CSR蓝牙芯片常用型号简介与应用

CSR8670开发板使用说明书一、开发板资源介绍开发板是针对蓝牙免提，蓝牙音响应用设计的一款多媒体蓝牙开发套件。

开发板采用英国CSR 公司CSR8670 蓝牙芯片，可以用来开发单声道蓝牙耳机，立体声蓝牙耳机，蓝牙车载免提，蓝牙音频适配器，蓝牙虚拟串口(SPP), 蓝牙人机交互接口（HID），蓝牙文件传输（FTP）等。

开发板带有USB，UART，I2C，PCM，音频输入、输出等接口，并引出PIO 和AIO 接口，方便用户扩展，进行二次开发。

I开发板支持程序在线调试以及参数修改。

1、硬件资源：◆标配CSR8670 蓝牙芯片，内置kalimba DSP ，支持蓝牙协议V4.0+EDR◆集成16Mb FLASH◆7个按键（1个复位键，1个开机键，5个用户按键）◆16个PIO 接口（其中PIO6、PIO7作为I2C）◆2个AIO 接口◆3个LED 指示灯◆ 1个USB 接口 ◆ 音频输出接口 ◆ 音频输入接口 ◆ 板载麦克风 ◆ RS232 接口 ◆ SPI 调试接口 ◆ IIC 接口（PIO 复用） ◆ 64Kbit E2PROM【注意】：板载的部分资源会因为芯片所采用的芯片的不同而未被使用到，具体请参考原理图。

二、硬件连接和使用1、请参照上图，将下载线通过10PIN的排线和开发板连接，将MINI-USB线连接下载线并接到电脑，此时板子左上方的红色LED灯会亮，说明开发板已经正常上电。

【注意】：1. 本开发板将VREN 开机信号单独连接到一个按键作为开机用，所以在使用bluelab或pstool连接开发板时，请务必按下改开机键不放，否则将会导致软件无法读取芯片的现象,bluelab 会提示"Unable to query BlueCore over SPI" 错误。

2. 使用bluelab下载调试程序时，请务先设置【Debug】菜单下的【Tansport】是否设置为USB，否则bluelab 将会提示"Unable to query BlueCore over SPI" 错误二、资料目录介绍随开发板提供给大家的资料包含以下目录，各个文件夹的内容，请见以下详细介绍，需要说明的是，我们的开发资料会不定期的更新，大家可每隔一段时间到我们提供的网盘链接获取最新的资料。

主流蓝牙芯片主流蓝牙芯片是指目前市场上广泛应用的蓝牙芯片，它们具有成熟的技术、稳定的性能和高度的兼容性，可以满足用户对蓝牙设备的多样化需求。

以下是一些主流蓝牙芯片的介绍：1. CSR蓝牙芯片：CSR是全球领先的无线技术解决方案供应商之一，其蓝牙芯片具有低功耗、高度集成、高性能的特点。

CSR蓝牙芯片目前已广泛应用于手机、耳机、音频设备等消费电子产品中。

2. 英特尔蓝牙芯片：英特尔是全球知名的半导体公司，其蓝牙芯片具有强大的计算能力和高度的可靠性。

英特尔蓝牙芯片广泛应用于计算机、平板电脑、物联网设备等领域，可以实现多种蓝牙应用场景。

3. Broadcom蓝牙芯片：Broadcom是全球领先的半导体解决方案供应商之一，其蓝牙芯片具有高度集成、低功耗、稳定性强的特点。

Broadcom蓝牙芯片广泛应用于智能手机、平板电脑、蓝牙耳机等产品中。

4. Nordic蓝牙芯片：Nordic是蓝牙低功耗领域的领先厂商之一，其蓝牙芯片具有超低功耗、高度集成、高度可编程的特点。

Nordic蓝牙芯片广泛应用于物联网设备、运动健康设备等领域，可以实现长时间的蓝牙连接和低功耗运行。

5. Dialog蓝牙芯片：Dialog是专注于节能技术的半导体公司，其蓝牙芯片具有低功耗、高度集成、快速开发的特点。

Dialog蓝牙芯片广泛应用于智能家居、智能穿戴等领域，可以实现长时间的蓝牙连接和低功耗运行。

这些主流蓝牙芯片在市场上都有一定的竞争力，它们不仅具有高度的兼容性和稳定性，还具备丰富的功能和灵活的应用场景。

未来，随着物联网技术的发展和蓝牙标准的不断演进，主流蓝牙芯片将继续不断创新，为用户带来更多更好的蓝牙体验。

国内外18家蓝⽛芯⽚⼚商及产品型号集合技术的出现，让⼈们的电脑、⼿机和各种便携设备，在没有线路的情况下也可以实现连结，这让原先被各种连接线塞满的屋⼦、桌⾯，变得⼲净整洁，如很多朋友都在使⽤的⽆线⿏标、⽿机等等。

⽆线通信技术可以分为近距离⽆线通信和远距离⽆线通信。

近距离⽆线通信包括蓝⽛、WIFI、1.Qualcomm（收购CSR）蓝⽛芯⽚业务，来源于2014年收购的CSR公司，CSR全称CambridgeSiliconRo，是⼀家Fabless⽆⼯⼚半导体制造商，主要产品线为单芯⽚的蓝⽛芯⽚、GPS芯⽚。

⾼通官⽹显⽰，其蓝⽛产品主要分为两⼤类，⽤于语⾳、⾳乐产品的蓝⽛和⽤于物联⽹的低功耗蓝⽛。

上述图表中提到的蓝⽛单模，是只兼容经典蓝⽛（包含蓝⽛3.0/2.1/2.0/1.2/1.1/1.0等）或低功耗蓝⽛（包含蓝⽛5.0/4.2/4.1/4.0等）其中的⼀种。

