02-a review of reflectance nomenclature used in remote sensing

Lesson 6N omenclature of Inorganic Chemistry（无机命名法则）The IUPAC nomenclature of inorganic chemistry is a systematic method of naming inorganic chemical compounds, as recommended by the International Union of Pure and Applied Chemistry (IUPAC). Ideally, every inorganic compound should have a name from which an unambiguous formula can be determined.译文：无机化学国际纯粹与应用化学联合会命名法是国际纯粹与应用化学联合会（IUPAC）推荐的系统命名无机化合物。

理想上，每一个无机化合物都应该有一个从中可确定的名称的明确的法则。

The names "caffeine" and "3,7-dihydro-1,3,7-trimethyl-1H-purine-2,6-dione" both signify the same chemical. The systematic name encodes the structure and composition of the caffeine molecule in some detail, and provides an unambiguous reference to this compound, whereas the name "caffeine" just names it. These advantages make the systematic name far superior to the common name when absolute clarity and precision are required. However, for the sake of brevity, even professional chemists will use the non-systematic name almost all of the time, because caffeine is a well-known common chemical with a unique structure. Similarly, H2O is most often simply called water in English, though other chemical names do exist.译文：名称“咖啡因”和“3,7 -二氢- 1 ,3,7 -三甲基氢嘌呤- 2 ,6 -二酮”描述着同样的化学物质。

journal of luminescence引用格式-回复标题：Luminescence: A Comprehensive Review of Its Applications and Future Prospects引言：Luminescence, as a fascinating phenomenon, has attracted significant attention from researchers across various disciplines. Its research has contributed to significant developments in fields such as material science, chemistry, physics, and biology. In this article, we will delve into the various aspects of luminescence, including its definition, mechanisms, measurement techniques, and applications. Additionally, we will explore the future prospects and potential advancements in this field.一、Luminescence的定义和机制（300字）Luminescence is the emission of light from a material without high temperatures, such as incandescence or flames. It encompasses various processes, including fluorescence, phosphorescence, and chemiluminescence, which emit light due to the relaxation of excited electrons in different ways. These processes are driven by electron transitions between energy levels in atoms, molecules, or crystals.在这一部分，我们将详细介绍各种光致发光的机制，以及这些机制背后的物理原理。

LASER INTERFEROMETER GRAVITATIONAL WAVE OBSERVATORY LIGO Laboratory / LIGO Scientific CollaborationLIGO-E960050-v4 Advanced LIGO12 Nov 2009 see DCC record for approvalLIGO Vacuum Compatible Materials ListD. Coyne (ed.)Distribution of this document:LIGO Science CollaborationThis is an internal working noteof the LIGO Project.California Institute of Technology LIGO Project – MS 18-341200 E. California Blvd.Pasadena, CA 91125Phone (626) 395-2129Fax (626) 304-9834E-mail:*****************.edu Massachusetts Institute of Technology LIGO Project – NW17-161175 Albany StCambridge, MA 02139Phone (617) 253-4824Fax (617) 253-7014E-mail:*************.eduLIGO Hanford Observatory P.O. Box 1970Mail Stop S9-02Richland WA 99352Phone 509-372-8106Fax 509-372-8137LIGO Livingston ObservatoryP.O. Box 940Livingston, LA 70754Phone 225-686-3100Fax 225-686-7189/CHANGE RECORDRevisionDateAuthority DescriptionA30 Jul 1996Initial Release Initial ReleaseB/v1 5 Apr 2004DCNE030570-01 Added approved materials for initial LIGO, clarified the designation "presently used", or "provisional" materials, added independent approval for Initial LIGO and AdvancedLIGO approval.v2 9 Sep 2009See DCC record ∙ Removed distinction between initial and advanced LIGO for approval∙ Made an explicit notation in the materials list if the use of a material is restricted (or not)∙ Moved a number of materials from the provisionally approved to the approved list, although in some cases with restrictions (e.g. carbon steel, Sm-Co, Nd-Fe-B, Vac-Seal, copper, Tin-Lead solder, etc.) and removed the provisional list from the document∙ Added a number of materials to the approved list, although in some cases with restrictions (e.g. adhesives,aluminum bronze, etc.) ∙ Added a few materials to the explicitly excluded list, e.g.aluminum alloy 7000 series, brass (aka manganese bronze), free-machining grades of stainless steel (303, 303S, 303Se) except as small fasteners, etc. ∙ Added a number of references∙ Added a section on general restrictions on materials (e.g. no castings, material certifications are always required, only the grades and sources called out for the polymers are permitted, etc.)∙ Most outgassing rate values remain blank in the materials list (pending)v3 16 Sep 2009 See DCCrecord∙ Added SEI-ISI actuators to approved list∙ Clarified that no castings refers to metals only∙ Added exception for the use of grinding to prepare the leads for in-vacuum photodiodes ∙ Added numbers to the rows of the approved materials list for easier reference∙ Added the grade and source for PEEK and carbon-loaded PEEKV4 12 Nov 2009See DCC record ∙ Explicitly added the Ferritic Stainless Steels (400 series) to the approved materials list. Of high vapor pressureelements, these alloys have 0.06% P max and 0.15% S max, which is well under the 0.5% max allowed inLIGO-L080072-00 [Ref. b )7]TABLE OF CONTENTS1Introduction (4)2Scope (4)3Nomenclature and Acronyms (4)4Ultra-High Vacuum Material Concerns (5)5Vacuum Requirements (5)6Procedure for Qualifying New Materials (6)7VRB wiki Log (6)8General Restrictions (6)9Approved Materials (7)10Explicitly Rejected Materials (20)11References for the approved materials table (20)LIST OF TABLESTable 1: Approved Construction Materials (8)1 IntroductionAll items to be installed inside LIGO Observatory vacuum systems must be on the "approved materials" list (components and materials).2 ScopeThe materials listed herein are those which are intended for use in vacuum. Materials used for items which are temporarily inside a LIGO vacuum system, but do not reside in vacuum (e.g. alignment fixtures, installation tooling, etc.) are not restricted to this material list. These items (referred to as "Class B"1 as opposed to "Class A" items which remain in the vacuum system) must comply with LIGO cleanliness standards and must not leave residues of non-vacuum compatible materials (e.g. hydrocarbon lubricants).3 Nomenclature and AcronymsLIGOAdL AdvancedADP Ammonium Di-hydrogen Phosphate [(NH4)H2PO4]AES Auger Electron SpectroscopyAMU Atomic Mass UnitFTIR Fourier Transform Infrared SpectroscopyHC HydrocarbonsLIGOInL InitialKDP Potassium Di-hydrogen Phosphate [KH2PO4]LIGO Laser Interferometer Gravitational Wave ObservatoryOFHC Oxygen Free High-Conductivity CopperNEO Neodymium Iron BoronPFA Perfluoroalkoxy fluoropolymer (Du Pont)PTFE Polytetrafluorethylene (Du Pont)PZT Lead-Zirconate-TitanateRTV Room Temperature Vulconizing Silicone elastomerSIMS Stimulated Ion Mass SpectroscopyUHV Ultra High VacuumVRB LIGO Vacuum Review BoardXPS X-ray Photoelectric Spectroscopy1 Betsy Bland (ed.), LIGO Contamination Control Plan, LIGO-E09000474 Ultra-High Vacuum Material ConcernsThere are two principal concerns associated with outgassing of materials in the LIGO vacuum system:a)Outgassing increases the gas load (and column density) in the system and consequently mayeither compromise the interferometer phase noise budget or require higher pumping capacity. Reduction with time, whether 1/t (range of adsorption energies) or 1/sqrt(t) (diffusion followed by desorption) is important and the particular gas species (whether condensable or non-condensable) is critical. Even inherently compatible, low outgassing materials (e.g. 6061 aluminum alloy) will contribute to the gas load (especially if not properly cleaned and/or copious amounts are installed into the vacuum system). However, the most significant risk is likely to be from materials which have inherently high outgassing rates (e.g. water outgassing from flouroelastomers such as Viton® and Flourel®).The literature is most useful in providing total and water outgassing rates. Since in LIGO, there is a special problem of larger phase noise sensitivity to (and concern of optical contamination from) heavy hydrocarbons, where possible, the hydrocarbon outgassing or surface contamination information should be provided.b)Outgassing is a potential source of contamination on the optics with the result of increasedoptical losses (scatter and absorption) and ultimately failure due to heating. The amount of outgassing is less important than the molecular species that is outgassed. Little is known of the most important contamination sources or the mechanisms that lead to the optical loss(e.g., UV from second harmonic generation, double photon absorption photoeffect, simplemolecular decomposition in the optical fields leaving an absorbing residue, etc.).In the approved materials list, one column entry indicates whether the listed material has the potential for (is suspected of) being a significant contributor as regards a) or b) or both.5 Vacuum RequirementsAn allocation of high molecular weight hydrocarbon outgassing budget to assemblies within the AdL UHV is given in LIGO-T0400012. However, this document is in need of revision (a) to reflect the pumping capacity of the beam tube (which reduces the requirements considerably), and (b) to more accurately reflect the evolved AdL configuration.An allocation of total gas load for AdL has not been made as yet. With the elimination of the significant amount of Flourel® flouroelastomer in InL (spring seats, parts of the InL seismic isolation system), the water load will decrease dramatically. However, recent calculations3 of test mass damping due to residual gas suggest that this may not be sufficient. We will need to achieve a total pressure of 10-9 torr or less in proximity to each test mass. A total gas load budget/estimate will be created.The limits on optical loss due contamination are < 1 ppm/yr absorption and < 4 ppm/yr scatter loss2 D. Coyne, Vacuum Hydrocarbon Outgassing Requirements, LIGO-T0400013 N. Robertson, J. Hough, Gas Damping in Advanced LIGO Suspensions, LIGO-T0900416-v1for any test mass (TM), high reflectance (HR), surface4.6 Procedure for Qualifying New MaterialsA request to qualify a new material or component/assembly should be addressed to the LIGO Chief Engineer or the LIGO Vacuum Review Board with a justification regarding the need for the new material and an estimate of the amount of material required. Materials can only be added to the "approved" list after extensive testing in accordance with the document "LIGO Vacuum Compatibility, Cleaning Methods and Procedures"5.7 VRB wiki LogThis revision captures all relevant LIGO Vacuum Review Board (VRB) decisions as of the date of this release. For more recent direction not yet captured in a revision of this document, see the LIGO VRB wiki log (access restricted to LSC members).8 General Restrictions1)Material certifications are required in every case.2)Only the grades called out3)Only the grades and sources called out for the polymers (unless otherwise noted).4)All polymers are restricted (even if approved). The use of an approved polymer in a newapplication must be approved. Despite the fact that some polymer materials are approved for use, these materials should be avoided if possible and used sparingly, especially if used in proximity to LIGO optics.5)Special precautions must be taken for adhesives. Often the shelf life for adhesives islimited. All adhesives should be degassed as part of the preparation procedure. Extreme care must be taken when mixing multi-part adhesives, to insure that the proper ratio is used and accurately controlled.6)No metal castings, including no aluminum tooling plate.7)All surfaces are to be smooth (preferably ≤ 32 micro inches Ra). All metal surfaces areideally machined.8)All machining fluids must be fully synthetic (water soluble, not simply water miscible) andfree of sulfur, chlorine, and silicone.9)No bead or sand blasting is permitted.4 G. Billingsley et. al., Core Optics Components Design Requirements Document, section 4.2.2.6 of LIGO-T080026-00. The timescale for accumulation (i.e. the time span between in situ re-cleaning of the test mass optics) has been chosen here to be 1 year. It is possible that a somewhat shorter time span could be accommodated.5 D. Coyne (ed.), LIGO Vacuum Compatibility, Cleaning Methods and Qualification Procedures, LIGO-E96002210)No grinding is permitted (due to potential contamination from the grinding wheel matrix),except for (a) grinding maraging steel blades to thickness6 and (b) photodiode lead end preparation for pin sockets.11)Parts should be designed and fabricated to provide venting for enclosed volumes12)For design applications where dimensional control is extremely important or tolerances areexceedingly tight, it is the responsibility of the design engineer to (a) establish a basis for baking parts at temperatures lower than the default temperatures (defined in LIGO-E960022), and (b) get a waiver for a lower temperature bake from the LIGO Vacuum Review Board.13)All materials must be cleaned with appropriate chemicals and procedures (defined in LIGO-E960022) and subsequently baked at “high temperature”. The appropriate temperature is defined in LIGO-E960022. Typical hold duration at temperature is 24 hours. The preferred bake is in a vacuum oven so that the outgassing rate can be shown to be acceptable by Residual Gas Assay (RGA) measurement with a mass spectrometer. If the part is too large to be placed in a vacuum oven, then it is air baked (or dry nitrogen baked) and then its surface cleanliness is established by FTIR measurement.14)Welding, brazing, soldering have special restrictions and requirements7 defined in LIGO-E0900048.15)For commercially produced components with potentially many materials used in theconstruction, a detailed accounting of all of the materials and the amounts used must be submitted for review. It may be necessary for some components to get certifications (per article or serial number) of the materials employed in their manufacture, so that material substitutions by the manufacturer are visible to LIGO.9 Approved MaterialsThe following Table lists materials which are approved for use in all LIGO vacuum systems. In many cases the materials are restricted to a particular application. Use of the material for another application must be approved by either the LIGO Chief Engineer or the LIGO Vacuum Review Board. References for the approved materials list table are given in the last section.6 C. Torrie et. al., Manufacturing Process for Cantilever Spring Blades for Advanced LIGO, LIGO-E09000237 C. Torrie, D. Coyne, Welding Specification for Weldments used within the Advanced LIGO Vacuum System, LIGO-E0900048LIGO LIGO-E960050-v410 Explicitly Rejected Materials1)Alkali metals2)Aluminum alloy 7000 series: due to the high zinc content3)Brass (aka manganese bronze): due to high zinc content4)Cadmium or zinc plating on metal parts: Cadmium and zinc have prohibitively high vapourpressures. Crystalline whiskers grow on cadmium, can cause short circuits.5)Delrin™ or similar polyacetal resin plastics: Outgassing products known to contaminatemirrors.6)Dyes7)Epoxy Tra-Bond 2101: outgassing was measured by LIGO to be too high (note that this isnot a low outgassing epoxy formulation)8)Inks9)Manganese bronze (aka brass): due to high zinc content10)Oils and greases for lubrication11)Oilite™ or other lubricant-impregnated bearings12)Oriel MotorMike™ actuators filled with hydrocarbon oil, not cleanable13)Palladium14)Soldering flux15)Stainless Steel, free-machining grades (303, 303S, 303Se): allowable only as smallhardware components (nuts, bolts, washers), due to high sulfur or selenium content16)RTV Type 61517)Tellurium11 References for the approved materials table1.Dayton, B.B. (1960) Trans. 6th Nat. Vacuum Congress; p 1012.Schram, A. (1963) Le Vide, No 103, p 553.Holland, Steckelmacher, Yarwood (1974) Vacuum Manual4.Lewin, G. (1965) Fundamentals of Vacuum Science and Technology, p 725.Coyne, D., Viton Spring Seat Vacuum Bake Qualification, LIGO-T970168-00, 10 Oct 1997.6.Coyne, D., Allowable Bake Temperature for UHV Processing of Copper Alloys, LIGO-T0900368-v2, 11 Aug 2009.7.Worden, J., Limits to high vapor pressure elements in alloys, LIGO- L080072-00, 12 Sep 2008.8.Coyne, D., VRB Response to L070131-00: Unacceptability of 7075 Aluminum Alloy in theLIGO UHV?,LIGO-, LIGO-L070132-00, 11 Nov 2008.20LIGO LIGO-E960050-v49.Worden, J., VRB response to L080042-00, Is 303 stainless steel acceptable in the LIGOVacuum system?, LIGO-L080044-v1, 12 Jan 2009.10.Worden, J., VRB response to nickel-phosphorous plating issues , LIGO-L0900024-v1, 20 Feb2009.11.Torrie, C. et. al., Manufacturing Process for Cantilever Spring Blades for Advanced LIGO,LIGO-E0900023-v6, 23 Jun 2009.12.Worden, J., VRB Response to Flourel/Viton O-ring questions, LIGO-L070086-00, 12 Oct2007.13.Coyne, D. (ed), LIGO Vacuum Compatibility, Cleaning Methods and Qualification Procedures,LIGO- E96002214.Process Systems International, Inc., Specification for Viton Vacuum Bakeout, LIGO VacuumEquipment - Hanford and Livingston, LIGO- E960159-v1, 18 Dec 1996.15.Coyne, D., Component Specification: Material, Process, Handling and Shipping Specificationfor Fluorel Parts, LIGO-E970130-A, 17 Nov 1997.16.Process Systems International, Inc., WA Site GNB Valve Modification Report Update (PSIV049-1-185) and LA Mid Point Valve O-Ring Specification, LIGO-C990061-00, 21 Jan 1999.17.Process Systems International, Inc., Vacuum Equipment: O Ring Specification, Rev. 06, LIGO-E960085-06, 7 Jan 1997.18.ASTM, Standard Specification for Steel Wire, Music Spring Quality, A 228/A 228M – 07.19.Worden, J., Re: L0900002-v1: VRB request: all SmCo magnets UHV compatible?, LIGO-L0900011-v1, 3 Feb 2009.20.C. Torrie, et. al., Summary of Maraging Steel used in Advanced LIGO, LIGO-T090009121。

