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SMT常用英语

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用SMT英文缩写词汇解析AI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接组件(摄影机) CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 芯片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 芯片尺寸BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插组件) FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)IC :integrate circuit 集成电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式芯片承载器MCM :multi-chip module 多层芯片模块MELF :metal electrode face 二极管MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package and Production Conference 国际电子包装及生产会议PBGA:plastic ball grid array 塑料球形矩阵PCB:printed circuit board 印刷电路板PFC :polymer flip chip 聚合物倒装片PLCC:plastic leadless chip carrier 塑料式有引脚芯片承载器Polyurethane 聚亚胺酯(刮刀材质)ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line package单列直插式封装SIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着组件SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 晶体管SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔) TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品应用。

TCP (Tape Carrier Package)ACF Anisotropic Conductive Film 异方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊Through hole 贯穿孔Touch up 补焊Briding 穚接(短路)Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化强度(红胶)Transter Pressure 转印压力(印刷)Screen Printing 刮刀式印刷Solder Powder 锡颗粒Wetteng ability 润湿能力Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接Laser Diode 半导体雷射Ion Lasers 离子雷射Nd: YAG Laser 石榴石雷射DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯片组件外观检查机High Voltage Burn-In Life Tester 高压恒温恒湿寿命测试机Capacitor Life Test with Leakage Current 电容漏电流寿命测试机Taping Machine 芯片打带包装机Surface Mounting Equipment 组件表面黏着设备Silver Electrode Coating Machine 电阻银电极沾附机TFT-LCD(薄膜晶体管液晶显示器) 笔记型用STN-LCD(中小尺寸超扭转向液晶显示器行动电话用PDA(个人数字助理器)CMP(化学机械研磨)制程Slurry 研磨液Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数字相机Dataplay Disk 微光盘SPS 交换式电源供应器EMS 专业电子制造服务HDI board 高密度连结板指线宽／线距小于4／4 mil，微小孔板（Micro-via board），孔俓5-6mil以下Puddle Effect 水沟效应早期大面积松宽线路之蚀刻银贯孔(STH)铜贯孔(CTH)Depaneling Machine 组装电路板切割机NONCFC 无氟氯碳化合物。

Support pin 支撑柱F.M. 光学点ENTEK 裸铜板上涂一层化学药剂使PCB的pad比较不会生锈QFD 品质机能展开PMT 产品成熟度测试ORT 持续性寿命测试FMEA 失效模式与效应分析TFT-LCD(薄膜晶体管液晶显示器) (Liquid-Crystal Displays Addressed by Thin-Film Transistors)导线架（Lead Frame）单体导线架（Discrete Lead Frame）及积体线路导线架（IC Lead Frame）二种ISP (Internet Service Provider) 指的是网际网络服务提供ADSL 即为非对称数字用户回路调制解调器SOP Standard Operation Procedure（标准操作手册）DOE Design Of Experiment （实验计划法）Wire Bonding 打线接合Tape Automated Bonding, TAB 卷带式自动接合Flip Chip 覆晶接合JIS 日本工业标准ISO 国际认证M.S.D.S 国际物质安全资料FLUX SIR 加湿绝缘阻抗值。

