En_GreenCompute_ATOMSrv_MotheBoard_Spec_V1.0

Micrium Tools Training: µC/Probe and SystemViewLabsMicrium’s µC/Probe and SEGGER’s SystemView can be invaluable for developers whose projects are based on the Micrium OS. The lab exercises described in this document will familiarize you with these two tools. The instructions for the lab assume that you have a Mighty Gecko Wireless Starter Kit (SLWSTK6000B), and that you’ve already insta lled µC/Probe and SystemView, as well as the Simplicity Studio IDE, on your PC. Download links for all of these tools are provided below.Download LinksSimplicity Studio: /products/development-tools/software/simplicity-studioThe Micrium OS example project prepared for these labs was developed using SimplicityStudio. You’ll need the IDE in ord er to build and run the project.µC/ProbeA visit to Micrium’s Web site to download µC/Probe is not necessary, since the tool was recently integrated into Simplicity Studio. However, you may need to use the IDE’s Package Manager to update your install and gain access to µC/Probe. Within the Package Manager, which you can find by clicking the button with the green, downward-facing arrow appearing near the upper-left corner of Simplicity Studio in the Launcher perspective, the link for installing µC/Probe is located on the Tools page, as indicated in the below screenshot. The Educational Edition of µC/Probe referenced by the link can be used without a license. If you’d like access to the full-featured Professional Edition of the tool, you can contact Micrium to get a one-year FAE license at no cost.SystemView: https:///downloads/free_tools/Setup_SystemView_V242.exe SystemView is a free tool from SEGGER. In order for the tool t o work properly, you’ll need the latest J-Link software, which is also available from SEGGER: https:///downloads/jlink/JLink_Windows_V614c.exe.Lab 1: Building and Running the Example ProjectIn this lab, you’ll build and run a Simplicity Studio example proj ect incorporating the Micrium OS. You’ll use this project in Lab 2 and Lab 3 to explore the features of µC/Probe and SystemView.Procedure:1.Your hardware platform for the labs is the Mighty Gecko Wireless Starter Kit. Youshould now connect one of your k it’s main boards (BRD4001A) to a radio board(BRD4161A). You should then establish a USB connection between your PC and thecombined boards. Your main board features a built-in J-Link debugger, and the USB connection will allow you to leverage this debugger within Simplicity Studio.2.If you’re not al ready running Simplicity Studio, you should start it now. You shouldmake sure that you’re in the Simplicity IDE perspective, which you can open by selecting Window>Perspective>Simplicity IDE.3.The example project for the labs is delivered in a zip file named Micrium-Tools-Lab.zip.You should now extract the contents of this zip file to a folder of your choice. To avoid any possible issues with long path names, it is recommended to keep the zip file contents relatively close to your root folder.4.You’ll now need to import the example project that was delivered in Micrium-Tools-Lab.zip. You should start the import process in Simplicity Studio by selecting File>Import…. On the dialog that subsequently appears, you should expand General and select Existing Projects into Workspace, as indicated in the below screenshot. You should then click the Next button.5.Within the second Import dialog, you should ensure that Select root directory is chosenand you should then click the corresponding Browse button. You must then navigate to the location of the project folder (named Tools-Lab-1) that was provided in Micrium-Tools-Lab.zip. Before clicking the Finish button, you should ensure that the Tools-Lab-1 is checked in the Projects field and that Copy projects into workspace is likewise checked, as indicated in the below screenshot.6.The example project should now appear in your Project Explorer, as indicated below.To clean any build artifacts that might exist for the project, you should right-click its name, Tools-Lab-1, and select Clean Project from the menu that appears. If the clean operation was successful, you should then attempt to build the project by again right-clicking the project name and this time selecting Build Project.7.The build operation for your project should have completed without any errors. (Thereshould have been one warning associated with deprecated interrupt code in the BSP.) In the case of a successful build, you should now attempt to download your project’s code to your board by right-clicking Tools-Lab-1in the Project Explorer and then selecting Debug As>1 Silicon Labs ARM Program.8.Simplicity Studio should automatically switch to the Debug perspective as a result ofyour actions in the previous step. Within this pers pective’s editor area, the tool should indicate that execution of your project is halted on the first line of the main() function. You should now start execution of the project’s code by clicking the Resume button shown below. LED0and LED1should then begin alternately blinking on yourboard.9.After confirming that your code is running and your LEDs are blinking, you can terminateyour debug session by right-clicking the Silicon Labs ARM MCU item that, as indicated inthe below screenshot, should appear in the Debug window. You should selectTerminate from the subsequent pop-up menu. Your LEDs should continue to blink afterthe debug session has ended, since your project’s code now resides in Flash memory.Lab 2: µC/ProbeIn this lab, you’ll use µC/Probe to visualize the internals of the project that you built in Lab 1. You’ll first monitor one of the project’s C variables, and you’ll then use µC/Probe’s kernel-awareness capabilities to view statistics output by the µC/OS 5 kernel on which the project is based.Procedure:1.You should now run µC/Probe. You can actually start the tool within Simplicity Studio byclicking the button shown in the below screenshot.2.