蓝⽛双模则是既可以兼容经典蓝⽛⼜兼容低功耗蓝⽛；也可理解为蓝⽛单模是⾳频或数传，⽽双模是⾳频（经典蓝⽛）+数传（低功耗蓝⽛）。

2.xas Instruments成⽴于1930年，是⼀家全球知名的数字信号处理与模拟技术半导体供应商，除半导体业务外，3.Cypress成⽴于1982年，是⼀家全球知名电⼦芯⽚制造商，中⽂名为，公司主要⽣产⾼性能IC产品，⽤于数据传输、远程通讯、PC和军⽤系统。

4.Nordic成⽴于1983年，总部位于挪威特隆赫姆。

公司主要提供可以从⼩型电源（如⼿表电池）长时间运⾏的超低功耗（ULP）⽆线芯⽚。

5.DialogDialog是⼀家⽆晶圆⼚半导体公司，主要致⼒于开发⽤于消费电⼦产品的⾼度集成的混合信号产品。

6.ST成⽴于1988年，由意⼤利的SGS微电⼦公司和法国Thomson半导体公司合并⽽成，是全球领先的半导体解决⽅案提供商，可为智能驾驶和物联⽹提供关键解决⽅案。

7.8.NXP成⽴于2006年，先前由飞利浦于50多年前所创⽴。

CSR-Harmony驱动安装和产品使用说明(1)欢迎使用CSR4.0蓝牙适配器------您的肯定就是我的荣耀！CSR Harmony4.0蓝牙的驱动安装和产品使用说明您好！欢迎您使用本产品！让我们一起尽情享受蓝牙的无线快乐吧！首先让我们先大概了解一下本产品的特色：1.CSR V4.0蓝牙适配器采用了CSR（Cambridge SiliconRadio）公司的最新的8510芯片。

2.支持Bluetooth High Speed v3.0与low energy v4.0，并完全向下兼容v1.1/ v1.2/ v2.0/ v2.1的蓝牙设备；3.CSR蓝牙4.0芯片通过被称为Wideband Speech的技术进行音频编码解码，并进一步消除背景噪声和干扰，使无线音频的传输质量大幅提升，A2DP蓝牙立体声音频传输的音效极欢迎使用CSR4.0蓝牙适配器------您的肯定就是我的荣耀！佳，可以媲美有线音频传输的音质；4.蓝牙4.0技术拥有极低的运行和待机功耗，同时拥有跨厂商互操作性，3毫秒低延迟，AES-128加密，无线覆盖范围增强；5.是蓝牙3.0的升级增强版本，与3.0版本相比最大的不同就是低功耗。

一：驱动部分本产品是支持免驱，即插即用的。

免驱的蓝牙适配器:意思并不是指不要驱动，而是微软公司自己在操作系统里集成了蓝牙驱动，当蓝牙适配器插上电脑后系统会自动安装微软的蓝牙驱动。

但是经我们测试，目前微软自己的蓝牙驱动仅仅能支持蓝牙键鼠协议，部分手机的蓝牙文件传输和蓝牙串口等，并不能支持蓝牙音频功能。

如果仅仅用免驱的适配器来连接蓝牙键盘或者鼠标，的确可以不用再额外安装欢迎使用CSR4.0蓝牙适配器------您的肯定就是我的荣耀！驱动，直接插上去就可以连接、使用，但是如果需要与蓝牙耳机连接或者想体验更多的蓝牙应用，那么必须安装我们光盘内的驱动。

本驱动支持多国语言介于本驱动内容较大，有四百多MB，所以本产品标配的驱动碟都采用小盘DVD；建议您先把光盘的内容直接复制到电脑后再进行安装，这将会让您更节省时间，安装也会更顺利。

csr8635和csr8645的区别CSR新一代架构,高度整合的系统单芯片装置，以更精巧的尺寸和更少的BOM成本实现更优越的高传真音质，最新的蓝牙无线连接技术，和功能强大的高效能管理系统。

CSR8600平台将协助消费性电子制造商更快、更容易、以更具成本效益的方式推出产品区隔性高的家庭娱乐和可穿戴(wearable)音讯产品，让消费者享受到前所未有的好音质，方便的无线连接技术，更长的电池寿命和更轻巧的产品设计。

针对各种具备无线连接技术消费性音讯产品，CSR计划陆续推出一系列采用CSR8600消费性音讯平台的高整合单芯片。

从新一代电视、互连家庭娱乐系统和有线/无线，到平板电脑、个人电脑和其他行动无线连接设备等各式应用，CSR8600平台都能以先进的蓝牙和蓝牙低功耗连接技术传输高品质的音讯。

具备小尺寸、高效能、省电以及其他许多特点优势的CSR8600非常符合各式功能强大但尺寸轻巧的可携式和可穿戴产品，例如,智慧型遥控器、无线耳麦和耳机、甚至是配备无线心律监测器、步幅感应器及其他感应装置的可携式媒体播放机。

目前推出使用较多芯片如下：CSR8605 QFN封装，单声道，无mic，单wireCSR8610 BGA封装，单声道，单mic，单wireCSR8615 QFN封装，单声道，单mic，双wireCSR8620 BGA封装，单声道，双mic，双wireCSR8630 QFN封装，双声道，无mic，双wireCSR8635 QFN 封装，双声道，单mic，双wireCSR8640 BGA封装，双声道，双mic，双wireCSR8645 BGA封装，双声道，双mic，双wire带APT-X另外说下APTX技术CSR的aptX音频压缩技术克服了标准蓝牙技术中的一些带宽障碍，通过无线蓝牙连接提供CD级立体声音频。