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SMT常用英语对照

SMT常用英语对照

常用術語中英文對照一.ME相關術語ME MANUFACTURE ENGINEER制工ECN ENGINEERING CHANGE NOTICE工程變更通知單BOM BILL OF MATERIAL物料清單MRP MATERIAL REQUIREMENT PLAN物料需求計劃TVR TOOL VERIFICATION REPORT 模具驗証報告FAI FIRST ARTICLE INSPECTION初件檢驗SDP SUPPLIER DEVELOPMENT PROCESS供應商開發程序PV PRODUCTION VERIFICATION 產品確認MV MANUFACTURING VERIFICATION制造確認PMP PROCESS MANAGEMENT PLAN制程管制計劃SCR SUPPLIER CHANGE REQUEST供應商變更申請SOP STANDARD OPERATION PROCEDURE作業指導書WIP WORK IN-PROCESS在制MC MATERIAL CONTROL物控JIT JUST IN TIME及時CORRECTION ACTION REPORT改善報告MARKETING MANAGEMENT行銷管理FINANCIAL MANAGEMENT財務管理OBJECT MANAGEMENT目標管理JOB FUNCTION工作職掌BTN BUILD TO NEED重機策略客戶BTCO BUILD TO CONFIRMED ORDER重要客戶BTI BUILD TO INVENTORY一般客戶WDR WEEKLY DELIVERY REQUIREMENT周出貨需求FMEA FAILURE MODE EFFECT失效模式分析二.品管常用術語REJ REJECT拒收OQC OUTGOING QUALITY CONTROL出庫檢驗QE QUALITY ENGINEERING品質工程GWQC GROUP-WIDE QUALITY CONTROL全集團品質管制TQC TOTAL QUALITY CONTROL全面品質管理QM QUALITY MANAGEMENT品質管理ZD ZERO DEFECTS零缺點ISO INTERNATIONAL ORGANIZATION FOR國際標准化組織STANDARDIZATIONUCL UP CONTROL LIMITED管制上限LCL LOW CONTROL LIMITED管制下限CL CENTER LINE中心線CA CAPABILITY OF ACCURACY制程准確度CP CAPABILITY OF PROCESS制程精密度SIP STANDARD INSPECTION PROCEDURE制程檢驗標准CHANCE CAUSES機遇原因ASSIGNABLE CAUSES非機遇原因PLAN DO CHECK ACTION 戴明循環QUALITY ALARM NOTICE品質異常通知ANALYSISPM PRODUCT MARKET產品市場TPM TOTAL PRODUCTION MAINTENANCE全面生產保養CRI CRITICAL DEFECT嚴重缺陷MAJ MAJOR DEFECT主要缺陷MIN MINOR DEFECT次要缺陷ACC ACCEPT允收AQL ACCEPTABLE QUALITY LEVEL允收的質量水准FQC FINAL QUALITY CONTROL最終品質管制IPQC IN PROCESS QUALITY CONTROL制程品質管制IQC INCOMING QUALITY CONTROL進料品質管制SPC STATISTICAL PROCESS CONTROL統計制程管制QA QUALITY ASSURANCE品質保証QCC QUALITY CONTROL CIRCLE品管圈QIT QUALITY IMPROVEMENT品質改善小組VDCS VENDOR DEFECTS CORRECTION進料品質異常SHEET回饋單DVT DESIGN 設計工程量試。

