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HDSP-5508-G0000中文资料

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14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeries HDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 2. Maximum Tolerable Peak Current vs. Pulse Duration – AlGaAs Red.Figure 1. Maximum Tolerable Peak Current vs.Pulse Duration – Red.Figure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 6. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °C AI M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G M EN T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

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HDSP-Kxxx中文资料

HDSP-Kxxx中文资料

Seven Segment Displays—10mm (0.40 inch), 10mm Slim Font,10.9mm (0.43 inch), 14.2mm (0.56inch),13mm Slim FontReliability DataDescriptionThe following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-Point Typical PerformanceStress Test Total DeviceUnits Total Failure Rate ColorsConditionsHoursTestedFailedMTBF(% /1 K Hours)HER T A = 55°C, I F = 30 mA 420,000630420,000≤0.23 %AlGaAs T A = 55°C, I F = 30 mA 378,000630378,000≤0.26 %Green T A = 55°C, I F = 30 mA 252,000840252,000≤0.40 %Orange T A = 55°C, I F = 30 mA 147,000210147,000≤0.26 %YellowT A = 55°C, I F = 20 mA147,00021147,000≤0.26 %Table 1. Life TestsDemonstrated PerformanceFailure Rate PredictionThe failure rate of semiconductor devices is determined by the junction temperature of thedevice. The relationship between ambient temperature and actual junction temperature is given by the following:T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °CθJA = thermal resistance of junction-to-ambient in °C/wattHDSP-Exxx, HDSP-Fxxx,HDSP-Gxxx, HDSP- Hxxx,HDSP-Kxxx, HDSP-3xxx,HDSP-4xxx, HDSP-5xxx,HDSP-6xxx, HDSP-7xxxtion but will probably be better than the performance outlined in Table 1.P AVG = average power dissipated in wattsThe estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using anArrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).Table 2.Point Typical Performance in Time[2]Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 3085115457,0000.219%118,0000.850% 751056430000.156%165,0000.605%6595920,0000.109%237,0000.423%55851,344,0000.074%346,0000.289%45752,006,0000.050%516,0000.194%35653,066,0000.033%788,0000.127%25554,809,0000.021%1,236,0000.081% Notes:1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number offailures. In the case of zero failures, one failure is assumed for this calculation.2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of allsamples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer toMIL-STD-690B for details on this methodology.3. A failure is any LED which does not emit light.Example of Failure Rate Calculation:Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25The point failure rate per year (8760 hours) at 25°C ambient temperature is:(0.021%/1K hours) x 0.25 x (8760 hours/year) = 0.045% per yearSimilarly, 90% confidence level failure rate per year at 25°C:(0.081%/1K hours) x 0.25 x (8760 hours/year) = 0.177% per yearTable 3. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Solder Heat Resistance MIL-STD-883 Method 2003260°C, 3 seconds100 Temperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,260015 min. transfer, 20 cyclesHumidity Storage JIS C 7021 Method B-1185°C, 85% RH, 168 Hours2520Solderability MIL-STD-883 Method 200316 Hours steam aging followed by100solder dip at 260°C for 5 secondsSalt Atmosphere MIL-STD-883 Method 100935°C, 24 Hours100Table 4. Mechanical TestsUnits Units Test Name Reference Test Conditions Tested Failed Terminal Strength MIL-STD-883 Method 2004 Cond. A 1 lb. for 30 sec.110 Lead Strength MIL-STD-883 Method 2004 Cond. B 3 X 90 degree bend, 8 oz.110 Vibration Variable MIL-STD-883 Method 2007 2 Hours for each X, Y, Z axis at220 Frequency20 Gs, 10 to 2k Hz; 20 min. sweep/go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 • Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 • Europe: Call your local HP sales office. • Data subject to change. • Copyright © 1999 Hewlett-Packard Co.5968-7071E (8/99)。

半导体激光打标机说明书

半导体激光打标机说明书

半导体激光打标机使用说明书深圳市华天世纪激光科技有限公司前言欢迎您选用我公司生产的HT-DP50系列激光打标机，如果您是首次使用此款型号的激光打标机，在通电前请务必仔细阅读本使用手册。

DP50系列激光设备已采用了尽可能全面的安全防范措施，以确保拥护人身安全及设备的自身安全,虽然如此,对本机的不正确使用、维护、改制等仍可能对操作者或机器造成各种损害。

