sht10温湿度传感器说明.

温湿度传感器SHT10驱动程序——基于MSP430这是暑假时用430的单片机写的温湿度传感器SHT10的程序，参考了官方的51例程，分享一下~~/****************************************Copyright(c)********************************************************************************************LiPeng********************* *************************************--------------FileInfo-------------------------------------------------------------------------------** File Name: Sht10_Driver.c** Created by: LiPeng** Created date: 2008-09-15** Version: 1.0** Descriptions: The original version****------------------------------------------------------------------------------------------------------** Modified by:** Modified date:** Version:** Descriptions:****------------------------------------------------------------------------------------------------------** System Function: Sht10 Driver------温湿度传感器SHT10驱动** 使用MSP430-F413连接方式:** VCC: P6.3** SCK: P6.4** SDA: P6.5*********************************************************************** ***********************************/#include <msp430x14x.h>/*宏定义，延时函数，参数为1时相应延时分别为1us和1ms*/#define CPU_F (double)1000000#define delay_us(x) __delay_cycles((long)(CPU_F * (double)x/1000000.0)) #define delay_ms(x) __delay_cycles((long)(CPU_F * (double)x/1000.0))/*常量定义*/#define uint unsigned int#define uchar unsigned char#define ulong unsigned long//adr command r/w#define STATUS_REG_W 0x06 //000 0011 0#define STATUS_REG_R 0x07 //000 0011 1#define MEASURE_TEMP 0x03 //000 0001 1#define MEASURE_HUMI 0x05 //000 0010 1#define RESET 0x1e //000 1111 0#define bitselect 0x01 //选择温度与湿度的低位读#define noACK 0#define ACK 1#define HUMIDITY 2#define TEMPERATURE 1#define SCK BIT4#define SDA BIT5#define SVCC BIT3#define SCK_H P6OUT|=SCK#define SCK_L P6OUT&=~SCK#define SDA_H P6OUT|=SDA#define SDA_L P6OUT&=~SDA#define SVCC_H P6OUT|=SVCC#define SVCC_L P6OUT&=~SVCCtypedef union{unsigned int i;float f;}value;uint table_temp[3];uint table_humi[3];uint temten;uint humi_true;/******************************************************************** ****************************************Function Name: S_Init**Description: 初始化**Input Parameters: 无**Output Parameters: 无*************************************/void S_Init(){P6SEL&=~(SCK+SDA+SVCC); //选择P6.3 P6.4 为IO端口，输出 P6.5输入P6DIR|=(SCK+SVCC);P6DIR&=~SDA;BCSCTL1=(XT2OFF+RSEL2); //关闭XT2，1MHz DOCDCOCTL=DCO2; //设定DCO频率为1MHz}/******************************************************************** ****************************************Function Name: S_Transstart**Description: 发送开始时序**** generates a transmission start** _____ ________** DATA: |_______|** ___ ___** SCK : ___| |___| |______**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/void S_Transstart(){P6DIR|=SDA;SDA_H;SCK_L;_NOP();SCK_H;_NOP();SDA_L;_NOP();SCK_L;_NOP();_NOP();_NOP();SCK_H;_NOP();SDA_H;_NOP();SCK_L;P6DIR&=~SDA;}****************************************Function Name: S_WriteByte**Description: 写时序**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/char S_WriteByte(unsigned char value){unsigned char i,error=0;P6DIR|=SDA;for(i=0x80;i>0;i/=2) //shift bit for masking{if(i&value)SDA_H; //masking value with i , write to SENSI-BUSelseSDA_L;SCK_H; //clk for SENSI-BUS_NOP();_NOP();_NOP(); //pulswith approx. 5 usSCK_L;}SDA_H; //release DATA-lineP6DIR&=~SDA; //Change SDA to be inputSCK_H; //clk #9 for ackerror=P6IN; //check ack (DATA will be pulled down by SHT11)error&=SDA;P6DIR|=SDA;SCK_L;if(error)return 1; //error=1 in case of no acknowledgereturn 0;}/******************************************************************** ****************************************Function Name: S_ReadByte**Description: 读时序**Input Parameters: ack--->reads a byte form the Sensibus and gives an acknowledge in case of "ack=1"**Output Parameters: 无********************************************************************* *************************************/char S_ReadByte(unsigned char ack){unsigned char i,val=0;P6DIR|=SDA;SDA_H; //release DATA-lineP6DIR&=~SDA;for(i=0x80;i>0;i/=2) //shift bit for masking{SCK_H; //clk for SENSI-BUSif(P6IN&SDA)val=(val|i); //read bitSCK_L;}P6DIR|=SDA;if(ack) //in case of "ack==1" pull down DATA-LineSDA_L;elseSDA_H;SCK_H; //clk #9 for ack_NOP();_NOP();_NOP(); //pulswith approx. 