forward osmosis treatment of landfill leachate for water recovery [J ].Waste Manag.,2017,63:284-291.[77]Amaral M C ,Pereira H V ,Nani E ,et al.Treatment of landfill leach ⁃ate by hybrid precipitation/microfiltration/nanofiltration process [J ].Water Sci.Technol.,2015,72(2):269-276.[78]Ye Wenyuan ,Liu Hongwei ,Jiang Mei ,et al.Sustainable manage ⁃ment of landfill leachate concentrate through recovering humic su ⁃bstance as liquid fertilizer by loose nanofiltration [J ].Water Res.,2019,157:555-563.[79]Zolfaghari M ,Drogui P ,Brar S K ,et al.Unwanted metals and hydro ⁃phobic contaminants in bioreactor effluents are associated with thepresence of humic substances [J ].Environmental Chemistry Lett ⁃ers ,2016,15(3):489-494.[80]Gao Kuo ,Li Tian ,Liu Junxia ,et al.Ultrafiltration membrane fou ⁃ling performance by mixtures with micromolecular and macromole ⁃cular organics [J ].Environmental Science :Water Research &Te ⁃chnology ,2019,5(2):277-286.[81]Tang C Y ,Kwon Y N ,Leckie J O.Fouling of reverse osmosis andnanofiltration membranes by humic acid-Effects of solution compo ⁃sition and hydrodynamic conditions [J ].Journal of Membrane Sci ⁃ence ,2007,290(1/2):86-94.[82]Sir M ,Podhola M ,Patocka T ,et al.The effect of humic acids on thereverse osmosis treatment of hazardous landfill leachate [J ].J.Ha ⁃zard.Mater.,2012,207/208:86-90.[83]Galvao R B ,da Silva Moretti A A ,Fernandes F ,et al.Post ⁃treatmentof stabilized landfill leachate by upflow gravel filtration and granu ⁃lar activated carbon adsorption [J ].Environ.Technol.,2020:1-7.[84]Ferraz F M ,Yuan anic matter removal from landfill lea ⁃chate by adsorption using spent coffee grounds activated carbon [J ].Sustainable Materials and Technologies ,2020,23:1-6.[85]Deng Yang ,Jung C ,Zhao Renzun ,et al.Adsorption of UV-quench ⁃ing substances (UVQS )from landfill leachate with activated carb ⁃on [J ].Chemical Engineering Journal ,2018,350:739-746.[86]Xiong Jianyin ,Zhang Chen ,Yang Xiaoying ,et bining che ⁃mical coagulation with activated coke adsorption to remove organicmatters and retain nitrogen compounds in mature landfill leacha ⁃te [J ].Environ.Technol.,2020:1-9.[87]Aftab B ,Hur J.Unraveling complex removal behavior of landfill lea ⁃chate upon the treatments of Fenton oxidation and MIEX ((R ))via two ⁃dimensional correlation size exclusion chromatography (2D-CoSEC )[J ].J.Hazard.Mater.,2019,362:36-44.[88]Akinpelu A A ,Ali M E ,Johan M R ,et al.Polycyclic aromatic hyd ⁃rocarbons extraction and removal from wastewater by carbon nano ⁃tubes :A review of the current technologies ,challenges and prosp ⁃ects [J ].Process Safety and Environmental Protection ,2019,122:68-82.[89]Ateia M ,Apul O G ,Shimizu Y ,et al.Elucidating adsorptive fracti ⁃ons of natural organic matter on carbon nanotubes [J ].Environ.Sci.Technol.,2017,51(12):7101-7110.———————————[作者简介]刘占孟(1977—),博士,教授,硕士生导师。

