LED外露灯规格书

and reliability.如产品需要用在有特殊质量要求及可靠性要求的地方，请提前咨询瑞丰的销售人员以取得相关信息。

disassemble and analyzein written form.在取得瑞丰的同意前，客户不应该对产品进行拆解分析，如发现失效产品，请直接书面通知瑞丰。

Features 特征Extremelywide viewing angle.发光角度大Suitable for all SMT assembly and solder process.适用于所有的SMT 组装和焊接工艺 Moisture sensitivity level:Level 3.防潮等级Level 3 Package:4000pcs/reel.包装每卷4000pcs RoHS compliant.满足RoHS 要求Description 描述The Colour LED which was fabricated by using a green chip 该产品为绿光LED ，是由绿光芯片封装形成Applications 应用Optical indicator.光学指示Switch and Symbol,Display.开关和标识、显示器等 General use.其他应用RF-GNS150TS-CFPackage Dimension外观尺寸NOTES:1.All dimensions units are millimeters.(所有尺寸标注单位为毫米)2.All dimensions tolerances are 0.2mm unless otherwise noted.(除特别标注外，所有尺寸公差为±0.2毫米)Electrical/Optical Characteristics at Ts=25°C电性与光学特性Note:备注Vr=5V For test conditions.Vr=5v为测试分选条件。

LED外露灯9mm单色系列参数LED外露灯（穿孔灯）系列LED Bare Signs Light SeriesΦ5mm单色外露灯（穿孔灯）系列Φ5mm LED Single Bare Light SeriesF5单色输入电压：DC5V Input V oltage:DC5V工作电流：20mA Work Current: 20mA额定功率：0.1W/个Work Power:0.1W/pcs工作温度：-45℃-65℃Work Temperature: -45℃-65℃防护等级：IP65 Waterproof Grade:IP65寿命时常：≥50000H Lifespan: ≥50000H灯珠直径：5mm Size Of LED Light:5mm冲孔尺寸：9mm Punch holes size: diameter 9 mm发光角度：≥90°View Angle: ≥90°正极：灰、红、黄、绿、蓝The anode: Gray, Red, Yellow, Green, Blue负极：白The cathode: White灯珠最大间距7CM(标准)产品重量：0.01KG包装尺寸：存放数量：该产品节能、环保、寿命长、衰减小等特点，适用于广告牌、外露发光字、陪会、吸塑字、各种照明设施的内外发光源。

可根据楼层的高低选择灯的间距。

此灯为点阵光源采用冲孔板做法，冲孔直径9.0mm，灯与灯的中心距为2cm-4cm最为合适。

The product has features for Energy conservation, Environmental protection, long lifetime, small Weaken, no need maintenance. Application for billboard, channel letter, Spurts draws, all kinds of inside and outside sign for all kinds of lightfacilities. Can choose the space between the lamp according to the height of the building. The lamp is spot sign made by punching hole. The diameter of the hole is 9.0mm. The center distance between the lamps is 2cm-4cm.产品特点1、充分发挥LED点光源有事，任意组合，让LED外发光字、大型户外LED广告招牌、LED电子灯箱制作更简单。

广州鸿利光电股份有限公司(花都湖项目)产品规格书莱帝亚天娜LED庭院灯编制：校对：审核：批准：2013-07-15发布2013-07-16实施修改记录表修改记录表版本号修改原因修改内容摘要修改人修改日期执行日期备注A一、灯具布局方法：产品规格书SPECIFICATION FOR APPROVAL产品图片客户名称CUSTOMER NAME: 花都湖公园项目部产品名称PRODUCT NAME: 天娜LED庭院灯产品型号PRODUCT TYPE: LEDIA0104使用前请阅读此规格书Please read this specification before using二、产品描述Features：1、莱帝亚天娜LED庭院灯是与西班牙设计师合作研发的景观照明产品，外观独特，简洁时尚，造形美观。

2、独特的飞碟式镂空结构设计，虚实结合，散热结构与光源一体化设计，能有效解决LED散热问题，发光的几何形状同时营造出特有的景观线条。

3、单灯使用，也可灵活高低组合，创新与腾飞在光与影的配合中完美融合。

4、灯具设计出光均匀柔和，采用泛光照明，解决了使用透镜造成的亮点效果。

根椐不同的使用环境,可采用不同的高度，使用不同的颜色出光罩。

5、该产品安装维护简单方便，电器外置于灯杆检修门内，一切的设计更具人性化。

6、该产品可实现远程智能控制；7、智能分时段进行控制光输出，实现产品精细节能；8、一体化散热设计，保证光源正常工作时不超过70度；9、采用增加扩散剂的透光罩，使灯具出光更均匀；10、多种配光选择可满足装饰性照明或功能性照明；11、该产品使用了著名光源品牌（HONGLI);应用范围Applications：适用于庭院小区，花园广场、城市街道等场所。