5 usSCK_L;SDA_H; //release DATA-lineP6DIR&=~SDA;return val;}/******************************************************************** ****************************************Function Name: S_Connectionreset**Description: 通讯复位时序** communication reset: DATA-line=1 and at least 9 SCK cycles followed by transstart** _____________________________________________________ ________** DATA: |_______|** _ _ _ _ _ _ _ _ _ ___ ___** SCK : __| |__| |__| |__| |__| |__| |__| |__| |__| |______| |___| |______ **Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/void S_Connectionreset(){unsigned char ClkCnt;P6DIR|=SDA;SDA_H;SCK_L; //Initial statefor(ClkCnt=0;ClkCnt<9;ClkCnt++) //9 SCK cycles{SCK_H;SCK_L;}S_Transstart(); //transmission start}/******************************************************************** ****************************************Function Name: S_Softreset**Description: 软件复位时序resets the sensor by a softreset**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/char S_Softreset(){unsigned char error=0;S_Connectionreset(); //reset communicationerror+=S_WriteByte(RESET); //send RESET-command to sensorreturn error; //error=1 in case of no response form the sensor}/******************************************************************** ****************************************Function Name: S_WriteStatusReg**Description: 写状态寄存器**Input Parameters: *p_value**Output Parameters: 无********************************************************************* *************************************/char S_WriteStatusReg(unsigned char *p_value){unsigned char error=0;S_Transstart(); //transmission starterror+=S_WriteByte(STATUS_REG_W); //send command to sensorerror+=S_WriteByte(*p_value); //send value of status registerreturn error; //error>=1 in case of no response form the sensor}/******************************************************************** ****************************************Function Name: S_Mearsure**Description: 读时序 makes a measurement (humidity/temperature) withchecksum**Input Parameters: *p_value ,*p_checknum ,mode**Output Parameters: 无********************************************************************* *************************************/unsigned char S_Measure(unsigned char *p_value, unsigned char*p_checksum, unsigned char mode){unsigned error=0;unsigned int i;S_Transstart(); //transmission startswitch(mode){ //send command to sensorcase TEMPERATURE: error+=S_WriteByte(MEASURE_TEMP); break;case HUMIDITY: error+=S_WriteByte(MEASURE_HUMI); break;}P6DIR&=~SDA;for(i=0;i<65535;i++) //wait until sensor has finished the measurement if((P6IN&SDA)==0)break;if(P6IN&SDA)error+=1; //or timeout (~2 sec.) is reached*(p_value)=S_ReadByte(ACK); //read the first byte (MSB)*(p_value+1)=S_ReadByte(ACK); //read the second byte (LSB)*p_checksum=S_ReadByte(noACK); //read checksumreturn(error);}/******************************************************************** ****************************************Function Name: S_Calculate**Description: 计算**Input Parameters: humi [Ticks] (12 bit)** temp [Ticks] (14 bit)**Output Parameters: humi [%RH]** temp [癈]********************************************************************* *************************************/void S_Calculate(unsigned int *p_humidity ,unsigned int *p_temperature) {const float C1=-4.0; // for 8 Bitconst float C2=+0.648; // for 8 Bitconst float C3=-0.0000072; // for 8 Bitconst float D1=-39.6; // for 12 Bit @ 3Vconst float D2=+0.04; // for 12 Bit @ 3Vconst float T1=0.01; // for 8 bitconst float T2=0.00128; // for 8 bitfloat rh=*p_humidity; // rh: Humidity [Ticks] 12 Bitfloat t=*p_temperature; // t: Temperature [Ticks] 14 Bitfloat rh_lin; // rh_lin: Humidity linearfloat rh_true; // rh_true: Temperature compensated humidityfloat t_C; // t_C : Temperature [癈]t_C=t*D2+D1; //calc. temperature from ticks to [癈]rh_lin=C3*rh*rh + C2*rh + C1; //calc. humidity from ticks to [%RH]rh_true=(t_C-25)*(T1+T2*rh)+rh_lin; //calc. temperature compensated humidity [%RH]if(rh_true>100)rh_true=100; //cut if the value is outside ofif(rh_true<0.1)rh_true=0.1; //the physical possible range*p_temperature=t_C; //return temperature [癈]*p_humidity=rh_true; //return humidity[%RH]}void main(){value humi_val,temp_val;unsigned char error,checksum;unsigned int i,temphigh,templow;unsigned int RegCMD=0x01;WDTCTL=WDTPW+WDTHOLD; //Stop watchdog timer to prevent time out resetS_Init();SVCC_H;S_Connectionreset();S_WriteStatusReg((unsigned char *)&RegCMD);while(1){error=0;error+=S_Measure((unsigned char*) &humi_val.i,&checksum,HUMIDITY);//measure humidityerror+=S_Measure((unsigned char*) &temp_val.i,&checksum,TEMPERATURE); //measure temperatureif(error!=0)S_Connectionreset(); //in case of an error: connection resetelse{templow=(humi_val.i&0xff00);humi_val.i=templow>>8;temphigh=((temp_val.i&0xf)<<8);templow=((temp_val.i&0xff00)>>8);temp_val.i=temphigh+templow;S_Calculate(&humi_val.i,&temp_val.i); //calculate humidity, temperature//temp_val_NOP();//printf("temp:%5.1fC humi:%5.1f%% dewpoint:%5.1fC\n",temp_val.f,humi_val.f,dew_point);}//----------wait approx. 0.8s to avoid heating upSHTxx------------------------------for (i=0;i<40000;i++); //(be sure that the compiler doesn't eliminate this line!)//-----------------------------------------------------------------------------------}}。