刊名简称刊名全称ATMOS CHEM PHYS ATMOSPHERIC CHEMISTRY AND PHYSICSB AM METEOROL SOC BULLETIN OF THE AMERICAN METEOROLOGICAL SOCIETY CLIM DYNAM CLIMATE DYNAMICSCONTRIB MINERAL PETR CONTRIBUTIONS TO MINERALOGY AND PETROLOGY EARTH PLANET SC LETT EARTH AND PLANETARY SCIENCE LETTERSEARTH-SCI REV EARTH-SCIENCE REVIEWSGEOCHIM COSMOCHIM AC GEOCHIMICA ET COSMOCHIMICA ACTAGEOLOGY GEOLOGYGEOTEXT GEOMEMBRANES GEOTEXTILES AND GEOMEMBRANESJ CLIMATE JOURNAL OF CLIMATEJ PETROL JOURNAL OF PETROLOGYLIMNOL OCEANOGR LIMNOLOGY AND OCEANOGRAPHYNAT GEOSCI Nature GeosciencePALEOCEANOGRAPHY PALEOCEANOGRAPHYPRECAMBRIAN RES PRECAMBRIAN RESEARCHQUATERNARY SCI REV QUATERNARY SCIENCE REVIEWSREV GEOPHYS REVIEWS OF GEOPHYSICSGEOPHYS RES LETT GEOPHYSICAL RESEARCH LETTERSJ ATMOS SCI JOURNAL OF THE ATMOSPHERIC SCIENCESJ GEOPHYS RES JOURNAL OF GEOPHYSICAL RESEARCHJ HYDROL JOURNAL OF HYDROLOGYMON WEATHER REV MONTHLY WEATHER REVIEWANNU REV ASTRON ASTR ANNUAL REVIEW OF ASTRONOMY AND ASTROPHYSICS ASTRON ASTROPHYS REV ASTRONOMY AND ASTROPHYSICS REVIEWASTROPHYS J SUPPL S ASTROPHYSICAL JOURNAL SUPPLEMENT SERIES ASTROPHYS J ASTROPHYSICAL JOURNALACM COMPUT SURV ACM COMPUTING SURVEYSACM T GRAPHIC ACM TRANSACTIONS ON GRAPHICSACS NANO ACS NanoACTA BIOMATER Acta BiomaterialiaACTA MATER ACTA MATERIALIAADV APPL MECH ADVANCES IN APPLIED MECHANICSADV BIOCHEM ENG BIOT ADVANCES IN BIOCHEMICAL ENGINEERING / BIOTECHNOL ADV FUNCT MATER ADVANCED FUNCTIONAL MATERIALSADV MATER ADVANCED MATERIALSANNU REV BIOMED ENG ANNUAL REVIEW OF BIOMEDICAL ENGINEERINGANNU REV MATER RES ANNUAL REVIEW OF MATERIALS RESEARCHAPPL SPECTROSC REV APPLIED SPECTROSCOPY REVIEWSARTIF INTELL ARTIFICIAL INTELLIGENCEBIOMATERIALS BIOMATERIALSBIORESOURCE TECHNOL BIORESOURCE TECHNOLOGYBIOSENS BIOELECTRON BIOSENSORS & BIOELECTRONICSBIOTECHNOL ADV BIOTECHNOLOGY ADVANCESBIOTECHNOL BIOENG BIOTECHNOLOGY AND BIOENGINEERINGBIOTECHNOL BIOFUELS Biotechnology for BiofuelsCARBON CARBONCHEM MATER CHEMISTRY OF MATERIALSCOMPUT INTELL COMPUTATIONAL INTELLIGENCECRIT REV BIOTECHNOL CRITICAL REVIEWS IN BIOTECHNOLOGYCRIT REV FOOD SCI CRITICAL REVIEWS IN FOOD SCIENCE AND NUTRITION CURR OPIN BIOTECH CURRENT OPINION IN BIOTECHNOLOGY ELECTROCHEM COMMUN ELECTROCHEMISTRY COMMUNICATIONSHUM-COMPUT INTERACT HUMAN-COMPUTER INTERACTIONIEEE J SEL AREA COMM IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS IEEE SIGNAL PROC MAG IEEE SIGNAL PROCESSING MAGAZINEIEEE T EVOLUT COMPUT IEEE TRANSACTIONS ON EVOLUTIONARY COMPUTATION IEEE T IND ELECTRON IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS IEEE T NEURAL NETWOR IEEE TRANSACTIONS ON NEURAL NETWORKSIEEE T PATTERN ANAL IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHIN IEEE T SOFTWARE ENG IEEE TRANSACTIONS ON SOFTWARE ENGINEERINGINT J COMPUT VISION INTERNATIONAL JOURNAL OF COMPUTER VISIONINT J HYDROGEN ENERG INTERNATIONAL JOURNAL OF HYDROGEN ENERGYINT J NONLIN SCI NUM INTERNATIONAL JOURNAL OF NONLINEAR SCIENCES AND INT J PLASTICITY INTERNATIONAL JOURNAL OF PLASTICITYINT MATER REV INTERNATIONAL MATERIALS REVIEWSJ CATAL JOURNAL OF CATALYSISJ HAZARD MATER JOURNAL OF HAZARDOUS MATERIALSJ MATER CHEM JOURNAL OF MATERIALS CHEMISTRYJ MECH BEHAV BIOMED Journal of the Mechanical Behavior of Biomedical J NEURAL ENG Journal of Neural EngineeringJ POWER SOURCES JOURNAL OF POWER SOURCESJ WEB SEMANT Journal of Web SemanticsLAB CHIP LAB ON A CHIPMACROMOL RAPID COMM MACROMOLECULAR RAPID COMMUNICATIONS MACROMOLECULES MACROMOLECULESMAT SCI ENG R MATERIALS SCIENCE & ENGINEERING R-REPORTS MATER TODAY Materials TodayMED IMAGE ANAL MEDICAL IMAGE ANALYSISMETAB ENG METABOLIC ENGINEERINGMIS QUART MIS QUARTERLYMOL NUTR FOOD RES MOLECULAR NUTRITION & FOOD RESEARCHMRS BULL MRS BULLETINNANO LETT NANO LETTERSNANO TODAY Nano TodayNANOMED-NANOTECHNOL Nanomedicine-Nanotechnology Biology and Medicine NANOTECHNOLOGY NANOTECHNOLOGYNAT BIOTECHNOL NATURE BIOTECHNOLOGYNAT MATER NATURE MATERIALSNAT NANOTECHNOL Nature NanotechnologyORG ELECTRON ORGANIC ELECTRONICSP IEEE PROCEEDINGS OF THE IEEEPLASMONICS PlasmonicsPOLYM REV Polymer ReviewsPROG CRYST GROWTH CH PROGRESS IN CRYSTAL GROWTH AND CHARACTERIZATION PROG ENERG COMBUST PROGRESS IN ENERGY AND COMBUSTION SCIENCEPROG MATER SCI PROGRESS IN MATERIALS SCIENCEPROG PHOTOVOLTAICS PROGRESS IN PHOTOVOLTAICSPROG QUANT ELECTRON PROGRESS IN QUANTUM ELECTRONICSPROG SURF SCI PROGRESS IN SURFACE SCIENCERENEW SUST ENERG REV RENEWABLE & SUSTAINABLE ENERGY REVIEWSSMALL SMALLSOFT MATTER Soft MatterTRENDS BIOTECHNOL TRENDS IN BIOTECHNOLOGYTRENDS FOOD SCI TECH TRENDS IN FOOD SCIENCE & TECHNOLOGYVLDB J VLDB JOURNALAICHE J AICHE JOURNALAPPL MICROBIOL BIOT APPLIED MICROBIOLOGY AND BIOTECHNOLOGYCHEM ENG SCI CHEMICAL ENGINEERING SCIENCEELECTROCHIM ACTA ELECTROCHIMICA ACTAFOOD CHEM FOOD CHEMISTRYIEEE T ANTENN PROPAG IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION IEEE T AUTOMAT CONTR IEEE TRANSACTIONS ON AUTOMATIC CONTROLIEEE T INFORM THEORY IEEE TRANSACTIONS ON INFORMATION THEORYIEEE T MICROW THEORY IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNI IEEE T SIGNAL PROCES IEEE TRANSACTIONS ON SIGNAL PROCESSINGIND ENG CHEM RES INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCHINT J HEAT MASS TRAN INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER J AM CERAM SOC JOURNAL OF THE AMERICAN CERAMIC SOCIETYJ ELECTROCHEM SOC JOURNAL OF THE ELECTROCHEMICAL SOCIETYJ MEMBRANE SCI JOURNAL OF MEMBRANE SCIENCEMATER LETT MATERIALS LETTERSSCRIPTA MATER SCRIPTA MATERIALIASENSOR ACTUAT B-CHEM SENSORS AND ACTUATORS B-CHEMICALSURF COAT TECH SURFACE & COATINGS TECHNOLOGYSYNTHETIC MET SYNTHETIC METALSTHIN SOLID FILMS THIN SOLID FILMSJ OPER MANAG JOURNAL OF OPERATIONS MANAGEMENTMANAGE SCI MANAGEMENT SCIENCEOMEGA-INT J MANAGE S OMEGA-INTERNATIONAL JOURNAL OF MANAGEMENT SCIENC PROD OPER MANAG PRODUCTION AND OPERATIONS MANAGEMENTEUR J OPER RES EUROPEAN JOURNAL OF OPERATIONAL RESEARCH ACCOUNTS CHEM RES ACCOUNTS OF CHEMICAL RESEARCHACTA CRYSTALLOGR A ACTA CRYSTALLOGRAPHICA SECTION AALDRICHIM ACTA ALDRICHIMICA ACTAANGEW CHEM INT EDIT ANGEWANDTE CHEMIE-INTERNATIONAL EDITIONANNU REV PHYS CHEM ANNUAL REVIEW OF PHYSICAL CHEMISTRYCATAL REV CATALYSIS REVIEWS-SCIENCE AND ENGINEERINGCHEM REV CHEMICAL REVIEWSCHEM SOC REV CHEMICAL SOCIETY REVIEWSCOORDIN CHEM REV COORDINATION CHEMISTRY REVIEWSENERG ENVIRON SCI Energy & Environmental ScienceINT REV PHYS CHEM INTERNATIONAL REVIEWS IN PHYSICAL CHEMISTRYJ AM CHEM SOC JOURNAL OF THE AMERICAN CHEMICAL SOCIETYJ PHOTOCH PHOTOBIO C JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY C-PHO NAT PROD REP NATURAL PRODUCT REPORTSPROG POLYM SCI PROGRESS IN POLYMER SCIENCESURF SCI REP SURFACE SCIENCE REPORTSTRAC-TREND ANAL CHEM TRAC-TRENDS IN ANALYTICAL CHEMISTRYANAL CHEM ANALYTICAL CHEMISTRYJ ORG CHEM JOURNAL OF ORGANIC CHEMISTRYJ PHYS CHEM B JOURNAL OF PHYSICAL CHEMISTRY BLANGMUIR LANGMUIRAPPL CATAL B-ENVIRON APPLIED CATALYSIS B-ENVIRONMENTALB AM MUS NAT HIST BULLETIN OF THE AMERICAN MUSEUM OF NATURAL HISTO CRIT REV ENV SCI TEC CRITICAL REVIEWS IN ENVIRONMENTAL SCIENCE AND TE ECOL LETT ECOLOGY LETTERSECOL MONOGR ECOLOGICAL MONOGRAPHSECOLOGY ECOLOGYENVIRON HEALTH PERSP ENVIRONMENTAL HEALTH PERSPECTIVESENVIRON MICROBIOL ENVIRONMENTAL MICROBIOLOGYEVOLUTION EVOLUTIONFRONT ECOL ENVIRON FRONTIERS IN ECOLOGY AND THE ENVIRONMENT GLOBAL CHANGE BIOL GLOBAL CHANGE BIOLOGYGLOBAL ECOL BIOGEOGR GLOBAL ECOLOGY AND BIOGEOGRAPHYISME J ISME JournalATMOS ENVIRON ATMOSPHERIC ENVIRONMENTCHEMOSPHERE CHEMOSPHEREENVIRON SCI TECHNOL ENVIRONMENTAL SCIENCE & TECHNOLOGYWATER RES WATER RESEARCHADV AGRON ADVANCES IN AGRONOMYAGR FOREST METEOROL AGRICULTURAL AND FOREST METEOROLOGYATLA-ALTERN LAB ANIM ATLA-ALTERNATIVES TO LABORATORY ANIMALSEUR J SOIL SCI EUROPEAN JOURNAL OF SOIL SCIENCEFISH FISH FISH AND FISHERIESFISH OCEANOGR FISHERIES OCEANOGRAPHYFISH SHELLFISH IMMUN FISH & SHELLFISH IMMUNOLOGYFOOD BIOPROCESS TECH Food and Bioprocess TechnologyGEODERMA GEODERMAILAR J ILAR JOURNALJ AGR FOOD CHEM JOURNAL OF AGRICULTURAL AND FOOD CHEMISTRYJ ANIM SCI JOURNAL OF ANIMAL SCIENCEJ DAIRY SCI JOURNAL OF DAIRY SCIENCEMOL BREEDING MOLECULAR BREEDINGREV FISH BIOL FISHER REVIEWS IN FISH BIOLOGY AND FISHERIESSOIL BIOL BIOCHEM SOIL BIOLOGY & BIOCHEMISTRYSOIL SCI SOC AM J SOIL SCIENCE SOCIETY OF AMERICA JOURNALTREE PHYSIOL TREE PHYSIOLOGYVET MICROBIOL VETERINARY MICROBIOLOGYVET RES VETERINARY RESEARCHAQUACULTURE AQUACULTURECAN J FISH AQUAT SCI CANADIAN JOURNAL OF FISHERIES AND AQUATIC SCIENC FOREST ECOL MANAG FOREST ECOLOGY AND MANAGEMENTJAVMA-J AM VET MED A JAVMA-JOURNAL OF THE AMERICAN VETERINARY MEDICAL PLANT SOIL PLANT AND SOILAM J BIOETHICS AMERICAN JOURNAL OF BIOETHICSECONOMETRICA ECONOMETRICAJ ECONOMETRICS JOURNAL OF ECONOMETRICSAM J HUM GENET AMERICAN JOURNAL OF HUMAN GENETICSANNU REV BIOCHEM ANNUAL REVIEW OF BIOCHEMISTRYANNU REV BIOPH BIOM ANNUAL REVIEW OF BIOPHYSICS AND BIOMOLECULAR STR ANNU REV BIOPHYS Annual Review of BiophysicsANNU REV CELL DEV BI ANNUAL REVIEW OF CELL AND DEVELOPMENTAL BIOLOGY ANNU REV ECOL EVOL S ANNUAL REVIEW OF ECOLOGY EVOLUTION AND SYSTEMATI ANNU REV ENTOMOL ANNUAL REVIEW OF ENTOMOLOGYANNU REV GENET ANNUAL REVIEW OF GENETICSANNU REV GENOM HUM G ANNUAL REVIEW OF GENOMICS AND HUMAN GENETICS ANNU REV MICROBIOL ANNUAL REVIEW OF MICROBIOLOGYANNU REV PHYTOPATHOL ANNUAL REVIEW OF PHYTOPATHOLOGYANNU REV PLANT BIOL ANNUAL REVIEW OF PLANT BIOLOGYCELL CELLCELL HOST MICROBE Cell Host & MicrobeCELL METAB Cell MetabolismCELL STEM CELL Cell Stem CellCRIT REV BIOCHEM MOL CRITICAL REVIEWS IN BIOCHEMISTRY AND MOLECULAR B CURR BIOL CURRENT BIOLOGYCURR OPIN CELL BIOL CURRENT OPINION IN CELL BIOLOGYCURR OPIN GENET DEV CURRENT OPINION IN GENETICS & DEVELOPMENTCURR OPIN PLANT BIOL CURRENT OPINION IN PLANT BIOLOGYCURR OPIN STRUC BIOL CURRENT OPINION IN STRUCTURAL BIOLOGYDEV CELL DEVELOPMENTAL CELLGENE DEV GENES & DEVELOPMENTGENOME RES GENOME RESEARCHJ CELL BIOL JOURNAL OF CELL BIOLOGYMICROBIOL MOL BIOL R MICROBIOLOGY AND MOLECULAR BIOLOGY REVIEWSMOL CELL MOLECULAR CELLMOL SYST BIOL Molecular Systems BiologyNAT CELL BIOL NATURE CELL BIOLOGYNAT CHEM BIOL Nature Chemical BiologyNAT GENET NATURE GENETICSNAT METHODS NATURE METHODSNAT REV GENET NATURE REVIEWS GENETICSNAT REV MICROBIOL NATURE REVIEWS MICROBIOLOGYNAT REV MOL CELL BIO NATURE REVIEWS MOLECULAR CELL BIOLOGYNAT STRUCT MOL BIOL NATURE STRUCTURAL & MOLECULAR BIOLOGYPLANT CELL PLANT CELLPLOS BIOL PLOS BIOLOGYPLOS GENET PLoS GeneticsPLOS PATHOG PLoS PathogensPROG LIPID RES PROGRESS IN LIPID RESEARCHQ REV BIOPHYS QUARTERLY REVIEWS OF BIOPHYSICSTRENDS BIOCHEM SCI TRENDS IN BIOCHEMICAL SCIENCESTRENDS CELL BIOL TRENDS IN CELL BIOLOGYTRENDS ECOL EVOL TRENDS IN ECOLOGY & EVOLUTIONTRENDS GENET TRENDS IN GENETICSTRENDS PLANT SCI TRENDS IN PLANT SCIENCEAPPL ENVIRON MICROB APPLIED AND ENVIRONMENTAL MICROBIOLOGY BIOCHEM J BIOCHEMICAL JOURNALBIOPHYS J BIOPHYSICAL JOURNALDEVELOPMENT DEVELOPMENTEMBO J EMBO JOURNALJ BACTERIOL JOURNAL OF BACTERIOLOGYJ BIOL CHEM JOURNAL OF BIOLOGICAL CHEMISTRYJ MOL BIOL JOURNAL OF MOLECULAR BIOLOGYMOL CELL BIOL MOLECULAR AND CELLULAR BIOLOGYNUCLEIC ACIDS RES NUCLEIC ACIDS RESEARCHPLANT PHYSIOL PLANT PHYSIOLOGYACTA MATH-DJURSHOLM ACTA MATHEMATICAANN MATH ANNALS OF MATHEMATICSANN STAT ANNALS OF STATISTICSB AM MATH SOC BULLETIN OF THE AMERICAN MATHEMATICAL SOCIETY COMMUN PUR APPL MATH COMMUNICATIONS ON PURE AND APPLIED MATHEMATICS FOUND COMPUT MATH FOUNDATIONS OF COMPUTATIONAL MATHEMATICS INVENT MATH INVENTIONES MATHEMATICAEINVERSE PROBL INVERSE PROBLEMSJ AM MATH SOC JOURNAL OF THE AMERICAN MATHEMATICAL SOCIETYJ AM STAT ASSOC JOURNAL OF THE AMERICAN STATISTICAL ASSOCIATION J R STAT SOC B JOURNAL OF THE ROYAL STATISTICAL SOCIETY SERIES MATH MOD METH APPL S MATHEMATICAL MODELS & METHODS IN APPLIED SCIENCE MATH PROGRAM MATHEMATICAL PROGRAMMINGMEM AM MATH SOC MEMOIRS OF THE AMERICAN MATHEMATICAL SOCIETY MULTISCALE MODEL SIM MULTISCALE MODELING & SIMULATIONMULTIVAR BEHAV RES MULTIVARIATE BEHAVIORAL RESEARCHNONLINEAR ANAL-REAL NONLINEAR ANALYSIS-REAL WORLD APPLICATIONSRISK ANAL RISK ANALYSISSIAM REV SIAM REVIEWSTAT SCI STATISTICAL SCIENCESTRUCT EQU MODELING STRUCTURAL EQUATION MODELING-A MULTIDISCIPLINARY FUZZY SET SYST FUZZY SETS AND SYSTEMSJ COMPUT APPL MATH JOURNAL OF COMPUTATIONAL AND APPLIED MATHEMATICS J DIFFER EQUATIONS JOURNAL OF DIFFERENTIAL EQUATIONSJ MATH ANAL APPL JOURNAL OF MATHEMATICAL ANALYSIS AND APPLICATIONNONLINEAR ANAL-THEOR NONLINEAR ANALYSIS-THEORY METHODS & APPLICATIONS SIAM J NUMER ANAL SIAM JOURNAL ON NUMERICAL ANALYSISSIAM J SCI COMPUT SIAM JOURNAL ON SCIENTIFIC COMPUTINGACTA CRYSTALLOGR A ACTA CRYSTALLOGRAPHICA SECTION AADV PHYS ADVANCES IN PHYSICSANNU REV FLUID MECH ANNUAL REVIEW OF FLUID MECHANICSANNU REV NUCL PART S ANNUAL REVIEW OF NUCLEAR AND PARTICLE SCIENCE CRIT REV SOLID STATE CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SC J HIGH ENERGY PHYS JOURNAL OF HIGH ENERGY PHYSICSLASER PHOTONICS REV Laser & Photonics ReviewsLIVING REV RELATIV Living Reviews in RelativityMASS SPECTROM REV MASS SPECTROMETRY REVIEWSNAT PHOTONICS Nature PhotonicsNAT PHYS Nature PhysicsPHYS REP PHYSICS REPORTS-REVIEW SECTION OF PHYSICS LETTER PHYS REV LETT PHYSICAL REVIEW LETTERSPROG NUCL MAG RES SP PROGRESS IN NUCLEAR MAGNETIC RESONANCE SPECTROSC REP PROG PHYS REPORTS ON PROGRESS IN PHYSICSREV MOD PHYS REVIEWS OF MODERN PHYSICSAPPL PHYS LETT APPLIED PHYSICS LETTERSJ CHEM PHYS JOURNAL OF CHEMICAL PHYSICSPHYS REV B PHYSICAL REVIEW BPHYS REV D PHYSICAL REVIEW DADV DRUG DELIVER REV ADVANCED DRUG DELIVERY REVIEWSADV IMMUNOL ADVANCES IN IMMUNOLOGYAM J CLIN NUTR AMERICAN