µC/Probe makes it possible to view the values of an application’s variables as codeactually runs. In order to offer this capability, it needs information on the variables’ locations. It typically gets this information from an ELF file. When you built the Micrium OS example project following the procedure given in the previous section of this document, an ELF file, Tools-Lab-1.axf, should have been generated by Simplicity Studio and placed at the path listed below. In this path, <project_location> is the folder where your project resides. If you’re uncertain of this location, you should right-click the project’s name in Project Explorer and select Properties. If you then select Resource from the categories listed on the left side of the Properties dialog, you’ll be able to read your project folder from the Location field in the upper half of the dialog.<project_location>\GNU ARM v4.9.3 - Debug3.You can pass an ELF file to µC/Probe using the Symbol Browser located at the bottom ofthe tool’s main window. You should now click the Symbol Broswer’s ELF button, which is shown in the below screen shot. In the ensuing dialog, you should simply browse to the ELF file described above and then click the Open button.4.µC/Probe will be able to use your board’s built-in J-Link debugger to access variables inyour running example code. In order to establish J-Link as your preferred communication interface, you’ll need to select it in the Settings dialog. You should now open this dialog by clicking the Settings button shown below.5.As indicated in the below screenshot, the lower left corner of the Settings dialogcontains a list of Debug Interfaces containing just one item: J-Link. You should confirm that J-Link is selected, and you should then ensure that Don’t Change has been specified for the Interface Mode. Before clicking OK, you should choose Silicon Labs as the Manufacturer, and, using the provided table, select EFR32MG12PxxxF1024as your Device.6.µC/Probe provides a variety of graphical components that can be used for displaying thevalues of variables. You can access these components via the Toolbox located on the left side of the main program window. You should now instantiate a new component—a gauge—by first clicking Angular Gauges in the lower half of the Toolbox and thendragging and dropping the Semicircle 3gauge onto the data screen in the middle of µC/Probe’s program window. The data screen should then appear as shown in thebelow screenshot.7. A graphical component is not of much use until it has been associated with a variable, orsymbol. The Symbol Browser will be your means of associating a variable with your new gauge. If the Symbol Browser is not already displaying a list of C files corresponding to the code that you built in the first part of the lab, you can make such a list appear by expanding the entry for Tools-Lab-1.axf that appeared when you specified the path of this file in Step 2. Once the list is visible, you should expand the entry for the C file ex_main.c in order to make the variables contained in that file appear. You should then drag and drop the variable Ex_MainSpeed from the Symbol Browser to your gauge. As indicated below, the variable name will appear below thegauge to indicate that the two are associated.8.You should now click µC/Probe's Run button, which, as indicated below, is located in theupper left-hand corner of the tool's main program window. If you’re using the Educational Edition of the tool, you’ll be presented with a dialog indicating that you won’t have access to µC/Probe’s full set of features unless you upg rade to the Professional Edition. You can simply click this dialog’s Close button. You will then enter µC/Probe’s Run-Time mode. The dial on your gauge should begin moving from 0 to 100 and then back to 0. It should repeat this pattern indefinitely. Keep in mind that, with the Educational Edition, you will only be able to remain in Run-Time mode for one minute before a time-out occurs and another dialog prompting you to upgrade appears.9.µC/Probe can be used with nearly any embedded system—including those not based ona real-time kernel. However, the tool is especially helpful when paired with projectsthat incorporate Micrium’s embedded software modules, in part because of its kernel-awareness capabilities. These capabilities are implemented via a number of pre-populated data screens that show the values of different kernel variables. You should now stop µC/Probe (by clicking the Stop button located in the upper left-hand corner of the main program window) and add the kernel-awareness screens for µC/OS 5, the kernel featured in the example project, to your workspace. You can add the screens by first clicking Project1in µC/Probe's Workspace Explorer window and then clicking Screens>Micriµm OS Kernel (µC/OS-5), as indicated in the below screenshot. After making this change, you can again click Run to prompt µC/Probe to begin updating the new screens with kernel statistics.10. Within the main µC/OS 5 kernel-awareness screen, there are a number of subordinatescreens, including one for Task(s). As shown below, this screen displays the status of each task running in your project. You should now take a moment to look over the screen and