CSR的蓝牙技术帮助世界上很多最为流行的消费电子通信和娱乐产品成为现实。

aptX技术彰显了蓝牙连接中优越的立体声音频质量，并且其完整的音频频率带宽与高保真性能相符。

Features _äìÉ`çêÉ∆=_`SNRM »=nck■Single-chip Bluetooth mono headset solution withadvanced echo and noise cancellation ■Low-power consumption: over 7 hours of talk-time from a 120mAh battery ■Built-in high-performance 5th Generation CVC(CVC v5.0) single and dual microphone echo and noise cancellation■Advanced Multipoint support: allows a headset (HFP) connection to 2 phones for voice■Packet Loss Concealment and Bit Error Concealment to improve audio quality in thepresence of air interference■Programmable Audio Prompts■Secure Simple Pairing and Proximity Pairing(headset initiated pairing)■Best-in-class Bluetooth radio with 7.5dBmtransmit power and -91dBm receive sensitivity■64MIPS Kalimba DSP coprocessor■Configurable mono headset software■HFP v1.5 and HSP v1.1 support■Integrated 1.5V and 1.8V linear regulators■Integrated switch-mode regulator■Integrated 150mA lithium battery charger■Integrated high-quality codec with 95dB SNRDAC■68-lead 8 x 8 x 0.9mm, 0.4mm pitch QFN package(pin-for-pin compatible with BlueVox DSP QFN)■Green (RoHS compliant and no antimony orhalogenated flame retardants)■ A complete BC6150 QFN mono headset solutiondevelopment kit, including example design, isavailable. Order code DK‑BC‑6150‑1ABC6150 QFN Mono Headset SolutionFully Qualified Single-chipBluetooth ® v2.1 + EDR SystemProduction InformationBC6150A08Issue 2General Description _`SNRM=nck is a low-cost fully featured ROM chip solution for mono headsets. It features advanced single-microphone and dual-microphone CVC v5.0echo and noise cancellation. BC6150 QFN includes a Bluetooth radio, baseband, Kalimba DSP, DAC /ADC, switch-mode power supply and battery charger in a compact 8 x 8 x 0.9mm QFN package for low-cost designs.Applications■Mono headset solution with advanced echo andnoise cancellationBC6150 QFN also includes state-of-the-art CVC v5.0single and dual-microphone echo and noise reductionincluding significant near end audio enhancements.Dual-microphone CVC v5.0 achieves over 30dBdynamic noise suppression, allowing the headset userto be heard more clearly.BC6150 QFN supports the latest Bluetooth v2.1 + EDRspecification which includes Secure Simple Pairing.This greatly simplifies the pairing process, making iteasier to use a Bluetooth headset.The device incorporates auto-calibration and BISTroutines to simplify development, type approval andproduction test.BC6150 QFN contains the Kalimba DSP coprocessorfor supporting enhanced audio applications.BC6150 QFN is designed to reduce the number ofexternal components required, which minimisesproduction costs._`SNRM=nck Data SheetDocument History RevisionDate Change Reason127 AUG 09Original publication of this document.213 NOV 09Production Information added.SPI interface information updated.If you have any comments about this document, email comments@ givingthe number, title and section with your feedback.Document History_`SNRM=nck Data SheetStatus InformationThe status of this Data Sheet is Production Information .CSR Product Data Sheets progress according to the following format:Advance InformationInformation for designers concerning CSR product in development. All values specified are the target values of thedesign. Minimum and maximum values specified are only given as guidance to the final specification limits and mustnot be considered as the final values.All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice.Pre-production InformationPinout and mechanical dimension specifications finalised. All values specified are the target values of the design.Minimum and maximum values specified are only given as guidance to the final specification limits and must not beconsidered as the final values.All electrical specifications may be changed by CSR without notice.Production InformationFinal Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications.Production Data Sheets supersede all previous document versions.Life Support Policy and Use in Safety-critical ApplicationsCSR's products are not authorised for use in life-support or safety-critical applications. Use in such applications isdone at the sole discretion of the customer. CSR will not warrant the use of its devices in such applications.CSR Green Semiconductor Products and RoHS ComplianceBC6150 QFN devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Councilon the Restriction of Hazardous Substance (RoHS).BC6150 QFN devices are also free from halogenated or antimony trioxide-based flame retardants and otherhazardous chemicals. For more information, see CSR's Environmental Compliance Statement for CSR GreenSemiconductor Products .Trademarks, Patents and LicencesUnless otherwise stated, words and logos marked with ™ or ® are trademarks registered or owned by CSR plc or itsaffiliates. Bluetooth ® and the Bluetooth ® logos are trademarks owned by Bluetooth ® SIG, Inc. and licensed toCSR. Other products, services and names used in this document may have been trademarked by their respectiveowners.The publication of this information does not imply that any license is granted under any patent or other rights ownedby CSR plc and/or its affiliates.CSR reserves the right to make technical changes to its products as part of its development programme.While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot acceptresponsibility for any errors.Refer to for compliance and conformance to standards information.Status Information_`SNRM=nck Data SheetContents1Device Details (8)2Functional Block Diagram (9)3Package Information (10)3.1Pinout Diagram (10)3.2Device Terminal Functions (11)3.3Package Dimensions (15)3.4PCB Design and Assembly Considerations (16)3.5Typical Solder Reflow Profile (16)4Bluetooth Modem (17)4.1RF Ports (17)4.1.1RF_N and RF_P (17)4.2RF Receiver (17)4.2.1Low Noise Amplifier (17)4.2.2RSSI Analogue to Digital Converter (17)4.3RF Transmitter (18)4.3.1IQ Modulator (18)4.3.2Power Amplifier (18)4.4Bluetooth Radio Synthesiser (18)4.5Baseband (18)4.5.1Burst Mode Controller (18)4.5.2Physical Layer Hardware Engine (18)4.6Basic Rate Modem (18)4.7Enhanced Data Rate Modem (18)5Clock Generation (20)5.1Clock Architecture (20)5.2Input Frequencies and PS Key Settings (20)5.3External Reference Clock (20)5.3.1Input: XTAL_IN (20)5.3.2XTAL_IN Impedance in External Mode (21)5.3.3Clock Start-up Delay (21)5.3.4Clock Timing Accuracy (21)5.4Crystal Oscillator: XTAL_IN and XTAL_OUT (22)5.4.1Load Capacitance (23)5.4.2Frequency Trim (23)5.4.3Transconductance Driver Model (24)5.4.4Negative Resistance Model (24)5.4.5Crystal PS Key Settings (25)6Bluetooth Stack Microcontroller (26)6.1Programmable I/O Ports, PIO and AIO (26)7Kalimba DSP (27)8Memory Interface and Management (28)8.1Memory Management Unit (28)8.2System RAM (28)8.3Kalimba DSP RAM (28)8.4Internal ROM (28)9Serial Interfaces (29)9.1UART Interface (29)9.1.1UART Configuration While Reset is Active (31)9.2Programming and Debug Interface (31)9.2.1Instruction Cycle ..................................................................................................................... 