SMT常见单词解释

SMT常见单词解释

SMT常见单词解释PCB=Printed Circuit Board 电路板CAM=Computer aided manufacture 计算机辅助Pad 焊盘Annular ['ænjulə]ring 焊环AOI=automatic optical inspection 自动光学检测Charge of free 免费WIP=work in process 在线板DCC=document control center 文控中心Legend ['ledʒənd]字符CS=Component Side =Top Side （顶层）元件面SS=Solder Side =Bottom Side （底层）焊锡面Gold Plated 电金，镀金Nickel Plated 电镍，镀镍Immersion Gold 沉金=沉镍金Carbon Ink Print 印碳油Microsection Report 切片报告，横切面报告X-out=Cross-out 打“X”报告Panel （客户称）拼板，（生产线称）工作板Marking 标记，UL 标记Date code 生产周期Unit 单元，单位Profile 外形，轮廓<outline>Profile By Routing 锣(铣)外形Wet Film 湿菲林,湿绿油,湿膜Slot 槽,方坑Base Material=Base Laminate 基材,板料V-out =V-score V形槽Finished 成品Marketing 市场部Gerber File GERBER文件UL LOGO UL标记E-Test=Electric Open/Short Test 电子测试PO=Purchase Order 订单Tolerance 公差Rigid,Flexible Board 刚性,软性板Board cut 开料Board baking 焗板Drill 钻孔PTH=Plated Through Hole 镀通孔,沉铜Panel plating 板面电镀,全板电镀Photo Image 图象,线路图形Pattern plating 线路电镀Etching 蚀板,蚀刻SM=Solder Mask 防焊,阻焊,绿油SR=Solder Resist 防焊,阻焊,绿油Gold finger 金手指Silkscreen 丝印字符HAL=HASL=Hot air(Solder)leveling 热风整平喷锡Routing 锣板,铣板Punching 冲板,啤板FQC=final quality checking 终检,最后检查FQA=final quality audit 最后稽查(抽查) Shippment 出货Flux 助焊剂（其主要成分为松香）Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金Lead free 无铅COC=compliance of certificate 材料证明书Microsection=cross section 微切片,横切片Chemical gold 沉镍金Mould=punch die 模具,啤模MI=manufacture instruction 制作批示QA=quality assurance 品质保证CAD=computer aided design 计算机辅助设计Drill bit size钻咀直径<diameter>Bow and twist 板弯和板曲Hit 击打,孔数Bonding 邦定,点焊Test coupon 测试模块(科邦)Thieving copper 抢电流铜皮Rail-webBreak-up tab 工艺边Break away tab 工艺边GND=ground 地线,大铜皮Hole edge 孔边,孔内Stamp hole 邮票孔Template 天坯,型板,钻孔样板(首板) Dry film 干菲林,干膜LPI=liquid photo image 液态感光=湿绿油Multilayer 多层板SMD=surface mounted device 贴片,表面贴装器件SMT=surface mounted technology 表面贴装技术Peelable mask=blue gel 蓝胶Tooling hole 工艺孔,管位,定位孔,工具孔Fiducial mask 测光点,光学对位点,对光点,电眼Copper foil 铜箔Dimension 尺寸Nagative负的,positive正的Flash gold 闪镀金,镀薄金Engineering department 工程部Delivery date 交货期Bevelling 斜边Spacing=gap 间隙,气隙,线隙Chip: 芯片Ceramic: 陶瓷Polarity: 极性Stagger: 交错的Hexagon inductor: 六角型的感应器Air wound coil: 空的旋转的盘绕物Crystal oscillator: 晶体,振荡器Criteria: 标准的Notch: 槽口,凹口Contour: 轮廓,周边Stable: 稳定的Burrs: 粗刻边Inferior: 差的,劣等的Reliability: 可靠性，可靠度，可信度CSP：chip scale package 晶片级尺寸封装MCM：multi-chip model 多芯片组件COB：chip on board 板载芯片LSI：large scale integrated circuit 大规模集成电路（LSIC）FCP: flip chip倒装芯片DCA：direct chip attachment 直接芯片组装SBC：solder ball connect 焊料球连接工艺（GLASS）epoxy:环氧的（环氧树脂）Asymmetrical: 不均匀的，不对称的Diode: 二极管Trimmer (capacitor): 调整式（可调电容）Resistor: 电阻器Capacitor: 电容器transistor: 晶体管Rectangular: 矩形的，成直角的PGA（pin grid array) 引脚网格阵列封装BGA（ball grid array) 球形矩阵排列封装PQFP（plastic quad flat package)塑料方形扁平封装C4（controlled collapse chip connection)可控塌陷芯片互联技术DIP（dual in-line package) 双列直插式封装PLCC（plastic leaded chip carrier) 塑料有引脚芯片载体封装SOJ（small out-line J-lead)小尺寸J形引脚封装TSOP（thin small out-line package)薄形小尺寸封装TBGA（tiny-BGA)小球列阵封装BLP（bottom lead package)底部引脚封装UBGA（micro BGA)芯片面积与封装面积比大于1：1.4。

SMT常见英语

SMT常见英语


微间距技朮
15 FR-4 Flame-retardant substrate
玻璃纤维胶片(用来制作 PCB 材质)
16
IC Integrated circuit
积成电路
17
IR Infra-red
红外线
18 Kpa Kilopascals
(压力单位)
19 LCC Leadless chip carrier
组装电路板切割机
82
Solder Recovery System
锡料回收再使用系统
83
Wire Welder
主板补线机
84 X-Ray Multi-layer inspection System 孔偏检查机
X-Ray
85
BGA Open/Short X-Ray BGA X-Ray 检查机
Inspection Machine
封装技朮 LGA 封装不需植球,适合轻薄短小 产品应用
59 TCP Tape carrier package 60 ACF Anisotropic conductive film 异方性导电胶膜制程
61
Solder mask
防焊漆
62
Soldering Iron
烙铁
63
Solder balls
锡球
64
实验计划法
132
Wire Bonding
打线结合
133 TAB Tape Automated Bonding
卷带式自动接合
134 JIS
日本工业标准
135 ISO
国际认证
136 M.S.D.S
国际物质安全资料
137
Flux SIR
SMT术语英语