familiarize yourself with the various tasks that the example incorporates.The percentage of CPU cycles consumed by the tasks is provided in the CPU Usage column, and you should note that, after the kernel’s Idle Task—which runs when no application tasks are ready—it is the Tick Task—the kernel task responsible for processing periodic tick interrupts—that consumes the most CPU cycles, with a usage of approximately 5.5%.11.After you’ve looked over Task(s), you should stop µC/Probe (via the Stop buttonmentioned in Step 9). You should then return to Simplicity Studio to make a simple change to the example project’s code. Within the IDE, you should open the file ex_main.c. You’ll be able to find this file by expanding the Micrium folder within the Project Explorer, and then similarly expanding Micrium_OS_V5.00 and examples. You should add the below two lines to ex_main.c, placing the new code at line 156, just below the variable declaration in the main() function. The result of your addition will be to change the frequency of tick interrupts received by the kernel, from 1 kHz to 100 Hz.OS_TASK_CFG Ex_MainCfgTick = {DEF_NULL, 256u, 4u, 100u};OS_ConfigureTickTask(&Ex_MainCfgTick);12.You should now build and run your modified project, following the same procedure thatyou used in Lab 1. Afterward, you should return to µC/Probe and again run your workspace. With tick interrupts now occurring at 1/10 of their original frequency, you should confirm that the overhead of the kernel’s Tick Task has experienced a similar decrease, meaning that the task’s CPU usage should be around 0.6%.Lab 3: SystemViewThis lab w ill walk you through the steps needed to use SEGGER’s SystemView with the example project featured in the previous two labs. With SystemView, you’ll be able to see the cont ext switches, interrupts, and kernel function calls that occur as the project runs.Procedure:1.Because the latest Micrium OS is a relatively new software module, it is not yetsupported by the version of SystemView available from the SEGGER Web site.Fortunately, though, it is fairly easy to update SystemView so that it will recognize applications based on MicriumOS. To make the update, you should now copy SYSVIEW_Micrium OS Kernel.txt, which was provided in Micrium-Tools-Lab.zip, and paste this file into the Description folder in the SystemView install path—Program Files (x86)\SEGGER\SystemView_V242.2.You should now run SystemView by clicking the tool’s entry in the Windows Start menu.3.When you run SystemView for the first time, you’ll be presented with the below dialog,asking whether you’d like to load a sample recording. You can simply click this dialog’s No button.4.In order to begin analyzing the behavior of your example project’s code, you’ll need torecord the code’s activity. To initiate recording, you should select Target>Start Recording within SystemView. You will then be presented with a Configuration dialog.Once you’ve verified that the contents of this dialog match the screenshot shown below, you should click the OK button to initiate recording.5.Shortly after you’ve started to record, you may be presented with the dia log shown inthe below screenshot. This dialog indicates that some of the data that would otherwise be displayed by SystemView was lost, because the buffer used to temporarily store that data on your target experienced overflows. You can simply click OK to close the dialog.For information on how to limit the potential for overflows, you can consult the last section in this document.6.Once you’ve gathered a few second’s worth of data, you should click the Stop Recordingbutton shown in the first of the two screenshots shown below. As the second screenshot indicates, the Timeline located near the center of the SystemView main program window should subsequently display all of the task and ISR activity that occurred during the period the recording was active. You now can begin investigating the execution of the example project’s code in detail.7.If you adjust the zoom on the timeline, you should be able to see, every 40 ms, thepattern of events depicted in the below screenshot. The example project incorporates three application tasks, in addition to a number of kernel, or system, tasks. One of the application’s tasks, labeled Post Task, peridocially performs a post operation on a semaphore, and that is what is shown in the screenshot. In the next couple of steps, you’ll adjust the period of the Post Task and then make an additional SystemViewrecording to confirm the results.8.The period of the Post Task is established by a variable in the same file that youmanipulated in Step 11 of the previous lab, ex_main.c. The variable is named Ex_MainDelayPostms and you have two different options for changing its value.One is to simply replace the variable’s initialization on line 371 of ex_main.c with thebelow code. You’l l then need to rebuild the example project and again download its code to your board. The second option involves µC/Probe. In addition to allowing you to read variables, µC/Probe offers a number of Writable Controls for changing variable values. You can drag and drop one of these controls—a Horizontal Slider, for example—into your workspace from Lab 2, and use the new control to adjust the value of ExMainDelayPostms.Ex_MainDelayPostms = 20;9.With the value of the variable adjusted, you should return to SystemView and make anew recording. Now the post operation described in Step 6 should be visible every 20 ms, as opposed to 40 ms. If time permits, you can make further adjustments to the code, changing, for example, the