31_`SNRM=nck Data Sheet9.2.2Multi-slave Operation (31)9.3I 2C Interface (31)10Audio Interface (33)10.1Audio Input and Output (33)10.2Mono Audio Codec Interface (33)10.2.1Mono Audio Codec Block Diagram (34)10.2.2ADC (34)10.2.3ADC Digital Gain (34)10.2.4ADC Analogue Gain (35)10.2.5DAC (35)10.2.6DAC Digital Gain (35)10.2.7DAC Analogue Gain (36)10.2.8Microphone Input (36)10.2.9Output Stage (39)10.2.10Side Tone (40)10.2.11Integrated Digital Filter (40)11Power Control and Regulation (42)11.1Power Sequencing (42)11.2External Voltage Source (42)11.3Switch-mode Regulator (43)11.4Low-voltage Linear Regulator (43)11.5Low-voltage Audio Linear Regulator (43)11.6Voltage Regulator Enable Pins (44)11.7Battery Charger (44)11.8LED Drivers (44)11.9Reset, RST# (45)11.9.1Digital Pin States on Reset (46)11.9.2Status after Reset (46)12Example Application Schematic (47)13Electrical Characteristics (48)13.1ESD Precautions (48)13.2Absolute Maximum Ratings (48)13.3Recommended Operating Conditions (48)13.4Input/Output Terminal Characteristics (49)13.4.1Low-voltage Linear Regulator (49)13.4.2Low-voltage Linear Audio Regulator (50)13.4.3Switch-mode Regulator (51)13.4.4Battery Charger (52)13.4.5Reset (53)13.4.6Regulator Enable (53)13.4.7Digital Terminals (54)13.4.8Mono Codec: Analogue to Digital Converter (55)13.4.9Mono Codec: Digital to Analogue Converter (56)13.4.10Clocks (57)13.4.11LED Driver Pads (57)13.4.12Auxiliary ADC (58)14Power Consumption (59)15CSR Green Semiconductor Products and RoHS Compliance (61)15.1RoHS Statement (61)15.1.1List of Restricted Materials (61)16BC6150 QFN Software Stack (62)16.1BC6150 QFN Mono Headset Solution Development Kit (62)16.2BC6150 QFN Mono Headset Solution ................................................................................................. 62_`SNRM=nck Data Sheet16.3Advanced Multipoint Support (62)16.4Programmable Audio Prompts (63)16.5Proximity Pairing (63)16.5.1Proximity Pairing Configuration (63)17Ordering Information (64)17.1BC6150 QFN Mono Headset Solution Development Kit Ordering Information (64)18Tape and Reel Information (65)18.1Tape Orientation (65)18.2Tape Dimensions (65)18.3Reel Information (66)18.4Moisture Sensitivity Level (66)19Document References (67)Terms and Definitions (68)List of FiguresFigure 2.1Functional Block Diagram (9)Figure 3.1Device Pinout (10)Figure 3.2Package Dimensions (15)Figure 4.1Simplified Circuit RF_N and RF_P (17)Figure 4.2BDR and EDR Packet Structure (19)Figure 5.1Clock Architecture (20)Figure 5.2TCXO Clock Accuracy (22)Figure 5.3Crystal Driver Circuit (22)Figure 5.4Crystal Equivalent Circuit (23)Figure 7.1Kalimba DSP Interface to Internal Functions (27)Figure 9.1Universal Asynchronous Receiver (29)Figure 9.2Break Signal (30)Figure 9.3Example EEPROM Connection (32)Figure 10.1BC6150 QFN Audio Interface (33)Figure 10.2Mono Codec Audio Input and Output Stages (34)Figure 10.3ADC Analogue Amplifier Block Diagram (35)Figure 10.4Microphone Biasing (36)Figure 10.5Speaker Output (40)Figure 11.1Voltage Regulator Configuration (42)Figure 11.2LED Equivalent Circuit (45)Figure 12.1Example Application Schematic (47)Figure 16.1Programmable Audio Prompts in External I 2C EEPROM (63)Figure 18.1BC6150 QFN Tape Orientation (65)Figure 18.2Reel Dimensions (66)List of TablesTable 4.1Data Rate Schemes (19)Table 5.1External Clock Specifications (21)Table 5.2Crystal Specification (23)Table 9.1Possible UART Settings (29)Table 9.2Standard Baud Rates (30)Table 9.3Instruction Cycle for a SPI Transaction (31)Table 10.1ADC Digital Gain Rate Selection (34)Table 10.2DAC Digital Gain Rate Selection (35)Table 10.3DAC Analogue Gain Rate Selection (36)Table 10.4Voltage Output Steps ....................................................................................................................... 38_`SNRM=nck Data SheetTable 10.5Current Output Steps (39)Table 11.1BC6150 QFN Voltage Regulator Enable Pins (44)Table 11.2BC6150 QFN Digital Pin States on Reset (46)List of EquationsEquation 5.1Load Capacitance (23)Equation 5.2Trim Capacitance (23)Equation 5.3Frequency Trim (24)Equation 5.4Pullability (24)Equation 5.5Transconductance Required for Oscillation (24)Equation 5.6Equivalent Negative Resistance (25)Equation 9.1Baud Rate (30)Equation 10.1IIR Filter Transfer Function, H(z) (41)Equation 10.2IIR Filter plus DC Blocking Transfer Function, H DC(z) (41)Equation 11.1LED Current (45)Equation 11.2LED PAD Voltage (45)_`SNRM=nckData Sheet1Device DetailsRadio ■Common TX/RX terminal simplifies external matching; eliminates external antenna switch ■BIST minimises production test time ■Bluetooth v2.1 + EDR specification compliant Transmitter ■7.5dBm RF transmit power with level control from a 6-bit DAC over a typical 30dB dynamic range ■Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch Receiver ■Receiver sensitivity of -91dBm ■Integrated channel filters ■Digital demodulator for improved sensitivity and co-channel rejection ■Real-time digitised RSSI available on HCI interface ■Fast AGC for enhanced dynamic range Synthesiser ■Fully integrated synthesiser requires no external VCO, varactor diode, resonator or loop filter ■Compatible with crystals 16MHz to 26MHz or an external clock 12MHz to 52MHz Kalimba DSP ■Very low power Kalimba DSP coprocessor,64MIPS, 24-bit fixed point core ■Single-cycle MAC; 24 x 24-bit multiply and 56-bit accumulator ■32-bit instruction word, dual 24-bit data memory■6K x 32-bit program RAM, 8K x 24-bit + 8K x 24-bit data RAM ■64 x 32-bit program memory cache when executing from ROM Audio Codec ■16-bit internal codec ■ADC and DAC for stereo audio ■Integrated amplifiers for driving 16Ω speakers; no need for external components ■Support for single-ended speaker termination and line output ■Integrated low-noise microphone bias Physical Interfaces ■Synchronous serial interface for system debugging ■I²C compatible