防止激光辐射的泄漏：DP50系列激光设备采用封闭的激光光路设计，可以有效地防止激光辐射的泄漏。

对本机电器设备进行的维护、调整必须由经过培训的对本机各部分均较为熟悉的专业技术人员进行，且需特别注意以下几点：1、若某部件在维护调整时不需要运行，请勿接通该部分的电源。

2、在更换激光器模块时，切勿接通设备电源。

3、机器应有良好的接地，并应对此作定期检查。

4、尽可能只用一只手操作电气设备，以防止在人体上构成回路。

5、在高压电路上操作时，应使用合格的，绝缘良好的工具。

设备的测试，有些需采用一些特殊的测量技术或设备。

测试参数的选择应由熟悉本机操作和相关设备使用的技术人员决定。

敬告用户：1、除本手册所规定的操作外,对机器的任何其他操作,都可能使操作者遭受危险的激光辐射!2、若激光束照射到易燃材料上时，将会引起火灾甚至爆炸，应注意不得把该类材料放置到光路上或激光束有可能照到的地方！3、激光器正常工作期间，设备内部不得增设任何零件及物品。

除非经过特别授权，否则不得在密封罩打开的状态下使用本机。

欢迎用户提出建议，请与下列地址联系：中华人民共和国深圳市华天世纪激光科技有限公司邮政编码：518001电话：国内业务部：0国际业务部：+86-售后服务部：0传真：（FAX）：1主页：H地址：深圳市罗湖区人民北路物资大院综合楼1-2层需要采购或技术支持时,请与就近的销售服务商联系目录第一部分半导体激光打标机各部件原理与使用说明............................................................................. - 1 -1.激光原理....................................................................................................................................... - 1 -2.光学系统....................................................................................................................................... - 1 -3.各主要部件原理与技术说明....................................................................................................... - 2 -扩束镜........................................................................................................................................... - 4 -激光电源....................................................................................................................................... - 4 -声光Q开关.................................................................................................................................. - 8 -声光Q开光驱动电源.................................................................................................................. - 8 -1.电气安装连线....................................................................................................... - 8 -1、数码窗................................................................................................................. - 10 -2、RUN/STOP（运行）指示灯................................................................................. - 10 -3、ALARM（报警）指示灯....................................................................................... - 10 -4、TEST（测试）指示灯......................................................................................... - 10 -5、M1、M2、M3指示灯............................................................................................ - 10 -6、按键说明............................................................................................................. - 10 -7、电源开关............................................................................................................. - 11 -“F-θ”镜组 ............................................................................................................................. - 11 -光学扫描振镜............................................................................................................................. - 11 -冷水机使用说明......................................................................................................................... - 12 -第二部分打标控制软件使用说明....................................................................................................... - 18 -第一章概述............................................................................................................................................... - 18 -EzCad2软件简介....................................................................................................................................... - 18 -1.1.1 软件安装........................................................................................................................... - 18 -1.1.2 软件功能........................................................................................................................... - 18 -1.1.3 界面说明........................................................................................................................... - 18 -第二章文件菜单....................................................................................................................................... - 20 -新建(N) ............................................................................................................................................... - 20 -打开(O) ............................................................................................................................................... - 20 -保存(S)，另存为(A) .......................................................................................................................... - 21 -打印..................................................................................................................................................... - 22 -获取扫描图像(m) ............................................................................................................................... - 22 -系统参数(P) ........................................................................................................................................ - 23 -2.6.1 常规................................................................................................................................... - 23 -2.6.2 颜色................................................................................................................................... - 24 -2.6.3 工作空间........................................................................................................................... - 24 -2.6.4 自动备份........................................................................................................................... - 24 -2.6.5 移动旋转........................................................................................................................... - 25 -2.6.6 插件管理器....................................................................................................................... - 25 -2.6.7 语言/Language .................................................................................................................. - 25 -最近文件............................................................................................................................................. - 26 -退出(X) ............................................................................................................................................... - 26 -对象列表............................................................................................................................................. - 26 -对象属性栏......................................................................................................................................... - 26 -第三章编辑............................................................................................................................................... - 28 -撤消(U)/恢复(R) ................................................................................................................................. - 28 -剪切(T)/复制(C)/粘贴(P) ................................................................................................................... - 28 -组合/分离组合.................................................................................................................................... - 28 -群组/分离群组.................................................................................................................................... - 29 -填充..................................................................................................................................................... - 29 -第四章绘制菜单....................................................................................................................................... - 33 -点(D) ................................................................................................................................................... - 33 -曲线..................................................................................................................................................... - 34 -矩形..................................................................................................................................................... - 34 -圆- 35 -椭圆..................................................................................................................................................... - 35 -多边形................................................................................................................................................. - 36 -文字..................................................................................................................................................... - 36 -4.7.1文字字体参数.................................................................................................................... - 36 -4.7.2曲线排文本参数................................................................................................................ - 38 -4.7.3条形码字体参数................................................................................................................ - 40 -一维条形码......................................................................................................................... - 42 -二维条形码......................................................................................................................... - 43 -1．