戴尔新一代14G服务器PowerEdge Server R940白皮书

Dell OpenManage Systems Management 概览指南版本 7.0注、小心和警告注: “注”表示可以帮助您更好地使用计算机的重要信息。

小心: “小心”表示可能会损坏硬件或导致数据丢失，并说明如何避免此类问题。

警告: “警告”表示可能会造成财产损失、人身伤害甚至死亡。

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2015 - 04Rev. A00目录1 Dell 系统管理 (5)Dell 系统管理产品 (5)Dell 硬件管理工具 (6)Dell 控制台 (6)Dell 服务 (6)Dell 工具和公用程序 (6)集成第三方控制台 (7)连接第三方控制台 (7)Dell 技术中心 (7)您可能需要的其他说明文件 (8)联系 Dell (8)从 Dell 支持站点访问说明文件 (8)2 系统管理产品概览 (10)Dell 硬件管理工具 (10)Integrated Dell Remote Access Controller With Lifecycle Controller (10)Dell Chassis Management Controller for Servers (11)Dell OpenManage Server Administrator (11)iDRAC Service Module (12)Baseboard Management Controller 管理公用程序 (12)OpenManage Client Instrumentation (12)Dell 控制台 (13)Dell OpenManage Essentials (13)Dell OpenManage Mobile (13)Dell Remote Access Configuration Tool (14)Dell OpenManage Power Center (14)Dell Active System Manager (14)Dell 工具和公用程序 (15)Dell Repository Manager (15)Dell Update Packages (16)Dell OpenManage Server Update Utility (17)Dell OpenManage Linux Repository (17)Dell OpenManage Deployment Toolkit (17)Remote Access Controller Administration CLI (18)Web 服务 API 工具和数据模型配置文件 (18)Dell IPMITool (18)OpenManage Server Administrator 命令行界面 (18)3集成第三方控制台 (18)Dell Server Management Pack Suite for Microsoft System Center Operations Manager (19)Dell Lifecycle Controller Integration for Microsoft System Center Configuration Manager (19)Dell Server Deployment Pack for Microsoft System Center Configuration Manager (20)Dell Lifecycle Controller Integration (DLCI) for System Center Virtual Machine Manager (20)Dell Server PRO Management Pack for Microsoft System Center Virtual Machine Manager (21)Dell OpenManage Integration for VMware vCenter (21)BMC Software (22)连接第三方控制台 (22)Dell OpenManage Connection for Computer Associates Network and SystemsManagement (22)Dell Smart Plug-in for HP Operations Manager for Windows (23)Dell OpenManage Connection for IBM Tivoli Netcool OMNIbus (23)Dell OpenManage Connection for IBM Tivoli Enterprise Console (23)Dell OpenManage Connection for IBM Tivoli Network Manager IP Edition (24)Dell OpenManage Plug-in for Oracle Enterprise Manager (24)Dell OpenManage Plug-in for Nagios Core (25)3 Dell 服务器管理操作 (26)部署 (27)更新 (30)监测 (31)维护 (33)41 Dell 系统管理Dell 提供管理解决方案，来帮助 IT 管理员有效地部署、更新、监测和管理 IT 资产。

2011年4月白皮书为DELL PRECISION工作站选择适当的CPU配置Mitch Markow，Core Technologies的总监在针对您的业务需求优化Dell Precision™工作站时，选择适当的处理器是一个重要注意事项。

虽然内存容量和图形卡硬盘对于特定工作负载会更重要，但处理器性能经常会决定工作完成得有多快。

通过与行业领先公司合作，戴尔为塔式、机架式和移动工作站提供多种中央处理器(CPU)配置选择。

许多Dell Precision工作站型号使用用于高性能服务器中的同样的英特尔®至强®处理器，以便提供超过台式机级别系统的更高的可靠性与性能。

选择CPU平台时的考虑事项选择CPU时，大家通常会想到的第一个问题是性能与成本。

技术考虑事项包括1个插槽(1S)还是2个插槽(2S)、核心数量、处理器频率和内存通道数量。

虽然这些确实是重要的考虑事项，但却不能脱离业务环境来回答这些问题。

选择处理器时，首先有必要确定对于您的业务而言什么是重要的，因为处理器要求取决于您尝试做的事情。

了解您的应用程序和工作负载模式对于处理器性能的依赖程度，是选择适当的处理器的重要前提条件。

台式机系统(DT)中的1个插槽与 2个插槽与1个插槽相比，2个插槽的主要益处在于核心数量以及可用于一个或多个并发应用程序的内存容量/带宽。

2S设计能够通过英特尔设计中名为QuickPath互连的一致总线来添加第二个处理器。

此总线的速度（通常以GT/秒为单位）非常重要，因为它是确定互联的带宽、处理器与相关内存之间的延迟（在NUMA[非统一内存访问]配置的系统中非常关键）的重要因素。

确保您的应用程序可以通过更多核心或更高的内存带宽和内存量来进行扩展，因为2S设计有成本和功耗方面的劣势。

核心数量、SMT和应用程序线程您需要的核心数量取决于两个重要因素：1. 您的工作负载/代码的平行程度有多高（同样，了解您的工作负载至关重要）2. 您希望同时运行多少项任务一般来讲，如果您的工作负载高度平行，可通过英特尔的超线程技术(HTT)来使用物理和逻辑核心很好地扩展性能。