JOURNAL OF CLINICAL NUTRITIONAM J GASTROENTEROL AMERICAN JOURNAL OF GASTROENTEROLOGYAM J PSYCHIAT AMERICAN JOURNAL OF PSYCHIATRYAM J RESP CRIT CARE AMERICAN JOURNAL OF RESPIRATORY AND CRITICAL CAR AM J TRANSPLANT AMERICAN JOURNAL OF TRANSPLANTATIONANN INTERN MED ANNALS OF INTERNAL MEDICINEANN NEUROL ANNALS OF NEUROLOGYANN RHEUM DIS ANNALS OF THE RHEUMATIC DISEASESANN SURG ANNALS OF SURGERYANNU REV IMMUNOL ANNUAL REVIEW OF IMMUNOLOGYANNU REV MED ANNUAL REVIEW OF MEDICINEANNU REV NEUROSCI ANNUAL REVIEW OF NEUROSCIENCEANNU REV NUTR ANNUAL REVIEW OF NUTRITIONANNU REV PATHOL-MECH Annual Review of Pathology-Mechanisms of Disease ANNU REV PHARMACOL ANNUAL REVIEW OF PHARMACOLOGY AND TOXICOLOGY ANNU REV PHYSIOL ANNUAL REVIEW OF PHYSIOLOGYANNU REV PSYCHOL ANNUAL REVIEW OF PSYCHOLOGYANNU REV PUBL HEALTH ANNUAL REVIEW OF PUBLIC HEALTHARCH GEN PSYCHIAT ARCHIVES OF GENERAL PSYCHIATRYARCH INTERN MED ARCHIVES OF INTERNAL MEDICINEARTERIOSCL THROM VAS ARTERIOSCLEROSIS THROMBOSIS AND VASCULAR BIOLOGY ARTHRITIS RHEUM-US ARTHRITIS AND RHEUMATISMBBA-REV CANCER BIOCHIMICA ET BIOPHYSICA ACTA-REVIEWS ON CANCER BEHAV BRAIN SCI BEHAVIORAL AND BRAIN SCIENCESBIOL PSYCHIAT BIOLOGICAL PSYCHIATRYBLOOD BLOODBLOOD REV BLOOD REVIEWSBRAIN BRAINBRAIN RES REV BRAIN RESEARCH REVIEWSBRIT MED J BRITISH MEDICAL JOURNALCA-CANCER J CLIN CA-A CANCER JOURNAL FOR CLINICIANSCAN MED ASSOC J CANADIAN MEDICAL ASSOCIATION JOURNALCANCER CELL CANCER CELLCANCER METAST REV CANCER AND METASTASIS REVIEWSCANCER RES CANCER RESEARCHCEREB CORTEX CEREBRAL CORTEXCIRC RES CIRCULATION RESEARCHCIRCULATION CIRCULATIONCLIN CANCER RES CLINICAL CANCER RESEARCHCLIN INFECT DIS CLINICAL INFECTIOUS DISEASESCLIN MICROBIOL REV CLINICAL MICROBIOLOGY REVIEWSCLIN PHARMACOL THER CLINICAL PHARMACOLOGY & THERAPEUTICSCRIT CARE MED CRITICAL CARE MEDICINECURR OPIN IMMUNOL CURRENT OPINION IN IMMUNOLOGYCURR OPIN LIPIDOL CURRENT OPINION IN LIPIDOLOGYCURR OPIN NEUROBIOL CURRENT OPINION IN NEUROBIOLOGYCURR OPIN PHARMACOL CURRENT OPINION IN PHARMACOLOGYDIABETES DIABETESDIABETES CARE DIABETES CAREDIABETOLOGIA DIABETOLOGIADRUG DISCOV TODAY DRUG DISCOVERY TODAYDRUG RESIST UPDATE DRUG RESISTANCE UPDATESEMERG INFECT DIS EMERGING INFECTIOUS DISEASESENDOCR REV ENDOCRINE REVIEWSEPIDEMIOL REV EPIDEMIOLOGIC REVIEWSEUR HEART J EUROPEAN HEART JOURNALEUR UROL EUROPEAN UROLOGYFRONT NEUROENDOCRIN FRONTIERS IN NEUROENDOCRINOLOGY GASTROENTEROLOGY GASTROENTEROLOGYGASTROINTEST ENDOSC GASTROINTESTINAL ENDOSCOPYGUT GUTHEPATOLOGY HEPATOLOGYHUM MUTAT HUMAN MUTATIONHUM REPROD UPDATE HUMAN REPRODUCTION UPDATEHYPERTENSION HYPERTENSIONIMMUNITY IMMUNITYIMMUNOL REV IMMUNOLOGICAL REVIEWSJ ALLERGY CLIN IMMUN JOURNAL OF ALLERGY AND CLINICAL IMMUNOLOGYJ AM COLL CARDIOL JOURNAL OF THE AMERICAN COLLEGE OF CARDIOLOGYJ AM SOC NEPHROL JOURNAL OF THE AMERICAN SOCIETY OF NEPHROLOGYJ AUTOIMMUN JOURNAL OF AUTOIMMUNITYJ BONE MINER RES JOURNAL OF BONE AND MINERAL RESEARCHJ CLIN INVEST JOURNAL OF CLINICAL INVESTIGATIONJ CLIN ONCOL JOURNAL OF CLINICAL ONCOLOGYJ EXP MED JOURNAL OF EXPERIMENTAL MEDICINEJ HEPATOL JOURNAL OF HEPATOLOGYJ NATL CANCER I JOURNAL OF THE NATIONAL CANCER INSTITUTEJ NEUROSCI JOURNAL OF NEUROSCIENCEJ NUCL MED JOURNAL OF NUCLEAR MEDICINEJAMA-J AM MED ASSOC JAMA-JOURNAL OF THE AMERICAN MEDICAL ASSOCIATION LANCET LANCETLANCET INFECT DIS LANCET INFECTIOUS DISEASESLANCET NEUROL LANCET NEUROLOGYLANCET ONCOL LANCET ONCOLOGYLEUKEMIA LEUKEMIAMED RES REV MEDICINAL RESEARCH REVIEWSMOL ASPECTS MED MOLECULAR ASPECTS OF MEDICINEMOL PSYCHIATR MOLECULAR PSYCHIATRYNAT CLIN PRACT ONCOL Nature Clinical Practice OncologyNAT IMMUNOL NATURE IMMUNOLOGYNAT MED NATURE MEDICINENAT NEUROSCI NATURE NEUROSCIENCENAT REV CANCER NATURE REVIEWS CANCERNAT REV DRUG DISCOV NATURE REVIEWS DRUG DISCOVERYNAT REV IMMUNOL NATURE REVIEWS IMMUNOLOGYNAT REV NEUROSCI NATURE REVIEWS NEUROSCIENCENEUROLOGY NEUROLOGYNEURON NEURONNEUROPSYCHOPHARMACOL NEUROPSYCHOPHARMACOLOGYNEUROSCI BIOBEHAV R NEUROSCIENCE AND BIOBEHAVIORAL REVIEWSNEW ENGL J MED NEW ENGLAND JOURNAL OF MEDICINEOBES REV Obesity ReviewsONCOGENE ONCOGENEPHARMACOL REV PHARMACOLOGICAL REVIEWSPHARMACOL THERAPEUT PHARMACOLOGY & THERAPEUTICSPHYSIOL REV PHYSIOLOGICAL REVIEWSPHYSIOLOGY PHYSIOLOGYPLOS MED PLOS MEDICINEPROG NEUROBIOL PROGRESS IN NEUROBIOLOGYPROG RETIN EYE RES PROGRESS IN RETINAL AND EYE RESEARCHPSYCHOL BULL PSYCHOLOGICAL BULLETINPSYCHOL REV PSYCHOLOGICAL REVIEWREV MED VIROL REVIEWS IN MEDICAL VIROLOGYSCHIZOPHRENIA BULL SCHIZOPHRENIA BULLETINSEMIN CANCER BIOL SEMINARS IN CANCER BIOLOGYSEMIN IMMUNOL SEMINARS IN IMMUNOLOGYSTEM CELLS STEM CELLSSTROKE STROKETHORAX THORAXTRENDS COGN SCI TRENDS IN COGNITIVE SCIENCESTRENDS ENDOCRIN MET TRENDS IN ENDOCRINOLOGY AND METABOLISMTRENDS IMMUNOL TRENDS IN IMMUNOLOGYTRENDS MOL MED TRENDS IN MOLECULAR MEDICINETRENDS NEUROSCI TRENDS IN NEUROSCIENCESTRENDS PHARMACOL SCI TRENDS IN PHARMACOLOGICAL SCIENCESWHO TECH REP SER WHO TECHNICAL REPORT SERIESAM J CARDIOL AMERICAN JOURNAL OF CARDIOLOGYAM J EPIDEMIOL AMERICAN JOURNAL OF EPIDEMIOLOGYAM J PATHOL AMERICAN JOURNAL OF PATHOLOGYAM J PHYSIOL-HEART C AMERICAN JOURNAL OF PHYSIOLOGY-HEART AND CIRCULA ANTIMICROB AGENTS CH ANTIMICROBIAL AGENTS AND CHEMOTHERAPYBRIT J CANCER BRITISH JOURNAL OF CANCERCANCER-AM CANCER SOC CANCERCHEST CHESTCNS NEUROL DISORD-DR CNS & Neurological Disorders-Drug Targets ENDOCRINOLOGY ENDOCRINOLOGYEUR J NEUROSCI EUROPEAN JOURNAL OF NEUROSCIENCEFREE RADICAL BIO MED FREE RADICAL BIOLOGY AND MEDICINEINFECT IMMUN INFECTION AND IMMUNITYINT J CANCER INTERNATIONAL JOURNAL OF CANCERINT J RADIAT ONCOL INTERNATIONAL JOURNAL OF RADIATION ONCOLOGY BIOL INVEST OPHTH VIS SCI INVESTIGATIVE OPHTHALMOLOGY & VISUAL SCIENCEJ APPL PHYSIOL JOURNAL OF APPLIED PHYSIOLOGYJ CLIN ENDOCR METAB JOURNAL OF CLINICAL ENDOCRINOLOGY AND METABOLISM J CLIN MICROBIOL JOURNAL OF CLINICAL MICROBIOLOGYJ COMP NEUROL JOURNAL OF COMPARATIVE NEUROLOGYJ IMMUNOL JOURNAL OF IMMUNOLOGYJ INFECT DIS JOURNAL OF INFECTIOUS DISEASESJ MED CHEM JOURNAL OF MEDICINAL CHEMISTRYJ NEUROCHEM JOURNAL OF NEUROCHEMISTRYJ NEUROPHYSIOL JOURNAL OF NEUROPHYSIOLOGYJ NUTR JOURNAL OF NUTRITIONJ PHARMACOL EXP THER JOURNAL OF PHARMACOLOGY AND EXPERIMENTAL THERAPE J PHYSIOL-LONDON JOURNAL OF PHYSIOLOGY-LONDONJ UROLOGY JOURNAL OF UROLOGYJ VIROL JOURNAL OF VIROLOGYKIDNEY INT KIDNEY INTERNATIONALNEUROIMAGE NEUROIMAGENEUROSCIENCE NEUROSCIENCEPEDIATRICS PEDIATRICSRADIOLOGY RADIOLOGYTRANSPLANTATION TRANSPLANTATIONVIROLOGY VIROLOGYNATURE NATUREP NATL ACAD SCI USA PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES SCIENCE SCIENCEANN NY ACAD SCI ANNALS OF THE NEW YORK ACADEMY OF SCIENCESISSN大类名称复分大类分区是否top期刊2009年影响因子1680-7316地学1Y 4.881 0003-0007地学1Y 6.123 0930-7575地学1Y 3.917 0010-7999地学1Y 3.497 0012-821X地学1Y 4.062 0012-8252地学1Y 6.942 0016-7037地学1Y 4.385 0091-7613地学1Y 4.368 0266-1144地学1Y 4.039 0894-8755地学1Y 3.363 0022-3530地学1Y 3.738 0024-3590地学1Y 3.545 1752-0894地学1Y8.108 0883-8305地学1Y 3.644 0301-9268地学1Y 3.574 0277-3791地学1Y 4.245 8755-1209地学1Y8.021 0094-8276地学2Y 3.204 0022-4928地学2Y 2.911 0148-0227地学2Y 3.082 0022-1694地学2Y 2.433 0027-0644地学2Y 2.238 0066-4146地学天文1Y25.640 0935-4956地学天文1Y11.857 0067-0049地学天文1Y12.771 0004-637X地学天文2Y7.364 0360-0300工程技术1Y7.667 0730-0301工程技术1Y 3.619 1936-0851工程技术1Y7.493 1742-7061工程技术1Y 3.975 1359-6454工程技术1Y 3.760 0065-2156工程技术1Y 5.500 0724-6145工程技术1Y 4.165 1616-301X工程技术1Y 6.990 0935-9648工程技术1Y8.379 1523-9829工程技术1Y11.235 1531-7331工程技术1Y7.911 0570-4928工程技术1Y 3.243 0004-3702工程技术1Y 3.036 0142-9612工程技术1Y7.365 0960-8524工程技术1Y 4.253 0956-5663工程技术1Y 5.429 0734-9750工程技术1Y8.250 0006-3592工程技术1Y 3.377 1754-6834工程技术1Y 4.118 0008-6223工程技术1Y 4.5040897-4756工程技术1Y 5.368 0824-7935工程技术1Y 5.378 0738-8551工程技术1Y 3.567 1040-8398工程技术1Y 3.725 0958-1669工程技术1Y7.820 1388-2481工程技术1Y 4.243 0737-0024工程技术1Y 6.190 0733-8716工程技术1Y 3.758 1053-5888工程技术1Y 4.914 1089-778X工程技术1Y 4.589 0278-0046工程技术1Y 4.678 1045-9227工程技术1Y 2.889 0162-8828工程技术1Y 4.378 0098-5589工程技术1Y 3.750 0920-5691工程技术1Y 3.508 0360-3199工程技术1Y 3.945 1565-1339工程技术1Y 5.276 0749-6419工程技术1Y 4.791 0950-6608工程技术1Y 4.857 0021-9517工程技术1Y 5.288 0304-3894工程技术1Y 4.144 0959-9428工程技术1Y 4.795 1751-6161工程技术1Y 3.176 1741-2560工程技术1Y 3.739 0378-7753工程技术1Y 3.792 1570-8268工程技术1Y 3.412 1473-0197工程技术1Y 6.306 1022-1336工程技术1Y 4.263 0024-9297工程技术1Y 4.539 0927-796X工程技术1Y12.217 1369-7021工程技术1Y11.452 1361-8415工程技术1Y 3.093 1096-7176工程技术1Y 4.725 0276-7783工程技术1Y 4.485 1613-4125工程技术1Y 4.356 0883-7694工程技术1Y 6.330 1530-6984工程技术1Y9.991 1748-0132工程技术1Y13.237 1549-9634工程技术1Y 5.440 0957-4484工程技术1Y 3.137 1087-0156工程技术1Y29.495 1476-1122工程技术1Y29.504 1748-3387工程技术1Y26.309 1566-1199工程技术1Y 3.262 0018-9219工程技术1Y 4.878 1557-1955工程技术1Y 3.723 1558-3724工程技术1Y 5.6120960-8974工程技术1Y9.250 0360-1285工程技术1Y11.024 0079-6425工程技术1Y15.769 1062-7995工程技术1Y 4.702 0079-6727工程技术1Y 4.091 0079-6816工程技术1Y7.913 1364-0321工程技术1Y 4.842 1613-6810工程技术1Y 6.171 1744-683X工程技术1Y 4.869 0167-7799工程技术1Y 6.909 0924-2244工程技术1Y 4.051 1066-8888工程技术1Y 4.517 0001-1541工程技术2Y 1.955 0175-7598工程技术2Y 2.896 0009-2509工程技术2Y 2.136 0013-4686工程技术2Y 3.325 0308-8146工程技术2Y 3.146 0018-926X工程技术2Y 2.011 0018-9286工程技术2Y 2.556 0018-9448工程技术2Y 2.357 0018-9480工程技术2Y 2.076 1053-587X工程技术2Y 2.212 0888-5885工程技术2Y 1.758 0017-9310工程技术2Y 1.947 0002-7820工程技术2Y 1.944 0013-4651工程技术2Y 2.241 0376-7388工程技术2Y 3.203 0167-577X工程技术2Y 1.940 1359-6462工程技术2Y 2.949 0925-4005工程技术2Y 3.083 0257-8972工程技术2Y 1.793 0379-6779工程技术2Y 1.901 0040-6090工程技术2Y 1.727 0272-6963管理科学1Y 3.238 0025-1909管理科学1Y 2.227 0305-0483管理科学1Y 3.101 1059-1478管理科学1Y 2.080 0377-2217管理科学2Y 2.093 0001-4842化学1Y18.203 0108-7673化学化学－晶体1Y49.926 0002-5100化学1Y18.688 1433-7851化学1Y11.829 0066-426X化学1Y17.464 0161-4940化学1Y7.765 0009-2665化学1Y35.957 0306-0012化学1Y20.086 0010-8545化学1Y11.2251754-5692化学1Y8.500 0144-235X化学1Y 5.000 0002-7863化学1Y8.580 1389-5567化学1Y7.952 0265-0568化学1Y9.202 0079-6700化学1Y23.753 0167-5729化学1Y13.462 0165-9936化学1Y 6.546 0003-2700化学2Y 5.214 0022-3263化学2Y 4.219 1520-6106化学2Y 3.471 0743-7463化学2Y 3.898 0926-3373环境科学1Y 5.252 0003-0090环境科学1Y 4.133 1064-3389环境科学1Y7.091 1461-023X环境科学1Y10.318 0012-9615环境科学1Y 4.862 0012-9658环境科学1Y 4.411 0091-6765环境科学1Y 6.191 1462-2912环境科学1Y 4.909 0014-3820环境科学1Y 5.429 1540-9295环境科学1Y 6.922 1354-1013环境科学1Y 5.561 1466-822X环境科学1Y 5.913 1751-7362环境科学1Y 6.397 1352-2310环境科学2Y 3.139 0045-6535环境科学2Y 3.253 0013-936X环境科学2Y 4.630 0043-1354环境科学2Y 4.355 0065-2113农林科学1Y 3.800 0168-1923农林科学1Y 3.197 0261-1929农林科学1Y 1.580 1351-0754农林科学1Y 2.131 1467-2960农林科学1Y 4.489 1054-6006农林科学1Y 2.427 1050-4648农林科学1Y 2.892 1935-5130农林科学1Y 2.238 0016-7061农林科学1Y 2.461 1084-2020农林科学1Y 2.806 0021-8561农林科学1Y 2.469 0021-8812农林科学1Y 2.466 0022-0302农林科学1Y 2.463 1380-3743农林科学1Y 2.272 0960-3166农林科学1Y 2.161 0038-0717农林科学1Y 2.978 0361-5995农林科学1Y 2.179 0829-318X农林科学1Y 2.2920378-1135农林科学1Y 2.874 0928-4249农林科学1Y 3.579 0044-8486农林科学2Y 1.925 0706-652X农林科学2Y 1.951 0378-1127农林科学2Y 1.950 0003-1488农林科学2Y 1.714 0032-079X农林科学2Y 2.517 1526-5161社会科学1Y 4.000 0012-9682社会科学1Y 4.000 0304-4076社会科学2Y 1.902 0002-9297生物1Y12.303 0066-4154生物1Y29.875 1056-8700生物1Y18.955 1936-122X生物1Y19.304 1081-0706生物1Y19.571 1543-592X生物1Y8.190 0066-4170生物1Y11.271 0066-4197生物1Y13.235 1527-8204生物1Y11.568 0066-4227生物1Y12.804 0066-4286生物1Y11.212 1543-5008生物1Y23.460 0092-8674生物1Y31.152 1931-3128生物1Y13.021 1550-4131生物1Y17.350 1934-5909生物1Y23.563 1040-9238生物1Y10.216 0960-9822生物1Y10.992 0955-0674生物1Y14.153 0959-437X生物1Y8.987 1369-5266生物1Y10.333 0959-440X生物1Y9.344 1534-5807生物1Y13.363 0890-9369生物1Y12.075 1088-9051生物1Y11.342 0021-9525生物1Y9.575 1092-2172生物1Y12.585 1097-2765生物1Y14.608 1744-4292生物1Y12.125 1465-7392生物1Y19.527 1552-4450生物1Y16.058 1061-4036生物1Y34.284 1548-7091生物1Y16.874 1471-0056生物1Y27.822 1740-1526生物1Y17.644 1471-0072生物1Y42.198 1545-9985生物1Y12.2731040-4651生物1Y9.293 1544-9173生物1Y12.916 1553-7390生物1Y9.532 1553-7366生物1Y8.978 0163-7827生物1Y8.167 0033-5835生物1Y10.200 0968-0004生物1Y11.572 0962-8924生物1Y12.115 0169-5347生物1Y11.564 0168-9525生物1Y8.689 1360-1385生物1Y9.883 0099-2240生物2Y 3.686 0264-6021生物2Y 5.155 0006-3495生物2Y 4.390 0950-1991生物2Y7.194 0261-4189生物2Y8.993 0021-9193生物2Y 3.940 0021-9258生物2Y 5.328 0022-2836生物2Y 3.871 0270-7306生物2Y 6.057 0305-1048生物2Y7.479 0032-0889生物2Y 6.235 0001-5962数学1Y 2.619 0003-486X数学1Y 4.174 0090-5364数学1Y 3.185 0273-0979数学1Y 3.294 0010-3640数学1Y 2.657 1615-3375数学1Y 1.905 0020-9910数学1Y 2.794 0266-5611数学1Y 1.900 0894-0347数学1Y 3.411 0162-1459数学1Y 2.322 1369-7412数学1Y 3.473 0218-2025数学1Y 2.095 0025-5610数学1Y 2.048 0065-9266数学1Y 2.240 1540-3459数学1Y 2.198 0027-3171数学1Y 2.328 1468-1218数学1Y 2.381 0272-4332数学1Y 1.953 0036-1445数学1Y 3.391 0883-4237数学1Y 3.523 1070-5511数学1Y 3.153 0165-0114数学2Y 2.138 0377-0427数学2Y 1.292 0022-0396数学2Y 1.426 0022-247X数学2Y 1.2250362-546X数学2Y 1.487 0036-1429数学2Y 1.840 1064-8275数学2Y 1.595 0108-7673物理物理－晶体1Y49.926 0001-8732物理1Y19.632 0066-4189物理1Y9.353 0163-8998物理1Y11.964 1040-8436物理1Y 5.167 1126-6708物理1Y 6.019 1863-8880物理1Y 5.814 1433-8351物理1Y10.600 0277-7037物理1Y10.623 1749-4885物理1Y22.869 1745-2473物理1Y15.491 0370-1573物理1Y17.752 0031-9007物理1Y7.328 0079-6565物理1Y 6.742 0034-4885物理1Y11.444 0034-6861物理1Y33.145 0003-6951物理2Y 3.554 0021-9606物理2Y 3.093 1098-0121物理2Y 3.475 1550-7998物理2Y 4.922 0169-409X医学1Y11.957 0065-2776医学1Y7.725 0002-9165医学1Y 6.307 0002-9270医学1Y 6.012 0002-953X医学1Y12.522 1073-449X医学1Y10.689 1600-6135医学1Y 6.433 0003-4819医学1Y16.225 0364-5134医学1Y9.317 0003-4967医学1Y8.111 0003-4932医学1Y7.900 0732-0582医学1Y37.902 0066-4219医学1Y9.940 0147-006X医学1Y24.822 0199-9885医学1Y8.783 1553-4006医学1Y13.500 0362-1642医学1Y22.468 0066-4278医学1Y18.170 0066-4308医学1Y22.750 0163-7525医学1Y7.915 0003-990X医学1Y12.257 0003-9926医学1Y9.813 1079-5642医学1Y7.235 0004-3591医学1Y7.332。