interface to external EEPROMcontaining device configuration data (PS Keys)■UART interface with data rates up to 3Mbits/s■Bidirectional serial programmable audio interfacesupporting PCM, I²S and SPDIF formats■ 2 LED drivers with fadersBaseband and Software■Internal ROM■48KB of internal RAM, allows full-speed datatransfer, mixed voice/data and full piconet support■Logic for forward error correction, header errorcontrol, access code correlation, CRC,demodulation, encryption bit stream generation,whitening and transmit pulse shaping■Transcoders for A-law, µ-law and linear voice fromhost and A-law, µ-law and CVSD voice over air■Configurable mono headset ROM software to set-up headset features and user interface■Support for HFP v1.5 (including three-way calling)and HSP v1.1■Support for Bluetooth v2.1 + EDR specificationSecure Simple Pairing■Proximity Pairing (headset initiated pairing)■Advanced Multipoint support, allowing the headsetto connect to 2 mobile phones or 1 mobile phoneand a VoIP dongle■Programmable audio prompts■Packet Loss Concealment and Bit ErrorConcealment to improve audio quality in thepresence of air interference■DSP based single-microphone CVC v5.0 echo andnoise cancellation is included in the BC6150 QFNfor effective noise cancellation under all conditions■ A high-performance dual-microphone noisecancellation is available using CVC v5.0 is availablein BC6150 QFN providing over 30dB of dynamicnoise suppressionAuxiliary Features■Crystal oscillator with built-in digital trimming■Power management includes digital shutdown andwake-up commands with an integrated low-poweroscillator for ultra-low power Park/Sniff/Hold mode■Clock request output to control external clock■On-chip regulators: 1.5V output from 1.7V to 1.95Vinput■On-chip high-efficiency switched-mode regulator:1.8V output from2.5V to 4.4V input■Power-on-reset cell detects low-supply voltage■10-bit ADC available to applications■On-chip 150mA charger for lithium ion/polymerbatteriesPackage Option■QFN 68-lead, 8 x 8 x 0.9mm, 0.4mm pitch Device Details_`SNRM=nck Data Sheet2Functional Block DiagramG-TW-0115.3.2VREGIN_AUDIO VDD_AUDIO VREGENABLE_L VREGIN_L VREGENABLE_H VSS BAT_PVDD_CHG RF_P XTAL_OUT XTAL_IN LO_REF VDD_LO LED[0]VDD_PADSVDD_MEM RST#TEST_ENVDD_SMP_CORE VDD_CORE VDD_ANA LX VDD_RADIO LED[1]AIO[0]AIO[1]PIO[5:0]VSS_PIO VDD_PIO PIO[14:11, 9]RF_N SPKR_A_PSPKR_A_NMIC_BIASMIC_A_PMIC_A_NMIC_B_NMIC_B_PAU_REF_DCPLUART_TXUART_RXUART_CTS UART_RTS VDD_UARTPIO[7]PIO[8]PIO[6]SPI_CS#SPI_MISO SPI_MOSISPI_CLKFigure 2.1: Functional Block DiagramFunctional Block Diagram_`SNRM=nck Data Sheet3Package Information 3.1Pinout DiagramG-TW-091.4.21234567891018192011121314151617212223242526272829303132333435363738394041424344454647484950515268535455565758596061626364656667Orientation from Top of DeviceFigure 3.1: Device Pinout Package Information_`SNRM=nck Data Sheet3.2Device Terminal FunctionsBluetooth Radio Lead Pad Type Supply Domain DescriptionRF_N65RFVDD_RADIO Transmitter output/switched receiverRF_P64RF Complement of RF_N Synthesiser andOscillatorLead Pad Type Supply Domain DescriptionXTAL_IN3Analogue VDD_ANA For crystal or external clock inputXTAL_OUT4Drive for crystalLO_REF5Reference voltage to decouple the synthesiserSPI Interface Lead Pad Type Supply Domain DescriptionSPI_MOSI28Input, with weak internal pull-downVDD_PADSSPI data inputSPI_CS#30Bidirectional with weakinternal pull-downChip select for SPI, active lowSPI_CLK29Bidirectional with weakinternal pull-downSPI clockSPI_MISO31Bidirectional with weakinternal pull-downSPI data outputUART Interface Lead Pad Type Supply Domain DescriptionUART_TX9Output, tri-state, with weakinternal pull-downVDD_UARTUART data output, active highUART_RX10Bidirectional with weakinternal pull-downUART data input, active highUART_RTS12Bidirectional CMOS output,tri-state, with weak internalpull-upUART request to send active lowUART_CTS11CMOS input with weakinternal pull-downUART clear to send active low_`SNRM=nckData SheetPIO Port Lead Pad Type Supply Domain Description PIO[14]20Bidirectional withprogrammable strength internal pull-up/down VDD_PADS Programmable input/output linePIO[13]19PIO[12]18PIO[11]15PIO[9]14PIO[8]21PIO[7]22PIO[6]23PIO[5]24PIO[4]25PIO[3]58Bidirectional withprogrammable strength internal pull-up/down VDD_PIO Programmable input/output linePIO[2]59PIO[1]60PIO[0]61AIO[1]6Bidirectional VDD_ANA Programmable input/output line AIO[0]7_`SNRM=nck Data SheetAudio Lead Pad Type Supply Domain DescriptionSPKR_A_N56Analogue VDD_AUDIO Speaker output, negative, channel ASPKR_A_P57Analogue VDD_AUDIO Speaker output, positive, channel AMIC_A_N52Analogue VDD_AUDIO Microphone input, negative, channel AMIC_A_P51Analogue VDD_AUDIO Microphone input, positive, channel AMIC_B_N50Analogue VDD_AUDIO Microphone input, negative, channel BMIC_B_P48Analogue VDD_AUDIO Microphone input, positive, channel BMIC_BIAS45Analogue VDD_AUDIO,BAT_PMicrophone biasAU_REF_DCPL55Analogue VDD_AUDIO Decoupling of audio reference, for high-quality audioLED Drivers Lead Pad Type Supply Domain Description LED[1]33Open drain output Open drainLED driver LED[0]32LED driver Test and Debug Lead Pad Type Supply Domain DescriptionRST#26Input with weak internal pull-upVDD_PADSReset if low. Input debounced somust be low for >5ms to cause aresetTEST_EN27Input with strong internal pull-downFor test purposes only, leaveunconnected_`SNRM=nckData SheetPower SuppliesControl Lead DescriptionVREGENABLE_L68Low-voltage linear regulator and low-voltage audiolinear regulator enable, active highVREGIN_L 1Input to internal low-voltage regulatorVREGENABLE_H 35Switch-mode regulator enable, active highVREGIN_AUDIO 46Input to internal audio low-voltage linear regulator VDD_AUDIO 47Positive supply for audioLX 37Switch-mode regulator outputVDD_ANA 2Positive supply output for analogue circuitry and1.5V regulated output, from internal low-voltageregulatorVDD_PIO 62Positive supply for digital input/output ports PIO[3:0]VDD_PADS 16Positive supply for all other digital Input/Output portsincluding PIO[14:11,9:4]VDD_CORE 17, 34Positive supply for internal digital circuitryVDD_RADIO 63, 66Positive supply for RF circuitryVDD_UART 13Positive supply for UART portsVDD_LO 67Positive supply for local oscillator circuitryBAT_P 38Lithium ion/polymer battery positive terminal. Batterycharger output and input to switch-mode regulatorVDD_CHG 39Lithium ion/polymer battery charger inputVDD_SMP_CORE 36Positive supply for switch-mode control circuitry VSS Exposed Pad Ground connectionsUnconnected Leads (N/Cs)Description8, 40, 41, 42, 43, 44, 49, 53, 54Leave unconnected_`SNRM=nck Data Sheet3.3Package DimensionsG-T W-0939.4.3Orientation from TopSeating PlaneOrientation from BottomFigure 3.2: Package Dimensions_`SNRM=nck Data Sheet3.4PCB Design and Assembly ConsiderationsThis section lists recommendations to achieve maximum board-level reliability of the 8 x 8 x 0.9mm QFN 68-leadpackage:■NSMD lands (lands smaller than the solder mask aperture) are preferred, because of the greater accuracy of the metal definition process compared to the solder mask process. With solder mask defined pads, theoverlap of the solder mask on the land creates a step in the solder at the land interface, which can causestress concentration and act as a point for crack initiation.