UNIVERSAL APPLICA TION AND BENEFITS OF AIR CONT AINMENT: A PRACTICAL GUIDEA Dell™ Technical White PaperDavid L. MossDell|Data Center InfrastructureTHIS WHITE PAPER IS FOR INFORMATIONAL PURPOSES ONLY, AND MAY CONTAIN TYPOGRAPHICAL ERRORS AND TECHNICAL INACCURACIES. THE CONTENT IS PROVIDED AS IS, WITHOUT EXPRESS OR IMPLIED WARRANTIES OF ANY KIND.© 2009 Dell Inc. All rights reserved. Reproduction of this material in any manner whatsoever without the express written permission of Dell Inc. is strictly forbidden. For more information, contact Dell.Dell and the DELL logo are trademarks of Dell Inc. Liebert is a trademark of Liebert Corporation. APC is a registered trademark of American Power Conversion.Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade names other than its own.Table of ContentsIntroduction (2)Nomenclature (3)Greenfield vs. Brownfield (4)Supply vs. Return (4)Materials and Flexibility (5)Tightly Coupled vs. Loosely Coupled Containment (5)More on Rack Level Containment (6)Non Hot/Cold Aisle Facilities (8)Summary (8)To operate more efficiently and at higher densities with the ability to predictably deploy IT hardware with less thermal risk, implement containment. Embrace containment aggressively; the approach to containment is a bit like the approach to virtualization. If you experiment with it lightly, you might only see minor benefits like rack density increases. Like virtualization, it takes a strong commitment. You need to contain most, if not all, of the data center in order to tap into large efficiency benefits. Both Liebert™ and APC® have good papers 1,2•An increase in coil capacity accompanying the higher return temperatures associated with containment on containment. Although they do show some bias for their own solutions, they agree on major benefits such as:•Near or absolute 100% sensible operation (no energy lost to condensation and humidification) • The opportunity to raise temperatures and save energy in the chilling processIn addition to these benefits, it should also be mentioned that the elimination of hot spots would result in theimmediate lowering of IT equipment fan power in the affected areas. For a more detailed example of containment-related energy savings, please refer to The Energy Advantages of Containment Systems 3The goal of this paper is not to come to an absolute conclusion as to which solution is the best. What is ideal for one facility will not be ideal for another. However, this paper will point out some of the key considerations to explore in determining the best solution for your facility. The following points are addressed in this paper:Dell whitepaper.•Greenfield vs. Brownfield? •Supply (intake) vs. return (exhaust) containment •Materials and flexibility •Rack level vs. row level containment •Closely coupled vs. loosely coupled1 Focused Cooling Using Cold Aisle Containment, Emerson Network Power, 2009; /common/ViewDocument.aspx?id=12952 Hot Aisle vs. Cold Aisle Containment, John Neimann, 2008; /salestools/DBOY-7EDLE8_R0_EN.pdf3 The Energy Advantages of Containment Systems; David Moss; 2009; /us/en/corp/d/business~solutions~whitepapers~en/Documents~dci-energy-advantages-of-containment-systems.pdf.aspxFor the purposes of this paper, we will attempt to categorize and name different types of containment. StationaryAisle containment like the APC Hot Aisle Containment (HAC) or Liebert Cold Aisle Containment (CAC) is a hard-paneled structure assembled in place that contains integral attachment points to the IT racks. These solutionscontain multiple racks. APC’s solution is designed specifically around their InRow coils,and it contains the hot aisle. Liebert’s solution contains the cold aisle and can bedesigned to contain raised-floor venting and Liebert XD systems. In each solution,hard-paneled construction includes doors and a ceiling structure. This type ofcontainment is typically more stationary and requires more effort to refresh new racksor additional cooling units in comparison to other solutions that are not as integrated. Hanging PartitionsHanging partitions are often referred to as meat locker curtains. Vendorsof these products have both hard and flexible material versions. They aretypically hung from ceiling structures and lightly touch the racks (if theytouch at all). They often are intentionally hung with gaps at the ceiling toallow smoke to pass horizontally and activate fire prevention systems aswell as the fuse links used to hang the partitions themselves. Since thepartitions are not tied to the IT racks, it is generally easier to refreshindividual racks. The containment is looser than with stationary solutions. This picture in one of Dell’s data centers depicts cold aisle containment with both floor and overhead delivery. Hanging partitions can also be used effectively as hot aisle containment.Rack ChimneysRack Chimney solutions add ductwork to each rack. With the rear of the rack closed up, this rack istightly coupled to the IT systems. The chimney is typically extended to a false ceiling which is usedas a return plenum and also ducted to the CRAC units. Unless the chimney contains fans or theCRAC units pull air through the return plenum to aid the flow through the rack, the rack andchimney add pressure to the IT systems. This either slows the flow rate through the systems orcauses them to speed up to maintain proper airflow. There is some debate in the industry as towhether chimneys should be deployed with serial fan units that help the IT fans to evacuate therack.If you have the luxury of a Greenfield opportunity, your options are obviously less limited. Some containment solutions are less invasive in the installation process. Since hanging partitions are not structurally tied to the racks, they tend to be an easier solution to use in a retrofit situation. As a retrofit, a chimney may require serverdowntime, especially for servers located high in the rack. Stationary solutions require attachment to existing racks and possibly drilling holes; this might make some owners uncomfortable. Even if you prefer a more substantial containment system like a stationary HAC or CAC, you might consider the hanging partition products for the retrofit portion of the data center and use your preferred choice for all new racks. The partition products areinexpensive and might be eventually switched out with your preferred choice as IT product is refreshed. Whatever solution you choose, your goal should be to get the entire data center contained so you can reap full efficiency benefits.Supply vs. ReturnHVAC vendors often have strong opinions that favor their own products, and suggest sharp contrasting density limitations specifically for cold aisle containment. However, both Cold Aisle Containment (CAC) and Hot AisleContainment (HAC) can be set up for high density. Hot aisle may offer more flexibility to apportion more density in one area at the detriment of another. In either case, the goal is to provide an adequate compliment to the air consumption rate of the IT equipment. It is the volumetric delivery of the facility that establishes any densitylimitation that might exist for each rack. This is why hot aisle containment may offer a local advantage. With a cold aisle solution there is a finite number of vent tiles. Since the aisle containment captures the vent tiles, the number of vents cannot be increased; it is typically no more than a single vent per rack. In contrast, a hot aisle containment solution does not capture the vents. Venting outside the perimeter of the pod can actually supply the pod with additional airflow.APC makes a similar argument regarding the limitations of cold aisle delivery 4,5Consider this high-density example computed using Dell’s Energy Smart Solutions Advisor(. The APC papers go one step further; they make assumptions about typical raised floor limitations, arguing that a maximum of approximately 600 CFM on average can be delivered through a single vent. APC equates this to a limitation of 6 kW per cabinet which takes their argument past the differences between HACs and CACs, resulting in an argument between raised floor delivery and their InRow products. It can be argued that this as an artificial limitation used to support the claim of superiority of the row cooling product. Higher CRAC-to-vent ratios allow a raised floor to easily achieve higher flow rates. A data center lab at one of the Dell facilities averages twice that value (1200 CFM) per vent. The APC argument of 100 CFM per kW is a good rule of thumb for generic legacy hardware. Today’s Dell servers,however, have much more efficient thermal designs and typically operate closer to 80 CFM per kW. If you combine higher vent flow rates with the fact that newer IT consumes less than 100 CFM per kW, an argument similar in approach to that in the aforementioned APC paper can be made in support of greater than 10 kW per rack. /calc ). A 1U server with high-end processors and 32 GB of memory consumes 324 watts and uses 25.6 CFM, which amounts to just 79 CFM per kW. Assuming 80 CFM per kW and an average of 1200 CFM per vent, the raised floor would support 15 kW per vent if that flow rate is delivered effectively to the rack.Containment is one way to ensure that the 1200 CFM supplied gets consumed effectively to achieve the full 15 kW.4 Hot Aisle vs. Cold Aisle Containment, John Neimann, 2008; /salestools/DBOY-7EDLE8_R0_EN.pdf5 Cooling Strategies for Ultra-High Density Racks and Blade Servers, Neil Rasmussen, 2006; /salestools/SADE-5TNRK6_R5_EN.pdfperceived density advantage. Ultimately, the data center is limited by the total amount of flow available from all the CRAC units. If a hot aisle containment enables an incremental advantage in one area because it can take advantage of adjacent vents outside of the perimeter of the pod, it uses up more of the aggregate CRAC flow rate, and other areas will be slighted. The HAC/CAC decision is more likely based on whether or not the facility already has a return ceiling plenum. It might also just be made on the basis of human comfort, since a HAC renders the personnel space comfortable in terms of temperature, and a CAC essentially uses the entire data center as a return plenum.Materials and FlexibilityAesthetics are important to many data center owners. Some may not have considered hanging partitions for that reason. These systems are gaining in popularity quickly, and their appearance is not as terrible as some people may think. Hard plastic versions are available; they are a bit more expensive than the meat-locker type material, but they are generally perceived as more attractive. Besides their cost advantage over other containment products, some Dell customers find more flexibility with this type of product. The stationary aisle containments typically tie the racks into a pod. Any reconfiguration that entails breaking up the pod will be easier with a hanging partition solution. Hanging partitions are readily available from a variety of vendors, and you can engage Dell Energy Optimization Services for assistance as they can install these types of products for you. Hanging partitions work well as either hot or cold aisle containment. Interestingly, in talking to the vendors of these products, the majority of their deployments have been cold aisle containment. Presumably, this is due to the absence of an existing ceiling return plenum. An additional consideration when contemplating flexible curtains is that, depending upon the criticality of the data center, the data center’s insurance company may have reservations about the flexible material. Even if a fire marshal has signed off on the product, the insurance company may be more conservative and oppose the flexible curtain material.Tightly Coupled vs. Loosely Coupled ContainmentThere are varying degrees of coupling between coil products and IT racks. The minimum goal behind containment is to separate supply and return paths. Above and beyond this minimum goal is an opportunity to more closely match coil flow rates to rack consumption (minimizing waste). The ability to achieve a flow match is proportional to the physical tightness of the coupling between the racks and coils.Hanging Partitions Stationary Rack LevelGreatest Air Over-Provision Least Air Over-ProvisionWith looser coupling, more air overage is required from the coils. Hanging partitions are arguably the loosest since they typically have designed gaps (for example, at the ceiling). The exhaust chimney appears to be the tightest common form of containment. Stationary containment systems range in between the two. Because aisle containment spans many racks, it is quite difficult to make it as “airtight” as a rack chimney. Gaps in the construction, under or between racks, are likely to exist. Any mismatch in flow rate between the coils and the racks will find these leaks. Stationary systems probably require more over-provision of air from the coils than a tightly coupled chimney but not as much as with hanging partitions.of external pressure added to a server, storage, or networking product elicits one of two responses―t he airflow slows and component temperatures climb, or the IT fans respond with additional fan energy to boost the flow rate back to its intended design point. What is meant by external pressure? A small amount of external pressure is added, for instance, when IT is put into a standard front-to-rear cooled rack and the front and rear perforated doors are closed. As a result, some negative pressure is applied to the front of the IT system and some positive pressure to the back of the system. Similarly, contained systems, like rack chimneys or door coils, typically impart two to three times the external pressure as a standard “flow through” rack due to their added airflow resistance. The IT system’s thermal design will determine whether or not its response to pressure is an increase in component temperature, an increase in fan power, or some compromise of the two. Newer systems will likely tend toward a fan speed increase. They have more components enabled with temperature sensors that contribute to the system’s fan response algorithms. If the system design is optimized, it will respond to even small pressure changes that would otherwise have resulted in a component temperature increase. Older IT systems have less discrete component temperature measurement capability and are typically designed more conservatively with higher thermal margins. They typically respond with less of a fan speed increase unless the pressure is large. The IT manufacturer should be able to advise you as to the impact of pressure on his or her system. Dell has historically designed with enough margin to handle the pressure added by a standard rack (two perforated doors) and a full cable management apparatus (translating arm).Therefore, even if the fans do not spin up due to pressure, minor component temperature increases do not exceed specification limits. More details of how Dell systems respond to external pressure can be found in the IT Equipment Response to External Pressure Dell whitepaper6.More on Rack Level ContainmentChimney systems are not the only form of rack containment, although they are probably the most widely used. Enclosed racks with side-car coils also could be considered contained solutions since they separate the hot from the cold. Rear door coils are another product which could technically be considered contained. Any of these systems may have impacts on the IT fan response as mentioned in the paragraphs above.Passive Chimney SystemsCare should be used when deploying passive chimney systems. A good design should impart little to no external pressure on the IT systems within the racks. While in some cases the air handlers may facilitate the flow through the racks and chimneys by creating a significant negative pressure in the ceiling return, a test should always be carried out to determine the presence of negative pressure in the chimneys and rack rears. If the air handlers do not improve the flow through the chimney, an increase of IT fan energy may occur. In addition, you may risk a pressure build-up at the back of the rack because the IT equipment is pushing the air up the chimney, which will cause a larger recirculation between the IT systems. This may not be a concern with larger systems such as blades where there are only a few chassis per rack. However, the 20 to 40 small gaps between 1 and 2U systems can add up. Increased recirculation could raise inlet temperatures and limit the extent to which you raise the overall data center temperature, thus limiting savings at the chiller.New Dell Rack ContainmentDell is currently working on another form of containment―a rack-level containment product that alters the normal front-to-rear flow pattern and converts it to bottom-to-rear. The strategy is scheduled for release late next year. Like other containment solutions, it enables similar energy savings opportunities. It will be a tightly coupled6 IT Equipment Response to External Pressure, Robert Curtis/David Moss, 2009to the floor and not the ceiling, it is more of a plug-and-play solution than most other containment solutions. The rack can be rolled up with no connections other than the vent underneath. Since that coupling surrounds the vent, it has the ability to affect the flow exiting the vent. Up to a certain rack density, the floor tends to dominate and actually aid the IT system’s flow rate; it may lower the IT fan energy as the IT systems try to throttle down flow rates. Above that density, the IT systems in the rack tend to dominate, extracting a greater volume than normal out of the floor. There is no specific density limit with this rack. High densities mean higher airflow which typically translates into increased IT equipment fan energy. This energy increase is in line with the increases cited for other rack solutions in IT Equipment Response to External Pressure7. A slight increase in IT fan energy may be acceptable. in order to achieve facility energy savings like those detailed in The Energy Advantages of Containment Systems8 There are further advantages to this rack level containment strategy. Due to the tight coupling with the floor, the rack has the ability to affect the pressure under the floor. In the case where multiple racks have spun up and increased their air consumption, a constantly supplied raised floor would normally see a decrease in under-floor pressure and a drop in the flow rate through other vents. Air handlers (CRAH units) can be configured to adjust their flow rates based on under-floor pressure. Rather than link airflow control with return or supply temperature (as is more common), variable speed fans in the air handlers speed up or slow down to maintain a specific pressure under the floor. This control strategy typically allows data centers to deploy new hardware with less concern about the adequacy of airflow delivery. As new racks are added, vents are installed as well. The increase in the number of vents would normally drop the pressure and the flow through all vents. The CRAH units, however, compensate to correct the pressure. As long as the CRAH unit flow rates are not at their maximum, the addition of new IT racks is accompanied by an increase in the CRAH unit flow rates.Similarly, as IT equipment dynamically drives rack flow rates up or down, a tightly coupled rack like the Dell containment rack could have a dynamic coupling to the CRAH units. This would be accomplished indirectly through their common pressure connection, the raised floor. Others companies have attempted to achieve similar results by much more complicated means (for example, a competitor introduced a dynamic service with a multitude of sensors feeding into a server to control the floor’s CRAH units).With the Dell solution, a company can have a data center set up such that whenever new racks are added, the CRAH units adjust their flow rates to compensate. Throughout the day, when the IT load changes and the rack airflow fluctuates up and down, the CRAH units also adjust up and down, supplying a near ideal match of air delivery versus rack consumption. The only task the company has is to monitor the Variable Frequency Drive (VFD) settings on the CRAH units to verify how close they are getting to 100%. At some point prior to the unit nearing 100%, another CRAH unit would have been scheduled for bulk airflow infusion into the floor. This situation is comparable to a type of “air buss” where multiple air handlers feed a common buss (the floor plenum) and multiple racks tap into and consume what they need from that buss. In addition to the energy and density advantages obtained with containment solutions, this dynamic coupling with the air handlers specific to the Dell containment rack offers a significant advantage.7 IT Equipment Response to External Pressure, Robert Curtis/David Moss, 20098 The Energy Advantages of Containment Systems; David Moss; 2009;/us/en/corp/d/business~solutions~whitepapers~en/Documents~dci-energy-advantages-of-containment-systems.pdf.aspxNon Hot/Cold Aisle FacilitiesThere are still plenty of facilities that have not converted to hot/cold aisle orientation. Aisle containment strategies rely on the fact that there is already hot/cold aisle orientation. Some of the rack level containment strategies actually do not require hot/cold aisle orientation. Chimneys, self-contained racks, the door coil, and Dell’s new rack containment would all work in a front-to-back oriented facility.SummaryRegardless of the type, containment solutions should be considered in almost any data center setting. The two major areas for reductions in cooling energy are at the chiller and air handler fans. Both of these energy reductions are aided by containment. Containment should be applied to as much of the data center as possible. With the main goal being an increase in overall data center temperature, it may be difficult to achieve without comprehensive containment. Rack densities are also improved with containment. Rack and associated costs are reduced by installing equipment in fewer racks. Finally, some tighter forms of containment, such as the new Dell rack, offer additional benefits in terms of coupling with facility airflow systems to set up a near ideal match of airflow and one that scales with IT load and IT additions..。

