T[K];3550 ±2%K4Rev. 1.1–02.02.2022© by SEMIKRON© by SEMIKRON Rev. 1.1–02.02.202256Rev. 1.1–02.02.2022© by SEMIKRONThis is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.In accordance with the quality guidelines of SEMIKRON, we would like to point out that the products are engineering samples. These engineering samples are not yet produced under quality conditions approaching those of series production, and are at the present time not included in the SEMIKRON quality monitoring and control process. Neither the product nor the production process has to date gone completely through the SEMIKRON internal authorization procedure. SEMIKRON may make any amendments without any prior notification. SEMIKRON cannot and shall not promise or commit itself to release and/or make available a final version or series product after the development phase. SEMIKRON cannot and will not assume any responsibility with regard to freedom from defects, functionality, and adaptation to and interaction with possible applications of the user or with regard to any other potential risks resulting from the use of engineering samples. Therefore SEMIKRON explicitly excludes any warranty and liability; as far as legally possible. The customer shall fully indemnify and hold harmless SEMIKRON from any and all risks, damages, losses, expenses and costs directly or indirectly resulting out of or in connection with the commissioning, operation, system integration, sale, dissemination or any other kind of use of engineering samples by the customer and/or any third party, which has come into possession of engineering samples through or because of the customer. All know-how and all registerable and non-registerable copyrights and industrial property rights arising from or in connection with these engineering samples remain the exclusive property of SEMIKRON.7。

1CAL-DIODESKCDI F(DC) = 30 A V RRM = 1200 VSize: 6.56 x 3.53 mm²SKCD 23 C 120 I3RFeatures•low forward voltage drop combined with a low temperature dependence •easy paralleling due to a small forward voltage spread•very soft recovery behavior •small switching losses •high ruggedness•compatible to thick wire bonding •compatible to all standard solder processesTypical Applications*•freewheeling diode for IGBT•particularly suitable for frequencies > 8 kHzAbsolute Maximum Ratings SymbolConditionsValuesUnitV RRM T j =25°C,I R =0.09mA 1200V I FSM 10ms sin 180°T j =25°C 280A T j =150°C270A i²t T j =150°C, t p =10ms, sin 180°365A²s T jmax150°CElectrical Characteristics SymbolConditionsmin.typ.max.UnitI F(AV)T c =80°C,T j =150°C, F i =PI/2,Semitrans Assembly; R th(j-c) = 1.25 K/W 20AI R T j =25°C,V RRM =1200V 0.09mA T j =125°C, V RRM =1200V 2.50mA V F T j =25°C,I F =25A 2.00 2.50V T j =125°C, I F =25A 1.79 2.30V V (TO)T j =125°C 1.18V r TT j =125°C25.2mDynamic Characteristics SymbolConditionsmin.typ.max.UnitE rr T j =25°C, 30A, 600V, 600A/µs 0.45mJ E rr T j =125°C, 30A, 600V, 600A/µs 1.2mJ Q rr T j =25°C, 30A, 600V, 600A/µs 1.7µC Q rr T j =125°C, 30A, 600, 600A/µs 3.8µC I rrm T j =25°C, 30A, 600V, 600A/µs 17A I rrmT j =125°C, 30A, 600, 600A/µs21AThermal Characteristics SymbolConditions min.typ.max.UnitT j -40150°C T stg -40150°C T solder 10min.250°C T solder5min.320°CMechanical Characteristics SymbolConditions ValuesUnitRaster size 6.56 x 3.53mm 2Area total 23.16mm²Anode bondable (Al)Cathode solderable (Ag/Ni)Wire bond Al, diameter ≤ 500 µm Package 150 mm wafer frameChips / Package639pcs2This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems issubject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.。