PDF417条码......................................................................................................... - 43 -2．DataMatrix条码 ................................................................................................... - 43 -4.7.4变量文本............................................................................................................................ - 44 -键盘............................................................................................................................. - 44 -日期............................................................................................................................. - 45 -显示为：序列号......................................................................................................... - 47 -列表文件..................................................................................................................... - 50 -动态文件..................................................................................................................... - 51 -位图..................................................................................................................................................... - 52 -矢量文件............................................................................................................................................. - 56 -延时器................................................................................................................................................. - 57 -输入口................................................................................................................................................. - 57 -输出口................................................................................................................................................. - 57 -直线..................................................................................................................................................... - 58 -图形选取............................................................................................................................................. - 58 -节点编辑............................................................................................................................................. - 59 -第五章修改菜单....................................................................................................................................... - 62 -变换..................................................................................................................................................... - 62 -5.1.1移动.................................................................................................................................... - 62 -5.1.2 旋转................................................................................................................................... - 63 -5.1.3镜像.................................................................................................................................... - 63 -5.1.4缩放.................................................................................................................................... - 64 -5.1.5倾斜.................................................................................................................................... - 64 -造形..................................................................................................................................................... - 65 -曲线编辑............................................................................................................................................. - 66 -对齐..................................................................................................................................................... - 66 -jsf字体................................................................................................................................................ - 67 -第六章查看菜单....................................................................................................................................... - 69 -观察..................................................................................................................................................... - 69 -标尺，网格点，辅助线..................................................................................................................... - 70 -捕捉网格............................................................................................................................................. - 70 -捕捉辅助线......................................................................................................................................... - 70 -捕捉对象............................................................................................................................................. - 70 -系统工具栏、视图工具栏、绘制工具栏、状态栏、对象列表栏、对象属性栏 ......................... - 70 -第七章帮助............................................................................................................................................... - 71 -关于EzCad(A) ................................................................................................................................... - 71 -第八章加工............................................................................................................................................... - 72 -笔列表................................................................................................................................................. - 72 -加工参数库......................................................................................................................................... - 73 -软件参数设置..................................................................................................................................... - 79 -8.4.1配置参数设置.................................................................................................................... - 79 -8.4.2区域尺寸参数.................................................................................................................... - 79 -8.4.3激光控制............................................................................................................................ - 80 -.端口参数.................................................................................................................................... - 84 -加工参数设置步骤............................................................................................................................. - 85 -8.5.1 调节开始段延时............................................................................................................... - 85 -8.5.2 调节结束段延时............................................................................................................... - 88 -8.5.3 调节拐角延时................................................................................................................... - 89 -扩展轴分割标刻模块......................................................................................................................... - 91 -8.6.1模块功能说明.................................................................................................................... - 91 -8.6.2 扩展轴参数....................................................................................................................... - 92 -8.6.3单扩展轴功能参数............................................................................................................ - 95 -1)单轴功能的开启设置.............................................................................................................. - 95 -2)各参数的功能定义................................................................................................................. - 96 -3)单扩展轴参数调试说明......................................................................................................... - 99 -8.6.4 双扩展轴功能参数......................................................................................................... - 100 -附件：电流映射参数....................................................................................................................... - 101 -第一部分半导体激光打标机各部件原理与使用说明HT-DP50系列激光打标设备由半导体激光器泵浦模块、Q驱动器、冷水机组、光学聚焦镜头、激光电源、半自动对焦控制器、计算机控制系统（包括计算机和专用接口板）、光学扫描振镜及其驱动器、X-Y工作平台、等部件组成。