priority of the Post Task (established by the #define EX_MAIN_POST_TASK_PRIO), and you can use SystemView to observe the results of the changes.Limiting OverflowsThere are a few steps that you can take to limit overflows and maximize the amount of data recorded by SystemView. One of these is to increase the size of the buffer used to temporarily store SystemView data on your target before it is passed to the PC application. The buffer size is established by the #define SEGGER_SYSVIEW_RTT_BUFFER_SIZE in the file SEGGER_SYSVIEW_Conf.h. This file is contained in Micrium/Tools/SystemView/Config within the example project. The provided copy of SEGGER_SYSVIEW_Conf.h uses a buffer size of 4096, but you’re free to increase to any size that the hardware can accomodate.An additional measure, recommended by SEGGER for reducing the number of overflows, is to ensure that SystemView is the only tool using your J-Link. In other words, if you were previously running µC/Probe or the Simplicity Studio debugger while recording data, you should stop the other tools and try a new recording. With exclusive access to the J-Link, SystemView should have fewer impediments to capturing all of the example project’s events.。

All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corporation without notice. Please review the latest information published by Renesas Electronics Corporation through various means, including the Renesas Electronics Corporation website ().T arget Board for RX65N User’s ManualRENESAS 32-Bit MCU RX Family / RX600 SeriesRX65N GroupPrecautionsThe following precautions should be observed when operating any Target Board for RX65N product:The Target Board for RX65N is only intended for use in a laboratory environment under ambient temperature and humidity conditions. A safe separation distance should be used between this product and any sensitive equipment. Its use outside the laboratory, classroom, and study area or in area not conform to the protection requirements of the Electromagnetic Compatibility Directive could lead to prosecution.This product generates, uses, and can radiate radio frequency energy and may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If any harmful interference to radio or television reception occurs by turning the equipment off or on, you are encouraged to correct the interference by one or more of the following measures;•Ensure attached cables do not lie across the equipment•Reorient the receiving antenna•Increase the distance between the equipment and the receiver•Connect the equipment into an outlet on a circuit different from that which the receiver is connected•Power down the equipment when not in use•Contact the dealer or an experienced radio/TV technician for helpNOTE: It is recommended that wherever possible shielded interface cables are used.This product is potentially susceptible to certain EMC phenomena. It is recommended to take following measures in order to migrate them;•Do not use mobile phones within 10m of the product when in use.•Take ESD precautions when handling the equipment.The Target Board for RX65N neither represents an ideal reference design for an end product nor fulfils the regulatory standards for an end product.How to Use This Manual1. Purpose and Target ReadersThis manual is designed to provide the user with an understanding of the Target Board for RX65N hardware functionality, and electrical characteristics, and not intend to be a guide to embedded programming or hardware design.Particular attention should be paid to the precautionary notes when using the manual. These notes are attached at the end of each section and in the Usage Notes section, not within the body of the text.The revision history only shows the summary of revised or added parts, and does not include all revisions. Refer to the text in this manual for details.The following documents apply to the RX65N Group, RX651 Group. Make sure to use the latest versions for reference, available on the Renesas Electronics Web site.Document TypeDescriptionDocument TitleDocument No. QuickStart Guide Provides instruction on how to get started with the Renesas RX65N Cloud Kit.Quick Start Guide Renesas RX65NCloud KitR12QS0036EJ User’s Manual Provides technical details of the Cloud Option Board Hardware.Cloud Option Board User’s ManualR12AN0098EG User’s Manual Provides the technical details of the Target Board for RX65N hardware Target Board for RX65N User’s ManualR20UT4167EJ User’s Manual Provides the technical details of the RX65N group of microcontrollers. RX65N Group, RX651 Group User’s Manual: HardwareR01UH0590EJ Schematics Describes circuit schematics of the Cloud Option Board in full detail.Cloud Option Board SchematicsR01AN4353EG Schematics Describes circuit schematics of the Target Board for RX65N in full detail. Target Board for RX65N SchematicsR20UT4164EJ SchematicsDescribes circuit schematics of the Silex Pmod Module in full detail.Silex Pmod Module SchematicsR12UT0008EG2. List of Abbreviations and AcronymsAbbreviation Full Form CPU Central Processing UnitDIP Dual In-line PackageDNF Do Not FitIDE Integrated Development EnvironmentIRQ Interrupt RequestHOCO High-Speed On-Chip OscillatorLOCO Low-Speed On-Chip OscillatorLED Light Emitting DiodeMCU Micro-controller Unitn/a (NA) Not Applicablen/c (NC) Not ConnectedPC Personal ComputerPmod™ Digilent Pmod™ Compatible connector. Pmod™ is registered to Digilent Inc. Digilent-Pmod_Interface_SpecificationRAM Random Access MemoryRFP Renesas Flash ProgrammerROM Read Only MemorySPI Serial Peripheral InterfaceUSB Universal Serial BusAll trademarks and registered