SHT10温湿度传感器的通信协议命令包含：1.读取站号命令2.写站号命令3.读取数据4.手动矫正数据串口参数设置：读站号命令(固定命令)主站从站地址功能码H地址L地址 H数据L数据 CRC00 03 00 01 00 01 CRClo CRChi 从站从站地址功能码H地址L地址H数据CRC00 03 02 00 XX CRClo CRChi 注：返回帧与主站相同设备地址：（XX=01-FF）示例：命令00 03 00 01 00 01 D4 1B（固定命令）回复00 03 02 00 FF C5 C4 （设备默认站号FF）写站号命令主站从站地址功能码H地址L地址寄存器个数寄存器个数数据长度数据CRC00 10 00 01 00 01 02 00 XX CRClo CRChi 注：（XX=0X01-0XFF）从站从站地址功能码 H地址L地址寄存器个数CRC00 10 00 01 00 01 CRClo CRChi 示例：命令00 10 00 01 00 01 02 00 33 EA 04回复00 10 00 01 00 01 51 D8读数据主站从站地址功能码 H地址L地址寄存器个数寄存器个数CRCXX 03 00 00 00 02 CRClo CRChi注：（XX=0X01-0XFF）从站从站地址功能码数据长度数据数据CRCXX 03 04 19 AD 1B E4 CRClo CRCh 示例命令FF 03 00 00 00 02 D1 D5回复FF 03 04 19 AD 1B E4 79 FA注：温度：第4，5个字节19 AD温度=读数/100-40度湿度：第5，6个字节1B E4。

1应用范围
SHT10（SHT11、SHT15）防护型温湿度传感器采用原装进口温湿度测量元件(内置SHT10/11/15)为核心部件，具有非常高的一致性、可完全互换，全量程标定，两线数字输出，湿度精度可高达±2%RH。

铜烧结网的防护加强了探头的耐温、耐压、耐损能力，可广泛适用于农业温室大棚、花卉、苗圃、草坪，养殖、仓储等各种需要测量环境温湿度的场所。

2技术参数
¾湿度测量范围：0～100%RH
¾温度测量范围：-40～+123.8℃
¾湿度测量精度： ±4.5%RH
¾温度测量精度： ±0.5℃
¾响应时间：8s(tau63%)
¾低功耗 80μW(12位测量，1次/s)
3接线方式
航空插头的管脚定义与SHT10的管脚定义相同，具体如下：
红色线VCC-电源正极（航空插头管脚4）
黄色线GND-电源负极（航空插头管脚1）
绿色线DATA-数据（航空插头管脚2）
蓝色线SCK-时序（航空插头管脚3）
4产品外观如图
4芯航空插头接插件连接，轻松更换，轻松维护。

