工厂英文经典知识缩写
- 格式：doc
- 大小：37.00 KB
- 文档页数：8
英文经典知识缩写
AF Acceleration factor
ALT Accelerated life test
ANOVA Analysis of Variance
AOQL Average Outgoing Quality Level
APO Auto Power Off
APQP Advanced Product Quality Planning and Control Plan
ARE Area Options
ASIC Application Specific Integrated Circuit
ASSP Application Specific Standard Part
ATE Automatic test equipment
ATO Assembly To Order
AVL RFQ IMPUT CHECKLIST里面用到
BAC Backup
BCI Bulk current injection
BD Business Developer
BFR Batch Failure Rate
bo Bochum
BOM Bill of Material
BU Business Unit
c acceptance level (= number of failed components accepted)
CBD Cost Break Down
CDM Contract Design Manufacturer
CDM Charge Device Model –discharge type
CDM Original Design done by Partner specifically to support
Nokia
CDN Coupling and Decoupling Network.
CE Concurrent Engineering
CE Concurrent Engineering (used for product development)
CE. E0...E5 Concurrent Engineering (CE) Product Program
Milestones
CEM Contract Electronic Manufacturer
CER. FILTERS, MONOBL. DUPLEXERS Powder mixing, Block pressing,
Firing
CI Capacity Implementation
CIM Custom In Mould
CLUSTER Group of companies, head by one Cluster leader
CM Cost Management
CMO Customer & Market Operations
co Copenhagen
COC Certificate of compliance
COO Country of Origin Cp, Cpk Process Capability indices
Cpk Capability Index
CPL Cost Part list
CQE Component Quality Engineer
CQP Component Quality Planning
CQS Component Quality Specialist
CR Change Request
CRR Component review report
CRYSTALS Crystal wafer manufacturing
CSA Current State Analysis
CSM
C-TPAT Customs-Trade Partners Against Terrorism
CTS Cost Target Setting
D Draft, first version of the document
da Dallas
DC Direct
DC Direct Current
DCN Design change notice
DES Deselect all
DFA Design For Assembly
DFBA Design for Board Assembly
DFDS Design for Demand Supply
DfE Design for Environment
DFFA Design for Final Assembly
DFM Design For Manufacturing (includes DFPT, DFBA, DFFA)
DFMEA Design Failure Mode and Effects Analysis
DFPT Design for Production Test
DG
DI-EL. DUPLEXERS Resonator preparing
DIR Design Improvement Reports
DocMan Type of Lotus Notes database (for documents)
DOE Design Of Experiment
DOE Design Of Experiment
DPM Defects Per Million
DSB Demand Supply Balance
DSN Demand Supplier Network
DUT Device Under Test
DV Demand Volume
DVR
E0...E5 Concurrent Engineering (CE) Milestones
E0..E5 Concurrent engineering (CE) milestones
ECN Engineering Change Notice
EFR Early Failure Rate
ELMECH Electro Mechanical EMC Electro Magnetic Compatibility
EMI Electro Magnetic Interference
EMS Environmental Management Sys-tem
EN European Norm
EoL End of Life
EPA ESD protected area
ERP
es Espoo
ESD Electrostatic discharge
ESDS Electrostatic discharge sensitive device
ESI Early Supplier Involvement
ETA Estimate to be arrive
EUT Equipment Under Test
EV Enclosed volume
EVM Enhancements Version Management
F Final, document to be archived
FA Failure Analysis
FAC Fully anechoic chamber
FAQ Frequently Asked Questions
FAI First article inspection
FEM Finite Element Modelling
FFR Field Failure Rate
FIL Filter..
FIML Fabric Inmold Labeling, same with CIM Custom In Mould
FIT Failures in Time
FMEA Failure Mode and Effect Analysis
FOR
FOT 第一次试模
FR Failure Rate
G.A. General Assembly
Gauge R&R Gauge Repeatability and Reproducibility
GCPM
GD&T Geometrical Dimensioning & Tolerances
GRP ground reference plane
GRR Gauge Repeatability and Reproducibility
HBM Human Body Model
HBM Human Body Model –discharge type
HCP horizontal coupling plane
HIGH Highlight selected
hk Hong Kong
HUB Warehousing and Shipping functionality location
ICDR Integrated Circuit Design Reviews