■CSR recommends that the PCB land pattern to be in accordance with IPC standard IPC-7351.■Solder paste must be used during the assembly process.3.5Typical Solder Reflow ProfileSee Typical Solder Reflow Profile for Lead-free Devices for information._`SNRM=nckData Sheet4Bluetooth Modem4.1RF Ports4.1.1RF_N and RF_PRF_N and RF_P form a complementary balanced pair and are available for both transmit and receive. On transmit their outputs are combined using an external balun into the single-ended output required for the antenna. Similarly,on receive their input signals are combined internally.Both terminals present similar complex impedances that may require matching networks between them and the balun. Viewed from the chip, the outputs can each be modelled as an ideal current source in parallel with a lossy capacitor. An equivalent series inductance can represent the package parasitics.G-T W-03349.2.2RF_NRF_PFigure 4.1: Simplified Circuit RF_N and RF_PRF_N and RF_P require an external DC bias. The DC level must be set at VDD_RADIO.4.2RF ReceiverThe receiver features a near-zero IF architecture that allows the channel filters to be integrated onto the die. Sufficient out-of-band blocking specification at the LNA input allows the receiver to be used in close proximity to GSM and W‑CDMA cellular phone transmitters without being desensitised. The use of a digital FSK discriminator means that no discriminator tank is needed and its excellent performance in the presence of noise allows BC6150 QFN to exceed the Bluetooth requirements for co-channel and adjacent channel rejection.For EDR, the demodulator contains an ADC which digitises the IF received signal. This information is then passed to the EDR modem.4.2.1Low Noise AmplifierThe LNA operates in differential mode and takes its input from the shared RF port.4.2.2RSSI Analogue to Digital ConverterThe ADC implements fast AGC. The ADC samples the RSSI voltage on a slot-by-slot basis. The front-end LNA gain is changed according to the measured RSSI value, keeping the first mixer input signal within a limited range. This improves the dynamic range of the receiver, improving performance in interference limited environments._`SNRM=nck Data Sheet4.3RF Transmitter4.3.1IQ ModulatorThe transmitter features a direct IQ modulator to minimise frequency drift during a transmit timeslot, which results in a controlled modulation index. Digital baseband transmit circuitry provides the required spectral shaping.4.3.2Power AmplifierThe internal PA has a maximum output power that allows BC6150 QFN to be used in Class 2 and Class 3 radios without an external RF PA.4.4Bluetooth Radio SynthesiserThe Bluetooth radio synthesiser is fully integrated onto the die with no requirement for an external VCO screening can, varactor tuning diodes, LC resonators or loop filter. The synthesiser is guaranteed to lock in sufficient time across the guaranteed temperature range to meet the Bluetooth v2.1 + EDR specification.4.5Baseband4.5.1Burst Mode ControllerDuring transmission the BMC constructs a packet from header information previously loaded into memory-mapped registers by the software and payload data/voice taken from the appropriate ring buffer in the RAM. During reception, the BMC stores the packet header in memory-mapped registers and the payload data in the appropriate ring buffer in RAM. This architecture minimises the intervention required by the processor during transmission and reception.4.5.2Physical Layer Hardware EngineDedicated logic performs the following:■Forward error correction■Header error control■Cyclic redundancy check■Encryption■Data whitening■Access code correlation■Audio transcodingFirmware performs the following voice data translations and operations:■A-law/µ-law/linear voice data (from host)■A-law/µ-law/CVSD (over the air)■Voice interpolation for lost packets■Rate mismatch correctionThe hardware supports all optional and mandatory features of Bluetooth v2.1 + EDR specification including AFH and eSCO.4.6Basic Rate ModemThe basic rate modem satisfies the basic data rate requirements of the Bluetooth v2.1 + EDR specification. The basic rate was the standard data rate available on the Bluetooth v1.2 specification and below, it is based on GFSK modulation scheme.Including the basic rate modem allows BC6150 QFN compatibility with earlier Bluetooth products.The basic rate modem uses the RF ports, receiver, transmitter and synthesiser, alongside the baseband components described in Section 4.5.4.7Enhanced Data Rate ModemThe EDR modem satisfies the requirements of the Bluetooth v2.1 + EDR specification. EDR has been introduced to provide 2x and 3x data rates with minimal disruption to higher layers of the Bluetooth stack. BC6150 QFN supportsboth the basic and enhanced data rates and is compliant with the Bluetooth v2.1 + EDR specification._`SNRM=nck Data SheetAt the baseband level, EDR uses the same 1.6kHz slot rate and the 1MHz symbol rate defined for the basic data rate. EDR differs in that each symbol in the payload portion of a packet represents 2 or 3 bits. This is achieved using 2 new distinct modulation schemes. Table 4.1 and Figure 4.2 summarise these. Link Establishment and Management are unchanged and still use GFSK for both the header and payload portions of these packets.The enhanced data rate modem uses the RF ports, receiver, transmitter and synthesiser, with the baseband components described in Section 4.5.Data Rate Scheme Bits Per Symbol ModulationBasic Rate 1GFSKEDR 2π/4 DQPSKEDR 38DPSK (optional)Table 4.1: Data Rate SchemesG-TW-0244.2.3Enhanced Data Rate Figure 4.2: BDR and EDR Packet Structure_`SNRM=nck Data Sheet。