HDSP-G10X资料

HDSP-G10X资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size 7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x Series HDSP-555x Series HDSP-751x Series HDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x SeriesHDSP-N10x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal AA1037513A803A9037.6 mm Common Cathode Right Hand Decimal BA1077517A807A9077.6 mm Common Anode ±1. Overflow CA1087518A808A9087.6 mm Common Cathode ±1. Overflow DF10110 mm Common Anode Right Hand Decimal EF10310 mm Common Cathode Right Hand Decimal FF10710 mm Common Anode ±1. Overflow GF10810 mm Common Cathode ±1. Overflow HG10110 mm Two Digit Common Anode Right Hand Decimal XG10310 mm Two Digit Common Cathode Right Hand Decimal YE100335010.9 mm Common Anode Left Hand Decimal IE101335110.9 mm Common Anode Right Hand Decimal JE103335310.9 mm Common Cathode Right Hand Decimal KE106335610.9 mm Universal ±1. Overflow[1]LH101555114.2 mm Common Anode Right Hand Decimal MH103555314.2 mm Common Cathode Right Hand Decimal NH107555714.2 mm Common Anode ±1. Overflow OH108555814.2 mm Common Cathode ±1. Overflow PK121K70114.2 mm Two Digit Common Anode Right Hand Decimal RK123K70314.2 mm Two Digit Common Cathode Right Hand Decimal SN10020 mm Common Anode Left Hand Decimal QN10120 mm Common Anode Right Hand Decimal TN10320 mm Common Cathode Right Hand Decimal UN10520 mm Common Cathode Left Hand Decimal VN10620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网9 Package Dimensions (cont.)10 Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mA N10x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA Pk All Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Intensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2003 Agilent Technologies, Inc.Obsoletes 5988-8412ENSeptember 24, 20035989-0080EN。

YAV 8AD PRO 24位高精度串口多功能采集卡技术手册DAM7452

YAV 8AD PRO 24位高精度串口多功能采集卡技术手册DAM7452

YAV8AD PRO高精度串口采集卡技术手册V1801武汉亚为电子科技有限公司DAM7452关于本手册为亚为推出的YAV8AD PRO数据采集卡的用户手册，主要内容包括功能概述、8路模拟量输入功能、8路IO功能、应用实例、性能测试、注意事项及故障排除等。

说明序号版本号编写人编写日期支持对象应用时间特别说明1 1.0郑先科2014.05YA V8AD PRO采集卡2 2.0郑先科2016.01YA V8AD PRO采集卡3 3.0郑先科2017.01YA V8AD PRO采集卡2017.01适用于RS232\485\WiFi\GPRS ZIGBEE\蓝牙\433M无线4 4.0李雪2017.08YA V8AD PRO采集卡2017.08目录0.快速上手 (1)产品包装内容 (1)应用软件 (1)接口定义 (1)通信 (2)1.产品概述 (2)技术指标 (2)⏹模拟信号输入 (3)⏹数字信号输入 (4)⏹数字信号输出 (4)⏹通信总线 (4)⏹温度参数 (4)硬件特点 (5)原理框图 (5)机械规格 (6)2.采集卡信号接线 (7)AI模拟量接线 (7)DI数字量接线 (8)DO数字量接线 (9)3.模拟量输入功能 (9)模拟量输入 (9)输入采样原理 (10)输入接线 (10)采样值计算 (11)⏹无符号整型 (11)⏹24位精度采集值的计算方法 (11)⏹模拟量值 (12)4.数字量输入功能 (12)数字量输入原理 (12)DI高低电平/无源触点输入 (13)计数功能输入 (13)测频功能输入 (13)PWM功能输入 (13)5.数字量输出功能 (14)输出原理 (14)DO高低电平输出 (14)PWM测试输出 (14)AO输出 (14)输出接线方式 (15)6.通信协议 (15)串口Modbus通信协议 (15)YA V IOT通信协议 (17)7.应用实例 (19)采集卡连接 (19)软件功能 (20)⏹亚为串口采集卡通用采集平台 (21)8.注意事项及故障排除 (22)注意事项 (22)⏹存储说明 (22)⏹出货清单 (22)⏹质保及售后 (22)⏹特别说明 (22)故障排除 (23)⏹无法正常采集数据 (23)⏹不显示波形 (24)⏹DI测频计数没反应 (24)⏹采集速度不够 (24)⏹软件错误 (24)9.性能测试 (24)安全规范 (24)耐电压范围测试 (25)环境适应性测试 (25)10.文档权利及免责声明 (26)11.联系方式.......................................................................................................................错误！未定义书签。