Dell EMC PowerEdge R450技术指南2021 9注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。

:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。

:“警告”表示可能会导致财产损失、人身伤害甚至死亡。

© 2021 年 Dell Inc. 或其子公司。

保留所有权利。

Dell、EMC 和其他商标是 Dell Inc. 或其附属机构的商标。

其他商标可能是其各自所有者的商标。

章 1: 系统概览 (5)关键工作负载 (5)新技术 (5)章 2: 系统功能和代际比较 (6)章 3: 机箱视图和功能部件 (8)机箱视图 (8)系统的前视图 (8)系统的后视图 (8)系统内部 (9)快速资源定位器 (10)章 4: 处理器 (11)处理器特性 (11)支持的处理器 (11)章 5: 内存子系统 (12)支持的内存 (12)内存速度 (13)章 6: 存储 (14)存储控制器 (14)支持的驱动器 (14)外部存储器 (15)章 7: 联网 (16)概览 (16)支持的 OCP 卡 (16)OCP 外形规格 (17)OCP NIC 3.0 与机架网络子卡比较 (17)章 8: 扩展卡和扩展卡提升板 (19)扩展卡安装原则 (19)章 9: 功率、散热和声音 (23)功率 (23)散热设计 (23)PowerEdge R450 声音 (24)声音性能 (24)章 10: 机架、导轨和线缆管理 (26)导轨信息 (26)目录3滑动导轨 (26)固定导轨 (26)线缆固定臂 (27)防变形条 (27)章 11: 支持的操作系统 (28)章 12: Dell EMC OpenManage 系统管理 (29)服务器和机箱管理器 (29)Dell EMC 控制台 (30)自动化启用程序 (30)集成第三方控制台 (30)连接第三方控制台的接口 (30)Dell EMC 更新公用程序 (30)戴尔资源 (30)章 13: Dell Technologies 服务 (32)Dell EMC ProDeploy Enterprise Suite (32)Dell EMC ProDeploy Plus (33)Dell EMC ProDeploy (33)基本部署 (33)面向 HPC 的 Dell EMC ProDeploy (33)Dell EMC 服务器配置服务 (34)Dell EMC 派驻服务 (34)Dell EMC 数据迁移服务 (34)Dell EMC ProSupport Enterprise Suite (34)面向企业的 Dell EMC ProSupport Plus (34)面向企业的 Dell EMC ProSupport (35)Dell EMC ProSupport One for Data Center (35)ProSupport for HPC (36)支持技术 (36)数据安全服务 (37)Dell Technologies Education Services (37)Dell Technologies 咨询服务 (37)Dell EMC 远程咨询服务 (38)Dell EMC 托管服务 (38)章 14: 附录 A.其他规格 (39)机箱尺寸 (39)机箱重量 (40)视频规格 (40)USB 端口 (41)PSU 评级 (41)环境规格 (42)散热限制 (43)章 15: 附录 B.标准遵从性 (46)章 16: 附录 C 其他资源 (47)4目录系统概览Dell™ PowerEdge™ R450 是戴尔最新的双路 1U 机架服务器，旨在使用可高度扩展的内存、I/O 和网络选项，运行复杂的工作负载。

技术白皮书：Dell EMC PowerEdge 服务器的网络弹性安全性2020 年 12 月修订记录本出版物的内容按“原样”提供。

Dell Inc. 对本出版物的内容不提供任何形式的陈述或担保，明确拒绝对适销性或针对特定目的的适用性进行默示担保。

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中国印刷 [11/12/20] [技术白皮书]信息如有更改，恕不另行通知。