CSR8670方案简介CSR8670是CSR公司推出的一款用于蓝牙音频应用的片上系统（SoC）解决方案，基于蓝牙4.0标准。

该方案具有高度集成、低功耗、高音质等特点，适用于蓝牙音箱、耳机、车载音频设备等领域。

主要特性高度集成CSR8670集成了多个功能模块，包括蓝牙无线通信模块、音频解码器、音频编码器、DSP处理器等。

这使得开发者在设计蓝牙音频产品时，能够更加简化电路设计、减少占用空间，提高产品的集成度和灵活性。

低功耗CSR8670采用了先进的低功耗技术，能够在保持音频传输稳定的同时，最大限度地降低功耗。

其低功耗模式支持多种设置，例如待机模式、睡眠模式等，有效延长产品的电池寿命。

高音质CSR8670支持多种音频编解码格式，包括SBC、AAC、MP3等，能够实现高质量的音频传输和解码。

此外，它还支持多种音频效果处理算法，如均衡器、音场扩展等，能够提升音频的音质和立体感。

配置灵活CSR8670内置了丰富的配置选项，可通过软件进行调整和控制。

开发者可以根据产品需求，灵活配置不同的参数，如功耗控制、传输速率、音频编码质量等，从而实现最优化的音频性能和功耗。

多种接口CSR8670提供了多种接口用于与外部设备连接，如I2S、SPI、GPIO、UART等，方便与其他外设进行通信和控制。

此外，它还支持蓝牙双模，即同时支持经典蓝牙和低功耗蓝牙（BLE），增加了产品的兼容性和互联性。

开发流程硬件设计在开始开发基于CSR8670的产品之前，首先需要进行硬件设计。

根据产品需求，选取合适的外围电路，如音频输入输出电路、电源管理电路等。

同时，需要根据CSR8670的引脚定义和规格书，设计PCB并进行布线。

软件开发CSR8670的软件开发主要包括两个方面：底层蓝牙协议栈开发和应用软件开发。

底层蓝牙协议栈开发主要涉及到与蓝牙通信相关的功能，如配对、连接管理、数据传输等。

开发者可以使用CSR提供的开发工具和文档，进行协议栈的调试和开发。

一、硬件1、控制芯片在蓝牙1.1标准的时代，CSR(Cambridge Silicon Radio)公司的CSR Core2芯片占据市场上的绝大部份份额，但到了蓝牙1.2标准盛行的2005年开始，由于Broadcom公司收购蓝牙管理软件widcomm公司，市场份额开始改变，CSR新推出的CSR Core3芯片转向使用IV Bluesoeil，市场反应不佳，Broadcom 公司的BCM系列芯片组开始领跑市场。