花都湖广场和停车场。

三、技术参数Technical parameter:(Ta=25℃)序号Number 项目Item参数Parameter1 工作电压IInput VoltageAC100-240V2 额定功耗Power Consumption80W3 功率因数Power Factor85%4 光源色温Color Temperature5500K5 光通量Luminous Flux7200.06 显色指数RaColor IndexRa<757 发光角度Maximum Candela Angle1208 使用寿命Life Span3万小时9 工作环境温度Operating Temperature-20℃-60℃10灯具材质压铸铝11 净重Weight暂无12表面处理金属保护神氟碳漆13 整灯发光效率System luminous efficiency60%14 IP防护等级IP ClassIP6515 安装方式Fixing Ways底盘安装16 建议安装高度Propositional Height4.5-5.5M备注:以上参数为基本参数,详细参数以具体各型号产品测试值为准。

全彩外露灯（穿孔灯）安装说明书V1.0外露灯（LED灯串）产品介绍LED外露灯产品的概述LED外露灯产品，是采用先进的高亮LED半导体芯片作为发光组件，配以先进设计、特殊工艺生产而成。

我公司有全彩、七彩、单色（红、黄、蓝、绿、白等5种）3大系列。

通过科学防水处理、独特的生产工艺，使发光字容易安装、降低成本、提升品质、节能省电、高亮度、色彩夺目等优点。

LED灯座有独特的卡口设计，非常方便取、装，维护变得更加简单；由于灯点是半隐藏式，所以使字或标识变得更美观大方！因它的绝对性价比等诸多优势，所以成为传统霓虹灯的换代产品。

LED外露灯产品的应用范围和场所:穿孔字、喷绘、广告牌、招牌和标识酒店、宾馆、饭店、餐馆；银行、车站、学校、医院、建筑、公司；KTV，夜总会、酒吧、桑拿洗浴中心、娱乐场所；店铺门头招牌，所有的户外LED穿孔字和发光体。

LED外露灯的描述及特点:1）直流电压5V，使用安全。

2）灯串的结构充分发挥点光源优势：任意组合，可以随意性。

3）安装方便，维护简单，有效降低安装成本。

不懂电路，不懂防水工艺，都可以自己更换LED！4）科学的防水处理方案，主要用于户外各种广告招牌的制作，不用焊锡，不用打胶。

5）采用了高亮度LED芯片，每平方米LED灯的亮度可以达到1000-2000CD。

6）LED绿色节能，是政府重点支持的产业。

它的耗电量仅相当于霓虹灯的10%。

平均功耗小于20W/㎡。

7）完全没有噪音污染，由于工作电压只有DC5V，也绝对不会对周边产生电磁干扰。

然而霓虹灯则需要将电压提升到10000V-15000V才可以发光，所以会产生很大的噪音和电磁干扰。

8）由半导体制作成的LED外露灯，使用寿命达3万个小时以上，无明显光衰3年以上。

相当于可用3-6年！9） LED外露灯可在全天候条件下工作，能应对恶劣的天气条件。

即便是遇到冰雹也不会受到影响。

10）LED外露灯系统的每个字由若干个发光点组成，每个点都相对独立，不会出现缺少笔画、整字不亮等现象。

TG-201705150367NP1-8th Floor, Building #1,10th Industrial Zone, Tian Liao Community, Gong Ming Area, Gang Ming栋一至八楼*************Web/网址：●亚光表面●Matte surface产品运用●户外全彩显示屏●汽车仪表盘●室内外装饰照明●娱乐照明Applications●Outdoor full-color video screen●The automobile dashboard●Indoor and outdoor decorative lighting ●Amusement●发光强度测量公差：±10% Tolerance of measurement of luminous intensity：±10%.●波长测量公差 : ±1nm Tolerance of measurement of dominant wavelength: ±1nm.●正向电压测量公差：±0.05V Tolerance of measurement of forward voltage±0.05V.●以上参数仅供参考,请以实物标签为准All the dates are just for reference, specific parameters pleaserefer to the label.●瑞丰以德国IS系统为量测标准Refund’s measuring standard system is the (Germany) InstrumentSystem( IS system) .典型特性曲线Typical Characteristics Curves可靠性试验Reliability Test Items Conditions1. The Reliability tests are based on Refond existing test platform. 可靠性测试基于瑞丰现有的测试标准。