1.简介 (5)2.通向安全服务器基础架构之路 (6)2.1 安全开发生命周期 (6)2.2 网络弹性体系结构 (7)2.3 当今的威胁 (7)3.保护 (8)3.1 经过加密验证的可信启动 (8)3.1.1 基于硅的信任根 (8)3.1.2 BIOS 实时扫描 (10)3.1.3 UEFI 安全启动自定义 (10)3.1.4 TPM 支持 (10)3.1.5 安全认证 (10)3.2 用户访问安全性 (11)3.2.1 RSA SecurID MFA (11)3.2.2 简化的 2FA (11)3.2.3 SELinux 框架 (12)3.2.4 最低限度权限 (12)3.2.5 自动证书登记和续订 (12)3.2.6 出厂默认密码 (13)3.2.7 动态系统锁定 (13)3.2.8 域隔离 (13)3.3 签名固件更新 (13)3.4 加密数据存储 (14)3.4.1 iDRAC 凭证存储区 (14)3.4.2 本地密钥管理 (LKM) (14)3.4.3 Secure Enterprise key Manager (SEKM) (15)3.5 硬件安全性 (15)3.5.1 机箱防盗警报 (15)3.5.2 动态 USB 端口管理 (15)3.5.3 iDRAC Direct (16)3.5.4 带地理位置的 iDRAC 连接视图 (16)3.6 供应链完整性和安全性 (16)3.6.1 硬件和软件完整性 (17)3.6.2 物理安全性 (17)3.6.3 专为 PowerEdge 服务器设计的 Dell Technologies Secured Component Verification (SCV) (17)4.1 通过 iDRAC 进行全面监控 (18)4.1.1 生命周期日志 (18)4.1.2 警报 (18)4.2 偏差检测 (19)5.恢复 (20)5.1 对新漏洞的快速响应 (20)5.2 BIOS 和操作系统恢复 (20)5.3 固件回滚 (21)5.4 硬件维修后恢复服务器配置 (21)5.4.1 部件更换 (21)5.4.2 Easy Restore（适用于主板更换） (22)5.5 系统擦除 (22)5.6 iDRAC9 密码选择 (23)5.7 CNSA 支持 (23)5.8 完整电源周期 (23)6.摘要 (24)A. 附录：延伸阅读 (25)1.简介随着威胁环境的不断发展，IT 和安全专业人员在管理数据和资源风险方面日益艰难。

高性能的英特尔至强5500和5600系列处理器、多达六硬盘（3.5英寸或2.5英寸）的配置、DDR3内存，以及24英寸的理想机箱深度，均有助于提高Dell PowerEdge T410的部署和运行效率。