trademarks are the property of their respective owners.Table of Contents1. Overview (7)1.1Contents (7)1.2Purpose (7)1.3Features (7)1.4Preparation (7)1.5Board Specification Table (8)2. Board Layout (9)3. Parts Layout (10)4. Operating Environment (11)5. User Circuit (12)5.1Evaluation MCU (12)5.2USB Connector (12)5.3ACT LED (12)5.4Power LED (12)5.5User LED (12)5.6Pmod™ Connector (13)5.7External Power Supply Header (14)5.8Current Consumption Measurement Header (15)5.9MCU Header (15)5.10RESET Switch (15)5.11User Switch (15)5.12Cut Pattern (15)5.13Standalone/Debug Pin Header (16)6. Configuration (17)6.1Modifying the Target Board for RX65N (17)6.2Analog Power Supply (17)6.3On-chip Oscillator (17)7. Handling Precautions (18)7.1Board Thickness (18)7.2Additional Load (18)7.3Substrate Remodelling (18)7.4Communication with RFP (18)8. Code Development (19)9. Additional Information (20)RX65N GroupTarget Board for RX65N1. Overview1.1ContentsThank you for purchasing the Renesas evaluation tool " Renesas RX65N Cloud Kit ". The kti consists of the following three items. - Target Board for RX65N - Cloud Option Board - Silex Pmod Module1.2 PurposeThe Target Board for RX65N is an CPU bord for the Renesas RX65N Cloud Kit. This manual describes the technical details of the Target Board for RX65N hardware.1.3 FeaturesThe Target Board for RX65N includes the following features: Renesas microcontroller programming User code debugging Switch, LED user circuit1.4 PreparationInstall the integrated development environment (IDE) from the following URL on the host PC (before you get started). All the other required drivers are will be automatically installed with the IDE.R12UM0038EJ0100Rev.1.00 Jul 10, 2019Target Board for RX65N 1. Overview 1.5 Board Specification TableTable 1-1 shows the Target Board for RX65N specifications.Table 1-1: Board Specification TableItem SpecificationEvaluation MCU Part No: R5F565NEDDFPPackage: 100-pin LFQFPOn-chip memory: ROM 2MB+32KB, RAM 640KBBoard Size Size: 53.34mm x 90.0mm Thickness: 0.8mmPower Supply USB connector: 5V InputPower supply IC: 5V Input, 3.3V InputFor external power supply header *1: 3.3V Input, 2-pin, x 1Current Consumption Max. 200mA Current ConsumptionMeasurement Header*1Header: 2-pin, x 1Main Clock *1Surface mount type: HC-49Lead type: 2.54mm Pitch Through Hole x 3Sub Clock *1Lead type: Through Hole x 2 (KYUSHU DENTSU CO., LTD.: NC-26 Equivalent)Push Switch Reset switch x 1 User switch x 1LED Power indicator: green x 1 User: green x 2ACT LED: green x 1USB Connector Connector: USB-mini B, 5-pin Pmod™ Connector *1Connector: Angle type, 12-pin MCU Header Header: 50-pin, x 2Cut Pattern 8 placesStandalone/Debug Pin Header Header: 2-pin, x 1*1: Parts are not mounted (DNF).Figure 2-1 shows the external appearance of the top side of Target Board for RX65N and Figure 2-2 shows the external view of the bottom side.MCU HeaderReset SwitchUser Switch Pmod TM ConnectorMCU HeaderEvaluation MCU ACT LEDConnector HeaderIndicator LEDCurrent Consumption MeasurementHeader Cut Pattern User LED Pin HeaderFigure 2-2: Board Layout (Bottom Side)Figure 3-1 shows the parts layout of Target Board for RX65N.Target Board for RX65N 4. Operating Environment4. Operating EnvironmentFigure4-1 shows the operating environment of the Target Board for RX65N. Install the integrated development environment (IDE) from the following URL on the host PC. All the other required drivers are will be automatically installed with the IDE.Figure 4-1: Operating EnvironmentHost PCTarget Board for RX65NUSB Cable5. User Circuit5.1 Evaluation MCUThe MCU specification for the power supply, system clock, and reset at the time of shipment are as follows; Power supply: 3.3 V fixed (including analog power supply)System clock: Operated with on-chip oscillatorReset: Reset switch, IDE reset instruction5.2 USB ConnectorThe connector shape is USB mini -B for debug interface. Connect to the computer via the USB cable. If the power supply on the host side is ON, the Target Board for RX65N will be automatically power-supplied with the cable connection.Note: USB cable is not included in the package.5.3 ACT LEDThe ACT LED displays the operation status of the emulator control software. The lighting conditions are shown below. The lighting color is green.Light On: Indicates that the emulator is connected to the target.Flickering: Indicates that the host machine (PC) has recognized the emulator.Light Off: Indicates that the emulator cannot be used for some reason. (Including power off)5.4 Power LEDThe power LED lights on, when the board is power- supplied. The lighting color is green.5.5 User LEDT he user LED is an optional LED to be used if necessary the board is mounted with LED 0 and LED 1, connected to the following ports respectively. The lighting color is green.LED0: 80pin, Port PD6LED1: 79pin, Port PD75.6 Pmod™ ConnectorThe Pmod ™ connector (PMOD1) has a through hole at a pitch of 2.54 mm and is connected to the evaluation MCU according to Pmod™ Interface Type 2 A. Note that the Pmod ™ connector has the pin assignment different from other headers. Figure 5-1 shows the pin assignment of the Pmod ™ connector and Table 5-1 shows the signal assign of the Pmod ™ connector. The channel for RSP is assigned to 0, and the channel for interrupts is assigned to IRQ5 respectively. (Connector parts are not mounted)Figure 5-1: Pmod™ Connector Pin Assignment (Top View)Table 5-1: Pmod™ Connector Signal AssignmentPmod™ ConnectorPin Circuit Net Name Evaluation MCUPin Circuit Net NameEvaluation MCU Port Pin Port Pin1 PMOD1-CS PA4 66 7 PMOD1-IRQ P15 312 PMOD1-MOSI PA6 64 8 PMOD1-RST