Handling InstructionsFor SHTxx Humidity and Temperature SensorsAbstractSensirion SHTxx are relative humidity and temperature sensors of high quality. For taking advantage of their outstanding performance some precautions must be taken during storage, assembly and packaging. Therefore, please read the following instructions carefully - preferably during design-in phase and before production release of the respective device. Special attention is required regarding the exposure to volatile organic compounds, i.e. high concentration and long exposure time to respective gases shall be avoided. Such conditions are known to occur in manufacturing environment and/or during storage. Therefore, proper handling and choice of materials are crucial. Applying sensors in the field in ambient environment is not critical.ApplicabilityThis document is applicable to all Sensirion SHTxx humidity and temperature sensors.ESD protectionThe sensor shall be protected from ESD (Electrostatic Discharge) and only be handled in ESD protected areas (EPA) under protected and controlled conditions (ground all personnel with wrist-straps, ground all non-insulating and conductive objects, exclude insulating materials from the EPA, operate only in grounded conductive floor, etc.). Protect sensor outside the EPA using ESD protective packaging.Protection against ESD is mandatory. Exposure to chemicalsHumidity and Temperature sensors are highly accurate environmental sensors and as such they are not ordinary electronic components. The opening in the package exposes the sensor to the environment and makes it susceptible to pollutants. While applying sensors in the field in ambient environment is not critical, pollutants are known to occur in manufacturing environments and during storage. Please carefully follow the guidelines in this application note to ensure that you can benefit of the sensor’s outstand ing performance.The sensor shall not get in close contact with volatile chemicals such as solvents or other organic compounds. Especially high concentration and long exposure must be avoided. Ketenes, Acetone, Ethanol, Isopropyl Alcohol, Toluene, etc. are known to cause drift of the humidity reading –irreversibly in most of the cases. Please note that such chemicals are integral part of epoxies, glues, adhesives, etc. and outgas during baking and curing. These chemicals are also added as plasticisers into plastics, used for packaging materials, and do out-gas for some period.Acids and bases may affect the sensor irreversibly and shall be avoided: HCl, H2SO4, HNO3, NH3etc. Also Ozone in high concentration or H2O2have the same effect and therefore shall be avoided. Please note, that above examples represent no complete list of harmful substances.The sensor shall not get in contact with cleaning agents (e.g. PCB board wash after soldering) or strong air blasts from an air-pistol (not oil-free air). Applying cleaning agents to the sensor may lead to drift of the reading or complete breakdown of the sensor.Ensure good ventilation (fresh air supply) to avoid high concentrations of volatile chemicals (solvents, e.g. ethanol, isopropanol, methanol, acetone, cleaning solutions, detergents…).Packaging and storagePrior to assembly or use of the sensors it is strongly recommended to store the sensors in the original sealed ESD bag at following conditions: Temperature shall be in the range of 10°C – 50°C (0 – 125°C for limited time) and humidity at 20 – 60%RH (sensors that are not stored in ESD bags).Store sensors in original, unopened ESD bag. Place additional stickers only on the outside of the ESD bag.Once sensors have been removed from the original ESD bag we recommend to store the individual sensors as well as devices with assembled sensors in metal-in antistatic shielded ESD bags. In particular, it is recommended not to use any adhesive or adhesive tapes to reseal the sensor bag after opening. Following ESD Bags can be recommended (no polluting effect on humidity sensor):ESD Bag Manufacturer ProductStroebel"Topshield" BagsSensors as a component or mounted into the final product shall not be packaged in outgassing plastic materials which could cause sensor pollution. Besides metal-in antistatic shielded ESD bags, paper or cardboards based packaging, deep drawn plastic trays (PE, PET, PP) may be considered. Do not use antistatic polyethylene bags (light blue, pink or rose color); be very careful with bubble foils and foams.Be careful about stickers present inside the packing (e.g. on the housing of the device). Sticker size should be kept to a minimum, and the sticky side shall fully adhere onto a surface.Please note that many packaging materials may be provided with additives (plasticizers) which may have a polluting effect on the sensor. Generally speaking, if a material emits a strong odour you should not use it. Additives may also be added to materials which are listed for recommended use. For high safety, device housing and shipment packaging must be qualified. Such a qualification test may contain exposure of the final device with sensor in its shipment packaging to temperature ≥65°C for at least 168 hours. (If shipping or storage conditions are expected to be harsh, the qualification test conditions for the packing material have to be customized.) The sensor reading then shall showno changed deviation against a reference compared to same measurements before the exposure.Do not use polyethylene antistatic bags (light blue, pink or rose color). Do not use adhesive tapes inside packaging.For guidance on simple and straight-forward testing of humidity sensors please consult the Testing Guide for humidity sensors.Assembly - SolderingFor soldering, standard reflow soldering ovens may be used. The sensors are designed to withstand soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260°C during up to 30sec for Pb-free assembly in IR/Convection reflow ovens (see Error! Reference source not found.).Make sure that maximum temperatures and exposure times are