PowerEdge T410采用有针对性的设计，拥有能源优化技术和简化的系统管理。

有针对性的设计PowerEdge T410具备戴尔卓越的系统通用性和可靠性。

一致的组件布局和精心配置的接口端口及电源，为安装和重新部署提供了便利。

PowerEdge T410深度为24英寸的机箱易于使用，非常适合需要小型机箱和安静办公的后端办公室、零售或小型办公室环境。

坚固的金属硬盘支架与排列有序的布线设计，有助于改善组件存取和服务器内部的通风。

悄无声息的静音设计，以及挡板正面方便监控的可选液晶屏，均体现了PowerEdge 410的针对性设计。

能源优化技术智能节能技术深入PowerEdge T410系统的核心。

多项能源调整技术和符合标准的智能节能组件可降低能耗，同时提高性能。

PowerEdge系统配备能效超过90%的智能节能电源装置，合乎系统的要求。

功率封顶、功率清点和功率预算等电源管理功能，可根据您的特定环境对电源进行最有效的管理。

简化的系统管理新一代Dell OpenManage™管理工具套件能提供高效的操作方式和标准化的命令，可与现有系统集成以实现有效控制。

戴尔管理控制台(DMC)将基础架构管理缩减至一个控制台，从而帮助简化操作并提高稳定性。

此控制台可在单一视图中显示整个基础架构，并为整个基础架构提供通用数据源。

它基于Symantec™ 管理平台而构建，拥有可轻松扩展的模块化基础，能提供基本的硬件管理功能，或资产和安全性管理等更为高级的功能。

戴尔管理控制台能够减少或避免手动流程，使您能够节约时间和资金以用于更具战略性的技术。

戴尔生命周期控制器通过单一访问点提供“即时启用”的集成管理功能，安全而高效。

统一服务器配置器(USC)界面嵌入并集成在系统中，以大幅提升灵活性与功能，并可为您提供永久的工具存取途径。

Technical White PaperImproved Memory Reliability, Availability, and Serviceability (RAS) in PowerEdge YX5X serversAbstractThis technical white paper describes enhancements made to the memory RASfeatures in PowerEdge YX5X servers that use Intel 3rd Generation (‘Ice Lake’)Xeon Scalable Processors. System configurations for achieving the maximummemory up time are called out.September 2021RevisionsAcknowledgementsAuthor(s): Jordan Chin (Memory Systems Engineering)Support: Mark Dykstra (Escalation Engineering), Kevin Cross (Memory Systems Engineering), Dave Chalfant(BIOS Engineering), Rene Franco (Memory Systems Engineering), and Trent Bates (Product Management)Others: Sheshadri PR Rao (InfoDev)The information in this publication is provided “as is.” Dell Inc. makes no representations or warranties of any kind with re spect to the information in this publication, and specifically disclaims implied warranties of merchantability or fitness for a particular purpose.Use, copying, and distribution of any software described in this publication requires an applicable software license.Copyright © 2021 Dell Inc. or its subsidiaries. All Rights Reserved. Dell Technologies, Dell, EMC, Dell EMC and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. [9/13/2021] [Technical White Paper] [Manager]Contents Revisions (2)Acknowledgements (2)Contents (3)Executive Summary (4)1RAS improvements in the Chipset (5)1.1Intel Partial Cache Line Sparing (PCLS) (5)1.2Improvements to Advanced ECC (or Single Device Data Correction) (5)2Smarter Self-healing (6)2.1Memory Health Check (6)2.2Self-healing during Full-Boot Memory tests (7)3Other Memory Serviceability improvements (9)3.1Redesigned Memory Event messaging (9)3.1.1Standard Memory Event Message severity levels (9)3.1.2Prescriptive Remediation (9)3.2User-directed Memory Map-out (10)4Legacy RAS features (12)5Achieving Maximum Memory Uptime (13)6Applicable PowerEdge YX5X servers (14)Executive SummaryExecutive SummaryIn our Memory Errors and Dell EMC PowerEdge YX4X Server Memory RAS Features technical white paper,we provided a primer on memory errors and the Memory Reliability, Availability, and Serviceability (RAS)features on our PowerEdge YX4X products. Most of the principles and RAS feature information from thatwhitepaper continue to remain intact for our latest YX5X line of PowerEdge products. However, as with everygeneration of Dell EMC PowerEdge server product, we continue to innovate and improve. With thisdocument, we would like to share with our customers the next generation of improvements to the memoryRAS capabilities in our latest YX5X line of PowerEdge products. At a high-level, this includes the followingnew features or processes:The content covered in this technical white paper applies only to DRAM based memory modules and does not apply to Intel Optane Persistent Memory. Also, this content is specific to Dell EMC PowerEdge YX5X serverswith 3rd generation Intel Xeon Scalable Processors.RAS improvements in the Chipset1 RAS improvements in the ChipsetIntel introduced the following improvements in their third generation of Xeon Scalable Processors:1.1 Intel Partial Cache Line Sparing (PCLS)The third generation of Xeon Scalable Processors contains 16 segments of spare cachelines per DDR channel in their integrated Memory Controllers (iMC). When BIOS detectsthat DRAM on a DIMM is experiencing single-bit errors (SBEs) for a particular cache line,it may request the iMC to re-map the offending portion of the cache-line to use its internalspare cache instead. Single-bit errors are generally harmless, but if left unchecked, theycould cause unwanted activation of preventative RAS features that can impact systemperformance.This feature will prevent continued triggering of the Dell Predictive Failure Algorithm (PFA) that wouldotherwise activate other RAS features (such as ADDDC) or consume self-healing resources. This results infewer performance impacts and corrective actions required by users. This feature is available on all third GenXeon Scalable Processors. There are no memory or system configuration requirements necessary to takeadvantage of PCLS.1.2 Improvements to Advanced ECC (or Single Device Data Correction)Intel has redesigned and optimized their Advanced Error Correcting Code in 3rd Gen XeonScalable Processors to handle the most common failure patterns known among the majorDRAM suppliers. In doing this, many of the multi-bit error patterns that were uncorrectable byprevious generations of Intel Xeon Scalable Processors are now correctable by 3rd GenXeon SPs. This uplift will result in a significant decrease in uncorrectable memory errors.This enhancement is available on all 3rd Gen Xeon Scalable Processors. There are no memory or systemconfiguration requirements necessary to take advantage of the improved Advanced ECC (or SDDC).For more information about Advanced ECC, see the Memory Errors and Dell EMC PowerEdge YX4X ServerMemory RAS Features technical white paper available on the Dell support site.2 Smarter Self-healingDell Technologies has introduced Memory Health Check and self-healing on full-boots as improvements tomemory self-healing in their PowerEdge YX5X servers. When used together, these features should provide amultiplicative effect on the testing and self-healing coverage for memory while minimally impacting the serverboot time.2.1 Memory Health CheckPrevious Dell EMC PowerEdge implementations of memory self-healing was based ontargeting repairs at a specific memory location where an uncorrectable error or multiplecorrectable errors were detected. For self-healing to take effect, the system must berebooted—thereby, resulting in some downtime. Understanding that downtime can beimpactful and difficult to arrange, it made sense to make use of any downtime because ofself-healing and use it as an opportunity to find other questionable memory locations and repair them. Thiswould prevent the need for future reboot operations and downtime to conduct further self-healing. Thus, DellTechnologies has developed Memory Health Check.Dell Memory Health Check works by first allowing the original self-healing process to execute and completeas described in the original Memory Errors and Dell EMC PowerEdge YX4X Server Memory RAS Featurestechnical white paper. Next, during the same boot cycle as the original self-heal, BIOS executes rigoroustesting throughout the DRAM rank where memory errors have occurred. The rigorous testing used by DellMemory Health Check is the same used by the Dell factory memory screening process. BIOS on thePowerEdge server can quickly and efficiently execute this type of rigorous testing (which can normally takehours) by intelligently testing the affected DRAM rank instead of the entire system memory range.Figure 1 The Memory Health Check process in PowerEdge YX5X serversLastly, if any additional questionable locations are found by this enhanced screening, then those locations are automatically repaired within the same boot cycle, thereby incurring no additional reboot penalty.If BIOS detects that there are more questionable locations than there are self-healing resources available torepair them, then BIOS will automatically map-out that memory region and message to the user that a DIMMreplacement is necessary.The execution of Dell Memory Health Check adds several seconds of boot time and is only executed asneeded based on certain types of memory health events from the previous boot. Normal boots should not see an impact to completion time.This feature is available on all 3rd Gen Xeon Scalable Processors. There are no memory or systemconfiguration requirements necessary to take advantage of Dell Memory Health Check.2.2 Self-healing during Full-Boot Memory testsOn Dell EMC PowerEdge platforms, the default boot behavior is ‘fast boot’, where the DDRbus is trained only partially and memory testing phase is skipped. ‘Full-boot’ is executedafter either a BIOS upgrade, memory configuration change, or after a memory health event(such as uncorrectable error or large number of correctable errors) or the system isconfigured to do so. During a full-boot cycle, BIOS performs memory retraining and a quickmemory test among other activities.On PowerEdge YX5X servers, Dell Technologies has added the ability to perform self-healing based on theresults of this quick memory test which differs from the testing in Memory Health Check in the following ways:Despite the differences in testing, the self-healing and map-out functions of the two features are identical. Ifany questionable locations are detected, then those locations are automatically repaired. If BIOS detects thatthere are more questionable locations than there are self-healing resources available to repair them, thenBIOS will automatically map-out that memory region and indicates to the user (through a message) that aDIMM replacement is necessary.As mentioned earlier, by default, full-boot is executed only in certain conditions. However, full-boot can beenabled to always execute in the BIOS Setup menu. Also, a user can also request for a one-time execution of full-boot. The boot options are accessed as ‘Memory Training’ settings in the System BIOS Settings→Memory Settings. Setting ‘Memory Training’ to ‘Enable’ will cause the system to always perform full-boot, while ‘Retrain at Next Boot’ will perform a one-time full-boot operation during the next reboot cycle.Access to these settings are also available in iDRAC9 by clicking Configuration→BIOS Settings→Memory Settings.Figure 2 Access Boot options on the System Setup pageThis feature is available on all 3rd Gen Xeon Scalable Processors. There are no memory requirements necessary to take advantage of self-healing during full-boot.3 Other Memory Serviceability improvements3.1 Redesigned Memory Event messagingDell Technologies has approached its YX5X PowerEdge servers with the goal of updating memory eventmessaging to improve reliability, usability, and serviceability. Run-time memory event messages in theSystem Event Log and Lifecycle Logs have been redesigned to focus on standardization of memory eventmessaging and prescriptive remediation.3.1.1 Standard Memory Event Message severity levelsAll run-time memory events are now designated by message ID prefixes MEM51xx, MEM61xx, and MEM71xx for alignment according to event severity. Severity is determined based the long-term health outlook of thememory device and whether the event or device correctable by the user.MEM51xx (Informational Severity) Events—Memory device is operational but may benefitfrom additional user action to improve performance or health. The specified user action in theevent message is optional. These event messages will appear only in the Lifecycle Log.MEM61xx (Warning Severity) Events—Memory device has encountered an event that canbe corrected with additional user action. The specified action in the event message is requiredto be performed by the user to prevent potential system outage or resolve an existing outage.If the event persists after performing the specified user action, users should contact thetechnical support teams for further assistance.These events messages will appear in both the Lifecycle Log and System Event Log.MEM71xx (Critical Severity) Events—Memory device has detected an event that hascompromised the reliability or usability of the device. Immediate replacement of the device iseither required or highly recommended. The specified user action in the event message, ifprovided, is intended only for use as a short-term remedy.These event messages will appear in both the Lifecycle Log and System Event Log.3.1.2 Prescriptive RemediationAfter broad review of memory event messaging throughout the server industry, we found it extremelycommon to recommend a general set of user actions to resolve all memory event types. These actions weretypically to reseat the memory device and to update BIOS firmware. Both actions are good practices inmaintaining a healthy memory system. Reseating the memory device can reduce any device-to-socketconnectivity issues, and while updating firmware, ensures that the system is patched for any known issuesand is running the latest memory-training and error-handling algorithms. However, almost all solutions requiresome system downtime and/or physical access to execute. Thus, spending time strictly to complete goodmaintenance practices is an inefficient use of downtime. As mentioned earlier, downtime can be impactful anddifficult to arrange, and as such, every solution prescribed should be carefully considered for the highestlikelihood of resolving the problem.Therefore, in addition to severity, run-time memory event messages on YX5X PowerEdge servers are nowalso categorized based on the recommended resolution. These recommended user actions arerecommended as the best engineering recommendation to address each underlying event. Recommendeduser action aligns with the last two digits of the message ID for all MEM51xx, MEM61xx, and MEM71xxevents.Important—The table above is a simplified version of the listed Recommended Response Actions for MEM51xx, 61xx, and 71xx. Refer to the appropriate product documentation for the fully detailed RecommendedResponse Actions which will include next steps for resolution beyond those listed here.3.2 User-directed Memory Map-outPowerEdge YX5X servers configured with BIOS version 1.3.x or later will enable usersthrough firmware to directly remove a DIMM from the system memory pool withoutphysically handling the device. When a DIMM is no longer part of the system memory pool,its DRAM components will not be used for any read/write operations. Total system memorycapacity is reduced to exclude the mapped out DIMM. Any DRAM faults on this DIMM willno longer produce correctable or uncorrectable errors during run-time operation.Important—DIMMs that are mapped out from the system memory pool are still configured, trained, andtested during the boot operation. Therefore, enabling memory map-out cannot prevent many memory relatedissues that may arise during boot.Mapping out one or more DIMMs can produce an imbalanced memory configuration and significantly impactsystem performance. To retain a supported memory configuration, Dell EMC BIOS may automatically mapout other DIMMs that are not targeted by you. This is necessary to maintain an optimized memoryconfiguration. Therefore, total system memory capacity may be reduced beyond the expected amount. This type of automatic map-out behavior also occurs if the DIMM was physically removed and the system is in an unsupported memory configuration.DIMMs that have been manually mapped out will display the MEM6101 message in system logs to indicate successful map-out. Meanwhile, DIMMs that have been automatically mapped out to maintain a supported memory configuration will display the MEM6101 message and UEFI0339 message in Lifecycle Logs.User directed memory map-out can be enabled and configured in the BIOS Setup menu under System BIOS Settings → Memory Settings → Memory Map Out. Access to these settings are also available in iDRAC9 via Configuration → BIOS Settings → Memory Settings → Memory Map Out.Figure 3 Enable the Memory Map Out feature on the System Setup pageMap-out takes effect during the next system reboot operation and will remain in effect until the you manually reenable the DIMM. Map-out settings will persist through configuration changes and BIOS firmware updates. There are no CPU or memory configuration requirements necessary to take advantage of user directed memory map-out.Warning—This feature should be used with care to ensure that at least one physically installed DIMMs is always enabled. Accidentally disabling all physically installed DIMMs will prevent the system from booting. The system BIOS NVRAM must be cleared to recover from this state. For information about clearing NVRAM, see the respective Installation and Service Manual available on the support site.Legacy RAS features4 Legacy RAS featuresThe RAS features that were supported in the YX4X servers are still supported in YX4X. See the MemoryErrors and Dell EMC PowerEdge YX4X Server Memory RAS Features technical white paper available on thesupport site. However, some updates to those features are listed here as sub-bullets:•Single Error Correction—Double Error Detection (SEC-DED) ECC•Advanced ECCo Improvements to Advanced ECC (or Single Device Data Correction)•Adaptive Double Device Data Correction (ADDDC)•Memory Patrol Scrub•Operating System Memory Page Retirement / Off-lining•Fault Resilient Memory (FRM) / Address Range Mirroring modeo A Non-Uniform Memory Access (NUMA) aware FRM option has been added. When NUMA aware FRM has been enabled, BIOS enforces creation of fault-resilient memory regions whichspan NUMA nodes, and if SNC is enabled, then also spans across sub-NUMA clusters. Earlier,YX4X servers created a fault- resilient region of memory starting from the lowest system memoryaddress without awareness of NUMA. Address range mirroring requested and enabled by theoperating system is and remains NUMA—aware.•Memory Self-Healingo Smarter Self-Healing•Machine Check Architecture RecoveryThe following legacy RAS features have been deprecated in PowerEdge YX5X servers because of insufficient user enablement:•Memory Rank Sparing•Full Memory MirroringAchieving Maximum Memory Uptime5 Achieving Maximum Memory UptimeThe following summarizes actions that users can take to achieve maximum memory uptime on theirPowerEdge YX5X servers:•Configure server using genuine DIMMs from Dell Technologieso Benefit—Memory modules are fully validated and assured by Dell Technologies. Additional self-healing (PPR) resources above and beyond industry standards. Rigorously screened usingproprietary Dell Technologies test patterns and DRAM vendor unique test patterns.•Configure server with x4 DRAM based DIMMso Benefit—Single DRAM Device Correction and ADDDC.•Configure server to operate in Fault Resilient Memory modeo Benefit—Significantly reduced probability of UCEs in critical portions of memory used byoperating systems. Low memory capacity reduction overhead (depending on the systemsettings).•Configure server to run memory patrol scrub in ‘Extended Mode’o Benefit—Patrol-scrub will run after every four hours (instead of 24). Increased scrubbingfrequency will reduce the accumulation of errors in areas of memory with low utilization that arenot being corrected by demand scrub.•Configure server to run ‘Full-Boot’ instead of ‘Fast Boot’o Benefit—Server performs full DDR bus training and testing after every boot operation. Re-training ensuring that the bus is optimally tuned given the current environmental and operating conditions.The quick memory testing will self-heal questionable memory cells that may have developed overtime.•Regularly check for MEM events in Lifecycle Logs and perform the actions as specified—Even for MEM51xx events displayed for information purposes only.o Benefit—Actions specified by MEM61xx and 71xx events are required while those specified by MEM51xx are optional. Even though the MEM51xx events are optional, PowerEdge BIOS hasmade these recommendations based on monitoring memory health and performing the actionsmay improve memory performance or long-term reliability.•Regularly update system firmwareo Benefit—System firmware is patched for any known issues and is running the latest memory training and error handling algorithms.Applicable PowerEdge YX5X servers6 Applicable PowerEdge YX5X serversThe following platforms are considered PowerEdge YX5X servers equipped with 3rd Gen Xeon ScalableProcessors and are therefore covered by this technical white paper:Important—Subsequent to the publication of this document, Dell may continue to add products to its YX5Xserver lineup. If a product is not listed below, please consult with a Dell sales or support representative toconfirm the server generation.PowerEdge leveraged products such as some Precision workstations may also be covered by this document.Please consult with a Dell sales or support representative to confirm.•PowerEdge R750•PowerEdge R750xa•PowerEdge R750xs•PowerEdge R650•PowerEdge R650xs•PowerEdge R550•PowerEdge C6520•PowerEdge MX750c•PowerEdge R450•PowerEdge T550•PowerEdge XR11•PowerEdge XR12。