P17 293 PMOD1-MISO PA7 63 9 PMOD1-IO0 PC3 494 PMOD1-SCK PA5 65 10 PMOD1-IO1 PC2 505 GROUND - - 11 GROUND - -6 TARGET_VCC - - 12 TARGET_VCC - -5.7 External Power Supply HeaderWhen operating the evaluation MCU at an arbitrary voltage, or requiring current more than the USB current capacity, use the external power supply header (J4) for power supply. The available voltage depends on theevaluation MCU. When using this header, cut SS1, SS2, SS4, SS5, SS7, SS8 and the bottom side cut pattern and separate the emulator and the target electrically. Figure 5-2 and Figure 5-4 show the position of the cut pattern, Figure 5-3 shows the position of the external power supply header. (header parts are not mounted)Figure 5-2: Position of Pattern SS1, SS2, SS4, SS5, SS7, SS8Figure 5-3: Position of External Power SupplyFigure 5-4: Position of Bottom Side Cut Pattern.5.8Current Consumption Measurement HeaderThe current consumption measurement header (JP2) is used for measuring current consumption of the evaluation MCU. The current consumption can be measured by connecting an ammeter to the evaluation MCU. Note that the cut pattern (SS6) should be cut when using this header. Figure 5-5 shows the position of the header and cut pattern. (header parts are not mounted)Figure 5-5: Position of Current Consumption Measurement Header and SS6 Cut Pattern5.9 MCU HeaderThe MCU header is installed with two 50-pin headers (J1, J2). The headers are allocated with interval of 2.54 mm pitch. The evaluation MCU and the header are connected according to each pin number as 1pin to 1pin, and 2pin to 2pin in order until 100pin. (except 5, 8, 9 pins)5.10 RESET SwitchPress the RESET switch to turn on the hard reset for the evaluation MCU.5.11 User SwitchThe user switch (SW 1) is an optional switch to be used if necessary. It is connected to 59pin and PB 1 port of the evaluation MCU. The interrupt is assigned to IRQ 4.5.12 Cut PatternAll cut patterns are set to the connected state at the time of factory shipment. Cut or repair soldering if necessary. Figure 5-6 show the example of the cut patternsFigure 5-6: Cut Pattern Treatment ExampleWhen repairing the cut pattern on the bottom side, repair soldering for SS7 and SS8 shown in Figure 5-2.5.13 Standalone/Debug Pin HeaderThe emulator enters the forced reset state by short-circuiting the standalone/debug pin header (EJ2). Theevaluation MCU can be operated independently without controlling the IDE.Figure 5-7shows the standalone/debug pin header position.Figure 5-7: Position of Standalone/Debug Pin Header6. Configuration6.1 Modifying the Target Board for RX65NThis section describes how to change the Target Board for RX65N setting by using option link resistance.A option link resistor is a 0Ω surface mount resistor, which is used to short or isolate a part of circuits. See the6.2 below for the list of option links by function. Fit or remove the option link resistor to switch functions by referring to the list. Bold fonts in blue indicates the default configuration at the shipment. For the position of option links, see the chapter 3 “Part Layout”.When removing soldered components, do not press a soldering iron on the Target Board for RX65N for more than 5 seconds to avoid any damage around the target area.6.2 Analog Power SupplyThe option links for analogue power supply are shown in Table 6-1, Table 6-2, Table 6-3.Table 6-1: 12bit A/D(Unit0) Analog Power Supply Option Link12bit A/D(Unit0)Fit DNF RemarksAnalog power supplysource3.3V on the board R3, R6 R1, R9 -MCU Header R1, R9 R3, R6 -Table 6-2: 12bit A/D(Unit0) Reference Voltage Option LinkFit DNF Remarks12bit A/D(Unit0)Reference voltagesupply source3.3V on the board R4, R7 R2, R8 -MCU Header R2, R8 R4, R7 The bypass capacitors of C6, C7, C8 are invalid.Table 6-3: 12bit A/D (Unit1), 12bit D/A Analog Power Supply Option LinkFit DNF Remarks12bit A/D(Unit1),12bit D/A Analogpower supply source3.3V on the board R11, R12 R10, R13 -MCU Header R10, R13 R11, R12 The bypass capacitors of C12, C13, C14 are invalid.6.3 On-chip OscillatorThe option links for on-chip oscillator operation are shown in Table 6-4, Table 6-5.Table 6-4: HOCO Option LinkHOCO setting Fit DNF RemarksOscillation R19, R23 R20, R22 -Stop R20, R22 R19, R23 Mount a crystal resonator on X1 or X2 and loadcapacitance on C16, C17.Table 6-5: LOCO Option LinkLOCO setting Fit DNF RemarksOscillation R25 - -Stop - R25 Mount a crystal resonator on X3 and loadcapacitance on C18, C19.7. Handling Precautions7.1 Board ThicknessPlease be extra careful when handling the “Target Board for RX65N “ as the board is thin (0.8 mm).7.2 Additional LoadWhen adding loads by USB power supply, the maximum operational current is 300 mA at 3.3 V operation. When adding loads by external power supply, the maximum operational current is 500 mA under any operating voltage.7.3 Substrate RemodellingAny modification of the board (including changing the cut pattern) shall be conducted on a user’s own responsibility.7.4 Communication with RFPThe Target Board for RX65N does not support communication with RFP. Use the IDE to write and read programs.Target Board for RX65N 8. Code Development 8. Code DevelopmentFigure 8-1 shows the setting of e2 studio when creating a new project for the Target Board for RX65N.Debug hardware: Select [E2 Lite (RX)].Connection type: Select [Fine]. (JTAG connection is not available)Power supply from the emulator: Select [No].Figure 8-1: e2 studio settings(Note) Do not connect other emulators to your PC while connecting the Target Board for RX65N.Target Board for RX65N 9. Additional Information 9. Additional