HSMS-2813-BLK中文资料

Surface Mount RF SchottkyBarrier DiodesTechnical DataHSMS-281x SeriesFeatures•Surface Mount Packages •Low Flicker Noise•Low FIT (Failure in Time) Rate*•Six-sigma Quality Level •Single, Dual and QuadVersions•Tape and Reel OptionsAvailable•Lead-free Option Available *For more information see the Surface Mount Schottky Reliability Data Sheet.Description/Applications These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-281x series of diodes features very low flicker (1/f) noise.Note that Agilent’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.Package Lead Code Identification, SOT-23/SOT-143 (Top View)COMMONCATHODECOMMONANODESERIESSINGLEPackage Lead CodeIdentification, SOT-323(Top View)Package Lead CodeIdentification, SOT-363(Top View)UNCONNECTEDTRIOLHIGH ISOLATIONUNCONNECTED PAIRK1.Package marking providesorientation and identification.2.See “Electrical Specifications” forappropriate package marking.Pin Connections andPackage Marking6542Electrical Specifications T C = 25°C, Single Diode [4]MaximumMaximumMinimum Maximum Forward Reverse Typical Part PackageBreakdown Forward Voltage Leakage Maximum Dynamic Number Marking Lead Voltage Voltage V F (V) @I R (nA) @Capacitance Resistance HSMS [5]Code Code Configuration V BR (V)V F (mV)I F (mA)V R (V)C T (pF)R D (Ω)[6]2810B0[3]0Single204001.035200 151.2152812B2[3]2Series2813B3[3]3Common Anode 2814B4[3]4Common Cathode 2815B5[3]5Unconnected Pair 2817B7[3]7Ring Quad [5]2818B8[3]8Bridge Quad [5]281B B0[7]B Single 281C B2[7]C Series281E B3[7]E Common Anode 281F B4[7]F Common Cathode 281K BK [7]K High IsolationUnconnected Pair 281LBL [7]LUnconnected TrioTest ConditionsI R = 10 µA I F = 1 mAV F = 0 V I F = 5 mAf = 1 MHzNotes:1. ∆V F for diodes in pairs and quads in 15 mV maximum at 1 mA.2. ∆C TO for diodes in pairs and quads is 0.2 pF maximum.3. Package marking code is in white.4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.5. See section titled “Quad Capacitance.”6. R D = R S + 5.2Ω at 25°C and I f = 5 mA.7. Package marking code is laser marked.Absolute Maximum Ratings [1] T C = 25°CSymbol ParameterUnit SOT-23/SOT-143SOT-323/SOT-363I f Forward Current (1 µs Pulse)Amp 11P IV Peak Inverse Voltage V Same as V BRSame as V BRT j Junction Temperature °C 150150T stg Storage Temperature °C -65 to 150-65 to 150θjcThermal Resistance [2]°C/W500150Notes:1.Operation in excess of any one of these conditions may result in permanent damage to the device.2.T C = +25°C, where T C is defined to be the temperature at the package pins where contact is made to the circuit board.ESD WARNING:Handling Precautions Should Be Taken To Avoid Static Discharge.3Quad CapacitanceCapacitance of Schottky diode quads is measured using an HP4271 LCR meter. Thisinstrument effectively isolates individual diode branches from the others, allowing accuratecapacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S.voltage at 1 MHz. Agilent defines this measurement as “CM ”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then becalculated by the formulas given below.In a quad, the diagonal capaci-tance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formulaC 1 x C 2 C 3 x C 4C DIAGONAL = _______ + _______C 1 + C 2 C 3 + C 4C 1C 2C 4C 3ABCThe equivalent adjacentcapacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula1C ADJACENT = C 1 + ____________1 1 1–– + –– + –– C2 C 3C 4SPICE ParametersParameter UnitsHSMS-281x B V V 25C J0pF 1.1E G eV 0.69I BV A E -5I S A 4.8E -9N 1.08R S Ω10P B V0.65P T 2M0.5C jR j =8.33 X 10-5 nT I b + I swhereI b = externally applied bias current in ampsI s = saturation current (see table of SPICE parameters)T = temperature, °Kn = ideality factor (see table of SPICE parameters)Note:To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124.R S = series resistance (see Table of SPICE parameters)C j = junction capacitance (see Table of SPICE parameters)Linear Equivalent Circuit, Diode Chip4Typical Performance, T C = 25°C (unless otherwise noted), Single DiodeFigure 1. Forward Current vs. Forward Voltage at Temperatures.I F – F O R W A R D C U R R E N T (m A )V F – FORWARD VOLTAGE (V)0.011010.1100Figure 2. Reverse Current vs. Reverse Voltage at Temperatures.I R – R E V E R S E C U R R E N T (n A )V R – REVERSE VOLTAGE (V)Figure 3. Dynamic Resistance vs. Forward Current.0.11100R D – D Y N A M I C R E S I S T A N C E (Ω)I F – FORWARD CURRENT (mA)101101000100Figure 4. Total Capacitance vs. Reverse Voltage.0264101281614C T – C A P A C I T A N C E (p F )V R – REVERSE VOLTAGE (V)00.750.500.251.251V F - FORWARD VOLTAGE (V)Figure 5. Typical V f Match, Pairs and Quads.301010.3I F - F O R W A R D C U R R E N T (m A )∆V F - F O R W A R D V O L T A G E D I F F E R E N C E (m V )0.20.40.60.8 1.0 1.21.45Table 1. Typical SPICE Parameters.Parameter Units HSMS-280xHSMS-281x HSMS-282x B V V 752515C J0pF 1.6 1.10.7E G eV 0.690.690.69I BV A 1 E-5 1 E-5 1 E-4I S A 3 E-8 4.8 E-9 2.2 E-8N 1.08 1.08 1.08R S Ω3010 6.0P B (V J )V0.650.650.65P T (XTI)222M0.50.50.5Applications InformationIntroduction —Product SelectionAgilent ’s family of Schottkyproducts provides unique solu-tions to many design problems.The first step in choosing the right product is to select the diode type.All of the products in theHSMS-282x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-280x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1.A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (R s ). In applica-tions which do not require