（1）CSR Core2芯片，属于蓝牙1.1规范产品（2）CSR Core3-Rom芯片，蓝牙1.2规范，固件与控制芯片整合在一起。

编号为31，有很多JS把CS R Core2的蓝牙棒当Core3卖，这是区别芯片最直接的方法。

（3）Broadcom的BCM系列芯片，属于蓝牙1.2规范产品。

（4）SiliconWave芯片，蓝牙1.2产品，比较少见，通常是低价蓝牙棒才用，不稳定。

2、缓存简单的说，缓存是提供两个蓝牙设备通讯时，由于不可能真正意义上的完全同步，蓝牙设备必须有一个缓冲区，用于暂时存放待处理的数据。

大多数的低价蓝牙棒都不具备缓存，如果你发现蓝牙老断线，70%的原因都是没有缓存造成的。

缓存容量从512K到4MB都有。

3、固件及Profile固件通常上来说，存在于蓝牙棒的缓存上，但现在也有固件与芯片整合的（如用CSR Core3 ROM这个芯片的蓝牙棒）。

固件是让蓝牙棒起应用功能的，其实这和硬盘等固件原理是一样的，而固件的内容就是profile。

举例说明，蓝牙棒用于同步PDA/手机，必须要有一个蓝牙虚拟端口，这个在蓝牙应用上，叫做串口profil e。

所以，有些低价蓝牙无法使用特定的功能，最常见的就是不支持蓝牙鼠标，键盘或蓝牙耳机，这都是因为固件内缺乏相对应的profile引起的，与驱动或蓝牙管理软件无关。

4、天线型态作为无线通讯的一种，蓝牙棒无可避免的需要天线。

天线型态分为两种，最常见的为单天线（Print on Bo ard），成本较低，效果也不错；另外还有双天线蓝牙棒（亦称双回路天线），可以更好地保证无线稳定度及有效距离。

蓝牙模块使用说明一、模块简介：1、芯片简介该蓝牙模块采用台湾胜普科技有限公司的BMX-02X模块为核心，它采用CSR BLUEcore4-External芯片并配置8Mbit的软件存储空间，成本低，使用方便。

CSR BlueCore4是英国Cambridge Silicon Radio(CSR)公司日前推出的第四代蓝牙硅芯片。

这种硅芯片用于蓝牙技术推广小组(SIG)推出的增强数据传输率(EDR)蓝牙。

CSR的BlueCore4的数据传输率将比现有的v 1.2蓝牙装置快三倍，并且使蓝牙移动电话或手机的耗电量较低。

蓝牙EDR的最大数据传输率为每秒2.1兆比特，而目前v1.2标准传输率则为每秒721千比特。

传输率的提高意味着对一个特定量的数据来说，EDR无线电的工作将比v1.2无线电快三倍，从而减少耗电量，大大有利于依赖蓄电池的移动设备。

CSR BlueCore4完全能与现有蓝牙v1.1和v1.2装置兼容。

蓝牙EDR用一种相移键控(PSK)调制模式取代标准传输率的Gaussian频移键控(GFSK)，实现更高的数据传输率。

CSR BlueCore4正在以两种形式提供——一种用于外部“快闪”存储器，一种用于掩模ROM。

BlueCore4-External以一种8×8mm BGA(球形格栅矩阵)封装提供，是十分灵活的解决方案，能够适应迅速更新的市场。

例如，由于BlueCore是目前可以得到的唯一能够支持蓝牙v1.2规格的所有强制和可选功能的硅芯片，BlueCore4-External为PC应用程序提供了理想的解决方案，使它们得益于以三倍速度的传输率无线传输文件，或者同时操作多个高需求的蓝牙链路。

鉴于蓝牙固件安装在芯片只读存储器上，CSR BlueCore4-ROM 的成本较低，占用面积小得多(在小片尺寸包装中为3.8×4mm，在与BC2-ROM和BC3-ROM引脚兼容的BGA中为6×6mm)。

蓝牙csr芯片CSR芯片是一种使用蓝牙技术的无线通信芯片。

它由英国CSR公司开发，是蓝牙通信技术的主要供应商之一。

CSR芯片可以实现无线音频传输、数据传输和远程控制等功能，广泛应用于消费电子、汽车领域和工业自动化等领域。

本文将详细介绍CSR芯片的特点、应用和发展前景。

首先，CSR芯片具有以下特点：1. 低功耗：CSR芯片采用了低功耗设计，可以有效延长电池寿命，适用于移动设备和无线传感器等需要长时间工作的场景。

2. 高集成度：CSR芯片集成了蓝牙通信协议栈、音频解码器、数模转换器等功能，可以实现多种无线通信场景的需求。

3. 高性能：CSR芯片通过优化算法和硬件设计，能够提供更稳定、更快速的数据传输速度和更高的音频质量。

4. 可靠性：CSR芯片支持蓝牙4.0标准，具有强大的抗干扰性能和数据传输稳定性，能够在复杂的无线环境下保持可靠的通信连接。

其次，CSR芯片在多个领域有广泛的应用。

1. 消费电子：CSR芯片被广泛应用于蓝牙耳机、蓝牙音箱、蓝牙键盘等消费电子产品，实现无线音频传输和远程控制功能。

2. 汽车领域：CSR芯片被用于汽车蓝牙系统，可以实现手机蓝牙连接、音频传输、语音控制等功能，提升驾驶体验和安全性。

3. 工业自动化：CSR芯片被用于工业自动化领域，实现无线传感器网络、设备远程监控和控制等功能，提高生产效率和降低人工成本。

4. 医疗健康：CSR芯片被应用于医疗健康领域，实现医疗设备的远程监测和数据收集，方便医生进行远程诊断和治疗。

最后，CSR芯片有着广阔的发展前景。

1. 5G时代的到来：随着5G时代的到来，对高速、低延迟的无线通信需求将更加迫切。

CSR芯片具有良好的性能和稳定性，可以满足5G通信的要求。

2. 物联网的发展：物联网的兴起将带动CSR芯片的需求增长。

CSR芯片可以实现无线传感器网络和设备互联互通，为物联网应用提供了无线通信的基础支撑。

3. 人工智能的普及：随着人工智能技术的普及，对于智能设备和智能家居应用的需求也在增加。