半导体专业词汇--汇总
- 格式：xls
- 大小：283.50 KB
- 文档页数：31
中文英文
1号极限开关LS1(limit suitch 1)
232 bus的使用寿命已到或线路短路或断路232 bus error
488 bus的使用寿命已到或线路短路或断路488bus error
5S(整理、整顿、清扫、清洁、修养)5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)
5u之pp质滤心cartridge p.p 5u
ABC分类法ABC classification
AUTO模automatic molding system
A板A plate
BT指示剂eriochrome black t indicator
B板B plate
CO2气泡机CO2 bubbler
DIP 产品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒收Any device having a chip out greater than 0.5mm in width
(or depth) and 1.25mm in length is rejectable.
DIP 从胶体末端算起,支持棒突出部分不得大于0.25mm(SOP为0.15mm)。The product is rejectable when pad support protrudes more
than 0.25mm from the end of the package
body.(sop:0.15mm).
DIP：不符合脚量规之脚弯拒收。Any device showing bent leads (in case of doubts use the
applicable gauge) is rejectable.
DIP：不均匀的镀层表面，使得小脚厚度大于0.4mm或宽度大于0.5mm或
大脚以上厚度大于0.75mm，拒收。Non-uniform solder such that a lead exceeds the
dimensions of 0.4mm thick and 0.5mm wide below the
seating plate, or an overall thickness of 0.75mm above the
seating plane is rejectable.
DIP：从脚尖端到肩膀弯脚处，脚的镀层表面须均匀且连续。Lead finish on the leads shall be smooth and continuous
from lead tip up to and over bend of lead.
DIP：顶出孔不得高于胶体面或低于胶体表面0.5mm。Ejector marks more than above the surface or more than
0.5mm below the surface of the device is rejectable.
DIP：离胶体0.5mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable
excluding 0.5mm from the body.
DIP：小脚上不得有任何外来物造成之沾污。大脚上不得有大于0.15mm
直径圆面积之沾污。Package leads shall be free from attached foreign material
except for foreign material located above the seating plane
of the lead, not bigger than 0.15mm in diameter.
DIP：由于冲切造成之支持棒残存凸出或大脚凹陷大于0.25mm拒收。Any lead with dam bar step dimensions exceeding 0.25mm
is rejectable.
Driver board的使用寿命已到或线路短路或断路driver board error
EDTA-2NA 标准溶液EDTA-2NA standard solution
Eprom的使用寿命已到或线路短路或断路eprom error
KBS 94 混床树脂筒leasing mix bed resin bottle, kbs 94
L/F存放架stack loader
L/F放反将导致反弯脚。Lead frame reverse will cause reverse bending.
L/F排放机Lead Frame Auto Loader Machine
L/F用剥锡剂 TLS-85asolde stipper for plastic package,TLS-85a
L/F用剥锡剂 TLS-85bsolde stipper for plastic package, TLS-85b
L/F用剥锡剂 TLS-86solder stipper for plastic package,TLS-86
L形尾塞end plug (L)
L型尾塞end plug(L)
MPU的使用寿命已到或线路短路或断路MPU error
N2流量nitrogen gas flow rate
OC曲线poprtation curve
P.P 打包袋P.P Band
PDCA管理循环PDCA（Plan-Do-Check-Action)
PIN1标示PIN1 identification
PIN1标示要有且与规格所订的尺寸一致。The PIN1 identification must be present and in accordance
with the specified dimensions.
PP材质阳极袋anode bag p.p.
QA允收章QA mark
QFP用的塑胶承载盘QFP plastic tray
RAM的使用寿命已到或线路短路或断路RAM read/write error即RAM error
SOP：不均匀的镀层表面，使得脚的宽度大于0.5mm或脚厚度大于0.25mm
。Non-uniform lead finish such that a lead exceeds the
specified dimensions 0.5mm or leadl thickness exceeds
0.25mm is rejectable.
SOP：产品边缘上的裂角宽或深大于0.2mm，长大于0.6mm或露出体材料
拒收。Any devices having a chip out greater than 0.2mm width(or
depth) and 0.6mm in length or exposed lead frame material
is rejectable.
SOP：顶出孔低于胶体表面0.2mm，或是高于胶体表面拒收。Ejector marks more than above the surface or more than
0.2mm below the surface of the device is rejectable.
SOP：脚浮不得超过0.1mm。Lead coplanarity shall be within 0.1mm of one another in the
vertical direction.
SOP：脚上不得有任何外务物之沾污，但如果是废胶则不能大于50％脚
宽为直径的圆面积。Leads shall be free attached foreign material, flash shall not
exceed 50% of the lead surface.SOP：离胶体0.2mm以外之脚表面有浮起、剥落或鳞片状等现象拒收。Lifting, peeling or flaking of the lead finish is rejectable
excluding 0.2mm of the lead length from body.
SOP：由于冲切造成之支持棒残存凸出或凹陷大于0.1mm时拒收。Any lead with dam bar step dimensions exceeding 0.1mm is
rejectable.
S形尾塞end plug (S)
XX部门经理manager of XX department
XX电子有限公司XX Electronics CO.Ltd
X管率X-ray yield
X射线X-ray
X-射线检验X-ray inspection
安全光幕safety curtain
安全库存量safety stock
安全眼镜safety glasses
氨水ammoniam water
按下紧急按钮。Press the emergency button.
按需订货lot for lot
昂球lifted bond
昂楔lifted wedge
凹模cavity plate,cavity block
百万分之一PPM (parts per million)
柏拉图Pareto chart
板状模组模具plate mold
半导体semiconductor
半球insufficient ball size
半自动框架输送机off loader
包反wrong orentation molding
包反wrong orientation molding
包封molding
包封molding
包封模具mold chase
包封模具mold chase
包封偏差molding mismatch
包装packing
包装packing
包装盒(内箱)packing box
包装盒缺点packing defect criteria
包装外箱shipping box
保管费carrying cost
保管费率carrying cost rate
保险期safety time
保压时间holdup time
保质期shelf life
报废scrap
备注remark
背金/银backside metal (Au/Ag)
背面back side
背面打印back marking
崩角chip package
崩碎chips
比重specific gravity
比重specific gravity
比重计hydrometer
闭环物料需求计划closed loop MRP
闭模时间closing time
边筋翘起bending side rail
边晶edge die
边晶reject die around slice edge
边框side rail
边沿芯片edge die
编带Tape & Reel
编带tape/real
编带拉力测试peel back force test
编织层braid
扁平电缆flat cable,ribbon cable
扁球flat ball
变差variation
变色discoloration
变色（发黄，发黑，发花，水渍，酸斑）discolor(yellowish,blcken,water mark)
变色、氧化、浮起discoloration/oxidation/lifting
变形deformed