SMT术语英语

Smt属于转换英语THT（Through Hole Technology）：通孔安装技术SMT（Surface Mounted Technology）：表面安装技术PTH （Pin Through the Hole）：通孔安装THT (Through Hole Component) ：通孔插装元件SMB (Surface Mount Printed Circuit Board)：表面安装PCB板SMC (Surface Mount Component)：表面安装元件SMD (Surface Mount Device)：表面安装器件SMA (Surface Mount Assembly)：表面安装组件Component：元件Device：器件Assembly：组件CTE（coefficient of thermal expansion）：热膨胀系数In-circuit test：在线测试Lead configuration：引脚外形Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Solderability：可焊性Soldermask：阻焊Yield：产出率Packaging density：装配密度Chip：片状元件melf：圆柱形元件PCB（Printed circuit board）：印刷电路板DIP：双列直插SIP：单列直插SOT（Small Outline Transistor）：小外形晶体管SOIC（Small outline IC）：小外形集成电路，SOP(Small outline Package)：小外型封装PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体QFP（Quad Flat Package）：多引脚方形扁平封装BGA（Ball grid array）球栅列阵CSP（Chip Scale Package）：芯片规模的封装Bare Chip：裸芯片Accuracy：精度ATE（Automated test equipment）：自动测试设备AOI（Automatic optical inspection）：自动光学检查Blind via：盲孔Buried via：埋孔through via：通孔Bridge：锡桥Circuit tester：电路测试机CTE（Coefficient of the thermal expansion）：温度膨胀系数Cold solder joint：冷焊锡点Component density：元件密度Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化Cycle rate：循环速率Defect：缺陷Desoldering：卸焊Downtime：停机时间FPT（Fine-pitch technology）：密脚距技术Flip chip：倒装芯片FCT（Functional test）：功能测试Golden boy：金样ICT（In-circuit test）：在线测试JIT（Just-in-time）：刚好准时Lead configuration：引脚外形Packaging density：装配密度Pick-and-place：拾取-贴装设备Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Defect SoldeR少锡Schematic：原理图Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Tape-and-reel：带和盘Tombstoning：元件立起Ultra-fine-pitch：超密脚距Yield：产出率solder mask：阻焊漆silk screen：丝印面via：导孔Copper Clad Laminates：覆铜箔层压板past mask：焊膏膜(漏板）solder mask：焊接掩摸(阻焊膜）Solding Pasts：焊锡膏Stencils：模板、漏板、钢板Bridging：搭锡Cursting：发生皮层Excessive Paste：膏量太多Insufficient Paste：膏量不足Poor Tack Retention：粘着力不足Slumping：坍塌Smearing：模糊Dpm（defects per million）：百万缺陷率Flexibility：柔性Modularity：模块化Component Pick-Up：元件拾取Component Check：元件检查Component Transport：元件传送Placement Procedure：元件放置Chamber System：炉膛系统Blowholes：吹孔Voids：空洞Movement：移位Misalignment：偏斜Dewetting：缩锡Dull Joint：焊点灰暗Non-Dewetting：不沾锡Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化nought materiel 无料Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Environmental test：环境测试Eutectic solders：共晶焊锡Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Full liquidus temperature：完全液化温度Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂Line certification：生产线确认Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Nonwetting：不熔湿的Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备Repeatability：可重复性Rheology：流变学Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体Solidus：固相线Statistical process control ：SPC统计过程控制Storage life：储存寿命Subtractive process：负过程Surfactant：表面活性剂Syringe：注射器Tape-and-reel：带和盘Thermocouple：热电偶Tombstoning：元件立起Vapor degreaser：汽相去油器paste working 1ife：焊膏工作寿命paste shelf life：焊膏贮存寿命slump：塌落no-clean solder paste：免清洗焊膏low temperature paste：低温焊膏screen printing：丝网印刷screen printing plate：网版squeegee：刮板screen printer：丝网印刷机stencil printing：漏版印刷metal stencil：金属漏版flexible stencil：柔性金属漏版feeders：供料器tape feeder：带式供料器stick feeder：杆式供料器tray feeder：盘式供料器bulk feeder：散装式供料器feeder holder：供料器架placement accuracy：贴装精度shifting deviation：平移偏差rotating deviation：旋转偏差resolution：分辨率repeatability：重复性placement speed：贴装速度low speed placement equipment：低速贴装机general placement equipment：中速贴装机high speed placement equipment：高速贴装机precise placement equipment：精密贴装机optic correction system ：光学校准系统sequential placement：顺序贴装placement pressure：贴装压力placement direction：贴装方位flying：飞片flux bubbles：焊剂气泡dual wave soldering：双波峰焊self alignment：自定位skewing：偏移tomb stone effect：墓碑现象Manhattan effect：曼哈顿现象hot air reflow soldering：热风再流焊convection reflow soldering：热对流再流焊laser reflow soldering：激光再流焊vapor phase soldering(VPS)：气相再流焊located soldering：局部软钎焊cleaning after soldering：焊后清洗AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :centipoises(黏度單位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of thermal expansion 熱膨脹系數DIP :dual in-line package 雙內線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MQFP :metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA:plastic ball grid array 塑膠球形矩陣PCB:printed circuit board 印刷電路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質)ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT :surface mount technology 表面黏著技術SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封裝SOT :small outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹(因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA (Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。