high voltage the HSMS-282x family,with a lower value of seriesresistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family.In general, the HSMS-282x family should be the designer ’s first choice, with the -280x familyreserved for high voltage applica-tions and the HSMS-281x family for low flicker noise applications.Assembly InstructionsSOT-323 PCB FootprintA recommended PCB pad layout for the miniature SOT-323 (SC-70)package is shown in Figure 6(dimensions are in inches). This layout provides ample allowance for package placement by auto-mated assembly equipment without adding parasitics that could impair the performance.Figure 6. PCB Pad Layout (dimensions in inches).Assembly InstructionsSOT-363 PCB FootprintA recommended PCB pad layout for the miniature SOT-363 (SC-70,6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for packageplacement by automated assembly equipment without addingparasitics that could impair the performance.Figure 7. PCB Pad Layout (dimensions in inches).6TIME (seconds)T E M P E R A T U R E (°C )05010015020025060120180240300Figure 8. Surface Mount Assembly Profile.SMT AssemblyReliable assembly of surface mount components is a complex process that involves manymaterial, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.)circuit board material, conductor thickness and pattern, type of solder alloy, and the thermalconductivity and thermal mass of components. Components with a low mass, such as the SOTpackage, will reach solder reflow temperatures faster than those with a greater mass.Agilent ’s SOT diodes have been qualified to the time-temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount assembly process.These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum tempera-tures and times necessary to achieve a uniform reflow of solder.After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)passes through one or morepreheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat-ing solvents from the solder paste.The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder.The rates of change of tempera-ture for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo-nents due to thermal shock. The maximum temperature in the reflow zone (T MAX ) should not exceed 235°C.7Part Number Ordering InformationNo. of Part Number Devices Container HSMS-281x-TR2*1000013" Reel HSMS-281x-TR1*30007" Reel HSMS-281x-BLK *100antistatic bagx = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, LFor lead-free option, the part number will have the character "G" at the end, eg. HSMS-281x-TR2G for a 10,000 lead-free reel.Package DimensionsOutline 23 (SOT-23)Outline 143 (SOT-143)SIDE VIEWEND VIEWDIMENSIONS ARE IN MILLIMETERS (INCHES)DIMENSIONS ARE IN MILLIMETERS (INCHES)PACKAGE MARKING CODE (XX)Outline SOT-363 (SC-70 6 Lead)Outline SOT-323 (SC-70 3 Lead)0.25 (0.010)0.30 (0.012)0.10 (0.004)0.425 (0.017)DIMENSIONS ARE IN MILLIMETERS (INCHES)0.30 (0.012)0.10 (0.004)0.425 (0.017)DIMENSIONS ARE IN MILLIMETERS (INCHES)8Device OrientationUSER FEEDFor Outline SOT-143Note: "AB" represents package marking code. "C" represents date code.END VIEWTOP VIEW For Outlines SOT-23, -323Note: "AB" represents package marking code. "C" represents date code.END VIEWTOP VIEW END VIEWTOP VIEW Note: "AB" represents package marking code. "C" represents date code.For Outline SOT-3639Tape Dimensions and Product OrientationFor Outline SOT-23DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.15 ± 0.102.77 ± 0.101.22 ± 0.104.00 ± 0.101.00 + 0.050.124 ± 0.0040.109 ± 0.0040.048 ± 0.0040.157 ± 0.0040.039 ± 0.002CAVITYDIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESSW t18.00 + 0.30 – 0.100.229 ± 0.0130.315 + 0.012 – 0.0040.009 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 23.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCE BETWEEN CENTERLINEFor Outline SOT-1431DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.19 ± 0.102.80 ± 0.101.31 ± 0.104.00 ± 0.101.00 + 0.250.126 ± 0.0040.110 ± 0.0040.052 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITYDIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESSW t18.00 + 0.30 – 0.100.254 ± 0.0130.315+ 0.012 – 0.0040.0100 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 23.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCE/semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (65) 6756 2394India, Australia, New Zealand: (65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)Korea: (65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines,Indonesia: (65) 6755 2044Taiwan: (65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5968-7649E March 24, 20045989-0475ENTape Dimensions and Product OrientationFor Outlines SOT-323, -363(CARRIER TAPE THICKNESS)(COVER TAPE THICKNESS)DESCRIPTIONSYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCHBOTTOM HOLE DIAMETER A 0B 0K 0P D 1 2.40 ± 0.102.40 ± 0.101.20 ± 0.104.00 ± 0.101.00 + 0.250.094 ± 0.0040.094 ± 0.0040.047 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITYDIAMETER PITCH POSITION D P 0E 1.55 ± 0.054.00 ± 0.101.75 ± 0.100.061 ± 0.0020.157 ± 0.0040.069 ± 0.004PERFORATIONWIDTH THICKNESS W t 18.00 ± 0.300.254 ± 0.020.315 ± 0.0120.0100 ± 0.0008CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)F P 2 3.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002DISTANCEFOR SOT-323 (SC70-3 LEAD)An8°C MAX FOR SOT-363 (SC70-6 LEAD)10°C MAXANGLEWIDTHTAPE THICKNESS C T t 5.4 ± 0.100.062 ± 0.0010.205 ± 0.0040.0025 ± 0.00004COVER TAPE。