respected. In case the PCB passes through multiple solder cycles (as is the case for e.g. PCB that are assembled on top and bottom side), it is recommended to assemble the SHTxx only in the last solder cycle. This is to reduce risks of sensor pollution.Figure 1 Soldering profile according to JEDEC standard. T P ≤ 260°C and t P ≤ 30sec above 255°C for Pb -free assembly. T L < 220°C and t L < 150sec. Ramp-up rate <3°C and ramp-down rate < 6°C/sec for temperatures > T L .SHT31 – 500pcsInspectedT e m p e r a t u r eTimet P T PT L T S (max)t Lpreheatin liquid phaseThe use of “no clean” type ≥3 solder paste 1 is strongly recommended as no board wash can be applied to SHTxx humidity sensors. An appropriate amount of solder paste shall be used, to result in a stand-off height (clearance between the package body and any part of the substrate) of 50μm to 75μm. Please consult the appropriate sensor data sheet for device specific information on the metal land pattern and recommendations on solder paste printing stencils. Standard pick & place equipment and vacuum nozzles for standard QFN packages may be used for assembly of SHTxx and STSxx sensors.Manual soldering is not recommended. For rework soldering, contact time must be limited to 5 seconds at up to 350°C.Immediately after the exposure to high temperatures SHTxx humidity sensors may temporarily read a negative humidity offset (typ. -1 to -2 %RH after reflow soldering). This offset slowly disappears again by itself when the sensor is exposed to ambient conditions (typ. within 1-3 days). If RH testing is performed immediately after reflow soldering, this offset should be considered when defining the test limits.It is important to note that the diced edge or side faces of the I/O pads may oxidise over time, therefore a solder fillet may or may not form. Hence there is no guarantee for solder joint fillet heights of any kind.Assembly – OthersSensors in SMT packages are classified as Moisture Sensitivity Level 1 (IPC/JEDEC J-STD-020). It is recommended to process the sensors within 1 year after date of delivery.Before developing the assembly process, please read the User ’s Guide and the Datasheets carefully. In the following, crucial items are underlined plus additional items are given:No mechanical force shall be applied to any part of the sensor during assembly or usage.No board wash shall be applied to SHTxx humidity sensors. Therefore, and as mentioned in the previous section , it is strongly recommended to use “no -clean” solder paste.1 Solder types are related to the solder particle size in the paste: Type 3covers the size range of 25 – 45 µm as specified in IPC J-STD-005A .Do not apply board wash.For application in corrosive environment – such as condensed water or corrosive gases – it may be necessary to protect the electronic assembly including the soldered contacts of the sensor with a passivation. Such passivation may be achieved by conformal coating or by applying adhesive.Low viscose conformal coatings or potting materials may flow into the inside the sensor cap, cover the sensor element and thus make the humidity sensor inoperative. Use only high viscose conformal coatings or potting materials, or seal the interface between sensor cap and sensor PCB before applying conformal coating. In any case, covering the humidity sensor opening with any kind of coating must be avoided. Therefore, the top surface of the sensor should remain free of coating.If conformal coating is applied, the top surface of the sensor must remain free of coating.Solvent vapors are produced during curing and processing of the coating. Ensure good ventilation throughout the application, staging and curing to prevent pollution of the sensor. Ventilation shall be established in such a way that the concentration of these gaseous substances remains low, e.g. by using ovens with fresh air supply.XXXCoating thickness and curing times shall be chosen according to respective datasheets and application notes of the manufacturer. If a time frame for curing is provided it is recommended to apply the upper time limit. This is especially true if the PCB design features large components with undercuts where high layer thicknesses on/under components or drain-off edges can form. Please note that the tack-free state of the coating is no indication of full curing. For full curing refer to application notes of the manufacturer. Ensure process stability for coating thickness and apply corresponding safety margins for curing times.The following table lists conformal coatings which have been tested regarding pollution of the humidity sensorand are known to be suitable if applied and fully cured under good ventilation and according to respective datasheet.Conformal CoatingsManufacturer ProductPeters Elpeguard SL 1301 ECO-FLZ Electrolube AFA (Aromatic Free Acrylic) Coating Chase HumiSeal 1B51NSLUDow Corning Dow corning 1-2620Do not apply spray to unprotected sensor. Whenever using spray coating techniques (e.g. to apply varnish or conformal coating, etc.) the SHT3x with protective cover option can be used or the SHTxx sensor has to be covered by the adhesive tape to prevent coating of the humidity sensor opening. The following table lists adhesive tapes which have been tested regarding pollution of the humidity sensor and are known to be suitable.Adhesive TapesManufacturer Product3M Electrical Tape 92Do not apply any other adhesive tapes such as Scotch Tape, Sello Tape, Tesa Film, etc. In conjunction with the sensor, use only recommended Kapton® tape Electrical Tape 92 by 3M™.Regarding adhesives and encapsulants the material in the following tables may be used –according to respective datasheets, applied and fully cured in well ventilated environment (fresh air supply). Materials and brands not listed in the following tables may be harmful and shall be tested carefully before applying.Epoxy AdhesivesManufacturer ProductEPO-TEK H70E/SEPO-TEK T6067EPO-TEK 93-86Lord MD-130Eccobond E3503-1Ablebond 84-3Epoxy Glob Top