AO3400
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D
SOT-23-3L
G S
REF. A B C D E F
Millimeter Min. Max. 2.70 3.10 2.65 2.95 1.50 1.70 0.35 0.50 0 0.10 0.45 0.55
REF. G H K J L M
Millimeter Min. Max. 1.90 REF. 1.00 1.30 0.10 0.20 0.40 0.85 1.15 0° 10°
Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Drain-Source On-State Resistance Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Forward Transconductance Gate Resistance Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Max. Diode Forward Current Diode Forward Voltage IS VSD IS = 1.6A, VGS = 0V 1.6 1.2 A V Qg VDS = 15V, ID = 5.8A Qgs VGS = 4.5V Qgd td(on) VDD = 15V, RL=2.7Ω tr ID = 1A, VGEN = 10V td(off) RG = 3Ω tf Ciss VDS = 10V, VGS = 0V Coss f = 1.0 MHz Crss 33 115 pF 3 340 10 38 50 15 20 ns 2.8 7 11 1.6 nC 11 14 BVDSS RDS(on) RDS(on) RDS(on) VGS(th) IDSS IGSS gfs Rg VGS = 0V, ID = 250uA VGS = 10V, ID = 5.8A VGS = 4.5V, ID =5A VGS = 2.5V, ID =4A VDS =VGS, ID = 250uA VDS = 24V, VGS = 0V VGS = ± 12V, VDS = 0V VDS = 5V, ID = 5A F=1.0MHz 10 6 15 7 7.5 0.7 30 22.0 27.0 43.0 28.0 33.0 52.0 1.4 1 ±100 V uA nA S Ω mΩ V
o
Symbol VDS VGS ID IDM PD
Limit 30
Unit V
± 12 5.8 A 30 1.4 W 1 -55 to 150 145
o o
C
C/W
ARACTERISTICS (TA = 25oC unless otherwise noted)
Maximum Ratings and Thermal Characteristics (TA = 25oC unless otherwise noted)
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current TA = 25oC Maximum Power Dissipation Operating Junction and Storage Temperature Range Junction-to-Ambient Thermal Resistance (PCB mounted) TA = 75 C TJ, Tstg RθJA
Symbol
Test Condition
Min.
Typ.
Miax.
Unit
Note: Pulse test: pulse width <= 300us, duty cycle<= 2%
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AO3400
Characteristics Curve
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AO3400
30V N-Channel Enhancement-Mode MOSFET VDS= 30V RDS(ON), Vgs@10V, Ids@5.8A < 28mΩ RDS(ON), Vgs@4.5V, Ids@5.0A < 33mΩ RDS(ON), Vgs@2.5V, Ids@4.0A < 52mΩ Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance Package Dimensions