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SIP16中文资料

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2.9 3.4 5.3 7.8 8.6 9.8 11.0 11.5 12.2 14.6 17.3 23.2
1.2 1.4 1.9 2.3 2.7 3.3 3.9 4.5 4.7 5.1 5.4 5.8
SIP16 Style 16-Tap Schematic
1 COM
2 IN
3 Tap 1
4 Tap 2
Tap-to-Tap (ns)
SIP16-85 SIP16-87 8 ± 0.5 0.5 ± 0.2 2.1 0.8 SIP16-127 12 ± 1.0 0.75 ± 0.3 SIP16-125 2.5 1.0 SIP16-167 16 ± 1.0 1.0 ± 0.4 SIP16-165 3.7 1.0 SIP16-207 20 ± 1.0 1.25 ± 0.5 SIP16-205 3.9 1.2 SIP16-247 24 ± 1.2 1.5 ± 0.5 SIP16-245 4.4 1.3 SIP16-327 32 ± 1.6 2.0 ± 0.5 SIP16-325 4.9 1.4 SIP16-407 40 ± 2.0 2.5 ± 0.5 SIP16-405 5.8 1.5 SIP16-487 48 ± 2.0 3.0 ± 0.5 SIP16-485 7.1 1.6 SIP16-567 56 ± 2.8 3.5 ± 1.0 SIP16-565 8.2 1.7 SIP16-647 64 ± 3.2 4.0 ± 1.0 SIP16-645 9.4 1.8 SIP16-807 80 ± 4.0 5.0 ± 1.0 SIP16-805 11.6 2.8 128 ± 6.4 8.0 ± 2.0 SIP16-1285 18.2 3.0 SIP16-1287 1. Rise Times are measured from 10% to 90% points. 2. Delay Times measured at 50% points of leading edge. 3. Output (100% Tap) terminated to ground through RL=ZO
2.2 2.7 3.8 3.9 4.4 4.9 5.9 7.1 8.2 9.4 11.8 18.5
1.0 1.1 1.2 1.4 1.6 1.8 2.1 2.7 2.9 3.0 3.2 3.4
SIP16-82 SIP16-122 SIP16-162 SIP16-202 SIP16-242 SIP16-322 SIP16-402 SIP16-482 SIP16-562 SIP16-642 SIP16-802 SIP16-1282
元器件交易网
19-Pin SIP 16-Tap High Performance Passive Delay Modules
Fast Rise Time, Low DCR High Bandwidth 0.35 / t r Low Distortion LC Network 16 or 20 Equal Delay Taps Standard Impedances: 50 - 75 - 100 - 200 Ω Stable Delay vs. Temperature: 100 ppm/OC Operating Temperature Range -55OC to +125OC
.315 (8.00) MAX. .012 (0.30) TYP.
.010 (0.25) TYP. .200 (5.08) TYP.
.100 (2.54) MIN. .020 (0.51) TYP. .100 (2.54) TYP.
Specifications subject to change without notice.
at 25OC
50 Ohm Part Number Rise Time (ns) DCR max. (Ohms) 75 Ohm Part Number Rise Time (ns) DCR max. (Ohms) 100 Ohm Part Number Rise Time (ns) DCR max. (Ohms) 200 Ohm Part Number Rise Time (ns) DCR max. (Ohms)
2.2 2.5 3.7 3.9 4.4 4.9 5.9 7.1 8.2 9.4 11.8 18.5
0.8 1.1 1.1 1.3 1.5 1.6 1.9 2.1 2.3 2.5 2.8 3.0
SIP16-81 SIP16-121 SIP16-161 SIP16-201 SIP16-241 SIP16-321 SIP16-401 SIP16-481 SIP16-561 SIP16-641 SIP16-801 SIP16-1281
For other values & Custom Designs, contact factory. 14
SIP16 1/98
Rhombus Industries Inc.
15801 Chemical Lane, Huntington Beach, CA 92649-1595 Tel: (714) 898-0960 • Fax: (714) 896-0971
Electrical Specifications
Total (ns)
1, 2, 3
OPERATING SPECIFICATIONS - Passive Delays
Pulse Overshoot (Pos) ................................... 5% to 10%, typical Pulse Distortion (S) ...................................................... 3% typical Working Voltage .............................................. 25 VDC maximum Dielectric Strength ........................................... 100VDC minimum Insulation Resistance .............. 1,000 Megohms min. @ 100VDC Temperature Coefficient ............................... 100 ppm/OC, typical Band Width (fC) ....................................................... .35/tr approx. Operating Temperature Range ............................ -55O to +125OC Storage Temperature Range ............................... -65O to +
7
8
9
10
11 Tap 9
12 Tap 10
13 Tap 11
14 Tap 12
15
16
17 Tap 15
18
19
Tap Tap 5 6
Tap Tap 7 8
Tap Tap 13 14
Tap COM 16
Dimensions in Inches (mm)
.260 (6.60) MAX. 2.00 (50.8) MAX.