EncapsulantsManufacturer ProductStycast 50300 / 50400 seriesHysol EO1061/EO1062Silicone AdhesivesManufacturer ProductRTV 6424 (Momentive)Dow Corning 732Silicone Glob Top EncapsulantsManufacturer ProductStycast S 7503Instant AdhesivesManufacturer ProductLoctite 401PUR (Polyutherane) Casting Compounds Manufacturer ProductPeters VU 4457-61Hot melts may absorb water and thus may have an impact on the response time of the sensor in the device. Therefore, hot melt shall be applied sparingly.The sensor shall be mounted into the device, if possible, after all materials that are used in the assembly process have completely cured or dried out. Otherwise ensure good ventilation (fresh air supply) in curing ovens and assembly lines.Prevent any dust or particles from entering the sensor opening (sensor performance may be affected).Wear clean gloves or finger cots while handling the sensor and avoid touching the sensor opening.Ensure recommendations in this application note are equally considered during repair and rework of assemblies containing sensors. During repair and rework, it may be recommendable to cover the sensor with Kapton tape (specific recommendation see above). Be particularly careful when using strong cleaning agents (e.g. detergents, alcohols, brominated or fluorinated solvents). Cleaning any part of a product might lead to high concentration of cleaning agents on the sensor. Please remove any sensors or devices containing sensors before cleaning the production area and tools. Ensure good ventilation (fresh air supply) and that any solvents have evaporated before resuming production.Prevent sensor from exposure to cleaning agents. Application in extreme environment Some applications require the exposure of humidity and temperature sensors to harsh environments. In many of the cases the sensor is uncritical to be used. However, some precautions must be taken.For exposure to extreme conditions with regards to humidity and temperature please consult the datasheet 275%RH can conveniently be generated with saturated NaCl solution. of respective product. Please make sure that exposure time of the sensor to maximum range of operating conditions is limited as given in datasheet. Exposure to volatile organic compounds at high concentration and long exposure time is critical not only in assembly but also in the field. Such application needs to be carefully tested and qualified.Exposure to acids or bases may be critical, too. In order to be critical, the concentration must be such that polymers are attacked. For bases there is a rule of thumb that pH<9 are uncritical. Etching substances such as H2O2, NH3, etc. at high concentrations are critical to the sensor, too.Corrosive substances at very low concentrations are not critical to the sensor itself. However, they may attack the solder contacts. Therefore, the contacts must be well protected (passivated) in case of an application to such environment –compare also Section “Assembly”. Application of Sensirion humidity and temperature sensors to harsh environment must be carefully tested and qualified. Sensirion qualifies its humidity and temperature sensors to work properly within ambient clean air – qualification for use in harsh environment is duty of the user of the sensor. Reconditioning procedureAs stated above extreme conditions or exposure to solvent vapors may offset the sensor. The following reconditioning procedure may bring the sensor back to calibration state:Baking: 100 – 105°C at < 5%RH for 10hRe-Hydration: 20 – 30°C at ~ 75%RH for 12h 2. DisclaimerThe above given restrictions, recommendations, materials, etc. do not cover all possible cases and items. The material recommendations are given with regard to pollution of SHTxx sensors and assume optimal processing for avoiding VOC in process – the materials were not tested regarding other properties like reliability, performance, usability or mechanical properties. The material recommendations have been compiled with our best knowledge at the time of writing. Manufacturers may change the compounds without notice, which can lead to reduced Sensor performance due to outgassing.This document is not to be considered complete and is subject to change without prior notice.Revision historyImportant NoticesWarning, Personal InjuryDo not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION shall be allegedly negligent with respect to the design or the manufacture of the product.ESD PrecautionsThe inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation, take customary and statutory ESD precautions when handling this product.See application note “ESD, Latchup and EMC” for more information.WarrantySENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product s hall be of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective, SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:•notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;•such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;•the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and•the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the intended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. 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Recommended parameters can and do vary in different applications.SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve reliability, functions and design of this product.Copyright© 2021, by SENSIRION. CMOSens® is a trademark of Sensirion. All rights reservedHeadquarters and SubsidiariesSensirion AG Laubisruetistr. 50CH-8712 Staefa ZH Switzerlandphone: +41 44 306 40 00 fax: +41 44 306 40 30 ****************** Sensirion Inc., USAphone: +1 312 690 5858*********************Sensirion Korea Co. Ltd.phone: +82 31 337 7700~3*********************/krSensirion Japan Co. Ltd.phone: +81 3 3444 4940*********************/jpSensirion China Co. Ltd.phone: +86 755 8252 1501*********************/cnSensirion Taiwan Co. Ltdphone: +886 3 5506701******************To find your local representative, please visit /distributors。