1-800-OK-CANON Canon U.S.A., Inc.One Canon Plaza, Lake Success, NY 11042 U.S.A.Canon Canada Inc.6390 Dixie Road, Mississauga, Ontario L5T 1P7 CanadaCanon Mexicana, S. DE R.L. DE C.V.Periférico Sur No. 4124, 5º y 6º pisos, Col. Ex-Rancho de Anzaldo,01900 México, D.F.Canon Latin America703 Waterford Way, Suite 400, Miami, FL 33126 U.S.A.0039W118©2003 canon u.s.a., inc.printed in u.s.a.digital tionized photography we revolu digital™“In 1990,Canon’s first EOS Rebel revolutionized photography by making SLR excitement available to everyone.In the decade that followed,the Rebel grew and evolved to give its legions of fans even more photographic freedom.Now the Rebel achieves its ultimate evolution.Equipped with Canon’s exclusive “Digital Trinity”– 6.3 Megapixel CMOS Sensor,≥Imaging Processor and compatibility with over 50 ofCanon’s superb EF lenses – the Digital Rebel breaks definitively through every remaining barrier to truly deliver photography without limits.Create memorable images no matter what your level of experience.Nurture your creativity with easy controls and a world of EOS accessories.Share and reproduce your images with state-of-the-art digital freedom.The world’s first affordable,premium-quality digital SLR makes it all possible.Canon Digital Trinity – EF Lenses,6.3 Megapixel CMOS Sensor,≥Imaging ProcessorRest assured with a 7-point Wide-Area AF,your shots will be in focus to capture those memorable moments.1/750 sec.• f/2.81/200 sec.• f/2.87-point Wide-Area AF 1/30 sec.• f/221/750 sec.• f/3.5and other unpredictable subjects.2.5 frames-per-second motor-driveContinuous Shooting mode,lettingyou capture split-second action sequences2.5 fps1/2500 sec.• f/2.81/3200 sec. f/2.81/2500 sec.• f/2.81/80 sec.• f/11taking into account lighting extremes and subject position through the active focusing point.Whether the light is bright and sunny or darkly atmospheric,whether it comes from the front exposure is Control is there when you want it,extra sensitivity to high-contrast situations,Average Metering options go even further with illumination from the built-in 535-zone Evaluative MeteringPhotoStitchCreate soft effects with a slow shutter speed or freeze the moment with a fast shutter speed.1/2 sec.• f/321/1000 sec.• f/81/125 sec.• f/111/180 sec.• f/161/250 sec.• f/5.6Preset 1Preset 2IMAGE ROTATIONPROCESSING PARAMETER SETTINGSThe Digital Rebel is compact and lightweight,with a secure rounded grip.In fact,it feels so good in your hand you’ll want to bring it everywhere.Operation feels familiar and intuitive,whether you’re new to digital,new to SLR cameras or even new to photography.The Mode Dial makes one-handed shooting comfortable,with digital and shooting controls easily accessed and under your thumb handle the operations you’ll use most.The LCD screen and you can even adjust the brightness setting.Menus are written in plain language and tabbed on a single screen – no scrolling necessary.highly intelligent fires automatically in appropriate modes for point-and-shoot convenience.With a built-in flash,night-time photos are a cinch.E a sy a n d f u n 1/90 s e c.• f /5.61/30 sec.• f/83 sec.• f/111/30 sec.• f/11Versatile and easy to use,be ready whenever the moment strikes you.U p l cs N P T V D M With Automatic Flash Output Reduction1322 3444 321215SOFTWARE SOLUTIONSREPRODUCING AND SHARING YOUR IMAGES IS AS EXCITING AS CREATING THEM.i475D Desktop Photo Printer with Digital Rebel For instant direct printing right at home,just plug your Digital Rebel intoone of Canon’s fine Card Photo Printers or Bubble Jet Direct PhotoPrinters.New PictBridge compatibility allows you to connect the camerato any PictBridge-conforming printer and access a wide range of printingmedia,modes and styles.Canon-to-Canon direct printing,however,willproduce the speediest,most reliable quality printing,with extraoptions for printing effects and a handy display whenit’s time to replace ink cartridges.With Exif Print2.2,images are processed intelligently basedon information the camera has recordedwith each shot,and PTP means WindowsXP and Mac OS X users won’t needto install any dedicated driversoftware to connect thecamera to a computer.”’M1716Canon’s EOS System is an excitingly varied,ever-expanding range of interchangeable 35mm and digital cameras,lenses and accessories.New technologies are engineered to work with existing EOS cameras,so the camera and lenses you buy today will continue to grow in flexibility and keep you creatively motivated now and well into the future.DIGITAL REBEL AND EOS SYSTEM TAKE YOU AS FAR AS YOU WANT TO GO.Canon Speedlites offer professional-quality illumination for virtually any subject. Although simple to operate even for beginners, they are sophisticated tools; the more you know about the system, the more you can do with it. For full featured flash photography, the Digital Rebel is compatible with Canon’s entire line of EX-series Speedlites (550EX, 420EX and 220EX plus Macro Ring Lite MR-14EX and Macro Twin Lite MT-24EX for close-ups).You can also link several off-camera flashes to fire together wirelessly, with the optionalSpeedlite Transmitter ST-E2.Designed exclusively for the Digital Rebel, Battery Grip BG-E1holds two Battery Packs BP-511 or BP-512 for approximately double the shooting time,and can also operate on a single Battery Pack. The vertical shutter release makes shooting with the camera in a vertical position just as comfortable as shooting horizontally.LENS CHARTWorld-renowned Canon EF Lenses are favorites of professionals for their optical brilliance and endless versatility. The Digital Rebel accepts all of these lenses, more than 50 in total, from ultra wide-angle to super telephoto and everything in between, including fish-eye, macro and tilt-shift lenses.Designed exclusively for the Digital Rebel, the EF-S 18-55mm f/3.5-5.6is a highly portable lens that covers the standard zoom range of approx.28-90mm (in 35mm format)with smooth operation and superb resolution.Angle finder CAC Adapter KitACK-E2Charge Adapter/Car Battery Cable KitCR-560Remote Switch RS-60E3Semi-hard CaseEH-16LMacro Ring Lite MR-14EX200mm28mmSpeedlite 420EX Battery Grip BG-E1Wireless Remote Controller RC-1/RC-5OPTIONAL ACCESSORIESEF-S 18-55mm f/3.5-5.6Speedlite 550EX Speedlite 220EXMacro Twin Ring Lite MT-24EXEF 55-200mm f/4.5-5.6 II USM© Peter Read Miller19Viewfinder eyepieceDioptric adjustment knob NOMENCLATURETYPEType:Digital AF/AE SLRRecording Medium:Type I and II CF card Image Size: 22.7 x 15.1mm (0.89 x 0.59 in.)Compatible Lenses:Canon EF lenses including EF-S Lens. (Focal lengthconversion factor: Equivalent to approx. 1.6x indicated focal length compared to 35mm format.)Lens Mount: Canon EF mountIMAGING ELEMENTType:High-sensitivity, high-resolution, single-plate, color CMOS Pixels:Effective pixels: Approx. 6.3 megapixels Total pixels:Approx. 6.5 megapixels Aspect Ratio:2:3 (Vertical:Horizontal)Color Filter System:RGB primary color filterLow-pass Filter:Located in front of the imaging element, non-removable RECORDING SYSTEMRecording Format:Design rule for Camera File system (JPEG) and RAW. Exif 2.2compliant.Image Format:JPEG and RAWFile Size (on CF card):); JPEG: (1) Large/Fine: Approx. 3.1 MB (3072 x 2048), (2)Large/ Normal: Approx.1.8 MB (3072 x 2048), (3) Middle/Fine: Approx. 1.8 MB (2048 x 1360), (4) Middle/Normal: Approx. 1.2 MB (2048 x1360), (5)Small/Fine: Approx. 1.4 MB (1536 x 1024), (6) Small/ Normal: Approx. 0.9 MB (1536 x 1024); RAW: (7) Middle/Fine: Approx. 7 MB (3072 x 2048)Folder Setting:AutomaticFile Numbering:(1) Continuous numbering, (2) Auto resetProcessing Parameters:Standard parameters plus up to three custom processing parameters can be set Interface:USBWHITE BALANCESettings: Auto (Auto, daylight, shade, overcast, tungsten bulb, fluorescent light,flash), Manual (Custom: read off photo quality gray card or white subject, color temperature)VIEWFINDERType: Eye-level SLR (with fixed pentamirror)Coverage: Approx. 95% vertically and horizontally (Coverage against JPEG Large)Magnification: 0.8x (-1 diopter with 50mm lens at infinity)Eyepoint: 21mmBuilt-in Dioptric Correction:-3.0 - +1.0 diopter Focusing Screen:FixedMirror: Quick-return half mirror (Transmittance: reflectance ratio of 40:60, no mirror cut-off with lenses up to EF 600mm f/4)Viewfinder Information:AF points, AE lock, FE lock, AEB in progress, flash ready,improper FE lock warning, high-speed sync, flash exposure compensation,shutter speed, bulb, FE lock, processing data, aperture, exposure level (exposure compensation, manual exposure level, AEB level, flash exposure compensation,red-eye reduction lamp-on indicator), Max. burst during continuous shooting,AF/MF focus confirmation, CF card full, CF card error, no CF card Depth-of-field:Enabled with depth-of-field preview button Eyepiece Shutter:NoneAUTOFOCUSType: TTL-CT-SIR with AF-dedicated CMOS sensor AF Points:7AF Working Range:EV 0.5 -18 (at ISO 100)Focusing Modes:One-Shot AF, Predictive AI Servo AF, AI Focus AF(Automatically selects One-Shot AF or AI Servo AF), Manual focusing (MF)AF Point Selection:Automatic selection, manual selectionSelected AF Point Display:Superimposed in viewfinder and indicated on LCD panel.AF-assist Beam:Intermittent firing of built-in flash, effective range: approx.13.1 ft/4m at center, approx. 11.5 ft/3.5m at peripheryEXPOSURE CONTROLMetering Modes:Metering Modes: Max. aperture TTL metering with 35-zone SPC. (1) Evaluative metering, (2) Partial metering at center (approx. 9% of viewfinder), (3) Centerweighted average metering (in manual exposure mode)Metering Range:EV 1-20 (at 20ºC with 50mm f/1.4 lens at ISO 100)Exposure Control Systems:Program AE (shiftable), shutter-priority AE,aperture-priority AE, auto depth-of-field AE, full auto, programmed image control modes (Portrait, Landscape, Close-up, Sports, Night Portrait, and Flash OFF), E-TTL autoflash program AE, and manual.ISO Speed Range:Equivalent to ISO 100-1600Up to +/-2 stops in 1/2 or 1/3-stop increments (1) AEB (Auto exposure brack-eting). (2) Manual exposure compensation. (3) Flash exposure compensation.AE Lock:Operates in One-Shot AF mode evaluative metering when focus is achieved.Manual: Enabled with AE lock button. No AE lock in Basic Zone modes.SHUTTERType:Vertical-travel, mechanical, focal-plane shutter with all speeds electronically-controlled.Shutter Speeds:1/4000 to 30 sec. (1/3-stop increments), bulb, X-sync at 1/200 sec.Shutter Release:Soft-touch electromagnetic release Noise Reduction:None (Not necessary)Self-Timer:10-sec. delay.Remote Control:Remote Control with RS-60E3 terminal or Wireless Remote Controller RC-1/ RC5FLASHBuilt-in Flash:Type: Auto pop-up, retractable, built-in flashin the pentamirror hump.Guide No: 13/43 (at ISO 100 in meters/feet)Recycling time: Approx. 3 sec.Flash ready indicator: Flash-ready icon lights on in viewfinder Flash coverage: Up to 18mm focal length (equivalent to approx. 28mm in 35mm format)EOS-dedicated Speedlite:E-TTL auto flash with EX series Speedlite.PC Terminal provided.DRIVE SYSTEMDrive Modes:Single, Continuous, Self-TimerContinuous Shooting Speed:Approx. 2.5 fps (at 1/250 sec. or faster for all recording qualities)Max. Burst During Continuous Shooting:4 shotsLCD MONITORType:TFT color LCD monitor Monitor Size:1.8 inchesPixels:Approx. 118,000 pixels (Displayed pixels)Coverage:Approx. 100% (for JPEG images)Brightness Adjustment: 5-levels (settable with menu’s “LCD brightness”)IMAGE PLAYBACKImage Display Format:(1) Single image, (2) Single image with information, (3)9-image index, (4) Enlarged, (5)Auto playHighlight Alert:In the single image with information display mode, the highlight portions containing no image information will blink.IMAGE PROTECTION AND ERASEProtection: A single image can be protected or unprotectedErase: A single image or all images stored in a CompactFlash card can be erased if they are unprotected.MENUSMenu Categories:(1) Shooting Menus [8], (2) Playback Menus [4], (3) Setup Menus [14]LCD Monitor Language:English, German, French, Dutch, Danish, Finnish,Italian, Norwegian, Swedish, Spanish, Chinese (simplified), and Japanese. Firmware Updating:Enabled by the userPOWER SOURCEBattery:One Battery Pack BP-511/512 (lithium ion rechargeable battery)Number of Shots:DIMENSIONS AND WEIGHTDimensions (W x H x D): 5.6 x 3.9 x 2.9 in. / 142 x 99 x 72.4mm Weight:19.7 oz. / 560gWORKING CONDITIONSWorking Temperature Range:0 - 40°C / 32-104°F Working Humidity:85% or lessMicrosoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the United States and / or other countries, Macintosh is a registered trademark or trademark of Apple Computer Inc. in the United States and / or other countries. CompactFlash is a trademark of SanDisk Corporation. Microdrive is a trademark of IBM Corporation. Adobe Photoshop is a registered trademark of Adobe Systems Incorporated and its subsidiaries in each country. The other product and brand names appearing in this brochure are trademarks or registered trade-marks of their respective owners. TFT monitor images shown in this brochure are simulated.SPECIFICATIONS• All the specifications above are based on Canon’s testing and measuring standards.• The camera’s specifications and physical appearance are subject to change withoutnotice.System Chart18Compatible Operating Systems and Computer Environments* The TWAIN driver runs on Windows 2000 and Windows 98SE.。