F4152AHigh Efficiency 40 mil ThinGaN ®LED (455nm)2007-09-131Features •High efficiency due to new ThinGaN ® concept •Lambertian Emission pattern•Ideal for LCD backlighting and coupling in light guides •Polarity: n-side up•Wavelength (typ.): 455 nm •Technology: ThinGaN ®•Grouping parameters: luminous intensity, wavelengthApplications •Outdoor displays •Optical indicators•Backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting)•Marker lights (e.g. steps, exit ways, etc.)•Signal and symbol luminaireType Ordering Code DescriptionF4152AQ65110A704040 mil high efficiency ThinGaN ® chip, 450 - 465 nmElectrical values1)(T A = 25 °C)Parameter Symbol Value2)Unitmin.typ.max. Dominant wavelengthI F = 350 mA, pulsedλdom450465nm Reverse voltageI R = 10µAV R10VForward voltageI F = 350 mA, pulsed VF2.73.8VRadiant PowerI F = 350 mA, pulsedΙV32 a.u.1)Measurement limits describe actual settings and do not include measurement uncertainties. Each wafer and fragmentof a wafer is subject to final testing. The wafer or its pieces are individually attached on foils (rings). All el. values are referenced to the vendor's measurement system (correlation to customer product(s) is required). Measurement uncertainty +/-15% for brightness, +/- 1nm for wavelength and +/- 0.1V for voltage.2)Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations oftechnical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.2007-09-1322007-09-133Binning Maximum Ratings 1)Radiant Power 450 - 455 nm455 - 460 nm460 - 465 nm28.0 - 35.2 a.u.A1B1C135.2 - 41.2 a.u.A2B2C241.2 - 48.4 a.u.A3B3C348.4 - 56.8 a.u.A4B4C4> 56.8 a.u.A5B5C5ParameterSymbol Value Unit Maximum Operating temperature range T op -40...+100°C Maximum forward current (T A = 25°C)I F 700mA Minimum forward current (T A = 25°C)I F100mA Maximum surge Current (T A = 25°C)t p = 10 µs, D = 0.05I peak0.7A Maximum junction temperatureT j125°C1)Maximum ratings are strongly package dependent and may differ between different packages. The values given represent the chip in an OSRAM Opto Semiconductor’s Platinum Dragon® package.Mechanical values1)Parameter Symbol Value2)Unitmin.typ.max.Length of chip edge (x-direction)L x0.95 1.00 1.05mm Length of chip edge (y-direction)L y0.95 1.00 1.05mm Diameter of the wafer D50.8mmDie height H170190210µm Diameter of bondpad d130150170µm Additional informationMetallization frontside Gold partialMetallization backside AuDie bonding Epoxy bonding1)All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspectionA63501-Q0013-N001-*-76G3:Unless otherwise described below, the quality level of the final visual inspection shall comply to an AQL 0,4 (according MIL-STD-105D, level II), if the customer performes an incoming visual inspection of a shipment. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM after the final visual inspection is not installed.2)Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations oftechnical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice2007-09-1342007-09-135Chip OutlinesDimensions are specified as typicalvalues as follows: mm (inch).Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved.Attention please!The information generally describes the type of component and shall not be considered as assured characteristics or detailed specification.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our sales organization.Handling and Storage Conditions:Storage time for wafers in sealed condition shall not exceed 6 months (storage ambient conditions: Ta=15...30°C;relative humidity: < 60%).The hermetically sealed shipment lot shall be opened under temperature and moisture controlled cleanroom environment only. Customer has to follow the according rules for disposition of material that can be hazardous for humans and environment. Dice have to be handled ESD sensitive.PackingChips are placed on a blue foil with minimum size of 18 x 18 cm².For shipment the wafers of a shipment lot are arranged to stacks. The stack is put in a plastic ESD bag with a maximum of 14 wafers in one bag. A maximum of 4 bags is put in a packaging box. A maximum of 5 packaging boxes is put in a shipping carton which is sealed for storage and shipment.Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.Label and shipping documentsEach wafer is identified with a sticker, which is attached to each wafer. The label shows chip type, wafer number, quantity, binning and the minimum, average and maximum values of voltage, luminous intensity and wavelength. Each wafer shipment includes an additional document, which summarizes the content.Design objectives a) workabilityThe chip design was developed and released based on the the vendor’s standard assembly procedures and packaging. Bond strength properties are in accordance to MIL_STD-750D, method 2037. Whether the chip fits to the customer’s product(c) with its according die and wire bond procedures and packaging must be evaluated by the customer himself. If workability problems arise after this release a mutually conducted problem solving procedure has to be set up, if thechips are suspected of contributing to the problemsb) chip characteristicsThe chips are produced by the vendor with best effort, but on chip level a subset of the chip characteristics can be determined only. Performance of the chip in the customer’s product(s) can only be determined by the customer himself. Returns/ComplaintsTo return material because of technical or logistical reasons a RMA-number is necessary. Samples for analysis purposes can be send to OSRAM OS without credit.Shipping Conditions:If not otherwise arranged, the “General Conditions for the supply of products and services of the electrical and electronics industry” apply for any shipment. If these documents are not familiar to you, please request them at our nearest sales office.Components used in life-support devices or systems must be expressly authorized by us for such purpose! Critical components2), may only be used in life-support devices or systems3) with the express written approval of OSRAM OS.1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value.2)A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.3)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.2007-09-136。