Dell EMC XC940 系列超融合应用装置安装和服务手册注、小心和警告注: “注”表示帮助您更好地使用该产品的重要信息。

小心: “小心”表示可能会损坏硬件或导致数据丢失，并说明如何避免此类问题。

警告: “警告”表示可能会造成财产损失、人身伤害甚至死亡。

© 2018 Dell Inc. 或其子公司。

保留所有权利Dell、EMC 和其他商标为 Dell Inc. 或其子公司的商标。

其他商标均为其各自所有者的商标。

2018 - 03Rev. A001 XC940 系列概览 (7)系统正面视图 (7)左侧控制面板视图 (8)右侧控制面板 (11)系统的后视图 (12)NIC 指示灯代码 (13)电源设备指示灯代码 (13)驱动器指示灯代码 (16)找到您的系统服务标签 (16)2 说明文件资源 (18)3 技术规格 (19)系统尺寸 (19)系统重量 (20)处理器规格 (20)PSU 规格 (21)系统电池规格 (21)扩展总线规格 (21)内存规格 (22)存储控制器规格 (22)远程管理端口规格 (23)驱动器规格 (23)硬盘驱动器 (23)端口和连接器规格 (23)USB 端口 (23)NIC 端口 (23)串行端口 (23)VGA 端口 (23)视频规格 (24)环境规格 (24)微粒和气体污染规格 (25)标准操作温度 (26)扩展操作温度 (26)扩展操作温度限制 (26)散热限制 (27)4 初始系统设置和配置 (28)设置系统 (28)iDRAC 配置 (28)目录3用于设置 iDRAC IP 地址的选项 (28)登录到 iDRAC。

(28)下载固件和驱动程序的方法 (29)下载驱动程序和固件 (29)5 预操作系统管理应用程序 (30)用于管理预操作系统应用程序的选项 (30)系统设置 (30)查看系统设置程序 (30)系统设置程序详细信息 (31)系统 BIOS (31)iDRAC 设置公用程序 (48)设备设置 (49)Dell Lifecycle Controller (49)嵌入式系统管理 (49)引导管理器 (49)查看引导管理器 (49)引导管理器主菜单 (49)一次性引导菜单 (50)系统公用程序 (50)PXE 引导 (50)6 安装和卸下系统组件 (51)安全说明 (51)拆装计算机内部组件之前 (52)拆装系统内部组件之后 (52)建议工具 (52)可选的前挡板 (52)卸下可选的前挡板 (52)安装可选的前挡板 (53)系统护盖 (54)卸下系统护盖 (54)安装系统护盖 (55)系统内部组件 (56)导流罩 (57)卸下导流罩 (57)安装导流罩 (58)冷却风扇 (59)卸下冷却风扇 (59)安装冷却风扇 (60)风扇固定框架 (61)卸下风扇固定框架 (61)安装风扇固定框架 (62)卸下风扇架 (63)4目录安装风扇架 (64)防盗开关 (65)卸下防盗开关 (65)安装防盗开关 (66)驱动器 (67)卸下驱动器挡片 (68)安装驱动器挡片 (68)卸下驱动器托架 (69)安装驱动器托架 (70)从驱动器托架中卸下驱动器 (71)将驱动器安装到驱动器托架中 (72)硬盘驱动器背板 (73)系统内存 (73)一般内存模块安装原则 (75)模式特定原则 (76)卸下内存模块 (76)安装内存模块 (77)扩展卡和扩展卡提升板 (78)扩展卡安装原则 (78)卸下扩展卡提升板 (79)安装扩展卡提升板 (80)将扩充卡从扩充卡提升板中卸下 (82)将扩充卡安装到扩充卡提升板中 (83)网络子卡 (84)卸下 NDC 提升板 (84)安装 NDC 提升板 (85)存储控制器卡 (86)卸下存储控制器卡 (86)安装存储控制器卡 (87)IDSDM (87)移除 microSD 卡 (88)安装 microSD 卡 (88)卸下可选的 IDSDM (88)安装可选的 IDSDM (89)电源设备 (90)热备用功能 (91)卸下电源设备单元 (91)安装电源设备单元 (92)直流电源设备的布线说明 (93)系统电池 (94)更换系统电池 (94)使用系统设置程序输入系统服务标签 (95)可信平台模块 (96)升级可信平台模块 (96)目录5为 TXT 用户初始化 TPM 1.2 (97)为 TXT 用户初始化 TPM 2.0 (97)7 使用系统诊断程序 (99)Dell 嵌入式系统诊断程序 (99)从引导管理器运行嵌入式系统诊断程序 (99)从 Dell Lifecycle Controller 运行嵌入式系统诊断程序 (99)系统诊断程序控制 (99)8 跳线和连接器 (101)系统板连接器 (102)系统板跳线设置 (105)禁用忘记的密码 (105)9 获取帮助 (107)</Z2> (107)说明文件反馈 (107)通过使用 QRL 访问系统信息 (107)XC940 系列系统的快速资源定位器 (108)通过 SupportAssist 接收自动支持 (108)附录 A: BOSS 卡 (109)BOSS 卡简介 (109)支持的操作系统 (109)支持的 XC 系列系统 (109)BOSS 卡功能 (110)外部导入 (110)SMART 信息 (110)自动重建 (110)部署 BOSS 卡 (110)卸下 BOSS 卡 (110)安装 BOSS 卡 (113)驱动程序安装 (114)BOSS 故障排除 (114)物理磁盘对操作系统不可见 (114)操作系统看不到虚拟磁盘 (115)驱动器更换 (115)控制器故障 (115)控制器故障 (115)无法启动到插槽 1 中的 M.2 (116)CLI 功能在运行时说明它们不受支持 (116)6目录XC940 系列概览XC940 超融合应用装置是 3U 机架式系统，可提供以下配置：表. 1: XC940 系列配置注: XC940 系列系统支持可热插拔硬盘驱动器。

DDR3 ECC 内存、热插拔硬盘、 冗余电源、 交互式液晶屏、 双 SD 模块
R910
高性能机架密集型 服务器，针对虚拟 化进行了优化
4U
虚拟化和高可用性、高性能数 据库 应用的理想平台
机架式
最高配置 4 个六 核 AMD 皓龙™ 8200 或 8300 系列处理器
2 GB – 256 GB DDR2 SDRAM
驱动器 控制器
RAID 控制器
集成网卡
最大 内置存储
外置 存储
可用性功能
高性能四路 4U 机 架式服务器，具备 内置可靠性与可扩 展性，适合运行关 键任务应用程序
4U
CPU、内存、硬件和虚拟机管 理程序等层级皆内置可靠性功 能 集成系统管理功能、生命周 期 控 制 器 和 嵌 入 式 诊 断 功 能， 英特尔® 至强® 有助于最大限度地延长正常运 7500 系列 行时间 故障安全型双 SD 模块 可以提供一流的虚拟机管理程 序冗余性
PowerEdge T110
戴尔推出的一款入门级塔式服务器，支持文件 共享、集中化和办公协作，非常适合用作小型 企业的第一台服务器。
PowerEdge R810
可扩展的 2U 双路或四路服务器，提供卓 越的性能和机架密度，可让您整合工作负 载，或提高虚拟机的密度。
PowerEdge T310
强大、可靠的企业级单路塔式服务器， 提供高级的可管理性、冗余性和可扩 展性。
Dell PowerEdge 服务器产品组合指南
5
新一代 PowerEdge 服务器
PowerEdge T610
双路 5U 塔式服务器，非常适合需要高可 用性及卓越的虚拟化、系统管理和能效的 企业数据中心及远程站点。