Aluminium magnesium ←aluminium→silicon B ↑Al ↓Ga Appearance General properties Name,symbol,number aluminium, Al, 13Element category other metal Group,period,block 13,3,p Standard atomic weight 26.9815386(13) g·mol −1Electron configuration [Ne] 3s 2 3p 1Electrons per shell 2, 8, 3 (Image)Physical properties Phase solid Density (near r.t.) 2.70g·cm −3Liquid density at m.p. 2.375 g·cm −3Melting point 933.47K, 660.32 °C, 1220.58 °F From Wikipedia, the free encyclopedia(Redirected from Aluminum)Aluminium (UK:/ˌælj ʊˈm ɪniəm/(listen)a-lew-MIN -ee-əm [4]) or aluminum (US:/əˈlu ːm ɪnəm/(listen); seespelling below) is a silvery white and ductile member of theboron group of chemical elements. It has the symbol Al andits atomic number is 13. It is not soluble in water undernormal circumstances. Aluminium is the most abundant metalin the Earth's crust, and the third most abundant elementtherein, after oxygen and silicon. It makes up about 8% byweight of the Earth's solid surface. Aluminium is too reactivechemically to occur in nature as a free metal. Instead, it isfound combined in over 270 different minerals.[5] The chiefsource of aluminium is bauxite ore.Aluminium is remarkable for the metal's low density and forits ability to resist corrosion due to the phenomenon ofpassivation. Structural components made from aluminium andits alloys are vital to the aerospace industry and are veryimportant in other areas of transportation and building. Itsreactive nature makes it useful as a catalyst or additive inchemical mixtures, including ammonium nitrate explosives, toenhance blast power.Contents1Characteristics2Isotopes3Natural occurrence4Production and refinement5Recycling6Chemistry6.1Oxidation state +16.2Oxidation state +26.3Oxidation state +36.4Analysis7Applications7.1General use7.2Aluminium compounds7.3Aluminium alloys in structural applicationsPeriodic table 13Al 4/7/2010Aluminium - Wikipedia, the free ency…Boiling point2792K, 2519 °C, 4566 °FHeat of fusion10.71kJ·mol−1Heat of vaporization294.0kJ·mol−1Specific heat capacity(25 °C) 24.200 J·mol−1·K−1Vapor pressureP/Pa110100 1 k10 k100 kat T/K148216321817205423642790Atomic propertiesOxidation states3, 2[1], 1[2](amphoteric oxide)Electronegativity 1.61 (Pauling scale)Ionization energies(more)1st: 577.5kJ·mol−12nd: 1816.7 kJ·mol−13rd: 2744.8 kJ·mol−1Atomic radius143pmCovalent radius121±4 pmVan der Waalsradius184 pmMiscellaneaCrystal structure face-centered cubicMagnetic ordering paramagnetic[3]Electrical resistivity(20 °C) 28.2 nΩ·mThermal conductivity(300 K) 237 W·m−1·K−1Thermal expansion(25 °C) 23.1 µm·m−1·K−1Speed of sound (thinrod)(r.t.) (rolled) 5,000m·s−1Young's modulus70 GPaShear modulus26 GPaBulk modulus76 GPaPoisson ratio0.35Mohs hardness 2.75Vickers hardness167 MPaBrinell hardness245 MPaCAS registrynumber7429-90-5Most stable isotopesMain article:Isotopes of aluminiumiso NA half-life DM DE(MeV)DP265+26 Etched surface from a high purity(99.9998%) aluminium bar, size55×37 mm7.4Household wiring8History9Etymology9.1Nomenclature history9.2Present-day spelling10Health concerns11Effect on plants12See also13References14External linksCharacteristicsAluminium is a soft,durable,lightweight,malleable metalwith appearanceranging from silveryto dull grey,depending on thesurface roughness.Aluminium isnonmagnetic andnonsparking. It isalso insoluble inalcohol, though it can be soluble in water in certain forms. Theyield strength of pure aluminium is 7–11MPa, whilealuminium alloys have yield strengths ranging from 200 MPato 600 MPa.[6] Aluminium has about one-third the densityand stiffness of steel. It is ductile, and easily machined,cast,drawn and extruded.Corrosion resistance can be excellent due to a thin surfacelayer of aluminium oxide that forms when the metal is exposedto air, effectively preventing further oxidation. The strongestaluminium alloys are less corrosion resistant due to galvanicreactions with alloyed copper.[6] This corrosion resistance isalso often greatly reduced when many aqueous salts arepresent, particularly in the presence of dissimilar metals.Aluminium atoms are arranged in a face-centred cubic (fcc)structure. Aluminium has a stacking-fault energy ofapproximately 200 mJ/m2.[7]4/7/2010Aluminium - Wikipedia, the free ency…26Al trace 7.17×105y β+1.1726Mg ε-26Mg γ 1.8086-27Al 100%27Al is stable with 14neutronsAluminium is one of the few metals that retain full silvery reflectance in finely powdered form, making it an important component of silver paints. Aluminium mirror finish has thehighest reflectance of any metal in the 200–400 nm (UV) andthe 3,000–10,000 nm (far IR) regions; in the 400–700 nmvisible range it is slightly outperformed by tin and silver and inthe 700–3000 (near IR) by silver,gold, and copper.[8]Aluminium is a good thermal and electrical conductor, having 62% the conductivity of copper. Aluminium is capable of being a superconductor, with a superconducting critical temperature of 1.2kelvins and a critical magnetic field of about 100gauss (10milliteslas).[9]IsotopesMain article:isotopes of aluminiumAluminium has nine isotopes, whose mass numbers range from 23 to 30. Only 27Al (stable isotope) and 26Al (radioactive isotope,t 1/2 = 7.2×105y) occur naturally; however,27Al has a natural abundance above 99.9%.26Al is produced from argon in the atmosphere by spallation caused by cosmic-ray protons. Aluminium isotopes have found practical application in dating marine sediments, manganese nodules, glacial ice,quartz in rock exposures,and meteorites. The ratio of 26Al to 10Be has been used to study the role of transport, deposition,sediment storage,burial times, and erosion on 105 to 106 year time scales.[10]Cosmogenic 26Al was first applied in studies of the Moon and meteorites. Meteoroid fragments, after departure from their parent bodies, are exposed to intense cosmic-ray bombardment during their travel through space, causing substantial 26Al production. After falling to Earth, atmospheric shielding protects the meteorite fragments from further 26Al production, and its decay can then be used to determine the meteorite's terrestrial age. Meteorite research has also shown that 26Al was relativelyabundant at the time of formation of our planetary system. Most meteorite scientists believe that the energy released by the decay of 26Al was responsible for the melting and differentiation of some asteroids after their formation 4.55billion years ago.[11]Natural occurrenceSee also:Aluminium in AfricaIn the Earth's crust, aluminium is the most abundant (8.3% by weight) metallic element and the third most abundant of all elements (after oxygen and silicon).[12] Because of its strong affinity to oxygen, however, it is almost never found in the elemental state; instead it is found in oxides or silicates.Feldspars, the most common group of minerals in the Earth's crust, are aluminosilicates. Native aluminium metal can be found as a minor phase in low oxygen fugacity environments, such as the interiors of certain volcanoes.[13] It also occurs in the minerals beryl,cryolite,garnet,spinel and turquoise.[12] Impurities in Al 2O 3, such as chromium or cobalt yield the gemstones ruby and sapphire, respectively. Pure Al 2O 3, known as corundum, is one of the hardest materials known.[12]Although aluminium is an extremely common and widespread element, the common aluminium minerals are not economic sources of the metal. Almost all metallic aluminium is produced from the ore bauxite (AlO x (OH)3-2x ).Bauxite occurs as a weathering product of low iron and silica bedrock in tropical climatic conditions.[14] Large deposits of bauxite occur in Australia,Brazil,Guinea and Jamaica but the primary mining areas for the ore are in4/7/2010Aluminium - Wikipedia, the free ency…Bauxitedeposits of bauxite occur in Australia,Brazil,Guinea and Jamaica but the primary mining areas for the ore are in Ghana,Indonesia, Jamaica, Russia and Surinam.[15]Smelting of the ore mainly occurs in Australia, Brazil, Canada,Norway, Russia and the United States. Because smelting is an energy-intensive process, regions with excess natural gas supplies (such as the United Arab Emirates) are becoming aluminium refiners.Production and refinementAlthough aluminium is the most abundant metallic element in the Earth's crust, it is never found in free, metallic form,and it was once considered a precious metal more valuable than gold.Napoleon III, Emperor of France, is reputed to have given a banquet where the most honoured guests were given aluminium utensils, while the others had to make do with gold.[16][17] The Washington Monument was completed, with the 100 ounce (2.8 kg) aluminium capstone being put in place on December 6, 1884, in an elaborate dedication ceremony. It was the largest single piece of aluminium cast at the time, when aluminium was as expensive as silver.[18] Aluminium has been produced in commercial quantities for just over 100 years.Aluminium is a strongly reactive metal that forms a high-energy chemicalbond with oxygen. Compared to most other metals, it is difficult to extractfrom ore, such as bauxite, due to the energy required to reduce aluminiumoxide (Al 2O 3). For example, direct reduction with carbon, as is used toproduce iron, is not chemically possible, since aluminium is a strongerreducing agent than carbon. However there is an indirect carbothermicreduction possible by using carbon and Al 2O 3 which forms anintermediate Al 4C 3 and this can further yield aluminium metal at atemperature of 1900–2000°C. This process is still under development.This process costs less energy and yields less CO 2 than the Hall-Héroult process.[19] Aluminium oxide has a melting point of about 2,000 °C(3,600 °F). Therefore, it must be extracted by electrolysis. In this process, the aluminium oxide is dissolved inmolten cryolite and then reduced to the pure metal. The operational temperature of the reduction cells is around 950to 980 °C (1,740 to 1,800 °F). Cryolite is found as a mineral in Greenland, but in industrial use it has been replaced by a synthetic substance. Cryolite is a chemical compound of aluminium,sodium, and calcium fluorides: (Na 3AlF 6).The aluminium oxide (a white powder) is obtained by refining bauxite in the Bayer process of Karl Bayer.(Previously, the Deville process was the predominant refining technology.)The electrolytic process replaced the Wöhler process, which involved the reduction of anhydrous aluminium chloride with potassium. Both of the electrodes used in the electrolysis of aluminium oxide are carbon. Once the refined alumina is dissolved in the electrolyte, its ions are free to move around. The reaction at the cathode is:Al 3+ + 3 e − → AlHere the aluminium ion is being reduced. The aluminium metal then sinks to the bottom and is tapped off, usually cast into large blocks called aluminium billets for further processing.At the anode, oxygen is formed:2 O 2− → O 2 + 4 e −This carbon anode is then oxidized by the oxygen, releasing carbon dioxide:4/7/2010Aluminium - Wikipedia, the free ency…World production trend of aluminiumAluminium output in 2005O 2 + C → CO 2The anodes in a reduction cell must therefore be replaced regularly, since they are consumed in the process.Unlike the anodes, the cathodes are not oxidized because there is no oxygen present, as the carbon cathodes are protected by the liquid aluminium inside the cells. Nevertheless, cathodes do erode, mainly due to electrochemical processes and metal movement. After five to ten years, depending on the current used in the electrolysis, a cell has to be rebuilt because of cathode wear.Aluminium electrolysis with the Hall-Héroult process consumes a lot ofenergy, but alternative processes were always found to be less viableeconomically and/or ecologically. The worldwide average specific energyconsumption is approximately 15±0.5kilowatt-hours per kilogram ofaluminium produced (52 to 56MJ/kg). The most modern smeltersachieve approximately 12.8 kW·h/kg (46.1 MJ/kg). (Compare this to theheat of reaction, 31 MJ/kg, and the Gibbs free energy of reaction, 29MJ/kg.) Reduction line currents for older technologies are typically 100to 200kiloamperes; state-of-the-art smelters [20] operate at about 350kA. Trials have been reported with 500 kA cells.Electric power represents about 20% to 40% of the cost of producing aluminium, depending on the location of the smelter. Smelters tend to be situated where electric power is both plentiful and inexpensive, such as South Africa,Ghana, the South Island of New Zealand, Australia, the People's Republic of China, the Middle East,Russia,Quebec and British Columbia in Canada, and Iceland.[21]In 2005, the People's Republic of China was the top producer ofaluminium with almost a one-fifth world share, followed by Russia,Canada, and the USA, reports the British Geological Survey.Over the last 50 years, Australia has become a major producer of bauxiteore and a major producer and exporter of alumina.[22] Australiaproduced 62 million tonnes of bauxite in 2005. The Australian depositshave some refining problems, some being high in silica but have theadvantage of being shallow and relatively easy to mine.[23]See also:Category:Aluminium minerals RecyclingMain article:Aluminium recyclingAluminium is 100% recyclable without any loss of its natural qualities. Recovery ofthe metal via recycling has become an important facet of the aluminium industry.Recycling involves melting the scrap, a process that requires only five percent of theenergy used to produce aluminium from ore. However, a significant part (up to 15%of the input material) is lost as dross (ash-like oxide).[24] The dross can undergo afurther process to extract aluminium.4/7/2010Aluminium - Wikipedia, the free ency…Aluminium recycling codefurther process to extract aluminium.Recycling was a low-profile activity until the late 1960s, when the growing use ofaluminium beverage cans brought it to the public awareness.In Europe aluminium experiences high rates of recycling, ranging from 42% of beverage cans, 85% of construction materials and 95% of transport vehicles.[25]Recycled aluminium is known as secondary aluminium, but maintains the same physical properties as primary aluminium. Secondary aluminium is produced in a wide range of formats and is employed in 80% of the alloy injections. Another important use is for extrusion.White dross from primary aluminium production and from secondary recycling operations still contains usefulquantities of aluminium which can be extracted industrially.[26] The process produces aluminium billets, together with a highly complex waste material. This waste is difficult to manage. It reacts with water, releasing a mixture of gases (including, among others,hydrogen,acetylene, and ammonia) which spontaneously ignites on contact with air;[27]contact with damp air results in the release of copious quantities of ammonia gas. Despite these difficulties,however, the waste has found use as a filler in asphalt and concrete.[28]ChemistryOxidation state +1AlH is produced when aluminium is heated in an atmosphere of hydrogen. Al 2O is made by heating the normal oxide, Al 2O 3, with silicon at 1,800 °C (3,272 °F) in a vacuum.[29]Al 2S can be made by heating Al 2S 3 with aluminium shavings at 1,300 °C (2,372 °F) in a vacuum.[29] It quickly disproportionates to the starting materials. The selenide is made in a parallel manner.AlF, AlCl and AlBr exist in the gaseous phase when the tri-halide is heated with aluminium. Aluminium halides usually exist in the form AlX 3, where X is F, Cl, Br, or I.[29]Oxidation state +2Aluminium monoxide, AlO, has been detected in the gas phase after explosion [30] and in stellar absorptionspectra.[31]Oxidation state +3Fajans' rules show that the simple trivalent cation Al 3+ is not expected to be found in anhydrous salts or binary compounds such as Al 2O 3. The hydroxide is a weak base and aluminium salts of weak acids, such as carbonate,cannot be prepared. The salts of strong acids, such as nitrate, are stable and soluble in water, forming hydrates with at least six molecules of water of crystallization.Aluminium hydride, (AlH 3)n , can be produced from trimethylaluminium and an excess of hydrogen. It burnsexplosively in air. It can also be prepared by the action of aluminium chloride on lithium hydride in ether solution, but cannot be isolated free from the solvent. Alumino-hydrides of the most electropositive elements are known, the4/7/2010Aluminium - Wikipedia, the free ency…most useful being lithium aluminium hydride, Li[AlH4]. It decomposes into lithium hydride, aluminium and hydrogen when heated, and is hydrolysed by water. It has many uses in organic chemistry, particularly as a reducing agent. The aluminohalides have a similar structure.Aluminium hydroxide may be prepared as a gelatinous precipitate by adding ammonia to an aqueous solution of an aluminium salt. It is amphoteric, being both a very weak acid, and forming aluminates with alkalis. It exists in various crystalline forms.Aluminium carbide, Al4C3 is made by heating a mixture of the elements above 1,000 °C (1,832 °F). The pale yellow crystals have a complex lattice structure, and react with water or dilute acids to give methane. The acetylide, Al2(C2)3, is made by passing acetylene over heated aluminium.Aluminium nitride, AlN, can be made from the elements at 800 °C (1,472 °F). It is hydrolysed by water to form ammonia and aluminium hydroxide.Aluminium phosphide, AlP, is made similarly, and hydrolyses to give phosphine.Aluminium oxide, Al2O3, occurs naturally as corundum, and can be made by burning aluminium in oxygen or by heating the hydroxide, nitrate or sulfate. As a gemstone, its hardness is only exceeded by diamond,boron nitride, and carborundum. It is almost insoluble in water.Aluminium sulfide, Al2S3, may be prepared by passing hydrogen sulfide over aluminium powder. It is polymorphic.Aluminium iodide, AlI3, is a dimer with applications in organic synthesis.Aluminium fluoride, AlF3, is made by treating the hydroxide with HF, or can be made from the elements. It consists of a giant molecule which sublimes without melting at 1,291 °C (2,356 °F). It is very inert. The other trihalides are dimeric, having a bridge-like structure.When aluminium and fluoride are together in aqueous solution, they readily form complex ions such as[AlF(H2O)5]2+,AlF3(H2O)3, and[AlF6]3−. Of these,[AlF6]3− is the most stable. This is explained by the fact that aluminium and fluoride, which are both very compact ions, fit together just right to form the octahedral aluminium hexafluoride complex. When aluminium and fluoride are together in water in a 1:6 molar ratio,[AlF6]3− is the most common form, even in rather low concentrations.Organometallic compounds of empirical formula AlR3 exist and, if not also polymers, are at least dimers or trimers. They have some uses in organic synthesis, for instance trimethylaluminium.AnalysisThe presence of aluminium can be detected in qualitative analysis using aluminon.ApplicationsGeneral useAluminium is the most widely used non-ferrous metal.[32] Global production of aluminium in 2005 was 31.9 million tonnes. It exceeded that of any other metal except iron (837.5 million tonnes).[33] Forecast for 2012 is 42–45 million tons, driven by rising Chinese output.[34] Relatively pure aluminium is encountered only when corrosion resistance and/or workability is more important than strength or hardness. A thin layer of aluminium can be deposited onto a flat surface by physical vapour deposition or (very infrequently)chemical vapour deposition orHousehold aluminium foil Aluminium-bodied Austin "A40Sports" (circa 1951)Aluminium slabs being transported from the smelters other chemical means to form optical coatings and mirrors. When so deposited, a fresh, pure aluminium film serves as a good reflector (approximately 92%) of visible light and an excellent reflector (as much as 98%) of medium and far infrared radiation.Pure aluminium has a low tensile strength, but when combined with thermo-mechanical processing, aluminium alloys display a marked improvement in mechanical properties, especially when tempered. Aluminium alloys form vital components of aircraft and rockets as a result of their high strength-to-weight ratio. Aluminium readily forms alloys with many elements such as copper,zinc,magnesium,manganese and silicon (e.g.,duralumin). Today, almost all bulk metal materials that are referred to loosely as "aluminium", are actually alloys. For example, the common aluminium foils are alloys of 92% to 99% aluminium.[35]Some of the many uses for aluminium metal are in:Transportation (automobiles, aircraft,trucks,railway cars, marinevessels,bicycles etc.) as sheet, tube, castings etc.Packaging (cans, foil, etc.)Construction (windows,doors,siding, building wire, etc.)A wide range of household items, from cooking utensils to baseballbats, watches.[36]Street lighting poles, sailing ship masts,walking poles etc.Outer shells of consumer electronics, also cases for equipment e.g.photographic equipment.Electrical transmission lines for power distributionMKM steel and Alnico magnetsSuper purity aluminium (SPA, 99.980% to 99.999% Al), used inelectronics and CDs.Heat sinks for electronic appliances such as transistors and CPUs.Substrate material of metal-core copper clad laminates used in highbrightness LED lighting.Powdered aluminium is used in paint, and in pyrotechnics such assolid rocket fuels and thermite.Aluminium can be reacted with hydrochloric acid to form hydrogengas.Aluminium compoundsAluminium ammonium sulfate ([Al(NH 4)](SO 4)2),ammonium alumis used as a mordant, in water purification and sewage treatment, inpaper production, as a food additive, and in leather tanning.Aluminium acetate is a salt used in solution as an astringent.Aluminium borate (Al 2O 3 B 2O 3) is used in the production of glassand ceramic.Aluminium borohydride (Al(BH 4)3) is used as an additive to jetfuel.Aluminium foamAluminium bronze (CuAl 5)Aluminium chloride (AlCl 3) is used: in paint manufacturing, in antiperspirants, in petroleum refining and in the production of synthetic rubber.Aluminium chlorohydrate is used as an antiperspirant and in the treatment of hyperhidrosis.Aluminium fluorosilicate (Al 2(SiF 6)3) is used in the production of synthetic gemstones, glass and ceramic.Aluminium hydroxide (Al(OH)3) is used: as an antacid, as a mordant, in water purification, in the manufacture of glass and ceramic and in the waterproofing of fabrics.Aluminium oxide (Al 2O 3), alumina, is found naturally as corundum (rubies and sapphires),emery, and is used in glass making. Synthetic ruby and sapphire are used in lasers for the production of coherent light. Used as a refractory, essential for the production of high pressure sodium lamps.Aluminium phosphate (AlPO 4) is used in the manufacture: of glass and ceramic,pulp and paper products,cosmetics, paints and varnishes and in making dental cement.Aluminium sulfate (Al 2(SO 4)3) is used: in the manufacture of paper, as a mordant, in a fire extinguisher, inwater purification and sewage treatment, as a food additive, in fireproofing, and in leather tanning.Aqueous Aluminium ions (such as found in aqueous Aluminium Sulfate) are used to treat against fish parasites such as Gyrodactylus salaris .In many vaccines, certain aluminium salts serve as an immune adjuvant (immune response booster) to allow the protein in the vaccine to achieve sufficient potency as an immune stimulant.Aluminium alloys in structural applicationsMain article:Aluminium alloyAluminium alloys with a wide range of properties are used in engineeringstructures. Alloy systems are classified by a number system (ANSI) or bynames indicating their main alloying constituents (DIN and ISO).The strength and durability of aluminium alloys vary widely, not only as aresult of the components of the specific alloy, but also as a result of heattreatments and manufacturing processes. A lack of knowledge of theseaspects has from time to time led to improperly designed structures andgained aluminium a bad reputation.One important structural limitation of aluminium alloys is their fatiguestrength. Unlike steels, aluminium alloys have no well-defined fatigue limit,meaning that fatigue failure will eventually occur under even very smallcyclic loadings. This implies that engineers must assess these loads anddesign for a fixed life rather than an infinite life.Another important property of aluminium alloys is their sensitivity to heat.Workshop procedures involving heating are complicated by the fact that aluminium, unlike steel, will melt withoutfirst glowing red. Forming operations where a blow torch is used therefore requires some expertise, since no visual signs reveal how close the material is to melting. Aluminium alloys, like all structural alloys, also are subject to internal stresses following heating operations such as welding and casting. The problem with aluminium alloys in this regard is their low melting point, which make them more susceptible to distortions from thermally induced stress relief. Controlled stress relief can be done during manufacturing by heat-treating the parts in an oven, followed by gradual cooling—in effect annealing the stresses.The low melting point of aluminium alloys has not precluded their use in rocketry; even for use in constructing combustion chambers where gases can reach 3500 K. The Agena upper stage engine used a regeneratively cooled aluminium design for some parts of the nozzle, including the thermally critical throat region.Household wiringSee also:Aluminium wireCompared to copper, aluminium has about 65% of the electrical conductivity by volume, although 200% by weight. Traditionally copper is used as household wiring material. In the 1960s aluminium was considerably cheaper than copper, and so was introduced for household electrical wiring in the United States, even though many fixtures had not been designed to accept aluminium wire. In some cases the greater coefficient of thermal expansion of aluminium causes the wire to expand and contract relative to the dissimilar metal screw connection, eventually loosening the connection. Also, pure aluminium has a tendency to creep under steady sustained pressure (to a greater degree as the temperature rises), again loosening the connection. Finally,Galvanic corrosion from the dissimilar metals increased the electrical resistance of the connection.All of this resulted in overheated and loose connections, and this in turn resulted in fires. Builders then became wary of using the wire, and many jurisdictions outlawed its use in very small sizes in new construction. Eventually, newer fixtures were introduced with connections designed to avoid loosening and overheating. The first generation fixtures were marked "Al/Cu" and were ultimately found suitable only for copper-clad aluminium wire, but the second generation fixtures, which bear a "CO/ALR" coding, are rated for unclad aluminium wire. To adapt older assemblies, workers forestall the heating problem using a properly-done crimp of the aluminium wire to a short "pigtail" of copper wire. Today, new alloys, designs, and methods are used for aluminium wiring in combination with aluminium termination.HistoryAncient Greeks and Romans used aluminium salts as dyeing mordantsand as astringents for dressing wounds;alum is still used as a styptic. In1761Guyton de Morveau suggested calling the base alum alumine. In1808,Humphry Davy identified the existence of a metal base of alum,which he at first termed alumium and later aluminum (see Etymologysection, below).The metal was first produced in 1825 (in an impure form) by Danishphysicist and chemist Hans Christian Ørsted. He reacted anhydrousaluminium chloride with potassium amalgam and yielded a lump of metallooking similar to tin.[37]Friedrich Wöhler was aware of theseexperiments and cited them, but after redoing the experiments of Ørstedhe concluded that this metal was pure potassium. He conducted a similar。