InformationTechnical SupportFor details on the RX65N Group, RX651 Group microcontrollers, refer to the RX65N Group, RX651Group Hardware Manual.For details on the RX assembly language, refer to the RX Family Software Manual.The latest information is available from the WEB site.Technical Contact DetailsAmerica: *******************************Europe: https:///en-eu/support/contact.htmlGlobal & Japan: https:///support/contact.htmlGeneral information on Renesas microcontrollers can be found on the Renesas website at:https:///TrademarksAll brand or product names used in this manual are trademarks or registered trademarks of their respective companies or organisations.CopyrightThis document may be, wholly or partially, subject to change without notice. All rights reserved. Duplication of this document, either in whole or part is prohibited without the written permission of Renesas Electronics Europe Limited.© 2019 Renesas Electronics Corporation. All rights reserved.REVISION HISTORY Target Board for RX65N User’s ManualRev. DateDescription Page Summary1.00 Jul 10, 2019 - First Edition issuedTarget Board for RX65N User’s ManualPublication Date: Rev. 1.00 Jul 10, 2019 Published by: Renesas Electronics CorporationRX65N GroupR12UM0038EJ0100。

双路高密度服务器准系统Rev1.0本手册为双路高密度服务器准系统SY204-D24R-G2用户操作手册，主要对本产品的特性参数、系统构成、安装方式进行介绍及说明，Gooxi®的此款高密度服务器支持4个双路服务器节点，该系统基于2U四节点24盘位机箱及G2DCN-B主板的整合。

本手册是供专业系统集成商和个人电脑技术人员参考研究，本产品应仅由经验丰富的技术人员进行安装和维护。

手册构架第一章产品介绍本章节提供了系统主要部件的规格并对G2DCN-B主板及2U四节点24盘位机箱的主要特性进行描述。

第二章系统接口介绍本章节提供了系统接口的细节说明，主要包括主板的IO接口和各个连接器、端子及跳线功能和信息。

第三章详细的节点拆装本章提供了G2DCN-B主板上的处理器、内存、扩展卡安装及说明，安装或拆除处理器、内存、扩展卡和散热器的注意事项，可参考本章节内容。

第四章准系统安装及维护本章提供了本高密度服务器上的各节点的安装及维护说明。

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138B a r t l e t t S t r e e t,M a r l b o r o,M A01752U S AT L:508.357.2221F X:508.229.0747w w w.e v e r g r e e n s o l a r.c o mE V E R G R E E N S O L A RC ED A R L I N E™P H O T O V O L T A I C M O D U LE S I N S T A L L A T I O N A N D O P E R A T I O N M A N U A LW A R N I N GE L E C T R I C A L H A Z A R DPlease read this manual completely before installing or using an Evergreen Solar Cedar photovoltaic (PV, solar electric) module. This photovoltaic module produces electricity when exposed to light. Follow all applicable electrical safety precautions. Only qualified personnel should install or perform maintenance work on this module. Do not damage or scratch the rear surface of the module. Do not handle modules when they are wet.S a f e t y P r e c a u t i o n sPhotovoltaic modules produce DC electricity when exposed to light and therefore can produce an electrical shock or burn. Modules produce voltage even when not connected to an electrical circuit or load. Modules produce nearly full voltage when exposed to as little as 5% of full sunlight, and both current and power increase with light intensity. Use insulated tools and rubber gloves when working with modules in sunlight.PV modules have no on/off switch. Modules can be rendered inoperative only by removing them from sunlight, or by fully covering their front surface with cloth, cardboard, or other completely opaque material, or by working with modules face down on a smooth, flat surface.Modules can produce higher output than the rated specifications. Industry standard ratings are made at conditions of 1000 watts/m2 and 25°C cell temperature. Reflection from snow or water can increase sunlight and therefore boost current and power. In addition, colder temperatures can substantially increase voltage and power. Evergreen Solar modules are constructed with tempered glass, but still must be handled with care. If the front glass is broken or if the polymer backskin is torn, contact with any module surface or the frame can produce electrical shock, particularly when the module is wet. Broken or damaged modules must be disposed of properly.Cedar PV modules are intended for use in terrestrial applications only, thus excluding aerospace or maritime conditions or use with sunlight concentration. Excluded applications include, but are not limited to, installations where modules are likely to come in contact with any salt water or where likely to become partially or wholly submerged in fresh or salt water, examples of which include use on boats, docks and buoys.C o d e s a n d R e g u l a t i o n sThe mechanical and electrical installation of PV systems should be performed in accordance with all applicable codes, including electrical codes, building codes, and electric utility interconnect requirements. Such requirements may vary for mounting location, such as building rooftop or motor vehicle applications. Requirements may also vary with system voltage, and for DC or AC application. Contact local authorities for governing regulations. In the U.S., all installations should conform to the National Electrical Code (NEC), including Article 690 on Solar Photovoltaic Systems and all other appropriate articles and sections.M e c h a n i c a l I n s t a l l a t i o nModules may be mounted at any angle from a vertical orientation to a horizontal one. The appropriate fixedtilt angle and azimuth orientation should be used inorder to maximize the exposure to sunlight. They may be mounted in either orientation, in “landscape” or “portrait.” Modules should be bolted to support structures through mounting holes located in the frame’s back flanges only. Four 1/4-inch stainless steel bolts, with nuts, washers, and lock washers, are recommended for module mounting. Creation of additional holes for mounting is not recommended and will invalidate the warranty. Modules should not be mounted