▪产品特征–技术特征–支持的操作系统（OS）▪机械部件–机械部件/硬盘驱动器（HDD）配置–前视图–后视图▪系统设计–系统框图–主板——布局和连接–扩展能力2014联想。

保留一切权利。

▪技术/关键子系统–中央处理器（CPU）兼容性–内存子系统–存储子系统–联网–电源管理▪可管理性/可维护性–服务器管理–易操作性和可维护性▪安全特征–可信平台模块（TPM）支持的处理器•E7-4800 v2系列，最高功率为155W SKU•英特尔C602芯片组内存•96个双列直插内存模块（DIMM）插口（8CH @ 3DPC/ 每个插槽24个DIMM）•LRDIMM和LV-RDIMM：DDR3 1600 MHz DIMM——最高内存容量为3TB •可靠性、可用性和可维护性（RAS）：错误检查与纠正（ECC）、锁步（Lockstep）、镜像（Mirroring）、热备（Sparing）•英特尔C104可扩展内存缓冲区存储•12个2.5" HS硬盘驱动器（HDD）托架——最高支持12TB SATA或14.4TB SAS存储•支持SATA/SAS/SSD/PCIe存储控制器•英特尔集成RAID 100——SATA/SAS（RAID 0/1）•RAID 700适配器（RAID 0/1/5/6/10/50/60），带可选的电池•RAID 710适配器（RAID 0/1/5/6/10/50/60），带1GB缓存和可选的CacheVault/FastPath可用的I/O扩展插槽安装1个CPU时：•1个PCIe，第3代：全高/半长，x8机械式，x8电子式（RAID 控制器使用该插槽）安装2个CPU时：•3个PCIe，第3代：全高/半长，x8机械式，x8电子式•1个PCIe，第3代：全高/半长，x16机械式，x16电子式安装3个CPU时：•5个PCIe，第3代：全高/半长，x8机械式，x8电子式•2个PCIe，第3代：全高/半长，x16机械式，x16电子式With 4 CPU Installed•8个PCIe，第3代：全高/半长，x8机械式，x8电子式•2个PCIe，第3代：全高/半长，x16机械式，x16电子式I/O接口•1个用于远程管理的1 Gb/s以太网端口（端口不能与OS共享）•最多2个可选的以太网子卡。

Los servidores Dell EMC PowerEdge en rack lo ayudarán a crear una infraestructura moderna que minimice los retos de TI e impulse el éxito del negocio. Elija entre un portafolio completo de servidores en rack de 1, 2 y4 conectores para ofrecer alta densidad de núcleos para las aplicaciones tradicionales, la virtualización y las cargas de trabajo nativas en la nube. Las velocidades de memoria mejoradas, las opciones de almacenamiento NVMe más rápidas,1 y el ajuste del BIOS le permiten hacer coincidir el rendimiento con la carga de trabajo para lograr la máxima eficiencia.Servidores PowerEdge de 15.ª generaciónR750R750xa R550R350R250Procesamiento potentepara aplicacionesR940R940xaR740R740xd2"Los servidores Dell EMC PowerEdge son la base del trabajo que hacemos aquí. Proporcionan la automatización, la seguridad, la flexibilidad y la confiabilidad para garantizar que podamos continuar concentrándonos en lo que hacemos mejor como empresa".- Ryan Gariepy, cofundador y gerente ejecutivo de tecnología, OTTO Motors"Podemos implementar nuestros servidores PowerEdge en minutos porque iDRAC está siempre en funcionamiento y se integra con Dell EMC OpenManage...". - Aldo Armiento, gerente ejecutivo de tecnología, Immobiliare.it"Ahorraremos 35 % en un TCO de cinco años con la solución de VDI de Dell EMC. Los servidores PowerEdge en rack estaban listos para salir de la caja para hosting de nuestros requisitos de almacenamiento. Ahorramos 30 % en comparación con una SAN independiente".- Bruce Salisbury, director de TI, Capital Area Human Services1 No todas las funciones están disponibles en todas las plataformas.2Las unidades utilizan portaunidades híbrido para encajar en la bahía de unidades de 3,5 pulgadas. (Para R740xd2: hay una configuración híbrida disponible con hasta 10 SSD de 2,5 pulgadas)Servidores PowerEdge de 14.ª generaciónhardware básicas a través de la planificación, la configuración y las integraciones complejas.Administre: ProSupport Enterprise Suite garantiza el acceso 24x7 a los ingenieros sénior de ProSupport, junto con servicio proactivo y predictivo automatizado permitido mediante SupportAssist. Nuestro servicio personalizado y nuestras medidas preventivas lo ayudarán a anticiparse a los problemas antes de que ocurran.Póngase en contactocon un experto de Dell EMCVer más recursosMás información acerca deSoluciones de servidor Dell EMCsus respectivos propietarios.Octubre de 2021 Rev. A02。

PowerEdgeR940SpecSheetCH适⽤于任务关键型⼯作负载的惊⼈性能Dell EMC PowerEdge R940 的可扩展企业体系结构可以处理⼤多数任务关键型⼯作负载。

借助适合众多⼯作负载的⾃动⼯作负载调整，迅速地完成配置。

再加上多达 6 TB 内存和 13 个 PCIe Gen 3 插槽，R940 具有所有资源，可最⼤限度地提⾼应⽤程序性能和可扩展性，以满⾜未来需求。

利⽤多达 12 个 NVMe 驱动器最⼤限度地提⾼存储性能，并确保轻松地扩展应⽤程序性能。

采⽤特殊的双槽配置，针对软件定义的存储进⾏优化，提供⽐常规双槽服务器多出 50% 的 QPI 带宽。

? 使⽤针对启动进⾏了优化的内部 M.2 SSD 释放存储空间。

借助 48 个 DIMMS （其中 12 个可以是 NVDIMM ）中多达 6 TB 内存，消除瓶颈。

通过 Dell OpenManage ⾃动执⾏维护Dell OpenManage ? 产品组合有助于为 PowerEdge 服务器提供⾼性能，从⽽提供⽇常任务的智能化和⾃动化管理。

再加上独特的免代理管理功能，PowerEdge R940 的管理⾮常简单，您可以腾出时间执⾏⾼级项⽬。

使⽤全新 OpenManage Enterprise ? 控制台简化管理，同时提供⾃定义报告和⾃动化发现功能。

? 充分利⽤ QuickSync 2 功能并通过⼿机或平板电脑轻松地访问服务器。

依靠 PowerEdge 及内置安全性每台 PowerEdge 服务器都设计为⽹络弹性体系结构的⼀部分，将安全性集成到完整的服务器⽣命周期中。

R940 利⽤内置于每台新 PowerEdge 服务器中的全新安全功能来加强保护，因此您可以安全可靠地向客户提供准确的数据，⽆论他们⾝在何处。

通过考虑从设计到停⽤在内的⽅⽅⾯⾯的系统安全性，Dell 将确保建⽴信任并提供⽆忧且安全的基础架构，同时⽆需做出妥协。

? 依赖安全组件供应链，确保从⼯⼚到数据中⼼安全⽆虞。

Dell PowerEdge R940 BIOS 和 UEFI 参考指南6 2021注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。

:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。

:“警告”表示可能会导致财产损失、人身伤害甚至死亡。

© 2017 - 2021 Dell Inc. 或其子公司。

保留所有权利。

Dell、EMC 和其他商标是 Dell Inc. 或其附属机构的商标。

其他商标可能是其各自所有者的商标。

章 1: 预装操作系统管理应用程序 (4)用于管理预操作系统应用程序的选项 (4)系统设置 (4)查看系统设置程序 (4)系统设置程序详细信息 (4)系统 BIOS (5)iDRAC 设置公用程序 (24)设备设置 (24)戴尔生命周期控制器 (24)嵌入式系统管理 (24)引导管理器 (24)查看引导管理器 (24)引导管理器主菜单 (25)一次性 UEFI 引导菜单 (25)系统公用程序 (25)PXE 引导 (25)目录3预装操作系统管理应用程序通过使用系统固件，可以在不引导至操作系统的情况下管理系统的基本设置和功能。

主题：•用于管理预操作系统应用程序的选项•系统设置•戴尔生命周期控制器•引导管理器•PXE 引导用于管理预操作系统应用程序的选项系统提供了以下用于管理预操作系统应用程序的选项：●系统设置●戴尔生命周期控制器●引导管理器●预引导执行环境 (PXE)系统设置通过使用系统设置屏幕，您可以配置 BIOS 设置、iDRAC 设置、以及系统的设备设置。