j. am. chem. soc.的文章类型-回复首先，需要明确的是，j. am. chem. soc. 是《美国化学学会杂志》（Journal of the American Chemical Society）的简称。

作为一个高影响力的学术期刊，它涉及的文章类型非常广泛，覆盖了化学领域的各个方向。

下面以中括号内的内容为主题，我们来一步一步回答和解析这个问题。

[文章类型]：以这个主题为基础，我们可以选择一种比较通用的文章类型进行分析，例如综述文章（review article）。

综述文章通常对某个领域的最新进展和研究成果进行总结和评述，把相关文献进行归类整理，可以为该领域的学者提供一个全面的概览及从中获得灵感和启发。

在综述文章中，我们可以对该主题进行全面的研究回顾、对比、综合和分析，以期帮助读者了解并深入探讨该主题。

下面是一份可能的文章大纲：Ⅰ. 引言A. 引入主题：介绍[文章类型] 这个主题的研究背景和意义B. 论述目的：说明本文的目的和构成Ⅱ. 研究历史与进展A. 回顾过去：通过文献回顾，介绍过去在[文章类型] 方面的研究和发展情况B. 当前挑战：讨论目前研究领域的挑战和问题Ⅲ. [文章类型]方法与技术A. 介绍常用的[文章类型] 实验方法和技术B. 分析这些方法和技术的优缺点Ⅳ. [文章类型]应用与前景A. 阐述[文章类型] 在不同领域的应用案例B. 展望[文章类型] 的未来发展方向和可能的研究热点Ⅴ. 结论A. 总结本文的主要内容和观点B. 强调[文章类型] 的重要性和潜在的贡献在这份大纲的基础上，我们可以逐步展开文章内容，提取相关文献进行综述，并且可以加入自己的观点和分析。

总体而言，一篇关于[文章类型] 主题的综述文章应该具备以下特点：全面回顾、系统综合、观点独特、观点支持。

通过这样的文章，我们可以向读者传达对该主题的全面理解和深入见解，并为进一步研究和创新性思考提供思路和基础知识。

需要注意的是，以上仅仅是对一种可能的文章类型进行解析和概述，并不能代表所有的j. am. chem. soc. 文章类型。

Material 材料wrong thickness 厚度不良Aluminum 铝wrong rating 规格外Brass 铜wrong process 加工错误Stainless steel 不锈钢wrong hardness 厚度不良Wood 木wrong finish 加工错误Cloth 布料wrong dimension 尺寸不良Polycarbonate (PC) wrong depth v-cut 深度不良PVC wrong angle 角度不良Polyester (PET) whiten 白化Nameplates & ornaments 铭板及饰物white spot 白点Finish 表面处理wet styron foam 保丽龙潮湿Plating 电镀weld line 结合线Anodizing 电解weak seal 溶著不良Erode 腐蚀warp 变形Etching 铜板刻画UV drying 紫外线干燥Bronzing 烫金uneven paint 涂装不良Diamond cutting 钻石切割ultimate adhesion 最高的黏性Embossing 冲凸UL 一种美国的认证Polyurethane Doming 滴塑transparent colors 透明颜色Polishing 上光/ 抛光transparency透明度Printing effects 印刷效果translucency 半透明3-D 立体效果transfer tape 双面背胶4 color Process 4色印刷Tooling mark 模具伤Tolerance 公差Title 职称Tight tapping 攻牙不足(孔小)Tight assembly 嵌合不良(紧)Thickness 厚度Textured 咬花Texture peel off 咬花脱落Text incorrect, missing 文字不正确, 丢失Text illegible 印刷文字模糊,不清楚Terminating tails尾部规格Temp 温度Telephone 电话Tear 裂缝Tactile 手感Tack 粘性Switch 开关Subsurface printing 背面印刷Substrate被印刷物Streak in window视窗条纹Sticky pointer 指针卡住Stain 沾染Spectrum 光谱Texture 咬花底纹specify 标示Luminescent 夜光/ 发光的solvent 溶剂Chrome 铬色smeary streaks 脏的条纹Post Decoration 后饰过程small hole 孔径小Vacuum plating 真空电镀slip sheeting 隔纸放于两张材料中间Silkscreen printing 网版印刷sink mark 缩水Hot stamping 热冲床short circuit 短路Pad printing 转印shortage 数量不足Off-set printing 平版印刷shielding terminated through 防干扰设计路径Impact 冲击shelf life 保存期限Coating 表层shear adhesion 胶的粘性Computer Sensor Piloting 数位定位系统service temperature 材料的温度限制Computerized Auto Punch Press 电脑冲床serial number 序列号Lenses 视窗面板separate tab 分立3D profiles 3D立体面板self adhesive 背胶Clean-cut edge 加工成平面selective texture 选择质地Selective texture 选择性咬花scratch 刮伤Anti-glare coatings 防炫层scrape 划伤PVD coatings PVD 涂装表面处理scoring 半切Forming 塑型scattered paint 涂装分散Tool fabrication 工装制造saturation 浸透,饱和Standard injection 一般射出成型satin 缎纹Clean room injection 无尘射出rusty 生锈的Stamping 冲床reverse printing 反面印刷Spray painting 喷漆resistance 电阻/ 抵抗Assembly 组装repeatability 重复性Color Spectrometer 对色仪release liner 离形纸Environmental tester 环境测试机reject 不合格品Hub caps & accessories 轮圈中心盖及配件register 定位Plastic particle 塑胶粒子reflection 反射/ 折射High and low pressure aluminum casting 高低压铝铸件Forge aluminum 铸铝/ 伪造铝reflectance 反射率/反射系数Accelerated aging 加速老化quantity 数量Accuracy 精确化punch mark 冲孔痕/ 刻痕Acrylic 压克力prototype required 所需样品Adhesion 附着力proof [印刷] 校样Adhesive 背胶precision 精确性Application 应用poor welding 焊接不良Approval 批准/确认poor silk print 文字印刷不良Artwork 稿件/底片poor packing 包装不良Black spot 黑点poor insulation 绝缘不良Back traces 背面痕迹poor gate cut 注入口修剪不良Background 底色In Mold Decoration (IMD) 预印模内装饰射出Zinc die- cast 锌印模压铸Gliders bronze 滑行青铜Precious metal 贵金属Chrome plated 镀铬Pressure sensitive adhesive 力敏型背胶Poured urethane 浇铸聚氨脂Residue 残余物Contaminate 污染物Isopropyl alcohol 异丙醇Tensile machine 拉伸机器Discoloration 异色Delaminating 分层,分叶Beltline 一贯作业生产系统Saturate 浸透Stopwatch 计时表Brushed 拉丝Overlay 面板Mold release 脱模剂Regrind resins 回收料Hot tip 热泄露Hot runner system 热运作系统(热胶道)Polyethylene 聚乙稀Pinhole 针洞Pin outs 线路安排Pin outs specified by customers 顾客指定线路安排Perception 理解,感觉Peel off 脱落Peel adhesion 离形纸或保护膜的黏性Pcb information 线路板规格Parameters 参数Pantone matching system- pantone 色票Paint/ ink adhesion 油漆/油墨附着力Oxidized 氧化Overlay information 面板规格Out of specification 规格外Other requirements 其他要求/备注Orange skin 麻面(麻点)Operator 操作者Open circuit 断线Opaque colors 不透明色Opacity 不透明性Op voltage (操作)电压offset printing 平版印刷offset 偏移off registration 材料错误observing conditions 观测状况non- simultaneous 无法同步作用Nomenclature 术语,命名法no V-cut 无V-CUTno tapping 无攻牙no hole 无孔no function 功能无作用Munsell color system 一种册颜色的色票matrix 矩阵mounting surface 背附着面材质molding mark 成型伤missing Din Tag 无现品表mixed parts 混装missing process 加工不当missing insulation 无绝缘胶Metallized film 金属处理的膜Metal 金属Memory 弹回性Membrane switch 薄膜开关Melamine 三聚氰氨Matte 消光,无光泽, 不光滑的。