by supports at the ends.The modules are designed for a maximum allowable design pressure of 50 pounds per square foot, which may correspond to a nominal wind speed of approximately 125 mph in certain circumstances. Actual maximum allowable wind speed may be influenced by module type, mounting configuration, location, and other factors. In no case should modules be exposed to pressures greater than 50 pounds per square foot of uniformly distributed wind, snow, or other loading. Care should be taken to avoid mounting modules in areas that are prone to drifting snow, icicle and/or ice dam formation. For example, a module mounted with its edge located directly above an overhanging roof eve is likely to be subjected to ice dam formation. The weight of an ice dam or icicle can easily exceed the allowable 50 pounds per square foot of uniformly distributed load.A clearance of four inches or more behind the modules is recommended to permit air circulation and cooler module operation. Elevated temperatures lower operating voltage and power and shorten module lifetime. Clearance of 1/4 inch or more between modules is required to allow for thermal expansion of the frames.E l e c t r i c a l I n s t a l l a t i o nModules should be mounted to maximize direct exposure to sunlight and to eliminate or minimize shadowing. Even partial shadowing can substantially reduce module and system output. Furthermore, partial shadowing can elevate the shaded portion’s internal temperature, which may lower output and shorten module life. Bypass diodes are factory installed. Blocking diodes should be installed in series with each module or series string to prevent possible back flow of energy through the module(s) when modules or strings are connected in parallel or used in conjunction with a battery. Whenever necessary to comply with local codes, use a listed fuse or circuit breaker, rated for the maximum series fuse rating of the module and the system voltage.All electrical components should have ratings equal or greater to the system rating. Do not exceed the maximum allowable system voltage as listed on the module label.All module frames should be grounded for safety. The module frame is provided with grounding holes that accommodate self-tapping screws. A #10 stainless steel tapping screw is recommended.Under normal conditions, a photovoltaic module may experience conditions that produce more currentand/or voltage than reported at Standard Test Conditions. Accordingly, the values of short circuit current, Isc, and open circuit voltage, Voc, marked on UL-listed modules should be multiplied by a factor of 1.25 when determining component voltage ratings, conductor capacities, fuse sizes, and size of controls connected to the module output. In the U.S., refer to Section 690-8 of the National Electric Code for an additional multiplying factor of 1.25, which may be applicable.Rated electrical characteristics are within 10 percent of measured values at Standard Test Conditions of: 1000 W/m2 , 25°C cell temperature and solar spectral irradiance per ASTM E 892.Cedar Line modules are equipped with factory-installed wires and quick connectors. These modules have been designed to be easily interconnected in series. Each module has two single-conductor wires, one positive and one negative, that are pre-wired inside the junction box. The connectors at the opposite end of these wires allow easy series connection of adjacent modules by firmly inserting the male connector of a module into the female connector of an adjacent module until the connector is fully seated.A separate return wire or wires may be required to run the positive and negative terminations of the series string of modules to the load. Male and/or female connectors pre-attached to wires may be used at the string terminations for return wire connections and/or for source circuit box terminations.Cedar Line modules also have a bypass diode installed (see next table for details).O p e r a t i o n a n d M a i n t e n a n c e No routine maintenance is required. However it is advisable to perform periodic inspection of the modules for damage to glass, backskin, or frame.Check electrical connections for loose connections and corrosion.PV modules can operate effectively without ever being washed, although removal of dirt from the front glass can increase output. The glass can be washed with a wet sponge or cloth. Wear rubber gloves for electrical insulation.Temperature EffectsI-V Characteristics*Pp – 0.49%/°C Vp – 0.53%/°C Ip + 0.049%/°C Voc – 0.41%/°C Isc + 0.088%/°CNOCT 44°CE l e c t r i c a l R a t i n g s *EC-94-GEC-102-G EC-110-G EC-115-G EC-120-GPp 94 102 110 115 120Vp 16.7 16.7 17.0 17.1 17.6 Ip 5.63 6.11 6.47 6.73 6.82Voc 21.3 21.3 21.3 21.3 21.5 Isc 6.86 7.32 7.48 7.62 7.68Cells 72 72 72 72 72Bypass Diode Type AR2510, 1000V, 25 AMaximum Series Fuse 15A UL Rated System Voltage 600V TUV Rated System Voltage800V*At STC (Standard Test Conditions): 1000 W/m 2, 25° C cell temperature, AM 1.5 spectrum. Minimum Specified Power Rating is 90% of above power rating. All modules are factory-inspected to produce at least 98% of above power rating; other specifications are +/-10%. Specifications subject to change without notice. 25 year limited power warranty. Complete warranty available on request.Note: This document may be provided in multiple languages.If there is a conflict among versions, the English language version dominates.0.01.02.03.04.05.06.07.08.00510152025Voltage (V)C u r r e n t (A )EC-94EC-102EC-120EC-115EC-110EC-94/102/110/115/120-G Weight: 28 lb (12.7Kg)Dimensions: Inches (mm)。