ML792H32中文资料

h3芯片手册H3芯片是由Allwinner科技推出的一款高性能、高集成度的系统芯片，主要用于嵌入式系统和智能设备等领域。

本手册将为您详细介绍H3芯片的技术规格、功能特性以及其在不同应用场景中的应用方法。

一、技术规格H3芯片采用28纳米工艺制造，具有低功耗、高性能的特点。

其主要技术规格如下：1. CPU：采用ARM Cortex-A7架构，最高主频达到1.2GHz，支持NEON指令集；2. GPU：集成Mali400-MP2图形处理器，支持OpenGL ES 2.0和OpenVG 1.1；3. 内存：支持DDR3和DDR3L SDRAM，最大支持4GB内存容量；4. 存储：支持eMMC和NAND Flash存储介质，最大支持64GB存储容量；5. 外设接口：包括USB 2.0、HDMI、SPI、I2C、UART、GPIO等接口；6. 视频编解码：支持4K H.264和1080p H.265视频编解码；7. 图像处理：具有ISP图像传感器接口，支持MIPI CSI-2和SMIA标准；8. 音频处理：支持多种音频格式解码，如MP3、AAC、WMA等；9. 网络通信：支持以太网、WiFi和蓝牙等无线通信方式；二、功能特性H3芯片具有丰富的功能特性，适用于各种不同的应用场景。

以下是H3芯片的主要功能特性：1. 多媒体处理能力：H3芯片支持高清视频播放和图像处理，能够提供流畅的多媒体体验；2. 强大的图形处理能力：搭载Mali400-MP2图形处理器，可实现2D和3D图形的渲染和加速；3. 多核心处理器：H3芯片采用四核心ARM Cortex-A7架构，能够同时处理多个任务，提高系统性能；4. 网络通信能力：支持以太网、WiFi和蓝牙等多种网络通信方式，可满足不同应用场景的需求；5. 丰富的外设接口：H3芯片提供丰富的外设接口，如USB、HDMI、SPI等，方便与其他外设进行连接和通信；6. 低功耗设计：采用28纳米工艺制造，功耗低，能够延长设备的使用时间；7. 开发支持：提供完善的软件开发工具和SDK，方便开发者进行应用开发和调试。

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)MC79L05ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L05ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L05ACDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L05ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L05ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L05ACDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MC79L05ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC MC79L05ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC MC79L05AILP OBSOLETE TO-92LP3TBD Call TI Call TIMC79L05CD OBSOLETE SOIC D8TBD Call TI Call TIMC79L05CDR OBSOLETE SOIC D8TBD Call TI Call TIMC79L05CLP OBSOLETE TO-92LP3TBD Call TI Call TIMC79L12ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L12ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L12ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L12ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MC79L12ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC MC79L12ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NCMC79L12CD OBSOLETE SOIC D8TBD Call TI Call TIMC79L12CLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC MC79L15ACD OBSOLETE SOIC D8TBD Call TI Call TIMC79L15ACLP ACTIVE TO-92LP31000TBD CU SNPB Level-NC-NC-NC MC79L15ACLPM ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NC MC79L15ACLPR ACTIVE TO-92LP32000TBD CU SNPB Level-NC-NC-NCMC79L15CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMMC79L15CDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MC79L15CLP OBSOLETE TO-92LP3TBD Call TI Call TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. 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