已根据解决方案要求预配置这些设置。

在更改这些设置之前，请先联系 Dell EMC 。

: 默认情况下，所选字段的帮助文本显示在图形浏览器中。

要在文本浏览器中查看帮助文本，请按 F1。

您可以通过以下方法之一访问系统设置程序：●标准图形浏览器 — 默认设置下启用的浏览器。

●文本浏览器 — 这种浏览器通过控制台重定向启用。

在 VMware ESXi 上部署 Dell™ DR2000v Dell 工程部2014 年 7 月本说明文件仅供信息参考，可能含有印刷错误和技术误差。

其内容应按原样理解，没有任何形式明示或暗示的保证。

© 2014 Dell Inc. 保留所有权利。

未经 Dell Inc. 书面许可，严禁以任何方式复印这些材料。

有关更多信息，请联系 Dell。

本说明文件中描述的适用于 Dell 产品的产品保修可在以下网址找到：/learn/us/en/19/terms-of-sale-commercial-and-public-sector。

本说明文件中所讨论的网络参考体系结构的性能可能会因不同的部署情况、网络负载等而有所不同。

为了方便读者，在参考体系结构中可能包含第三方产品。

包含该类第三方产品并不意味着Dell 建议使用这些产品。

请咨询您的 Dell 代表了解额外信息。

本文中使用的商标：Dell™、Dell 徽标、Dell Boomi™、Dell Precision™、OptiPlex™、Latitude™、PowerEdge™、PowerVault™、PowerConnect™、OpenManage™、EqualLogic™、Compellent™、KACE™、FlexAddress™、Force10™ 和 Vostro™ 是 Dell Inc. 的商标。

本说明文件中还可能使用其他 Dell 商标。

Cisco Nexus®，Cisco MDS®、Cisco NX-0S®和其他Cisco Catalyst®是 Cisco Systems Inc. 的注册商标。

EMC VNX®和 EMC Unisphere®是 EMC Corporation 的注册商标。

Intel®、Pentium®、Xeon®、Core®和 Celeron®是 Intel Corporation 在美国和其他国家或地区的注册商标。

Dell Update Packages 版本 14.11.201用户指南注、小心和警告注: “注”表示可以帮助您更好地使用计算机的重要信息。

小心: “小心”表示可能会损坏硬件或导致数据丢失，并说明如何避免此类问题。

警告: “警告”表示可能会造成财产损失、人身伤害甚至死亡。

版权所有© 2015 Dell Inc. 保留所有权利。

本产品受美国、国际版权和知识产权法律保护。

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2015- 04Rev. A00目录1 使用入门 (6)此版本有哪些新功能？ (7)相关性 (7)支持的操作系统 (7)前提条件 (8)运行 Linux 的系统的前提条件和功能 (8)Dell 限定的和 Dell 启用的软件包 (8)OpenIPMI 要求 (8)运行 Windows 的系统的前提条件和功能 (8)下载 DUP (9)硬盘驱动器固件更新 (9)安装设备驱动程序 (10)交互模式 (10)非交互模式 (10)DUP 的安装顺序 (10)使用 DUP 时需要记住的重要提示 (10)您可能需要的其他说明文件 (11)联系 Dell (11)2 使用 Dell Update Packages (12)更新软件包组件和系统兼容性 (12)在 Linux 环境中执行 DUP (12)交互模式 (12)非交互模式 (12)验证数字签名 (13)在运行 Windows 的系统上执行 DUP (13)在运行 Windows 的系统上验证数字签名 (14)兼容性问题 (14)在运行的系统上应用更新的影响 (14)需要重新引导系统 (14)保存 Linux 控制台输出 (15)将 DUP 发送到系统 (15)更新多个系统 (15)远程终端会话 (15)独立系统和防火墙 (15)确认更新 (15)3 使用 Dell Linux 联机存储库执行 BIOS 和固件更新 (17)3设置或引导存储库 (18)创建本地镜像 (18)安装固件工具 (18)下载适用的固件 (18)对安装的固件进行资源清册 (18)更新 BIOS 和固件 (18)使用 CLI 更新 BIOS 和固件 (18)查看日志信息 (19)4 Lifecycle Controller Enabled Server 中的更新和回滚 (20)Lifecycle Controller 中的更新 (20)Lifecycle Controller 中的回滚 (20)5 命令行界面参考 (22)Linux CLI 选项 (22)Windows CLI 选项 (23)CLI 退出代码 (25)6 Linux 故障排除 (27)已知问题 (27)诊断任务在 DUP 重新引导挂起期间不会运行 (27)DUP 异常终止 (27)Mellanox 资源清册收集器失败 (27)加载共享程序库时出错 (27)可用物理内存不足造成无法加载 BIOS 映像 (28)内核在运行存储控制器固件更新软件包时发生严重错误 (28)重命名 Linux DUP 期间丢失功能 (28)Yum 存储库管理软件高速缓存不正确的存储库元数据 (28)DUP 在 64 位 Red Hat Enterprise Linux 操作系统上发生故障 (28)在 UEFI 模式下运行时，DUP 固件更新可能会失败 (28)消息 (29)DUP 消息日志 (34)消息位置 (34)消息日志文件 (34)7 针对运行 Windows 的系统的故障排除 (35)已知问题 (35)资源清册故障 (35)消息 (35)DUP 消息日志 (37)消息位置 (37)消息日志文件 (37)48 可信平台模块和 BitLocker 支持 (39)9 Microsoft Windows Server 2008 用户帐户控制 (40)远程运行 DUP 时的 UAC 限制 (41)10 常见问题 (42)51使用入门Dell 更新软件包（DUP）是标准软件包格式的独立可执行文件，可更新系统上的单个软件元素。

– 统一通信和协作适合 Microsoft Exchange、Lync 和 Sharepoint 的戴尔解决方案、Lync 和 Sharepoint – 业务处理和决策支持 – 高性能计算 – 虚拟化和云计算
传统基础架构 • PowerEdge 平台 ：
– PowerEdge 机架式服务器 – PowerEdge 塔式服务器 – – – – PowerEdge FX 机箱系列 PowerEdge VRTX PowerEdge 刀片式服务器 PowerEdge C 系列
T630 VRTX
5
统一通信和协作
实时通信
适合 Microsoft Lync 的戴尔解决方案
建议用于 Lync 共享数据库后端
PowerEdge R730 平台非常适合在极 为注重高可用性的环境中担当 Lync 后 端基础架构角色，例如用于承载电话 和消息传送数据库。R730 提供了支持 峰值事务负载所需的可扩展内存密度、 扩展 I/O 和原始性能。
最适合共享存储环境
融 合 的 基 础 架 构 服 务 器， 比 如 PowerEdge FC630、M630、 机 架 优 化 型 1U R630 或 2U R730，可提供共享存储 Exchange 环境所需的性能、内存密度、灵 活的 I/O 和联网选项。在与 Dell Storage 光纤通道或 iSCSI SAN 阵列结合使用时， 这些服务器可以提供大规模通信基础架构所需的响应速度和可扩展性。
新一代 PowerEdge 服务器的每个处理器最多可配备 18 个核心，此外这些服务器还 提供更高的内存带宽和模块化网络选项，从而可以 ： • • • • • • 进一步整合硬件并提高相关的 IT 效率 支持更多并发用户 提高性能并降低延迟，以便在实时通信方面提供更高质量的体验 提供多种网络接口选项，因而无需再进行不必要的“断代”升级 提供面向未来的可扩展性，以便添加更多用户和功能（如企业语音） 借助可监控最重要应用程序组件的性能以及总体系统性能的免代理、自动化、 嵌入式系统管理功能，提高可用性和响应能力

Dell EMC PowerEdge rack servers help you build a modern infrastructure that minimizes IT challenges and drives business success. Choose from a complete portfolio of 1, 2, and 4-socket rack servers to deliver high core density for your traditional applications, virtualization, and cloud-native workloads. Enhanced memory speeds, faster NVMe storage options,1 and BIOS tuning allows you to match performance to your workload for ultimate efficiency.R750R940R940xaR740R740xd2“Dell EMC PowerEdge servers are the foundation of the work we do here. They provide the automation, the security, the flexibility, and the reliability to make sure that we can continue to focus on what we do best as a company.”- Ryan Gariepy Co-founder and Chief Technology Officer, OTTO Motors“We can deploy our PowerEdge servers in minutes because iDRAC is always on and integrates with Dell EMC OpenManage...”- Aldo Armiento, Chief Technology Officer, Immobiliare.it“We’ll save 35 percent on a five-year TCO with the Dell EMC VDI solution. The PowerEdge rack servers were ready to go out of the box for hosting our storage requirements. We saved 30 percent compared to a standalone SAN.”- Bruce Salisbury IT Director, Capital Area Human Services1 Not all features are available on all platforms.2Drives use hybrid carrier to fit in 3.5” drive bay. (For the R740xd2 - a hybrid configuration is available with up to 10 2.5” SSDs)experts to lead deployments from basic hardware installations through planning, configuration and complex integrations.Manage: The ProSupport Enterprise Suite ensures 24x7 access to senior ProSupport engineers along with automated proactive and predictive service enabled by SupportAssist. Our personalized service and preventative measures help you get ahead of problems before they happen.Contacta Dell EMC ExpertView more resources Learn more aboutDell EMC server solutions。