ShtXX系列介绍SHTxx 系列产品是一款高度集成的温湿度传感器芯片，提供全量程标定的数字输出。

它采用专利的CMOSens? 技术，确保产品具有极高的可靠性与卓越的长期稳定性。

传感器包括一个电容性聚合体湿度敏感元件和一个用能隙材料制成的温度敏感元件，这两个敏感元件与一个14 位的A/D 转换器以及一个串行接口电路设计在同一个芯片上面。

该传感器品质卓越、响应超快、抗干扰能力强、极高的性价比。

每个传感器芯片都在极为精确的恒温室中进行标定，以镜面冷凝式露点仪为参照。

通过标定得到的校准系数以程序形式储存在芯片本身的OTP内存中。

通过两线制的串行接口与内部的电压调整，使外围系统集成变得快速而简单微小体积、极低功耗等优点使其成为各类应用中的首选。

相对湿度和温度测量特点露点测量全标定输出，无需标定即可互换使用卓越的长期稳定性两线制数字接口，无需额外电路基于请求式测量，低能耗表面贴片或4针引脚安装超小尺寸自动休眠超快响应时间应用领域暖通空调HVAC 汽车消费电子家用气象站湿度调节器_ 测试及检测设备数据记录仪自动控制家电产品医疗仪器型号测湿精度[%RH] 测温精度[℃] 封装SHT10 ±4.5 ±0.5℃在25℃SMD（LCC）SHT11 ±3.0 ±0.4℃在25℃SMD（LCC）SHT15 ±2.0 ±0.3℃在5~40℃SMD（LCC）SHT71 ±3.0 ±0.4℃在25℃4-PIN单排直插SHT75 ±1.8 ±0.3℃在5~40℃4-PIN单排直插框图性能指标电气特性接口说明电源引脚SHTxx 的供电电压为2.4~5.5V。

传感器上电后，要等待11m 来完成“休眠”状态。

在此期间无需发送任何指令。

电源引脚（VDD，GND）之间可增加一个100nF的滤波电容。

串行接口(两线双向)SHTxx 应用的的串行接口技术，在传感器信号读取及电源损耗方面都做了优化处理；但与I2C 接口不兼容，SHTxx 温湿度传感器注意事项1. 按引脚说明图连接电路。