Instructions to AuthorsGeneral rules1.Bioscience,Biotechnology,and Biochemistry(Biosci.Biotechnol.Biochem.)publishes previously unpublished papers in the variousfields mentioned in its name.2.Manuscripts will be dated as‘‘received’’on the dayof their receipt by the Society and as‘‘accepted’’on the day when they are accepted for publication.The manuscripts that do not conform to the journal instructions would not be accepted.3.The copyright of the material published in thejournal is held by the Society.4.Manuscripts must be in English.5.All authors of a manuscript must have agreed to itssubmission and are responsible for its content.They must also have agreed that the corresponding author has the authority to act on their behalf in all matters pertaining to the publication of the manuscript. 6.With the initial submission,authors must submit astatement confirming that the paper has not been previously published elsewhere in any language and is not currently under consideration by any other publication.7.By publishing,the authors agree that any materialnewly described in the paper will be made available for noncommercial purposes in a timely fashion and at a reasonable cost to members of the scientific community.8.In manuscripts describing research on humans,itshould be stated whether the study complied with the code of ethics of the World Medical Association (Helsinki Declaration of1964,as revised in2002).Reports of research on animals should state whether the protocol was approved by the appropriate com-mittee of the institute where the research was carried out in line with the guidelines for the care and use of laboratory animals.Manuscripts that do not conform to the specifications of the guidelines will not be accepted for publication by the Society. Categories of papersThe Journal publishes papers in the categories of Regular Papers,Communications,Notes,and Re-views.All papers must be original.Regular PapersRegular Papers should describe valuable new informa-tion and should be submitted in theirfinal complete form. CommunicationsCommunications should describe an importantfinding or conclusion that is of particular interest,in order to justify the publication of the paper as a preliminary report.As a rule,communications should not exceed three printed pages.NotesNotes can describe afinding in a specializedfield,a new experimental method,or something similar,which might not be suitable for publication as a Regular Paper but needs to be published.Notes should not exceed three printed pages.ReviewA Review should be on a topic of any subject that is within the scope of the journal.The publication of Reviews is by invitation only;a potential author for Reviews is contacted by one of the Editors.The submitted manuscripts will be reviewed by an Editor and reviewers.Reviewing process1.An editor is assigned to manage the reviewingprocess of each manuscript and is chosen on the basis of the researchfield to which the paper is a contribution.The editor then selects two or more referees to evaluate the manuscript,and subsequent-ly,makes afinal decision on the suitability of the paper based on the opinions of the referees.2.The authors should provide clear responses to anycomments or questions of the editor.The revised manuscript and the authors’responses should be sent directly to the editor-in-charge.If a manuscript is not returned to the editor within three weeks(except for reasons accepted by the editor),it will be assumed that the paper has been withdrawn by the authors.If the authors decide to withdraw their paper from consideration for publication,they should inform the editor of the same.3.When the editor decides to accept a manuscript,it will be sent for English language editing by a rewriter selected by the Society.The edited manu-script will be returned to the authors to check the meanings of the revised sentences.The retyped manuscript should be returned to the Society.The author may be charged in case of extensive rewriting.Preparation of manuscripts1.General1.1Manuscripts should contain clear and accurateaccounts of research.Unnecessary repetition(byduplicating the results infigures and tables or datain the text and a table)should be avoided.Timesfont is preferred.Do not use boldface print forsentences.1.2If the manuscript has not been prepared in thecorrect format,it may be returned for revision.Refer to the recent issues of this journal whilepreparing manuscripts and follow the same or-ganization and style.1.3The manuscript should be prepared on a wordprocessor using the A4(210Â297mm)pagesetting.1.4The manuscript should be typed with margins notless than3cm wide on all sides.A page should betyped such that it contains60characters,includingspaces,on each line,with28lines on a page.InBiosci.Biotechnol.Biochem.,2012(1)this format,four pages of a manuscript will beequivalent to one printed page in the journal.Themanuscript should be typed in a font not smallerthan12points.1.5Manuscripts should be typed only on one side ofthe paper.1.6Do not justify the margins(do not make a straightright margin).Start each paragraph with anindentation offive spaces.1.7Do not divide words at the right margin.1.8Mark the desired position of tables andfigureswith a note in red ink at the right margin using afunction of word processor.1.9Use word processor’s functions to apply italics,boldface,and small capitals.(However,do not useboldface for the abstract.)If this is not possible,indicate italics with a single underline,boldfacewith a wavy underline,and small capitals witha double underline.Do not italicize a word andunderline it.1.10All pages must be numbered at the center of thebottom margin,starting with the title page.1.11Add line numbering throughout the document,beginning with the number1on each page.1.12Supplemental information(Figures,Tables,etc.)can be added as Supplementary Materials(RegularPaper or Communication).The Supplemental of anaccepted manuscript should basically be madepublic through the Internet.See Tips of‘‘Guidefor Submission(for non-Japanese authors).’’2.Form of papers2.1Regular Papers must be divided into sections inthe following order:(1)Abstract:Use no more than150words,(2)Key words:Write up tofive key words following the abstract,using words or phrases that best define the contents of the paper.Avoid words of broad application that would not be useful in information retrieval,(3)Introduc-tion,(4)Materials and Methods,(5)Results,(6) Discussion:Alternatively,a combined Results and Discussion section may be prepared,(7)Refer-ences,(8)Tables,(9)Figure legends,and(10) Figures.Materials and Methods may be placed before References as Experimental.2.2Communications should not be divided intosections.The abstract should not exceed100 words,and up tofive key words should be provided.The manuscript,including tables,figure legends,andfigures,in that order,should not exceed12pages(no longer than3pages when printed).2.3Notes should not be divided into sections.Theabstract should not exceed60words,and up tofive key words should be provided.The manuscript, including tables andfigures(which should not number more than three,taken together),should not exceed6pages(not more than three printed pages).3.Title page and key words3.1The order and contents of the title page,numberedpage1,should be as follows:1)A running title;2)Title of the article;3)Full names of the authors;4)Names and complete addresses of Institution wherethe research was carried out.5)Footnote containing the phrase‘‘y To whomcorrespondence should be addressed(use the dagger mark)’’along with fax and e-mail address of the corresponding author.If the affiliation(s) where the work was carried out differ from the present affiliation(s)of the author(s),provide the present address of the author for mailing purposes.6)Complete list of abbreviations in an alphabeticalorder and the words or phrases they represent.Do not list the approved abbreviations(see below).The content of the cover page can extend to page2.However,in this case,the text will begin on page3.3.2The title should be a concise statement of thearticle’s major contents.It should not include abbreviations(with the exception of those listed below in sections10and11and in the tables)or chemical formulae.3.3A running title,which must be an abbreviatedversion of the title,should appear at the top of every printed page.It should not exceed60 characters,including monly used abbreviations(such as‘‘ATP’’),simple chemical structures(such as‘‘O2’’),and the short form of binomial Latin names for organisms(such as ‘‘E.coli’’)may be used(see sections10and11and the tables below).3.4All tables andfigures should be numbered in theorder of their appearance,e.g.,Table2and Fig.4.However,the word‘‘Figure’’should not be abbreviated at the start of a sentence.3.5References in the text.The references should benumbered in the order of their appearance in the text,and the numbers in the text should be superscripted(e.g.,1Þor1{3Þ)after a mention of the contents or author(s).3.6References not(yet)available.References toarticles submitted for publication but not accepted, unpublished articles,or personal communications should not be included in the reference list.Such citations should be inserted in parentheses at appropriate places in the text.Examples:(Kornberg A,personal communication)(Kaneko R and Sueoka N,unpublishedresults)3.7In the text,only the family names of the authorsmust be used,unless initials are required in order to avoid confusion among authors sharing same family names.If a reference includes two authors, both the authors’names should be mentioned.If there are three or more authors,use‘‘et al.’’after thefirst author’s name.3.8Abbreviations and symbols that require explana-tion should be used as sparingly as possible(see sections10and11below).Define such abbrevia-tions at theirfirst occurrence in the text,and provide the abbreviation or symbol in parentheses.List all such abbreviations on the title page under the heading‘‘Abbreviation’’or‘‘Abbreviations.’’Do not use the nonstandard abbreviations(those not listed in sections10and11and tables below) in the title,running title,or abstract.(2)3.9In the case of a footnote,mark the relevant part inthe text with an asterisk,and type an unbroken line after the last line of the text on that page.Type the footnote below that line.In case more than one footnote appears on a page,use different numbers of asterisks to indicate different footnotes.4.References4.1All references cited should have individual refer-ence numbers.4.2References should be numbered in the order oftheir appearance in the text.4.3With regard to authors’names,the family namefollowed by the initial(s)should be provided in the reference list.List all authors.List thefirst and last pages,and the year of publication in parentheses.See examples.a)References to journal articlesProvide the name of the journal,the volumenumber,thefirst and last pages of the article,andthe year of publication(see examples below).Abbreviate journal names as in Biological Ab-stracts(BIOSIS)or Chemical Abstracts.Italicizethe journal name,and provide the volume numberin boldface type.For reference to a journalpublished in Japanese,write the full name of thejournal in italicized letters,and mention‘‘inJapanese’’in parentheses after the journal name.When an article has been accepted,give the nameof the journal in which it will appear,followed by‘‘in press.’’If the volume number,pages,and theyear of publication are available later,add thisinformation during the revision of the manuscriptor galley proof.1)Hoshino T,Kobayashi K,Ishibashi E,and HashimotoS,Biosci.Biotechnol.Biochem.,59,602–609(1995).2)Sasaki K,Iwanaga C,Watanabe M,Suzuki K,Hamaoka T,and Kondo S,Nippon No¯geikagakuKaishi(in Japanese),70,1103–1116(1996).3)Sue M,Miyoshi H,and Iwamura H,Biosci.Biotechnol.Biochem.,in press.b)References to books4)Lenton JR and Appleford NEJ,‘‘Gibberellins,’’eds.Takahashi N,Phinney BO,and MacMillan J,Springer-Verlag,New York,pp.125–135(1990).c)References to patents5)Kunstman MP and Prote JN,U.S.Patent,3803306(Apr.9,1974).6)Yamaguchi H,Sato S,and Takada K,Japan KokaiTokkyo Koho,85259190(Dec.21,1975).5.Tables5.1Tables should be numbered consecutively withArabic numerals as Table1,Table2,and so on.Each table should appear on a separate page of the manuscript.5.2The title of the table should explain its contents.Tables should be self-explanatory.Further,the data provided in Materials and Methods or tables orfigures should not be repeated;instead,the reader should be referred there.5.3Use abbreviations(those used in Chemical Ab-stracts)and words or short phrases to label each column and row in the table.5.4The width of the table should be in considerationwith the width of a full page of the journal,i.e., 120spaces or the width of a column,i.e.,60 spaces.6.Figures6.1Original artwork or a clear copy of the originalartwork of the authors will be used for printing.Unsuitablefigures will be returned to the authors for revision.6.2Eachfigure should appear on a separate page of themanuscript.Allfigures should be numbered(e.g., Fig.1)near the bottom edge along with the name of thefirst author.The top of thefigure should be marked,if necessary.6.3Allfigure legends should be provided on a separatepage,not on the page with thefigure.The legends should be numbered and self-explanatory.Further, data provided in Materials and Methods or in the otherfigure legends should not be repeated but merely referred to.Leave a line space between the caption and the explanation of eachfigure,and two line spaces between the legends of differentfigures.6.4Use white paper measuring210Â297mm for thefigures.However,thefinal size of thefigures will be decided by the Society.6.5Leave at least a3-cm margin on all sides of thefigure.6.6Both the x-and y-axes offigures should be markedwith scale and numbers.Letters and numerals should be of a size such that it would permit reduction without loss of legibility.6.7ThesymbolsÂcan be used in this order infigures to plot the results of measurements.Lines such as——,ÁÁÁÁÁÁ,——,and can also be used.Do not draw a smoothed line without plots of the actual results.7.Photographs7.1All photographs should be numbered and treated asfigures.7.2The size of the photographs may be reduced forprinting,similar tofigures(see section6.4above).However,on the request of the authors,electron micrographs will not be reduced in size,provided they can be printed on one page.A bar should be included to show the scale for all photomicro-graphs.7.3If a color photograph is to be printed in black andwhite,please provide a black-and-white print. 8.Structural formulae8.1For the representation of structural formulae,referto the directions provided for the preparation of figures(sections6.1and6.4).8.2If a structural formula is provided to show simplythe structure of a compound,which is the subject of the paper,no numbers or legends are required;however,if it explains the steps in a reaction,the formulae should be numbered asfigures or Scheme 1,Scheme2,etc.,and otherwise treated asfigures (see section6).8.3The size of a structural formula is decided in thesame manner as that of afigure.(3)9.EquationsWrite equations as follows.(a)i a¼650nD1=2cm2=3t1=6(for an equation on a single line)(b)E a¼E0ÀðRT=nFÞlnða=a0Þ10.UnitsThe Syste´me International d’Unite´s(SI)shouldbe used for physical quantities,but non-SI units(e.g.,liter,h)can also be e unitsaccording to the list provided in Table1.Differentsystems of units should not be used in the samemanuscript(e.g.,‘‘kg/cm2’’and‘‘bar’’).11.Abbreviations and symbols for chemical com-pounds11.1The common abbreviations provided in the listbelow,as decided by an international agreement,need not be defined at theirfirst occurrence.TheSociety accepts the use of the abbreviationsprovided in Table2without any definition.11.2Follow the rules and recommendations of theIUPAC-IUB Commission*for the abbreviation ofcompound names in thefield of biochemistry.Inaddition to the common name of an enzyme,thename recommended by the International Union ofBiochemistry**should be provided.The EnzymeCommission(EC)number should be provided atthefirst occurrence of the enzyme in the text. 11.3The authors should select unambiguous abbrevia-tions or use atomic symbols for chemical com-pounds mentioned in the description of the ex-periments,including reagents,solvents,and sim-ple functional groups,in order to prevent mis-understanding.In the name of a single compound,symbols,abbreviations,and chemical namesshould not be mixed.Correct examples:Me,Et,Pr,Bu,Ph,AcOH,Bz,Ar,X,CO2H,iso-BuOH 11.4Follow the rules of IUPAC for the nomenclatureof organic and inorganic compounds.*11.5Use names,not chemical formulae,when writingthe name of a chemical in the text.11.6Radioactive compounds.The isotopic prefix inthe name of an isotopically labeled compoundshould be provided in square brackets immedi-ately before the part of the name to which it refers.Example:sodium[14C]formate.When the posi-tion(s)of a radioactive label is known,representthe compound as[2,3-3H]alanine.In case ofuniform labeling,represent the compound as[U-14C]glucose.When the labeled material is nota chemical compound,represent the compoundwithout square brackets,e.g.,14C-ribosomes or32P-labeled.11.7Naming of chemical compoundsa)Italics should be used for o-(ortho),m-(meta),p-(para),n-(normal),sec-(secondary),tert-(tertiary),cis-,trans-,gauche-,erythro-,threo-,syn-,and anti-.Italics should also be used for thespecification of optical activity or inactivity suchas d-(dextro),l-(laevo),dl-(racemic),and i-(inactive),and for substituted atoms such as N-,O-,and C-.b)Small capitals D-,L-,and DL-are used to expressthe configuration of sugars and amino acids.Absolute configurations of asymmetric centersare written as(R)and(S)or as(E)and(Z)forgeometric isomers.For the description of therelative configuration in ring compounds,cis andtrans are used.12.Scientific names of organismsThe binomial Latin names for organisms shouldbe written in italics.13.Numbers13.1Numbers should be written as Arabic numerals.In sentences,write‘‘zero’’not‘‘0.’’13.2When a number begins a sentence,it should bespelled out along with its unit of measurement(e.g.,Five grams).Units that are not immediatelypreceded by a numeral(e.g.,per milliliter)shouldbe spelled out.Decimal numbers should berepresented as‘‘0.1234.’’A multiplication symbol‘‘Â’’should be used, e.g.,‘‘6:02Â1023’’not‘‘6:02Á1023.’’Numbers greater than four-digitnumbers should be separated by commas everythree places.However,four-digit numbers neednot be separated by commas(e.g.,IR wavenumber as given in section14).14.Description of the results of analytical testsThe results of analytical tests should appear inthe Materials and Methods section.Write in asimple form,using abbreviations for the names ofmethods,units,values,and assignments.½ 20DÀ35 (c1.0,CHCl3)Uv max(EtOH)nm ("):238(10,050),288(9880)IR max(nujol)cmÀ1:1762(O–C=O),1640(C=O)NMR H(CDCl3):2.25(2H,quartet,J¼7Hz,O–C H2–Me),4.28(2H,N H2).When the chemical shifts are shown with d,show the nuclei measured as H, c etc.Whenthere is no chance of misunderstanding,d alonecan be used.ORD(c0.118,MeOH)½ 31(nm):À21 (589),À38 (400)X-ray2 Cu-K :18.8 (d¼4:72A˚),20.5 (d¼3:65A˚)MS m=z:154(Mþ),139(MþÀCH3).Give the ionization conditions for CIMS,EIMS,FABMS,etc.HRMS m=z(Mþ)Calcd.for C29H26O10:534.151.Found:534.150.Elemental analysis:Write as‘‘Found:C,70.01;H,8.83;N, 3.68.Calcd.For C22H23O4N:C,70.36;H,8.86;N,3.73.’’In the descriptions of organic chemistry,pro-vide either the results of elemental analysis of all*‘‘Biochemical Nomenclature and Related Documents,’’2nd ed,Portland Press,London,1992.Also http://www.chem. /iupacWbibliog/white.html(December2002)**‘‘Enzyme Nomenclature1992:Recommendations of the Nomenclature Committee of the International Union of Biochemistry and Molecular Biology,’’Academic Press,New York,1992.Also .iubmb/enzyme/ (December2002)(4)novel compounds or high-resolution mass spectraldata.In the descriptions of structural analysis,include the data on which the identification ofthe molecular structure was based(the results ofelemental analysis and high-resolution mass spec-tral data).In the case of compounds for which ahigh-resolution mass spectrum cannot be created,include the data used for the calculation of themolecular weight.Such data must be omittedfrom Communications because of the restrictionson the word count.This data should be providedin a footnote.15.Superscript and subscriptFor superscripts and subscripts,use the wordprocessor’s functions.16.DNA sequencesIn papers describing newly sequenced DNA,the accession number and the database name(DDBJ,etc.)in which the sequence has beendeposited must be provided.This informationshould be placed in parentheses at thefirstmention of the sequence in the abstract and text.Similarly,mention databases such as the PDB andCCDC in which new crystallographic data ofatomic coordinates have been deposited.Submission of manuscriptsProcedure for electronic submission to Biosci.Biotech-nol.Biochem.1.Preparefiles and requisite information in advance.Thefiles of the manuscript and information of authors.For preparation,follow the instructions provided in‘‘User Tutorials(for Author).’’Because the manner of using Electric Submission changes properly,it would be better to confirm‘‘User Tutorials’’beforehand.2.It is highly desirable that you put line numbers inyour e line numbering function of your word processing software.(It will help expedite the electronic reviewing process).3.The submitting author is requested to input or selectfollowing information.a)Create accountInput the information of the submitting author:name,institution,address,e-mail,and fax number.b)Submitting manuscript1)Select the type of paper.2)Input the title and running title(running head).3)Input abstract.The abstract should not exceed150words(Regular Paper),100words(Com-munication),or60words(Note).4)Input key words,subject category,and classi-fication of researchfields(one or two).5)Input authors’information.6)If References include a paper in press or anothermanuscript related to the manuscript to besubmitted is under submission,upload itsfileas a cover letter.7)Input the numbers of the pages of text,figures,figure legends,and tables.8)Check the box‘‘membership,’’if you are amember of the Society.Do not forget to inputthe membership number.If the membershipnumber is not inputted,the page charge will notbe discounted because you will be treated as anon-member.9)Check the box‘‘Statement of originality’’afterreading the statement therein.10)Upload the manuscriptfiles.Procedures during publication1.After the accepted manuscript has been returnedfrom English editing,a complete retyped manu-script(title page,text,reference list,tables,figure legends,andfigures)should be sent to the Society.When high resolution photographs cannot be sub-mitted online,mailing is accepted.In this case,the author should contact the secretariat and thereafter the instructions will be followed.2.The corresponding author will receive a galleyproof for one revision.Only printing errors and page numbers of those articles that were in press but have been published now should be corrected.Any other additions and deletions are not permitted.In certain cases,with the permission of the Editor-in-chief,a short addition may be made in the form of a‘‘Note Added in Proof.’’In that case,the additional cost will be borne by the authors.3.When a manuscript is accepted,the correspondingauthor is required to sign the Copyright Transfer Agreement and send it to the editorial office fax,pdf attachment,or postal mail.4.If the galley proof is not returned before thedeadline,the paper may not be printed.5.Page charges and the price of reprints are as listedin the table below.The member fee is applied to a manuscript whose corresponding author has com-pleted membership registration by submission and has provided his/her membership number.The actual expenses for the color print are to be paid by the author.6.The offprints are sold in units of50.They should beordered on the order sheet provided by the Society.Return the order with the galley proof.7.If an important error is discovered after publication,it should be brought to the attention of the editorial section so that an erratum can be published.If the error was made by the author,the costs of publication of the erratum will be charged to the author.(5)(6)Page Charges and Price of ReprintsI.Page Charges(standard)1)Regular Papers and NotesMember of JSBBA Non-memberPrinted pages JPY¥Printed pages JPY¥14,20018,40028,400216,800312,600325,200416,800433,600521,000542,000625,200650,400729,400758,800833,600867,200937,800975,6001042,0001084,0001146,2001192,4001250,40012100,8001354,60013109,2001458,80014117,6002)CommunicationsMember of JSBBA Non-memberPrinted pages JPY¥Printed pages JPY¥18,400116,800216,800233,600325,200350,400433,600467,200542,000584,000650,4006100,8003)Color Printing:Add JPY¥50,000per a color page4)Supplementary MaterialsAdd JPY¥4,200per onefile(Member of JSBBA)JPY¥8,400per onefile(Non-membber)II.Price of Reprints(Postage is not included)Printed Copiespages501001502002503001–2JPY¥3,780JPY¥5,040JPY¥7,560JPY¥10,080JPY¥12,600JPY¥15,1203–47,56010,08015,12020,16025,20030,2405–611,34015,12022,68030,24037,80045,3607–815,12020,16030,24040,32050,40060,4809–1018,90025,20037,80050,40063,00075,60011–1222,68030,24045,36060,48075,60090,72013–1426,46035,28052,92070,56088,200105,840 It is possible to pay Publishing Fee by credit card.Corresponding author will be able to choose the way for payment,when author gets galley proof.(7)(8)。