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SMT行业常用名词缩写中英文对照

SMT行业常用名词缩写中英文对照

SMT行业常用名词缩写中英文对照AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :centipoises(黏度單位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of thermal expansion 熱膨脹系數DIP :dual in-line package 雙內線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MQFP :metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA:plastic ball grid array 塑膠球形矩陣PCB:printed circuit board 印刷電路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質)ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點) psi :pounds/inch2 磅/英吋2PWB :printed wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT :surface mount technology 表面黏著技術SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封裝SOT :small outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹(因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA (Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。

工厂专有名词中英文对照表

工厂专有名词中英文对照表


Contract Electronic Manufacturing Customer Focus Executive Cost,Insurance,and Freight Carriage and Insurance Paid TO Common Management Information Protocol Cost of Goods Sold Component Purchase Agreement Carriage Paid to Change Request Customer Service Division Customer Selling Price Configure To Order Full Descripition Delivered At Frontier Document Center Delivered Duty Paid Delivered Duty Unpaid Design For Assembly Design For Manufacture Dead on Arrival Defect Per Hunderd Unit Defect Per Percent Million Dynamic Random Access Memory Design For Test Design For X(test,manufacture,assembly) Dual in-line Package Domain Name System Defect per Million Desktop Design TO Cost Design Verification Test Full Descripition End to End Engineering Change Engineering Change Management Engineering Change Notice Engineering Change Order Engineering Change Request Engineering Directive Enhanced Industrial Standard Architecture Early Life Performance Test Environment Protection Association Erasable Programable Read Only Memory Engineering Specification
汇维仕产品-中文学习资料

汇维仕产品-中文学习资料

INTRODUCTION OF HUVIS
Global Creative Fibertech Leader
2008. 11. 12
1
7. SPECIALTIES
◈ 短纤的品总和用途
民用 纺纱
纱线, 缝纫线 与羊毛混纺的纱线
普通品种的规格在2DE的以上 差别化纤维 : 阻燃纤维, 原液着色纤维, 扁平纤维, 超细纤维
12-1. Product Item
Type 聚合物 纤维根数 (分裂后) 纤度(分裂后) Recommend Felt process 分裂方式 尼龙 70% 8 0.2 STF N 改性聚酯30% 1 0.7 聚酯 70% 8 0.22 Needle punching (Spunlace) 化学分裂 STF P 改性聚酯 30% 溶出 溶出
PET
mono 0.2 De’ REMARK PET / PET PET / PET
NYLON
Item SIP
Luster SD SD
51 51
PROPERTIES 37 Island 16 Island 37 Island
日晒牢度
色牢度 抗污性能 手感 撕裂强度 染色性能 物理状态稳定性
○
○ ○ ○ △ △ ○
4.2
2.90 53 5.0 Not Good Not Good Not stable over 65℃
4.2
3.7 43 1.0 ↓ Good Good
6.0
2.6 73
Stable under 145℃
8
Application of LM in Automotive
用途
衣帽架 汽车顶篷 车身 踏脚
◎
◎ ○ △ △ △ ○
Yealink SIP-T20(P)中文说明书-V50.0

Yealink SIP-T20(P)中文说明书-V50.0

关于该使用手册
感谢您选择我们的产品。这款入门级 IP 电话是针对办公环境下用户设计的，外形时尚圆润，有着丰 富的电话功能，广泛的互操作性和流行的第三方 VoIP 功能。它从企业和 ITSP 的需求出发，来满 足 VoIP 的发展需求。 通过该使用手册，用户可以找到所需要的一切资料，可以马上了解使用该 IP 电话。请务必与您的系 统管理员联系确认您的网络是否允许配置 IP 电话。同时，请务必先阅读本指南中的包装清单和注意 事项，然后再配置使用该话机。
联系人管理.............................................................................................................................. - 15 编辑/添加/删除联系人.................................................................................................... - 15 导入/导出联系人列表..................................................................................................ห้องสมุดไป่ตู้.. - 15 -
话机配置 .......................................................................................... - 11 -
常规配置...................................................................................................................................- 11 话机状态...........................................................................................................................- 11 语言...................................................................................................................................- 11 时间和日期...................................................................................................................... - 12 键盘锁.............................................................................................................................. - 12 -